WO2020053973A1 - Cible de pulvérisation cathodique en matériau ferromagnétique - Google Patents

Cible de pulvérisation cathodique en matériau ferromagnétique Download PDF

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WO2020053973A1
WO2020053973A1 PCT/JP2018/033698 JP2018033698W WO2020053973A1 WO 2020053973 A1 WO2020053973 A1 WO 2020053973A1 JP 2018033698 W JP2018033698 W JP 2018033698W WO 2020053973 A1 WO2020053973 A1 WO 2020053973A1
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metal
mol
powder
sputtering target
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PCT/JP2018/033698
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Japanese (ja)
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真一 荻野
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Ｊｘ金属株式会社
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Priority to JP2019530516A priority Critical patent/JPWO2020053973A1/ja
Priority to MYPI2019004199A priority patent/MY191072A/en
Priority to PCT/JP2018/033698 priority patent/WO2020053973A1/fr
Priority to CN201880004278.2A priority patent/CN111183244B/zh
Priority to SG11201906523QA priority patent/SG11201906523QA/en
Publication of WO2020053973A1 publication Critical patent/WO2020053973A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering

Definitions

  • the present invention relates to a Co—Pt ferromagnetic sputtering target suitable for forming a magnetic thin film in a magnetic recording medium.
  • Magnetic thin films are often produced by sputtering a sputtering target containing the above-mentioned material with a DC magnetron sputtering apparatus because of its high productivity.
  • a ferromagnetic material sputtering target with a magnetron sputtering apparatus most of the magnetic flux from the magnet passes through the inside of the target, which is a ferromagnetic material, so that the leakage magnetic flux decreases and no discharge occurs during sputtering.
  • the discharge is not stable even if the discharge is performed.
  • reducing Co is not an essential solution because a desired magnetic recording film cannot be obtained.
  • it is possible to improve the leakage magnetic flux by reducing the thickness of the target but in this case, the target life is shortened, and frequent replacement of the target is required, which causes an increase in cost.
  • a method has been adopted in which the Cr ratio is increased to make it partially non-magnetic and the leakage magnetic flux is increased.
  • a Co—Cr-based or Co—Cr—Pt-based ferromagnetic alloy containing Co as a main component has been used for a recording layer of a hard disk employing an in-plane magnetic recording system.
  • non-magnetic particles such as oxide and carbon are dispersed in a Co—Cr—Pt-based ferromagnetic alloy containing Co as a main component in a recording layer of a hard disk employing a perpendicular magnetic recording method that has been put into practical use in recent years.
  • Composite materials are often used.
  • the composition that has become the mainstream in recent years is a composition containing little or no Cr, and it is difficult to sufficiently obtain the effect of increasing the leakage magnetic flux by the conventional method.
  • WO2012 / 077665 discloses that in a sputtering target made of a metal having a composition in which Pt is 5 mol% or more, Cr is 20 mol% or less, and the balance is Co, the metal base (A) and the (A) Among them, a ferromagnetic sputtering target characterized by having a Co—Pt alloy phase (B) containing 40 to 76 mol% of Pt has been proposed.
  • the thickness be 10 ⁇ m or more.
  • the diameter of the Co—Pt alloy phase (B) is too large, the problem of particles at the time of sputtering is likely to occur. Therefore, it is preferable that the diameter be 150 ⁇ m or less.
  • a metal base (A) and A ferromagnetic material comprising: a Co—Pt alloy phase (B) containing 40 to 76 mol% of Pt; and Co or a metal or alloy phase (C) containing Co as a main component different from the phase (B).
  • Sputtering targets have been proposed. According to the document, if the diameter of the Co—Pt alloy phase (B) is too small, the diffusion between the metal base (A) and the phase (B) proceeds, and the difference between the constituent elements becomes unclear.
  • the thickness be 10 ⁇ m or more. Further, according to the document, if the diameter of the Co—Pt alloy phase (B) is too large, the problem of particles at the time of sputtering is likely to occur. Therefore, it is preferable that the diameter be 150 ⁇ m or less.
  • an object of the present invention is to provide a Co—Pt-based ferromagnetic material sputtering target having a high leakage magnetic flux and capable of suppressing generation of particles during sputtering.
  • Patent Literature 1 and Patent Literature 2 teach that the Co—Pt alloy phase should have a diameter of 10 ⁇ m or more. However, such a coarse Co—Pt alloy phase has a large particle size during sputtering. It was found to be the cause of the outbreak. Therefore, the present inventors have intensively studied effective means for suppressing particles while taking advantage of the Co-Pt alloy phase capable of increasing the leakage magnetic flux, and found that the Co-Pt alloy phase was coarsened while the Co-Pt alloy phase was refined. It has been found that the technique of making is effective. The present invention has been completed based on such findings.
  • This is a ferromagnetic material sputtering target having a particle phase.
  • a total of one or more non-magnetic materials selected from the group consisting of carbon, oxide, nitride, carbide and carbonitride 25 mol% or less is contained.
  • This is a method for producing a ferromagnetic material sputtering target containing:
  • the step of obtaining the mixed powder further includes B, Ti, V, Mn, Zr, Nb, Ru, Mo, Ta, W, Al, This includes mixing one or more powders selected from the group consisting of Si and Zn.
  • the step of obtaining the mixed powder is further selected from the group consisting of carbon, oxide, nitride, carbide and carbonitride. This includes mixing one or more non-magnetic materials.
  • the present invention is a method for producing a magnetic recording film, comprising using the sputtering target according to the present invention.
  • the ferromagnetic material sputtering target of the present invention becomes a target having a large leakage magnetic flux, and when used in a magnetron sputtering apparatus, ionization of an inert gas is efficiently promoted and a stable discharge is obtained. According to the present invention, since the thickness of the target can be increased, there is an advantage that the frequency of replacement of the target is reduced and a magnetic thin film can be manufactured at low cost. Further, the ferromagnetic material sputtering target of the present invention has few particles at the time of sputtering and enables stable sputtering.
  • Metal Cr is contained in an amount of 0 mol% or more and 20 mol% or less.
  • This composition has a high content of metal Co, which is a ferromagnetic material, and a small content of metal Cr, which has an effect of increasing the leakage magnetic flux, so that it is generally difficult to obtain a high leakage magnetic flux.
  • the ferromagnetic material sputtering target according to the present invention can satisfy 70 ⁇ X ⁇ 90 in one embodiment, and can satisfy 80 ⁇ X ⁇ 85 in another embodiment, in consideration of hard disk media manufacturing applications. it can.
  • the ferromagnetic material sputtering target according to the present invention can contain metal Co and metal Pt in a total amount of 75 mol% or more in one embodiment, and can contain metal Co and metal Pt in a total amount of 85 mol% or more in another embodiment. can do.
  • the ferromagnetic material sputtering target according to the present invention can contain metal Co and metal Pt in a total of 95 mol% or less, and in another embodiment, the metal Co and metal Pt in a total of 90 mol%. The following can be contained.
  • a ferromagnetic sputtering target containing a total of 75 to 95 mol% of metal Co and metal Pt is suitable for a perpendicular magnetic recording film.
  • the ferromagnetic material sputtering target according to the present invention can contain 0 to 15 mol% of metal Cr in one embodiment, and can contain 0 to 10 mol% of metal Cr in another embodiment.
  • the metal Cr can be contained in an amount of 0 mol% or more and 5 mol% or less.
  • the metal Cr can be contained in an amount of 0 mol% or more and 1 mol% or less.
  • the form does not contain metallic Cr.
  • the Co—Pt alloy particle phase can be dispersed in the target structure.
  • the Co—Pt alloy particle phase contributes to the improvement of the leakage magnetic flux, but when the average particle size is large, it becomes a factor of increasing particles.
  • the problem of particles during sputtering by the Co—Pt alloy particle phase occurs when the diameter exceeds 150 ⁇ m, but the Co—Pt alloy particle phase is as fine as possible. It is desirable. Therefore, in the ferromagnetic material sputtering target according to the present invention, the average particle size of the Co—Pt alloy particle phase is preferably 7 ⁇ m or less, more preferably 5 ⁇ m or less, and even more preferably 2 ⁇ m or less. preferable.
  • the average particle diameter of the Co-Pt alloy particles phase since the possibility of L1 0 structure is diffused too small and another phase during sintering is promoted loss increases, at 0.1 ⁇ m or more It is preferably at least 0.2 ⁇ m, more preferably at least 0.5 ⁇ m.
  • the Co—Pt alloy particle phase is preferably at least 20% by mass, more preferably at least 30% by mass, based on the total mass of the sputtering target. , 40% by mass or more.
  • the Co-Pt alloy particle phase is preferably 70% by mass or less, and more preferably 65% by mass or less, based on the total mass of the sputtering target. More preferably, it is even more preferably 60% by mass or less.
  • the Co-rich composition sputtering target according to the present invention has a Co particle phase containing 90 mol% or more of metallic Co in addition to the Co—Pt alloy particle phase.
  • the Co particle phase preferably contains metallic Co in an amount of 95 mol% or more, more preferably 99.9 mol% or more, in order to increase the proportion of the Co—Pt alloy particle phase contained in the target.
  • the Co particle phase can be dispersed in the target structure.
  • the Co particle phase is desirably coarsened.
  • the average particle size of the Co particle phase containing 90 mol% or more of metal Co is preferably 30 ⁇ m or more, more preferably 50 ⁇ m or more, and even more preferably 100 ⁇ m or more.
  • the average particle size of the Co particle phase is preferably 300 ⁇ m or less, more preferably 200 ⁇ m or less, and more preferably 150 ⁇ m or less, since there is a concern that if the average particle size is too large, particles may be generated. Is even more preferred.
  • the Co particle phase is preferably 15% by mass or more based on the total mass of the sputtering target from the viewpoint of increasing the leakage magnetic flux and further suppressing the diffusion of the Co—Pt alloy particle phase during sintering. It is more preferably at least 25% by mass, and even more preferably at least 30% by mass.
  • the Co particle phase is preferably 50% by mass or less, and more preferably 45% by mass, based on the total mass of the sputtering target, from the viewpoint of improving dispersibility with other raw materials during mixing because the Co particle phase is coarse particles. %, More preferably 40% by mass or less.
  • the ferromagnetic material sputtering target according to the present invention includes, as a third element, one selected from the group consisting of B, Ti, V, Mn, Zr, Nb, Ru, Mo, Ta, W, Al, Si, and Zn. Two or more of them may be contained in a total amount of 30 mol% or less, for example, 0.01 to 20 mol%, typically 0.05 to 10 mol% as a single metal or alloy. These are elements added as necessary to improve the characteristics as a magnetic recording medium. The mixing ratio can be variously adjusted within the above range, and any of them can maintain the characteristics as an effective magnetic recording medium.
  • B is also treated as a metal.
  • the third element may be present in the Co—Pt alloy particle phase, may be present in the Co particle phase, and may be a different particle phase distinguishable from the Co—Pt alloy particle phase and the Co particle phase. Can be inside.
  • the other particulate phase can be dispersed in the target tissue.
  • the third element is present in the Co—Pt alloy particle phase or is contained in another fine particle phase because the finely dispersed element is advantageous for particle reduction. Is preferably present.
  • the third element is not a single metal or alloy particle phase but forms a particle phase as an oxide, nitride, carbide or carbonitride
  • the third element is not a third element particle phase but a Handle as the particle phase of the magnetic material.
  • the another particle phase forms a composite phase mutually dispersed with the Co—Pt alloy particle phase.
  • the other particle phase may form a composite phase mutually dispersed with the Co—Pt alloy particle phase and the particle phase of the nonmagnetic material.
  • the average particle diameter of the particle phase of the third element is preferably 20 ⁇ m or less, more preferably 10 ⁇ m or less, and more preferably 5 ⁇ m or less. Is even more preferred.
  • the average particle diameter of the particle phase of the third element is preferably 0.5 ⁇ m or more, preferably 1 ⁇ m or more, because if the average particle diameter is too small, oxidation may proceed due to oxygen in the air during the mixed powder preparation step. Is more preferable, and it is still more preferable that it is 2 micrometers or more.
  • Ferromagnetic material sputtering target as an additional material, carbon, oxide, nitride, carbide and one or two or more non-magnetic material selected from the group consisting of carbonitride, 25 mol% or less in total, For example, it may be contained at 5 to 20 mol%, typically 5 to 15 mol%.
  • the sputtering target can have characteristics suitable for a material of a magnetic recording film having a granular structure, particularly a recording film of a hard disk drive employing a perpendicular magnetic recording method.
  • Examples of the carbide include one or more carbides of elements selected from the group consisting of B, Ca, Nb, Si, Ta, Ti, W and Zr.
  • Examples of the oxide include Si, Al, B, Ba, Be, Co, Ca, Ce, Cr, Dy, Er, Eu, Ga, Gd, Ho, Li, Mg, Mn, Nb, Nd, Pr, and Sc. , Sm, Sr, Ta, Tb, Ti, V, Y, Zn, and one or more oxides of elements selected from the group consisting of Zr.
  • SiO 2 has a great effect of increasing the density of a sputtering target, and is therefore preferably added.
  • nitride examples include one or more nitrides of elements selected from the group consisting of Al, Ca, Nb, Si, Ta, Ti, and Zr. These nonmagnetic materials may be appropriately added according to the required magnetic properties of the magnetic thin film.
  • the Cr oxide and the Co oxide are recognized as being different from Cr and Co added as a metal.
  • the non-magnetic material can be dispersed in the target structure as a non-magnetic material particle phase that can be distinguished from the Co—Pt alloy particle phase and the Co particle phase.
  • the average particle size of the particle phase of the nonmagnetic material is preferably 2 ⁇ m or less, more preferably 1 ⁇ m or less, and even more preferably 0.5 ⁇ m or less.
  • the average particle size of the particle phase of the nonmagnetic material is 0.05 ⁇ m or more because if the particle size is too small, there is a concern that the particles may aggregate with each other during the mixed powder preparation step to form a lump (coarse secondary particles). Is preferably 0.1 ⁇ m or more, and more preferably 0.2 ⁇ m or more.
  • each peak is derived from the L1 0 structure, as viewed from the composition of the sputtering target according to the present invention, Co-Pt alloy particles phase L1 0 It is presumed that such a peak is observed when an ordered phase of the structure is formed.
  • each position has a peak.
  • Means that the ratio of the peak intensity to the background intensity (the average value of the intensity at 2 ⁇ 37.0 to 38.0 °) is 2 or more, and generally the ratio can be 2 to 200.
  • the measurement range of 2 ⁇ of XRD measurement strongest peak at 30 ° ⁇ 60 ° 41.52 It preferably exists at ⁇ 2 °. 41.52 ⁇ 2 ° is a strongest peak of L1 0 structure of Co-Pt.
  • the XRD measurement of the sputtering target is performed under the following conditions.
  • An X-ray diffractometer (Ultima IV manufactured by Rigaku Corp. was used in the examples) was used as the measuring device, the tube was Cu, the measuring conditions were a tube voltage of 40 kv, a tube current of 30 mA, a scan speed of 4 ° / min, and a step of 0.02. ° and the measurement is made on the plane parallel to the sputtering surface by the ⁇ / 2 ⁇ method.
  • the surface may be a surface or a cut surface as long as the surface is horizontal to the sputter surface.
  • the ferromagnetic material sputtering target according to the present invention can be manufactured using the powder sintering method, for example, by the following procedure.
  • Co Prepare a Co powder having a purity of 90 mol% or more, preferably 95 mol% or more, more preferably 99.9 mol% or more.
  • the Co powder may be produced by pulverizing a molten cobalt ingot of metal cobalt, or may be produced by a gas atomizing method.
  • the median diameter of the Co powder is preferably 30 ⁇ m or more, more preferably 50 ⁇ m or more, and even more preferably 100 ⁇ m or more.
  • the median diameter of the Co powder is preferably 300 ⁇ m or less, because if it is too large, it is difficult to mix uniformly with other powder materials and there is a concern that particles may be generated during sputtering. It is more preferably 200 ⁇ m or less, and even more preferably 150 ⁇ m or less.
  • the median diameter can be adjusted by grinding or sieving.
  • the total of metal Co and metal Pt is 70 mol% or more, preferably 80 mol% or more, more preferably 90 mol. %, More preferably 99 mol% or more.
  • the median diameter of the Co-Pt alloy powder is 7 ⁇ m or less, more preferably 6 ⁇ m or less, and still more preferably at 5 ⁇ m or less.
  • the median diameter of the Co—Pt alloy powder is preferably 0.1 ⁇ m or more, because if it is too small, it may be oxidized by atmospheric oxygen during the mixing step. It is more preferably at least 1 ⁇ m.
  • the inert atmosphere include a rare gas atmosphere such as a vacuum atmosphere and an Ar gas atmosphere, and a nitrogen gas atmosphere.
  • the median diameter can be adjusted by sieving the powder obtained by crushing the obtained sponge.
  • the powder of the third element is preferably added so that the total concentration in the mixed powder becomes the predetermined concentration in the sputtering target described above.
  • the median diameter of the third element powder is preferably 20 ⁇ m or less, more preferably 10 ⁇ m or less, and even more preferably 5 ⁇ m or less.
  • the median diameter of the powder of the third element is preferably at least 0.5 ⁇ m, more preferably at least 1 ⁇ m, because if the median diameter of the powder of the third element is too small, oxidation may proceed due to oxygen in the atmosphere during the mixed powder preparation step. Is more preferable, and it is still more preferable that it is 2 micrometers or more.
  • the powder of the nonmagnetic material is preferably added so that the total concentration in the mixed powder becomes the predetermined concentration in the sputtering target described above.
  • the median diameter of the non-magnetic material powder is preferably 2 ⁇ m or less, more preferably 1 ⁇ m or less, and even more preferably 0.5 ⁇ m or less.
  • the median diameter of the powder of the nonmagnetic material is preferably at least 0.05 ⁇ m, and more preferably at least 0.1 ⁇ m, since if it is too small, oxidation may proceed due to oxygen in the atmosphere during the mixed powder preparation step. Is more preferable, and even more preferably 0.2 ⁇ m or more.
  • the median diameter of the Cr powder is preferably 10 ⁇ m or less, more preferably 5 ⁇ m or less, and even more preferably 3 ⁇ m or less.
  • the median diameter of the Cr powder is preferably 1 ⁇ m or more, more preferably 1.5 ⁇ m or more, because if the median diameter of the Cr powder is too small, there is a concern that oxidation may proceed due to oxygen in the air during the mixed powder production step. Even more preferably, it is 2 ⁇ m or more.
  • the median diameter in each of the raw material powders described above means a particle diameter at an integrated value of 50% (D50) based on a volume value in a particle size distribution obtained by a laser diffraction / scattering method.
  • the powder was dispersed in a solvent of ethanol and measured by a wet method using a particle size distribution analyzer of model LA-920 manufactured by HORIBA.
  • the refractive index the value of metallic cobalt was used.
  • the above-mentioned raw material powder is weighed so as to have a desired composition, and is mixed using a known method such as a ball mill while also serving as pulverization. At this time, it is desirable that an inert gas be sealed in the pulverizing container to suppress oxidation of the raw material powder as much as possible.
  • the inert gas include Ar and N 2 gases.
  • the mixed powder thus obtained is molded and sintered in a vacuum atmosphere or an inert gas atmosphere by a hot press method.
  • various pressure sintering methods such as a plasma discharge sintering method can be used.
  • hot isostatic pressing HIP is effective in increasing the density of a sintered body, and hot pressing and hot isostatic pressing are performed in this order. It is preferable from the viewpoint of improvement.
  • the holding temperature during sintering is preferably set to the lowest temperature in the temperature range where the target is sufficiently densified. Although it depends on the composition of the target, in many cases, the temperature may be maintained in a temperature range of 700 to 1200 ° C. Among the temperature range from the viewpoint of increasing the ordered phase of the L1 0 structure, the holding temperature at the time of sintering is preferably set to 1050 ° C. or less, and more preferably set to 1000 ° C. or less, and 950 ° C. or less Is even more preferred.
  • the pressure during sintering is preferably 300 to 500 kg / cm 2 .
  • the holding temperature at the time of hot isostatic pressing depends on the composition of the sintered body, but is often in the range of 700 to 1200 ° C.
  • the temperature range from the viewpoint of increasing the ordered phase of the L1 0 structure preferably set to 1050 ° C. or less, and more preferably set to 1000 ° C. or less, still more preferably it is 950 ° C. or less.
  • the pressing force is preferably set to 100 MPa or more.
  • the sintering time is preferably at least 0.3 hour, more preferably at least 0.5 hour, even more preferably at least 1.0 hour, for improving the density of the sintered body. Further, the sintering time is preferably 3.0 hours or less, more preferably 2.0 hours or less, and further preferably 1.5 hours or less in order to prevent coarsening of crystal grains. Is more preferable.
  • the obtained sintered body is formed into a desired shape using a lathe or the like, whereby the sputtering target according to the present invention can be manufactured.
  • the target shape is not particularly limited, and examples thereof include a flat plate shape (including a disk shape and a rectangular plate shape) and a cylindrical shape.
  • the sputtering target according to the present invention is particularly useful as a sputtering target used for forming a magnetic recording film.
  • Co powders of the respective median diameter shown in Table 1 Pt powder, Co-Pt alloy powder, Cr powder, B 2 O 3 powder, TiO 2 powder, SiO 2 powder, Co 3 O 4 powder, Cr 2 O 3 powder, B powder, Ru powder, Ta powder, Ta 2 O 5 powder, CoO powder, Si 3 N 4 powder, and SiC powder were prepared. Each is a high-purity product and does not contain anything other than inevitable impurities. The median diameter of these powders was appropriately adjusted by sieving.
  • Co-Pt alloy powder was prepared according to the following procedure.
  • the Co powder having a median diameter of 3 ⁇ m and the Pt powder having a median diameter of 2 ⁇ m were rotated using an automatic mortar for 2 hours so that the Co molar ratio (Y) in the Co—Pt alloy powder became the value shown in Table 3.
  • the obtained mixed powder was fired in a vacuum atmosphere for 2 hours at a pre-heat treatment temperature shown in Table 5 according to the test number.
  • the obtained sponge was pulverized, and the obtained powder was sieved to obtain Co-Pt alloy powder having various median diameters shown in Table 1.
  • the Co-Pt powder used in Comparative Example 3 was prepared by a gas atomizing method and used by sieving.
  • the above-mentioned raw material powders were placed in a ball mill pot having a capacity of 10 liters together with a zirconia ball as a grinding medium at a mass ratio shown in Table 2 so as to have a molar ratio described in the composition column of Table 3 according to the test number. Sealed and rotated for 20 hours to mix. Next, the obtained mixed powder was filled in a carbon mold, and hot-pressed at a temperature shown in Table 5 in a vacuum atmosphere under a condition of a holding time of 2 hours and a pressure of 30 MPa to obtain a sintered body. . Next, the sintered body taken out from the hot press was subjected to hot isostatic pressing at the temperatures shown in Table 5. The pressure was set in the range of 100 to 200 MPa.
  • Table 3 shows the target composition in each test number calculated from the mixing ratio of the raw material powders, and the molar ratio (X) (%) of metal Co to the total of metal Co and metal Pt in the target.
  • Table 3 shows the molar ratio of metal Co to the total of metal Co and metal Pt in the Co-Pt alloy particle phase (equal to the composition of the Co-Pt alloy powder) (Y) (%).
  • the average particle size of the Co—Pt alloy particle phase is calculated by the following method. Two horizontal cutting lines in a horizontal direction on a 70 ⁇ m ⁇ 95 ⁇ m SEM photograph taken at 3000 ⁇ magnification using a mirror-polished cut surface of a surface which is horizontal to a sputtering surface of a sputtering target. The photograph is divided into three parts at equal intervals in the vertical direction, the cutting length of the Co—Pt alloy particle phase cut along each cutting line is measured, and the average value ( ⁇ m) of the cutting length is determined for each visual field. The thickness of the cutting line is 1/400 of the vertical length of the photograph. This is performed in arbitrary 10 visual fields, and the average value of 10 visual fields is set as a measured value. Note that the Co—Pt alloy particle phase included only partially in the visual field is excluded from the measurement target.
  • the average particle size of the Co particle phase is calculated by the following method.
  • the measurement of the size of the Co particle phase was performed using a mirror-polished cut surface of a surface that is horizontal to the sputtering surface of the sputtering target, and on a SEM photograph of 1120 ⁇ m ⁇ 1500 ⁇ m taken at 220 ⁇ , The photograph is divided into three parts at equal intervals in the vertical direction by two horizontal cutting lines in the horizontal direction, the cutting length of the Co particle phase cut by each cutting line is measured, and the average value of the cutting length ( ⁇ m ) Is determined for each field of view.
  • the thickness of the cutting line is 1/400 of the vertical length of the photograph. This is performed in arbitrary 10 visual fields, and the average value of 10 visual fields is set as a measured value. Note that the Co particle phase included only partially in the visual field is excluded from the measurement target.
  • the average particle size of the particle phase of the third element is calculated by the following method. Using a mirror-polished cut surface of a surface that is horizontal to the sputtering surface of the sputtering target, two horizontal cutting lines in the horizontal direction on a 215 ⁇ m ⁇ 290 ⁇ m SEM photograph taken at 1000 ⁇ magnification. The photograph is divided into three parts at equal intervals in the vertical direction, the cutting length of the particle phase of the third element cut by each cutting line is measured, and the average value ( ⁇ m) of the cutting length is determined for each visual field. The thickness of the cutting line is 1/400 of the vertical length of the photograph. This is performed in arbitrary 10 visual fields, and the average value of 10 visual fields is set as a measured value. The particle phase of the third element contained only partially in the visual field is excluded from the measurement target.
  • the average particle size of the particle phase of the nonmagnetic material is calculated by the following method. Two horizontal cutting lines in a horizontal direction on a 70 ⁇ m ⁇ 95 ⁇ m SEM photograph taken at 3000 ⁇ magnification using a mirror-polished cut surface of a surface which is horizontal to a sputtering surface of a sputtering target. The photograph is divided into three at equal intervals in the vertical direction, the cut length of the particle phase of the nonmagnetic material cut along each cutting line is measured, and the average value ( ⁇ m) of the cut length is determined for each visual field. The thickness of the cutting line is 1/400 of the vertical length of the photograph. This is performed in arbitrary 10 visual fields, and the average value of 10 visual fields is set as a measured value. Note that the particle phase of the nonmagnetic material included only in a part of the visual field is excluded from the measurement target.
  • Each sputtering target obtained by the above procedure was attached to a magnetron sputtering apparatus (C-3010 sputtering system manufactured by Canon Anelva Co., Ltd.) to perform sputtering.
  • the sputtering was performed under the conditions of an input power of 1 kW and an Ar gas pressure of 1.7 Pa. After performing pre-sputtering at 2 kWhr, a film was formed on a 4-inch diameter silicon substrate for 20 seconds. Then, the number of particles having a particle diameter of 0.07 ⁇ m or more adhered to the substrate was measured with a surface foreign matter inspection device (Candela CS920, manufactured by KLA-Tencor). Table 5 shows the results.

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Abstract

L'invention concerne une cible de pulvérisation cathodique en matériau ferromagnétique à base de Co-Pt qui présente un flux de fuite magnétique élevé et avec laquelle la formation de particules pendant la pulvérisation peut être évitée. Elle concerne une cible de pulvérisation cathodique en matériau ferromagnétique qui contient du métal Co et du métal Pt en une quantité totale de 70 % en moles ou plus à un rapport molaire Co/Pt de X/(100-X) (59 ≤ X < 100) et contient également du métal Cr en une quantité de 0 à 20 % en moles inclus, et qui a une phase de particules Co contenant du métal Co en une quantité de 90 % en moles ou plus et ayant un diamètre de particule moyen de 30 à 300 µm et une phase de particules d'alliage de Co-Pt contenant du métal Co et du métal Pt en une quantité totale de 70 % en moles ou plus à un rapport molaire Co/Pt de Y/(100-Y) (20 ≤ Y ≤ 60,5) et ayant un diamètre moyen de particule de 7 µm ou moins.
PCT/JP2018/033698 2018-09-11 2018-09-11 Cible de pulvérisation cathodique en matériau ferromagnétique WO2020053973A1 (fr)

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JP2019530516A JPWO2020053973A1 (ja) 2018-09-11 2018-09-11 強磁性材スパッタリングターゲット
MYPI2019004199A MY191072A (en) 2018-09-11 2018-09-11 Ferromagnetic material sputtering target
PCT/JP2018/033698 WO2020053973A1 (fr) 2018-09-11 2018-09-11 Cible de pulvérisation cathodique en matériau ferromagnétique
CN201880004278.2A CN111183244B (zh) 2018-09-11 2018-09-11 强磁性材料溅射靶
SG11201906523QA SG11201906523QA (en) 2018-09-11 2018-09-11 Ferromagnetic material sputtering target

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JP2010090412A (ja) * 2008-10-03 2010-04-22 Tanaka Holdings Kk Ｐｄ−Ｃｒ−Ｗ系スパッタリングターゲット及びその製造方法
JP2011174174A (ja) * 2010-01-26 2011-09-08 Mitsubishi Materials Corp 磁気記録媒体膜形成用スパッタリングターゲットおよびその製造方法
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WO2021235380A1 (fr) * 2020-05-18 2021-11-25 田中貴金属工業株式会社 CIBLE DE PULVÉRISATION CATHODIQUE EN Pt-OXYDE ET SUPPORT D'ENREGISTREMENT MAGNÉTIQUE PERPENDICULAIRE
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MY191072A (en) 2022-05-30

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