MY191072A - Ferromagnetic material sputtering target - Google Patents

Ferromagnetic material sputtering target

Info

Publication number
MY191072A
MY191072A MYPI2019004199A MYPI2019004199A MY191072A MY 191072 A MY191072 A MY 191072A MY PI2019004199 A MYPI2019004199 A MY PI2019004199A MY PI2019004199 A MYPI2019004199 A MY PI2019004199A MY 191072 A MY191072 A MY 191072A
Authority
MY
Malaysia
Prior art keywords
metal
ferromagnetic material
mol
sputtering target
material sputtering
Prior art date
Application number
MYPI2019004199A
Inventor
Shin-Ichi Ogino
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of MY191072A publication Critical patent/MY191072A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Powder Metallurgy (AREA)

Abstract

Provided is a Co-Pt-based ferromagnetic material sputtering target that has a high flux leakage and is capable of suppressing generation of particle matter during sputtering. A ferromagnetic material sputtering target including a total of 70 mol% or more of metal Co and metal Pt in a molar ratio of Co:Pt = X:100 - X (59 ? X < 100) and comprising 0 mol% or more and 20 mol% or less of metal Cr, wherein the ferromagnetic material sputtering target includes a Co particle phase including 90 mol% or more of metal Co and having an average particle size of 30 to 300 ?m, and a Co-Pt alloy particle phase that, under a condition of a molar ratio of Co:Pt = Y:100 - Y (20 ? Y ? 60.5), includes a total of 70 mol% or more of metal Co and metal Pt and has an average particle size of 7 ?m or less.
MYPI2019004199A 2018-09-11 2018-09-11 Ferromagnetic material sputtering target MY191072A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2018/033698 WO2020053973A1 (en) 2018-09-11 2018-09-11 Ferromagnetic material sputtering target

Publications (1)

Publication Number Publication Date
MY191072A true MY191072A (en) 2022-05-30

Family

ID=69776659

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2019004199A MY191072A (en) 2018-09-11 2018-09-11 Ferromagnetic material sputtering target

Country Status (5)

Country Link
JP (1) JPWO2020053973A1 (en)
CN (1) CN111183244B (en)
MY (1) MY191072A (en)
SG (1) SG11201906523QA (en)
WO (1) WO2020053973A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115552052A (en) * 2020-05-18 2022-12-30 田中贵金属工业株式会社 Pt-oxide-based sputtering target and perpendicular magnetic recording medium

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5111320B2 (en) * 2008-10-03 2013-01-09 田中貴金属工業株式会社 Pd-Cr-W-based sputtering target and method for producing the same
JP2011174174A (en) * 2010-01-26 2011-09-08 Mitsubishi Materials Corp Sputtering target for forming magnetic recording medium film, and method for producing the same
MY150826A (en) * 2010-07-20 2014-02-28 Jx Nippon Mining & Metals Corp Sputtering target of perromagnetic material with low generation of particles
SG188601A1 (en) * 2010-12-09 2013-04-30 Jx Nippon Mining & Metals Corp Ferromagnetic material sputtering target
US20130213804A1 (en) * 2010-12-17 2013-08-22 Jx Nippon Mining & Metals Corporation Ferromagnetic material sputtering target
JP6305881B2 (en) * 2014-09-05 2018-04-04 Ｊｘ金属株式会社 Sputtering target for magnetic recording media

Also Published As

Publication number Publication date
JPWO2020053973A1 (en) 2020-10-22
CN111183244A (en) 2020-05-19
WO2020053973A1 (en) 2020-03-19
SG11201906523QA (en) 2020-04-29
CN111183244B (en) 2022-03-08

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