MY159936A - Alloy for seed layer in magnetic recording medium, and sputtering target material - Google Patents
Alloy for seed layer in magnetic recording medium, and sputtering target materialInfo
- Publication number
- MY159936A MY159936A MYPI2013700827A MYPI2013700827A MY159936A MY 159936 A MY159936 A MY 159936A MY PI2013700827 A MYPI2013700827 A MY PI2013700827A MY PI2013700827 A MYPI2013700827 A MY PI2013700827A MY 159936 A MY159936 A MY 159936A
- Authority
- MY
- Malaysia
- Prior art keywords
- alloy
- recording medium
- seed layer
- magnetic recording
- target material
- Prior art date
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/14—Ferrous alloys, e.g. steel alloys containing titanium or zirconium
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
- C22C19/03—Alloys based on nickel or cobalt based on nickel
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
- C22C19/03—Alloys based on nickel or cobalt based on nickel
- C22C19/05—Alloys based on nickel or cobalt based on nickel with chromium
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
- C22C19/07—Alloys based on nickel or cobalt based on cobalt
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/002—Ferrous alloys, e.g. steel alloys containing In, Mg, or other elements not provided for in one single group C22C38/001 - C22C38/60
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/008—Ferrous alloys, e.g. steel alloys containing tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/02—Ferrous alloys, e.g. steel alloys containing silicon
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/06—Ferrous alloys, e.g. steel alloys containing aluminium
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/08—Ferrous alloys, e.g. steel alloys containing nickel
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/10—Ferrous alloys, e.g. steel alloys containing cobalt
- C22C38/105—Ferrous alloys, e.g. steel alloys containing cobalt containing Co and Ni
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/12—Ferrous alloys, e.g. steel alloys containing tungsten, tantalum, molybdenum, vanadium, or niobium
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/18—Metallic material, boron or silicon on other inorganic substrates
- C23C14/185—Metallic material, boron or silicon on other inorganic substrates by cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/62—Record carriers characterised by the selection of the material
- G11B5/73—Base layers, i.e. all non-magnetic layers lying under a lowermost magnetic recording layer, e.g. including any non-magnetic layer in between a first magnetic recording layer and either an underlying substrate or a soft magnetic underlayer
- G11B5/7368—Non-polymeric layer under the lowermost magnetic recording layer
- G11B5/7379—Seed layer, e.g. at least one non-magnetic layer is specifically adapted as a seed or seeding layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
- H01F41/18—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates by cathode sputtering
- H01F41/183—Sputtering targets therefor
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
- G11B5/851—Coating a support with a magnetic layer by sputtering
Abstract
There is provided an alloy for a seed layer in a magnetic recording medium, capable of providing a NI-based intermediate layer on a soft-magnetic undercoat film (SUL) with magnetism and capable of increasing a magnetic permeability. The alloy comprises: 2 to 20 at% of an M1 element which is one or two or more selected from the group consisting of W, Mo, Ta, Cr, V, and Nb, based on the alloy; 0 to 10 at% of an M2 element which is one or two or more selected from the group consisting of Al, Ga, In, Si, Ge, Sn, Zr, Ti, Hf, B, Cu, P, C, and Ru, based on the alloy; and the balance being at least two of Ni, Fe, and Co. The amounts of Ni, Fe, and Co are set to (I) ratios of Ni:Fe:Co=98-20:0-50:0-60 and Fe+Co more than equal to 1.5 or (II) a ratio of Ni:Fe:Co=98-20:2-50:0-60 in at % based on the total amount of Ni+Fe+Co.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010259713 | 2010-11-22 | ||
JP2011094594A JP5726615B2 (en) | 2010-11-22 | 2011-04-21 | Alloy for seed layer of magnetic recording medium and sputtering target material |
Publications (1)
Publication Number | Publication Date |
---|---|
MY159936A true MY159936A (en) | 2017-02-15 |
Family
ID=46145808
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2013700827A MY159936A (en) | 2010-11-22 | 2011-11-17 | Alloy for seed layer in magnetic recording medium, and sputtering target material |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP5726615B2 (en) |
CN (1) | CN103221999B (en) |
MY (1) | MY159936A (en) |
SG (1) | SG190358A1 (en) |
TW (1) | TWI512113B (en) |
WO (1) | WO2012070464A1 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6050050B2 (en) * | 2012-08-14 | 2016-12-21 | 山陽特殊製鋼株式会社 | Fe-Co alloy sputtering target material and method for producing the same |
CN104651788B (en) * | 2013-11-21 | 2017-03-15 | 安泰科技股份有限公司 | Ni Fe W alloys targets and its manufacture method |
CN103938030B (en) * | 2014-04-29 | 2015-12-09 | 深圳市天瑞科技有限公司 | A kind of preparation method of Ni-based soft magnetic materials |
CN105420678B (en) * | 2014-09-15 | 2018-03-09 | 安泰科技股份有限公司 | A kind of Al addition Ni W alloys targets and its manufacture method |
US9685184B1 (en) * | 2014-09-25 | 2017-06-20 | WD Media, LLC | NiFeX-based seed layer for magnetic recording media |
JP6502672B2 (en) * | 2015-01-09 | 2019-04-17 | 山陽特殊製鋼株式会社 | Alloy for seed layer of Ni-Cu based magnetic recording medium, sputtering target material and magnetic recording medium |
JP6581780B2 (en) * | 2015-02-09 | 2019-09-25 | 山陽特殊製鋼株式会社 | Ni-based target material with excellent sputtering properties |
SG11201707351RA (en) * | 2015-03-12 | 2017-10-30 | Sanyo Special Steel Co Ltd | Ni-BASED SPUTTERING TARGET MATERIAL AND MAGNETIC RECORDING MEDIUM |
JP6431496B2 (en) * | 2016-04-13 | 2018-11-28 | 山陽特殊製鋼株式会社 | Alloy for seed layer of magnetic recording medium, sputtering target material, and magnetic recording medium |
JP2018053280A (en) * | 2016-09-27 | 2018-04-05 | 山陽特殊製鋼株式会社 | NiTa-BASED ALLOY, TARGET MATERIAL AND MAGNETIC RECORDING MEDIA |
JP7157573B2 (en) * | 2018-07-04 | 2022-10-20 | 山陽特殊製鋼株式会社 | Ni-based alloy for seed layer of magnetic recording media |
JP7274361B2 (en) * | 2019-06-19 | 2023-05-16 | 山陽特殊製鋼株式会社 | Alloy for seed layer of magnetic recording media |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4224804B2 (en) * | 2002-06-19 | 2009-02-18 | 富士電機デバイステクノロジー株式会社 | Method for manufacturing perpendicular magnetic recording medium |
JP4812254B2 (en) * | 2004-01-08 | 2011-11-09 | 富士電機株式会社 | Perpendicular magnetic recording medium and manufacturing method thereof |
US20070253103A1 (en) * | 2006-04-27 | 2007-11-01 | Heraeus, Inc. | Soft magnetic underlayer in magnetic media and soft magnetic alloy based sputter target |
JP4632144B2 (en) * | 2007-09-14 | 2011-02-16 | 富士電機デバイステクノロジー株式会社 | Magnetic recording medium |
JP2009116952A (en) * | 2007-11-06 | 2009-05-28 | Hitachi Global Storage Technologies Netherlands Bv | Perpendicular magnetic recording medium, and magnetic memory using the same |
JP4993296B2 (en) * | 2007-11-29 | 2012-08-08 | 富士電機株式会社 | Perpendicular magnetic recording medium |
JP5337451B2 (en) * | 2008-11-06 | 2013-11-06 | エイチジーエスティーネザーランドビーブイ | Perpendicular magnetic recording medium |
JP4697337B2 (en) * | 2010-01-18 | 2011-06-08 | 富士電機デバイステクノロジー株式会社 | Perpendicular magnetic recording medium |
-
2011
- 2011-04-21 JP JP2011094594A patent/JP5726615B2/en active Active
- 2011-11-17 WO PCT/JP2011/076529 patent/WO2012070464A1/en active Application Filing
- 2011-11-17 SG SG2013039078A patent/SG190358A1/en unknown
- 2011-11-17 CN CN201180055776.8A patent/CN103221999B/en active Active
- 2011-11-17 MY MYPI2013700827A patent/MY159936A/en unknown
- 2011-11-22 TW TW100142726A patent/TWI512113B/en active
Also Published As
Publication number | Publication date |
---|---|
TW201233814A (en) | 2012-08-16 |
JP2012128933A (en) | 2012-07-05 |
JP5726615B2 (en) | 2015-06-03 |
SG190358A1 (en) | 2013-06-28 |
CN103221999B (en) | 2016-10-19 |
CN103221999A (en) | 2013-07-24 |
TWI512113B (en) | 2015-12-11 |
WO2012070464A1 (en) | 2012-05-31 |
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