MY159546A - Sputtering target materials for forming alloys for soft-magnetic film layers in perpendicular magnetic recording media, and method for producing the same - Google Patents
Sputtering target materials for forming alloys for soft-magnetic film layers in perpendicular magnetic recording media, and method for producing the sameInfo
- Publication number
- MY159546A MY159546A MYPI2011000191A MYPI2011000191A MY159546A MY 159546 A MY159546 A MY 159546A MY PI2011000191 A MYPI2011000191 A MY PI2011000191A MY PI2011000191 A MYPI2011000191 A MY PI2011000191A MY 159546 A MY159546 A MY 159546A
- Authority
- MY
- Malaysia
- Prior art keywords
- sputtering target
- soft
- raw
- producing
- recording media
- Prior art date
Links
- 239000013077 target material Substances 0.000 title abstract 4
- 238000005477 sputtering target Methods 0.000 title abstract 3
- 239000000956 alloy Substances 0.000 title abstract 2
- 229910045601 alloy Inorganic materials 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000843 powder Substances 0.000 abstract 5
- 239000002994 raw material Substances 0.000 abstract 5
- 229910052782 aluminium Inorganic materials 0.000 abstract 3
- 229910052796 boron Inorganic materials 0.000 abstract 3
- 229910052804 chromium Inorganic materials 0.000 abstract 3
- 229910052735 hafnium Inorganic materials 0.000 abstract 3
- 229910052758 niobium Inorganic materials 0.000 abstract 3
- 229910052715 tantalum Inorganic materials 0.000 abstract 3
- 229910052726 zirconium Inorganic materials 0.000 abstract 3
- 239000012535 impurity Substances 0.000 abstract 2
- 229910020630 Co Ni Inorganic materials 0.000 abstract 1
- 229910002440 Co–Ni Inorganic materials 0.000 abstract 1
- QQHSIRTYSFLSRM-UHFFFAOYSA-N alumanylidynechromium Chemical compound [Al].[Cr] QQHSIRTYSFLSRM-UHFFFAOYSA-N 0.000 abstract 1
- 238000001755 magnetron sputter deposition Methods 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- 238000007493 shaping process Methods 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/62—Record carriers characterised by the selection of the material
- G11B5/64—Record carriers characterised by the selection of the material comprising only the magnetic material without bonding agent
- G11B5/65—Record carriers characterised by the selection of the material comprising only the magnetic material without bonding agent characterised by its composition
- G11B5/657—Record carriers characterised by the selection of the material comprising only the magnetic material without bonding agent characterised by its composition containing inorganic, non-oxide compound of Si, N, P, B, H or C, e.g. in metal alloy or compound
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
- G11B5/851—Coating a support with a magnetic layer by sputtering
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/0433—Nickel- or cobalt-based alloys
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
- C22C19/07—Alloys based on nickel or cobalt based on cobalt
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C33/00—Making ferrous alloys
- C22C33/02—Making ferrous alloys by powder metallurgy
- C22C33/0257—Making ferrous alloys by powder metallurgy characterised by the range of the alloying elements
- C22C33/0278—Making ferrous alloys by powder metallurgy characterised by the range of the alloying elements with at least one alloying element having a minimum content above 5%
- C22C33/0285—Making ferrous alloys by powder metallurgy characterised by the range of the alloying elements with at least one alloying element having a minimum content above 5% with Cr, Co, or Ni having a minimum content higher than 5%
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C45/00—Amorphous alloys
- C22C45/02—Amorphous alloys with iron as the major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C45/00—Amorphous alloys
- C22C45/04—Amorphous alloys with nickel or cobalt as the major constituent
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C2202/00—Physical properties
- C22C2202/02—Magnetic
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physical Vapour Deposition (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Powder Metallurgy (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
Abstract
There is disclosed a magnetron sputtering target material for forming an alloy for a soft-magnetic film layer. The sputtering target material is obtained by mixing and shaping two or more raw-material powders having different compositions, wherein one raw-material powder of the two or more raw-material powders comprises in at,%:Ni: 20 to 34%; Co: 0 to 6%; one or more of Zr, Hf, Nb, Ta and B: 3 to 12% in total of Zr+Hf+Nb+Ta+B/2, wherein B is in an amount of from 0 to 7%; and one or more of Al and Cr: 0 to 5% in total of Al-Cr; and the balance Fe and unavoidable impurities, and satisfies in atomic ratio: Ni/(Fe+Ni): 0.27 to 0.35; wherein the one raw-material powder is mixed with at least one raw material powder comprising Co-Ni elements and one or more of Zr, Hf, Nb, Ta, B, Al and Cr, and is consolidated to form the sputtering target material comprising in at.%:Fe: 10 to 45% Ni: 1 to 25%; one or more of Zr, Hf, Nb, Ta and B: 5 to 10% in total of Zr+Hf+Nb+Ta+-B/2, wherein B is in an amount of from 0 to 7%; and one or more of Al and Cr: 0 to 5% in total of Al+Cr; and the balance Co and unavoidable impurities: 37% or more, and satisfying in atomic ratio: Fe/(Co+Fe+Ni): 0.10 to 0.50; and Ni/(Co+Fe+Ni): 0.01 to 0.25.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008182645A JP5605787B2 (en) | 2008-07-14 | 2008-07-14 | Sputtering target material for forming an alloy for a soft magnetic film layer in a perpendicular magnetic recording medium and its manufacturing method |
Publications (1)
Publication Number | Publication Date |
---|---|
MY159546A true MY159546A (en) | 2017-01-13 |
Family
ID=41550383
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2011000191A MY159546A (en) | 2008-07-14 | 2009-07-14 | Sputtering target materials for forming alloys for soft-magnetic film layers in perpendicular magnetic recording media, and method for producing the same |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5605787B2 (en) |
CN (1) | CN102149836B (en) |
MY (1) | MY159546A (en) |
WO (1) | WO2010007980A1 (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5403418B2 (en) * | 2008-09-22 | 2014-01-29 | 日立金属株式会社 | Method for producing Co-Fe-Ni alloy sputtering target material |
CN103038388B (en) * | 2010-09-03 | 2015-04-01 | 吉坤日矿日石金属株式会社 | Ferromagnetic material sputtering target |
JP5714397B2 (en) * | 2010-10-26 | 2015-05-07 | 山陽特殊製鋼株式会社 | Soft magnetic alloy for magnetic recording, sputtering target material, and magnetic recording medium |
JP5917045B2 (en) * | 2011-08-17 | 2016-05-11 | 山陽特殊製鋼株式会社 | Alloy and sputtering target material for soft magnetic thin film layer in perpendicular magnetic recording medium |
JP6302153B2 (en) * | 2011-09-28 | 2018-03-28 | 山陽特殊製鋼株式会社 | Soft magnetic thin film layer and perpendicular magnetic recording medium in perpendicular magnetic recording medium |
JP5778052B2 (en) * | 2012-02-03 | 2015-09-16 | 山陽特殊製鋼株式会社 | Alloy for soft magnetic film layer having low saturation magnetic flux density used for magnetic recording medium and sputtering target material |
SG11201405335SA (en) * | 2012-06-06 | 2014-11-27 | Hitachi Metals Ltd | Fe-co-based alloy sputtering target material, and method ofproducing same |
JP6161991B2 (en) * | 2013-08-15 | 2017-07-12 | 山陽特殊製鋼株式会社 | Fe-Co alloy sputtering target material |
JP6405261B2 (en) * | 2014-05-01 | 2018-10-17 | 山陽特殊製鋼株式会社 | Soft magnetic alloy for magnetic recording, sputtering target material, and magnetic recording medium |
TWI602940B (en) * | 2014-06-11 | 2017-10-21 | 光洋應用材料科技股份有限公司 | Soft-magnetic sputtering target and soft-magnetic sputtering material |
CN113787189A (en) * | 2021-11-16 | 2021-12-14 | 西安欧中材料科技有限公司 | Steel spherical powder of die for additive manufacturing and recycling method thereof |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3909240A (en) * | 1973-09-28 | 1975-09-30 | Graham Magnetics Inc | Method of producing acicular metal crystals |
US4054530A (en) * | 1973-09-28 | 1977-10-18 | Graham Magnetics, Inc. | Iron-nickel-cobalt magnetic powder and tape prepared therefrom |
JPH0744110B2 (en) * | 1988-09-02 | 1995-05-15 | 松下電器産業株式会社 | High saturation magnetic flux density soft magnetic film and magnetic head |
JP2006265654A (en) * | 2005-03-24 | 2006-10-05 | Hitachi Metals Ltd | Fe-Co-B-BASED ALLOY TARGET MATERIAL AND METHOD FOR PRODUCING THE SAME |
JP2007048790A (en) * | 2005-08-05 | 2007-02-22 | Sony Corp | Storage element and memory |
US7524570B2 (en) * | 2005-10-13 | 2009-04-28 | Hitachi Global Storage Technologies Netherlands B.V. | Perpendicular magnetic recording system and medium with high-moment corrosion-resistant “soft” underlayer (SUL) |
JP4101836B2 (en) * | 2005-12-26 | 2008-06-18 | 昭和電工株式会社 | Magnetic recording medium, manufacturing method thereof, and magnetic recording / reproducing apparatus |
JP2007250094A (en) * | 2006-03-16 | 2007-09-27 | Fujitsu Ltd | Magnetic recording medium, manufacturing method of magnetic recording medium and magnetic recording device |
JP2007273056A (en) * | 2006-03-31 | 2007-10-18 | Fujitsu Ltd | Perpendicular magnetic recording medium and magnetic storage device |
JP4331182B2 (en) * | 2006-04-14 | 2009-09-16 | 山陽特殊製鋼株式会社 | Soft magnetic target material |
-
2008
- 2008-07-14 JP JP2008182645A patent/JP5605787B2/en not_active Expired - Fee Related
-
2009
- 2009-07-14 CN CN200980135768.7A patent/CN102149836B/en not_active Expired - Fee Related
- 2009-07-14 MY MYPI2011000191A patent/MY159546A/en unknown
- 2009-07-14 WO PCT/JP2009/062716 patent/WO2010007980A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
JP2010018869A (en) | 2010-01-28 |
WO2010007980A1 (en) | 2010-01-21 |
CN102149836B (en) | 2014-03-19 |
CN102149836A (en) | 2011-08-10 |
JP5605787B2 (en) | 2014-10-15 |
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