WO2020029507A1 - 一种密度分布可控的实木压缩密实化板材生产方法 - Google Patents
一种密度分布可控的实木压缩密实化板材生产方法 Download PDFInfo
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- WO2020029507A1 WO2020029507A1 PCT/CN2018/121944 CN2018121944W WO2020029507A1 WO 2020029507 A1 WO2020029507 A1 WO 2020029507A1 CN 2018121944 W CN2018121944 W CN 2018121944W WO 2020029507 A1 WO2020029507 A1 WO 2020029507A1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27D—WORKING VENEER OR PLYWOOD
- B27D1/00—Joining wood veneer with any material; Forming articles thereby; Preparatory processing of surfaces to be joined, e.g. scoring
- B27D1/04—Joining wood veneer with any material; Forming articles thereby; Preparatory processing of surfaces to be joined, e.g. scoring to produce plywood or articles made therefrom; Plywood sheets
- B27D1/08—Manufacture of shaped articles; Presses specially designed therefor
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- the invention relates to a method for producing solid wood compressed and compacted board, in particular to a method for producing a solid wood compressed and compacted board with controllable density distribution, and relates to the field of solid wood and wood processing.
- Wood compression technology first appeared in the United States and Germany in the 1930s. The original compressed wood was used in military aircraft to replace metal materials in order to prevent detection by radar. It was not until the 1990s that the study of wood compression technology aimed at improving the performance of soft wood and broadening the scope of application of plantation woods received the attention of scholars and industry around the world.
- wood compression technology has been gradually improved in terms of softening of the wood, control of the mechanical properties of the compressed wood, compression and deformation fixation, etc., and has formed raw wood shaping compression, overall sawn timber compression, veneer compression, and sawn surface compression. , As well as high-frequency heating softening and deformation fixed compression wood processing technology system.
- the compression and deformation fixing technology developed by Inoue Yaman for 180 ° C saturated steam pressure (equivalent to 10Kg pressure) for 10 minutes or 200 ° C saturated steam pressure (equivalent to 15Kg pressure) for 2 minutes can permanently fix the compression deformation.
- the development of this technology has advanced the application of wood compression technology from the perspective of material dimensional stability. However, due to the complexity of the equipment for material processing, and the high equipment and production costs, so far, these wood compression technologies have not achieved industrial application.
- the rebound rate can be as low as 3%.
- the upper and lower surfaces of 650 kg / m 3 are densified wood, but the thickness of the densified layer is very limited (or very small), and the density distribution cannot be controlled.
- a fixed heat treatment experiment was also performed after atmospheric pressure. The results show that the maximum dimensional stability can be improved by 40% after heat treatment.
- Clevan Lamason and Meng Gong used the method of compressing the surface of poplar wood board (1mm deep) in boiling water for 5 minutes and then using a hot press at 145 ° C, 175 ° C and 205 ° C to obtain a compact with a single surface density. wood.
- the wood compressed at 145 ° C was subjected to normal pressure post-heat treatment at 190 ° C, 200 ° C, and 210 ° C to perform compression deformation fixation, which can reduce the rebound rate to 3%.
- the technical problem to be solved by the present invention is to provide a method for producing a compacted solidified solid wood board with controllable density distribution.
- the invention can accurately compress solid wood boards, so that the position distribution of the compacted layer and the uncompressed layer of the wood can be accurately controlled.
- the invention has more excellent mechanical properties and dimensional stability, which further improves the quality of compressed wood. .
- the technical solution of the present invention is as follows: A method for producing a solid wood compression compacted board with controllable density distribution, adjusting the moisture content of each layer in the thickness direction of the solid wood board, and forming a dry area and a wet area in the thickness direction of the solid wood board. Area, and the yield stress difference between the dry and wet areas is above 0.2MPa, adjust the position distribution of the dry and wet areas, and then use a hot press to form a high-density compression layer in the wet area of the solid wood board. Controlled solid wood compression densified board.
- the moisture content of the wood board is adjusted by means of water immersion and / or drying, so that the wet and dry interface of the wood board is moved, and the low moisture layer in the wood board forms a dry zone.
- the high moisture content layer in the solid wood board forms a wet zone, and the yield stress of the dry zone and the wet zone is detected in real time to ensure that the yield stress difference between the dry zone and the wet zone is above 0.2 MPa.
- the solid wood compacted compacted board includes a surface compacted board with a compressed layer on the surface of the wood, an intermediate layer compacted board with the compressed layer in the middle of the thickness direction of the wood, or The center layer of the compression layer at the center of the thickness direction of the wood compacts the board.
- the method of adjusting the moisture content of the surface compacted and compacted boards is to dry the solid wood boards to a moisture content of 15% or less; Water spraying at the end increases the moisture content of the wood surface and forms a wet zone on the wood surface.
- the dry-wet interface inside the wood is moved, thereby adjusting the position distribution of the wet area on the wood surface and the dry area inside the wood , And adjust the yield stress difference between the wet area on the wood surface and the dry area inside the wood.
- the method for adjusting the moisture content of the middle-layer compacted board or the center-layer compacted board is to adjust the moisture content of the solid wood board to more than 15% and seal the wood.
- the wood is dried to form a moisture content gradient from the outside to the inside in the thickness direction of the wood, thereby forming a dry area on the surface of the wood and a wet area inside the wood;
- the plate is then heated under the grip of a hot press, and the inside of the plate is heated.
- the wet-dry interface moves, thereby adjusting the position distribution of the dry area on the wood surface and the wet area inside the wood, and adjusting the yield stress difference between the dry area on the wood surface and the wet area inside the wood.
- T S is the surface temperature °C of the solid wood board when heated under the grip of a hot press
- T V is the boiling point temperature of water °C
- T 0 is the initial temperature of the wood
- K 1 and K 2 are the thermal conductivity of the wood in the wet and dry areas, respectively.
- ⁇ L is the weight per unit volume of moisture evaporated at the wood interface kg / m 3 ;
- t is under the grip of a hot press Heating time;
- S is the distance m from the interface to the plate surface at time t; L is the latent heat of evaporation of the interface moisture kJ / kg.
- the solid wood board is compressed on a hot press, specifically, the solid wood board is placed on the hot press, the hot press is started, and the temperature is 100 to 150 ° C. Compression speed of 2 ⁇ 7mm / min, compression of solid wood board with pressure above 3MPa, real-time detection and control of compression layer thickness with displacement sensor.
- the end cap is used to seal and coat the ends of the solid wood board with bone glue, paraffin, or asphalt.
- the solid wood compacted and compacted board further includes a multilayered compacted board having multiple compressed layers.
- the multilayered compacted board is first processed into The surface layer with the upper and lower compression layers is compacted, and then it is continuously placed on the hot press, and the hot-pressed plate is used for contact drying. The wet and dry interface in the thickness direction of the plate is further adjusted, and compressed again to obtain Multi-layer compacted sheet with compressed layers.
- the present invention forms a dry area and a wet area in the thickness direction of the solid wood plate by adjusting the moisture content of the solid wood plate, and the yield stress difference between the dry area and the wet area is above 0.2 MPa; and by adjusting the dry and wet areas, Position distribution to achieve controllable density distribution of solid wood compacted boards. Since the present invention can precisely control the position distribution of the compacted layer and the uncompressed layer of the solid wood board to achieve precise compression, it can effectively save wood and improve the quality and performance of the product, on the other hand, it can realize the personality of the wood product. Customization, expand the use of ordinary wood, and increase the value of ordinary wood.
- the solid wood compacted board of the present invention includes a surface compacted board with a compressed layer on the surface of the wood, an intermediate layer compacted board with a compressed layer in the middle of the wood, or a central layer compacted board with the compressed layer in the center of the wood;
- the applicant has specifically defined and optimized the method for adjusting the moisture content of the surface compaction sheet, the intermediate layer compaction sheet, and the center layer compaction sheet, and the method of adjusting the position distribution of the dry zone and the wet zone by adjusting the moisture content, thereby
- the directional compression and compaction of any area in the thickness direction of the solid wood plate is realized, and the use range and practicality of the product are greatly improved.
- the moving rule of the wet and dry interface under the heating time and the clamping temperature (that is, the surface temperature of the solid wood board when the heating is clamped by the hot press) can be accurately obtained by the functional relationship, so that Obtain the precise relationship between the heating time and clamping temperature under the clamping of the hot press and the changes in the dry and wet areas, so as to further precisely compress the solid wood boards, so that the position distribution of the dense and uncompressed layers of the wood is accurately and controllable .
- the present invention also improves the anti-deformation fixing treatment of solid wood compressed and compacted boards.
- the improved compacted boards have extremely excellent performance in terms of moisture absorption rebound rate and water absorption rebound rate, and greatly improve the product
- the properties of MOE, MOR, hardness and surface hardness further improve the quality of compressed wood.
- FIG. 1 is a schematic diagram of forming a dry area and a wet area by adjusting the moisture content of a solid wood plate;
- Figure 2 is a density distribution diagram of an uncompressed poplar board
- FIG. 3 is a density distribution diagram of the surface layer compressed and densified when the yield stress difference between the dry area and the wet area is 0.2 MPa, and the surface layer is compressed by 5 mm;
- FIG. 4 is a density distribution chart of a poplar solid wood board compressed by a method of compressing and densifying the upper and lower layers of the present invention by 5 mm when the yield stress difference between the dry zone and the wet zone is 0.10 MPa;
- FIG. 5 is a density distribution diagram of a poplar solid wood board compressed by a compression and compaction method of 7 mm on the upper and lower layers of the present invention when the yield stress difference between the dry zone and the wet zone is 0.16 MPa;
- FIG. 6 is a photo of the effect of compressed solidified solid wood board produced according to the production process of the present invention.
- FIG. 7 is a density distribution diagram of the surface layer compressed and densified on the poplar and the bottom layer by 10 mm;
- FIG. 8 is a density distribution diagram of compression and densification of the intermediate layer of Kanuo paint
- FIG. 9 is a density distribution chart of a 5 mm center layer compressed and densified board of poplar
- FIG. 10 is a density distribution diagram of a 10 mm core layer compressed and compacted board in a poplar center layer
- FIG. 11 is a density distribution diagram of three compression layers (upper and lower layers plus a central layer) of poplar;
- FIG. 12 is a density distribution diagram of 5 compressed layers (upper and lower layers, two middle layers, and one center layer) of poplar;
- FIG. 13 is a real photo of a solid wood compacted board produced according to the production process of the present invention.
- FIG. 14 is a real photo of a multilayer compression-compacted sheet produced according to the production process of the present invention.
- Embodiment 1 A method for producing a solid wood compacted and compacted board with controllable density distribution.
- the water content of each layer in the thickness direction of the solid wood board is adjusted by means of water immersion and / or drying. Area, a wet zone is formed in the layer with a high moisture content in the thickness direction of the solid wood board, and a wet and dry interface is formed at the junction of the dry zone and the wet zone.
- FIG. 1 A schematic diagram of the wet zone, where the abscissa x is the position in the thickness direction of the sheet, and the ordinate is the moisture content corresponding to the position on the abscissa.
- area 1 is a dry area
- area 2 is a wet area
- the interface between area 1 and area 2 is a wet and dry interface.
- the moisture content in the dry and wet regions is different, the yield stresses in the dry and wet regions are also different.
- the yield stress difference can also be adjusted, and the thickness of the plate can be adjusted by adjusting the moisture content. Orient the distribution of the dry and wet areas, and detect the dry and wet areas in real time to ensure that the yield stress difference between the dry and wet areas is above 0.2 MPa.
- Figure 2 is the density distribution of uncompressed poplar board, the abscissa is the distance (mm) from the lower surface to the upper surface of the board, and the ordinate is the wood density (g / cm 3 ) corresponding to the abscissa position;
- Figure 3 is dry The density distribution map of the compression and densification of the surface layer compressed by 5mm on the poplar and the lower layer when the yield stress difference between the wet zone and the wet zone is 0.2MPa. Wood density at location (g / cm 3 ). It can be seen from FIG. 3 that when the yield stress difference is 0.2 MPa, the present invention can effectively and accurately achieve surface compaction and compaction of solid wood boards.
- Figure 4 is a density distribution map of a poplar solid wood board compressed by the method of compressing and densifying the upper and lower layers of the present invention by a compression of 5 mm when the yield stress difference between the dry zone and the wet zone is 0.10 MPa, and the abscissa is the lower surface of the board
- the distance to the upper surface (mm) the ordinate is the wood density (g / cm 3 ) corresponding to the position on the abscissa, and it can be seen from FIG. 4 that the compression layer cannot be obtained when the yield stress difference is 0.10 MPa.
- FIG. 5 is a density distribution chart of a poplar solid wood board compressed by a compression and compaction method of 7 mm on the upper and lower layers of the present invention when the yield stress difference between the dry zone and the wet zone is 0.16 MPa, and the abscissa is the lower surface of the board to the top
- the surface distance (mm) the ordinate is the wood density (g / cm 3 ) corresponding to the position on the abscissa, and it can be seen from FIG. 5 that the compression layer cannot be obtained when the yield stress difference is 0.16 MPa.
- the dry-wet interface of the solid wood plate is moved by means of adjusting water content such as water immersion and / or drying, thereby adjusting the position distribution of the dry zone and the wet zone, and ensuring that the yield stress difference between the dry zone and the wet zone is 0.2.
- the solid wood plate Above MPa, the solid wood plate is placed on a hot press at a temperature of 100 to 150 ° C, a compression speed of 2 to 7 mm / min, and a pressure of more than 3 MPa to compress the solid wood plate.
- the displacement sensor is used to detect and control the thickness of the compressed layer in real time.
- a high-density compression layer is formed in the wet area of the solid wood board to obtain a solid wood compacted board with controllable density distribution.
- the solid wood compacted board includes a surface compacted board with a compressed layer on the surface of the wood, an intermediate layer compacted board with the compressed layer in the middle of the thickness direction of the wood, or a central layer compacted board with the compressed layer at the center of the thickness of the wood.
- the method of adjusting the moisture content of the surface compacted board is to dry the solid wood board to a moisture content of less than 15%; then, the wood is sealed with bone cement, paraffin, or asphalt, and then immersed in water or sprayed without sealing to increase the moisture content of the wood surface. , Forming a wet area on the wood surface, by controlling the soaking time or the amount of water spray, the internal wet and dry interface of the wood is moved, thereby adjusting the position distribution of the wet area on the wood surface and the dry area inside the wood, and adjusting the wet area on the wood surface and the dry area inside the wood Yield stress difference between.
- the method of adjusting the moisture content of the middle layer compacted plate or the center layer compacted plate is to adjust the moisture content of the solid wood plate to more than 15%, seal the end of the wood with bone glue, paraffin or asphalt, and then dry the wood.
- the drying treatment may be contact or non-contact heat conduction drying.
- a contact drying method of a hot press plate of a hot press a drying method with high drying efficiency and good drying effect is preferred.
- the thickness direction of the wood forms a moisture content gradient from the outside to the inside, thereby forming a dry area on the surface of the wood, a wet area inside the wood, and a dry-wet interface at the junction of the dry area and the wet area; by adjusting the drying Temperature and time cause the internal wet and dry interface of the wood to move, thereby adjusting the position distribution of the dry area on the wood surface and the wet area inside the wood, and adjusting the yield stress difference between the dry area on the wood surface and the wet area inside the wood.
- T S is the surface temperature of the solid wood board when heated under the grip of a hot press °C
- T V is the boiling point temperature of water °C
- T 0 is the initial temperature of the wood
- K 1 and K 2 are wet and dry, respectively Coefficient of wood thermal conductivity W / m ⁇ K
- h is wood thickness m
- D 1 is wood thermal conductivity coefficient m 2 / h in wet zone
- ⁇ L is the weight per unit volume of water vapor kg / m 3 at the wood interface
- t is hot pressing Heating time under the grip of the machine
- S is the distance m from the interface to the plate surface at time t
- L is the latent heat of evaporation of the interface moisture kJ / kg.
- the moving position of the wet and dry interface can be calculated quantitatively and definitively by adjusting the heating time t under the clamping of the hot press and the surface temperature T S of the solid wood board when heating under the clamping of the hot press, thereby more
- T S surface temperature
- FIG. 6 is a photo of solid wood compacted board produced according to the production process of the present invention.
- the present invention can produce surface-layer compressed board, middle-layer compressed board, center-layer compressed board and many more.
- Various compression plates of layer compression plates are possible.
- the solid wood compaction board according to the present invention further includes a multi-layer compaction board having multiple compression layers.
- Multi-layer compacted sheet is first processed solid wood sheet into surface compacted sheet with upper and lower compression layers, and then continues to be placed on the hot press for conductive heating for more than 120s to further adjust the dryness and wetness in the thickness direction of the sheet. Interface, and compressed again, to obtain a multi-layer compacted sheet with a multi-layer compression layer having two compression surface layers and two compression intermediate layers. If the plate is thick enough, this process can be continued to more than 4 compression layers, that is, two compression surface layers, two compression intermediate layers and one compression center layer, as shown in FIG. 14.
- Embodiment 2 Specific manufacturing method of surface layer compaction and compaction plate:
- the water immersion surface should be on the same side as the heating plate and continuously compressed at a speed of 2-7 mm / min at a pressure of 3 MPa or more until it is compressed to the target thickness to form a single-sided compressed wood immersed in water and the heating surface is compressed;
- Air-dry material to dry material with initial moisture content of less than 15% Immersion in water after capping or spraying without capping to increase the moisture content on the wood surface. The increase is 20g / m 2 or more, forming a wet area and the interior of the wood surface. Yield stress difference between 0.2 MPa and more in the dry zone. It is then placed on a hot press heated to 100 to 150 ° C and continuously compressed at a speed of 2 to 7 mm / min at a pressure of more than 3 MPa until it is compressed to the target thickness to form a double-sided compressed wood with both upper and lower surfaces compressed.
- Figure 3 is a density distribution map of the surface layer compressed and densified by 5mm on the upper and lower layers of poplar.
- the abscissa is the distance (mm) from the lower surface to the upper surface of the board, and the ordinate is the wood density corresponding to the position of the abscissa ( g / cm 3 )
- Figure 7 is the density distribution of the surface layer compressed and densified by 10mm on the upper and lower layers of poplar.
- the abscissa is the distance (mm) from the lower surface to the upper surface of the board, and the ordinate is the position corresponding to the abscissa position.
- Embodiment 3 The specific manufacturing method of the intermediate layer compression compaction plate:
- the contact (hot press) heat conduction method is used at 100 ° C or higher.
- the clamping and drying process for a time of more than 60s moves the dry-wet interface of the board to a predetermined position, and the yield stress difference between the dry zone and the wet zone of the board is 0.25 MPa.
- the final compression is controlled by a displacement sensor, and then 100 ⁇ It is compressed by a 150 ° C hot press and is continuously compressed at a speed of 2 to 7 mm / min. When the pressure is above 3 MPa, the surface is not compressed, and the middle layer of the compression and compaction which forms two compression layers is compressed and densified.
- FIG. 8 is a density distribution map of the compaction and compaction of the intermediate layer of Cano paint.
- the abscissa is the distance (mm) from the lower surface to the upper surface of the board, and the ordinate is the wood density (g / cm 3 ) corresponding to the abscissa position. )
- the intermediate layer is compacted and compacted, two intermediate layer compressed layers are formed in the intermediate layer in the thickness direction of the plate.
- Embodiment 4 The specific manufacturing process of the center layer compression compaction plate:
- the contact or non-contact heat conduction method is used to dry at 100 ° C or higher. If the drying time is more than 5 minutes, the yield stress difference between the surface of the sheet and the center of the sheet is 0.2 MPa or more, the compression amount is set to 1 to 6 mm, and then compressed with a hot press at 100 to 150 ° C to Continuous compression at a speed of 2 to 7 mm / min, and a pressure of 3 MPa or more can form a surface that does not compress, and the center layer is compressed and densified to compact the wood.
- the said Figure 9 is the density distribution of the compressed 5mm center layer of the poplar center layer.
- the abscissa is the distance (mm) from the lower surface to the upper surface of the board, and the ordinate is the wood density corresponding to the position of the abscissa ( g / cm 3 )
- Figure 10 is the density distribution of the core layer compressed and densified board with the core layer compressed by 10 mm.
- the abscissa is the distance (mm) from the lower surface to the upper surface of the board, and the ordinate is the position corresponding to the abscissa position.
- Example 5 Specific manufacturing process of multi-layer compression and compaction plate:
- the wood compressed in accordance with the upper and lower surface compression processes is continued to be placed on the hot press, and the conductive heating is performed for more than 120s, and then compressed again, on the basis of the surface compression and densification, two middle layers are compressed and densified. Compression layer. If the plate is thick enough, this compression and densification process can continue until the core layer is compressed and densified.
- the compression After the compression is completed, it is held on the press for 5 minutes, and the pressure is reduced to 1 MPa for more than 30 minutes. Open the press, remove the wood from the press plate, put it in a closed heat treatment kiln, and dry it to a moisture content of 10% or less, directly It is heat-set at 180 ° C or higher. After the heat treatment temperature reaches 180 ° C, water vapor is passed into the heat treatment kiln, so that the pressure in the kiln reaches above 0.25 MPa, and is maintained for more than 1 hour. First, the pressure in the kiln is reduced to 0.1 MPa, and then the temperature is lowered to below 60. After taking out from the kiln, a layered compression and compaction plate with a compression deformation rebound rate of less than 3% can be obtained.
- FIG. 11 is a density distribution map of three compressed layers of poplar (upper and lower layers plus a central layer).
- the abscissa is the distance (mm) from the lower surface to the upper surface of the board, and the ordinate is the wood corresponding to the abscissa position.
- Figure 12 shows the density distribution of 5 compressed layers of poplar (upper and lower layers, two middle layers, and one center layer).
- the abscissa is the distance from the lower surface to the upper surface of the board ( mm), and the ordinate is the wood density (g / cm 3 ) corresponding to the position on the abscissa.
- FIG. 13 is a real photo of solid wood compacted board produced according to the production process of the present invention. From left to right, it is a compacted board with a surface layer compressed by 5mm, 10mm, a compacted board with a center layer compressed by 5mm, and 10mm. Compressed plain plate.
- FIG. 14 is a real photo of a multilayer compressed and compacted board produced according to the production process of the present invention. The left side is a multi-layered compacted board with a double skin layer and a center layer, and the right side is a multi-layered compacted board with a double skin layer and a middle layer. Layer compression compacts the plate.
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Abstract
本发明公开了一种密度分布可控的实木压缩密实化板材生产方法,调节实木板材厚度方向各层的含水率,在实木板材内部厚度方向形成干区和湿区,且干区和湿区的屈服应力差在0.2MPa以上,调整干区和湿区的位置分布,再用热压机压缩,在实木板材的湿区形成高密度压缩层,得到密度分布可控的实木压缩密实化板材。本发明可以对实木板材进行精准压缩,使得木材的密实化层与未压缩层的位置分布精准可控;此外,本发明具有更为优越的力学性能和尺寸稳定性,进一步提高了压缩木材的品质。
Description
本发明涉及一种实木压缩密实化板材生产方法,特别是密度分布可控的实木压缩密实化板材生产方法,涉及实木木材加工领域。
木材压缩技术最早出现于20世纪30年代的美国和德国,最初的压缩木使用在军用飞机上,用来替代金属材料,目的是防止被雷达发现。直到20世纪90年代,以改善软质木材的性能、拓宽人工林木材的应用范围为目标的木材压缩技术研究,才受到世界各国学者和产业界的重视。
经过20多年的研究,木材压缩技术,在木材软化、压缩木材的力学性能控制、压缩变形固定等方面逐步得到完善,并形成了原木整形压缩、锯材整体压缩、单板压缩、锯材表面压缩,以及高频加热软化和变形固定等压缩木加工技术体系。井上雅文开发的180℃的饱和蒸汽压力(相当于10Kg压力)处理10分钟或者200℃的饱和蒸汽压力(相当于15Kg压力)处理2分钟的压缩变形固定技术,可以使压缩变形得到永久固定。这项技术的开发从材料的尺寸稳定性角度,对木材压缩技术的应用向前推进了一步。但由于材料加工的设备复杂,且设备成本及生产成本很高,到目前为止,这些木材整体压缩技术并 未实现工业化应用。
上述的压缩技术都是将木材作为一个整体进行软化和压缩的。这种压缩方式下,木材力学性能的提高主要依赖于压缩率的增加。但提高压缩率会增加压缩木的制造成本。针对这个问题,很多学者开展了各种方式的表层压缩研究,目的是期望在较低的压缩率下提高木材的表面密度和硬度。涂登云等将干燥杨木在180℃下预热350秒后,进行高温热软化压缩,获得了表层密度相对较大的表面压缩木材,但是这种压缩方式获得的表层密实化木材,从密度分布结果可以看出,中间部分实际上也被压缩了。这种压缩木材经过200℃、4小时的常压后热处理固定后,回弹率最低可以低至3%。Zhan JF等将基本密度为319kg/m
3的冷杉气干材表面喷水后,直接放在160℃或者180℃的热压机上压缩,0.4分钟内从28mm压缩至23.5mm,可以获得峰值密度大于650kg/m
3的上、下表面均被密实化的木材,但密实化层的厚度非常有限(或者非常小),而且密度分布不能控制。这项研究也做了常压后热处理固定实验,结果表明热处理后最大可以使尺寸稳定性提高40%。Clevan Lamason和Meng Gong采用对杨木板材表面(深1mm)浸泡于煮沸的水中5min后,用145℃、175℃和205℃的热压机压缩的方式,获得了单面表面密度较大的压缩木材。又对145℃压缩的木材进行了温度为190℃、200℃和210℃的常压后热处理进行压缩变形固定,可以使回弹率降低至3%。
Inoue M、Gabrielli C、刘君良等报道了采用木材表层浸渍酚醛树脂和三聚氰胺树脂等化学聚合物后进行木材表层压缩,能够获得表面性能和尺寸稳定显著改善的压缩木材,但由于存在有害物质释放的 问题,限制了其推广应用。
因此,如何实现低压缩率下大幅度提高低密度木材的密度和强度,且压缩变形不回弹,而且压缩密实化木材的加工过程中和使用过程不会对环境造成污染,工艺容易实现,成为木制品行业普遍关注的前沿研究之一。随着高质量阔叶材资源的减少,低密度材的增值利用受到木材科学与技术领域的重视,开发人工林速生材的高品质利用技术具有重要意义。
发明内容
本发明所要解决的技术问题在于提供一种密度分布可控的实木压缩密实化板材生产方法。本发明可以对实木板材进行精准压缩,使得木材的密实化层与未压缩层的位置分布精准可控;此外,本发明具有更为优越的力学性能和尺寸稳定性,进一步提高了压缩木材的品质。
为解决上述技术问题,本发明的技术方案如下:一种密度分布可控的实木压缩密实化板材生产方法,调节实木板材厚度方向各层的含水率,在实木板材内部厚度方向形成干区和湿区,且干区和湿区的屈服应力差在0.2MPa以上,调整干区和湿区的位置分布,再用热压机压缩,在实木板材的湿区形成高密度压缩层,得到密度分布可控的实木压缩密实化板材。
上述的密度分布可控的实木压缩密实化板材生产方法中,调节实木板材的含水率是通过浸水和/或干燥的手段,使得实木板材干湿界 面移动,实木板材内低含水率层形成干区,实木板材内高含水率层形成湿区,并实时检测干区和湿区的屈服应力,保证干区和湿区的屈服应力差在0.2MPa以上。
前述的密度分布可控的实木压缩密实化板材生产方法中,所述的实木压缩密实化板材包括压缩层在木材表面的表层密实化板材、压缩层在木材厚度方向中间的中间层密实化板材或压缩层在木材厚度方向中心的中心层密实化板材。
前述的密度分布可控的实木压缩密实化板材生产方法中,表层压缩密实化板材的调整含水率的方法是先将实木板材干燥至含水率在15%以下;再将木材封端后浸水或者不封端喷水,增加木材表面的含水率,在木材表面形成湿区,通过控制浸水时间或者喷水量,使得木材内部干湿界面移动,从而调节木材表面湿区与木材内部干区的位置分布,以及调节木材表面湿区与木材内部干区之间的屈服应力差。
前述的密度分布可控的实木压缩密实化板材生产方法中,中间层密实化板材或中心层密实化板材的调整含水率的方法是,将实木板材的含水率调整至15%以上,对木材封端,再对木材进行干燥处理,木材厚度方向从外向内形成含水率梯度,从而在木材表面形成干区,在木材内部形成湿区;再将板材置于热压机夹持下加热,板材内部干湿界面移动,从而调节木材表面干区与木材内部湿区的位置分布,以及调节木材表面干区与木材内部湿区之间的屈服应力差。
前述的密度分布可控的实木压缩密实化板材生产方法中,干湿界 面移动的公式为:
T
S为热压机夹持下加热时的实木板材的表面温度℃;T
V为水沸腾点温度℃;T
0为木材初始温度;K
1、K
2分别为湿区、干区木材导热系数W/m·K;h为木材厚度m;D
1为湿区木材导温系数m
2/h;ρ
L为木材界面蒸发单位体积水分的重量kg/m
3;t为热压机夹持下的加热时间;S为时间t时界面距板面距离m;L为界面水分的蒸发潜热kJ/kg。
前述的密度分布可控的实木压缩密实化板材生产方法中,将实木板材置于热压机上压缩,具体是将实木板材置于热压机上,启动热压机并以100~150℃的温度,2~7mm/min的压缩速度,3MPa以上的压力对实木板材进行压缩,用位移传感器实时检测和控制压缩层厚度。
前述的密度分布可控的实木压缩密实化板材生产方法中,封端是通过骨胶、石蜡或沥青对实木板材的端头进行封涂。
前述的密度分布可控的实木压缩密实化板材生产方法中,压缩完成后,先在热压机上保持5分钟,再将热压机的压力降低至1MPa,保持30分钟以上;打开热压机,从压板上取出木材,放入热处理窑内,进行180℃以上的高温热处理定型,定型前先将压缩板材干燥至含水率10%以下;窑内温度升高至目标温度后,再向热处理窑内通入水蒸气,使窑内压力达到0.25MPa以上,并保持1小时以上;最后先降低窑内压力至0.1MPa,之后降低木材温度至60温度以下,从窑内取出,最后放入高湿环境下调整木材含水率至8%以上。
前述的密度分布可控的实木压缩密实化板材生产方法中,所述的实木压缩密实化板材还包括具有多层压缩层的多层密实化板材,多层密实化板材是先将实木板材加工成具有上、下两个压缩层的表层密实化板材,再继续放在热压机上,用热压板进行接触式干燥,进一步调整板材内部厚度方向的干湿界面,并再次压缩,得到具有多个压缩层的多层密实化板材。
本发明的有益效果:与现有技术相比,本发明具有以下有益效果:
(1)本发明通过调整实木板材的含水率,在实木板材内部厚度方向形成干区和湿区,且干区和湿区的屈服应力差在0.2MPa以上;并通过调节干区和湿区的位置分布,实现实木压缩密实化板材的密度分布可控。由于本发明可以对实木板材的密实化层与未压缩层的位置分布精准调控,实现精准压缩,一方面有效地节约了木材、提高了产品的品质和性能,另一方面可以实现木材产品的个性化定制,扩大普通木材的使用领域,提高普通木材的价值。
(2)进一步地,本发明的实木压缩密实化板材包括压缩层在木材表面的表层密实化板材、压缩层在木材中间的中间层密实化板材或压缩层在木材中心的中心层密实化板材;申请人对表层密实化板材、中间层密实化板材和中心层密实化板材的调整含水率的方法、以及通过调整含水率调节干区和湿区的位置分布的方法进行了具体限定和优选,从而实现了实木板材厚度方向任何区域的定向压缩密实化,大大提高了产品的使用范围和实用性。
(3)再进一步地,申请人经试验发现调整含水率时的干湿界面移动的函数公式为
,通过该函数关系式可以精确地得到热压机夹持下的加热时间和夹持温度(也即热压机夹持下加热时的实木板材的表面温度)下干湿界面的移动规律,从而获得热压机夹持下的加热时间和夹持温度与干区、湿区变化的精确关系,从而进一步对实木板材进行精准压缩,使得木材的密实化层与未压缩层的位置分布精准可控。
(4)本发明还对实木压缩密实化板材的防变形固定处理作了改进,改进后的密实化板材在吸湿回弹率、吸水回弹率方面具有极为优秀的性能,而且大大提高了产品的MOE、MOR、硬度和表面硬度等性能,进一步提高了压缩木材的品质。
附图1是调节实木板材含水率形成干区和湿区的示意图;
附图2是未压缩的杨木素板的密度分布图;
附图3是干区和湿区的屈服应力差在0.2MPa时杨木上、下表层压缩5mm的表层压缩密实化的密度分布图;
附图4是干区和湿区的屈服应力差在0.10MPa时,杨木实木板材采用本发明上、下表层压缩5mm的压缩密实化的方法压缩的板材密度分布图;
附图5是干区和湿区的屈服应力差在0.16MPa时,杨木实木板材采用本发明上、下表层压缩7mm的压缩密实化方法压缩的板材密度分布图;
附图6是按照本发明生产工艺生产出的实木压缩密实化板材效果照;
附图7是杨木上、下表层压缩10mm的表层压缩密实化的密度分 布图;
附图8是坎诺漆的中间层压缩密实化的密度分布图;
附图9是杨木中心层压缩5mm的中心层压缩密实化板材的密度分布图;
附图10是杨木中心层压缩10mm的中心层压缩密实化板材的密度分布图;
附图11是杨木3个压缩层(上、下表层加中心层)的密度分布图;
附图12是杨木5个压缩层(上、下表层、两个中间层、1个中心层)的密度分布图;
附图13是按照本发明生产工艺生产出的实木压缩密实化板材实照;
图14是按照本发明生产工艺生产出的多层压缩密实化板材实照。
实施例1:一种密度分布可控的实木压缩密实化板材生产方法,通过浸水和/或干燥的手段调节实木板材厚度方向各层的含水率,在实木板材内部厚度方向低含水率层形成干区,在实木板材内部厚度方向高含水率层形成湿区,在干区和湿区的交界处形成干湿界面,如附图1所示,附图1是调节实木板材含水率形成干区和湿区的示意图,横坐标x为板材厚度方向位置,纵坐标为对应横坐标位置的含水率。 图中,区域1为干区,区域2为湿区,区域1和区域2的交界面为干湿界面。且因为干区和湿区含水率的不同,导致干区和湿区的屈服应力也不同,通过调整干区和湿区的含水率还可以调整屈服应力差,通过调整含水率来调整板材在厚度方向干区和湿区的位置分布,并实时检测检测干区和湿区的服应力,保证干区和湿区的屈服应力差在0.2MPa以上。附图2是未压缩的杨木素板的密度分布图,横坐标为板材下表面至上表面的距离(mm),纵坐标为对应横坐标位置的木材密度(g/cm
3);附图3是干区和湿区的屈服应力差在0.2MPa时杨木上、下表层压缩5mm的表层压缩密实化的密度分布图,横坐标为板材下表面至上表面的距离(mm),纵坐标为对应横坐标位置的木材密度(g/cm
3)。从附图3可以看出,屈服应力差在0.2MPa时,本发明可以有效地、准确地实现实木板材的表层压缩密实化。附图4是干区和湿区的屈服应力差在0.10MPa时,杨木实木板材采用本发明上、下表层压缩5mm的压缩密实化的方法压缩的板材密度分布图,横坐标为板材下表面至上表面的距离(mm),纵坐标为对应横坐标位置的木材密度(g/cm
3),从图4可以看出屈服应力差在0.10MPa时无法得到压缩层。附图5是干区和湿区的屈服应力差在0.16MPa时,杨木实木板材采用本发明上、下表层压缩7mm的压缩密实化方法压缩的板材密度分布图,横坐标为板材下表面至上表面的距离(mm),纵坐标为对应横坐标位置的木材密度(g/cm
3),从图5可以看出屈服应力差在0.16MPa时无法得到压缩层。进一步地,本发明是通过浸水和/或干燥等调节含 水率的手段使得实木板材干湿界面移动,从而调整干区和湿区的位置分布,并保证干区和湿区的屈服应力差在0.2MPa以上,再将实木板材置于热压机上以100~150℃的温度,2~7mm/min的压缩速度,3MPa以上的压力对实木板材进行压缩,用位移传感器实时检测和控制压缩层厚度。在实木板材的湿区形成高密度压缩层,得到密度分布可控的实木压缩密实化板材。
所述的实木压缩密实化板材包括压缩层在木材表面的表层密实化板材、压缩层在木材厚度方向中间的中间层密实化板材或压缩层在木材厚度方向中心的中心层密实化板材。
表层密实化板材的调整含水率的方法是先将实木板材干燥至含水率在15%以下;再将木材用骨胶、石蜡或沥青封端后浸水或者不封端喷水,增加木材表面的含水率,在木材表面形成湿区,通过控制浸水时间或者喷水量使得木材内部干湿界面移动,从而调节木材表面湿区与木材内部干区的位置分布,以及调节木材表面湿区与木材内部干区之间的屈服应力差。
中间层密实化板材或中心层密实化板材的调整含水率的方法是,将实木板材的含水率调整至15%以上,对木材端头用骨胶、石蜡或沥青封端,再对木材进行干燥处理,干燥处理可以是采用接触或非接触式热传导干燥,作为优选可以选择热压机热压板的接触式干燥方式,这种干燥方式干燥效率高、干燥效果好。干燥处理中,木材厚度方向(横向)从外向内形成含水率梯度,从而在木材表面形成干区,在木材内部形成湿区,在干区和湿区的交界处形成干湿界面;通过调整干燥温度和时间使得木材内部干湿界面移动,从而调节木材表面干区与 木材内部湿区的位置分布,以及调节木材表面干区与木材内部湿区之间的屈服应力差。
采用接触式干燥调整干区和湿区的干湿界面移动的公式为:
上式中,T
S为热压机夹持下加热时的实木板材的表面温度℃;T
V为水沸腾点温度℃;T
0为木材初始温度;K
1、K
2分别为湿区、干区木材导热系数W/m·K;h为木材厚度m;D
1为湿区木材导温系数m
2/h;ρ
L为木材界面蒸发单位体积水分的重量kg/m
3;t为热压机夹持下的加热时间;S为时间t时界面距板面距离m;L为界面水分的蒸发潜热kJ/kg。如附图1所示。通过上述公式即可定量、确定地通过调整热压机夹持下的加热时间t、热压机夹持下加热时的实木板材的表面温度T
S来计算得到干湿界面的移动位置,从而更为精确地得到干区和湿区的位置分布,得到密度分布可控的实木压缩密实化板材。
所述的图6是按照本发明生产工艺生产出的实木压缩密实化板材效果照,从附图6可以看出,本发明可以生产得到表层压缩板材、中间层压缩板材、中心层压缩板材及多层压缩板材多种密实化板材。
作为优选,本发明所述的实木压缩密实化板材还包括具有多层压缩层的多层密实化板材。多层密实化板材是先将实木板材加工成具有上、下两个压缩层的表层密实化板材,再继续放在热压机上,进行传导式加热120s以上,进一步调整板材内部厚度方向的干湿界面,并再次压缩,得到具有两个压缩表层和两个压缩中间层的多层压缩层的多层密实化板材。如果板材足够厚,这个过程可以继续延续,至4个以上的压缩层,即两个压缩表层、两个压缩中间层和一个压缩中心层,如附图14所示。
实施例2:表层压缩密实化板材的具体制造方法:
单表面(仅一个表面)压缩工艺:
将含水率在气干含水率值以下(10%以下)的板材单面浸水或者在水面上漂浮或者湿润后,使表面含水率大于20%,之后放在单面压板加热至100~150℃热压机的上,浸水面要与加热板同侧,以2~7mm/min的速度连续压缩,压力3MPa以上,直至压缩到目标厚度,形成浸水且加热面被压缩的单面压缩木材;
上下两个表面压缩工艺:
初含水率小于15%的气干材至绝干材:封端后浸水或者不封端喷水,增加木材表面的含水率,增加量为20g/m
2以上,形成木材表面的湿区与内部的干区之间0.2MPa以上的屈服应力差。之后放在加热至100~150℃热压机上,以2~7mm/min的速度连续压缩,压力3MPa以上,直至压缩到目标厚度,形成上下两个表面都被压缩的双面压缩木材。
所述的附图3是杨木上、下表层压缩5mm的表层压缩密实化的密度分布图,横坐标为板材下表面至上表面的距离(mm),纵坐标为对应横坐标位置的木材密度(g/cm
3),附图7是杨木上、下表层压缩10mm的表层压缩密实化的密度分布图,横坐标为板材下表面至上表面的距离(mm),纵坐标为对应横坐标位置的木材密度(g/cm
3)。从附图3和附图7可以证明,本发明可以有效地、准确地实现实木板材的上、下表层压缩密实化。
实施例3:中间层压缩密实化板材的具体制造方法:
将含水率大于15%的板材的端头(横截面)用骨胶、石蜡、沥青等木材端头封涂用材料涂刷后,采用接触式(热压板)热传导的方法,在100℃以上进行时间60s以上的夹持干燥处理,使板材的干湿界面移动到预定位置,并使得板材的干区和湿区的屈服应力差在0.25MPa,并用位移传感器控制最终的压缩量,之后用100~150℃热压机压缩,以2~7mm/min的速度连续压缩,压力3MPa以上,即可形成表面不压缩,而内部形成两个压缩层的压缩密实化的中间层压缩密实化木材。
所述的附图8是坎诺漆的中间层压缩密实化的密度分布图,横坐标为板材下表面至上表面的距离(mm),纵坐标为对应横坐标位置的木材密度(g/cm
3),从附图8可以看出,中间层压缩密实化后在板材厚度方向的中间层形成两个中间层压缩层。
实施例4:中心层压缩密实化板材的具体制造工艺:
将含水率大于15%的板材的端头(横截面)用骨胶、石蜡、沥青等木材端头封涂用材料涂刷后,采用接触或非接触式热传导的方法,在100℃以上的干燥处理,干燥时间大于5分钟以上,使板材表面与板材中心1~6mm的范围内形成0.2MPa以上的屈服应力差,压缩量设定为1~6mm,之后用100~150℃热压机压缩,以2~7mm/min的速度连续压缩,压力3MPa以上,即可形成表面不压缩,而正中心被压缩密实化的中心层压缩密实化木材。
所述的附图9是杨木中心层压缩5mm的中心层压缩密实化板材的密度分布图,横坐标为板材下表面至上表面的距离(mm),纵坐标为对应横坐标位置的木材密度(g/cm
3),附图10是杨木中心层压缩10mm 的中心层压缩密实化板材的密度分布图,横坐标为板材下表面至上表面的距离(mm),纵坐标为对应横坐标位置的木材密度(g/cm
3)。从附图9和附图10可以看出,本发明可以有效地、准确地实现实木板材的中心层压缩密实化。
实施例5:多层压缩密实化板材的具体制造工艺:
将按照上下两个表面压缩工艺压缩的木材,继续放在热压机上,进行传导式加热120s以上,再次压缩,即可在表面压缩密实化的基础上,增加两个中间层被压缩密实化的压缩层,如果板材足够厚,这个压缩密实化过程可以一直延续下去,直到形成中心层压缩密实化为止。
压缩完成后,在压机上保持5分钟后,压力降低至1MPa,保持30分钟以上;打开压机,从压板上取出木材,放入密闭的热处理窑内,干燥至含水率10%以下,直接进行180℃以上的高温热处理定型。热处理温度达到180℃后,将热处理窑内通入水蒸气,使窑内压力达到0.25MPa以上,并保持1小时以上。先降低窑内压力至0.1MPa,之后降低温度至60温度以下,从窑内取出,可以得到压缩变形回弹率小于3%的分层压缩密实化板材。
所述的附图11是杨木3个压缩层(上、下表层加中心层)的密度分布图,横坐标为板材下表面至上表面的距离(mm),纵坐标为对应横坐标位置的木材密度(g/cm
3),附图12是杨木5个压缩层(上、下表层、两个中间层、1个中心层)的密度分布图,横坐标为板材下表面至上表面的距离(mm),纵坐标为对应横坐标位置的木材密度 (g/cm
3)。
所述的图13是按照本发明生产工艺生产出的实木压缩密实化板材实照,从左往右依次为表层压缩5mm、10mm的密实化板材、中心层压缩5mm、10mm的密实化板材和未压缩的素板。图14是按照本发明生产工艺生产出的多层压缩密实化板材实照,左侧为双表层和中心层的多层压缩密实化板材,右侧为双表层、双中间层和中心层的多层压缩密实化板材。
Claims (10)
- 一种密度分布可控的实木压缩密实化板材生产方法,其特征在于:调节实木板材厚度方向各层的含水率,在实木板材内部厚度方向形成干区和湿区,且干区和湿区的屈服应力差在0.2MPa以上,调整干区和湿区的位置分布,再用热压机压缩,在实木板材的湿区形成高密度压缩层,得到密度分布可控的实木压缩密实化板材。
- 根据权利要求1所述的密度分布可控的实木压缩密实化板材生产方法,其特征在于:调节实木板材的含水率是通过浸水和/或干燥的手段,使得实木板材干湿界面移动,实木板材内低含水率层形成干区,实木板材内高含水率层形成湿区,并实时检测干区和湿区的屈服应力,保证干区和湿区的屈服应力差在0.2MPa以上。
- 根据权利要求1或2所述的密度分布可控的实木压缩密实化板材生产方法,其特征在于:所述的实木压缩密实化板材包括压缩层在木材表面的表层密实化板材、压缩层在木材厚度方向中间的中间层密实化板材或压缩层在木材厚度方向中心的中心层密实化板材。
- 根据权利要求3所述的密度分布可控的实木压缩密实化板材生产方法,其特征在于:表层压缩密实化板材的调整含水率的方法是先将实木板材干燥至含水率在15%以下;再将木材封端后浸水或者不封端喷水,增加木材表面的含水率,在木材表面形成湿区,通过控制浸水时间或者喷水量,使得木材内部干湿界面移动,从而调节木材表 面湿区与木材内部干区的位置分布,以及调节木材表面湿区与木材内部干区之间的屈服应力差。
- 根据权利要求3所述的密度分布可控的实木压缩密实化板材生产方法,其特征在于:中间层密实化板材或中心层密实化板材的调整含水率的方法是,将实木板材的含水率调整至15%以上,对木材封端,再对木材进行干燥处理,木材厚度方向从外向内形成含水率梯度,从而在木材表面形成干区,在木材内部形成湿区;再将板材置于热压机夹持下加热,板材内部干湿界面移动,从而调节木材表面干区与木材内部湿区的位置分布,以及调节木材表面干区与木材内部湿区之间的屈服应力差。
- 根据权利要求1所述的密度分布可控的实木压缩密实化板材生产方法,其特征在于:将实木板材置于热压机上压缩,具体是将实 木板材置于热压机上,启动热压机并以100~150℃的温度,2~7mm/min的压缩速度,3MPa以上的压力对实木板材进行压缩,用位移传感器实时检测和控制压缩层厚度。
- 根据权利要求1所述的密度分布可控的实木压缩密实化板材生产方法,其特征在于:封端是通过骨胶、石蜡或沥青对实木板材的端头进行封涂。
- 根据权利要求1所述的密度分布可控的实木压缩密实化板材生产方法,其特征在于:压缩完成后,先在热压机上保持5分钟,再将热压机的压力降低至1MPa,保持30分钟以上;打开热压机,从压板上取出木材,放入热处理窑内,进行180℃以上的高温热处理定型,定型前先将压缩板材干燥至含水率10%以下;窑内温度升高至目标温度后,再向热处理窑内通入水蒸气,使窑内压力达到0.25MPa以上,并保持1小时以上;最后先降低窑内压力至0.1MPa,之后降低木材温度至60温度以下,从窑内取出,最后放入高湿环境下调整木材含水率至8%以上。
- 根据权利要求3所述的密度分布可控的实木压缩密实化板材生产方法,其特征在于:所述的实木压缩密实化板材还包括具有多层压缩层的多层密实化板材,多层密实化板材是先将实木板材加工成具有上、下两个压缩层的表层密实化板材,再继续放在热压机上,用热压板进行接触式干燥,进一步调整板材内部厚度方向的干湿界面,并再次压缩,得到具有多个压缩层的多层密实化板材。
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