WO2020010772A1 - 一种oled显示面板及其封装方法 - Google Patents

一种oled显示面板及其封装方法 Download PDF

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Publication number
WO2020010772A1
WO2020010772A1 PCT/CN2018/115794 CN2018115794W WO2020010772A1 WO 2020010772 A1 WO2020010772 A1 WO 2020010772A1 CN 2018115794 W CN2018115794 W CN 2018115794W WO 2020010772 A1 WO2020010772 A1 WO 2020010772A1
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Prior art keywords
encapsulation layer
isopropylacrylamide
methyl methacrylate
display panel
layer
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PCT/CN2018/115794
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English (en)
French (fr)
Inventor
李朝
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Priority to US16/334,372 priority Critical patent/US11145842B2/en
Publication of WO2020010772A1 publication Critical patent/WO2020010772A1/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour

Definitions

  • the present application relates to the field of display technology, and in particular, to an OLED display panel and a packaging method thereof.
  • OLED Organic Light Emitting Diode (Organic Light Emitting Diode) display technology
  • OLED products have received more and more attention and applications due to their advantages such as thinness, fast response, wide viewing angle, high contrast, and bendability. They are mainly used in mobile phones and tablets. , TV and other display fields.
  • the OLED display panel includes a base layer, a thin film transistor layer, an OLED light emitting layer, a first inorganic packaging layer, an organic packaging layer, a second inorganic packaging layer, and the like from bottom to top.
  • the organic encapsulation layer mainly plays a role of planarizing and blocking water and oxygen transmission.
  • an organic encapsulation layer is prepared by an IJP (Ink Jet Printing) method, that is, a printing ink is dripped on the first inorganic encapsulation layer, and the ink is leveled and cured to form the organic encapsulation layer.
  • IJP Ink Jet Printing
  • PMMA polymethyl methacrylate, also known as plexiglass
  • plexiglass polymethyl methacrylate, also known as plexiglass
  • the first inorganic encapsulation layer is hydrophilic
  • the organic encapsulation layer PMMA's monomer MMA is hydrophobic
  • the prepared organic packaging layer may form through-holes, causing impurities such as water and oxygen from the outside to easily penetrate into the interior of the OLED panel, resulting in OLED devices being oxidized, resulting in reduced performance such as lifetime.
  • the application provides an OLED display panel and a packaging method thereof, which can reduce voids in the organic packaging layer, enhance the ability of the organic packaging layer to block water and oxygen, reduce the risk of oxidation of devices inside the OLED display panel, and increase the life of the OLED device.
  • This application provides an OLED display panel, including:
  • the thin-film encapsulation layer includes an inorganic encapsulation layer and an organic encapsulation layer which are arranged in a stack;
  • the material forming the organic encapsulation layer is a methyl methacrylate-N-isopropylacrylamide copolymer solution, and the methyl methacrylate-N-isopropylacrylamide copolymer solution is in the inorganic
  • the surface of the encapsulation layer is spread and used to form the organic encapsulation layer after curing, and the thickness of the film layer at different positions of the organic encapsulation layer is uniform.
  • the methyl methacrylate-N-isopropylacrylamide copolymer solution is a mixed solution of methyl methacrylate, N-isopropylacrylamide, and a photopolymerization initiator. Formed by light.
  • the methyl methacrylate, the N-isopropylacrylamide, and the photopolymerization initiator are the mixed liquid formed by mixing in a predetermined ratio.
  • the mass concentration range of the N-isopropylacrylamide in the mixed solution is 0.05% to 20%.
  • the methyl methacrylate-N-isopropylacrylamide copolymer solution contained in the methyl methacrylate-N-isopropylacrylamide copolymer solution has a hydrophilic end and Hydrophobic end.
  • the methyl methacrylate-N-isopropylacrylamide copolymer is close to the inorganic encapsulation layer with the hydrophilic end and away from the inorganic encapsulation layer with the hydrophobic end. Way to distribute.
  • the methyl methacrylate-N-isopropylacrylamide copolymer is a copolymer formed of polymethylmethacrylate and polyN-isopropylacrylamide.
  • the present application also provides a packaging method for an OLED display panel.
  • the method includes the following steps:
  • Step S10 providing an OLED display panel to be packaged, and preparing an inorganic packaging layer on the OLED display panel;
  • Step S20 forming a layer of mixed liquid containing methyl methacrylate, N-isopropylacrylamide, and a photopolymerization initiator on the surface of the inorganic encapsulation layer;
  • Step S30 A curing process is performed. First, the mixed solution is irradiated with light to form a methyl methacrylate-N-isopropylacrylamide copolymer solution, so that the methyl methacrylate-N-isopropylacrylamide copolymer is copolymerized. A physical solution is spread on the surface of the inorganic encapsulation layer, and an organic encapsulation layer is formed after curing;
  • step S40 another layer of the inorganic packaging layer is formed on the surface of the organic packaging layer.
  • step S20 specifically includes the following steps:
  • Step S201 mixing the methyl methacrylate, the N-isopropylacrylamide, and the photopolymerization initiator in a predetermined ratio to form the mixed liquid;
  • Step S202 forming the mixed solution on the surface of the inorganic encapsulation layer by means of inkjet printing.
  • a mass concentration range of the N-isopropylacrylamide in the mixed solution is 0.05% to 20%.
  • the step S30 specifically includes the following steps:
  • Step S301 the N-isopropylacrylamide in the mixed solution is hydrophilic, and is first moved to the surface of the inorganic encapsulation layer for spreading;
  • Step S302 Under the action of the photopolymerization initiator, the methyl methacrylate and the N-isopropylacrylamide in the mixed solution are polymerized to generate methyl methacrylate having a hydrophilic end after polymerization.
  • -N-isopropylacrylamide copolymer the methyl methacrylate-N-isopropylacrylamide copolymer moves toward the surface of the inorganic encapsulation layer, and a side having the hydrophilic end is close to the inorganic Encapsulation layer
  • step S303 after the methyl methacrylate-N-isopropylacrylamide copolymer solution is applied to the inorganic encapsulation layer, it is cured to form the organic encapsulation layer.
  • an OLED display panel including:
  • the thin-film encapsulation layer includes an inorganic encapsulation layer and an organic encapsulation layer which are arranged in a stack;
  • the material forming the organic encapsulation layer is a methyl methacrylate-N-isopropylacrylamide copolymer solution, and the methyl methacrylate-N-isopropylacrylamide copolymer solution is in the inorganic
  • the surface of the encapsulation layer is spread and used to form the organic encapsulation layer after curing.
  • the methyl methacrylate-N-isopropylacrylamide copolymer solution is a mixed solution of methyl methacrylate, N-isopropylacrylamide, and a photopolymerization initiator. Formed by light.
  • the methyl methacrylate, the N-isopropylacrylamide, and the photopolymerization initiator are mixed liquids formed by mixing in a predetermined ratio.
  • the mass concentration range of the N-isopropylacrylamide in the mixed solution is 0.05% to 20%.
  • the methyl methacrylate-N-isopropylacrylamide copolymer solution contained in the methyl methacrylate-N-isopropylacrylamide copolymer solution has a hydrophilic end and Hydrophobic end.
  • the methyl methacrylate-N-isopropylacrylamide copolymer is close to the inorganic encapsulation layer with the hydrophilic end and away from the inorganic encapsulation layer with the hydrophobic end. Way to distribute.
  • the methyl methacrylate-N-isopropylacrylamide copolymer is a copolymer formed of polymethylmethacrylate and polyN-isopropylacrylamide.
  • the beneficial effects of this application are: Compared with the current general packaging technology and other improved packaging technologies, the OLED display panel and its packaging method provided by this application are based on the introduction of amphiphilicity without changing the original process.
  • PMMA-PNIPAm methyl methacrylate-N-isopropylacrylamide copolymer
  • This preparation process is due to the introduction of hydrophilic poly-N-isopropylacrylamide (PNIPAm), so that the mixed liquid (ink) can be smoothly spread on the inorganic packaging layer, thereby reducing voids in the organic packaging layer, enhancing the ability of the organic packaging layer to block water and oxygen, and reducing the risk of oxidation of the devices inside the OLED display panel Thus, the life of the OLED device is improved.
  • PNIPAm hydrophilic poly-N-isopropylacrylamide
  • FIG. 1 is a schematic cross-sectional view of an OLED display panel according to an embodiment of the present application.
  • FIG. 2 is a flowchart of a method for packaging an OLED display panel according to an embodiment of the present application.
  • This application is directed to the prior art OLED display panel and its packaging structure. Since the organic packaging layer is liable to cause voids during the preparation process, the organic packaging layer's ability to block water and oxygen is reduced, thereby increasing the oxidation of the devices inside the OLED display panel. Risk, which in turn affects the technical problem of the lifetime of the OLED device. This embodiment can solve this defect.
  • FIG. 1 is a schematic cross-sectional view of an OLED display panel according to an embodiment of the present application.
  • the OLED display panel includes: a base substrate 10; a thin film transistor layer 11 prepared on the base substrate 10; an OLED light emitting layer 12 prepared on the thin film transistor layer 11; a thin film encapsulation layer 13 prepared on the base substrate 10;
  • the OLED light-emitting layer 12 is used for wrapping the OLED light-emitting layer 12;
  • the thin-film encapsulation layer 13 includes a plurality of inorganic encapsulation layers and an organic encapsulation layer that are disposed in a stack;
  • the thin-film encapsulation layer 13 includes a first inorganic encapsulation layer 130.
  • An organic encapsulation layer 131 and a second inorganic encapsulation layer 132 The method for preparing the first inorganic encapsulation layer 130 and the second inorganic encapsulation layer 132 is similar to that in the prior art, and is not repeated here.
  • the material of the organic encapsulation layer 131 is a methyl methacrylate-N-isopropylacrylamide copolymer solution, and the methyl methacrylate-N-isopropylacrylamide copolymer solution is made of methyl methacrylate
  • the ester, N-isopropylacrylamide, and the photopolymerization initiator are mixed in a predetermined ratio to form a mixed solution, and the mixed solution is formed after being irradiated with light.
  • the mass concentration range of the N-isopropylacrylamide in the mixed solution is 0.05% -20%.
  • the mass concentration range of the N-isopropylacrylamide in the mixed solution is 0.1% to 10%.
  • the organic encapsulation layer 131 contains methyl methacrylate-N-isopropylacrylamide copolymer 133, that is, the methyl methacrylate-N-isopropylacrylamide copolymer solution contains the methyl group Methyl acrylate-N-isopropylacrylamide copolymer 133, the methyl methacrylate-N-isopropylacrylamide copolymer 133 has a hydrophilic end and a hydrophobic end, and the hydrophilic end is close to the The first inorganic encapsulation layer 130 and the hydrophobic end are distributed away from the first inorganic encapsulation layer 130.
  • the methyl methacrylate-N-isopropylacrylamide copolymer 133 is a copolymer formed of polymethylmethacrylate and polyN-isopropylacrylamide.
  • the mixed solution is formed on the surface of the first inorganic encapsulation layer 130 by inkjet printing.
  • the photopolymerization initiator functions to form the methyl methacrylate-N-isopropylpropylene.
  • the amide copolymer solution is spread on the surface of the first inorganic encapsulation layer 130, and the organic encapsulation layer 131 having a uniform film thickness is formed after curing.
  • the surface of the organic encapsulation layer 131 is flat, and no cavity is generated.
  • This application also provides a packaging method for an OLED display panel. As shown in FIG. 2, the method includes the following steps:
  • Step S10 providing an OLED display panel to be packaged, and preparing an inorganic packaging layer on the OLED display panel;
  • the inorganic encapsulation layer is hydrophilic, and the material of the inorganic encapsulation layer is an inorganic substance such as SiN, Si2O; the preparation method of the inorganic encapsulation layer is similar to that in the prior art, and is not repeated here.
  • Step S20 forming a mixed solution containing methyl methacrylate (MMA), N-isopropylacrylamide (NIPAm), and a photopolymerization initiator on the surface of the inorganic encapsulation layer;
  • MMA methyl methacrylate
  • NIPAm N-isopropylacrylamide
  • step S20 includes the following steps:
  • Step S201 mixing the methyl methacrylate, the N-isopropylacrylamide, and the photopolymerization initiator in a predetermined ratio to form the mixed liquid;
  • the mass concentration range of the N-isopropylacrylamide in the mixed solution is 0.05% -20%, and preferably 0.1% -10%.
  • the mixed liquid may further include other solvents such as a catalyst, which is not limited herein.
  • the photopolymerization initiator may be of a conventional type, and is not limited herein.
  • Step S202 forming the mixed solution on the surface of the inorganic encapsulation layer by means of inkjet printing.
  • the N-isopropylacrylamide is an oil-water amphiphilic polar small molecule, which is easy to bind to the hydrophilic surface of the inorganic encapsulation layer;
  • the methyl methacrylate is a hydrophobic organic substance, and it is not easy to contact
  • the water-based inorganic encapsulation layer is combined; when the mixed solution (ink) containing the methyl methacrylate and the N-isopropylacrylamide is added dropwise to the surface of the inorganic encapsulation layer, the liquid droplets
  • the medium hydrophilic monomer that is, the N-isopropylacrylamide, is easy to spread on the surface of the inorganic encapsulation layer.
  • Step S30 A curing process is performed. First, the mixed solution is irradiated with light to form a methyl methacrylate-N-isopropylacrylamide copolymer solution, so that the methyl methacrylate-N-isopropylacrylamide copolymer is copolymerized. A physical solution is spread on the surface of the inorganic encapsulation layer, and an organic encapsulation layer is formed after curing;
  • step S30 includes the following steps:
  • Step S301 the N-isopropylacrylamide in the mixed solution is hydrophilic, and is first moved to the surface of the inorganic encapsulation layer for spreading;
  • Step S302 Under the action of the photopolymerization initiator, the methyl methacrylate and the N-isopropylacrylamide in the mixed solution are polymerized to generate methyl methacrylate having a hydrophilic end after polymerization.
  • -N-isopropylacrylamide copolymer PMMA-PNIPAm
  • the methyl methacrylate-N-isopropylacrylamide copolymer moves toward the surface of the inorganic encapsulation layer, and has a hydrophilic end. The side is close to the inorganic encapsulation layer;
  • the photopolymerization initiator may cause the methyl methacrylate and the N-isopropylacrylamide to undergo a polymerization reaction; the methyl methacrylate is first polymerized to form polymethyl methacrylate (PMMA)
  • PMMA polymethyl methacrylate
  • the N-isopropylacrylamide is polymerized to form poly-N-isopropylacrylamide (PNIPAm), and the polyN-isopropylacrylamide has hydrophilicity, and then further functions as the photopolymerization initiator.
  • the polymethyl methacrylate and the poly N-isopropylacrylamide are polymerized to form the methyl methacrylate-N-isopropylacrylamide copolymer.
  • the part having methyl methacrylate group in the molecule of methyl methacrylate-N-isopropylacrylamide copolymer is a hydrophobic end
  • the part having N-isopropylacrylamide group is a hydrophilic end.
  • the hydrophilic end is closer to the inorganic encapsulation layer.
  • the polymethyl methacrylate also known as organic glass
  • step S303 after the methyl methacrylate-N-isopropylacrylamide copolymer solution is applied to the inorganic encapsulation layer, it is cured to form the organic encapsulation layer.
  • the methyl methacrylate-N-isopropylacrylamide copolymer solution contains hydrophilic N-isopropylacrylamide molecules and groups, the methyl methacrylate-N-iso The propylacrylamide copolymer solution can cover the surface of the inorganic encapsulation layer, thereby avoiding voids in the organic encapsulation layer, and improving the ability of the organic encapsulation layer to block water and oxygen.
  • step S40 another layer of the inorganic packaging layer is formed on the surface of the organic packaging layer.
  • the inorganic encapsulation layer and the organic encapsulation layer may be sequentially stacked on the OLED display panel.
  • the OLED display panel and the packaging method provided by the present application are based on the introduction of amphiphilic methyl methacrylate without changing the original process.
  • N-isopropylacrylamide copolymer (PMMA-PNIPAm) organic layer to reduce voids in the organic encapsulation layer.
  • the mixed solution ( Ink) can be smoothly spread on the inorganic packaging layer, thereby reducing voids in the organic packaging layer, enhancing the ability of the organic packaging layer to block water and oxygen, reducing the risk of oxidation of the devices inside the OLED display panel, and thereby increasing the life of the OLED device.
  • PNIPAm hydrophilic poly-N-isopropylacrylamide

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Abstract

一种OLED显示面板及其封装方法，该OLED显示面板包括：依次设于衬底基板（10）上的薄膜晶体管层（11）、OLED发光层（12）、薄膜封装层（13）；薄膜封装层（13）包括层叠的无机封装层与有机封装层；其中，形成有机封装层的材料为甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物溶液，将其在无机封装层表面铺展，经固化后用于形成有机封装层。

Description

一种OLED显示面板及其封装方法 技术领域
本申请涉及显示技术领域，尤其涉及一种OLED显示面板及其封装方法。
 背景技术
近年来，OLED（Organic Light Emitting Diode，有机发光二极管）显示技术发展突飞猛进，OLED产品由于具有轻薄、响应快、广视角、高对比度、可弯折等优点，受到了越来越多的关注和应用，主要应用在手机、平板、电视等显示领域。
OLED显示面板由下到上包括基底层、薄膜晶体管层、OLED发光层、第一无机封装层、有机封装层、第二无机封装层等。其中有机封装层主要起到平坦化及阻隔水氧传输的作用。通常，采用IJP（喷墨打印）方式制备有机封装层，即在第一无机封装层上滴加打印墨水，墨水流平后固化形成上述有机封装层。PMMA（聚甲基丙烯酸甲酯，又称有机玻璃）由于其高透明度且具有一定吸水性被业界广泛选择为有机封装层材料。然而，由于第一无机封装层为亲水性，有机封装层PMMA的单体MMA为疏水性，在制备有机封装层时，墨水液滴难以在第一无机封装层上流平，反而聚集成多个墨水液滴，制备的有机封装层可能形成贯穿的空洞，造成外界的水氧等杂质易于从这些空洞侵入OLED面板内部，致使OLED器件被氧化而导致寿命等性能降低。
因此，有必要提供一种OLED显示面板及其封装方法，以解决现有技术所存在的问题。
 技术问题
本申请提供一种OLED显示面板及其封装方法，能够减少有机封装层中的空洞，增强有机封装层对水氧的阻隔能力，降低OLED显示面板内部的器件被氧化的风险，提高OLED器件寿命。
 技术解决方案
为实现上述目的，本申请提供的技术方案如下：
本申请提供一种OLED显示面板，包括：
衬底基板；
薄膜晶体管层，制备于所述衬底基板上；
OLED发光层，制备于所述薄膜晶体管层上；
薄膜封装层，制备于所述OLED发光层上且用以包裹所述OLED发光层；
所述薄膜封装层包括层叠设置的无机封装层与有机封装层；
其中，形成所述有机封装层的材料为甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物溶液，所述甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物溶液在所述无机封装层表面铺展，经固化后用于形成所述有机封装层，且所述有机封装层不同位置的膜层厚度均一。
在本申请的OLED显示面板中，所述甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物溶液是通过甲基丙烯酸甲酯、N-异丙基丙烯酰胺以及光聚合引发剂的混合液经光照后形成的。
在本申请的OLED显示面板中，所述甲基丙烯酸甲酯、所述N-异丙基丙烯酰胺以及所述光聚合引发剂是以预设比例混合形成的所述混合液。
在本申请的OLED显示面板中，所述N-异丙基丙烯酰胺在所述混合液中的质量浓度范围为0.05%~20%。
在本申请的OLED显示面板中，所述甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物溶液中含有的甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物具有亲水端与疏水端。
在本申请的OLED显示面板中，所述甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物以所述亲水端靠近所述无机封装层以及所述疏水端远离所述无机封装层的方式进行分布。
在本申请的OLED显示面板中，所述甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物是由聚甲基丙烯酸甲酯与聚N-异丙基丙烯酰胺形成的共聚物。
为实现上述目的，本申请还提供一种OLED显示面板的封装方法，所述方法包括以下步骤：
步骤S10，提供一待封装的OLED显示面板，在所述OLED显示面板上制备一层无机封装层；
步骤S20，在所述无机封装层表面形成一层包含甲基丙烯酸甲酯、N-异丙基丙烯酰胺以及光聚合引发剂的混合液；
步骤S30，进行固化制程，首先所述混合液经光照后形成甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物溶液，使得所述甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物溶液在所述无机封装层表面铺展，经固化后形成有机封装层；
步骤S40，在所述有机封装层表面再形成一层所述无机封装层。
在本申请的封装方法中，所述步骤S20具体包括以下步骤：
步骤S201，将所述甲基丙烯酸甲酯、所述N-异丙基丙烯酰胺以及所述光聚合引发剂以预设比例混合形成所述混合液；
步骤S202，将所述混合液通过喷墨打印的方式形成于所述无机封装层表面。
在本申请的封装方法中，所述N-异丙基丙烯酰胺在所述混合液中的质量浓度范围为0.05%~20%。
在本申请的封装方法中，所述步骤S30具体包括以下步骤：
步骤S301，所述混合液中的所述N-异丙基丙烯酰胺具有亲水性，先向所述无机封装层表面移动进行铺展；
步骤S302，在所述光聚合引发剂的作用下，所述混合液中的所述甲基丙烯酸甲酯与所述N-异丙基丙烯酰胺经聚合后生成具有亲水端的甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物，所述甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物向所述无机封装层表面移动，且具有所述亲水端的一侧靠近所述无机封装层；
步骤S303，所述甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物溶液铺满所述无机封装层后，固化形成所述有机封装层。
为实现上述目的，本申请还提供一种OLED显示面板，包括：
衬底基板；
薄膜晶体管层，制备于所述衬底基板上；
OLED发光层，制备于所述薄膜晶体管层上；
薄膜封装层，制备于所述OLED发光层上且用以包裹所述OLED发光层；
所述薄膜封装层包括层叠设置的无机封装层与有机封装层；
其中，形成所述有机封装层的材料为甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物溶液，所述甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物溶液在所述无机封装层表面铺展，经固化后用于形成所述有机封装层。
在本申请的OLED显示面板中，所述甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物溶液是通过甲基丙烯酸甲酯、N-异丙基丙烯酰胺以及光聚合引发剂的混合液经光照后形成的。
在本申请的OLED显示面板中，所述甲基丙烯酸甲酯、所述N-异丙基丙烯酰胺以及所述光聚合引发剂是以预设比例混合形成的所述混合液。
在本申请的OLED显示面板中，所述N-异丙基丙烯酰胺在所述混合液中的质量浓度范围为0.05%~20%。
在本申请的OLED显示面板中，所述甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物溶液中含有的甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物具有亲水端与疏水端。
在本申请的OLED显示面板中，所述甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物以所述亲水端靠近所述无机封装层以及所述疏水端远离所述无机封装层的方式进行分布。
在本申请的OLED显示面板中，所述甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物是由聚甲基丙烯酸甲酯与聚N-异丙基丙烯酰胺形成的共聚物。。
 有益效果
本申请的有益效果为：本申请提供的OLED显示面板及其封装方法，与现行通用的封装技术及其他改进的封装技术相比，本申请在不改变原制程的基础上，通过引入两亲性的甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物（PMMA-PNIPAm）有机层来减少有机封装层中的空洞，该制备过程由于引入了亲水的聚N-异丙基丙烯酰胺（PNIPAm），使得混合液（墨水）能够顺利铺展在无机封装层上，从而减少有机封装层中的空洞，增强有机封装层对水氧的阻隔能力，降低OLED显示面板内部的器件被氧化的风险，进而提高OLED器件寿命。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的OLED显示面板截面示意图；
图2为本申请实施例提供的OLED显示面板的封装方法流程图。
 本发明的实施方式
以下各实施例的说明是参考附加的图示，用以例示本申请可用以实施的特定实施例。本申请所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本申请，而非用以限制本申请。在图中，结构相似的单元是用以相同标号表示。
本申请针对现有技术的OLED显示面板及其封装结构，由于有机封装层制备过程中容易造成空洞，使得有机封装层对水氧的阻隔能力降低，从而增大了OLED显示面板内部的器件被氧化的风险，进而影响OLED器件寿命的技术问题，本实施例能够解决该缺陷。
参阅图1，为本申请实施例提供的OLED显示面板截面示意图。该OLED显示面板包括：衬底基板10；薄膜晶体管层11，制备于所述衬底基板10上；OLED发光层12，制备于所述薄膜晶体管层11上；薄膜封装层13，制备于所述OLED发光层12上且用以包裹所述OLED发光层12；所述薄膜封装层13包括层叠设置的多层无机封装层与有机封装层；图示所述薄膜封装层13包括第一无机封装层130、有机封装层131以及第二无机封装层132。其中，所述第一无机封装层130与所述第二无机封装层132的制备方法同现有技术相似，此处不再赘述。所述有机封装层131的材料为甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物溶液，所述甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物溶液是通过甲基丙烯酸甲酯、N-异丙基丙烯酰胺以及光聚合引发剂以预设比例混合形成混合液，再由该混合液经光照后形成的。其中，所述N-异丙基丙烯酰胺在所述混合液中的质量浓度范围为0.05%~20%。优选的，所述N-异丙基丙烯酰胺在所述混合液中的质量浓度范围为0.1%~10%。
所述有机封装层131内含有甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物133，即所述甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物溶液中含有所述甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物133，该甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物133具有亲水端与疏水端，且以所述亲水端靠近所述第一无机封装层130以及所述疏水端远离所述第一无机封装层130的方式进行分布。所述甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物133是由聚甲基丙烯酸甲酯与聚N-异丙基丙烯酰胺形成的共聚物。
所述混合液经由喷墨打印的方式形成于所述第一无机封装层130表面，在一定条件下所述光聚合引发剂发挥作用，形成所述甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物溶液并使其在所述第一无机封装层130表面铺展，经固化后形成膜层厚度均一的所述有机封装层131。所述有机封装层131表面平整，不会产生空洞。
本申请还提供一种OLED显示面板的封装方法，如图2所示，所述方法包括以下步骤：
步骤S10，提供一待封装的OLED显示面板，在所述OLED显示面板上制备一层无机封装层；
其中，所述无机封装层为亲水性，所述无机封装层的材料为SiN、Si2O等无机物；所述无机封装层的制备方法与现有技术中相似，此处不再赘述。
步骤S20，在所述无机封装层表面形成一层包含甲基丙烯酸甲酯（MMA）、N-异丙基丙烯酰胺（NIPAm）以及光聚合引发剂的混合液；
具体地，所述步骤S20包括以下步骤：
步骤S201，将所述甲基丙烯酸甲酯、所述N-异丙基丙烯酰胺以及所述光聚合引发剂以预设比例混合形成所述混合液；
其中，所述N-异丙基丙烯酰胺在所述混合液中的质量浓度范围为0.05%~20%，优选为0.1%~10%。所述混合液中还可以包括催化剂等其他溶剂，此处不做限制。另外，所述光聚合引发剂可以为常规种类，此处也不做限定。
步骤S202，将所述混合液通过喷墨打印的方式形成于所述无机封装层表面。
其中，所述N-异丙基丙烯酰胺为油水两亲性极性小分子、容易结合在亲水性的所述无机封装层表面；所述甲基丙烯酸甲酯为疏水性有机物，不易与亲水性的所述无机封装层结合；当含有所述甲基丙烯酸甲酯和所述N-异丙基丙烯酰胺的所述混合液（墨水）滴加到所述无机封装层表面时，液滴中亲水单体即所述N-异丙基丙烯酰胺容易在所述无机封装层表面铺展。
步骤S30，进行固化制程，首先所述混合液经光照后形成甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物溶液，使得所述甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物溶液在所述无机封装层表面铺展，经固化后形成有机封装层；
具体地，所述步骤S30包括以下步骤：
步骤S301，所述混合液中的所述N-异丙基丙烯酰胺具有亲水性，先向所述无机封装层表面移动进行铺展；
步骤S302，在所述光聚合引发剂的作用下，所述混合液中的所述甲基丙烯酸甲酯与所述N-异丙基丙烯酰胺经聚合后生成具有亲水端的甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物（PMMA-PNIPAm），所述甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物向所述无机封装层表面移动，且具有所述亲水端的一侧靠近所述无机封装层；
其中，所述光聚合引发剂可使所述甲基丙烯酸甲酯以及所述N-异丙基丙烯酰胺发生聚合反应；所述甲基丙烯酸甲酯先聚合生成聚甲基丙烯酸甲酯（PMMA），所述N-异丙基丙烯酰胺聚合形成聚N-异丙基丙烯酰胺（PNIPAm），所述聚N-异丙基丙烯酰胺具有亲水性，之后在所述光聚合引发剂的进一步作用下，所述聚甲基丙烯酸甲酯与所述聚N-异丙基丙烯酰胺聚合形成所述甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物。其中，甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物分子中具有甲基丙烯酸甲酯基团的部分为疏水端，具有N-异丙基丙烯酰胺基团的部分为亲水端，该亲水端更靠近所述无机封装层。所述聚甲基丙烯酸甲酯（又称有机玻璃）由于其高透明度且具有一定吸水性被业界广泛选择为有机封装层材料。
步骤S303，所述甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物溶液铺满所述无机封装层后，固化形成所述有机封装层。
其中，由于所述甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物溶液中含有亲水的N-异丙基丙烯酰胺分子以及基团，使得所述甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物溶液能够铺满所述无机封装层表面，从而避免所述有机封装层产生空洞，提高所述有机封装层阻隔水氧的能力。
步骤S40，在所述有机封装层表面再形成一层所述无机封装层。
其中，所述无机封装层与所述有机封装层可依次层叠设置于所述OLED显示面板上。
本申请提供的OLED显示面板及其封装方法，与现行通用的封装技术及其他改进的封装技术相比，本申请在不改变原制程的基础上，通过引入两亲性的甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物（PMMA-PNIPAm）有机层来减少有机封装层中的空洞，该制备过程由于引入了亲水的聚N-异丙基丙烯酰胺（PNIPAm），使得混合液（墨水）能够顺利铺展在无机封装层上，从而减少有机封装层中的空洞，增强有机封装层对水氧的阻隔能力，降低OLED显示面板内部的器件被氧化的风险，进而提高OLED器件寿命。
综上所述，虽然本申请已以优选实施例揭露如上，但上述优选实施例并非用以限制本申请，本领域的普通技术人员，在不脱离本申请的精神和范围内，均可作各种更动与润饰，因此本申请的保护范围以权利要求界定的范围为准。

Claims (18)

  1. 一种OLED显示面板，其包括：
    衬底基板；
    薄膜晶体管层，制备于所述衬底基板上；
    OLED发光层，制备于所述薄膜晶体管层上；
    薄膜封装层，制备于所述OLED发光层上且用以包裹所述OLED发光层；
    所述薄膜封装层包括层叠设置的无机封装层与有机封装层；
    其中，形成所述有机封装层的材料为甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物溶液，所述甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物溶液在所述无机封装层表面铺展，经固化后用于形成所述有机封装层，且所述有机封装层不同位置的膜层厚度均一。
  2. 根据权利要求1所述的OLED显示面板，其中，所述甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物溶液是通过甲基丙烯酸甲酯、N-异丙基丙烯酰胺以及光聚合引发剂的混合液经光照后形成的。
  3. 根据权利要求2所述的OLED显示面板，其中，所述甲基丙烯酸甲酯、所述N-异丙基丙烯酰胺以及所述光聚合引发剂是以预设比例混合形成的所述混合液。
  4. 根据权利要求3所述的OLED显示面板，其中，所述N-异丙基丙烯酰胺在所述混合液中的质量浓度范围为0.05%~20%。
  5. 根据权利要求1所述的OLED显示面板，其中，所述甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物溶液中含有的甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物具有亲水端与疏水端。
  6. 根据权利要求5所述的OLED显示面板，其中，所述甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物以所述亲水端靠近所述无机封装层以及所述疏水端远离所述无机封装层的方式进行分布。
  7. 根据权利要求5所述的OLED显示面板，其中，所述甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物是由聚甲基丙烯酸甲酯与聚N-异丙基丙烯酰胺形成的共聚物。
  8. 一种OLED显示面板的封装方法，其中，所述方法包括以下步骤：
    步骤S10，提供一待封装的OLED显示面板，在所述OLED显示面板上制备一层无机封装层；
    步骤S20，在所述无机封装层表面形成一层包含甲基丙烯酸甲酯、N-异丙基丙烯酰胺以及光聚合引发剂的混合液；
    步骤S30，进行固化制程，首先所述混合液经光照后形成甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物溶液，使得所述甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物溶液在所述无机封装层表面铺展，经固化后形成有机封装层；
    步骤S40，在所述有机封装层表面再形成一层所述无机封装层。
  9. 根据权利要求8所述的封装方法，其中，所述步骤S20具体包括以下步骤：
    步骤S201，将所述甲基丙烯酸甲酯、所述N-异丙基丙烯酰胺以及所述光聚合引发剂以预设比例混合形成所述混合液；
    步骤S202，将所述混合液通过喷墨打印的方式形成于所述无机封装层表面。
  10. 根据权利要求9所述的封装方法，其中，所述N-异丙基丙烯酰胺在所述混合液中的质量浓度范围为0.05%~20%。
  11. 根据权利要求8所述的封装方法，其中，所述步骤S30具体包括以下步骤：
    步骤S301，所述混合液中的所述N-异丙基丙烯酰胺具有亲水性，先向所述无机封装层表面移动进行铺展；
    步骤S302，在所述光聚合引发剂的作用下，所述混合液中的所述甲基丙烯酸甲酯与所述N-异丙基丙烯酰胺经聚合后生成具有亲水端的甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物，所述甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物向所述无机封装层表面移动，且具有所述亲水端的一侧靠近所述无机封装层；
    步骤S303，所述甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物溶液铺满所述无机封装层后，固化形成所述有机封装层。
  12. 一种OLED显示面板，其包括：
    衬底基板；
    薄膜晶体管层，制备于所述衬底基板上；
    OLED发光层，制备于所述薄膜晶体管层上；
    薄膜封装层，制备于所述OLED发光层上且用以包裹所述OLED发光层；
    所述薄膜封装层包括层叠设置的无机封装层与有机封装层；
    其中，形成所述有机封装层的材料为甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物溶液，所述甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物溶液在所述无机封装层表面铺展，经固化后用于形成所述有机封装层。
  13. 根据权利要求12所述的OLED显示面板，其中，所述甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物溶液是通过甲基丙烯酸甲酯、N-异丙基丙烯酰胺以及光聚合引发剂的混合液经光照后形成的。
  14. 根据权利要求13所述的OLED显示面板，其中，所述甲基丙烯酸甲酯、所述N-异丙基丙烯酰胺以及所述光聚合引发剂是以预设比例混合形成的所述混合液。
  15. 根据权利要求14所述的OLED显示面板，其中，所述N-异丙基丙烯酰胺在所述混合液中的质量浓度范围为0.05%~20%。
  16. 根据权利要求12所述的OLED显示面板，其中，所述甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物溶液中含有的甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物具有亲水端与疏水端。
  17. 根据权利要求16所述的OLED显示面板，其中，所述甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物以所述亲水端靠近所述无机封装层以及所述疏水端远离所述无机封装层的方式进行分布。
  18. 根据权利要求16所述的OLED显示面板，其中，所述甲基丙烯酸甲酯-N-异丙基丙烯酰胺共聚物是由聚甲基丙烯酸甲酯与聚N-异丙基丙烯酰胺形成的共聚物。
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