WO2016180103A1 - 薄膜封装结构及其制作方法和显示装置 - Google Patents
薄膜封装结构及其制作方法和显示装置 Download PDFInfo
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- WO2016180103A1 WO2016180103A1 PCT/CN2016/078538 CN2016078538W WO2016180103A1 WO 2016180103 A1 WO2016180103 A1 WO 2016180103A1 CN 2016078538 W CN2016078538 W CN 2016078538W WO 2016180103 A1 WO2016180103 A1 WO 2016180103A1
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- film layer
- organic
- inorganic
- organic film
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- 239000010409 thin film Substances 0.000 title claims abstract description 47
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 238000004806 packaging method and process Methods 0.000 title abstract description 6
- 239000010408 film Substances 0.000 claims abstract description 173
- 238000005538 encapsulation Methods 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 23
- 239000002086 nanomaterial Substances 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 17
- 239000000178 monomer Substances 0.000 claims description 17
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 229910010272 inorganic material Inorganic materials 0.000 claims description 6
- 239000011147 inorganic material Substances 0.000 claims description 6
- 238000009736 wetting Methods 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 5
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 4
- 238000005229 chemical vapour deposition Methods 0.000 claims description 4
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 claims description 4
- 238000007641 inkjet printing Methods 0.000 claims description 4
- 229920000058 polyacrylate Polymers 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 239000009719 polyimide resin Substances 0.000 claims description 4
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 4
- 238000000231 atomic layer deposition Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 10
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 7
- 239000001301 oxygen Substances 0.000 abstract description 7
- 229910052760 oxygen Inorganic materials 0.000 abstract description 7
- 239000000243 solution Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 6
- 239000000203 mixture Substances 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- 238000001723 curing Methods 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 3
- 239000011787 zinc oxide Substances 0.000 description 3
- 229910001928 zirconium oxide Inorganic materials 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 150000001768 cations Chemical class 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 230000000977 initiatory effect Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000008204 material by function Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
- H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- Embodiments of the present invention relate to a thin film package structure, a method of fabricating the same, and a display device.
- the organic light-emitting display is an active light-emitting device, which has the advantages of light weight, wide viewing angle, low power consumption, fast response speed, and flexible display. Therefore, the organic electroluminescent display has been widely used in the display field and the lighting field.
- the core component of the organic light emitting display is an organic light emitting device (OLED device) which is a novel display device which has the advantages of good color saturation and wide viewing angle.
- OLED device organic light emitting device
- the luminescent materials and functional materials in the display device are sensitive to water and gas.
- the water and gas resistance requirements of the corresponding products are: the sealing requirement for oxygen is less than 10 -3 cc / m 2 ⁇ day; the barrier to water Requires less than 10 -6 g/m 2 ⁇ day.
- Embodiments of the present invention provide a thin film package structure, a method of fabricating the same, and a display device.
- One of the problems that can be solved is, for example, that the organic light emitting display device is easily eroded by water and oxygen.
- a thin film encapsulation structure comprising a flexible film for covering a device, the flexible film comprising at least two organic film layers and at least one inorganic film layer, the at least two layers of organic
- the film layer includes a first organic film layer and a second organic film layer, the first organic An inorganic film layer is disposed between the film layer and the second organic film layer, wherein the first organic film layer contacts the device, and the second organic film layer is disposed at an outermost layer of the flexible film.
- the flexible film comprises more than two layers of inorganic film layers, the organic film layer and the inorganic film layer being alternately arranged, each layer of the inorganic film layer being between two organic film layers.
- the sum of the number of layers of the organic film layer and the inorganic film layer is three to nine layers.
- the material of the inorganic film layer comprises an inorganic nano material.
- the inorganic nanomaterial is dispersed within an ethylenically unsaturated monomer.
- a photoinitiator and/or a wetting leveling agent is added to the inorganic film layer.
- the material of the organic film layer includes one or a combination of polyvinyl alcohol, urethane acrylate polymer, and polyimide resin.
- a display device comprising a light emitting display device and a thin film package structure as described above overlying the light emitting display device.
- a method of fabricating a thin film encapsulation structure comprising: fabricating a flexible film having at least two organic film layers and at least one inorganic film layer, the at least two organic film layers including the first The organic film layer and the second organic film layer, the flexible film is formed including:
- the second organic film layer is formed, and the second organic film layer is located at an outermost layer of the flexible film.
- an organic film layer is formed and cured by a coating process, an inkjet printing process, or a chemical vapor deposition process.
- an inorganic material solution is coated on the organic film layer, baked and cured by an ultraviolet curing process to form an inorganic film layer; or an inorganic film layer is formed on the organic film layer by an atomic layer deposition process.
- the baking temperature is 50-70 degrees Celsius for a duration of 60-90 seconds.
- the thin film encapsulation structure according to the embodiment of the present invention can effectively prevent external oxygen and water from infiltrating into a device such as an organic light emitting display device by alternately disposing an organic film layer and an inorganic film layer.
- the package structure and process of the present invention can be applied to packages of devices such as flexible display devices.
- FIG. 1 is a schematic structural view of a thin film encapsulation structure according to an embodiment of the present invention
- FIG. 2 is a schematic structural view of a thin film encapsulation structure according to another embodiment of the present invention.
- FIG. 3 is a flow chart of a method of fabricating a thin film encapsulation structure in accordance with one embodiment of the present invention.
- the thin film encapsulation structure of the present embodiment includes a flexible film 100 for covering a device such as an organic light emitting display device, the flexible film 100 including at least two organic film layers 1 and At least one inorganic film layer 2, the at least two organic film layers including a first organic film layer and a second organic film layer, and an inorganic film layer 2 is disposed between the first organic film layer and the second organic film layer Wherein the first organic film layer contacts the device (such as an organic light emitting display device) and the second organic film layer is disposed at an outermost layer of the flexible film.
- the material of the inorganic film layer includes an inorganic nano material including one or a combination of aluminum oxide, zinc oxide, titanium oxide, silicon dioxide, silicon nitride, and zirconium oxide. That is, the material of the inorganic film layer may be one or more selected from the group consisting of alumina, zinc oxide, titanium oxide, silicon dioxide, silicon nitride, and zirconium oxide.
- the inorganic nanomaterial is dispersed within an ethylenically unsaturated monomer.
- the inorganic nanomaterial can also be uniformly dispersed in the ethylenically unsaturated monomer.
- Dispersing the inorganic nanomaterial in the ethylenically unsaturated monomer is to achieve mutual compatibility between the inorganic nanomaterial and the ethylenically unsaturated monomer.
- the ethylenically unsaturated monomer is cured by ultraviolet light, the inorganic nanomaterial is simultaneously cured, and a good combination of the inorganic material and the organic material can be obtained.
- a photoinitiator and/or a wetting leveling agent is added to the inorganic film layer.
- Ethylene unsaturated monomers are photocurable materials. Since the inorganic nanomaterial is dispersed in the ethylenically unsaturated monomer inner body, when the photocurable material is cured, a photoinitiator needs to be added to the inorganic film layer.
- Photoinitiator also known as photosensitizer or photocuring agent, can absorb a certain wavelength of energy in the ultraviolet or visible region to generate free radicals, cations, etc., thereby initiating polymerization of the monomer by crosslinking.
- a wetting leveling agent can adjust the surface tension of the liquid mixture such that it is more flat during film formation.
- the material of the organic film layer comprises one or a combination of polyvinyl alcohol, urethane acrylate polymer, polyimide resin.
- FIG. 1 shows, in addition to the flexible film 100, a composition of a device covered by the flexible film 100 (an organic light-emitting display device in FIG. 1), wherein reference numeral 3 denotes a substrate, and reference numeral 4 denotes an anode, and a mark 5 denotes a hole injecting layer, and reference numeral 6 denotes a hole transporting layer, Reference numeral 7 denotes an organic light-emitting layer, reference numeral 8 denotes an electron transport layer, and reference numeral 9 denotes a cathode.
- reference numeral 3 denotes a substrate
- reference numeral 4 denotes an anode
- a mark 5 denotes a hole injecting layer
- reference numeral 6 denotes a hole transporting layer
- Reference numeral 7 denotes an organic light-emitting layer
- reference numeral 8 denotes an electron transport layer
- reference numeral 9 denotes a cathode.
- the sum of the number of layers of the organic film layer 1 and the inorganic film layer 2 is not excessive.
- the sum of the number of layers of the organic film layer 1 and the inorganic film layer 2 is 3-9 layers, for example, 3, 5, 7, and 9 layers.
- the thin film encapsulation structure for a package device (such as an organic light-emitting display device) of the present embodiment adopts a manner in which an organic film layer and an inorganic film layer are alternately disposed, which can effectively prevent external oxygen and water from penetrating into the organic light-emitting display device. In addition, it has been verified by high temperature and high humidity experiments, which can meet the reliability requirements of products. Furthermore, the thin film encapsulation structure of the present embodiment can also be applied to a package of a flexible display device.
- the flexible film 100 for covering a device such as an organic light-emitting display device in the thin film package structure of the present embodiment includes three organic film layers 1 and two inorganic film layers 2, wherein the organic film layer 1 The inorganic film layer 2 is alternately disposed, and each of the inorganic film layers 2 is interposed between the two organic film layers 1.
- the organic film layer 1 is used for a contact device such as an organic light-emitting display device, and the outermost layer of the flexible film is the organic film layer 1.
- the composition of the device covered by the flexible film 100 (the organic light-emitting display device in FIG. 2), wherein the mark 3 indicates the substrate, the mark 4 indicates the anode, and the mark 5 indicates the hole injection layer, and the mark 6 The hole transport layer is indicated, the mark 7 indicates the organic light-emitting layer, the mark 8 indicates the electron transport layer, and the mark 9 indicates the cathode.
- the flexible film 100 for covering a device such as an organic light-emitting display device in a thin film package structure may further include four organic film layers 1 and three inorganic film layers 2; or five organic film layers 1 and four inorganic layers Membrane layer 2, the specific case will not be drawn one by one.
- An embodiment of the present invention provides a display device including a light emitting display device (such as an organic light emitting display device) and a thin film package structure as described in any of the above embodiments overlying the light emitting display device .
- the display device provided in this embodiment can be seen in FIG. 1 and FIG. 2 .
- the marks 3-9 constitute an organic light-emitting display device which is covered with a thin film encapsulation structure in which the organic film layer 1 and the inorganic film layer 2 are alternately disposed, and is in contact with the organic light-emitting display device.
- Organic film layer 1 and the outermost layer of the thin film encapsulation structure It is an organic film layer 1.
- the display device described in this embodiment can be a flexible display device.
- the display device of the embodiment since the thin film encapsulation structure provided by the above embodiments is adopted, the display device has better water and oxygen barrier properties.
- the display device may be a product having a display function such as a mobile phone, an electronic paper, a tablet computer, a video camera, a camera, a television, and a printer.
- a display function such as a mobile phone, an electronic paper, a tablet computer, a video camera, a camera, a television, and a printer.
- One embodiment of the present invention provides a method of fabricating a thin film encapsulation structure, the method comprising: fabricating a flexible film having at least two organic film layers and at least one inorganic film layer, the at least two organic film layers including a first organic film layer and a second organic film layer, the fabricating the flexible film comprising: forming a first organic film layer on the device; forming an inorganic film layer on the first organic film layer; and fabricating the second organic film a layer, the second organic film layer being located at an outermost layer of the flexible film.
- FIG. 3 shows a flow chart of a method of fabricating a thin film encapsulation structure according to the present embodiment.
- the manufacturing method of the thin film encapsulation structure provided by this embodiment includes:
- Step 101 The organic film layer is formed and cured by a coating process, an inkjet printing process, or a chemical vapor deposition process.
- an organic film layer is formed and cured by a coating process, an inkjet printing process, or a chemical vapor deposition process.
- the material which can be selected when the organic film layer is formed is one or a combination of polyvinyl alcohol, urethane acrylate polymer, and polyimide resin.
- Step 102 coating an inorganic material solution on the organic film layer, baking and curing by an ultraviolet curing process to form an inorganic film layer; or forming an inorganic film layer on the organic film layer by an atomic layer deposition process.
- the baking temperature is 50-70 degrees Celsius
- the duration is 60-90 seconds.
- a material which can be selected is one or a combination of alumina, zinc oxide, titanium oxide, silicon dioxide, silicon nitride, and zirconium oxide.
- the inorganic nanomaterials of the above materials are uniformly dispersed in the ethylenically unsaturated monomer, and an additive such as a photoinitiator or a wetting leveling agent is added to the inorganic nanomaterial.
- the inorganic nano material is dispersed in the ethylenically unsaturated monomer in order to make the inorganic nano material and the ethylenically unsaturated monomer realize the mutual compatibility of the organic material and the inorganic material.
- the ethylenically unsaturated monomer is cured by ultraviolet rays, the inorganic nanomaterial is simultaneously cured, and a good combination of the inorganic material and the organic material can be obtained.
- the ethylenically unsaturated monomer is a photocurable material. Since the inorganic nanomaterial is dispersed in the ethylenically unsaturated monomer inner body, a photoinitiator can be added to the inorganic nano material when the photocurable material is cured. The photoinitiator can absorb a certain wavelength of energy in the ultraviolet light region or the visible light region to generate a radical, a cation, etc., thereby initiating a compound in which the monomer is polymerized and crosslinked and solidified.
- a wetting leveling agent can adjust the surface tension of the liquid mixture so that the film layer is more flat during film formation.
- Step 103 Steps 101 and 102 are repeated several times in sequence to form an alternate structure of the organic film layer and the inorganic film layer.
- Step 104 An organic film layer is formed, the organic film layer being located at an outermost layer of the thin film encapsulation structure.
- the sum of the number of layers of the organic film layer and the inorganic film layer is not excessive.
- the sum of the number of layers of the organic film layer and the inorganic film layer is 3-9 layers, for example, 3, 5, 7, 9 layers.
- the method for fabricating the thin film encapsulation structure described in this embodiment can be used to fabricate the thin film encapsulation structure described in the above embodiments.
- the thin film encapsulation structure fabricated by the fabrication method described in this embodiment can cover a device such as an organic light emitting display device.
- the film package structure of the embodiment can meet the reliability requirements of the product.
- the thin film encapsulation structure can effectively prevent external oxygen and water from penetrating into the organic light emitting display, and satisfies the packaging performance of devices such as organic light emitting display devices.
- the package structure and process described in this embodiment can be applied to the package of the flexible light emitting display device.
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Abstract
Description
Claims (12)
- 一种薄膜封装结构,包括用于覆盖器件的柔性薄膜,所述柔性薄膜包括至少两层有机膜层和至少一层无机膜层,所述至少两层有机膜层包括第一有机膜层和第二有机膜层,所述第一有机膜层和第二有机膜层之间设置有无机膜层,其中所述第一有机膜层接触所述器件,所述第二有机膜层设置在所述柔性薄膜的最外层。
- 根据权利要求1所述的薄膜封装结构,其中,所述柔性薄膜包括多于两层的无机膜层,所述有机膜层和无机膜层交替设置,每层所述无机膜层处于两层有机膜层之间。
- 根据权利要求1或2所述的薄膜封装结构,其中,所述有机膜层和无机膜层的层数之和为三层到九层。
- 根据权利要求1-3任一所述的薄膜封装结构,其中,所述无机膜层的材料包括无机纳米材料。
- 根据权利要求4所述的薄膜封装结构,其中,所述无机纳米材料分散在乙烯性不饱和单体内。
- 根据权利要求1-5任一所述的薄膜封装结构,其中,所述无机膜层中添加有光引发剂和/或润湿流平剂。
- 根据权利要求1-6任一所述的薄膜封装结构,其中,所述有机膜层的材料包括聚乙烯醇、聚氨酯丙烯酸酯聚合物、聚酰亚胺树脂中一种或几种的组合。
- 一种显示装置,包括发光显示器件及覆盖在所述发光显示器件上的如权利要求1-7任一项所述的薄膜封装结构。
- 一种薄膜封装结构的制作方法,包括制作具有至少两层有机膜层和至少一层无机膜层的柔性薄膜,所述至少两层有机膜层包括第一有机膜层和第二有机膜层,制作所述柔性薄膜包括:在器件上制作第一有机膜层;在所述第一有机膜层上制作无机膜层;制作所述第二有机膜层,所述第二有机膜层位于所述柔性薄膜的最外 层。
- 根据权利要求9所述的薄膜封装结构的制作方法,其中,采用涂覆工艺、喷墨印刷工艺或化学气相沉积工艺制作有机膜层并进行固化。
- 根据权利要求9或10所述的薄膜封装结构的制作方法,其中,在有机膜层上涂布无机材料溶液,进行烘烤并采用紫外线固化工艺进行固化形成无机膜层;或者在有机膜层上采用原子层沉积工艺制作无机膜层。
- 根据权利要求11所述的薄膜封装结构的制作方法,其中,所述烘烤的温度为50-70摄氏度,持续的时间为60-90秒。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US15/511,521 US20170288172A1 (en) | 2015-05-14 | 2016-04-06 | Thin Film Packaging Structure, Method For Fabrication Thereof And Display Device |
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CN201510246548.9 | 2015-05-14 | ||
CN201510246548.9A CN104882565B (zh) | 2015-05-14 | 2015-05-14 | 薄膜封装结构及其制作方法和显示装置 |
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WO2016180103A1 true WO2016180103A1 (zh) | 2016-11-17 |
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CN104882565B (zh) * | 2015-05-14 | 2017-10-13 | 京东方科技集团股份有限公司 | 薄膜封装结构及其制作方法和显示装置 |
CN105514298B (zh) * | 2015-12-31 | 2018-12-18 | 固安翌光科技有限公司 | 一种薄膜封装结构及薄膜封装方法 |
CN107845732A (zh) * | 2016-09-19 | 2018-03-27 | 上海和辉光电有限公司 | 一种薄膜封装结构和oled显示面板 |
CN106206994B (zh) | 2016-09-26 | 2019-04-26 | 京东方科技集团股份有限公司 | 一种显示面板及制备方法 |
CN108666341B (zh) * | 2017-03-30 | 2021-04-02 | 昆山国显光电有限公司 | 显示装置及其制作方法 |
CN107994131A (zh) * | 2017-11-28 | 2018-05-04 | 武汉华星光电半导体显示技术有限公司 | 用于封装oled器件的封装结构、显示装置 |
CN109524440B (zh) * | 2018-11-21 | 2021-03-12 | 云谷(固安)科技有限公司 | 一种柔性显示面板及装置 |
CN110444568A (zh) * | 2019-07-31 | 2019-11-12 | 武汉华星光电半导体显示技术有限公司 | 有机发光二极管显示面板及其制作方法、显示装置 |
CN110707236B (zh) | 2019-10-17 | 2022-08-30 | 京东方科技集团股份有限公司 | 显示基板的封装结构、封装方法及显示装置 |
CN113410413B (zh) * | 2021-06-18 | 2024-04-19 | 北京京东方技术开发有限公司 | 柔性拼接模组、显示装置及其制备方法 |
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CN103258955A (zh) * | 2012-02-20 | 2013-08-21 | 中国科学院微电子研究所 | 有机电子器件的封装方法 |
CN103855185A (zh) * | 2012-12-06 | 2014-06-11 | 三星显示有限公司 | 有机发光显示装置及其制造方法 |
CN104882565A (zh) * | 2015-05-14 | 2015-09-02 | 京东方科技集团股份有限公司 | 薄膜封装结构及其制作方法和显示装置 |
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US6624568B2 (en) * | 2001-03-28 | 2003-09-23 | Universal Display Corporation | Multilayer barrier region containing moisture- and oxygen-absorbing material for optoelectronic devices |
FR2955051B1 (fr) * | 2010-01-14 | 2013-03-08 | Arkema France | Film resistant a l'humidite a base de polymere fluore et d'oxyde inorganique pour application photovoltaique |
KR101182234B1 (ko) * | 2010-05-28 | 2012-09-12 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
KR101990555B1 (ko) * | 2012-12-24 | 2019-06-19 | 삼성디스플레이 주식회사 | 박막봉지 제조장치 및 박막봉지 제조방법 |
CN103440824B (zh) * | 2013-08-07 | 2016-08-10 | 北京京东方光电科技有限公司 | 一种有机电致发光显示面板、其制造方法及显示装置 |
KR102356841B1 (ko) * | 2014-11-21 | 2022-02-03 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
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CN103258955A (zh) * | 2012-02-20 | 2013-08-21 | 中国科学院微电子研究所 | 有机电子器件的封装方法 |
CN103855185A (zh) * | 2012-12-06 | 2014-06-11 | 三星显示有限公司 | 有机发光显示装置及其制造方法 |
CN104882565A (zh) * | 2015-05-14 | 2015-09-02 | 京东方科技集团股份有限公司 | 薄膜封装结构及其制作方法和显示装置 |
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