WO2016169370A1 - 薄膜封装结构及其制作方法和显示装置 - Google Patents

薄膜封装结构及其制作方法和显示装置 Download PDF

Info

Publication number
WO2016169370A1
WO2016169370A1 PCT/CN2016/076592 CN2016076592W WO2016169370A1 WO 2016169370 A1 WO2016169370 A1 WO 2016169370A1 CN 2016076592 W CN2016076592 W CN 2016076592W WO 2016169370 A1 WO2016169370 A1 WO 2016169370A1
Authority
WO
WIPO (PCT)
Prior art keywords
film layer
light extraction
organic
layer
thin film
Prior art date
Application number
PCT/CN2016/076592
Other languages
English (en)
French (fr)
Inventor
杨久霞
白峰
王迎姿
Original Assignee
京东方科技集团股份有限公司
北京京东方光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司, 北京京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US15/322,212 priority Critical patent/US10090487B2/en
Publication of WO2016169370A1 publication Critical patent/WO2016169370A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/85—Arrangements for extracting light from the devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/19—Tandem OLEDs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/875—Arrangements for extracting light from the devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/331—Nanoparticles used in non-emissive layers, e.g. in packaging layer

Definitions

  • Embodiments of the present invention relate to a thin film package structure, a method of fabricating the same, and a display device.
  • Active light-emitting devices such as OLED devices
  • OLED devices have the advantages of light weight, wide viewing angle, low power consumption, fast response, and flexible display, and thus have been widely used in display fields and lighting fields.
  • active light-emitting devices such as OLED devices have low light extraction efficiency.
  • the luminous efficiency loss of the OLED device is large. Therefore, a solution is needed to improve light extraction efficiency.
  • Embodiments of the present invention provide a thin film package structure, a manufacturing method thereof, and a display device, which can solve the problem of light extraction efficiency.
  • a thin film encapsulation structure comprising a flexible film for enclosing a light emitting display device, the flexible film comprising at least two organic film layers, at least one inorganic film layer and a light extraction film layer, Each of the inorganic film layers is located between two layers of the organic film layer, and the light extraction film layer is located between the two layers of the organic film layer or on the outer surface of the outermost layer of the organic film layer.
  • the light extraction film layer includes a plurality of microstructures having a light extraction function.
  • the microstructures comprise a tapered, cylindrical and/or spherical structure.
  • the material of the light extraction film layer comprises an organic material and/or an inorganic material.
  • a protective layer is disposed on the light extraction film layer.
  • the material of the protective layer comprises an organic resin.
  • the light extraction film layer is provided with a flat material.
  • the flat material is an ultraviolet curable material or a thermosetting material.
  • a display device comprising a light emitting display device and a thin film package structure as described above overlying the light emitting display device.
  • a method of fabricating a thin film encapsulation structure comprising: fabricating a flexible film having at least two organic film layers, at least one inorganic film layer, and a light extraction film layer, wherein each of the inorganic films is formed
  • the layers are each located between two layers of the organic film layer, the light extraction film layer being located between the two layers of the organic film layer or on the outer surface of the outermost layer of the organic film layer, the light extraction film layer Includes multiple microstructures with light extraction capabilities.
  • the microstructures comprise a tapered, cylindrical and/or spherical structure.
  • the material of the light extraction film layer comprises an organic material and/or an inorganic material.
  • the light extraction film layer is formed by a printing process or a vacuum thermal evaporation process.
  • a protective layer is disposed over the light extraction film layer.
  • the material of the protective layer comprises an organic resin.
  • the method for fabricating the thin film encapsulation structure further includes:
  • the surface of the light extraction film layer is planarized.
  • planarizing the surface of the light extraction film layer by using an ultraviolet curing process includes: coating an ultraviolet curing material on a surface of the light extraction film layer, and curing the ultraviolet curing material Or applying a thermosetting material to the surface of the light extraction film layer to thermally cure the thermosetting material.
  • an organic film layer is formed and cured by an inkjet printing process or a chemical vapor deposition process.
  • an inorganic material solution is coated on the organic film layer, baked and
  • the inorganic film layer is formed by curing by an ultraviolet curing process; or the inorganic film layer is formed by an atomic layer deposition process on the organic film layer.
  • the thin film package structure by providing a light extraction film layer having a light extraction function, the light extraction efficiency of the light emitting display device wrapped using the film package structure is improved.
  • the thin film encapsulation structure of the present invention can effectively prevent external oxygen and water from penetrating into the light emitting display device by alternately disposing the organic film layer and the inorganic film layer, thereby satisfying the packaging performance of the light emitting display device.
  • the package structure and process of the present invention can be applied to a package of a flexible display device.
  • FIG. 1 is a schematic structural view of a thin film encapsulation structure according to an embodiment of the present invention
  • FIG. 2 is a schematic structural view of another thin film encapsulation structure according to an embodiment of the present invention.
  • FIG. 3 is a schematic structural view of a thin film encapsulation structure according to another embodiment of the present invention.
  • FIG. 4 is a flow chart of a method of fabricating a thin film encapsulation structure in accordance with one embodiment of the present invention.
  • the thin film encapsulation structure provided in this embodiment includes a flexible film for enclosing a light-emitting display device, the flexible film comprising at least two organic film layers 1, at least one inorganic film layer 2, and light extraction. a film layer 3, each of which is located between two layers of the organic film layer 1, the light extraction film layer 3 being located between two layers of the organic film layer 1 (see FIG. 1) or located On the outer surface of the outermost layer of the organic film layer 1 (see FIG.
  • the light extraction film layer 3 includes a plurality of microstructures having a light extraction function.
  • a thin film package structure according to an embodiment of the present invention is generally disposed on a light emitting side of a light emitting display device, that is, light emitted from the light emitting display device can pass through the thin film package structure.
  • FIG. 1 and 2 show the composition of one of the light-emitting display devices (in this embodiment, the organic light-emitting display device) in which the flexible film can be wrapped, in addition to the flexible film.
  • 4 denotes a substrate
  • 5 denotes a first electrode (e.g., an anode)
  • 6 denotes a hole injection layer
  • 7 denotes a hole transport layer
  • 8 denotes an organic light-emitting layer
  • 9 denotes an electron transport layer
  • 10 denotes a second electrode ( For example cathode).
  • the light extraction film layer 3 can completely cover the organic light-emitting layer 8 of the organic light-emitting display device.
  • the flexible film can enclose any other suitable structure of the light emitting display device, and is not limited to only the organic light emitting display device.
  • the microstructures include tapered, cylindrical, and/or spherical structures (not shown in Figures 1 and 2).
  • the light extraction film layer 3 includes a plurality of tapered structures having a light extraction function.
  • a flat material may be disposed on the light extraction film layer 3.
  • the flat material may be an ultraviolet curable material or a heat curable material. Since the light extraction film layer 3 includes a plurality of tapered, cylindrical or spherical microstructures, the provision of a flat material on the light extraction film layer allows the other film layers or structures disposed on the light extraction film layer to be protected and maintained. smooth.
  • the material of the light extraction film layer 3 comprises an organic material and/or an inorganic material, that is, the microstructure having the light extraction function can be made of an organic material, It can be made of inorganic materials.
  • the sum of the number of layers of the organic film layer 1, the inorganic film layer 2, and the light extraction film layer 3 is not excessive, and preferably, the organic film layer 1, the inorganic film layer 2, and the light extraction film layer 3
  • the sum of the layers is 5-10 layers.
  • the thin film encapsulation structure for encapsulating the organic light emitting display device adopts an organic film layer and an inorganic film layer or a light extraction film layer alternately disposed, which can effectively prevent external oxygen and water from penetrating into the organic light emitting display device.
  • the thin film encapsulation structure for encapsulating the organic light emitting display device provided by the embodiment provides a light extraction film layer including a plurality of microstructures having a light extraction function, thereby effectively improving the luminous efficiency of the organic light emitting display device.
  • the thin film package structure provided by the embodiment can also be applied to a package of a flexible display device.
  • FIG. 1 shows The thin film encapsulation structure can effectively protect the light extraction film layer from damage and improve the service life and use effect of the thin film encapsulation structure.
  • FIG. 3 is a schematic view showing the structure of a thin film package structure according to another embodiment of the present invention.
  • the thin film encapsulation structure shown in FIG. 3 is substantially the same as the thin film encapsulation structure shown in FIG. 2 except that the protective layer 11 is disposed on the light extraction film layer 3, and the same portions will not be described in detail herein.
  • the material of the protective layer includes an organic resin.
  • a protective layer 11 is disposed over the light extraction film layer 3.
  • a flat material may be disposed between the light extraction film layer 3 and the protective layer 11.
  • the flat material may be an ultraviolet curable material or a heat curable material.
  • the protective layer 11 is provided over the light extraction film layer 3 when the light extraction film layer 3 is disposed on the outer surface of the outermost layer of the organic film layer 1, the film described with respect to the above embodiment
  • the package structure, the thin film encapsulation structure of the embodiment can effectively protect the light extraction film layer from damage, and improve the service life and use effect of the film package structure.
  • a display device comprising a light emitting display device and a thin film package structure as described in any of the above embodiments overlying the light emitting display device.
  • the structure of the display device can also be seen in FIG.
  • the display device described in this embodiment can be a flexible display device.
  • the display device of the embodiment of the present invention since the thin film encapsulation structure provided by the above embodiment is employed, the display device has high luminous efficiency.
  • the display device can be applied to a product having a display function such as a mobile phone, a tablet computer, a video camera, a camera, a television, and a printer.
  • a display function such as a mobile phone, a tablet computer, a video camera, a camera, a television, and a printer.
  • the method for fabricating the thin film encapsulation structure includes: fabricating at least two organic film layers, at least one layer a flexible film of an inorganic film layer and a light extraction film layer, wherein each of the inorganic film layers is located between two layers of the organic film layer, and the light extraction film layer is located between two layers of the organic film layer or at the outermost
  • the light extraction film layer includes a plurality of microstructures having a light extraction function.
  • the microstructure comprises a tapered, cylindrical and/or spherical structure.
  • the manufacturing method of the thin film encapsulation structure provided by the embodiment includes:
  • Step 101 The organic film layer is formed and cured by an inkjet printing process or a chemical vapor deposition process.
  • an organic film layer is formed and cured by an inkjet printing process or a chemical vapor deposition process on a light-emitting display device (for example, an organic light-emitting display device).
  • Step 102 coating an inorganic material solution on the organic film layer, baking and curing by an ultraviolet curing process to form an inorganic film layer; or forming an inorganic film layer on the organic film layer by an atomic layer deposition process.
  • Step 103 Steps 101 and 102 are repeated several times in sequence to form an alternate structure of the organic film layer and the inorganic film layer.
  • Step 104 forming an organic film layer, and forming a light extraction film layer on the organic film layer, the light extraction film layer including a plurality of microstructures having a light extraction function.
  • the process of forming the light extraction film layer specifically includes:
  • the microstructure includes one or more of a tapered, cylindrical, and spherical structure.
  • the microstructure of the step A1 is formed by a printing process or a vacuum thermal evaporation process to form the light extraction film layer.
  • a printing process or a vacuum thermal evaporation process to form the light extraction film layer.
  • the formed light extraction film layer should be capable of completely covering a light-emitting layer (for example, an organic light-emitting layer) of a light-emitting display device (for example, an organic light-emitting display device).
  • a light-emitting layer for example, an organic light-emitting layer
  • a light-emitting display device for example, an organic light-emitting display device
  • the material of the light extraction film layer comprises an organic material and/or an inorganic material. That is, the microstructured material may be made of an organic material or an inorganic material.
  • the surface of the light extraction film layer is planarized, including:
  • the surface of the light extraction film layer is planarized by an ultraviolet curing process, comprising: coating an ultraviolet curing material on a surface of the light extraction film layer to cure the ultraviolet curing material; or in the light extraction
  • the surface of the film layer is coated with a thermosetting material, and the thermosetting material is thermally cured.
  • Step 105 forming an organic film layer on the light extraction film layer, or forming an organic film layer on the light extraction film layer, and continuing to form an alternate structure of the inorganic film layer and the organic film layer.
  • the sum of the number of layers of the organic film layer, the inorganic film layer and the light extraction film layer is not excessive, and preferably, the sum of the number of layers of the organic film layer, the inorganic film layer and the light extraction film layer is 5-10 layers.
  • the method for fabricating the thin film encapsulation structure is slightly different from the above example.
  • step 104 is performed, step 105 is not continued, and the light is An extraction film is formed on the outer surface of the outermost layer of the organic film.
  • the present example is designed with a light extraction function microstructure on the outer surface of the thin film package structure.
  • the light extraction film layer when the light extraction film layer is disposed on the outer surface of the outermost layer of the organic film layer At the time, a protective layer is provided on the light extraction film layer.
  • the light extraction film layer may be directly bonded to the outer cover of the display device without providing a protective layer.
  • the material of the protective layer when the protective layer is provided, includes an organic resin.
  • the method for fabricating the thin film encapsulation structure described in this embodiment can be used to fabricate the thin film encapsulation structure described in the above embodiments. Since the present embodiment is designed to fabricate a thin film encapsulation structure, a microstructure having a light extraction function is designed (light extraction).
  • the thin film encapsulation structure fabricated by the embodiment is used to wrap a light emitting display device (for example, an organic light emitting display device), the luminous efficiency of the light emitting device (for example, an organic light emitting display device) can be effectively improved, and
  • the embodiment adopts a manner in which the organic film layer and the inorganic film layer are alternately disposed in the production of the thin film package structure, and thus it is possible to effectively prevent external oxygen and water from penetrating into the light emitting display device (for example, an organic light emitting display device).

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

提供了一种薄膜封装结构，包括用于包裹有机发光显示器件的柔性薄膜，所述柔性薄膜包括至少两层有机膜层（1）、至少一层无机膜层（2）和光提取膜层（3），每层所述无机膜层（2）均位于两层所述有机膜层（1）之间，所述光提取膜层（3）位于两层所述有机膜层（1）之间或位于最外层的所述有机膜层（1）的外表面上，所述光提取膜层（3）包括多个具有光提取功能的微结构。提供的薄膜封装结构能够使得其所包裹的有机发光显示器件的出光效率提高。

Description

薄膜封装结构及其制作方法和显示装置
本申请要求申请日为2015年4月23的中国专利申请第201510198118.4号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。
技术领域
本发明的实施例涉及一种薄膜封装结构及其制作方法和显示装置。
背景技术
主动发光型器件(诸如OLED器件)，具有轻薄、宽视角、功耗低、响应速度快、可实现柔性显示的优势，因此在显示领域及照明领域得到了广泛应用。
然而，主动发光型器件(诸如OLED器件)的光提取效率较低。例如，由于OLED器件中的电极层与基板之间的微腔结构的存在，使得OLED器件的发光效率损失较大。因此需要一种解决方案，以提高光提取效率。
发明内容
本发明的实施例提供一种薄膜封装结构及其制作方法和显示装置，可以解决光提取效率的问题。
根据本发明的第一方面，提供了一种薄膜封装结构，包括用于包裹发光显示器件的柔性薄膜，所述柔性薄膜包括至少两层有机膜层、至少一层无机膜层和光提取膜层，每层所述无机膜层均位于两层所述有机膜层之间，所述光提取膜层位于两层所述有机膜层之间或位于最外层的所述有机膜层的外表面上，所述光提取膜层包括多个具有光提取功能的微结构。
根据本发明的实施例，所述微结构包括锥形、柱形和/或球形结构。
根据本发明的实施例，所述光提取膜层的材料包括有机材料和/或无机材料。
根据本发明的实施例，当所述光提取膜层设置在最外层的所述有机膜 层的外表面上时，所述光提取膜层之上设置有保护层。
根据本发明的实施例，所述保护层的材料包括有机树脂。
根据本发明的实施例，所述光提取膜层上设置有平坦材料。
根据本发明的实施例，所述平坦材料为紫外线固化材料或热固化材料。
根据本发明的第二方面，提供了一种显示装置，包括发光显示器件及覆盖在所述发光显示器件上的如上面所述的薄膜封装结构。
根据本发明的第三方面，提供了一种薄膜封装结构的制作方法，包括制作具有至少两层有机膜层、至少一层无机膜层和光提取膜层的柔性薄膜，其中每层所述无机膜层均位于两层所述有机膜层之间，所述光提取膜层位于两层所述有机膜层之间或位于最外层的所述有机膜层的外表面上，所述光提取膜层包括多个具有光提取功能的微结构。
根据本发明的实施例，所述微结构包括锥形、柱形和/或球形结构。
根据本发明的实施例，所述光提取膜层的材料包括有机材料和/或无机材料。
根据本发明的实施例，采用打印工艺或真空热蒸镀工艺制作所述光提取膜层。
根据本发明的实施例，当所述光提取膜层设置在最外层的所述有机膜层的外表面上时，在所述光提取膜层之上设置有保护层。
根据本发明的实施例，所述保护层的材料包括有机树脂。
根据本发明的实施例，所述的薄膜封装结构的制作方法还包括：
对所述光提取膜层的表面进行平坦化处理。
根据本发明的实施例，采用紫外线固化工艺对所述光提取膜层的表面进行平坦化处理，包括：在所述光提取膜层的表面涂布紫外线固化材料，对所述紫外线固化材料进行固化；或在所述光提取膜层的表面涂布热固化材料，对所述热固化材料进行热固化。
根据本发明的实施例，采用喷墨印刷工艺或化学气相沉积工艺制作有机膜层并进行固化。
根据本发明的实施例，在有机膜层上涂布无机材料溶液，进行烘烤并 采用紫外线固化工艺进行固化形成无机膜层；或者在有机膜层上采用原子层沉积工艺制作无机膜层。
本发明的实施例所述的薄膜封装结构，通过设置具有光提取功能的光提取膜层，使得使用该薄膜封装结构包裹的发光显示器件的出光效率提高。另外，本发明所述的薄膜封装结构通过交替设置有机膜层和无机膜层，使得该封装结构能够有效阻止外部氧气和水渗入发光显示器件，满足了发光显示器件的封装性能。本发明所述的封装结构及工艺可以应用于柔性显示器件的封装。
附图说明
为了更清楚地说明本发明实施例的技术方案，下面将对实施例的附图作简单地介绍。显而易见地，下面描述中的附图仅仅涉及本发明的一些实施例，而非对本发明的限制。
图1是根据本发明一个实施例的薄膜封装结构的结构示意图；
图2是根据本发明一个实施例的另一种薄膜封装结构的结构示意图；
图3是根据本发明另一个实施例的薄膜封装结构的结构示意图；
图4是根据本发明一个实施例的薄膜封装结构的制作方法的流程图。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整的描述。显然，所描述的实施例是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
需要注意的是，虽然下文中主要在有机发光显示器件的上下文中来描述本发明的各种实施例，但是本领域的技术人员应当了解的是，本发明的实施例还可以应用于任何其它合适的发光显示器件，而并不是仅局限于有机发光显示器件。
图1示出了本发明一个实施例提供的薄膜封装结构的结构示意图，图 2是本发明一个实施例提供的另一种薄膜封装结构的结构示意图。如图1和图2所示，本实施例提供的薄膜封装结构包括用于包裹发光显示器件的柔性薄膜，所述柔性薄膜包括至少两层有机膜层1、至少一层无机膜层2和光提取膜层3，每层所述无机膜层2均位于两层所述有机膜层1之间，所述光提取膜层3位于两层所述有机膜层1之间(参见图1)或位于最外层的所述有机膜层1的外表面上(参见图2)，所述光提取膜层3包括多个具有光提取功能的微结构。一般而言，根据本发明的实施例的薄膜封装结构一般被设置在发光显示器件的发光侧，即发光显示器件所发出的光能够通过该薄膜封装结构。
图1和图2除了示出了柔性薄膜以外，还示出了柔性薄膜能够包裹的其中一种发光显示器件(在这个实施例中，为有机发光显示器件)的组成结构。参见图2，4表示基板，5表示第一电极(例如阳极)，6表示空穴注入层，7表示空穴传输层，8表示有机发光层，9表示电子传输层，10表示第二电极(例如阴极)。其中，所述光提取膜层3能够完全覆盖住有机发光显示器件的有机发光层8。图1中的有机发光显示器件的组成结构和图2一样，因此图1中没有详细标出。此外，在其它实施例中，柔性薄膜能够包裹任何其它合适结构的发光显示器件，而并不是仅局限于有机发光显示器件。
在本实施例中，所述微结构包括锥形、柱形和/或球形结构(图1和图2中没有示出)。
在本实施例的一个实例中，所述光提取膜层3包括多个具有光提取功能的锥形结构。
在一个实施例中，所述光提取膜层3上可以设置平坦材料。所述平坦材料可以为紫外线固化材料或热固化材料。由于光提取膜层3中包括多个锥形、柱形或球形的微结构，因此，在光提取膜层上设置平坦材料可以使得设置在光提取膜层上其他膜层或结构受到保护且保持平整。
在一个实施例中，所述光提取膜层3的材料包括有机材料和/或无机材料，即所述具有光提取功能的微结构既可以采用有机材料制作而成，也 可以采用无机材料制作而成。
为了节省材料和工艺，所述有机膜层1、无机膜层2和光提取膜层3的层数之和不宜过多，优选地，所述有机膜层1、无机膜层2和光提取膜层3的层数之和为5-10层。
本实施例提供的用于包裹有机发光显示器件的薄膜封装结构，采用了有机膜层和无机膜层或光提取膜层交替设置的方式，可以有效阻止外部氧气和水渗入有机发光显示器件。
本实施例提供的用于包裹有机发光显示器件的薄膜封装结构，由于设置了包括多个具有光提取功能的微结构的光提取膜层，因此可以有效提升有机发光显示器件的发光效率。
此外，本实施例提供的薄膜封装结构还可以应用于柔性显示器件的封装。
此外，参见图1所示出的薄膜封装结构，由于光提取膜层被设置在两层有机膜层之间，而不是位于最外层的有机膜层的外表面上，因此图1所示出的薄膜封装结构可以有效保护所述光提取膜层使其免受损坏，提高所述薄膜封装结构的使用寿命和使用效果。
图3示出了根据本发明另一个实施例的薄膜封装结构的结构示意图。除了所述光提取膜层3之上设置有保护层11之外，图3所示出的薄膜封装结构与图2所示出的薄膜封装结构基本相同，对于相同的部分在此不再详细描述。在这个实施例中，所述保护层的材料包括有机树脂。
当光提取膜层3设置在最外层的所述有机膜层1的外表面上时，为了保护光提取膜层3免受损坏，在所述光提取膜层3之上设置保护层11。
在一个实施例中，所述光提取膜层3和保护层11之间可以设置有平坦材料。所述平坦材料可以为紫外线固化材料或热固化材料。
由于在光提取膜层3设置在最外层的所述有机膜层1的外表面上时，在所述光提取膜层3之上设置保护层11，因此相对于上述实施例所述的薄膜封装结构，本实施例的薄膜封装结构可以有效保护所述光提取膜层使其免受损坏，提高所述薄膜封装结构的使用寿命和使用效果。
根据本发明的一个实施例，提供了一种显示装置，所述显示装置包括发光显示器件及覆盖在所述发光显示器件上的如上面任一实施例所述的薄膜封装结构。所述显示装置的结构也可参见图3。
由于上述实施例提供的薄膜封装结构可以应用于柔性显示器件的封装，因此，本实施例所述的显示装置可以为柔性显示装置。
根据本发明的实施例的显示装置，由于采用了上述实施例提供的薄膜封装结构，因此，该显示装置具有较高的发光效率。
其中，根据本发明的实施例的显示装置可以应用在手机、平板电脑、摄像机、照相机、电视机和打印机等具有显示功能的产品中。
图4示出了根据本发明一个实施例的薄膜封装结构的制作方法的流程图，如图4所示，所述薄膜封装结构的制作方法包括：制作具有至少两层有机膜层、至少一层无机膜层和光提取膜层的柔性薄膜，其中每层所述无机膜层均位于两层所述有机膜层之间，所述光提取膜层位于两层所述有机膜层之间或位于最外层的所述有机膜层的外表面上，所述光提取膜层包括多个具有光提取功能的微结构。其中，所述微结构包括锥形、柱形和/或球形结构。
具体地，本实施例提供的薄膜封装结构的制作方法包括：
步骤101：采用喷墨印刷工艺或化学气相沉积工艺制作有机膜层并进行固化。
在本步骤中，在发光显示器件(例如，有机发光显示器件)上，采用喷墨印刷工艺或化学气相沉积工艺制作有机膜层并进行固化。
步骤102：在有机膜层上涂布无机材料溶液，进行烘烤并采用紫外线固化工艺进行固化形成无机膜层；或者在有机膜层上采用原子层沉积工艺制作无机膜层。
步骤103：依次重复若干次步骤101和步骤102，形成有机膜层和无机膜层相交替的结构。
步骤104：制作有机膜层，并在所述有机膜层上形成光提取膜层，所述光提取膜层包括多个具有光提取功能的微结构。
在本步骤中，形成光提取膜层的过程具体包括：
A1.设计光提取膜层中的微结构，一般地，所述微结构包括锥形、柱形和球形结构中的一种或多种。
A2.采用打印工艺或真空热蒸镀工艺制作步骤A1设计的微结构，形成所述光提取膜层。在采用真空热蒸镀工艺制作所述微结构时，还需配合掩膜完成图案的制作。
这里，形成的光提取膜层应该能够完全覆盖住发光显示器件(例如，有机发光显示器件)的发光层(例如有机发光层)。
其中，所述光提取膜层的材料包括有机材料和/或无机材料。即，所述微结构的材料可以采用有机材料制作而成，也可以采用无机材料制作而成。
在一个实施例中，在形成光提取膜层之后，对光提取膜层表面进行平坦化处理，包括：
采用紫外线固化工艺对所述光提取膜层的表面进行平坦化处理，包括：在所述光提取膜层的表面涂布紫外线固化材料，对所述紫外线固化材料进行固化；或在所述光提取膜层的表面涂布热固化材料，对所述热固化材料进行热固化。
步骤105：在所述光提取膜层上形成有机膜层，或在所述光提取膜层上形成有机膜层后，继续形成无机膜层和有机膜层的交替结构。
为了节省材料和工艺，所述有机膜层、无机膜层和光提取膜层的层数之和不宜过多，优选地，所述有机膜层、无机膜层和光提取膜层的层数之和为5-10层。
在本实施例的另一实例中，所述薄膜封装结构的制作方法与上述实例稍有不同，在本实例中，在进行完步骤104之后，不再继续执行步骤105，这时，所述光提取膜形成在最外层的所述有机膜层的外表面上。与上述在薄膜封装结构内部具有光提取功能的微结构不同，本实例是在薄膜封装结构的外表面上设计有光提取功能微结构。
在本实例中，当光提取膜层设置在最外层的所述有机膜层的外表面上 时，在所述光提取膜层之上设置有保护层。当然，也可以不设置保护层，而使所述光提取膜层直接与显示器件的外盖板进行贴合。其中，当设置保护层时，所述保护层的材料包括有机树脂。
采用本实施例所述的薄膜封装结构的制作方法，可以用于制作上述实施例所述的薄膜封装结构，由于本实施例在制作薄膜封装结构时设计了具有光提取功能的微结构(光提取膜层)，因此当采用本实施例制作而成的薄膜封装结构包裹发光显示器件(例如，有机发光显示器件)时，可以有效提升发光器件(例如，有机发光显示器件)的发光效率，且本实施例在制作薄膜封装结构时采用了有机膜层和无机膜层交替设置的方式，因此可以有效阻止外部氧气和水渗入发光显示器件(例如，有机发光显示器件)内。
以上实施例仅用于说明本发明的技术方案，而非对其限制；尽管参照前述实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或替换，并不使相应技术方案的本质脱离本发明各实施例技术方案的精神和范围。

Claims (18)

  1. 一种薄膜封装结构，包括用于包裹发光显示器件的柔性薄膜，所述柔性薄膜包括至少两层有机膜层、至少一层无机膜层和光提取膜层，每层所述无机膜层均位于两层所述有机膜层之间，所述光提取膜层位于两层所述有机膜层之间或位于最外层的所述有机膜层的外表面上，所述光提取膜层包括多个具有光提取功能的微结构。
  2. 根据权利要求1所述的薄膜封装结构，其中所述微结构包括锥形、柱形和/或球形结构。
  3. 根据权利要求1或2所述的薄膜封装结构，其中所述光提取膜层的材料包括有机材料和/或无机材料。
  4. 根据权利要求1-3任一所述的薄膜封装结构，其中当所述光提取膜层设置在最外层的所述有机膜层的外表面上时，所述光提取膜层之上设置有保护层。
  5. 根据权利要求4所述的薄膜封装结构，其中所述保护层的材料包括有机树脂。
  6. 根据权利要求1-5任一所述的薄膜封装结构，其中所述光提取膜层上设置有平坦材料。
  7. 根据权利要求6所述的薄膜封装结构，其中所述平坦材料为紫外线固化材料或热固化材料。
  8. 一种显示装置，包括发光显示器件及覆盖在所述发光显示器件上的如权利要求1-7任一项所述的薄膜封装结构。
  9. 一种薄膜封装结构的制作方法，包括制作具有至少两层有机膜层、至少一层无机膜层和光提取膜层的柔性薄膜，其中每层所述无机膜层均位于两层所述有机膜层之间，所述光提取膜层位于两层所述有机膜层之间或位于最外层的所述有机膜层的外表面上，所述光提取膜层包括多个具有光提取功能的微结构。
  10. 根据权利要求9所述的薄膜封装结构的制作方法，其中所述微结 构包括锥形、柱形和/或球形结构。
  11. 根据权利要求9或10所述的薄膜封装结构的制作方法，其中所述光提取膜层的材料包括有机材料和/或无机材料。
  12. 根据权利要求9-11任一所述的薄膜封装结构的制作方法，其中采用打印工艺或真空热蒸镀工艺制作所述光提取膜层。
  13. 根据权利要求9-11任一所述的薄膜封装结构的制作方法，其中当所述光提取膜层设置在最外层的所述有机膜层的外表面上时，在所述光提取膜层之上设置有保护层。
  14. 根据权利要求13所述的薄膜封装结构的制作方法，其中所述保护层的材料包括有机树脂。
  15. 根据权利要求9-14任一所述的薄膜封装结构的制作方法，还包括：对所述光提取膜层的表面进行平坦化处理。
  16. 根据权利要求15所述的薄膜封装结构的制作方法，其中采用紫外线固化工艺对所述光提取膜层的表面进行平坦化处理，包括：在所述光提取膜层的表面涂布紫外线固化材料，对所述紫外线固化材料进行固化；或在所述光提取膜层的表面涂布热固化材料，对所述热固化材料进行热固化。
  17. 根据权利要求9-16任一所述的薄膜封装结构的制作方法，其中采用喷墨印刷工艺或化学气相沉积工艺制作有机膜层并进行固化。
  18. 根据权利要求9-17任一所述的薄膜封装结构的制作方法，其中在有机膜层上涂布无机材料溶液，进行烘烤并采用紫外线固化工艺进行固化形成无机膜层；或者在有机膜层上采用原子层沉积工艺制作无机膜层。
PCT/CN2016/076592 2015-04-23 2016-03-17 薄膜封装结构及其制作方法和显示装置 WO2016169370A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US15/322,212 US10090487B2 (en) 2015-04-23 2016-03-17 Thin film packaging structure, method for fabrication thereof and display device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201510198118.4A CN104900812A (zh) 2015-04-23 2015-04-23 薄膜封装结构及其制作方法和显示装置
CN201510198118.4 2015-04-23

Publications (1)

Publication Number Publication Date
WO2016169370A1 true WO2016169370A1 (zh) 2016-10-27

Family

ID=54033344

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2016/076592 WO2016169370A1 (zh) 2015-04-23 2016-03-17 薄膜封装结构及其制作方法和显示装置

Country Status (3)

Country Link
US (1) US10090487B2 (zh)
CN (1) CN104900812A (zh)
WO (1) WO2016169370A1 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104900812A (zh) * 2015-04-23 2015-09-09 京东方科技集团股份有限公司 薄膜封装结构及其制作方法和显示装置
CN105742525A (zh) * 2016-03-02 2016-07-06 京东方科技集团股份有限公司 Oled器件的封装结构及显示装置
CN106129267B (zh) * 2016-08-02 2018-01-12 武汉华星光电技术有限公司 Oled薄膜封装结构及其制作方法
CN108511614B (zh) * 2018-03-21 2020-02-07 武汉华星光电半导体显示技术有限公司 一种oled面板及oled显示器
CN108615816B (zh) * 2018-04-26 2020-06-05 武汉华星光电半导体显示技术有限公司 Oled显示面板
CN109148728B (zh) * 2018-08-31 2019-10-29 昆山国显光电有限公司 一种显示面板及显示装置
CN110289368B (zh) * 2019-06-27 2021-10-22 昆山工研院新型平板显示技术中心有限公司 一种显示面板、显示设备及显示面板的制备方法
DE102020119428A1 (de) * 2020-03-30 2021-09-30 Taiwan Semiconductor Manufacturing Co., Ltd. Gate-all-around-vorrichtungen mit optimierten gateabstandhaltern und gate-ende-dielektrikum

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101533850A (zh) * 2008-03-13 2009-09-16 统宝光电股份有限公司 有机发光二极管显示装置及其显示系统
CN101933175A (zh) * 2008-01-30 2010-12-29 奥斯兰姆奥普托半导体有限责任公司 具有封装单元的装置
CN104103776A (zh) * 2013-04-15 2014-10-15 三星显示有限公司 有机发光显示装置及其制造方法
US20140361270A1 (en) * 2013-06-05 2014-12-11 Universal Display Corporation Microlens array architectures for enhanced light outcoupling from an oled array
CN104900812A (zh) * 2015-04-23 2015-09-09 京东方科技集团股份有限公司 薄膜封装结构及其制作方法和显示装置

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7521727B2 (en) * 2006-04-26 2009-04-21 Rohm And Haas Company Light emitting device having improved light extraction efficiency and method of making same
EP2091096A1 (en) * 2008-02-15 2009-08-19 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Encapsulated electronic device and method of manufacturing
JP5402143B2 (ja) * 2008-03-28 2014-01-29 住友化学株式会社 有機エレクトロルミネッセンス素子
KR101318072B1 (ko) * 2008-06-04 2013-10-15 엘지디스플레이 주식회사 유기발광다이오드 표시장치 및 이의 제조 방법
US7957621B2 (en) * 2008-12-17 2011-06-07 3M Innovative Properties Company Light extraction film with nanoparticle coatings
KR101001552B1 (ko) * 2009-01-20 2010-12-17 삼성모바일디스플레이주식회사 유기 발광 표시 장치
JP5683094B2 (ja) * 2009-11-17 2015-03-11 キヤノン株式会社 有機エレクトロルミネッセンス素子及びこれを用いた多色表示装置
JP5017399B2 (ja) * 2010-03-09 2012-09-05 株式会社東芝 半導体発光装置および半導体発光装置の製造方法
US8547015B2 (en) * 2010-10-20 2013-10-01 3M Innovative Properties Company Light extraction films for organic light emitting devices (OLEDs)
US8469551B2 (en) * 2010-10-20 2013-06-25 3M Innovative Properties Company Light extraction films for increasing pixelated OLED output with reduced blur
EP2495783A1 (en) * 2011-03-01 2012-09-05 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Light-emitting device and method of manufacturing the same
JP2012204103A (ja) * 2011-03-24 2012-10-22 Toshiba Corp 有機電界発光素子、表示装置および照明装置
KR101873476B1 (ko) * 2011-04-11 2018-07-03 삼성디스플레이 주식회사 유기 발광 표시 장치 및 이의 제조 방법
CN103258955B (zh) * 2012-02-20 2016-02-03 中国科学院微电子研究所 有机电子器件的封装方法
WO2013154150A1 (ja) * 2012-04-13 2013-10-17 旭化成株式会社 半導体発光素子用光抽出体及び発光素子
EP2888524A1 (en) * 2012-08-24 2015-07-01 3M Innovative Properties Company Variable index light extraction layer and method of making the same
KR20150064203A (ko) * 2012-10-11 2015-06-10 파나소닉 아이피 매니지먼트 가부시키가이샤 유기 전계 발광 소자 및 조명 장치
CN103715366A (zh) * 2013-12-20 2014-04-09 京东方科技集团股份有限公司 Oled薄膜封装结构、oled器件以及显示装置
CN103928625B (zh) * 2014-04-08 2016-05-18 陕西科技大学 一种柔性透明oled的器件结构及制备方法
CN104362260A (zh) * 2014-11-18 2015-02-18 上海交通大学 一种利用微结构提高光萃取效率的oled器件
CN204271086U (zh) * 2014-12-29 2015-04-15 北京维信诺科技有限公司 一种含光取出结构的显示屏体

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101933175A (zh) * 2008-01-30 2010-12-29 奥斯兰姆奥普托半导体有限责任公司 具有封装单元的装置
CN101533850A (zh) * 2008-03-13 2009-09-16 统宝光电股份有限公司 有机发光二极管显示装置及其显示系统
CN104103776A (zh) * 2013-04-15 2014-10-15 三星显示有限公司 有机发光显示装置及其制造方法
US20140361270A1 (en) * 2013-06-05 2014-12-11 Universal Display Corporation Microlens array architectures for enhanced light outcoupling from an oled array
CN104900812A (zh) * 2015-04-23 2015-09-09 京东方科技集团股份有限公司 薄膜封装结构及其制作方法和显示装置

Also Published As

Publication number Publication date
CN104900812A (zh) 2015-09-09
US20170133632A1 (en) 2017-05-11
US10090487B2 (en) 2018-10-02

Similar Documents

Publication Publication Date Title
WO2016169370A1 (zh) 薄膜封装结构及其制作方法和显示装置
TWI645593B (zh) 具有撓性基板之有機發光顯示裝置
US20190181379A1 (en) Light-emitting display panel
US10276832B2 (en) Oled display and manufacturing method thereof
US10930886B2 (en) Method for manufacturing OLED display screen and OLED display screen
WO2016033923A1 (zh) 有机电致发光器件及其制备方法、显示装置
WO2016180103A1 (zh) 薄膜封装结构及其制作方法和显示装置
EP3550630B1 (en) Packaging method for organic semiconductor device
US10326097B1 (en) Display panel preparation method, display panel and display device
WO2019041386A1 (zh) Oled面板的制作方法及oled面板
WO2015188491A1 (zh) 有机电致发光显示面板及其封装方法、显示装置
WO2015143840A1 (zh) 有机电致发光显示面板、其制作方法及显示装置
WO2016033931A1 (zh) 显示面板及其制备方法和显示装置
WO2018157449A1 (zh) 有机电致发光显示装置及其制作方法
WO2019104838A1 (zh) 显示面板及其制作方法
US11508933B2 (en) Display panel and display device
US20210359259A1 (en) Display panel and display device
TWI624941B (zh) 製造有機發光顯示裝置之方法
US20160365540A1 (en) Thin film package structure, manufacturing method and organic light emitting apparatus having the structure
WO2015085713A1 (zh) 有机电致发光显示器件及其制备方法、显示装置
WO2014134861A1 (zh) Oled器件封装薄膜、制备方法以及oled器件、封装方法
WO2018223815A1 (zh) 薄膜封装结构和显示装置
JP2007042599A (ja) 有機ｅｌディスプレイ及びその製造方法
JPWO2015145533A1 (ja) 発光装置及び発光装置の製造方法
WO2015085723A1 (zh) 有机电致发光显示器件、其制备方法及显示装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16782518

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 15322212

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 16782518

Country of ref document: EP

Kind code of ref document: A1

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 17/04/2018)