WO2020003385A1 - Dispositif de montage et système de montage - Google Patents

Dispositif de montage et système de montage Download PDF

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Publication number
WO2020003385A1
WO2020003385A1 PCT/JP2018/024224 JP2018024224W WO2020003385A1 WO 2020003385 A1 WO2020003385 A1 WO 2020003385A1 JP 2018024224 W JP2018024224 W JP 2018024224W WO 2020003385 A1 WO2020003385 A1 WO 2020003385A1
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WO
WIPO (PCT)
Prior art keywords
head
component
rotary head
components
flatness
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Application number
PCT/JP2018/024224
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English (en)
Japanese (ja)
Inventor
雅史 天野
貴紘 小林
勇太 横井
Original Assignee
株式会社Ｆｕｊｉ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Ｆｕｊｉ filed Critical 株式会社Ｆｕｊｉ
Priority to CN201880094885.2A priority Critical patent/CN112314065B/zh
Priority to PCT/JP2018/024224 priority patent/WO2020003385A1/fr
Priority to JP2020526758A priority patent/JP7095089B2/ja
Publication of WO2020003385A1 publication Critical patent/WO2020003385A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

Definitions

  • the present disclosure relates to a mounting machine for obtaining flatness and a mounting system including the mounting machine.
  • the mounting machine described in Patent Literature 1 is provided with a floating presence / absence detection device that detects the presence / absence of floating of each of a plurality of lead wires of one component held by the component holder of the head.
  • a floating presence / absence detection device that detects the presence / absence of floating of each of a plurality of lead wires of one component held by the component holder of the head.
  • some of the plurality of lead wires irradiated with slit light from the slit light source are imaged by the camera, and based on the captured image. Thus, the presence or absence of each of the plurality of lead wires is detected.
  • the subject of the present disclosure is to efficiently obtain the flatness of each of a plurality of components.
  • two or more of a plurality of components held by the rotary head are irradiated with a pattern and imaged, and some of the components are based on the captured image.
  • the flatness of each of the two or more parts is obtained.
  • pattern irradiation and imaging are performed on each of the components, and the flatness is determined based on the captured image.
  • the flatness of two or more components can be acquired more efficiently than when acquired. Note that, in Patent Literature 1, two or more components of a plurality of components held by a rotary head are imaged by an imaging device, and the flatness of the two or more components is determined based on the captured image. It is not stated that it will be obtained.
  • FIG. 3 is a plan view (conceptual diagram) of the imaging unit. It is a figure which shows notionally the periphery of the control apparatus of the said mounting machine.
  • 4 is a flowchart illustrating a flatness acquisition program stored in a storage unit of the control device. It is a flowchart showing the optimization program memorize
  • FIG. 3 is a conceptual diagram of a component held by the rotary head as viewed from below.
  • FIG. 3 is a diagram conceptually showing a relative positional relationship between the rotary head and an imaging unit.
  • FIG. 12A is a diagram illustrating a change in an irradiation angle of a pattern accompanying rotation of a component held by the rotary head.
  • FIG. 12B is a diagram illustrating a change in an irradiation angle when the another pattern is irradiated. It is a figure which shows notionally another relative positional relationship between the said rotary head and an imaging unit.
  • FIG. 12A is a diagram illustrating a change in an irradiation angle of a pattern accompanying rotation of a component held by the rotary head.
  • FIG. 12B is a diagram illustrating a change in an irradiation angle when the another pattern is irradiated. It is a figure which shows notionally another relative positional relationship between the said rotary head and an imaging unit.
  • FIG. 14A is a diagram illustrating a change in the angle of a pattern irradiated on a component by the projector 150 due to the rotation of the rotary head.
  • (14B) It is a figure showing the change of the angle of the pattern irradiated to a component by the projector 151.
  • FIG. 4 is a diagram illustrating a change in the angle of a pattern irradiated on a component as the rotary head rotates at a first relative position.
  • FIG. 9 is a diagram illustrating a change in the angle of a pattern irradiated on a component as the rotary head rotates at a second relative position.
  • FIG. 17A is a diagram illustrating components held by the rotary head when optimization is performed by the host PC.
  • FIG. 17B is a diagram showing components held by the rotary head when optimization has not been performed by the host PC.
  • (18A), (18B), (18C) are views showing work target components in the mounting machine.
  • the mounting system 2 includes (a) a plurality of mounting machines 4A, 4B,..., (B) a host computer (hereinafter abbreviated as host PC) 6, (d) a bus 8, and the like.
  • host PC host computer
  • a bus 8 a bus 8
  • control devices 10A, 10B,... Provided in each of the plurality of mounting machines 4A, 4B,.
  • symbols A, B,... are omitted.
  • the plurality of mounting machines 4 mount electronic components (hereinafter, abbreviated as components) on a circuit board S (hereinafter, abbreviated as a board S). (See FIG. 6), and includes a board transfer support device 12, a component supply device 14, a component mounting device 16, an imaging unit 18, and the like.
  • the substrate transport and support device 12 transports and holds the substrate S.
  • X is the direction in which the substrate S is transported by the substrate transport and support device 12
  • Y is the width direction of the substrate S.
  • Z is the thickness direction of the substrate S.
  • Y is the front-back direction of the mounting machine 4
  • Z is the up-down direction, and these X direction, Y direction, and Z direction are orthogonal to each other.
  • the component supply device 14 supplies a component to be mounted on the board S to the component mounting device 16 in a state where it can be delivered.
  • the component supply device 14 includes the tape feeder 22 that supplies a plurality of components using a tape.
  • the component supply device 14 may include a plurality of trays.
  • the component supplied by the component supply device 14 is a component 30 including a component main body 26 and a plurality of solder balls 28 as electrode portions formed on the component main body 26.
  • a BGA (Ball Grid Array), as shown in FIGS. 10 and 18B, includes a component body 32 and a plurality of lead wires 34 extending from the side surface of the component body 32 and serving as J-shaped electrode portions.
  • FIGS. 10, 17A and 17B show components 30, 36 and 38 as viewed from the bottom.
  • the component mounting device 16 picks up and holds the component supplied by the component supply device 14 and mounts the component on the substrate S transported and held by the substrate transport and support device 12.
  • the component mounting device 16 includes a rotary head 40, a head moving device 42 that moves the rotary head 40, and the like.
  • the head moving device 42 includes a head horizontal moving device 44 for moving the rotary head 40 in the x direction and the y direction, a head rotating device 46 for rotating the rotary head 40 around a central axis of the head (indicated by Lh in FIG. 3), and the like. including.
  • the head horizontal moving device 44 includes an X direction moving device 50 and a Y direction moving device 52 as shown in FIG.
  • the X-direction moving device 50 includes an X-slider 54, an X-motor 56 as a driving source, a motion conversion mechanism 58 for converting the rotation of the X-motor 56 into a linear motion and transmitting the linear motion to the X-slider 54.
  • the Y-direction moving device 52 is provided on the X slider 54, and converts the rotation of the Y slider 62, the Y motor 64 serving as a driving source, and the Y motor 64 into a linear motion and transmits the linear motion to the Y slider 62 (see FIG. 3). ) Etc.
  • the rotary head 40 is held by the Y slider 62 so as to be rotatable around its own central axis Lh by the head rotating device 46.
  • the rotary head 40 includes a head body 78 and a plurality of (for example, three or more, in this embodiment, eight) suction nozzles 80a, 80b,...
  • the head main body 78 includes a rotation shaft 84 and a nozzle holder 86 provided so as to be integrally rotatable with each other.
  • the suction nozzles 80a, 80b,... Are held by nozzle bodies 87a, 87b,.
  • the suction nozzles 80a, 80b,... Suck and hold components by negative pressure, and hold components by supplying negative pressure from a negative pressure source (not shown).
  • a negative pressure source not shown.
  • the head rotation device 46 rotates the head main body 78 by rotating the rotation shaft 84, and transmits a rotation of the head rotation motor 88 as a driving source and the rotation of the head rotation motor 88 to the rotation shaft 84 (not shown). And a rotation transmitting mechanism.
  • the rotation shaft 84 that is, the head main body 78 (the rotary head 40) is rotated around the head center axis Lh.
  • the Y slider 62 is provided with a nozzle rotating device 94 as a holder rotating device, a nozzle lifting device 96 for lifting and lowering the suction nozzle 80, and the like.
  • the nozzle rotation device 94 is integrally formed with a rotation motor 130 provided as a drive source provided on the Y slider 62, a rotation drive shaft 132 provided rotatably with respect to the rotation shaft 84 of the rotary head 40, and a nozzle body 87. And a rotatable member 134 rotatably provided.
  • the rotation motor 130, the rotation drive shaft 132, and the rotating body 134 are engaged with each other so that rotation can be transmitted.
  • the rotation of the rotation motor 130 is transmitted to the rotating body 134 via the rotation drive shaft 132, and the plurality of suction nozzles 80 are simultaneously rotated around the nozzle center axis Ln.
  • the nozzle lifting / lowering device 96 includes a lifting / lowering motor 140 as a driving source provided on the Y slider 62, a lifting / lowering driving member 142 engageable with a nozzle main body 87 at a predetermined position of the nozzle holder 86, And a motion conversion mechanism 144 that converts the rotation of the rotation into a linear motion and transmits the linear motion to the lifting drive member 142.
  • the imaging unit 18 acquires the three-dimensional shape of the component held by the suction nozzle 80 positioned above, and as shown in FIGS. 4 and 5, two projectors 150 and 151 and a camera as an imaging device 152 and a three-dimensional shape acquisition unit 154 that mainly controls a computer, controls the projectors 150 and 152, and the camera 152, and acquires the three-dimensional shape of the component.
  • the camera 152 is an image pickup device having an image pickup device such as a CCD (Charge Coupled Device) and a CMOS (Complementary Metal Oxide Semiconductor).
  • the camera 152 is provided so that the axis Lz extends in the Z direction, and the projectors 150 and 151 are provided at positions separated by 90 degrees around the axis Lz.
  • the projector 150 irradiates a pattern N that spreads in a plane in which the intensity changes sinusoidally in the direction of arrow Fa, and the projector 151 moves in the direction of arrow Fb as shown in FIG. 12B.
  • a pattern N that spreads in a plane shape whose intensity changes sinusoidally is irradiated. Further, these patterns N are irradiated in a direction inclined with respect to the Z direction and the X and Y directions, and strike the components from obliquely below.
  • the imaging region Rc which is a region where the camera 152 can capture an image
  • the components irradiated with the patterns by the projectors 150 and 151 are imaged by the camera 152, and the three-dimensional shape acquisition unit 154 acquires the three-dimensional shape of the component based on the acquired image by the phase shift method. Is done.
  • the three-dimensional shape of the component located inside the two-dimensionally spread common region Rc is acquired.
  • the projectors 150 and 151 irradiate a pattern whose intensity changes sinusoidally in one direction Fa and Fb a plurality of times with a phase shift, and each time the pattern is illuminated, the camera 152 irradiates the pattern in the imaging region Rc.
  • a captured image which is an image, is obtained.
  • the three-dimensional shape obtaining unit 154 obtains the luminance of each of the pixels constituting the captured image, and obtains the phase of the pixel based on the luminance value of the same pixel in the plurality of captured images. Is done. Then, by connecting pixels having the same phase, an equal phase line is obtained.
  • the irradiation angle of the light of the phase one line forming the pattern
  • the position of the pixel on the image sensor of the camera 152 the optical and geometric parameters of the image pickup unit 18 (the optical center coordinates of the projectors 150 and 151, Based on the optical center coordinates of the camera 152, the focal length, and the like, the distance from the image sensor of the camera 152 to the point on the component corresponding to each of the pixels connected by the equiphase lines is obtained.
  • the three-dimensional shape of the component is obtained based on the distance of each of the plurality of points on the component from the image sensor.
  • the method of acquiring the three-dimensional shape and the pattern irradiated by the projectors 150 and 151 are not limited.
  • the three-dimensional shape can be obtained not only by the phase shift method but also by a pattern projection method.
  • the three-dimensional shape of the part located in the predetermined two-dimensionally (planarly) set area may be obtained, and for example, the stereo image method may be used.
  • the stereo image method is used, a projector is unnecessary, and a three-dimensional shape of a component located in the imaging region Rc is obtained based on images captured by a plurality of cameras.
  • the control device 10 mainly includes a computer, and includes an execution unit 180, a storage unit 182, an input / output unit 184, and the like, as shown in FIG.
  • the shape acquisition unit 154 is connected, and the substrate transport support device 12, the component supply device 14, the component mounting device 16, and the like are connected via the drive circuit 190.
  • a host PC 6 is connected to the control device 10.
  • the host PC 6 includes an execution unit 200, a storage unit 202, an input / output unit 204, and the like, as shown in FIG.
  • the device 206 and the like are connected.
  • the operation of the mounting machine 4 will be described first.
  • the rotary head 40 is moved above the imaging unit 18, and the portions of the plurality of components held by the rotary head 40 to be mounted on the substrate S (the side held by the suction nozzle 80
  • the three-dimensional shape of the target portion is acquired, and the flatness of the virtual plane is acquired based on the three-dimensional shape.
  • the target part is a part including at least a part of the electrode part of the component. For example, in the component 30 shown in FIG.
  • a portion including the plurality of solder balls 28 is set as the target portion Ta, and based on a three-dimensional shape of the target portion Ta, a set of tips (points) of the plurality of solder balls 28 is formed.
  • the flatness of the formed virtual plane Pa is obtained.
  • a portion of the plurality of lead wires 34 including a portion extending to the bottom surface of the component body 32 is set as the target portion Tb, and based on the three-dimensional shape of the target portion Tb, the plurality of lead wires 34
  • the flatness of the virtual plane Pb formed by a set of predetermined points on the side surface (bottom surface) of the portion of the component body 32 extending to the bottom surface side of the component 34 is acquired.
  • a part of the solder ball 28 may be missing or the lead wire 34 may be bent due to a manufacturing defect or a trouble during transportation.
  • a problem such as the occurrence of poor current supply to the components 30 and 36 occurs. . Therefore, in the present embodiment, the flatness of the target portion of the components 30 and 36 is obtained, and the components 30 and 36 are checked.
  • the component 38 shown in FIG. 18C it is not necessary to obtain the flatness of the electrode portion 37.
  • the components 30 and 36 are the target components for acquiring the flatness (hereinafter, may be simply referred to as target components), and the component 38 is not a target component.
  • the flatness of a virtual plane formed by a set of predetermined points of the electrode portion of the target portion of the component may be simply referred to as the flatness of the component.
  • the common area Rc is smaller than the area including all eight components held by the rotary head 40. Therefore, it is not possible to acquire a captured image including all eight components held by the rotary head 40.
  • the three-dimensional shape of the component is acquired in a state where the pattern N is irradiated from a plurality of different directions by the projector. This is because, depending on the direction of the pattern N irradiated to the component, there may be a portion where the pattern does not hit in the component, and it may be difficult to accurately obtain a three-dimensional shape.
  • the rotary head 40 is moved by the head horizontal moving device 44, and the relative position between the rotary head 40 and the imaging unit 18 is changed to all the suction nozzles 80 provided on the rotary head 40.
  • the two or more components held by some of the suction nozzles 80 are set to the first relative position located inside the common region Rc.
  • the pattern N is irradiated while the rotary head 40 is intermittently rotated by the set rotation angle by the head rotation device 46 to image the component.
  • the three-dimensional shape of each of the components is obtained based on the obtained captured image.
  • the first relative position is, specifically, the three components 36 (1) , 36 (2 ) held by the three suction nozzles 80a, 80b, 80c located inside the first region R1 of the rotary head 40.
  • ) , 30 (3) are relative positions located inside the common region Rc.
  • the first region R1 is a region defined by the central angle of the rotary head 40. When the position closest to the x slider 54 is 0 °, the first region R1 is located in a region from 0 ° to 90 ° (set central angle range).
  • the area includes the three components held by the three suction nozzles 80 to be processed.
  • the pattern N is irradiated on the component from different angles.
  • the projector 150 irradiates the pattern N in the direction indicated by the arrow Fa.
  • the component N held in the suction nozzle 80a (hereinafter, may be referred to as the first component) 36 (1)
  • the irradiation angle may be simply referred to as an angle) is set to 0 °
  • the component held by the suction nozzle 80b hereinafter, may be referred to as a second component) 36
  • the angle of the pattern N irradiated to the component (2) Is 45 °
  • the angle of the pattern N irradiated on the component (sometimes referred to as the third component) 30 (3) held by the suction nozzle 80c is 90 °.
  • the captured image captured by the camera 152 includes images of three components 36 (1) , 36 (2) , and 30 (3) , and a pattern is formed from an angle of 0 ° based on the captured image.
  • the three-dimensional shape of the part 30 (3) is obtained.
  • the projector 151 irradiates the pattern N in the direction indicated by the arrow Fb.
  • the first component 36 (1) is irradiated with the pattern N from an angle of 90 ° in a plan view
  • the second component 36 (2) is irradiated with the pattern N from an angle of 135 °
  • the third component 30 (3) Is irradiated with the pattern N from an angle of 180 °.
  • the tertiary order when the pattern N is irradiated from the angles 90 °, 135 °, and 180 ° in plan view for each of the components 36 (1) , 36 (2) , and 30 (3) The original shape is obtained.
  • the rotary head 40 is rotated around the head central axis Lh by 45 ° as a set rotation angle.
  • the component held by the suction nozzle 80h (sometimes referred to as the eighth component) 30 (8) , the first component 36 (1) , and the second component 36 (2) are located inside the common area Rc.
  • the third component 30 (3) deviates from the common area Rc.
  • the pattern N is formed by the projector 150 from angles of 0 °, 45 °, and 90 ° in plan view.
  • the pattern N is radiated from the projector 151 at angles of 90 °, 135 °, and 180 ° in plan view, and a three-dimensional shape is obtained.
  • the rotary head 40 is rotated by 45 °, and a three-dimensional shape is obtained for each of the three components located inside the common region Rc.
  • the set rotation angle (45 °) that is one rotation angle of the rotary head 40 is smaller than the set center angle range (90 °) that defines the first region R1. Therefore, when the rotary head 40 is rotated once, all the components belonging to the first region R1, that is, the common region Rc when the rotary head 40 and the imaging unit 18 are at the first relative position may change. And at least one remains.
  • the set rotation angle of the rotary head 40 and the set center angle that defines the first region R1 are defined by two or more components located inside the common region Rc by one rotation of the rotary head 40. Are deviated from the common region Rc, and the remaining part is determined to remain inside the common region Rc.
  • the first component 36 When attention is paid to one component, for example, the first component 36 (1) , as shown in FIG. 12A, the first component 36 is rotated by rotating the rotary head 40 by 0 °, 45 °, and 90 °.
  • the pattern N is emitted from the projector 150 at angles of 0 °, 45 °, and 90 ° in plan view, and as shown in FIG. 12B, the projector 151 outputs 90 °, 135 °, and 180 ° in plan view.
  • the pattern N is irradiated from an angle.
  • the pattern N is irradiated from the angles of 0 °, 45 °, 90 °, 135 °, and 180 ° for the first component 36 (1).
  • the three-dimensional shape of each case is acquired.
  • the pattern is formed from angles of 0 °, 45 °, 90 °, 135 ° and 180 ° in plan view with the rotation of the rotary head 40 by 45 °.
  • a captured image when N is irradiated is acquired, and a three-dimensional shape is acquired, respectively.
  • the inside of the first component 36 (1) is indicated by an arrow. This orientation change of the part 36 with the rotation of the rotary head 40 (1), in order to clearly show the change in angle of the pattern N irradiated to part 36 (1).
  • FIG. 12 the inside of the first component 36 (1) is indicated by an arrow.
  • FIG. 15 shows the rotation angle of the rotary head 40 and the irradiation angle of the pattern N on each of the components in this case.
  • the components located inside the common region Rc change, and the angle of the pattern N irradiated on the components in plan view also changes.
  • the first component is described as component 1. The same applies to the following components.
  • the rotary head 40 is moved by the head horizontal moving device 44, and the relative position between the rotary head 40 and the imaging unit 18 is different from the first region R1 of the rotary head 40.
  • the fifth component 36 (5) , the sixth component 30 (6) , and the seventh component 30 (7) held by the suction nozzles 80 e, 80 f, and 80 g located inside the two regions R2 are connected to the imaging unit 18. Is a second relative position located within the common region Rc.
  • the second region R2 is a region to which three components held by three suction nozzles located at a central angle of 180 ° to 270 ° of the rotary head 40 belong.
  • the first region R1 and the second region R2 have the same area size, but different relative positions to the x slider 54. Then, at the second relative position of the rotary head 40, similarly, while the rotary head 40 is intermittently rotated by 45 °, the three components are irradiated with the pattern N by the projectors 150 and 151, respectively. Three parts are imaged by the camera 152.
  • the component 36 (5) When attention is paid to one fifth component 36 (5) , as shown in FIG. 14A, by rotating the rotary head 40 by 0 °, 45 °, and 90 °, the component 36 (5) is flattened by the projector 150.
  • the captured image is acquired by the camera 152 while the pattern N is irradiated from the angles of 180 °, 225 °, and 270 ° in visual observation.
  • FIG. 14B a captured image is acquired while the pattern N is irradiated on the component 36 (5) from the angles of 270 °, 315 °, and 360 ° in plan view by the projector 151.
  • FIG. 14A When attention is paid to one fifth component 36 (5) , as shown in FIG. 14A, by rotating the rotary head 40 by 0 °, 45 °, and 90 °, the component 36 (5) is flattened by the projector 150.
  • the captured image is acquired by the camera 152 while the pattern N is irradiated from the angles of 180
  • the angles 180 °, 225 °, 270 °, and 315 ° are respectively associated with the rotation of the rotary head 40.
  • the pattern N is irradiated from 360 °, a captured image is obtained, and a three-dimensional shape is obtained.
  • all of the eight parts held by the rotary head 40 are A three-dimensional shape when the pattern N is illuminated from angles 0 °, 45 °, 90 °, 135 °, 180 °, 225 °, 270 °, and 315 ° in plan view is acquired.
  • the flatness acquisition program in that case will be described based on the flowchart of FIG.
  • This program is executed by the control device 10 and outputs a three-dimensional shape acquisition command to the three-dimensional shape acquisition unit 154 every time the rotary head 40 is rotated by 45 °.
  • a pattern is emitted by the projectors 150 and 151, and a captured image is acquired by the camera 152. Then, a three-dimensional shape is obtained based on the captured image and supplied to the control device 10.
  • step 1 hereinafter abbreviated as S1; the same applies to other steps
  • a count value n of a counter for counting the number of rotations is initialized (set to 0), and in S2, the rotary head 40 is moved to the first position.
  • the imaging unit 18 It moves to the relative position, and outputs a three-dimensional shape acquisition command to the imaging unit 18 in S3.
  • the acquired three-dimensional shape of the three parts 36 (1) , 36 (2) , and 30 (3) is supplied to the control device 10 and stored.
  • the rotary head 40 is rotated by 45 ° around the head center axis Lh.
  • the count value of the number counter is incremented by 1, and in S6, it is determined whether the count value is greater than 7. If the determination is NO, S3 to S6 are repeatedly executed. While the rotary head 40 is intermittently rotated by 45 °, the three-dimensional shape of each of the three parts is acquired as shown in FIG.
  • the rotary head 40 is rotated 360 °, and if the determination in S6 is YES, the count value is reset to 0 in S7, and the rotary head 40 is moved to the second relative position in S8. Thereafter, in S9, a command to acquire a three-dimensional shape is output to the three-dimensional shape acquisition unit 154, and thereafter, S9 to S12 are executed in the same manner as S3 to S6. At the second relative position, while the rotary head 40 is intermittently rotated by 45 °, the three-dimensional shape of each of three parts is acquired as shown in FIG.
  • each of the eight parts held by the rotary head 40 is separated from each other by 45 °.
  • the flatness of the virtual planes Pa and Pb is obtained based on information representing a plurality of three-dimensional shapes when the pattern N is irradiated from different directions.
  • an optimal three-dimensional shape that most appropriately represents the actual three-dimensional shape of the part is acquired, and a virtual plane based on the optimal three-dimensional shape is acquired.
  • the flatness is obtained.
  • an optimal three-dimensional shape can be obtained by statistically processing information representing a plurality of three-dimensional shapes.
  • the flatness of a plurality of parts is obtained while rotating the rotary head 40 around the head center axis Lh. Therefore, the flatness of all the components can be acquired more efficiently, that is, in a shorter time than when the flatness is acquired while rotating each of the components around the nozzle center axis Ln.
  • the flatness of each of the parts is different from the three-dimensional shape obtained when the rotary head 40 is at the first relative position and the three-dimensional shape obtained when the rotary head 40 is at the second relative position.
  • the host PC 6 based on component information, which is information on components to be worked on one or more of the mounting machines 4 input by the operator, the optimum arrangement of the mounting machines 4A, 4B,. The optimal allocation and the like of the parts held in 40 are determined.
  • the component information also includes information on the target components 30, 36 for which flatness is to be obtained.
  • the imaging unit 18 is not always provided in all the mounting machines 4A, 4B,. Further, it takes a long time to obtain the flatness. Therefore, it is desirable that a mounting machine for acquiring flatness is arranged in the latter half of a series of operations. In the rotary head 40, for example, as shown in FIG. 17B, when the target components 30, 36 are held at distant positions, it is inefficient to obtain the flatness of the target components 30, 36. .
  • the optimal arrangement of the mounting machines 4A, 4B,... Is determined, and the optimal allocation of components in the rotary head 40 is determined.
  • the optimization program represented by the flowchart in FIG. 8 is executed before a series of operations is started in the mounting machines 4A, 4B,.
  • component information including target component information is acquired.
  • processing of component information and the like are performed.
  • the position of the mounting machine 4 from which flatness is acquired is determined.
  • allocation of a plurality of components in the rotary head 40 is determined.
  • the mounting machines 4A, 4B,... are arranged, and in the mounting machine 4 in which the flatness is acquired, components are allocated to each of the plurality of suction nozzles 80 of the rotary head 40 in accordance with the determination in S24.
  • components are allocated to each of the plurality of suction nozzles 80 of the rotary head 40 in accordance with the determination in S24.
  • target components 36 (1) , 36 (2) , and 30 (3) are held by suction nozzles 80a, 80b, and 80c adjacent to each other. Therefore, it is not necessary to acquire a three-dimensional shape when the rotation angle of the rotary head 40 is between 135 ° and 225 °.
  • the flatness acquisition program executed in that case is shown in the flowchart of FIG.
  • the same steps as those of the flatness acquisition program shown in the flowchart of FIG. In S1 to S5, the rotary head 40 is rotated by 45 ° at the first relative position.
  • S31 it is determined whether the number of rotations of the rotary head 40 has exceeded 2, that is, whether the rotation angle has reached 135 °. It is determined whether or not. If the determination is YES, in S32, it is determined whether the number of rotations is smaller than 6, that is, whether the rotation angle is smaller than 270 °.
  • the rotation angle of the rotary head 40 is 270 °, since the component 30 (3) is located in the common region Rc, the three-dimensional shape of the component 30 (3) is obtained, and the rotation angle of the rotary head 40 is reduced. If it is 315 °, the three-dimensional shape of the parts 30 (3) and 36 (2) is obtained. Thereafter, when the determination in S33 is YES, the flatness is acquired in S13. After the determination in S33 becomes YES, the rotary head 40 can be moved to the second relative position to obtain a three-dimensional shape in the same manner, but it is indispensable to do so. is not.
  • the control device 10 stores a flatness acquisition program represented by the flowcharts of FIGS. 7 and 9, the three-dimensional shape acquisition unit 154 acquires a three-dimensional shape, and the like.
  • a flatness acquisition unit is configured, and a portion for storing and executing S2 of the control device 10 constitutes a first head horizontal movement control unit, and a portion for storing and executing S8 is used for horizontal movement of the second head.
  • a control unit is configured. Further, the first head horizontal movement control unit, the second head horizontal movement control unit, a part for storing S4 and S10, and a part for executing the same constitute a head movement control unit.
  • a part for storing S3 and S9, a part for executing S3, and the like constitute an imaging control unit.
  • a work control device is constituted by the host PC 6, and an optimization work control unit is constituted by a portion of the host PC 6 which stores and executes an optimization program represented by the flowchart of FIG.
  • An allocation determining unit is configured by a part that stores 24, an execution part, and the like.
  • the common area Rc does not include a part of the components held by the rotary head 40
  • the eight components held by the rotary head 40 are all included in the common area Rc.
  • the same can be applied to the case where it is located inside.
  • the three-dimensional shape is acquired while the rotary head 40 is rotated around the head center axis Lh, so that the flatness of each of the eight parts can be acquired more accurately.
  • the flatness of the eight components can be obtained more efficiently than when a three-dimensional shape is obtained while each of the suction nozzles 80 is rotated around the nozzle center axis Ln.
  • the flatness is acquired based on the plurality of three-dimensional shapes when the pattern N is irradiated from different angles with respect to each of the plurality of components has been described.
  • Acquisition is not indispensable, and an optimal three-dimensional shape can be acquired as flatness.
  • the imaging unit 18 acquire a three-dimensional shape, but the height of each of the points of the tip of the plurality of solder balls 28 of the target portion of the component from the imaging element of the camera 152 and the plurality of leads The height or the like of each of the predetermined points of the line 34 from the image sensor can be obtained. Based on these heights, the flatness of the virtual planes Pa and Pb can be obtained.
  • the host computer 6 is not indispensable, and the control device 10 of the mounting machine 4 can execute the optimization program.
  • the present invention is not limited to the rotation of the rotary head 40 about the head center axis Lh, and the three-dimensional shape of the component can be obtained while rotating the suction nozzle 80 about the nozzle center axis Ln.
  • the present invention can be implemented in various modified forms based on the knowledge of those skilled in the art.

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  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

Le problème abordé par la présente invention est d'acquérir efficacement la planéité d'un composant. Dans un dispositif de montage d'un système de montage selon la présente invention, des images capturées sont acquises et comprennent des images d'au moins deux composants d'une pluralité de composants maintenus par une tête rotative, et la planéité de chacun des deux composants ou plus est acquise sur la base des images capturées. De cette manière, étant donné que la planéité de chacun des deux composants ou plus est acquise sur la base des images capturées, il est possible d'acquérir efficacement la planéité des deux composants ou plus par rapport à un cas dans lequel une image capturée est acquise pour chaque composant et la planéité est acquise pour chaque image capturée.
PCT/JP2018/024224 2018-06-26 2018-06-26 Dispositif de montage et système de montage WO2020003385A1 (fr)

Priority Applications (3)

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CN201880094885.2A CN112314065B (zh) 2018-06-26 2018-06-26 安装机及安装系统
PCT/JP2018/024224 WO2020003385A1 (fr) 2018-06-26 2018-06-26 Dispositif de montage et système de montage
JP2020526758A JP7095089B2 (ja) 2018-06-26 2018-06-26 実装機および実装システム

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PCT/JP2018/024224 WO2020003385A1 (fr) 2018-06-26 2018-06-26 Dispositif de montage et système de montage

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JP2014001939A (ja) * 2012-06-15 2014-01-09 Juki Corp 部品検査装置
JP2014154750A (ja) * 2013-02-12 2014-08-25 Fuji Mach Mfg Co Ltd 組立機
JP2014165209A (ja) * 2013-02-21 2014-09-08 Panasonic Corp 部品実装装置、および、部品実装方法
WO2015011850A1 (fr) * 2013-07-25 2015-01-29 パナソニックＩｐマネジメント株式会社 Appareil de montage de composants électroniques et procédé de montage de composants électroniques
WO2015019447A1 (fr) * 2013-08-07 2015-02-12 富士機械製造株式会社 Machine de montage de composant électronique et procédé de confirmation de transfert

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JP5524495B2 (ja) * 2009-03-10 2014-06-18 富士機械製造株式会社 撮像システムおよび電子回路部品装着機
WO2014141380A1 (fr) * 2013-03-12 2014-09-18 富士機械製造株式会社 Système de reconnaissance de composant pour machine de montage de composant
JP6319818B2 (ja) * 2014-02-19 2018-05-09 株式会社Ｆｕｊｉ 対基板作業システム及び対基板作業システムの部品の装着順を管理する方法
US10701850B2 (en) * 2015-05-29 2020-06-30 Fuji Corporation Optimization program and mounting machine

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014001939A (ja) * 2012-06-15 2014-01-09 Juki Corp 部品検査装置
JP2014154750A (ja) * 2013-02-12 2014-08-25 Fuji Mach Mfg Co Ltd 組立機
JP2014165209A (ja) * 2013-02-21 2014-09-08 Panasonic Corp 部品実装装置、および、部品実装方法
WO2015011850A1 (fr) * 2013-07-25 2015-01-29 パナソニックＩｐマネジメント株式会社 Appareil de montage de composants électroniques et procédé de montage de composants électroniques
WO2015019447A1 (fr) * 2013-08-07 2015-02-12 富士機械製造株式会社 Machine de montage de composant électronique et procédé de confirmation de transfert

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CN112314065B (zh) 2022-03-18
CN112314065A (zh) 2021-02-02
JP7095089B2 (ja) 2022-07-04

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