WO2024111022A1 - Dispositif d'inspection d'aspect de composant et procédé d'inspection d'aspect de composant - Google Patents

Dispositif d'inspection d'aspect de composant et procédé d'inspection d'aspect de composant Download PDF

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Publication number
WO2024111022A1
WO2024111022A1 PCT/JP2022/043004 JP2022043004W WO2024111022A1 WO 2024111022 A1 WO2024111022 A1 WO 2024111022A1 JP 2022043004 W JP2022043004 W JP 2022043004W WO 2024111022 A1 WO2024111022 A1 WO 2024111022A1
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Prior art keywords
measurement
height data
determination unit
electronic component
area
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PCT/JP2022/043004
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English (en)
Japanese (ja)
Inventor
一也 小谷
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株式会社Fuji
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Priority to PCT/JP2022/043004 priority Critical patent/WO2024111022A1/fr
Publication of WO2024111022A1 publication Critical patent/WO2024111022A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/16—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge

Definitions

  • the technology disclosed in this specification relates to a component appearance inspection device and a component appearance inspection method.
  • a component mounter equipped with a component appearance inspection device targets an electronic component to be mounted on a board and judges whether the condition of a specific part (e.g., a terminal) of the electronic component is suitable for the application of the electronic component.
  • a specific part e.g., a terminal
  • JP 2016-151538 A discloses a component mounter equipped with a component appearance inspection device that performs flatness inspection (so-called coplanarity check) of multiple terminals.
  • This component appearance inspection device is equipped with an imaging device that can capture an image of an electronic component, a projection device that projects a pattern image onto the electronic component, and an information processing device that measures the three-dimensional shape based on the captured image of the electronic component when the pattern image is projected, and inspects the flatness of the terminals of the electronic component.
  • the component appearance inspection device judges whether the electronic component is suitable, thereby preventing the mounting of defective electronic components with deformed terminals, etc.
  • the measurement of the three-dimensional shape based on the captured image may fail, resulting in an error.
  • Possible causes of the error include a) the shutter speed of the imaging device is not appropriate (too bright or too dark, etc.), b) the light from the projection device is not shining, c) the position of the set measurement point is not appropriate, and d) the electronic component captured is actually defective.
  • the above causes a) and b) may be improved by reviewing the imaging conditions of the imaging device.
  • the only way to solve this problem is for the user to determine the imaging conditions through trial and error.
  • height data three-dimensional shape data
  • This specification therefore provides technology for automatically determining appropriate imaging conditions for an imaging device to be used for component visual inspection.
  • a component appearance inspection device that includes an imaging device, a projection device, and an information processing device.
  • the imaging device is capable of capturing an image of an electronic component.
  • the projection device projects a pattern image onto the electronic component.
  • the information processing device performs flatness inspection of a specific portion of the electronic component using a captured image of the electronic component captured by the imaging device at the time of projecting the pattern image.
  • the information processing device includes a measurement area determination unit, a halation determination unit, and a success/failure determination unit.
  • the measurement area determination unit determines whether height data exists for a measurement area set corresponding to a specific portion in the captured image.
  • the halation determination unit determines whether height data exists for a halation determination area set in the vicinity of the measurement area.
  • the success/failure determination unit determines that the flatness inspection using the captured image has failed when the measurement area determination unit determines that height data exists in the measurement area but the halation determination unit determines that height data exists in the halation determination area.
  • the measurement area determination unit determines that height data exists in the measurement area but the halation determination unit determines that height data exists in the halation determination area.
  • This specification also discloses another component appearance inspection device that includes an imaging device, a projection device, and an information processing device.
  • the imaging device is capable of imaging an electronic component.
  • the projection device projects a pattern image onto the electronic component.
  • the information processing device performs flatness inspection of a specific portion of the electronic component using an image captured by the imaging device of the electronic component at the time of projecting the pattern image.
  • the information processing device includes a measurement area determination unit, a measurement effective area determination unit, and a success/failure determination unit.
  • the measurement area determination unit determines whether height data exists for a measurement area set corresponding to a specific portion in the captured image.
  • the measurement effective area determination unit determines whether height data exists for a measurement effective area set within the measurement area.
  • the success/failure determination unit determines that the flatness inspection using the captured image has failed when the measurement area determination unit determines that height data exists in the measurement area but the measurement effective area determination unit determines that height data does not exist in the measurement effective area.
  • the measurement effective area determination unit determines that height data does not exist in the measurement effective area.
  • FIG. 1 is a plan view showing an entire component mounter according to an embodiment of the present invention
  • 1 is a block diagram showing a control device of a component mounter to which the component appearance inspection device of the embodiment is applied
  • 1 is a schematic diagram showing the positional relationship between a suction nozzle and a coplanarity unit.
  • FIG. FIG. 2 is a diagram showing an inspection surface of an electronic component whose three-dimensional shape has been measured
  • 1A is a schematic diagram for explaining the positional relationship between the defined lead, the measurement location, and the halation determination area
  • FIG. 1B is an enlarged view of a key portion showing the inspection surface of an electronic component whose three-dimensional shape is measured in the presence of halation
  • FIG. 1C is an enlarged view of a key portion showing the inspection surface of an electronic component whose three-dimensional shape is measured in the absence of halation.
  • 1A is a schematic diagram for explaining the positional relationship between the defined leads, the measurement points, and the effective measurement area
  • FIG. 1B is an enlarged view of a key portion showing the inspection surface of an electronic component whose three-dimensional shape has been measured outside the effective measurement area
  • FIG. 1C is an enlarged view of a key portion showing the inspection surface of an electronic component whose three-dimensional shape has been measured within the effective measurement area.
  • 11 is a flowchart for explaining a procedure for automatically determining imaging conditions for a part appearance inspection device.
  • 13 is a table showing the results of a flatness inspection when images are captured at different shutter speeds.
  • 13 is a table showing the results of a flatness inspection when images of a plurality of electronic components are captured at different shutter speeds.
  • 13 is a table showing the results of a flatness inspection when images are captured in a pluralit
  • the success/failure determination unit may determine that the flatness inspection using the captured image has been successful when the measurement area determination unit determines that height data exists in the measurement area and the halation determination unit determines that height data does not exist in the halation determination area. With this configuration, it is possible to appropriately determine that the flatness inspection has been successful.
  • the information processing device may further include an effective measurement area determination unit that determines whether height data exists for an effective measurement area set within the measurement area.
  • the success/failure determination unit may further determine that the flatness inspection using the captured image has failed when the effective measurement area determination unit determines that no height data exists in the effective measurement area.
  • the success/failure determination unit may determine that the flatness inspection using the captured image has been successful if the measurement area determination unit determines that height data exists in the measurement area, the halation determination unit determines that height data does not exist in the halation determination area, and the effective measurement area determination unit determines that height data exists in the effective measurement area.
  • the imaging device may be capable of imaging the electronic component under multiple imaging conditions.
  • the information processing device may perform flatness inspection on each of multiple captured images obtained by imaging the electronic component under each of the multiple imaging conditions.
  • the information processing device may further include an imaging condition setting unit that sets imaging conditions when the electronic component is imaged by the imaging device based on the imaging conditions when an image is captured for which the success/failure determination unit determines that the flatness inspection was successful. With this configuration, appropriate imaging conditions can be automatically set based on the results of the flatness inspection that appropriately determines whether it was successful or not.
  • the specific part may be a terminal of an electronic component
  • the imaging condition may be the shutter speed of the imaging device.
  • Example 1 An example of the component mounter 11 will be described below with reference to the drawings.
  • the horizontal width direction of the component mounter 11 (left-right direction in FIG. 1) is the X-axis direction
  • the horizontal length direction of the component mounter 11 is the Y-axis direction
  • the vertical direction perpendicular to the X-axis and Y-axis (front-back direction in FIG. 1) is the Z-axis direction.
  • the component mounter 11 includes a board transport device 15, a component supply device 21, a component transfer device 30, a part camera 41, a mark camera 42, a coplanarity unit 51, and a control device 61.
  • the board transport device 15 is composed of a pair of belt conveyors 16 and the like, and transports the circuit board 2 sequentially in the transport direction.
  • the board transport device 15 positions the circuit board 2 at a predetermined position inside the component mounter 11. Then, after the mounting process is performed by the component mounter 11, the board transport device 15 transports the circuit board 2 out of the component mounter 11.
  • the component supply device 21 supplies electronic components to be mounted on the circuit board 2.
  • the component supply device 21 has multiple slots arranged side by side in the X-axis direction.
  • a feeder 22 is removably set in each of the multiple slots.
  • the component supply device 21 feeds and moves the carrier tape using the feeder 22, and supplies electronic components at a removal section located at the tip side of the feeder 22 (upper side in Figure 1).
  • the component supply device 21 also supplies relatively large electronic components, such as lead components, arranged on trays 23.
  • the component supply device 21 stores multiple trays 23 in storage shelves 24 that are partitioned in the vertical direction, and pulls out a specific tray 23 according to the mounting process to supply electronic components such as lead components.
  • the component transfer device 31 is configured to be movable in the X-axis direction and the Y-axis direction.
  • the component transfer device 31 is arranged from the rear side (upper side in FIG. 1) of the component mounter 11 in the longitudinal direction to above the component supply device 21 on the front side.
  • the component transfer device 31 includes a head drive device 32, a moving table 33, and a mounting head 34.
  • the head drive device 32 is configured to be able to move the moving table 33 in the X-axis direction and the Y-axis direction by a linear motion mechanism.
  • the mounting head 34 is a holding device that holds electronic components, and is detachably attached to the moving table 33 of the head drive device 32.
  • the mounting head 34 supports a number of suction nozzles 35 (see FIG. 3) that are detachably provided on a number of nozzle holders.
  • the suction nozzles 35 suction and hold electronic components supplied at the take-out section of the feeder 22 and electronic components supplied from the tray 23.
  • the part camera 41 and the mark camera 42 are digital imaging devices having imaging elements such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor).
  • the part camera 41 and the mark camera 42 capture images based on control signals from a control device 61 that is communicatively connected, and send the image data acquired by the capture to the control device 61.
  • the part camera 41 is fixed to the base of the component mounter 11 so that its optical axis is vertical (Z-axis direction) and is configured to be able to capture images from below the component transfer device 31. More specifically, the part camera 41 is configured to be able to capture images of the underside of the electronic component while it is being held by the suction nozzle 35.
  • the mark camera 42 is mounted on the moving stage 33 of the component transfer device 31 so that its optical axis faces vertically downward (Z-axis direction).
  • the mark camera 42 is configured to be able to capture an image of the circuit board 2.
  • the control device 61 acquires image data from the mark camera 42 and recognizes the positioning state of the circuit board 2 by the board transport device 15, for example by recognizing positioning marks attached to the board through image processing.
  • the control device 61 corrects the position of the moving stage 33 according to the positioning state of the circuit board 2, and controls the mounting process to mount the electronic components.
  • the coplanarity unit 51 measures the three-dimensional positions (spatial positions indicated by three-dimensional coordinates) of measurement points set on an electronic component. In this embodiment, the coplanarity unit 51 measures the three-dimensional positions of each measurement point by measuring the shape (three-dimensional shape) of the inspection surface indicated by three-dimensional coordinates.
  • the coplanarity unit 51 constitutes part of a component appearance inspection device 81, which will be described later.
  • the control device 61 is mainly composed of a CPU, various memories, and control circuits.
  • the control device 61 controls the mounting process of mounting electronic components on the circuit board 2 based on image data acquired by imaging with the parts camera 41 and the mark camera 42, and the results of the judgment of the suitability of the electronic components by the part appearance inspection device 81.
  • the control device 61 has an input/output interface 68 connected via a bus to the mounting control unit 62, shape measurement unit 63, flatness calculation unit 64, flatness inspection unit 65, suitability judgment unit 66, and storage device 67.
  • a motor control circuit 69, an imaging control circuit 70, and a projection control circuit 71 are connected to the input/output interface 68.
  • the mounting control unit 62 controls the position of the mounting head 34 and the operation of the suction mechanism via the motor control circuit 69. More specifically, the mounting control unit 62 receives information output from the various sensors provided in the component mounter 11 and the results of various recognition processes. The mounting control unit 62 sends a control signal to the motor control circuit 69 based on the control program stored in the storage device 67, the information from the various sensors, and the results of image processing and recognition processing. This controls the position and rotation angle of the suction nozzle 35 supported by the mounting head 34.
  • the shape measurement unit 63, plane calculation unit 64, flatness inspection unit 65, and suitability determination unit 66 are elements that make up the component appearance inspection device 81, and will be described in detail below.
  • the storage device 67 is composed of an optical drive device such as a hard disk drive, or a flash memory.
  • the storage device 67 stores a control program for operating the component mounter 11, image data transferred from the part camera 41 and mark camera 42 to the control device 61 via a bus or communication cable, temporary data of image processing by the component appearance inspection device 81, and the like.
  • the input/output interface 68 is located between the CPU and storage device 67 and each unit, and converts data formats and adjusts signal strength.
  • the motor control circuit 69 is used to control each axis motor provided in the component transfer device 31 based on a control signal from the mounting control unit 62. This positions the mounting head 34 in each axial direction. In addition, the lift position (Z-axis position) and rotation angle of a specified suction nozzle 35 are determined by controlling each axis motor.
  • the imaging control circuit 70 controls the imaging by the part camera 41, the mark camera 42, and the measurement camera 54 of the coplanarity unit 51 based on the imaging control signal sent by the control device 61.
  • the imaging control circuit 70 also acquires image data captured by the part camera 41, the mark camera 42, and the measurement camera 54, and stores the image data in the storage device 67 via the input/output interface 68.
  • the projection control circuit 71 controls the projection by the projection device (projectors 52, 53) of the coplanarity unit 51 based on the projection control signal sent by the control device 61.
  • the component visual inspection device 81 of this embodiment is a device that inspects the appearance of electronic components to determine whether they are normal or not, and is configured as part of the component mounter 11.
  • the electronic components that are the subject of visual inspection are, for example, electronic components that have a component body and multiple terminals provided on the component body, and specific examples include semiconductor packages such as QFP (Quad Flat Package) and BGA (Ball Grid Array).
  • QFP is an electronic component that has multiple lead terminals protruding from the side of the component body.
  • a BGA is an electronic component that has multiple bumps protruding from the bottom surface of the component body. The following description focuses on an electronic component 3 that has a shape similar to the QFP shown in Figure 3.
  • the top surface of the electronic component 3 having lead terminals 4 is the surface that is adsorbed and held by the mounting head 34, so the bottom surface opposite is defined as the inspection surface that is visually inspected.
  • the bottom surface of the component body 5 and the bottom surfaces of each lead terminal 4 are the inspection surfaces.
  • the component visual inspection device 81 includes a coplanarity unit 51, a plane calculation unit 64, a flatness inspection unit 65, and a suitability determination unit 66.
  • the coplanarity unit 51 measures the three-dimensional position of a measurement point P1 set on the electronic component 3.
  • the coplanarity unit 51 of this embodiment measures the three-dimensional position of each measurement point P1 by measuring the three-dimensional shape of the inspection surface indicated by three-dimensional coordinates.
  • the coplanarity unit 51 includes a measurement camera 54, two projectors 52, 53, and a shape measurement unit 63 (see FIG. 2) that constitutes part of the control device 61.
  • the two projectors 52, 53 and the measurement camera 54 are fixed to the base of the component mounter 11.
  • the two projectors 52, 53 are positioned at positions offset by 90° in the circumferential direction around the optical axis of the measurement camera 54, and are devices that project a predetermined pattern image onto the electronic component 3 that is the object of measurement of the three-dimensional shape.
  • a striped pattern image in which the brightness changes sinusoidally is used.
  • the measurement camera 54 is a digital camera with an image sensor, similar to the part camera 41 and the mark camera 42.
  • the measurement camera 54 captures the pattern image projected onto the electronic component 3.
  • the measurement camera 54 captures the image based on a control signal from the control device 61, which is communicatively connected, and sends the image data acquired by capturing the image to the control device 61.
  • the shape measuring unit 63 measures the three-dimensional shape of the electronic component 3 based on multiple image data acquired by imaging with the measurement camera 54. In this embodiment, the shape measuring unit 63 measures the three-dimensional shape of the electronic component 3 using a phase shift method.
  • the plane calculation unit 64 calculates a reference plane based on the three-dimensional positions of the measurement points P1 set on each of the multiple lead terminals 4.
  • the reference plane refers to a virtual plane that indicates the position of the plane relative to the multiple lead terminals 4 when the electronic component 3 is placed on a plane.
  • FIG. 4 visualizes the three-dimensional shape of the electronic component 3 measured by the shape measuring unit 63, and the height (Z coordinate) of each part is indicated by the brightness (shading in FIG. 4) of the part.
  • one measurement point P1 is set for each lead terminal 4.
  • the rectangular area forming the outer shape of each lead terminal 4 represents the lead terminal defined in the Shape Data (hereinafter referred to as the "defined lead T1").
  • the measurement point P1 is set on the inner periphery of the area surrounded by the defined lead T1, and is preferably set at a distance inward from the edge of the defined lead T1.
  • the measurement point P1 is represented by a mark with an x in a square frame.
  • the shape measuring unit 63 calculates the Z coordinate for the XY coordinates of the set measurement point P1, for example, based on the coordinate system of the coplanarity unit 51, and measures the three-dimensional position of the measurement point P1.
  • the flatness inspection unit 65 performs a flatness inspection (coplanarity check) of the multiple lead terminals 4 based on the distance between the measurement point P1 set on each of the multiple lead terminals 4 and the reference plane.
  • the suitability determination unit 66 determines whether the electronic component 3 is suitable. In this embodiment, it determines whether the flatness of the electronic component 3 is within the allowable range. Specifically, if the flatness of the electronic component 3 is within the allowable range, it is determined to be a normal product suitable for mounting, and if it is outside the allowable range, it is determined to be a defective product unsuitable for mounting.
  • the suitability determination unit 66 determines whether the electronic component 3 is suitable, and if it is suitable, it determines that the electronic component 3 is suitable for mounting by the component mounter 11. On the other hand, if it is not suitable, the suitability determination unit 66 determines that the electronic component 3 is not suitable for mounting by the component mounter 11.
  • the mounting control unit 62 first performs a suction process in which the electronic components 3 are sequentially sucked by the suction nozzles 35 supported by the mounting head 34, and the electronic components 3 are held.
  • the control device 61 performs an imaging process in which the mounting head 34 is moved above the part camera 41 by the operation of the component transfer device 31, and the picked-up electronic components 3 are imaged.
  • the coplanarity unit 51 performs a suitability judgment process for the electronic components 3 held by the multiple suction nozzles 35.
  • the control device 61 judges whether or not there is an unsuitable component based on the judgment result in the suitability judgment process.
  • the mounting control unit 62 performs a mounting process in which the electronic components 3 are sequentially mounted on the circuit board 2. Then, the mounting control unit 62 judges whether or not the mounting process for all electronic components 3 has been completed based on the control program, and repeats the above process until the mounting process is completed.
  • the coplanarity unit 51 first performs an imaging process using the measurement camera 54. Specifically, the coplanarity unit 51 moves the electronic component 3 above the measurement camera 54 by the operation of the component transfer device 31. The coplanarity unit 51 then performs the imaging process by repeating the projection of a pattern image by the two projectors 52 and 53 and the imaging by the measurement camera 54. Next, the shape measurement unit 63 performs a measurement process of the three-dimensional shape of the inspection surface of the electronic component 3 indicated by three-dimensional coordinates using the image data acquired by the imaging process. Through this process, the coplanarity unit 51 acquires the three-dimensional position of each measurement point P1 of the multiple lead terminals 4.
  • the coplanarity unit 51 adjusts the positional deviation of the measurement point P1 in response to the deformation amount of the lead terminal 4 based on the acquired shape of the inspection surface. As a result, the coplanarity unit 51 acquires the three-dimensional position of the measurement point P1 displaced due to the deformation of the lead terminal 4.
  • the plane calculation unit 64 calculates a reference plane based on the three-dimensional positions of the measurement points P1 of each of the lead terminals 4.
  • the suitability determination unit 66 executes a flatness inspection process for the lead terminals 4. In the flatness inspection process, the flatness of the lead terminals 4 is inspected based on whether the three-dimensional positions of the measurement points P1 set for each of the lead terminals 4 are within the flatness tolerance range.
  • the suitability determination unit 66 judges the suitability of the electronic component 3 based on the inspection result of the flatness inspection. If it is determined that the flatness of the lead terminals 4 is insufficient, the suitability determination unit 66 requests the control device 61 to perform a recovery process and ends the suitability determination process for the electronic component 3. On the other hand, if the flatness of the lead terminals 4 is sufficient, the suitability determination unit 66 ends the suitability determination process without requesting a recovery process.
  • the control device 61 which is an information processing device, further includes a measurement area determination unit 91, a halation determination unit 92, a success/failure determination unit 93, a measurement effective area determination unit 94, and an imaging condition setting unit 95.
  • the measurement camera 54 of the coplanarity unit 51 is capable of capturing images of the electronic component 3 under multiple imaging conditions.
  • the multiple imaging conditions are the shutter speed and imaging mode of the measurement camera 54.
  • the shutter speed can be set in 1 ms increments within a range of 1 ms to 9 ms, for example.
  • a short shutter speed results in a short exposure time, and the image will be darker.
  • a long shutter speed results in a long exposure time, and the image will be brighter.
  • the imaging mode is determined by a combination of the number of times the measurement camera 54 captures images and the angle setting of the electronic component when capturing images.
  • four types of imaging modes (“Auto”, “Fine”, “Auto+45deg”, and “Fine+45deg") can be set.
  • the “Auto” mode is an imaging mode that is automatically selected and performs inspection by capturing an image only once.
  • the “Fine” mode is an imaging mode that performs inspection by capturing an image twice with different angles of the electronic component 3. Specifically, in this mode, the electronic component 3 is captured, then rotated 180° and captured again for inspection.
  • the "Auto+45deg” mode is an imaging mode that automatically selects an imaging mode and further rotates the electronic component 3 45° in the ⁇ direction and captures the image.
  • the "Fine+45deg” mode is an imaging mode that performs inspection by rotating the electronic component 3 45° in the ⁇ direction and capturing the image twice.
  • the control device 61 then captures the electronic component 3 under each of the multiple imaging conditions and performs flatness inspection for each of the multiple captured images obtained by capturing the images.
  • the measurement area determination unit 91 determines whether height data exists for a measurement area set corresponding to a specific part in the captured image. In this embodiment, it determines whether height data exists for a measurement point P1 set corresponding to each defined lead T1 in the captured image. Note that "determining whether height data exists for measurement point P1" refers to calculating the Z coordinate for the XY coordinates of the set measurement point P1 and determining whether the result has been obtained (i.e., determining whether the three-dimensional position of measurement point P1 has been grasped).
  • the halation determination unit 92 determines whether height data exists in the halation determination area set in the vicinity of the measurement area.
  • a halation determination area A1 is set in a substantially U-shape at a position surrounding the lead tip side of each defined lead T1 (see Figures 5(a) to 5(c)).
  • the halation determination unit 92 determines whether height data exists in the halation determination area A1.
  • Figure 5(b) shows a state in which height data exists in the halation determination area A1.
  • the light-colored area (high-luminance area) indicating the presence of height data extends to the outer area of the defined lead T1 and reaches the halation determination area A1, causing halation.
  • FIG. 5(c) shows a state in which no height data exists in the halation determination area A1.
  • the high brightness area indicating the presence of height data does not extend to the outer area of the defined lead T1, and does not reach the halation determination area A1.
  • the measurement point P1 is set on the inner side of the defined lead T1. Therefore, in this case, no height data is obtained in the halation determination area A1.
  • the halation determination area A1 may be automatically generated based on the shape of the defined lead T1, or may be arbitrarily set by the user.
  • the measurement effective area determination unit 94 determines whether height data exists for the measurement effective area set within the measurement area.
  • a rectangular measurement effective area A2 is set on the inner circumference of the lead tip side of each defined lead T1 (see Figures 6(a) to 6(c)).
  • the measurement effective area A2 is set away from the edge of the defined lead T1 inward.
  • Figure 6(b) shows a state in which the measurement point P1 is set outside the measurement effective area A2.
  • Figure 6(c) shows a state in which the measurement point P1 is set within the measurement effective area A2.
  • the measurement effective area A2 may be generated automatically based on the shape of the defined lead T1, or may be set arbitrarily by the user.
  • the success/failure determination unit 93 determines that the flatness inspection using the captured image has been successful when the measurement area determination unit 91 determines that height data exists in the measurement area and the halation determination unit 92 determines that height data does not exist in the halation determination area. Specifically, the success/failure determination unit 93 determines that the flatness inspection using the captured image has been successful when the measurement area determination unit 91 determines that height data exists in the measurement point P1 and the halation determination unit 92 determines that height data does not exist in the halation determination area A1 (for example, the state in FIG. 5(c)).
  • the success/failure determination unit 93 determines that the flatness inspection using the captured image has failed if the measurement area determination unit 91 determines that height data exists in the measurement area, but the halation determination unit 92 determines that height data exists in the halation determination area. Specifically, the success/failure determination unit 93 determines that the flatness inspection using the captured image has failed if the measurement area determination unit 91 determines that height data exists in the measurement point P1, but the halation determination unit 92 determines that height data exists in the halation determination area A1 (for example, the state of FIG. 5B).
  • the success/failure determination unit 93 determines that the flatness inspection using the captured image has failed if the measurement effective area determination unit 94 determines that no height data exists in the measurement effective area. Specifically, the success/failure determination unit 93 determines that the flatness inspection using the captured image has failed if the measurement effective area determination unit 94 determines that no height data exists in the measurement effective area A2 (for example, the state of FIG. 6B).
  • the imaging condition setting unit 95 sets imaging conditions for imaging the electronic component 3 with the imaging device based on the imaging conditions used when the image for which the success/failure determination unit 93 determines that the flatness inspection was successful is captured.
  • the shutter speed and imaging mode used when the electronic component 3 is imaged with the measurement camera 54 are set based on the shutter speed and imaging mode used when the image for which the success/failure determination unit 93 determines that the flatness inspection was successful is captured.
  • an automatic imaging condition determination program is stored in the storage device 67, and the control device 61 reads out and executes this program from the storage device 67.
  • the control device 61 performs a measurement area determination process for determining whether height data exists for a measurement area (measurement point P1) set corresponding to a specific portion (each defined lead T1) in the captured image of a normal electronic component 3.
  • control device 61 operates the two projectors 52, 53 and the measurement camera 54 constituting the coplanarity unit 51 to capture images of each lead terminal 4 of the electronic component 3, and operates the shape measurement unit 63 to measure the three-dimensional shape of each lead terminal 4 based on the captured data.
  • the control device 61 also operates the plane calculation unit 64 to calculate a reference plane, and operates the flatness inspection unit 65 to perform a flatness inspection (coplanarity check) of each lead terminal 4.
  • the control device 61 proceeds to step S120 and operates the halation determination unit 92 to execute the halation determination process.
  • the halation determination process it is determined whether height data exists for the halation determination area (halation determination area A1) set near the definition lead T1.
  • the control device 61 then operates the success/failure determination unit 93 to determine whether the flatness inspection was successful or unsuccessful based on the determination result of the halation determination process.
  • the measurement area determination unit 91 determines that height data exists in the measurement area (measurement point P1)
  • the halation determination unit 92 determines that height data exists in the halation determination area A1
  • step S130 is skipped and the process proceeds to step S140.
  • the measurement area determination unit 91 determines that height data exists in the measurement area (measurement point P1) and the halation determination unit 92 determines that height data does not exist in the halation determination area A1, the process proceeds to the determination process of step S130.
  • control device 61 when the control device 61 proceeds to step S130, it operates the measurement effective area determination unit 94 to execute a measurement effective area determination process.
  • the measurement effective area determination process it is determined whether height data exists for the measurement effective area (measurement effective area A2) set in the definition lead T1.
  • the control device 61 operates the success/failure determination unit 93 to determine whether the flatness inspection was successful or unsuccessful based on the determination result of the measurement effective area determination process.
  • the measurement area determination process determines that height data exists in the measurement area (measurement point P1) in the definition lead T1
  • the measurement effective area determination process determines that no height data exists in the measurement effective area A2
  • the flatness inspection is determined to be successful.
  • step S140 the control device 61 proceeds to step S140, where it outputs the results of the flatness inspection to the storage device 67 and temporarily stores them in the storage device 67.
  • steps S110 to S140 are repeated for the range of shutter speeds (i.e., 1 ms to 9 ms). Also, the same process is repeated for each type of imaging mode.
  • examples of output of the results of the flatness inspection are shown in the tables of Figs. 8 to 10, respectively.
  • the table in Figure 8 illustrates the results of a flatness inspection when, for example, the shutter speed is set in 1 ms increments within the range of 1 to 9 ms, and an image is captured in the "Auto" mode, which is automatically selected by default.
  • "OK” means that the flatness inspection was successful
  • "Error” means that the flatness inspection failed.
  • the table also lists the CPH value, which is an index of productivity.
  • a shutter speed in the range of 4 to 6 ms is "OK,” and any other range is “Error.”
  • the median value of the "OK" range is 5 ms.
  • the table in Figure 9 illustrates the results of a flatness inspection when multiple electronic components 3 ("Component 1,” “Component 2,” and “Component 3”) are used and similar imaging is performed in "Auto” mode.
  • the range of 2 ms to 6 ms for “Component 1” the range of 4 ms to 6 ms for “Component 2”
  • the range of 3 ms to 7 ms for “Component 3” are each "OK.”
  • comparing the OK ranges "Component 3" is the widest, “Component 1” is the next widest, and “Component 2” is the narrowest.
  • the median of the common "OK" range for each component is 5 ms.
  • the table in FIG. 10 illustrates the results of flatness inspection when the same image is captured using four types of imaging modes ("Auto”, “Fine”, “Auto+45deg”, and “Fine+45deg” modes).
  • the range of 4 ms to 6 ms for the "Auto” mode, the range of 2 ms to 8 ms for the "Fine” mode, the range of 3 ms to 6 ms for the "Auto+45deg” mode, and the range of 3 ms to 8 ms for the "Fine+45deg” mode are each "OK".
  • step S150 the control device 61 refers to the output result of the flatness inspection and selects an imaging mode with a wide "OK" range. For example, based on the results of the table in FIG. 10, the "Fine" mode is selected as the optimal imaging mode.
  • the control device 61 proceeds to step S160 and selects a shutter speed. In this embodiment, it is predefined that the median value of the "OK" range is the optimal value. Therefore, in the example of the table in FIG. 10, the control device 61 selects "5 ms" as the optimal shutter speed. Furthermore, the control device 61 operates the imaging condition setting unit 95 to adopt an imaging condition of capturing an image in "Fine” mode with a shutter speed of "5 ms", and sets this as the imaging condition for subsequent shooting, thereby completing the series of processes.
  • the component appearance inspection device 81 constituting the component mounter 11 of this embodiment determines whether height data exists for the measurement point P1 set corresponding to the defined lead T1 in the captured image, and further determines whether height data exists for the halation determination area A1 set near the defined lead T1. Then, even if it is determined that height data exists at the measurement point P1, if it is determined that height data exists in the halation determination area A1, it is determined that the flatness inspection using the captured image has failed. Therefore, as shown in FIG. 5(b), it is possible to avoid erroneously determining that the flatness inspection was successful when height data is acquired due to halation. Since the optimal imaging conditions are determined after erroneous inspection results due to halation are removed, the optimal imaging conditions can be determined stably.
  • the component visual inspection device 81 of this embodiment it is further determined whether or not height data exists for the measurement effective area (measurement effective area A2) set within the defined lead T1, which is the measurement area. If it is determined that no height data exists in the measurement effective area A2, it is determined that the flatness inspection using the captured image has failed. On the other hand, if it is determined that height data exists in the defined lead T1, that no height data exists in the halation determination area A1, and that height data exists in the measurement effective area A2, it is determined that the flatness inspection using the captured image has been successful. Therefore, it is possible to more accurately determine whether or not valid height data has been obtained.
  • a flatness inspection is performed on each of a plurality of captured images obtained by capturing images of the electronic component 3 under each of a plurality of imaging conditions, and the imaging conditions for capturing images of the electronic component 3 with the measurement camera 54 are set based on the imaging conditions when an image for which the flatness inspection is determined to be successful is captured. Therefore, the optimal imaging conditions for the measurement camera 54 to be used for component appearance inspection can be automatically determined. This eliminates the need for the user to determine the imaging conditions through trial and error, eliminating the hassle of determining the optimal imaging conditions.
  • the optimal imaging conditions are determined by defining the median value of the "OK" range as the optimal value, but the present invention is not limited to this configuration.
  • the smallest "CPH value" within the "OK" range may be defined as the optimal value to determine the optimal imaging conditions.
  • the imaging condition setting unit 95 sets the imaging conditions when the electronic component 3 is imaged by the measurement camera 54, but this configuration is not limited to this.
  • the user may set the imaging conditions when the electronic component 3 is imaged by the measurement camera 54 based on the results of the flatness measurement without relying on the imaging condition setting unit 95.
  • the component appearance inspection device 81 is embodied as a part of the component mounter 11, but this is not limited to this configuration.
  • the component appearance inspection device 81 may be embodied as a part of a substrate-related device other than the component mounter 11. That is, in this embodiment, the automatic imaging condition determination program is stored in the component mounter 11, and the control device 61 of the component mounter 11 is configured to execute this program, but this is not limited to this configuration.
  • the automatic imaging condition determination program may be stored in a substrate-related device other than the component mounter 11, and the control device of the substrate-related device may be configured to execute this program.
  • the automatic imaging condition determination program may be stored in a production management computer, and the production management computer may be configured to execute this program.
  • the part appearance inspection device 81 performs a halation judgment to determine whether height data exists, and a measurement effective area judgment to determine whether height data exists for the measurement effective area, but this configuration is not limited to this.
  • the part appearance inspection device 81 may perform only one of the halation judgment and the measurement effective area judgment.
  • flatness inspection was performed for each of the multiple captured images obtained by capturing images of the electronic component 3 under each of two imaging conditions (shutter speed and imaging mode), but this is not limited to the configuration.
  • flatness inspection may be performed under three or more imaging conditions by adding another imaging condition to the shutter speed and imaging mode.
  • Electronic component 4 Lead terminals 52, 53 as specific parts of electronic component: Projector 54 as projection device: Measurement camera 61 as imaging device: Control device 81 as information processing device: Component appearance inspection device 91: Measurement area determination unit 92: Halation determination unit 93: Success/failure determination unit 94: Measurement effective area determination unit 95: Imaging condition setting unit A1: Halation determination area A2 as halation determination area: Measurement effective area P1 as measurement effective area: Measurement point as measurement area

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Abstract

Ce dispositif d'inspection d'aspect de composant comprend un dispositif d'imagerie, un dispositif de projection et un dispositif de traitement d'informations. Le dispositif de traitement d'informations inspecte la planéité de parties spécifiques d'un composant électronique à l'aide d'une image capturée du composant électronique capturée par un dispositif d'imagerie tandis qu'une image de motif est projetée sur celui-ci. Le dispositif de traitement d'informations détermine si des données de hauteur existent dans des zones de mesure définies pour correspondre aux parties spécifiques sur l'image capturée. Le dispositif de traitement d'informations détermine également si des données de hauteur existent dans des zones de détermination de halo définies au voisinage des zones de mesure. De plus, même lorsqu'il est déterminé que des données de hauteur existent dans les zones de mesure, s'il est déterminé que des données de hauteur existent dans les zones de détermination de halo, il est déterminé que l'inspection de planéité à l'aide de l'image capturée a échoué.
PCT/JP2022/043004 2022-11-21 2022-11-21 Dispositif d'inspection d'aspect de composant et procédé d'inspection d'aspect de composant WO2024111022A1 (fr)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07120238A (ja) * 1993-10-22 1995-05-12 Mazda Motor Corp 三次元測定器による測定方法
JP2001150646A (ja) * 1999-11-24 2001-06-05 Dainippon Printing Co Ltd 外観検査装置
JP2011220934A (ja) * 2010-04-13 2011-11-04 Ckd Corp 三次元計測装置及び基板検査装置
JP2019190917A (ja) * 2018-04-20 2019-10-31 株式会社キーエンス 形状測定装置、形状測定方法、形状測定プログラム及びコンピュータで読み取り可能な記録媒体並びに記録した機器

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07120238A (ja) * 1993-10-22 1995-05-12 Mazda Motor Corp 三次元測定器による測定方法
JP2001150646A (ja) * 1999-11-24 2001-06-05 Dainippon Printing Co Ltd 外観検査装置
JP2011220934A (ja) * 2010-04-13 2011-11-04 Ckd Corp 三次元計測装置及び基板検査装置
JP2019190917A (ja) * 2018-04-20 2019-10-31 株式会社キーエンス 形状測定装置、形状測定方法、形状測定プログラム及びコンピュータで読み取り可能な記録媒体並びに記録した機器

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