WO2019192529A1 - 显示基板及其制备方法、显示装置 - Google Patents

显示基板及其制备方法、显示装置 Download PDF

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Publication number
WO2019192529A1
WO2019192529A1 PCT/CN2019/081300 CN2019081300W WO2019192529A1 WO 2019192529 A1 WO2019192529 A1 WO 2019192529A1 CN 2019081300 W CN2019081300 W CN 2019081300W WO 2019192529 A1 WO2019192529 A1 WO 2019192529A1
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Prior art keywords
openings
substrate
pixel defining
defining layer
opening
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PCT/CN2019/081300
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English (en)
French (fr)
Inventor
胡春静
侯文军
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京东方科技集团股份有限公司
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Priority to US16/616,025 priority Critical patent/US11678557B2/en
Publication of WO2019192529A1 publication Critical patent/WO2019192529A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/88—Dummy elements, i.e. elements having non-functional features
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment

Definitions

  • the present disclosure relates to the field of display technologies, and in particular, to a display substrate, a method for fabricating the same, and a display device.
  • the OLED device includes an anode, at least one organic layer, a cathode, and the like.
  • the at least one organic layer may be one or more layers of the light-emitting layer, the hole transport layer, the electron transport layer, the hole injection layer, and the electron injection layer.
  • a display substrate in a first aspect, includes: a display area and a non-display area, the non-display area includes a dummy pixel area located around the display area; the display substrate further includes: a substrate; is disposed on the substrate and located at the a first pixel defining layer of the display area, the first pixel defining layer is provided with a plurality of first openings; and a second pixel defining layer disposed on the substrate and located in the dummy pixel region, The second pixel defining layer is provided with a plurality of second openings; wherein a volume of each of the second openings is greater than a volume of each of the first openings, and an opening area of each of the second openings is less than or equal to each of the first openings An opening area of the opening; wherein an opening area of each of the second openings is an area of each of the second openings located in a plane of the second pixel defining layer away from a surface of the substrate, each of the The opening area of
  • the surface of the second pixel defining layer away from the substrate is in the same plane as the surface of the first pixel defining layer away from the substrate.
  • each of the plurality of first openings and the plurality of second openings are arranged in a matrix in a plane defined by the first direction and the second direction, the first direction and the The second direction is perpendicular; wherein, in the first direction, the spacing between any two adjacent openings is the same; in the second direction, the spacing between any two adjacent openings is the same.
  • each of the second openings is located in a shape of a plane in which the second pixel defining layer is away from a surface of the substrate, and each of the first openings is located away from the first pixel defining layer
  • the plane of the surface of the substrate has the same shape.
  • each of the first openings is gradually reduced in a direction toward the substrate; each of the second openings includes a first sub-opening, and is located at the first sub-opening a second sub-opening away from a side of the substrate and in communication with the first sub-opening; wherein a cross-sectional area of the second sub-opening is gradually decreased in a direction close to the substrate, the first The cross-sectional area of one of the sub-openings is gradually increased, and the minimum cross-sectional area of the second sub-opening is the same as the minimum cross-sectional area of the first sub-opening.
  • a height of the first sub-opening is the same as a height of the second sub-opening, a volume of the first sub-opening and the second sub-opening The volume is equal.
  • the cross-sectional area of each of the first openings gradually decreases in a direction close to the substrate, and the cross-sectional area of the second openings gradually increases.
  • the first pixel defining layer and the second pixel defining layer are both photoresist layers.
  • a display device in a second aspect, includes the display substrate of the first aspect.
  • a method of preparing a display substrate includes: forming a first pixel defining layer on a portion of the substrate located in the display region, forming a plurality of first openings in the first pixel defining layer; and on a portion of the substrate located in the non-display region Forming a second pixel defining layer, forming a plurality of second openings in the second pixel defining layer; a volume of each of the second openings is greater than a volume of each of the first openings, and an opening area of each of the second openings An opening area smaller than or equal to each of the first openings; wherein an opening area of each of the second openings is a surface of each of the second openings that is located away from the substrate The area of the plane, the opening area of each of the first openings is an area of each of the first openings located in a plane of the first pixel defining layer away from the surface of the substrate; using an inkjet printing process, At least one organic layer is formed in
  • the forming a first pixel defining layer on a portion of the substrate located in the display region, and forming a plurality of first openings in the first pixel defining layer including: a portion of the substrate located in the display region Coating a photoresist layer; exposing and developing the photoresist layer to form a first pixel defining layer provided with the plurality of first openings.
  • the forming a second pixel defining layer on a portion of the substrate that is located on a non-display area, and forming a plurality of second openings in the second pixel defining layer including: on the substrate a portion of the non-display area is coated with a negative photoresist layer; the negative photoresist layer is exposed and developed to form a plurality of first sub- openings; and the negative photoresist layer is away from the Coating a positive photoresist layer on the surface of the substrate and the plurality of first sub-opens; exposing and developing the positive photoresist layer to form a second portion provided with the plurality of second openings
  • the material of the first pixel defining layer is the same as the material of the second pixel defining layer, and the first pixel defining layer and the second pixel defining layer are formed in a single fabrication process.
  • FIG. 1 is a top plan view of a display substrate in accordance with some embodiments of the present disclosure.
  • FIG. 2 is a cross-sectional view showing an AA' direction in the display substrate shown in FIG. 1;
  • FIG. 3 is a cross-sectional view showing a BB' direction in the display substrate shown in FIG. 1;
  • FIG. 4 is a cross-sectional view showing another BB' direction in the display substrate shown in FIG. 1;
  • FIG. 5 is a schematic flow chart of a method for preparing a display substrate according to some embodiments of the present disclosure
  • FIG. 6 is a flow diagram of preparing a first pixel defining layer in accordance with some embodiments of the present disclosure
  • FIG. 7 is a flow diagram of preparing a second pixel defining layer in accordance with some embodiments of the present disclosure.
  • FIGS. 8a-8d are schematic diagrams showing steps of preparing a second pixel defining layer according to some embodiments of the present disclosure.
  • FIG. 9 is a schematic structural diagram of a display device according to some embodiments of the present disclosure.
  • the display substrate includes: a display area 10 and a non-display area 20, and the non-display area 20 includes a virtual pixel area 22 located around the display area 10 (FIG. 1). a portion between the dotted lines outside the display area 10; the display substrate further includes a substrate 4; a first pixel defining layer 11 disposed on the substrate 4 and located in the display area 10, the first pixel defining layer 11 being provided with a plurality of a first opening 110; and a second pixel disposed on the substrate 4 and located in the dummy pixel region 22 defines a layer 21, and the second pixel defining layer 21 is provided with a plurality of second openings 210.
  • the volume of each of the second openings 210 is greater than the volume of each of the first openings 110, and the opening area of the second openings 210 is less than or equal to the opening area of the first openings 110; the opening area of each of the second openings 210 is each The two openings 210 are located in an area of the plane of the second pixel defining layer 21 away from the surface of the substrate 4, and the opening area of each of the first openings 110 is such that each of the first openings 110 is located on the surface of the first pixel defining layer 11 away from the substrate 4. The area of the plane.
  • the plurality of first openings 110 in the first pixel defining layer 11 and the plurality of sub-pixels in the display area 10 are in one-to-one correspondence
  • the second pixels defining the plurality of second openings 210 and the dummy pixel regions 22 in the layer 21 The plurality of sub-pixels are in one-to-one correspondence, wherein the structure of each sub-pixel in the virtual pixel region 22 is the same as the structure of each sub-pixel in the display region 10, but since the dummy pixel region 22 is in the non-display region 20, the dummy pixel region 22 Each sub-pixel does not participate in the display.
  • a display device is generally provided in each of the sub-pixels.
  • the display substrate is an OLED substrate, and an OLED device is disposed as a display device in each sub-pixel of the OLED substrate.
  • the OLED device includes an anode, at least one organic layer, and a cathode; wherein at least one of the organic layers includes at least a light-emitting layer.
  • the anode is generally formed prior to the pixel defining layer, and the organic layer is formed within the plurality of openings of the pixel defining layer (the opening includes the first opening 110 and the second opening 210).
  • an anode is formed first, and then a first pixel defining layer 11 is formed, the edge of the anode may extend below the first pixel defining layer 11, and then the first pixel defines the layer 11
  • An organic layer is formed in the first openings 110.
  • an anode is formed first, and then a second pixel defining layer 21 is formed, and an edge of the anode may extend below the second pixel defining layer 21, and then a plurality of layers defining the layer 21 in the second pixel
  • An organic layer is formed in the second opening 210.
  • the display substrate is a Quantum Dot Light Emitting Diodes (QLED) substrate, or a substrate such as a color filter substrate that needs to be formed by an inkjet printing process, and is also allowed.
  • QLED Quantum Dot Light Emitting Diodes
  • some embodiments of the present disclosure may utilize the plurality of sub-pixels located in the edge region of the display substrate in the virtual pixel region 22 after the plurality of sub-pixels for non-display are disposed in the virtual pixel region 22 around the display region.
  • the problem that the drying speed of the organic solvent in the edge region of the display region 10 is faster than the drying rate of the organic solvent in the intermediate region is improved to some extent.
  • Some embodiments of the present disclosure may utilize each of the second openings 210 in the process of inkjet printing of the organic solvent to form the organic layer by setting the volume of each of the second openings 210 to be larger than the volume of each of the first openings 110.
  • An opening 110 holds more organic solvent, thereby enabling the dummy pixel region 22 to provide a sufficient solvent atmosphere for the edge region in the display region 10 to ensure the drying rate of the organic solvent in the edge region of the display region 10 and the organic solvent in the middle region thereof. The drying speed tends to be the same.
  • Gs (5.38+4.1u) P v FM 1/2 (Gs is the evaporation amount of the organic solvent; u is the dry ambient air flow rate, and P v is the saturated vapor pressure of the organic solvent) ; F organic solvent exposed area; M is the molecular weight of the organic solvent) It is known that the evaporation amount of the organic solvent is related to the exposed area of the organic solvent. Since the organic solvent is printed in each opening of the pixel defining layer, the evaporation amount of the organic solvent is actually related to the opening area of the corresponding opening.
  • Some embodiments of the present disclosure may cause the evaporation rate of the organic solvent contained in each of the second openings 210 to be no more than each by controlling the opening area of each of the second openings 210 to be less than or equal to the opening area of each of the first openings 110.
  • the evaporation rate of the organic solvent in the first opening 110 enables the solvent atmosphere in the edge region of the display region 10 to be always provided by the organic solvent in each of the second openings 210 during the drying of the organic solvent in each of the first openings 110. .
  • the display substrate provided by some embodiments of the present disclosure, by disposing the first pixel defining layer 11 in the display region 10, disposing the second pixel defining layer 21 in the dummy pixel region 22, and causing each of the second pixel defining layer 21
  • the volume of the second openings 210 is greater than the volume of each of the first openings 110 in the first pixel defining layer 11, and each of the second openings 210 may be made relatively opposite each other during the inkjet printing of the organic solvent to form the organic layer.
  • An opening 110 holds more organic solvent to provide a sufficient solvent atmosphere for the edge regions in the display region 10, so that the drying speed of the organic solvent in each of the first openings 110 in the edge regions in the display region 10 is lowered. That is, the drying speed of the organic solvent in the edge region in the display region 10 tends to coincide with the drying speed of the organic solvent in the intermediate portion.
  • the display substrate provided by some embodiments of the present disclosure can make the organic solvent contained in each of the second openings 210 by making the opening area of each of the second openings 210 smaller than or equal to the opening area of each of the first openings 110.
  • the evaporation rate is not greater than the evaporation rate of the organic solvent in each of the first openings 110, thereby ensuring that the organic solvent in each of the second openings 210 in the dummy pixel region 22 is utilized in the process of drying the organic solvent in each of the first openings 110.
  • the edge region in the display region 10 always provides a solvent atmosphere, thereby increasing the film thickness uniformity of the organic layer in each of the sub-pixels in the edge region and the intermediate region of the display region 10.
  • each sub-pixel in the dummy pixel region 22 is the same as the structure of each sub-pixel in the display region 10, the surface of the second pixel defining layer 21 away from the substrate 4 is away from the first pixel defining layer 11
  • the surface of the substrate 4 is in the same plane, that is, the height of the second opening 210 is equal to the height of the first opening 110 when the surface of the substrate 4 is used as a reference surface.
  • printing can be simultaneously performed by using a plurality of nozzles that are continuously disposed, which not only improves printing efficiency, but also reduces printing complexity. That is, the problem that multiple special printing is required due to the fact that the second opening 210 and the first opening 110 are not at the same height occurs.
  • each of the plurality of first openings 110 of the first pixel defining layer 11 and the plurality of second openings 210 of the second pixel defining layer 21 is in the first direction X and the The plane defined by the two directions Y is arranged in a matrix, and the first direction X and the second direction Y are perpendicular; wherein, in the first direction X, the spacing between any adjacent two openings is the same; in the second direction Y, The spacing between any two adjacent openings is the same.
  • the plurality of nozzles that are continuously disposed, whether printing in the first direction X or the second direction Y, can accurately drop the organic solvent ejected from each nozzle into the corresponding plurality of first openings 110 and/or Within the plurality of second openings 210, it is advantageous to improve the printing accuracy of inkjet printing.
  • each of the second openings 210 is located in a shape of a plane in which the second pixel defining layer 21 is away from the surface of the substrate 4, and each of the first openings 110 is located on a surface of the first pixel defining layer 11 away from the substrate 4.
  • the shape of the plane is the same. This makes the organic solvent falling into the first opening 110 and the second opening 210 more uniform during the ink jet printing, and the uniformity of the film thickness of the organic layer in each opening can be further ensured.
  • the shape of each second opening 210 located on a plane of the surface of the second pixel defining layer 21 away from the substrate 4 may be selected according to actual needs, such as a circle, a square, a diamond, or a rectangle, etc. The embodiment does not limit this.
  • the cross-sectional area of each of the first openings 110 gradually decreases in a direction close to the substrate 4. That is, the cross-sectional area of each of the first openings 110 parallel to the surface of the substrate 4 is gradually reduced.
  • the cross-sectional shape of each of the first openings 110 perpendicular to the surface of the substrate 4 is inverted trapezoidal. As shown in FIG.
  • each of the second openings 210 includes a first sub-opening 211, and a second sub-opening 212 located at a side of the first sub-opening 211 away from the substrate 4 and communicating with the first sub-opening 110, wherein In a direction close to the substrate 4, the cross-sectional area of the second sub-opening 212 gradually decreases, the cross-sectional area of the first sub-opening 211 gradually increases, and the minimum cross-sectional area of the second sub-opening 212 and the minimum cross-section of the first sub-opening 211 The area is the same. That is, the cross-sectional area of each of the first sub-openings 211 parallel to the surface of the substrate 4 is gradually increased.
  • each of the first sub-openings 211 perpendicular to the surface of the substrate 4 is trapezoidal; each of the second sub-openings 212 is parallel.
  • the cross-sectional area of the surface of the substrate 4 is gradually reduced.
  • the cross-sectional shape of each of the second sub-openings 212 perpendicular to the surface of the substrate 4 is inverted trapezoidal.
  • the display substrate of some embodiments is also disclosed such that the volume of each of the second openings 210 is greater than the volume of each of the first openings 110, thereby ensuring that each of the second openings 210 can hold more of each of the first openings 110.
  • the organic solvent facilitates the organic solvent in each of the second openings 210 of the dummy pixel region 22 to provide a sufficient solvent atmosphere for the plurality of first openings 110 in the edge regions of the display region 10.
  • each first sub- The volume of the opening 211 is equal to the volume of each of the second sub-openings 212.
  • the first sub-opening 211 and the second sub-opening 212 in each of the second openings 210 are symmetrically disposed along the interface of the two, and the second pixel defining layer 21 is more easily fabricated in the process.
  • the cross-sectional area of each of the first openings 110 gradually decreases in a direction close to the substrate 4, for example, a cross section of each of the first openings 110 perpendicular to the surface of the substrate 4.
  • the shape is inverted trapezoidal.
  • the cross-sectional area of the second opening 210 gradually increases in a direction close to the substrate 4.
  • the cross-sectional shape of each of the second openings 210 perpendicular to the surface of the substrate 4 is trapezoidal. It is also allowed.
  • the cross-sectional area of each of the second openings 210 is larger than the cross-sectional area of each of the first openings 110, and therefore, the volume of each of the second openings 210 is larger than the volume of each of the first openings 110.
  • the shape of each of the second openings 210 is exactly the shape in which each of the first openings 110 is inverted, which makes it easy to fabricate the second pixel defining layer 21 in the process.
  • the first pixel defining layer 11 and the second pixel defining layer 21 are both photoresist layers.
  • the photoresist may comprise a positive photoresist or a negative photoresist.
  • Some embodiments of the present disclosure provide a display device, as shown in FIG. 9, which includes the display substrate 7 described above.
  • the display device 8 has the same technical effects as the above display substrate, and details are not described herein again.
  • Some examples of the present disclosure provide a method of preparing a display substrate.
  • the preparation method includes S100 to S300.
  • a first pixel defining layer 11 is formed on a portion of the substrate 4 located on the display region 10, and a plurality of first openings 110 are formed in the first pixel defining layer 11.
  • a second pixel defining layer 21 is formed on a portion of the non-display area 20 where the substrate 4 is located, and a plurality of second openings 210 are formed in the second pixel defining layer 21.
  • the volume of each of the second openings 210 is greater than the volume of each of the first openings 110, and the opening area of each of the second openings 210 is less than or equal to the opening area of each of the first openings 110; wherein, each of the second openings 210
  • the opening area is an area of each of the second openings 210 located in a plane of the second pixel defining layer 21 away from the surface of the substrate 4, and the opening area of each of the first openings 110 is located at the first pixel defining layer 11 for each of the first openings 110. The area away from the plane of the surface of the substrate 4.
  • the first pixel defining layer 11 and the second pixel defining layer 21 are both photoresists and are formed by exposure and development processes, respectively.
  • a first pixel defining layer 11 is formed on a portion of the substrate 4 located on the display region 10, and a plurality of first openings 110 are formed in the first pixel defining layer 11, including S110 ⁇ S120.
  • a photoresist layer is coated on a portion of the substrate 4 located on the display region.
  • a second pixel defining layer 21 is formed on a portion of the substrate 4 located on the non-display area 20, and a plurality of second portions are formed in the second pixel defining layer 21.
  • the opening 210 includes S210 to S240.
  • a negative photoresist layer 30 is coated on a portion of the substrate 4 located on the non-display area 20, as shown in FIG. 8a.
  • a positive photoresist layer 31 is coated on the surface of the negative photoresist layer 30 away from the substrate 4 and the plurality of first sub- openings 211, as shown in FIG. 8c.
  • the negative photoresist can generate an actinic reaction under ultraviolet light irradiation, the polymer compound is crosslinked into a molecular structure insoluble in the alkaline developing solution, and therefore, an optional negative photoresist Layer 30 is exposed to ultraviolet light.
  • a mask 5 is disposed on the side of the negative photoresist layer 30 away from the substrate 4 to utilize the mask 5 for the negative photoresist layer 30. Exposure. After exposure by ultraviolet light, the unexposed areas of the negative photoresist layer 30 are dissolved in the developer, and the exposed areas of the negative photoresist layer 30 are insoluble in the developer.
  • the positive photoresist layer 31 is coated on the surface of the negative photoresist layer 30 away from the substrate 4 and the plurality of first sub- openings 211. Since the principle of exposure development of the positive photoresist layer 31 is similar to that of the negative photoresist 30, that is, after the positive photoresist layer 31 is exposed through the mask, the exposed region thereof is dissolved in the developer, and The unexposed areas are insoluble in the developer, both of which require exposure by light and development etching. Therefore, by performing the exposure development on the positive photoresist layer 31, a pattern as shown in FIG.
  • each of the second openings 210 It is composed of a first sub-opening 211 and a second sub-opening 212.
  • the foregoing is only one of the methods for preparing the second pixel defining layer 21, and may be a normal mask or a half according to the material of the second pixel defining layer 21 and the structure of the corresponding second opening 210.
  • a tone mask was used for the preparation.
  • the same is true for the first pixel defining layer 11, and the material thereof may be a positive photoresist or a negative photoresist.
  • the first pixel defining layer 11 and the second pixel defining layer 21 are made of the same material, and the first pixel defining layer 11 and the second pixel defining layer 21 can be simultaneously formed and formed in one preparation process to simplify the display substrate. Production process.
  • the materials for forming the first pixel defining layer 11 and the second pixel defining layer 21 are different, the two may be separately prepared.

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Abstract

一种显示基板，包括：显示区和非显示区，非显示区包括位于显示区周边的虚拟像素区；显示基板还包括：衬底；设置于衬底上且位于显示区的第一像素界定层，第一像素界定层设置有多个第一开口；设置于衬底上且位于虚拟像素区的第二像素界定层，第二像素界定层设置有多个第二开口；每个第二开口的容积大于每个第一开口的容积，每个第二开口的开口面积小于或等于每个第一开口的开口面积。

Description

显示基板及其制备方法、显示装置
本申请要求于2018年04月04日提交中国专利局、申请号为201810305257.6、名称为“一种OLED基板及其制备方法、显示装置”的中国专利申请的优先权和权益，其全部内容通过引用结合在本申请中。
技术领域
本公开涉及显示技术领域，尤其涉及一种显示基板及其制备方法、显示装置。
背景技术
有机电致发光二极管(Organic Light-Emitting Diode，简称OLED)显示基板中，OLED器件包括阳极、至少一层有机层和阴极等。其中，至少一层有机层可以为发光层、空穴传输层、电子传输层、空穴注入层和电子注入层中的一层或多层。在使用喷墨打印工艺形成有机层时，需先在衬底上形成像素界定层，然后将有机溶剂打印到像素界定层的多个开口内。
发明内容
第一方面，提供一种显示基板。所述显示基板包括：显示区和非显示区，所述非显示区包括位于所述显示区周边的虚拟像素区；所述显示基板还包括：衬底；设置于所述衬底上且位于所述显示区的第一像素界定层，所述第一像素界定层设置有多个第一开口；以及，设置于所述衬底上且位于所述虚拟像素区的第二像素界定层，所述第二像素界定层设置有多个第二开口；其中，每个第二开口的容积大于每个第一开口的容积，且所述每个第二开口的开口面积小于或等于所述每个第一开口的开口面积；其中，所述每个第二开口的开口面积为所述每个第二开口位于所述第二像素界定层远离所述衬底的表面所在平面的面积，所述每个第一开口的开口面积为所述每个第一开口位于所述第一像素界定层远离所 述衬底的表面所在平面的面积。
在一些实施例中，所述第二像素界定层远离所述衬底的表面与所述第一像素界定层远离所述衬底的表面处于同一平面。
在一些实施例中，所述多个第一开口和所述多个第二开口中的各开口在由第一方向和第二方向限定的平面内呈矩阵排布，所述第一方向和所述第二方向垂直；其中，沿第一方向，任意相邻的两个开口之间的间距相同；沿第二方向，任意相邻的两个开口之间的间距相同。
在一些实施例中，所述每个第二开口位于所述第二像素界定层远离所述衬底的表面所在平面的形状，和所述每个第一开口位于所述第一像素界定层远离所述衬底的表面所在平面的形状相同。
在一些实施例中，沿靠近所述衬底的方向，所述每个第一开口的截面积逐渐减小；所述每个第二开口包括第一子开口，以及位于所述第一子开口远离所述衬底一侧且与所述第一子开口相连通的第二子开口；其中，沿靠近所述衬底的方向，所述第二子开口的截面面积逐渐减小，所述第一子开口的截面积逐渐增大，所述第二子开口的最小截面积与所述第一子开口的最小截面积相同。
在一些实施例中，在所述每个第二开口中，所述第一子开口的高度与所述第二子开口的高度相同，所述第一子开口的容积和所述第二子开口的容积相等。
在一些实施例中，沿靠近所述衬底的方向，所述每个第一开口的截面积逐渐减小，所述第二开口的截面积逐渐增大。
在一些实施例中，所述第一像素界定层和所述第二像素界定层均为光刻胶层。
第二方面，提供一种显示装置。所述显示装置包括第一方面所述的显示基板。
第三方面，提供一种显示基板的制备方法。所述制备方法包括：在衬底位于显示区的部分上形成第一像素界定层，在所述第一像素界定层 中形成多个第一开口；在所述衬底位于非显示区的部分上形成第二像素界定层，在所述第二像素界定层中形成多个第二开口；每个第二开口的容积大于每个第一开口的容积，且所述每个第二开口的开口面积小于或等于所述每个第一开口的开口面积；其中，所述每个第二开口的开口面积为所述每个第二开口位于所述第二像素界定层远离所述衬底的表面所在平面的面积，所述每个第一开口的开口面积为所述每个第一开口位于所述第一像素界定层远离所述衬底的表面所在平面的面积；采用喷墨打印工艺，在所述每个第二开口和所述每个第一开口内形成至少一层有机层。
在一些实施例中，所述在衬底位于显示区的部分上形成第一像素界定层，在所述第一像素界定层中形成多个第一开口，包括：在衬底位于显示区的部分上涂覆光刻胶层；对所述光刻胶层进行曝光和显影，形成设置有所述多个第一开口的第一像素界定层。
在一些实施例中，所述在所述衬底位于非显示区的部分上形成第二像素界定层，在所述第二像素界定层中形成多个第二开口，包括：在所述衬底位于非显示区的部分上涂覆负性光刻胶层；对所述负性光刻胶层进行曝光和显影，形成多个第一子开口；在所述负性光刻胶层远离所述衬底的表面以及所述多个第一子开口内涂覆正性光刻胶层；对所述正性光刻胶层进行曝光和显影，形成设置有所述多个第二开口的第二像素界定层，其中，每个第二开口由一个第一子开口和第一第二子开口连通构成。
在一些实施例中，所述第一像素界定层的材料与所述第二像素界定层的材料相同，所述第一像素界定层和所述第二像素界定层在一次制备工艺中形成。
附图说明
为了更清楚地说明本公开一些实施例中的技术方案，下面将对本公开一些实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附 图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为根据本公开一些实施例的一种显示基板的俯视示意图；
图2为图1所示显示基板中一种AA′向的剖视示意图；
图3为图1所示显示基板中一种BB′向的剖视示意图；
图4为图1所示显示基板中另一种BB′向的剖视示意图；
图5为根据本公开一些实施例的一种显示基板制备方法的流程示意图；
图6为根据本公开一些实施例中制备第一像素界定层的流程示意图；
图7为根据本公开一些实施例中制备第二像素界定层的流程示意图；
图8a-图8d为根据本公开一些实施例的第二像素界定层的制备步骤示意图；
图9为根据本公开一些实施例的一种显示装置的结构示意图。
具体实施方式
下面将结合本公开一些实施例中的附图，对本公开一些实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本公开一部分实施例，而不是全部的实施例。基于本公开中的一些实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。
本公开一些实施例提供了一种显示基板，如图1所示，该显示基板包括：显示区10和非显示区20，非显示区20包括位于显示区10周边的虚拟像素区22(图1中显示区10外侧虚线框中间的部分)；显示基板还包括衬底4；设置于衬底4上且位于显示区10的第一像素界定层11，该第一像素界定层11设置有多个第一开口110；以及，设置于衬底4上且位于虚拟像素区22的第二像素界定层21，该第二像素界定层21设置 有多个第二开口210。
每个第二开口210的容积大于每个第一开口110的容积，且第二开口210的开口面积小于或等于第一开口110的开口面积；每个第二开口210的开口面积为每个第二开口210位于第二像素界定层21远离衬底4的表面所在平面的面积，每个第一开口110的开口面积为每个第一开口110位于第一像素界定层11远离衬底4的表面所在平面的面积。
需要说明的是，第一像素界定层11中的多个第一开口110和显示区10的多个子像素一一对应，第二像素界定层21中的多个第二开口210和虚拟像素区22的多个子像素一一对应，其中，虚拟像素区22中各子像素的结构与显示区10中各子像素的结构相同，但由于虚拟像素区位22于非显示区20中，因此虚拟像素区22的各子像素并不参与显示。此外，对于显示基板而言，其每个子像素中一般都设置有显示器件。例如，显示基板为OLED基板，OLED基板的每个子像素中均设置有OLED器件作为显示器件。OLED器件包括阳极、至少一层有机层、阴极；其中，至少一层有机层至少包括发光层。阳极一般先于像素界定层形成，有机层形成于像素界定层的多个开口(该开口包括第一开口110和第二开口210)内。即，对于显示区10的多个子像素而言，先形成阳极，然后形成第一像素界定层11，阳极的边缘可延伸至第一像素界定层11下方，之后在第一像素界定层11的多个第一开口110内形成有机层。对于虚拟像素区22的多个子像素而言，先形成阳极，然后形成第二像素界定层21，阳极的边缘可延伸至第二像素界定层21下方，之后在第二像素界定层21的多个第二开口210内形成有机层。
当然，在一些实施例中，上述显示基板为量子点发光二极管(Quantum Dot Light Emitting Diodes，简称QLED)基板，或彩膜基板等需要采用喷墨打印工艺制作形成的基板，也均是允许的，本公开一些实施例对此不作限定。
可以理解的是，本公开一些实施例在显示区周边的虚拟像素区22设 置非显示用的多个子像素后，可以利用虚拟像素区22中的位于显示基板边缘区域的该多个子像素，在喷墨打印有机溶剂形成有机层的过程中，在一定程度上改善显示区10中边缘区域有机溶剂的干燥速度比其中间区域有机溶剂的干燥速度快的问题。
但是，由于虚拟像素区22在显示基板中所占的区域有限，因此，
本公开一些实施例通过设置每个第二开口210的体积大于每个第一开口110的体积，可以在喷墨打印有机溶剂形成有机层的过程中，利用每个第二开口210相对每个第一开口110盛放更多的有机溶剂，从而使得虚拟像素区22能够为显示区10中的边缘区域提供充足的溶剂氛围，以确保显示区10中边缘区域有机溶剂的干燥速度与其中间区域有机溶剂的干燥速度趋于一致。
在此基础上，根据马扎克公式，Gs＝(5.38+4.1u)P vFM 1/2(Gs为有机溶剂蒸发量；u为干燥环境空气流动速率,P v为有机溶剂的饱和蒸汽压；F有机溶剂敞露面积；M为有机溶剂分子量)可知，有机溶剂的蒸发量与有机溶剂的敞露面积有关。由于有机溶剂打印在像素界定层的各开口中，因此有机溶剂的蒸发量实际上是与对应开口的开口面积有关。本公开一些实施例通过控制每个第二开口210的开口面积小于或等于每个第一开口110的开口面积，可以使得每个第二开口210内盛放的有机溶剂的蒸发速度不大于每个第一开口110内有机溶剂的蒸发速度，从而能够在干燥各第一开口110内的有机溶剂的过程中，利用各第二开口210内的有机溶剂一直为显示区10中的边缘区域提供溶剂氛围。
由上，本公开一些实施例提供的显示基板，通过在显示区10设置第一像素界定层11，在虚拟像素区22设置第二像素界定层21，并使第二像素界定层21中的每个第二开口210的容积大于第一像素界定层11中的每个第一开口110的容积，可在喷墨打印有机溶剂形成有机层的过程中，使每个第二开口210相对每个第一开口110盛放更多的有机溶剂，从而为显示区10中的边缘区域提供充足的溶剂氛围，以使得显示区10 中的边缘区域的各第一开口110中的有机溶剂的干燥速度降低，即显示区10中边缘区域有机溶剂的干燥速度与其中间区域有机溶剂的干燥速度趋于一致。
并且，本公开一些实施例提供的显示基板通过使每个第二开口210的开口面积小于或等于每个第一开口110的开口面积，可使每个第二开口210内盛放的有机溶剂的蒸发速度不大于每个第一开口110内有机溶剂的蒸发速度，从而保证在干燥各第一开口110内的有机溶剂的过程中，利用虚拟像素区22中各第二开口210内的有机溶剂为显示区10中的边缘区域一直提供溶剂氛围，进而提高显示区10中边缘区域和其中间区域各子像素内的有机层的膜厚均一性。
可以理解的是，由于虚拟像素区22中各子像素的结构与显示区10中各子像素的结构相同，因此，第二像素界定层21远离衬底4的表面与第一像素界定层11远离衬底4的表面处于同一平面，也即，在以衬底4的表面为基准面时，第二开口210的高度和第一开口110的高度相等。这样在对各第二开口210和各第一开口110进行喷墨打印有机溶剂的过程中，可以采用连续设置的多个喷嘴同时进行打印，不仅提高了打印效率，而且能够降低打印的复杂度，即避免因第二开口210和第一开口110不在同一高度而出现需要多次专门打印的问题。
可选的，如图1所示，第一像素界定层11的多个第一开口110和第二像素界定层21的多个第二开口210中的各开口，在由第一方向X和第二方向Y限定的平面内呈矩阵排布，第一方向X和第二方向Y垂直；其中，沿第一方向X，任意相邻的两个开口之间的间距相同；沿第二方向Y，任意相邻的两个开口之间的间距相同。
基于上述结构，连续设置的多个喷嘴不管是沿第一方向X还是第二方向Y进行打印，都可使各喷嘴喷出的有机溶剂精确的落入对应的多个第一开口110和/或多个第二开口210内，有利于提高喷墨打印的打印精度。
在一些实施例中，每个第二开口210位于第二像素界定层21远离衬底4的表面所在平面的形状，和每个第一开口110位于第一像素界定层11远离衬底4的表面所在平面的形状相同。这使得在喷墨打印的过程中，落入第一开口110和第二开口210内的有机溶剂更加均匀，能够进一步保证各开口内有机层膜厚的均一性。可选的，每个第二开口210位于第二像素界定层21远离衬底4的表面所在平面的形状可以根据实际需要选择设定，例如为圆形、方形、菱形或矩形等，本公开一些实施例对此不作限定。
值得一提的是，在一些实施例中，如图2所示，沿靠近衬底4的方向，每个第一开口110的截面积逐渐减小。即每个第一开口110平行于衬底4表面的截面积逐渐减小，例如每个第一开口110垂直于衬底4表面的截面形状呈倒梯形。如图3所示，每个第二开口210包括第一子开口211，以及位于第一子开口211远离衬底4一侧且与第一子开口110相连通的第二子开口212，其中，沿靠近衬底4的方向，第二子开口212的截面积逐渐减小，第一子开口211的截面积逐渐增大，第二子开口212的最小截面积与第一子开口211的最小截面积相同。即，每个第一子开口211平行于衬底4表面的截面积逐渐增大，例如每个第一子开口211垂直于衬底4表面的截面形状呈梯形；每个第二子开口212平行于衬底4表面的截面积逐渐减小，例如每个第二子开口212垂直于衬底4表面的截面形状呈倒梯形。
基于此，即使在每个第二开口210的高度和每个第一开口110的高度相等，且每个第二开口210的开口面积和每个第一开口110的开口面积相同的情况下，本公开一些实施例的显示基板也能使每个第二开口210的容积大于每个第一开口110的容积积，从而保证了每个第二开口210相对每个第一开口110能够盛放更多的有机溶剂，以便于虚拟像素区22各第二开口210内的有机溶剂能够为显示区10中边缘区域的多个第一开口110提供充足的溶剂氛围。
此外，如图3所示，在每个第二开口210中，以衬底4的表面为基准面时，第一子开口211的高度和第二子开口212的高度相同，每个第一子开口211的容积和每个第二子开口212的容积相等。这样，每个第二开口210中的第一子开口211和第二子开口212沿二者的分界面对称设置，在工艺上更容易制作出第二像素界定层21。
当然，在一些实施例中，如图2所示，沿靠近衬底4的方向，每个第一开口110的截面积逐渐减小，例如每个第一开口110垂直于衬底4表面的截面形状呈倒梯形。如图4所示，沿靠近衬底4的方向，第二开口210的截面积逐渐增大，例如每个第二开口210垂直于衬底4表面的截面形状呈梯形。也是允许的。
基于此，在第二开口210的高度和第一开口110的高度相等，且第二开口210的开口面积与第一开口110的开口面积相同的情况下，由于在平行于衬底4表面的同一截面上，每个第二开口210的截面积大于每个第一开口110的截面积，因此，每个第二开口210的容积大于每个第一开口110的容积。而且，每个第二开口210的形状正好为每个第一开口110倒置的形状，这在工艺上也容易制作第二像素界定层21。
在一些实施例中，第一像素界定层11和第二像素界定层21均为光刻胶层。这样，在制备形成第一像素界定层11和第二像素界定层21时，只需进行涂胶、曝光、显影即可，从而使其制作工艺较为简单。可选的，光刻胶可以包括正性光刻胶或负性光刻胶。
本公开一些实施例提供了一种显示装置，如图9所示，该显示装置8包括上述的显示基板7。该显示装置8具有与上述显示基板相同的技术效果，在此不再赘述。
本公开一些实例提供了一种显示基板的制备方法，请参阅图1和图5，该制备方法包括S100～S300。
S100，在衬底4位于显示区10的部分上形成第一像素界定层11，在第一像素界定层11中形成多个第一开口110。
S200，在衬底4位于的非显示区20的部分上形成第二像素界定层21，在第二像素界定层21中形成多个第二开口210。每个第二开口210的容积大于每个第一开口110的容积，且每个第二开口210的开口面积小于或等于每个第一开口110的开口面积；其中，每个第二开口210的开口面积为每个第二开口210位于第二像素界定层21远离衬底4的表面所在平面的面积，每个第一开口110的开口面积为每个第一开口110位于第一像素界定层11远离衬底4的表面所在平面的面积。
S300，采用喷墨打印工艺，在每个第二开口210和每个第一开口110内形成至少一层有机层。
本公开一些实例提供的显示基板的制备方法的有益效果与上述一些实施例提供的显示基板的有益效果相同，在此不做赘述。
需要说明的是，上述S100中制作第一像素界定层11以及其多个第一开口110的过程，和S200中制作第二像素界定层21和第二开口210的过程，并无时间上的区分；即，可以先实施S100，也可以先实施S200，当然也可以同时实施S100和S200。
在一些实施例中，第一像素界定层11和第二像素界定层21均为光刻胶，并分别通过曝光和显影工艺形成。
示例性地，如图6所示，S100中在衬底4位于显示区10的部分上形成第一像素界定层11，在第一像素界定层11中形成多个第一开口110，包括S110～S120。
S110，在衬底4位于显示区的部分上涂覆光刻胶层。
S120，对光刻胶层进行曝光和显影，形成设置有多个第一开口110的第一像素界定层11。
示例性地，请参阅图7以及图8a～图8d，S200中在衬底4位于非显示区20的部分上形成第二像素界定层21，在第二像素界定层21中形成多个第二开口210，包括S210～S240。
S210，在衬底4位于非显示区20的部分上涂覆负性光刻胶层30， 如图8a所示。
S220，对负性光刻胶层30进行曝光和显影，形成多个第一子开口211，如图8a和图8b所示。
S230，在负性光刻胶层30远离衬底4的表面以及多个第一子开口211内涂覆正性光刻胶层31，如图8c所示。
S240，对正性光刻胶层31进行曝光和显影，形成设置有多个第二开口210的第二像素界定层21，其中，每个第二开口210由一个第一子开口211和一个第二子开口212连通构成，如图8c和图8d所示。
需要说明的是，由于负性光刻胶可以在紫外光照射下产生光化反应，使得高分子化合物交联成不溶于碱性显影液的分子结构，因此，可选的，负性光刻胶层30采用紫外光进行曝光。在对负性光刻胶层30进行曝光之前，需用在负性光刻胶层30远离衬底4的一侧设置掩膜版5，以利用掩膜版5对负性光刻胶层30进行曝光。在经过紫外光曝光之后，负性光刻胶层30未被曝光的区域溶于显影液，负性光刻胶层30被曝光的区域不溶于显影液。而且，考虑到在曝光时，由于负性光刻胶30被曝光的区域的上部的曝光程度要优于下部的曝光程度，因而负性光刻胶30被曝光的区域的上部的光化反应要强于下部的光化反应。进而在对负性光刻胶层30根据其曝光程度进行显影后，最终可以形成如图8b所示的图案。
在形成多个第一子开口211之后，在负性光刻胶层30远离衬底4的表面以及多个第一子开口211内涂覆正性光刻胶层31。由于正性光刻胶层31的曝光显影原理与负性光刻胶30类似，即除了正性光刻胶层31在经过掩膜版曝光之后，其被曝光的区域溶于显影液，且其未被曝光的区域不溶于显影液之外，二者均需要利用光感曝光并显影刻蚀。因此，通过对正性光刻胶层31进行曝光显影，最终可以形成如图8d所示的图案，即在第二像素界定层21中形成多个第二开口210，使得每个第二开口210由一个第一子开口211和一个第二子开口212连通构成。
需要说明的是，上述仅为制备第二像素界定层21的其中一种方式， 实际可根据第二像素界定层21的制作材料以及对应各第二开口210的结构，采用普通掩膜版或半色调掩膜版来进行制备。当然，对于第一像素界定层11，也是如此，其材料可以为正性光刻胶，也可以为负性光刻胶。
示例性地，第一像素界定层11和第二像素界定层21采用相同的制作材料，第一像素界定层11和第二像素界定层21可以在一次制备工艺中同时制备形成，以简化显示基板的制作工艺。当然，若第一像素界定层11和第二像素界定层21的制作材料不同，二者分开进行制备即可。
在上述实施方式的描述中，具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
以上所述，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本公开的保护范围之内。因此，本公开的保护范围应以所述权利要求的保护范围为准。

Claims (13)

  1. 一种显示基板，包括：显示区和非显示区，所述非显示区包括位于所述显示区周边的虚拟像素区；
    所述显示基板还包括：
    衬底；
    设置于所述衬底上且位于所述显示区的第一像素界定层，所述第一像素界定层设置有多个第一开口；
    以及，设置于所述衬底上且位于所述虚拟像素区的第二像素界定层，所述第二像素界定层设置有多个第二开口；
    其中，每个第二开口的容积大于每个第一开口的容积，且所述每个第二开口的开口面积小于或等于所述每个第一开口的开口面积；
    其中，所述每个第二开口的开口面积为所述每个第二开口位于所述第二像素界定层远离所述衬底的表面所在平面的面积，所述每个第一开口的开口面积为所述每个第一开口位于所述第一像素界定层远离所述衬底的表面所在平面的面积。
  2. 根据权利要求1所述的显示基板，其中，所述第二像素界定层远离所述衬底的表面与所述第一像素界定层远离所述衬底的表面处于同一平面。
  3. 根据权利要求2所述的显示基板，其中，所述多个第一开口和所述多个第二开口中的各开口在由第一方向和第二方向限定的平面内呈矩阵排布，所述第一方向和所述第二方向垂直；其中，沿第一方向，任意相邻的两个开口之间的间距相同；沿第二方向，任意相邻的两个开口之间的间距相同。
  4. 根据权利要求1-3任一项所述的显示基板，其中，所述每个第二开口位于所述第二像素界定层远离所述衬底的表面所在平面的形状，和所述每个第一开口位于所述第一像素界定层远离所述衬底的表面所在平面的形状相同。
  5. 根据权利要求1-3任一项所述的显示基板，其中，
    沿靠近所述衬底的方向，所述每个第一开口的截面积逐渐减小；
    所述每个第二开口包括第一子开口，以及位于所述第一子开口远离所述衬底一侧且与所述第一子开口相连通的第二子开口；其中，沿靠近所述衬底的方向，所述第二子开口的截面积逐渐减小，所述第一子开口的截面积逐渐增大，所述第二子开口的最小截面积与所述第一子开口的最小截面积相同。
  6. 根据权利要求5所述的显示基板，其中，在所述每个第二开口中，所述第一子开口的高度与所述第二子开口的高度相同，所述第一子开口的容积和所述第二子开口的容积相等。
  7. 根据权利要求1-3任一项所述的显示基板，其中，沿靠近所述衬底的方向，所述每个第一开口的截面积逐渐减小，所述第二开口的截面积逐渐增大。
  8. 根据权利要求1所述的显示基板，其中，所述第一像素界定层和所述第二像素界定层均为光刻胶层。
  9. 一种显示装置，包括权利要求1-7任一项所述的显示基板。
  10. 一种显示基板的制备方法，包括：
    在衬底位于显示区的部分上形成第一像素界定层，在所述第一像素界定层中形成多个第一开口；
    在所述衬底位于非显示区的部分上形成第二像素界定层，在所述第二像素界定层中形成多个第二开口；
    每个第二开口的容积大于每个第一开口的容积，且所述每个第二开口的开口面积小于或等于所述每个第一开口的开口面积，其中，所述每个第二开口的开口面积为所述每个第二开口位于所述第二像素界定层远离所述衬底的表面所在平面的面积，所述每个第一开口的开口面积为所述每个第一开口位于所述第一像素界定层远离所述衬底的表面所在平面的面积；
    采用喷墨打印工艺，在所述每个第二开口和所述每个第一开口内形成至少一层有机层。
  11. 根据权利要求10所述的制备方法，其中，所述在衬底位于显示区的部分上形成第一像素界定层，在所述第一像素界定层中形成多个第一开口，包括：
    在衬底位于显示区的部分上涂覆光刻胶层；
    对所述光刻胶层进行曝光和显影，形成设置有所述多个第一开口的第一像素界定层。
  12. 根据权利要求10所述的制备方法，其中，所述在所述衬底位于非显示区的部分上形成第二像素界定层，在所述第二像素界定层中形成多个第二开口，包括：
    在所述衬底位于非显示区的部分上涂覆负性光刻胶层；
    对所述负性光刻胶层进行曝光和显影，形成多个第一子开口；
    在所述负性光刻胶层远离所述衬底的表面以及所述多个第一子开口内涂覆正性光刻胶层；
    对所述正性光刻胶层进行曝光和显影，形成设置有所述多个第二开口的第二像素界定层，其中，每个第二开口由一个第一子开口和第一第二子开口连通构成。
  13. 根据权利要求10所述的制备方法，其中，所述第一像素界定层的材料与所述第二像素界定层的材料相同，所述第一像素界定层和所述第二像素界定层在一次制备工艺中形成。
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Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108336123B (zh) 2018-04-04 2021-01-26 京东方科技集团股份有限公司 一种oled基板及其制备方法、显示装置
CN110581160B (zh) * 2019-09-19 2022-06-21 合肥京东方卓印科技有限公司 一种显示基板及其制备方法、显示装置
CN111028692A (zh) * 2019-12-26 2020-04-17 武汉天马微电子有限公司 一种显示面板和显示装置
CN111509144B (zh) * 2020-04-24 2022-09-30 合肥京东方卓印科技有限公司 Oled器件的制备方法及显示面板的制备方法
KR20210142807A (ko) * 2020-05-18 2021-11-26 삼성디스플레이 주식회사 디스플레이 장치 제조방법
TWI774143B (zh) * 2020-11-30 2022-08-11 國立清華大學 有機發光二極體及其製備方法
KR20220079758A (ko) * 2020-12-04 2022-06-14 삼성디스플레이 주식회사 표시 장치 및 그 제조 방법
CN115224224A (zh) * 2021-04-15 2022-10-21 合肥京东方卓印科技有限公司 显示基板的制作方法、显示基板及显示装置
CN113193027B (zh) * 2021-04-27 2024-06-18 京东方科技集团股份有限公司 显示面板及其制作方法、显示设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1943879A (zh) * 2005-09-08 2007-04-11 精工爱普生株式会社 膜图案的形成方法以及电子设备的制造方法
US20100193791A1 (en) * 2009-02-05 2010-08-05 Byung-Hoon Chun Organic light emitting diode display device and method of fabricating the same
US8004187B2 (en) * 2005-02-03 2011-08-23 Chunghwa Picture Tubes, Ltd. Organic electro-luminescence display having an inverted trapeziform patterned separator structure
CN104393192A (zh) * 2014-12-04 2015-03-04 京东方科技集团股份有限公司 一种像素界定层及其制作方法、显示面板、显示装置
CN108336123A (zh) * 2018-04-04 2018-07-27 京东方科技集团股份有限公司 一种oled基板及其制备方法、显示装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1905126A (zh) * 2000-11-27 2007-01-31 精工爱普生株式会社 有机电致发光装置及其电子装置
JP4459521B2 (ja) * 2002-10-17 2010-04-28 大日本印刷株式会社 エレクトロルミネッセンス表示装置
JP4251329B2 (ja) * 2005-12-20 2009-04-08 カシオ計算機株式会社 表示装置及びその製造方法
WO2015083823A1 (ja) * 2013-12-06 2015-06-11 シャープ株式会社 発光体基板、太陽電池、表示装置、照明装置、電子機器、有機ｅｌ素子、及び発光体基板の製造方法
CN104167430B (zh) * 2014-08-08 2017-04-05 京东方科技集团股份有限公司 一种有机电致发光显示面板、其制作方法及显示装置
CN104260554B (zh) * 2014-09-24 2016-03-30 京东方科技集团股份有限公司 喷墨打印方法及设备、显示基板的制作方法
KR102472642B1 (ko) * 2015-06-16 2022-11-30 삼성디스플레이 주식회사 유기 발광 표시 장치 및 이의 제조 방법
CN107331780B (zh) * 2017-05-24 2019-12-13 昆山国显光电有限公司 喷墨打印方法、显示基板及oled的制备方法
JP2019008962A (ja) * 2017-06-23 2019-01-17 株式会社Ｊｏｌｅｄ 有機ｅｌ表示パネル及び有機ｅｌ表示パネルの製造方法
CN207165575U (zh) * 2017-09-28 2018-03-30 京东方科技集团股份有限公司 像素界定层、显示基板及显示装置
CN107799577B (zh) * 2017-11-06 2019-11-05 武汉华星光电半导体显示技术有限公司 Amoled显示面板及amoled显示器
KR102484209B1 (ko) * 2017-12-22 2023-01-02 엘지디스플레이 주식회사 전계발광 표시 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8004187B2 (en) * 2005-02-03 2011-08-23 Chunghwa Picture Tubes, Ltd. Organic electro-luminescence display having an inverted trapeziform patterned separator structure
CN1943879A (zh) * 2005-09-08 2007-04-11 精工爱普生株式会社 膜图案的形成方法以及电子设备的制造方法
US20100193791A1 (en) * 2009-02-05 2010-08-05 Byung-Hoon Chun Organic light emitting diode display device and method of fabricating the same
CN104393192A (zh) * 2014-12-04 2015-03-04 京东方科技集团股份有限公司 一种像素界定层及其制作方法、显示面板、显示装置
CN108336123A (zh) * 2018-04-04 2018-07-27 京东方科技集团股份有限公司 一种oled基板及其制备方法、显示装置

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