WO2021174598A1 - 显示面板及显示面板的制备方法 - Google Patents

显示面板及显示面板的制备方法 Download PDF

Info

Publication number
WO2021174598A1
WO2021174598A1 PCT/CN2020/080113 CN2020080113W WO2021174598A1 WO 2021174598 A1 WO2021174598 A1 WO 2021174598A1 CN 2020080113 W CN2020080113 W CN 2020080113W WO 2021174598 A1 WO2021174598 A1 WO 2021174598A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
display panel
light
inorganic
encapsulation layer
Prior art date
Application number
PCT/CN2020/080113
Other languages
English (en)
French (fr)
Inventor
何超
Original Assignee
武汉华星光电半导体显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Priority to US16/756,932 priority Critical patent/US11659730B2/en
Priority to EP20726668.5A priority patent/EP4117051A4/en
Publication of WO2021174598A1 publication Critical patent/WO2021174598A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/85—Arrangements for extracting light from the devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/875—Arrangements for extracting light from the devices
    • H10K59/877—Arrangements for extracting light from the devices comprising scattering means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/875—Arrangements for extracting light from the devices
    • H10K59/878—Arrangements for extracting light from the devices comprising reflective means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/875—Arrangements for extracting light from the devices
    • H10K59/879—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • the present disclosure relates to the field of display technology, and in particular to a display panel and a manufacturing method of the display panel.
  • OLED display devices have many advantages such as thin body, self-luminous, wide viewing angle, energy saving and environmental protection, and have been widely used in various fields.
  • the organic light-emitting diode display panel is composed of a variety of film layers, such as glass substrates and functional layers. When light propagates in different layers, the light transmittance is different. Some layers have better light transmittance, and some have poor light transmittance. At the same time, when light is in When propagating in each layer, due to the influence of reflection and refraction and other factors, about 80% of the photons cannot escape into the air, which reduces the transmittance of light and reduces the display quality.
  • the present disclosure provides a display panel and a manufacturing method of the display panel, so as to solve the problem of the large loss of photons in each film layer in the existing display panel, the low light extraction efficiency and light extraction rate, and the unsatisfactory display effect and quality of the display panel. And the production process is complicated and other issues.
  • a display panel including:
  • a light-emitting layer, the light-emitting layer is disposed on the substrate;
  • An encapsulation layer is disposed on the light-emitting layer
  • the packaging layer includes a plurality of raised structures or recessed structures, and the raised structures or recessed structures are arranged on a side of the packaging layer away from the substrate.
  • a plurality of the convex structures or the concave structures are arranged in an array on the side of the packaging layer away from the substrate.
  • the top of the protruding structure is set in an arc shape.
  • the contact angle between the arc surface of the protruding structure and the surface of the encapsulation layer is 30°-70°.
  • the protruding structure is arranged in a light-emitting display area corresponding to the encapsulation layer of the display panel.
  • the distance between adjacent protrusion structures is 20 nm-100 nm.
  • the height of each convex structure or the depth of the concave structure is the same.
  • the height of the protrusion is 20 nm to 1000 nm.
  • the material of the convex structure or the concave structure includes one of acrylic resin, methacrylic resin, and isoprene resin.
  • the encapsulation layer includes at least one inorganic layer and an organic layer, and the organic layer and the inorganic layer are alternately stacked.
  • the film layer adjacent to the encapsulation layer and the light-emitting layer is configured as an inorganic layer, and the film layer on the side of the encapsulation layer away from the light-emitting layer is configured as an inorganic layer.
  • the encapsulation layer includes a first inorganic layer, a first organic layer, a second inorganic layer, a second organic layer, and a third inorganic layer, and the first inorganic layer is disposed on the light-emitting layer ,
  • the first organic layer is disposed on the first inorganic layer
  • the second inorganic layer is disposed on the first organic layer
  • the second organic layer is disposed on the second inorganic layer
  • the third inorganic layer is disposed on the second organic layer.
  • the material of the inorganic layer in the encapsulation layer includes metal oxide and non-metal oxide.
  • a method for manufacturing a display panel including the following steps:
  • S100 Provide a base substrate, and prepare a light-emitting device layer of an organic light-emitting diode on the base substrate;
  • S101 preparing an encapsulation layer on the light-emitting device layer, and at the same time, coating ink on the encapsulation layer in a regular array;
  • the ink is applied by an inkjet printing process
  • the ink material includes an organic resin material
  • the organic resin material is cured under ultraviolet light to form a polymer.
  • the ink is coated by a spraying process to form a convex structure.
  • an inorganic encapsulation layer and an organic encapsulation layer are sequentially formed on the light-emitting device layer.
  • a chemical vapor deposition method is used to form the inorganic encapsulation layer.
  • a physical vapor deposition method is used to form the inorganic encapsulation layer.
  • an atomic layer deposition method is used to form the inorganic encapsulation layer.
  • the present disclosure provides a display panel and a method for manufacturing the display panel.
  • the organic ink is ink-jet printed on the encapsulation layer of the display panel, and the organic ink is arranged in a regular array. After the organic ink is illuminated and cured, a convex structure arranged in the array is formed When light reaches the convex structure, the convex structure will re-reflect or refract the light, so that as much light as possible is emitted into the air, thereby effectively increasing the light output rate of the display panel and reducing the light output The loss between the film layers improves the display quality of the panel. At the same time, the preparation process is simple and the production cost is low.
  • FIG. 1 is a schematic diagram of each layer structure of a display panel according to an embodiment of the disclosure
  • FIG. 2 is a schematic diagram of the structure of a display panel in another embodiment of the disclosure.
  • FIG. 3 is a schematic diagram of the protrusion structure in the embodiment of the disclosure.
  • FIG. 5 is a schematic top view of the protruding structure in the embodiment of the disclosure.
  • FIG. 6 is a flow chart of the manufacturing process of the display panel in the embodiment of the disclosure.
  • FIG. 1 is a schematic diagram of the structure of each layer of a display panel according to an embodiment of the disclosure.
  • the display panel includes a base substrate 100, a light-emitting layer 101 and an encapsulation layer 102.
  • the light-emitting layer 101 is disposed on the base substrate 100, and the encapsulation layer 102 is disposed on the light-emitting layer 101.
  • a plurality of raised structures 103 are provided on the packaging layer 102, wherein the raised structures 103 are provided on the side of the packaging layer 102 away from the base substrate 100.
  • the raised structure 103 When the light passes through the raised structure 103, it will be refracted or diffused again by the raised structure 103, so that the light can be emitted from the screen in multiple directions, thereby increasing the way for the light to exit, so that the light can be diffused to the outside as much as possible , Thereby reducing the loss of light in the inner film of the display panel, and achieving the purpose of improving the utilization rate of light.
  • the base substrate 100 may also include film layers such as a base layer and a thin film transistor array substrate.
  • the thin film transistor array substrate is disposed on the base layer. It can be a double-layer flexible substrate structure, wherein the material of the substrate layer can be polyimide material to enhance the performance of the substrate.
  • the gate, source, drain of the thin film transistor and the insulating layer between the electrodes are provided, and the flat layer, the pixel definition layer and the insulating layer are provided on the insulating layer.
  • the anode layer between the flat layer and the pixel definition layer is provided.
  • the planarization layer and the pixel definition layer are patterned. During the patterning process, it can be processed through photolithography processes such as exposure, development, etching, and peeling.
  • the light-emitting layer 101 also includes other film layers such as a color resist layer.
  • the light-emitting layer 101 is disposed on the pixel definition layer. After the pixel definition layer is patterned, a number of pixel openings are formed.
  • the organic light-emitting material is vapor-deposited, and color resists of different colors, such as red color resist, blue color resist, and green color resist layers, are set on the regions corresponding to the pixel openings to realize the display function of different colors.
  • FIG. 2 is a schematic structural diagram of a display panel in another embodiment of the disclosure.
  • the display panel includes a substrate 200, a light-emitting layer 201, an encapsulation layer 20, and a protrusion structure 207.
  • the light-emitting layer 201 is disposed on the substrate 200, and the encapsulation layer 20 is disposed on the light-emitting layer 201 and covers the light-emitting layer 201.
  • the encapsulation layer 20 includes a first inorganic layer 202, a first organic layer 203, a second inorganic layer 204, a second organic layer 205, and a third inorganic layer. 206.
  • the first inorganic layer 202 is disposed on the light-emitting layer 201
  • the first organic layer 203 is disposed on the first inorganic layer 202
  • the second inorganic layer 204 is disposed on the first organic layer 203 and covers the first organic layer 203.
  • the outermost side of the encapsulation layer 20, that is, the side of the encapsulation layer 20 facing away from the light-emitting layer 201 is provided as a third inorganic layer 206.
  • the encapsulation layer 20 is formed by alternately laminating multiple organic layers and inorganic layers. In this way, the multiple inorganic and organic layers can not only effectively seal the various film layers of the display panel, and ensure the encapsulation effect of the display panel, but also The cracking of the encapsulation layer 20 is effectively suppressed, and the film performance of the encapsulation layer 20 is further enhanced.
  • the inorganic layer in the encapsulation layer 20 may include metal oxide and non-metal oxide, for example, may include one of aluminum oxide, titanium oxide, silicon oxide, and nitride, or any combination thereof.
  • the light from the light emitting layer 101 travels, it will pass through multiple different film layers and finally hit the outside.
  • the light passes through a film layer, it will be lost between the film layers, and a part of the light will eventually fail. It is emitted into the air, thereby reducing the utilization rate of light and reducing the display quality.
  • FIG. 3 is a schematic diagram of the protrusion structure in the embodiment of the disclosure.
  • the protruding structure 301 is disposed on the packaging layer 300, and the protruding structure 301 is prepared by ink, and the preparation process is simpler.
  • a plurality of raised structures 301 are provided on the outermost surface of the packaging layer 300.
  • the plurality of raised structures 301 can be arranged at equal intervals and arranged in an array on the packaging layer 300. When the array is arranged, it can be arranged in a row or column direction on the surface of the encapsulation layer 300, or arranged in a circular array.
  • the convex structure 301 makes the outermost upper surface of the encapsulation layer 300 become a rough surface, thereby improving the utilization rate of light.
  • the interval between two adjacent raised structures 301 is 20nm ⁇ 100nm.
  • the height of the raised structures 301 is preferably 20nm ⁇ At 1000 nm, the height of any one of the raised structures 301 can be the same to simplify the manufacturing process.
  • the duty ratio of the array of raised structures 301 is preferably 50%-100%, so that light can be emitted from the raised structures 301 to the outside as much as possible.
  • the top of the convex structure 301 can be set in a curved shape, which is similar to a micro lens, which can diffuse the light in a larger range, and at the same time,
  • the raised structure 301 is provided, the raised structure 301 is arranged in a display area corresponding to the display panel, so as to ensure that the display panel has the best display effect.
  • the bottom of the protrusion structure 301 is connected with the encapsulation layer 300, and the connection part can be a boss or a cylinder, and the height of the boss or the cylinder is small, and an arc is arranged on the boss or the cylinder. noodle.
  • the contact angle between the bottom of the arc surface and the boss or the encapsulation layer 300 is preferably 30° to 70°.
  • the light 304 When the light 304 reaches the encapsulation layer 300 from the light-emitting layer and enters the convex structure 301, it will be refracted or reflected by each film layer in turn. At the same time, it will be refracted again on the curved surface of the convex structure 301, and the convex structure 301 The light 304 is further extracted and the emission area of the light 304 is enlarged, thereby achieving the purpose of improving the luminous efficiency of the display panel and improving the display quality.
  • the specific shape of the protruding structure 301 is not limited to the shape and structure in the embodiment of the present disclosure.
  • the protruding structure 301 can also be configured as a combination of one or more of a recessed structure, a sawtooth structure, a semicircular structure, and a trapezoidal structure. Structure or other shape structure.
  • FIG. 4 is a schematic diagram of the protrusion structure in another embodiment of the disclosure.
  • a plurality of semicircular convex structures 401 arranged in an array are provided on the packaging layer 400.
  • FIG. 5 is a schematic top view of the protrusion structure in the embodiment of the disclosure.
  • a plurality of raised structures 501 are arranged in an array on the packaging layer 500.
  • each structure When it is configured as a recessed structure or a structure with other shapes, the depth of each structure can be the same.
  • Other shapes and structures are not described in detail here, but their purpose and functions are to guide the light in the display panel and improve the luminous area and luminous efficiency of the light emitted from the structure.
  • the material of the convex structure may be a polymer material, including acrylic resin, methacrylic resin, isoprene resin, vinyl resin, epoxy resin, polyurethane resin, cellulose resin, Perylene resins, imide resins, or mixtures of two or more thereof, such polymer materials will be cured and stabilized under light.
  • a polymer material including acrylic resin, methacrylic resin, isoprene resin, vinyl resin, epoxy resin, polyurethane resin, cellulose resin, Perylene resins, imide resins, or mixtures of two or more thereof, such polymer materials will be cured and stabilized under light.
  • FIG. 6 is a flow chart of the manufacturing process of the display panel in the embodiment of the disclosure.
  • the preparation process includes the following steps:
  • S100 Provide a base substrate, and prepare a light-emitting device layer of an organic light-emitting diode on the base substrate;
  • step S100 when the base substrate and the light-emitting device layer of the organic light-emitting diode on the base substrate are prepared, the preparation is carried out according to the existing preparation process, which will not be described in detail here.
  • S101 preparing an encapsulation layer on the light-emitting device layer, and at the same time, coating ink on the encapsulation layer in a regular array;
  • the encapsulation layer is prepared.
  • the encapsulation layer is composed of multiple organic film layers and inorganic film layers. Preferably, 3-5 layers of organic and inorganic films are stacked. Inorganic stacked structure.
  • the process of chemical vapor deposition, physical vapor deposition or atomic layer deposition can be used to sink the inorganic encapsulation layer on the light-emitting layer;
  • the organic encapsulation layer When preparing the organic encapsulation layer, it can be coated on the inorganic layer by any process of inkjet printing, spraying and coating.
  • the inorganic encapsulation layer is located on the outermost side of the entire encapsulation layer.
  • the ink is coated on the upper surface of the outermost inorganic encapsulation layer, and then the ink is processed to make the ink form the convex structure in the embodiment of the present disclosure, and the convex structure is used to improve the light-emitting effect of the display panel.
  • ink coating can be performed through an inkjet printing process, and during printing, array coating is performed. Since the ink printing process is simple, the manufacturing process of the raised structure in the embodiment of the present disclosure is simplified, thereby improving the production efficiency of the display panel. At the same time, inkjet printing supports indeterminate design, so a variety of patterns and distributions can be designed, making the design more flexible.
  • the ink When the ink is applied, it is mainly applied in the display area of the display panel.
  • the contact angle between the ink and the surface of the encapsulation layer is 30°-70°.
  • the ink After the ink is coated, ultraviolet light can be used to irradiate the light, and the ink will be cured under the ultraviolet light. After the irradiation is completed, the ink is cured to form the convex structure in the embodiment of the present disclosure. Since the array is coated when the ink is applied, the formed convex structure is also an array structure.
  • the material of the ink is mainly an organic ink, such as a curable monomer material.
  • a curable monomer material such as a curable monomer material.
  • the formed polymer includes acrylic resin, methacrylic resin, isoprene resin, vinyl resin, epoxy resin, polyurethane resin, cellulose resin, perylene resin, Imide resin or a mixture of two or more kinds thereof.
  • the entire display panel is packaged and a protective cover plate is added to finally complete the preparation of the display panel.

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

本揭示提供一种显示面板及显示面板的制备方法，显示面板包括衬底、发光层、封装层，其中，封装层包括多个凸起结构或凹陷结构，凸起结构或所述凹陷结构设置在所述封装层背离所述衬底的一侧，凸起结构通过墨水固化形成，不仅制备工艺简单，节约成本，同时凸起结构可提高显示面板内光的利用率，提高显示面板的显示质量。

Description

显示面板及显示面板的制备方法 技术领域
本揭示涉及显示技术领域，尤其涉及一种显示面板及显示面板的制备方法。
 背景技术
有机发光二极管（organic light emitting display，OLED）显示装置具有机身薄、自发光、视角广以及节能环保等众多优点，已被广泛地应用于各个领域之中。
有机发光二极管显示面板由多种膜层组合而成，如玻璃基底以及功能层等。当光线在不同的膜层之中传播时，其光的透过率存在差别，一些膜层对光的透过性较好，一些膜层对光的透过率较差，同时，当光在各膜层中传播时，由于反射和折射等因素的影响，大约有80%的光子无法逸出至空气中，从而降低了光线的透过率，降低显示质量。为了提高器件的光效率，现有技术中如通过改变器件的电极结构，在OLED内部插入光提取层，或者在基底表面刻蚀各种微结构，但是这些设计只能在一定程度上提高OLED的取光效率，并且提高程度较小，效果不理想，同时，设计工艺复杂，不利于实际的生产制造，并且，对于柔性显示面板而言，工艺更加复杂。
综上所述，现有的显示面板中，光在各膜层之中传播时，较多光子无法逸出至空气中，光的取光效率以及出光率低，存在着显示面板显示效果及质量不理想，同时生产工艺复杂等问题。
 技术问题
本揭示提供一种显示面板及显示面板的制备方法，以解决现有显示面板中光子在各膜层中损失较大，光的取光效率以及出光率低，显示面板显示效果及质量不理想，并且生产工艺复杂等问题。
 技术解决方案
为解决上述技术问题，本揭示实施例提供的技术方案如下：
根据本揭示实施例的第一方面，提供了一种显示面板，包括：
衬底；
发光层，所述发光层设置在所述衬底上；以及
封装层，所述封装层设置在所述发光层上；
其中，所述封装层包括多个凸起结构或凹陷结构，所述凸起结构或所述凹陷结构设置在所述封装层背离所述衬底的一侧。
根据本揭示一实施例，多个所述凸起结构或所述凹陷结构在所述封装层背离所述衬底一侧呈阵列排布。
根据本揭示一实施例，所述凸起结构的顶部设置为弧面形状。
根据本揭示一实施例，所述凸起结构的所述弧面与所述封装层表面之间的接触角为30°~70°。
根据本揭示一实施例，所述凸起结构设置在所述显示面板的所述封装层对应的发光显示区域内。
根据本揭示一实施例，相邻所述凸起结构之间的间距为20nm~100nm。
根据本揭示一实施例，每个所述凸起结构的高度或所述凹陷结构的深度均相同。
根据本揭示一实施例，所述凸起的高度为20nm~1000nm。
根据本揭示一实施例，所述凸起结构或者凹陷结构的材料包括丙烯酸类树脂、甲基丙烯酸类树脂、异戊二烯类树脂中的一种。
根据本揭示一实施例，所述封装层包括至少一无机层以及有机层，所述有机层与所述无机层交替层叠设置。
根据本揭示一实施例，所述封装层与所述发光层相邻的膜层设置为无机层，所述封装层背离所述发光层一侧的膜层设置为无机层。
根据本揭示一实施例，所述封装层包括第一无机层、第一有机层、第二无机层、第二有机层、第三无机层，所述第一无机层设置于所述发光层上，所述第一有机层设置于所述第一无机层上，所述第二无机层设置于所述第一有机层上，所述第二有机层设置于所述第二无机层上，所述第三无机层设置于所述第二有机层上。
根据本揭示一实施例，所述封装层中的无机层的材料包括金属氧化物和非金属氧化物。
根据本揭示的第二方面，还提供了一种显示面板的制备方法，包括以下步骤，
S100：提供衬底基板，并在所述衬底基板上制备有机发光二极管的发光器件层；
S101：在所述发光器件层上制备封装层，同时，在所述封装层上规律性阵列涂布墨水；
S102：照射所述墨水，使所述墨水固化并形成凸起结构；
S103：进行封装，并完成所述显示面板的制备。
根据本揭示一实施例，所述步骤S101中，通过喷墨打印工艺涂布所述墨水，所述墨水材料包括有机树脂材料，所述有机树脂材料在紫外光下固化并形成聚合物。
根据本揭示一实施例，所述步骤S101中，通过喷涂工艺涂布所述墨水，形成凸起结构。
根据本揭示一实施例，所述步骤S101中，在所述发光器件层上依次形成无机封装层和有机封装层。
根据本揭示一实施例，在所述发光器件层上依次形成无机封装层和有机封装层的步骤中，采用化学气相沉积法形成无机封装层。
根据本揭示一实施例，在所述发光器件层上依次形成无机封装层和有机封装层的步骤中，采用物理气相沉积法形成无机封装层。
根据本揭示一实施例，在所述发光器件层上依次形成无机封装层和有机封装层的步骤中，采用原子层沉积法形成无机封装层。
 有益效果
本揭示提供一种显示面板及显示面板的制备方法，通过在显示面板的封装层上喷墨打印规律性阵列排布的有机墨水，所述有机墨水光照固化后，形成阵列排布的凸起结构，当光线到达所述凸起结构时，所述凸起结构会对光进行再反射或折射，使尽可能多的光线射出到空气中，从而有效的提高显示面板的出光率，减少光线在各膜层之间的损耗，提高面板的显示质量，同时，本制备工艺流程简单，生产成本低。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是揭示的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本揭示实施例的显示面板各层结构示意图；
图2为本揭示又一实施例中显示面板的结构示意图；
图3为本揭示实施例中凸起结构示意图；
图4为本揭示又一实施例中凸起结构示意图；
图5为本揭示实施例中凸起结构俯视示意图；
图6为本揭示实施例中显示显示面板的制备工艺流程图。
 本发明的实施方式
下面将结合本揭示实施例中的附图，对本揭示实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本揭示一部分实施例，而不是全部的实施例。基于本揭示中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本揭示保护的范围。
在本揭示的实施例中，本揭示实施例提供一种显示面板。如图1所示，图1为本揭示实施例的显示面板各层结构示意图。所述显示面板包括衬底基板100、发光层101以及封装层102。发光层101设置在所述衬底基板100上，所述封装层102设置所述发光层101上。
本揭示实施例中，通过在封装层102上设置多个凸起结构103，其中，凸起结构103设置在所述封装层102背离所述衬底基板100的一侧。当光线经过凸起结构103时，会被凸起结构103再次折射或者扩散，使光线能够沿多个方向从屏幕上射出，进而增加光线的射出途径，使光线尽可能多的被扩散到外界中，从而减小显示面板内膜层中光线的损耗，达到提高光线的利用率的目的。
具体的，对于整个显示面板而言，其内部包括多种膜层，如衬底基板100内还可包括基底层和薄膜晶体管阵列基板等膜层，薄膜晶体管阵列基板设置在基底层上，基底层可为双层柔性基底结构，其中基底层的材料可选聚酰亚胺材料，以此来增强基底的性能。
对于薄膜晶体管阵列基板而言，在设置薄膜晶体管阵列基板时，设置薄膜晶体管的栅极、源极、漏极以及各电极之间的绝缘层，同时在绝缘层上设置平坦层、像素定义层以及平坦层和像素定义层之间的阳极层。同时对平坦层以及像素定义层进行图案化处理，在图案化处理时，可通过曝光、显影、蚀刻及剥离等光刻工艺进行处理。
发光层101内还包括色阻层等其他膜层，在本揭示实施例中，发光层101设置在像素定义层上，像素定义层在图案化后会形成若干像素开口，在所述像素开口内蒸镀有机发光材料，同时在所述像素开口对应的区域上设置不同颜色的色阻，如红色色阻、蓝色色阻以及绿色色阻层，以实现不同颜色的显示功能。
如图2所示，图2为本揭示又一实施例中显示面板的结构示意图。显示面板包括衬底200、发光层201、封装层20以及凸起结构207，发光层201设置在衬底200上，封装层20设置在发光层201上，并覆盖所述发光层201。
衬底基板以及发光层设置完成后，设置显示面板的封装层20以及凸起结构207。具体的，本揭示实施例中，为了保证封装层20的封装效果，封装层20包括第一无机层202、第一有机层203、第二无机层204、第二有机层205以及第三无机层206。第一无机层202设置在发光层201上，第一有机层203设置在第一无机层202上，第二无机层204设置在第一有机层203上并覆盖第一有机层203，同时，在封装层20的最外侧，即封装层20背离发光层201的一侧设置为第三无机层206。
封装层20由多层有机层与无机层相互交替层叠而形成，这样，多层无机层和有机层不仅可有效的对显示面板的各膜层进行密封，保证显示面板的封装效果，同时，还有效的抑制了封装层20的开裂，进一步的增强了封装层20的膜层性能。
其中，封装层20中的无机层可以包含金属氧化物和非金属氧化物，例如，可以包含氧化铝、氧化钛、氧化硅以及氮化物等中的一种或者其任意组合。
进一步的，当发光层101的光线传播时，会通过多个不同的膜层，并最终射到外界，而当光线每传过一个膜层时，在膜层间均会损失，一部分光最终无法出射到空气中，进而降低光的利用率，降低显示质量。
本揭示实施例中，如图3所示，图3为本揭示实施例中凸起结构示意图。凸起结构301设置在封装层300上，凸起结构301由墨水制备而形成，制备工艺更加简单。
具体的，在封装层300的最外侧表面上设置多个凸起结构301，为了保证膜层的一致性，多个凸起结构301可等间距设置，在封装层300上呈阵列排布，在阵列排布时，可在封装层300表面上呈行或者列方向上，或者以环形阵列进行设置。凸起结构301使得封装层300最外侧的上表面变为粗糙表面，进而提高光的利用率。
优选的，在阵列设置时，相邻两凸起结构301之间的间隔为20nm~100nm，同时，结合显示面板的尺寸，在设置凸起结构301时，凸起结构301的高度优选为20nm~1000nm，任一一个凸起结构301的高度均可相同，以简化其制备工艺。在封装层300的表面，凸起结构301阵列的占空比优选为50%~100%，从而使光线尽可能的从所述凸起结构301射出到外界。
为了提高光线的射出效率，在设置凸起结构301时，凸起结构301的顶部可设置为弧面形状，弧面形状与微透镜相似，可将光线在较大范围内进行扩散，同时，在设置凸起结构301时，凸起结构301设置在与显示面板相对应的显示区域内，从而保证显示面板具有最佳的显示效果。
在设置凸起结构301时，凸起结构301的底部与封装层300相连接，连接部位可为凸台或者圆柱，凸台或者圆柱的高度较小，并在所述凸台或圆柱上设置弧面。
在设置弧面时，优选的弧形面的底部与凸台或者封装层300之间的接触角优选为30°~70°。
当光线304从发光层到达封装层300并进入到凸起结构301时，会依次被各膜层折射或反射，同时，在凸起结构301的弧形面上，会再次折射，凸起结构301进一步的对光线304进行提取并扩大光线304的射出面积，进而达到提高显示面板的发光效率，提高显示质量的目的。
凸起结构301的具体形状不限于本揭示实施例中的形状及结构，凸起结构301还可设置为凹陷结构、锯齿状结构、半圆形结构、梯形结构中的一种或多种组合的结构或者其他形状结构。如图4所示，图4为本揭示又一实施例中凸起结构示意图。封装层400上设置多个阵列布置的半圆形的凸起结构401。图5为本揭示实施例中凸起结构俯视示意图。封装层500上阵列设置的多个凸起结构501。
当设置为凹陷结构或其他形状结构时，每一个结构的深度可均相同。其他形状及结构这里不再详细阐述，但其目的及作用均是对显示面板内的光线进行引导，并提高从该结构中出射的光的发光区域以及发光效率。
具体的，凸起结构的材料可为聚合物材料，包括丙烯酸类树脂、甲基丙烯酸类树脂、异戊二烯类树脂、乙烯类树脂、环氧类树脂、聚氨酯类树脂、纤维素类树脂、二萘嵌苯类树脂、酰亚胺类树脂或其两种或更多种的混合物，这类聚合物材料在光照下会发生固化并稳定。
如图6所示，图6为本揭示实施例中显示显示面板的制备工艺流程图。制备工艺流程包括如下步骤：
S100：提供衬底基板，并在所述衬底基板上制备有机发光二极管的发光器件层；
步骤S100中，在制备衬底基板以及衬底基板上的有机发光二极管的发光器件层时，按照现有的制备工艺进行制备，这里不再详细描述。
S101：在所述发光器件层上制备封装层，同时，在所述封装层上规律性阵列涂布墨水；
当衬底基板以及发光层制备完成后，制备封装层，本揭示实施例中，为了提高封装效果，封装层由多个有机膜层以及无机膜层层叠构成，优选的堆叠3-5层有机与无机形成的堆叠结构。
在制备无机层封装层时，可以采用化学气相沉积法、物理气相沉积法或原子层沉积法的工艺在发光层上沉底无机封装层；
在制备有机封装层时，可通过喷墨打印、喷涂以及涂布中的任一工艺涂覆在无机层上。
S102：照射所述墨水，使所述墨水固化并形成凸起结构；
有机封装层以及无机封装层均制备完成后，在整个封装层的最外侧为无机封装层。此时，在最外侧的无机封装层上表面上涂布墨水，然后对墨水处理，使墨水形成本揭示实施例中的凸起结构，进而通过凸起结构来提高显示面板的发光效果。
具体的，可通过喷墨打印的工艺进行墨水涂布，在打印时，阵列涂布。由于墨水打印工艺简单，因此，本揭示实施例中凸起结构的制备工艺随之简化，进而提高了显示面板的生产效率。同时，喷墨打印支持不定性设计，因此，可以设计多种图案与分布，设计更加灵活。
墨水在涂布时，主要涂布在显示面板的显示区域内，优选的，墨水与封装层的表面之间的接触角为30°~70°。
墨水涂布完成后，光照，可采用紫外光进行照射，墨水在紫外光照射下会发生固化，照射完成后，墨水固化形成本揭示实施例中的凸起结构。由于在涂布墨水时，阵列进行涂布，因此形成的凸起结构也为阵列结构。
优选的，墨水的材料主要为有机墨水，如可固化型单体材料。这类物质材料在光照下会固化并形成聚合物。优选的，形成的聚合物包括丙烯酸类树脂、甲基丙烯酸类树脂、异戊二烯类树脂、乙烯类树脂、环氧类树脂、聚氨酯类树脂、纤维素类树脂、二萘嵌苯类树脂、酰亚胺类树脂或其两种或更多种的混合物。
S103：进行封装，并完成所述显示面板的制备。
凸起结构制备完成后，对整个显示面板封装并添加保护盖板，最终完成显示面板的制备。
以上对本揭示实施例所提供的一种显示面板及显示面板的制备方法进行了详细介绍，以上实施例的说明只是用于帮助理解本揭示的技术方案及其核心思想；本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，而这些修改或者替换，并不使相应技术方案的本质脱离本揭示各实施例的技术方案的范围。

Claims (20)

  1. 一种显示面板，其包括：
    衬底；
    发光层，所述发光层设置在所述衬底上；以及
    封装层，所述封装层设置在所述发光层上；
    其中，所述封装层包括多个凸起结构或凹陷结构，所述凸起结构或所述凹陷结构设置在所述封装层背离所述衬底的一侧。
  2. 根据权利要求1所述的显示面板，其中，多个所述凸起结构或所述凹陷结构在所述封装层背离所述衬底一侧呈阵列排布。
  3. 根据权利要求2所述的显示面板，其中，所述凸起结构的顶部设置为弧面形状。
  4. 根据权利要求3所述的显示面板，其中，所述凸起结构的所述弧面与所述封装层表面之间的接触角为30°~70°。
  5. 根据权利要求2所述的显示面板，其中，所述凸起结构设置在所述显示面板的所述封装层对应的发光显示区域内。
  6. 根据权利要求2所述的显示面板，其中，相邻所述凸起结构之间的间距为20nm~100nm。
  7. 根据权利要求 1所述的显示面板，其中，每个所述凸起结构的高度或所述凹陷结构的深度均相同。
  8. 根据权利要求7所述的显示面板，其中，所述凸起的高度为20nm~1000nm。
  9. 根据权利要求1所述的显示面板，其中，所述凸起结构或者凹陷结构的材料包括丙烯酸类树脂、甲基丙烯酸类树脂、异戊二烯类树脂中的一种。
  10. 根据权利要求1所述的显示面板，其中，所述封装层包括至少一无机层以及有机层，所述有机层与所述无机层交替层叠设置。
  11. 根据权利要求10所述的显示面板，其中，所述封装层与所述发光层相邻的膜层设置为无机层，所述封装层背离所述发光层一侧的膜层设置为无机层。
  12. 根据权利要求11所述的显示面板，其中，所述封装层包括第一无机层、第一有机层、第二无机层、第二有机层、第三无机层，所述第一无机层设置于所述发光层上，所述第一有机层设置于所述第一无机层上，所述第二无机层设置于所述第一有机层上，所述第二有机层设置于所述第二无机层上，所述第三无机层设置于所述第二有机层上。
  13. 根据权利要求10所述的显示面板，其中，所述封装层中的无机层的材料包括金属氧化物和非金属氧化物。
  14. 一种显示面板的制备方法，其包括如下步骤：
    S100：提供衬底基板，并在所述衬底基板上制备有机发光二极管的发光器件层；
    S101：在所述发光器件层上制备封装层，同时，在所述封装层上规律性阵列涂布墨水；
    S102：照射所述墨水，使所述墨水固化并形成凸起结构；
    S103：进行封装，并完成所述显示面板的制备。
  15. 根据权利要求14所述的显示面板的制备方法，其中，所述步骤S101中，通过喷墨打印工艺涂布所述墨水，所述墨水材料包括有机树脂材料，所述有机树脂材料在紫外光下固化并形成聚合物。
  16. 根据权利要求14所述的显示面板的制备方法，其中，所述步骤S101中，通过喷涂工艺涂布所述墨水，形成凸起结构。
  17. 根据权利要求14所述的显示面板的制备方法，其中，所述步骤S101中，在所述发光器件层上依次形成无机封装层和有机封装层。
  18. 根据权利要求17所述的显示面板的制备方法，其中，在所述发光器件层上依次形成无机封装层和有机封装层的步骤中，采用化学气相沉积法形成无机封装层。
  19. 根据权利要求17所述的显示面板的制备方法，其中，在所述发光器件层上依次形成无机封装层和有机封装层的步骤中，采用物理气相沉积法形成无机封装层。
  20. 根据权利要求17所述的显示面板的制备方法，其中，在所述发光器件层上依次形成无机封装层和有机封装层的步骤中，采用原子层沉积法形成无机封装层。
PCT/CN2020/080113 2020-03-05 2020-03-19 显示面板及显示面板的制备方法 WO2021174598A1 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US16/756,932 US11659730B2 (en) 2020-03-05 2020-03-19 Display panel having an encapsulation layer comprises plurality of protrusions and manufacturing method having the same thereof
EP20726668.5A EP4117051A4 (en) 2020-03-05 2020-03-19 DISPLAY PANEL AND METHOD FOR MANUFACTURING DISPLAY PANEL

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202010148380.9 2020-03-05
CN202010148380.9A CN111341934A (zh) 2020-03-05 2020-03-05 显示面板及显示面板的制备方法

Publications (1)

Publication Number Publication Date
WO2021174598A1 true WO2021174598A1 (zh) 2021-09-10

Family

ID=71185921

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2020/080113 WO2021174598A1 (zh) 2020-03-05 2020-03-19 显示面板及显示面板的制备方法

Country Status (4)

Country Link
US (1) US11659730B2 (zh)
EP (1) EP4117051A4 (zh)
CN (1) CN111341934A (zh)
WO (1) WO2021174598A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111855034B (zh) * 2020-07-24 2021-12-10 芜湖传方智能科技有限公司 一种压力传感器敏感元件的制造工艺
CN112017539B (zh) * 2020-08-07 2022-11-08 武汉华星光电半导体显示技术有限公司 封装膜及其制作方法、显示面板以及电子设备

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140027725A1 (en) * 2012-07-25 2014-01-30 Samsung Display Co., Ltd. Organic light emitting display device and manufacturing method thereof
US20140034919A1 (en) * 2012-08-02 2014-02-06 Samsung Display Co., Ltd. Organic light emitting display device with enhanced light efficiency and manufacturing method thereof
CN208970564U (zh) * 2018-11-30 2019-06-11 广东聚华印刷显示技术有限公司 薄膜封装结构和显示面板
CN110429195A (zh) * 2018-08-27 2019-11-08 广东聚华印刷显示技术有限公司 薄膜封装结构及其制备方法和显示面板
CN209785979U (zh) * 2019-05-10 2019-12-13 江苏集萃有机光电技术研究所有限公司 一种oled显示装置及电子设备
CN110880560A (zh) * 2018-09-06 2020-03-13 乐金显示有限公司 有机发光显示装置及其制造方法
CN111276515A (zh) * 2020-02-07 2020-06-12 武汉华星光电半导体显示技术有限公司 Oled显示面板及其制备方法
CN111370592A (zh) * 2020-03-17 2020-07-03 京东方科技集团股份有限公司 显示面板及其制造方法、显示装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004227940A (ja) * 2003-01-23 2004-08-12 Seiko Epson Corp 表示体、表示パネル、表示装置および製造方法
KR101318072B1 (ko) * 2008-06-04 2013-10-15 엘지디스플레이 주식회사 유기발광다이오드 표시장치 및 이의 제조 방법
JP2010186723A (ja) * 2009-02-13 2010-08-26 Fujifilm Corp 有機ｅｌ装置及びその製造方法
KR102012046B1 (ko) * 2013-01-02 2019-10-24 삼성디스플레이 주식회사 유기발광 표시장치 및 그의 제조방법
KR102117395B1 (ko) * 2013-12-16 2020-06-02 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
KR20160034510A (ko) * 2014-09-19 2016-03-30 삼성디스플레이 주식회사 조명 장치 및 이를 포함하는 표시 장치
KR102584517B1 (ko) * 2018-02-28 2023-10-05 삼성디스플레이 주식회사 디스플레이 장치
CN110350003A (zh) * 2019-06-21 2019-10-18 武汉华星光电半导体显示技术有限公司 有机发光显示面板及其制造方法
CN110400889B (zh) * 2019-07-25 2022-01-25 云谷（固安）科技有限公司 显示面板、显示装置及显示面板的制备方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140027725A1 (en) * 2012-07-25 2014-01-30 Samsung Display Co., Ltd. Organic light emitting display device and manufacturing method thereof
US20140034919A1 (en) * 2012-08-02 2014-02-06 Samsung Display Co., Ltd. Organic light emitting display device with enhanced light efficiency and manufacturing method thereof
CN110429195A (zh) * 2018-08-27 2019-11-08 广东聚华印刷显示技术有限公司 薄膜封装结构及其制备方法和显示面板
CN110880560A (zh) * 2018-09-06 2020-03-13 乐金显示有限公司 有机发光显示装置及其制造方法
US10790474B2 (en) * 2018-09-06 2020-09-29 Lg Display Co., Ltd. Organic light emitting display device and method for manufacturing the same
CN208970564U (zh) * 2018-11-30 2019-06-11 广东聚华印刷显示技术有限公司 薄膜封装结构和显示面板
CN209785979U (zh) * 2019-05-10 2019-12-13 江苏集萃有机光电技术研究所有限公司 一种oled显示装置及电子设备
CN111276515A (zh) * 2020-02-07 2020-06-12 武汉华星光电半导体显示技术有限公司 Oled显示面板及其制备方法
CN111370592A (zh) * 2020-03-17 2020-07-03 京东方科技集团股份有限公司 显示面板及其制造方法、显示装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP4117051A4 *

Also Published As

Publication number Publication date
US20220310975A1 (en) 2022-09-29
EP4117051A4 (en) 2024-04-03
EP4117051A1 (en) 2023-01-11
US11659730B2 (en) 2023-05-23
CN111341934A (zh) 2020-06-26

Similar Documents

Publication Publication Date Title
CN105633123B (zh) 用于制造有机电致发光显示器的方法
US11877492B2 (en) OLED display device including touch sensors and method for manufacturing same
US10181578B2 (en) Organic light-emitting diode (OLED) device, manufacturing method thereof and display device
CN103928497B (zh) Oled显示器件及其制作方法、显示装置
WO2019192529A1 (zh) 显示基板及其制备方法、显示装置
CN108198843B (zh) 显示面板制备方法
WO2021174615A1 (zh) 量子点显示面板及其制备方法
JP2013114772A (ja) 表示装置
US7737631B2 (en) Flat panel display with repellant and border areas and method of manufacturing the same
CN104282729A (zh) 一种有机发光显示面板及其制备方法、显示装置
US10727438B2 (en) OLED component and method for manufacturing the same
CN105655346A (zh) 薄膜晶体管阵列基板
WO2018040329A1 (zh) 一种发光面板及其制备方法
CN110992841A (zh) 显示装置及显示装置的制作方法
US20190333974A1 (en) Array substrate and method of manufacturing the same, display panel, and display device
WO2021174598A1 (zh) 显示面板及显示面板的制备方法
WO2020118842A1 (zh) 阵列基板及其制作方法、显示装置
US8748924B2 (en) Display apparatus and method for manufacturing the same
TWI683435B (zh) 像素界定結構及其製備方法、顯示基板、噴墨列印方法
WO2022247180A1 (zh) 显示面板及显示装置
US10943956B2 (en) Display panel and manufacturing method thereof
CN110622317B (zh) 显示基板、制造显示基板的方法和显示设备
KR101675843B1 (ko) 평판 표시 소자 및 그 제조 방법
WO2020062742A1 (zh) Oled 面板以及制备方法
US11393881B2 (en) Display device and manufacturing method thereof

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20726668

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 2020726668

Country of ref document: EP

Effective date: 20221005