WO2019192076A1 - 柔性oled屏幕、柔性面板薄膜封装结构和封装方法 - Google Patents

柔性oled屏幕、柔性面板薄膜封装结构和封装方法 Download PDF

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WO2019192076A1
WO2019192076A1 PCT/CN2018/091541 CN2018091541W WO2019192076A1 WO 2019192076 A1 WO2019192076 A1 WO 2019192076A1 CN 2018091541 W CN2018091541 W CN 2018091541W WO 2019192076 A1 WO2019192076 A1 WO 2019192076A1
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Prior art keywords
retaining wall
flexible panel
thin film
inorganic layer
organic layer
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English (en)
French (fr)
Inventor
黄静
徐湘伦
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Priority to US16/128,377 priority Critical patent/US10637001B2/en
Publication of WO2019192076A1 publication Critical patent/WO2019192076A1/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the present invention relates to the field of OLED display manufacturing, and in particular to a thin film packaging structure and a packaging method of a flexible panel.
  • the flexible packaging technology is directly related to the display life of OLED, which is one of the bottlenecks restricting the development of OLED.
  • the flexible package mainly adopts a laminated structure of an inorganic layer-organic layer-inorganic layer, and is required to not only fully shield the external water and oxygen from being eroded, but also to effectively cover particle contaminants, buffer bending, and folding which cannot be avoided in the production process. The stress in the process.
  • the inorganic layer it is mainly used to block the erosion of external water and oxygen; while the organic layer is mainly used to cover the particulate pollutants, buffer bending and stress during the folding process, which is unavoidable in the production process. Therefore, the organic layer is also called organic The buffer layer.
  • the organic buffer layer in the package structure is usually realized by flash evaporation, inkjet printing (IJP), etc., wherein the inkjet printing method is shorter in process time and excellent in planarization effect, but because of materials used for preparing the organic layer. Often the fluidity is good and the boundary is not easy to control.
  • the dam is usually made outside the display area to block the uncontrollability of the ink boundary. Since the retaining wall is usually obtained by using the same metal mask in the preparation of the flat layer and the pixel defining layer, the material of the retaining wall is an organic material, water vapor is easily penetrated, and in order to completely block the overflow of the organic layer material, at least two are generally produced. a retaining wall.
  • the material of the organic layer is hydrophilic and the retaining wall material is also hydrophilic, or the organic layer material is hydrophobic and the retaining wall material is also hydrophobic, the same organic layer material of the hydrophilic/hydrophobic material
  • the surface of the retaining wall material will be mutually soluble, which will have a greater impact on the barrier effect of the retaining wall. It is necessary to increase the thickness of the retaining wall or provide a multi-layer retaining wall to achieve a better blocking function. Further, the boundary width of the outermost inorganic layer at the time of preparation is affected, at least the edge of the outermost retaining wall needs to be exceeded, so as to ensure that the edge does not invade the water and oxygen quickly, which is disadvantageous for the design of the narrow bezel.
  • the object of the present invention is to provide a simple and compact film package structure, and provide the following technical solutions:
  • a thin film encapsulation structure comprising a first inorganic layer, a first organic layer and a second inorganic layer, which are sequentially stacked, and a first retaining wall; the first inorganic layer covering the flexible panel;
  • the number of the retaining walls is at least one, the first retaining wall is a hexamethyldimethicone retaining wall, at least one of the first retaining walls is disposed at a periphery of the first organic layer; and the second inorganic layer is covered The first organic layer and the first retaining wall.
  • the surface tension of the first retaining wall is hydrophobic; when the first organic layer is prepared as a hydrophobic material, the surface of the first retaining wall The tension is hydrophilic.
  • the first retaining wall is disposed on the first inorganic layer.
  • the second inorganic layer is in contact with the first inorganic layer.
  • the flexible panel further comprises a second retaining wall, the second retaining wall material is polyimide, and the second retaining wall is covered by the first inorganic layer.
  • the flexible panel further comprises a second retaining wall, the second retaining wall material is polyimide, and the second retaining wall is covered by the first inorganic layer.
  • the flexible panel further comprises a second retaining wall, the second retaining wall material is polyimide, and the second retaining wall is covered by the first inorganic layer.
  • the flexible panel further comprises a second retaining wall, the second retaining wall material is polyimide, and the second retaining wall is covered by the first inorganic layer.
  • the present application also relates to a thin film encapsulation method for a flexible panel, the specific method comprising the following steps:
  • first retaining wall material being hexamethyldimethicone
  • a second inorganic layer is formed to cover the first retaining wall and the first organic layer.
  • the proportion of the gas in the chemical deposition process is controlled according to the affinity/hydrophobicity of the first organic layer material to be printed to obtain a difference
  • the first retaining wall of the first organic layer material having a hydrophilic/hydrophobic surface sparse/hydrophilic character.
  • a second retaining wall is formed, and the second retaining wall material is polyimide;
  • the first inorganic layer is prepared on the periphery of the second retaining wall.
  • the third retaining wall is made of another material.
  • the first inorganic layer is prepared by a deposition method
  • the first retaining wall is prepared by a chemical deposition method
  • the first organic layer is prepared by an inkjet printing method
  • the second inorganic The preparation method of the layer is a chemical deposition method.
  • the thin film encapsulation structure of the invention adopts the traditional inorganic layer-organic layer-inorganic layer structure, and realizes the stress on the flexible panel display area from the external water oxygen erosion and the barrier particle contaminant, the buffer bending and the folding process. More importantly, by the hydrophilic/hydrophobic relative arrangement between the first retaining wall and the first organic layer, the surface of the first retaining wall and the first organic layer are not in contact upon contact Mutual dissolution occurs, which can greatly reduce the thickness of the first retaining wall, and has a more simplified and reliable retaining wall structure compared with the conventional retaining wall structure, which helps to further narrow the frame of the flexible OLED screen display area and improve user experience.
  • Figure 1 is a schematic view of a thin film encapsulation structure of the present invention
  • FIG. 2 is a schematic view of another embodiment of a thin film encapsulation structure of the present invention.
  • FIG. 3 is a schematic view showing still another embodiment of the thin film encapsulation structure of the present invention.
  • FIG. 4 is a schematic view of a metal mask used in the film package structure of the present invention.
  • Figure 5 is a schematic illustration of a metal mask used in the thin film encapsulation structure of the present invention.
  • the thin film encapsulation structure 100 is packaged on the display area 210 of the flexible panel 200 .
  • the display area 210 is disposed on the glass substrate 200.
  • the thin film encapsulation structure 100 of the present invention is sequentially laminated with a first inorganic layer 10, a first organic layer 20, and a second inorganic layer 30, wherein the first inorganic layer 10 is directly covered and Contacting the display area 210, the first organic layer 20 is received within the first retaining wall 40.
  • the material of the first retaining wall 40 is hexamethyldimethicone, and the first retaining wall 40 contains the display area 210, that is, the first retaining wall 40 and the first organic layer 20 are covered together.
  • the second inorganic layer 30 covers the first organic layer 20 and the first retaining wall 40.
  • the first inorganic layer 10 and the second inorganic layer 30 are both used to block the erosion of external water and oxygen, wherein the second inorganic layer 30 can also protect the first retaining wall 40 and the first organic layer. 20 is protected from external water oxygen.
  • the first organic layer 20 is mainly used to cover the particle contaminants, buffer bending, and stress during folding in the production process, and achieve buffering.
  • the first retaining wall 40 is typically prepared simultaneously with the flat layer and the pixel defining layer in the flexible panel 200, using the same metal mask 50 to deposit. Because of the material properties of the first retaining wall 40, the affinity/hydrophobicity of the first retaining wall 40 can be adjusted by adjusting the ratio of process gases in the chemical deposition process.
  • the surface tension of the first retaining wall 40 is modulated to be hydrophobic; when the first organic layer 20 is prepared as a hydrophobic organic material, modulation is performed.
  • the surface tension of the first retaining wall 40 is hydrophilic.
  • Such an arrangement can prevent the outer surfaces of the first organic layer 20 and the first retaining wall 40 from being mutually soluble due to the same hydrophilicity or the same hydrophobicity. Such an arrangement can improve the blocking efficiency of the first retaining wall 40, thereby reducing the volume and the occupied area of the first retaining wall 40, and the boundary width of the corresponding second inorganic layer 30 is also reduced.
  • the miniaturization of the entire thin film encapsulation structure 100 is achieved, thereby making the narrow bezel design effect of the entire flexible OLED screen.
  • the thin film encapsulation structure 100 described in the present invention is not limited to the above structure, and in order to obtain a better encapsulation effect, the manufacturer may be in the first inorganic layer 10, the first organic layer 20, and The protective layer is continuously superimposed on the basis of the second inorganic layer 30, or a retaining wall prepared by any material is added inside and outside the first retaining wall 40 of the present invention, as long as the thin film encapsulating structure includes the technical solution of the present invention.
  • the package structures described are all within the scope of the claimed invention.
  • the thin film encapsulation structure 100 of the present invention sequentially stacks the first inorganic layer 10, the first organic layer 20, and the second inorganic layer 30, and at least one retaining wall that houses the first organic layer 20.
  • the at least one retaining wall may be one or multiple retaining walls.
  • the at least one retaining wall includes a first retaining wall 40. It can be understood that when there is only one of the at least one retaining wall, the at least one retaining wall is the first retaining wall 40 (Fig. 1). When the at least one retaining wall is multi-channel, at least one of the at least one retaining wall may be composed of the first retaining wall 40 or may be made of the remaining materials.
  • the third retaining wall 41 (Fig. 2).
  • the first organic layer 20 is received within the at least one retaining wall.
  • the at least one retaining wall houses the display area 210, that is, the at least one retaining wall and the first organic layer 20 collectively cover the first inorganic layer 10.
  • the second inorganic layer 30 covers the first organic layer 20 and the at least one retaining wall.
  • the first inorganic layer 10 and the second inorganic layer 30 are both used to block the erosion of external water and oxygen, wherein the second inorganic layer 30 can also protect the at least one retaining wall and the first organic layer 20 Protected from outside water oxygen.
  • the first organic layer 20 is mainly used to cover the particle contaminants, buffer bending, and stress during folding in the production process, and achieve buffering.
  • the thin film encapsulation structure 100 is disposed on the display area 210 of the flexible OLED screen 200.
  • the embodiment may also be applied to a similar structure for The object to be encapsulated blocks the erosion of external water and oxygen and the stress during the blockage of particles, buffer bending and folding.
  • the first retaining wall 40 and the second inorganic layer 30 may be disposed on the first inorganic layer 10. This depends on whether the user pays more attention to the thickness control of the packaged object or more attention to the width control. In this embodiment, when the first retaining wall 40 is not disposed on the first inorganic layer 10 and is directly disposed on the glass substrate 220, the thickness of the thin film encapsulating structure 100 can be further improved. Small, but the width of the first retaining wall 40 is necessarily greater; conversely, when the first retaining wall 40 is disposed on the first inorganic layer 10, the overall width can be better controlled, but the corresponding thickness increase.
  • the second inorganic layer 30 since it is the same as the material and properties of the first inorganic layer 10, it can block the external water and oxygen attack, so the second inorganic layer 30 can be arbitrarily set in the first The inorganic layer 10 or above or the glass substrate 220, that is, the second inorganic layer 30 is in contact with the glass substrate 220 and/or the first inorganic layer 10.
  • Such an arrangement can ensure that the second inorganic layer 30 completely covers the at least one retaining wall and the first organic layer 20. Since many retaining walls are polymeric materials, they are hygroscopic and cause lateral water vapor intrusion. If the second inorganic layer 30 can cover the at least one retaining wall, the lateral water vapor intrusion can be reduced.
  • the thickness of the first inorganic layer 10 is set between 0.5 and 1 ⁇ m, and various deposition methods such as chemical deposition, atomic deposition, and vapor deposition may be used.
  • the material of an inorganic layer 10 is not limited to inorganic materials commonly used in the art such as silicon nitride, silicon oxide, silicon oxynitride or aluminum oxide, which can increase the water-blocking oxygen resistance of the flexible panel 100.
  • the thickness of the first organic layer 20 is between 4 and 10 ⁇ m, which is generally prepared by an inkjet printing method.
  • the material used for the first organic layer 20 is not limited to acrylate or hexamethyldimethylsilane. Ethers, polyacrylates, polycarbonates, polystyrenes, and the like, which are commonly used in the art, can cushion the stress of the flexible panel 100 during bending, folding, and coverage of particulate contaminants.
  • the thickness of the second inorganic layer is between 0.5 and 1 ⁇ m.
  • a chemical deposition method may be used, and a material used for the second organic layer 30 is not limited.
  • An inorganic material commonly used in the art such as silicon nitride, silicon oxide, silicon oxynitride or aluminum oxide to increase the water-blocking oxygen resistance of the flexible panel 100.
  • the first retaining wall 40 has a thickness of between 0.01 and 1 ⁇ m and a width of between 5 and 50 ⁇ m, since the first retaining wall 40 is generally used in the preparation of a flat layer and a pixel defining layer.
  • the metal mask 50 is obtained, and the first retaining wall 40 cannot be defined as a completely continuous structure, otherwise the corresponding metal mask 50 cannot be fabricated.
  • the first retaining wall 40 may be a layer, but because the retaining wall structure is not completely continuous, multiple layers may be provided to enhance the blocking effect. It should be noted that the first retaining wall 40 may be formed on the first inorganic layer 10 or may be disposed outside the first inorganic layer 10.
  • the flexible panel 200 further includes at least one second retaining wall 42 (see FIG. 3), and the polyimide retaining wall 42 is covered by the first inorganic layer 10.
  • the material of the second retaining wall is polyimide
  • the second retaining wall 42 is located in the thin film encapsulation structure 100 of the present invention, and the second retaining wall 42 serves to slow down the first retaining wall 40. And/or the retaining wall pressure of the third retaining wall 41.
  • the present invention also relates to a method for manufacturing the thin film encapsulation structure 100 of the display area 210 of the flexible panel 200 described above.
  • the specific technical solution is as follows:
  • a first organic layer 20 is prepared in the display area 210 of the flexible panel 200, so that the first organic layer 20 is received in a receiving cavity surrounded by the first retaining wall 40;
  • a second inorganic layer 30 is formed to cover the first retaining wall 40 and the first organic layer 20.
  • the obtained thin film encapsulation structure is the thin film encapsulation structure 100 of the present invention, and the corresponding beneficial effects of the thin film encapsulation structure 100 of the present invention are also taken of course, and will not be further described herein.
  • a chemical deposition method is employed in the preparation of the first retaining wall 40. And controlling the proportion of the gas in the chemical deposition process according to the material affinity/hydrophobicity of the first organic layer 20 to be printed to obtain a surface different in affinity/hydrophobicity from the material of the first organic layer 20.
  • the first retaining wall 40 is sparse/hydrophilic. Specifically, when the material of the first organic layer 20 is hydrophilic, the first retaining wall 40 is prepared by controlling the proportion of the gas to make the surface hydrophobic; when the first organic When the layer material is hydrophobic, the ratio of the control gas in the process of preparing the first retaining wall 40 is made to make the surface hydrophilic;
  • the method of processing the thin film package structure of the present invention is not necessarily the entire processing step of the entire thin film package structure.
  • the corresponding processing steps claimed in the method of the invention are included in the process of film encapsulation, even prior to, during or after the present processing method some conventional processing steps are added as long as the last obtained structure is not Substantial effects are all subject to the processing methods claimed herein.
  • the first inorganic layer 10 is prepared by a deposition method, a chemical deposition method, an atomic deposition method, a vapor deposition method, or the like.
  • the thickness of the first inorganic layer 10 is set between 0.5 and 1 ⁇ m, and the material is not It is limited to inorganic materials commonly used in the art such as silicon nitride, silicon oxide, silicon oxynitride or aluminum oxide to increase the water-blocking oxygen resistance of the flexible panel 100.
  • a second retaining wall 42 is formed on the flexible panel 200 prior to forming the first inorganic layer 10.
  • the material of the second retaining wall 42 is polyimide, and the second retaining wall 42 serves as a first retaining wall to relieve the pressure of the first retaining wall 40.
  • the third retaining wall 41 made of the remaining material is used.
  • the third retaining wall 41 may be disposed in the first retaining wall 40 or may be disposed outside the first retaining wall 40.
  • the third retaining wall needs to be covered by the inorganic layer to block the moisture.
  • the inorganic layer may be the second inorganic layer 30 described herein, or may be the remaining inorganic layer.
  • the third retaining wall 41 cooperates with the second retaining wall 42 to relieve the pressure of the retaining wall of the first retaining wall 40 and achieve a better retaining wall effect.
  • the first organic layer 20 is prepared by an inkjet printing method having a thickness of 4 to 10 ⁇ m, and the material used for the first organic layer 20 is not limited to acrylate or hexamethyldimethylsilane.
  • the second inorganic layer 30 is prepared by a chemical deposition method with a thickness of 0.5 to 1 ⁇ m, and the second organic layer 30 is not limited to silicon nitride, silicon oxide, or silicon oxynitride. Or an inorganic material commonly used in the art such as alumina to increase the water-blocking oxygen resistance of the flexible panel 100.
  • the thickness of the first retaining wall 40 is between 0.01 and 1 ⁇ m and the width is between 5 and 50 ⁇ m.
  • the first retaining wall 40 is prepared simultaneously with the flat layer and the pixel defining layer in the flexible panel.
  • the metal mask 50 used is as shown in FIG. 4, that is, the first retaining wall 40 cannot be a completely continuous structure, otherwise the corresponding metal mask 50 cannot be manufactured. Because the first retaining wall 40 is not completely continuous, the number of layers of the retaining wall groove 51 in the metal mask 50 may be one layer or multiple layers (see FIG. 5) to improve the The blocking effect of the first retaining wall 40.
  • the thin film encapsulation structure of the present invention comprises a first inorganic layer, a first organic layer and a second inorganic layer structure, wherein the first organic layer is prepared by using hexamethyldimethicone which is an organic material to form the first retaining wall
  • the hydrophilicity/hydrophobicity between the first retaining wall and the first organic layer is oppositely disposed such that the surface of the first retaining wall and the first organic layer do not dissolve when contacted.
  • the trait can greatly reduce the thickness of the at least one retaining wall, while ensuring the erosion of the outer water oxygen to the flexible panel display area and the stress during the particle contaminant, buffer bending and folding of the flexible panel. Compared with the traditional retaining wall structure, it has more simplified and more reliable features.
  • the thin film encapsulation structure manufactured by the method of the invention helps to further narrow the frame of the flexible OLED screen display area and improve the user experience because of the miniaturization of the volume.

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  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
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Abstract

一种柔性面板的薄膜封装结构（100）及其制造方法，包括第一无机层（10）、第一有机层（20）和第二无机层（30），其中采用有机材料六甲基二甲硅醚来制作第一挡墙（40），第一挡墙（40）和第一有机层（20）之间的亲水性/疏水性相对设置，使得二者在接触时不发生表面共溶，可以大大缩减第一挡墙（40）的厚度，并保证封装结构的阻隔外界水氧侵蚀及覆盖柔性面板的颗粒污染物，缓冲弯曲、折叠过程中的应力等功效。相对传统挡墙结构更简化、可靠，有助于进一步缩窄柔性OLED屏幕显示区的边框，提高用户体验。

Description

柔性OLED屏幕、柔性面板薄膜封装结构和封装方法 技术领域
本发明涉及OLED显示屏制造领域，尤其涉及柔性面板的薄膜封装结构和封装方法。
背景技术
随着第三代显示技术市场需求的不断增加，柔性OLED的研发与生产成为目前显示行业发展的热门领域。其中柔性封装技术因为直接关系到OLED的显示寿命，而成为了制约OLED发展的瓶颈之一。目前柔性封装主要采用无机层-有机层-无机层的叠层结构，要求不但要实现充分阻隔外界水氧的侵蚀，而且要能有效的覆盖生产过程中无法避免的颗粒污染物、缓冲弯曲、折叠过程中的应力。对于无机层，主要用来阻隔外界水氧的侵蚀；而有机层则主要用来覆盖生产过程中无法避免的颗粒污染物、缓冲弯曲、折叠过程中的应力，所以业内也对有机层称为有机缓冲层。
封装结构中的有机缓冲层通常利用闪蒸、喷墨打印(IJP)等技术实现，其中喷墨打印的方法虽然工艺耗时更短，并且平坦化效果优异，但是因为用于制备有机层的材料往往流动性较好而导致其边界不易控制，通常会采用在显示区域外围制作挡墙(dam)的方式来阻挡ink边界的不可控性。由于挡墙通常是在平坦层和像素定义层制备时使用同一金属掩模板得到，因此挡墙的材质属于有机材料，水汽容易穿透，并且为了完全阻挡有机层材料的溢出，一般会至少制作两个挡墙。更重要的一点，如果有机层的材料为亲水性而挡墙材料也为亲水性，或者有机层材料为疏水性而挡墙材料也为疏水性，则亲/疏水材料相同 的有机层材料和挡墙材料会发生表面互溶，这对挡墙的阻挡效果会形成较大冲击，势必需要增加挡墙的厚度或者提供多层挡墙才能达到较好的阻挡功能。进而影响制备时最外层无机层的边界宽度，至少需要超过最外围的挡墙边缘，才能保证边缘不会很快水氧入侵，这样制作对窄边框的设计是不利的。
发明内容
本发明的目的在于提供一种结构简单、紧凑薄膜封装结构，提供如下技术方案：
一种薄膜封装结构，包含依次层叠设置的第一无机层、第一有机层和第二无机层，以及第一挡墙；所述第一无机层覆盖于所述柔性面板上；所述第一挡墙数量至少为一个，所述第一挡墙为六甲基二甲硅醚挡墙，至少一个所述第一挡墙设在所述第一有机层的外围；所述第二无机层覆盖所述第一有机层和所述第一挡墙。
其中，当所述第一有机层为亲水性材料制备时，所述第一挡墙表面张力呈疏水性；当所述第一有机层为疏水性材料制备时，所述第一挡墙表面张力呈亲水性。
其中，所述第一挡墙设置于所述第一无机层上。
其中，所述第二无机层与所述第一无机层接触。
其中，所述柔性面板还包括第二挡墙，所述第二挡墙材料为聚酰亚胺，所述第二挡墙被所述第一无机层覆盖。
其中，所述柔性面板还包括第二挡墙，所述第二挡墙材料为聚酰亚胺，所述第二挡墙被所述第一无机层覆盖。
其中，所述柔性面板还包括第二挡墙，所述第二挡墙材料为聚酰亚胺，所 述第二挡墙被所述第一无机层覆盖。
其中，所述柔性面板还包括第二挡墙，所述第二挡墙材料为聚酰亚胺，所述第二挡墙被所述第一无机层覆盖。
本申请还涉及一种柔性面板的薄膜封装方法，具体方法包括以下步骤：
在柔性面板上制备第一无机层；
在所述柔性面板的显示区外围制备第一挡墙，所述第一挡墙材料为六甲基二甲硅醚；
在所述柔性面板的显示区内制备第一有机层，以使得所述第一有机层收容于所述第一挡墙围设的收容腔内；
制作第二无机层以覆盖所述第一挡墙和所述第一有机层。
其中，在所述柔性面板的显示区外围制备所述第一挡墙时，根据待打印的第一有机层材料的亲/疏水性，控制所述化学沉积制程中的气体比例，以获得不同于所述第一有机层材料亲/疏水性的表面疏/亲水性特质的所述第一挡墙。
其中，在制备所述第一无机层前，先制作一道第二挡墙，所述第二挡墙材料为聚酰亚胺；
且所述第一无机层制备于所述第二挡墙外围。
其中，在所述柔性面板的显示区外围用化学沉积法制备所述第一挡墙时，采用另一材料制作第三挡墙。
其中，所述第一无机层的制备方法为沉积法，所述第一挡墙的制备方法为用化学沉积法，所述第一有机层的制备方法为喷墨打印法，所述第二无机层的制备方法为化学沉积法。
本发明薄膜封装结构，采用了传统的无机层-有机层-无机层结构，实现了对柔性面板显示区的阻隔外界水氧的侵蚀和隔阻颗粒污染物、缓冲弯曲、折叠过程中的应力。更重要的是，通过所述第一挡墙和所述第一有机层之间亲水性/疏水性相对的设置，使得所述第一挡墙和所述第一有机层在接触时表面不发生互溶，这一特质可以大大缩减所述第一挡墙的厚度，相对于传统挡墙结构具备了更简化、可靠的挡墙结构，有助于进一步缩窄柔性OLED屏幕显示区的边框，提高用户体验。
附图说明
图1是本发明薄膜封装结构的示意图；
图2是本发明薄膜封装结构另一实施例的示意图；
图3是本发明薄膜封装结构再一实施例的示意图；
图4是本发明薄膜封装结构使用的金属掩模板示意图；
图5是本发明薄膜封装结构使用的金属掩模板示意图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动的前提下所获得的所有其它实施例，都属于本发明保护的范围。
请参阅图1的薄膜封装结构100，在本实施例中，所述薄膜封装结构100封装在柔性面板200的显示区210上。所述显示区210设置在玻璃基板200 上，本发明薄膜封装结构100依次层叠有第一无机层10、第一有机层20和第二无机层30，其中所述第一无机层10直接覆盖并接触于所述显示区210上，所述第一有机层20收容于所述第一挡墙40以内。所述第一挡墙40的材料为六甲基二甲硅醚，所述第一挡墙40包容所述显示区210，即所述第一挡墙40和所述第一有机层20共同覆盖所述第一无机层10。所述第二无机层30覆盖所述第一有机层20和所述第一挡墙40。所述第一无机层10和所述第二无机层30均用于阻隔外界水氧的侵蚀，其中所述第二无机层30还可以保护所述第一挡墙40和所述第一有机层20免受外界水氧侵蚀。而所述第一有机层20主要用于覆盖生产过程中无法避免的颗粒污染物、缓冲弯曲、折叠过程中的应力，实现缓冲。
所述第一挡墙40通常与所述柔性面板200中的平坦层和像素定义层同时制备，使用同一块所述金属掩模板50进行沉积。因为所述第一挡墙40的材料特性，通过在化学沉积法中制程气体比例的调整，可以调整所述第一挡墙40的亲/疏水性。当所述第一有机层20为亲水性有机材料制备时，则调制所述第一挡墙40的表面张力呈疏水性；当所述第一有机层20为疏水性有机材料制备时，调制所述第一挡墙40表面张力呈亲水性。这样的设置可以避免所述第一有机层20和所述第一挡墙40的外表面因为同为亲水性或同为疏水性而造成的二者表面互溶。这样的设置，可以提高所述第一挡墙40的阻挡效率，进而减小所述第一挡墙40的体积和所占面积，相应的所述第二无机层30的边界宽度也得以减小，实现整个薄膜封装结构100的小型化，从而使得整个柔性OLED屏幕的窄边框设计效果。
需要提出的是，本发明所描述的薄膜封装结构100并不局限于上述的结构， 为了获得更好的封装效果，生产厂商可以在所述第一无机层10、所述第一有机层20和所述第二无机层30的基础上继续叠加保护层，或者在本发明所述第一挡墙40的内外再增加任意材料制备的挡墙等，只要该薄膜封装结构包含本发明技术方案中所描述的封装结构，则均属于本发明要求保护的范围。
采用另一种表述方式，本发明所述薄膜封装结构100依次层叠有第一无机层10、第一有机层20和第二无机层30，以及收容所述第一有机层20的至少一道挡墙。可以理解的，所述至少一道挡墙可以是一道，也可以是多道挡墙。所述至少一道挡墙中包含第一挡墙40。可以理解的，当所述至少一道挡墙只有一道时，所述至少一道挡墙就是所述第一挡墙40(图1)。当所述至少一道挡墙为多道时，所述至少一道挡墙中至少有一道所述第一挡墙40，当然也可以全部由所述第一挡墙40组成，或辅以其余材质制作的第三挡墙41(图2)。所述第一有机层20收容于所述至少一道挡墙以内。所述至少一道挡墙包容所述显示区210，即所述至少一道挡墙和所述第一有机层20共同覆盖所述第一无机层10。所述第二无机层30覆盖所述第一有机层20和所述至少一道挡墙。所述第一无机层10和所述第二无机层30均用于阻隔外界水氧的侵蚀，其中所述第二无机层30还可以保护所述至少一道挡墙和所述第一有机层20免受外界水氧侵蚀。而所述第一有机层20主要用于覆盖生产过程中无法避免的颗粒污染物、缓冲弯曲、折叠过程中的应力，实现缓冲。
需要提出的是，在本实施例中所述薄膜封装结构100设置于所述柔性OLED屏幕200的显示区210上，在实际使用中，本实施例也可能运用于类似的结构上，用于为待封装物体阻隔外界水氧的侵蚀和隔阻颗粒污染物、缓冲弯曲、折叠过程中的应力。
对于所述第一挡墙40和所述第二无机层30，都可以设置在所述第一无机层10上。这取决于使用者对待封装物体的厚度控制更重视，还是对宽度控制更重视。如本实施例中，当所述第一挡墙40不设于所述第一无机层10上，而直接设置于所述玻璃基板220上时，本薄膜封装结构100的厚度相应可以做到更小，但所述第一挡墙40的宽度势必更大；反之，当所述第一挡墙40设置于所述第一无机层10上时，可以更好的控制整体的宽度，但相应厚度增加。
对于所述第二无机层30，由于与所述第一无机层10的材料和性质相同，都能隔阻外界的水氧侵蚀，因此所述第二无机层30可以任意设置在所述第一无机层10以上或所述玻璃基板220上，即所述第二无机层30与所述玻璃基板220和/或所述第一无机层10接触。这样的设置可以保证所述第二无机层30完全覆盖所述至少一道挡墙和所述第一有机层20。因为很多挡墙属于高分子材料，具有吸湿性，会导致侧向的水汽入侵，如果所述第二无机层30可以覆盖住所述至少一道挡墙的话，就可以减小侧向的水汽入侵。
一种实施例，对于所述第一无机层10，其厚度设置在0.5～1μm之间，制作方法可采用化学沉积法、原子沉积法和气相沉积法等各种沉积法，而对于所述第一无机层10的材料，不限于氮化硅，氧化硅，氮氧化硅或氧化铝等本领域常用的可增加所述柔性面板100阻水氧性能的无机材料。
一种实施例，所述第一有机层20的厚度在4～10μm之间，一般采用喷墨打印法制备，所述第一有机层20使用的材料不限于丙烯酸酯、六甲基二甲硅醚、聚丙烯酸酯类、聚碳酸脂类、聚苯乙烯等本领域常用的可缓冲所述柔性面板100在弯曲、折叠时的应力以及颗粒污染物的覆盖。
一种实施例，所述第二无机层的厚度在0.5～1μm之间，与所述第一无机 层一样，制作方法可采用化学沉积法，所述第二有机层30使用的材料也不限于氮化硅、氧化硅、氮氧化硅或氧化铝等本领域常用的可增加所述柔性面板100阻水氧性能的无机材料。
一种实施例，所述第一挡墙40的厚度在0.01～1μm之间，宽度在5～50μm之间，由于所述第一挡墙40通常是在平坦层和像素定义层制备时使用同一所述金属掩模板50得到，所述第一挡墙40不能被定义为完全连续的结构，否则无法制作出相应的所述金属掩模板50。所述第一挡墙40可以为一层，但因为挡墙结构不完全连续，也可以设置多层，用以加固阻挡的效果。另外需要注意的一点是，所述第一挡墙40可以制作在所述第一无机层10上，也可以设置在所述第一无机层10之外。
一种实施例，所述柔性面板200内还至少包括一个第二挡墙42(见图3)，且所述聚酰亚胺挡墙42被所述第一无机层10覆盖。所述第二挡墙的材料为聚酰亚胺，所述第二挡墙42位于本发明所述薄膜封装结构100之内，所述第二挡墙42用作减缓所述第一挡墙40和/或所述第三挡墙41的挡墙压力。
本发明还涉及上述柔性面板200的显示区210薄膜封装结构100的制造方法，具体技术方案如下：
在所述柔性面板200上制备第一无机层10；
在所述柔性面板200的显示区210外围制备第一挡墙40；
在所述柔性面板200的所述显示区210内制备第一有机层20，以使得所述第一有机层20收容于所述第一挡墙40围设的收容腔内；
制作第二无机层30以覆盖所述第一挡墙40和所述第一有机层20。
本方法的制作过程，所得到的薄膜封装结构即为本发明所述薄膜封装结构 100，也理所当然的具备了本发明所述薄膜封装结构100的相应有益效果，在此不做再一次的阐述。
其中，在制备所述第一挡墙40时，采用化学沉积法。并根据待打印的所述第一有机层20的材料亲/疏水性为依据，控制化学沉积制程中的气体比例，以获得不同于所述第一有机层20材料的亲/疏水性不同的表面呈疏/亲水性特质的所述第一挡墙40。具体来说，当所述第一有机层20的材料为亲水性时，则制备所述第一挡墙40的过程中通过控制气体比例，使其表面呈疏水性；当所述第一有机层材料为疏水性时，则制备所述第一挡墙40的过程中控制气体比例，使其表面呈亲水性；
同样需要注意的是，本发明薄膜封装结构加工方法，并不一定是整个薄膜封装结构的加工全步骤。只要在薄膜封装的过程中，包含了本发明方法所要求保护的相应加工步骤，即使在本加工方法之前、之中或之后加入一些现有技术中常规的加工步骤，只要不对最后所获得的结构产生实质性影响，都属于本发明所要求保护的加工方法。
一些实施例，所述第一无机层10的制备方法为沉积法，化学沉积法、原子沉积法和气相沉积法等，所述第一无机层10的厚度设置在0.5～1μm之间，材料不限于氮化硅，氧化硅，氮氧化硅或氧化铝等本领域常用的可增加所述柔性面板100阻水氧性能的无机材料。
一种实施例，在制作所述第一无机层10之前，在所述柔性面板200上制作一道第二挡墙42。所述第二挡墙42的材料为聚酰亚胺，所述第二挡墙42用作第一道挡墙而减缓所述第一挡墙40的压力。
一种实施例，在制作所述第一挡墙40时，辅以其余材质制作的第三挡墙 41。所述第三挡墙41可设置于所述第一挡墙40之内，也可以设置于所述第一挡墙40之外。同时，所述第三挡墙需要被无机层所覆盖以隔阻水气。该无机层可以是本申请所述第二无机层30，也可以是其余叠加的无机层。所述第三挡墙41与所述第二挡墙42共同作用，以缓解所述第一挡墙40的挡墙压力，实现更好的挡墙效果。
一些实施例，所述第一有机层20的制备方法为喷墨打印法，其厚度在4～10μm之间，所述第一有机层20使用的材料不限于丙烯酸酯、六甲基二甲硅醚、聚丙烯酸酯类、聚碳酸脂类、聚苯乙烯等本领域常用的可缓冲所述柔性面板100在弯曲、折叠时的应力以及颗粒污染物的覆盖。
一些实施例，所述第二无机层30的制备方法为化学沉积法，厚度在0.5～1μm之间，所述第二有机层30使用的材料也不限于氮化硅，氧化硅，氮氧化硅或氧化铝等本领域常用的可增加所述柔性面板100阻水氧性能的无机材料。
需要提出的是，所述第一挡墙40的厚度在0.01～1μm之间，宽度在5～50μm之间，所述第一挡墙40与所述柔性面板中平坦层和像素定义层同时制备，其使用的所述金属掩模板50如图4所示，即所述第一挡墙40不能为完全连续的结构，否则无法制造出对应的所述金属掩模板50。因为所述第一挡墙40的不完全连续，所述金属掩模板50内的挡墙槽51的层数，可以是一层，也可以是多层(见图5)，用以提高所述第一挡墙40的阻挡效果。
本发明薄膜封装结构，包括第一无机层、第一有机层和第二无机层结构，其中第一有机层的制备采用了同为有机材料的六甲基二甲硅醚来制作第一挡墙，所述第一挡墙和所述第一有机层之间的亲水性/疏水性相对设置，使得所述第一挡墙和所述第一有机层在接触时表面不发生互溶，这一特质可以大大缩 减所述至少一道挡墙的厚度，同时保证了对所述柔性面板显示区的阻隔外界水氧的侵蚀和覆盖所述柔性面板的颗粒污染物、缓冲弯曲、折叠过程中的应力。相对于传统挡墙结构具备了更简化、更可靠的特点。采用本发明方法制造出的薄膜封装结构，因为体积的小型化，而有助于进一步缩窄柔性OLED屏幕显示区的边框，提高用户体验。
以上所述的实施方式，并不构成对该技术方案保护范围的限定。任何在上述实施方式的精神和原则之内所作的修改、等同替换和改进等，均应包含在该技术方案的保护范围之内。

Claims (13)

  1. 一种柔性面板的薄膜封装结构，其中，
    包含依次层叠设置的第一无机层、第一有机层和第二无机层，以及第一挡墙；
    所述第一无机层覆盖于所述柔性面板上；
    所述第一挡墙数量至少为一个，所述第一挡墙为六甲基二甲硅醚挡墙，至少一个所述第一挡墙设在所述第一有机层的外围；
    所述第二无机层覆盖所述第一有机层和所述第一挡墙。
  2. 如权利要求1所述柔性面板的薄膜封装结构，其中，当所述第一有机层为亲水性材料制备时，所述第一挡墙表面张力呈疏水性；当所述第一有机层为疏水性材料制备时，所述第一挡墙表面张力呈亲水性。
  3. 如权利要求2所述柔性面板的薄膜封装结构，其中，所述第一挡墙设置于所述第一无机层上。
  4. 如权利要求3所述柔性面板的薄膜封装结构，其中，所述第二无机层与所述第一无机层接触。
  5. 如权利要求1所述柔性面板的薄膜封装结构，其中，所述柔性面板还包括第二挡墙，所述第二挡墙材料为聚酰亚胺，所述第二挡墙被所述第一无机层覆盖。
  6. 如权利要求2所述柔性面板的薄膜封装结构，其中，所述柔性面板还包括第二挡墙，所述第二挡墙材料为聚酰亚胺，所述第二挡墙被所述第一无机层覆盖。
  7. 如权利要求3所述柔性面板的薄膜封装结构，其中，所述柔性面板还包括第二挡墙，所述第二挡墙材料为聚酰亚胺，所述第二挡墙被所述第一无机层覆盖。
  8. 如权利要4所述柔性面板的薄膜封装结构，其中，所述柔性面板还包括第二挡墙，所述第二挡墙材料为聚酰亚胺，所述第二挡墙被所述第一无机层覆盖。
  9. 一种柔性面板的薄膜封装方法，具体方法包括以下步骤：
    在柔性面板上制备第一无机层；
    在所述柔性面板的显示区外围制备第一挡墙，所述第一挡墙材料为六甲基二甲硅醚；
    在所述柔性面板的显示区内制备第一有机层，以使得所述第一有机层收容于所述第一挡墙围设的收容腔内；
    制作第二无机层以覆盖所述第一挡墙和所述第一有机层。
  10. 如权利要求9所述柔性面板的薄膜封装方法，其中，在所述柔性面板 的显示区外围制备所述第一挡墙时，根据待打印的第一有机层材料的亲/疏水性，控制所述化学沉积制程中的气体比例，以获得不同于所述第一有机层材料亲/疏水性的表面疏/亲水性特质的所述第一挡墙。
  11. 如权利要求9所述柔性面板的薄膜封装方法，其中，在制备所述第一无机层前，先制作一道第二挡墙，所述第二挡墙材料为聚酰亚胺；
    且所述第一无机层制备于所述第二挡墙外围。
  12. 如权利要求9所述柔性面板的薄膜封装方法，其中，在所述柔性面板的显示区外围用化学沉积法制备所述第一挡墙时，采用另一材料制作第三挡墙。
  13. 如权利要求9所述柔性面板的薄膜封装方法，其中，所述第一无机层的制备方法为沉积法，所述第一挡墙的制备方法为用化学沉积法，所述第一有机层的制备方法为喷墨打印法，所述第二无机层的制备方法为化学沉积法。
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