WO2019148549A1 - 显示装置及其覆晶薄膜结构 - Google Patents

显示装置及其覆晶薄膜结构 Download PDF

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Publication number
WO2019148549A1
WO2019148549A1 PCT/CN2018/076481 CN2018076481W WO2019148549A1 WO 2019148549 A1 WO2019148549 A1 WO 2019148549A1 CN 2018076481 W CN2018076481 W CN 2018076481W WO 2019148549 A1 WO2019148549 A1 WO 2019148549A1
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Prior art keywords
output pads
output
substrate
lead
leads
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PCT/CN2018/076481
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English (en)
French (fr)
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罗京
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武汉华星光电半导体显示技术有限公司
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Priority to US15/765,188 priority Critical patent/US10672700B2/en
Publication of WO2019148549A1 publication Critical patent/WO2019148549A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a display device and a flip chip structure thereof.
  • the flexible display is a flexible display device made of a flexible material, which has the advantages of thin thickness, small size, light weight, easy to carry, bendable, energy-saving and environmentally friendly, and stylish personality. Therefore, the flexible display has gradually become the mainstream.
  • the drive design for flexible display mainly adopts COF (chip on film) structure, and COF becomes a display technology with flexible display.
  • COF chip on film
  • the number of output pads required by COFs is increasing, and the number of leads connected to the output pads is also increasing. Due to the limited space of COF wiring, these leads are respectively It is disposed on both sides of the COF substrate.
  • the presence of the lead wire may cause unevenness of the output pad during the pressing process, causing problems such as shallow conductive particles and pressure-bonding bubbles.
  • the present invention provides a display device and a flip-chip structure thereof, which can avoid the occurrence of undesirable problems such as shallow conductive particles and pressure-bonding bubbles caused by uneven force during the pressing process.
  • the specific technical solution proposed by the present invention is to provide a flip-chip structure including a substrate, a plurality of first output pads, a plurality of second output pads, a plurality of first leads, and a plurality of a second lead, one side of the substrate is provided with a binding area, the plurality of first output pads and the plurality of second output pads are located in the binding area, the plurality of first leads, the plurality of first An output pad is located on the same side of the substrate, and the plurality of first leads and the plurality of second leads are located on opposite sides of the substrate, each of the first leads and a first output pad Connecting, each of the second leads is respectively connected to a second output pad, and the two ends of the portion of the second lead corresponding to the binding area are respectively connected to the first output pad and the second output pad Right.
  • the plurality of first output pads are alternately disposed with the plurality of second output pads.
  • the plurality of first output pads and the plurality of second output pads are respectively arranged in a line along a first direction, and the plurality of first output pads and the plurality of second output pads are in a second The direction is spaced apart, and the first direction is perpendicular to the second direction.
  • the projection of the second lead on the substrate covers the projection of the first lead on the substrate.
  • a through hole corresponding to the plurality of second output pads is disposed on the substrate, and the second lead is connected to the second output pad through the via.
  • the binding region is located between the via and the first lead.
  • the flip chip structure further includes a driving chip, the driving chip and the plurality of first leads are located on a same side of the substrate, and the first lead and the second lead are respectively driven by the driving Chip connection.
  • the present invention further provides a display device, comprising: a display panel and a flip-chip structure as described above, wherein the display panel is provided with a plurality of first output pads corresponding to the plurality of first output pads a first input pad and a plurality of second input pads corresponding to the plurality of second output pads, the plurality of first input pads being electrically connected to the plurality of first output pads, the plurality of The second input pad is electrically connected to the plurality of second output pads.
  • the method further includes a conductive layer disposed between the first input pad and the first output pad and the second input pad and the second output pad.
  • the plurality of first input pads and the plurality of second input pads are both located at edges of the display panel.
  • the plurality of first output pads and the plurality of second output pads of the flip-chip structure of the present invention are located in the binding region, and the plurality of first leads and the plurality of second leads are located on opposite sides of the substrate, the A projection of the two leads on the substrate covers a projection of the first output pad and the second output pad on the substrate such that the first output pad and the second output pad are subjected to the pressing process
  • the force is uniform, avoiding the occurrence of poor problems such as shallow conductive particles and pressure-bonding bubbles caused by uneven force during the pressing process.
  • Figure 1 is a front elevational view of the structure of a flip chip
  • Figure 2 is a cross-sectional view showing the structure of a flip chip
  • Figure 3 is a rear elevational view of the structure of the flip chip
  • FIG. 4 is a schematic structural view of a display device
  • Fig. 5 is a partial enlarged view of Fig. 4;
  • the flip chip structure 1 provided in this embodiment includes a substrate 11 , a plurality of first output pads 12 , a plurality of second output pads 13 , a plurality of first leads 14 , and a plurality of a second lead 15, a side of the substrate 11 is provided with a binding area 10, a plurality of first output pads 12, a plurality of second output pads 13 are located in the binding area 10, a plurality of first leads 14, a plurality of first The output pads 12 are located on the same side of the substrate 11, and the plurality of first leads 14 and the plurality of second leads 15 are located on opposite sides of the substrate 11, and each of the first leads 14 is connected to a first output pad 12, respectively.
  • a second lead 15 is respectively connected to a second output pad 13, and the two ends of the portion of the second lead 15 corresponding to the binding region 10 are opposite to the first output pad 12 and the second output pad 13, respectively.
  • the portion of the second lead 15 corresponding to the binding region 10 includes a first end portion 15a, a second end portion 15b, and a connecting portion 15c, the first end portion 15a and the first output pad.
  • the second end portion 15b is opposite to the second output pad 13, that is, the central axis of the first end portion 15a coincides with the projection of the central axis of the first output pad 12 on the substrate 11, and the second end portion 15b
  • the central axis coincides with the projection of the central axis of the second output pad 13 on the substrate 11.
  • the connecting portion 15c is connected between the first end portion 15a and the second end portion 15b.
  • the plurality of first output pads 12 and the plurality of second output pads 13 are alternately disposed, that is, a second output pad 13 is disposed between each adjacent two first output pads 12.
  • the plurality of first output pads 12 and the plurality of second output pads 13 are respectively arranged in a line along the first direction, and the plurality of first output pads 12 and the plurality of second output pads 13 are spaced apart in the second direction, the first direction is The second direction is vertical, wherein the first direction is the x direction in FIG. 1, and the second direction is the y direction in FIG.
  • the flip chip structure 1 in this embodiment is a double row structure in the y direction, wherein the first row of output pads in the y direction is the second output pad 13 and the second row of output pads in the y direction is the first An output pad 12.
  • the shapes of the first output pad 12 and the second output pad 13 are both elongated and perpendicular to the x direction, so that the length of the flip chip structure 1 in the x direction can be shortened.
  • the projection of the second lead 15 on the substrate 11 covers the projection of the first lead 14 on the substrate 11, that is, the first lead 14 and the second lead 15 face each other.
  • the substrate 11 is provided with a via 110 corresponding to the plurality of second output pads 13 , and the second lead 15 is connected to the second output pad 13 via the via 110 .
  • the second lead 15 passes through the via hole 110 and is electrically connected to the second output pad 13 through a wire.
  • the bonding region 10 is located between the via 110 and the first lead 14, that is, the via 110 is not in the bonding region 10, so that the second lead 15 and the via 110 can be avoided during the pressing process.
  • the connection of the wires is biased to cause poor contact between the second lead 15 and the second output pad 13.
  • the flip chip structure 1 of the present embodiment further includes a driving chip 16 , the driving chip 16 and the plurality of first leads 14 are located on the same side of the substrate 11 , and the first lead 14 and the second lead 15 are respectively connected to the driving chip 16 . That is, the first output pad 12 is connected to the driving chip 16 through the first lead 14, and the second output pad 13 is connected to the driving chip 16 through the second lead 15.
  • the second lead 15 is connected to the driving chip 16 through the via 111.
  • the flip chip structure 1 in this embodiment further includes a third input pad 17, the third input pad 17 and the binding region 10 are respectively located at two ends of the substrate 11, and the driving chip 16 is located at the third input pad 17 and tied Between the fixed areas 10, the third input pad 17 is connected to the driving chip 16 through a wire, and the flip chip structure 1 is connected to the driving circuit through a third input pad 17 (not shown) and receives a driving signal of the driving circuit.
  • the present embodiment further provides a display device including a display panel 2 and the above-mentioned flip chip structure 1.
  • the display panel 2 is provided with a plurality of first output pads 12 corresponding to each other. a first input pad 21 and a plurality of second input pads 22 corresponding to the plurality of second output pads 13 .
  • the plurality of first input pads 21 are electrically connected to the plurality of first output pads 12
  • the plurality of second inputs is electrically connected to the plurality of second output pads 13.
  • the driving chip 16 can be electrically connected to the display panel 2 through the first output pad 12, the second output pad 13, the first lead 14, the second lead 15, the first input pad 21, and the second input pad 22, thereby driving The drive signal of the circuit is transmitted to the display panel 2.
  • the display panel 2 in this embodiment includes a substrate 23, an alignment film layer 24, and a display layer 25.
  • the display layer 25 is an OLED, which is not limited herein.
  • the alignment film layer 24 is located between the substrate 23 and the display layer 25. The edges of the alignment film layer 24 and the substrate 23 are beyond the display layer 25. The excess portion is the frame area of the display panel.
  • the first input pad 21 and the second input pad 22 are located. In the border area.
  • a conductive layer 26 is further disposed between the binding region 10 and the frame region.
  • the conductive layer 26 completely covers the first input pad 21 and the second input pad 22.
  • the first input pad 21 and the second input pad 22 pass through the conductive layer 26 and the first layer.
  • An output pad 12 and a second output pad 13 are electrically connected.
  • the pressing head acts on the second lead 15 and presses the first output pad 12 and the second output pad 13 with the first input pad 21 and the second input pad 22, Since the two ends of the portion of the second lead 15 corresponding to the binding region 10 are opposite to the first output pad 12 and the second output pad 13, respectively, that is, the first end portion 15a is opposite to the first output pad 12, The two end portions 15b are opposite to the second output pad 13, that is, the central axis of the first end portion 15a coincides with the projection of the central axis of the first output pad 12 on the substrate 11, and the central axis of the second end portion 15b is The projection of the central axis of the second output pad 13 on the substrate 11 coincides, so that the first output pad 12, the second output pad 13 and the first input pad 21 and the second input pad 22 are evenly stressed during pressing. Therefore, it is possible to avoid the occurrence of undesirable problems such as shallow conductive particles and pressure-bonding bubbles caused by uneven force in the pressing process.

Abstract

本发明提供一种显示装置及其覆晶薄膜结构，所述覆晶薄膜结构包括基材、多个第一输出垫、多个第二输出垫、多个第一引线及多个第二引线，所述基材的一面设有绑定区，所述多个第一输出垫、多个第二输出垫位于所述绑定区中，所述多个第一引线、多个第一输出垫位于所述基材的同一面，所述多个第一引线与所述多个第二引线位于所述基材的相对的两面，每一个所述第一引线分别与一个第一输出垫连接，每一个所述第二引线分别与一个第二输出垫连接，所述第二引线与所述绑定区对应的部分的两个端部分别与所述第一输出垫、第二输出垫正对。本发明提供的覆晶薄膜结构能够避免压合过程中受力不均而引起的导电粒子浅、压合气泡等不良问题的出现。

Description

显示装置及其覆晶薄膜结构 技术领域
本发明涉及显示技术领域，尤其涉及一种显示装置及其覆晶薄膜结构。
背景技术
柔性显示器是用柔性材料制成的可弯曲的显示装置，其具有厚度薄、体积小、轻便、易携带、可弯曲、节能环保、个性时尚等优点，因此，柔性显示器逐渐成为主流。目前，对于柔性显示上的驱动设计主要采用COF(chip on film，覆晶薄膜封装)结构，COF成为柔性显示极具竞争优势的显示技术。随着柔性显示器的分辨率的不断提升，COF所需要的输出垫(pad)的数目越来越多，从而与输出垫连接的引线数目也越来越多，由于COF布线空间有限，这些引线分别设置在COF基材的两面，在COF绑定时，由于引线的存在会使得输出垫在压合过程中受力不均而引起导电粒子浅、压合气泡等不良问题。
发明内容
为了解决现有技术的不足，本发明提供一种显示装置及其覆晶薄膜结构，能够避免压合过程中受力不均而引起的导电粒子浅、压合气泡等不良问题的出现。
本发明提出的具体技术方案为：提供一种覆晶薄膜结构，所述覆晶薄膜结构包括基材、多个第一输出垫、多个第二输出垫、多个第一引线及多个第二引线，所述基材的一面设有绑定区，所述多个第一输出垫、多个第二输出垫位于所述绑定区中，所述多个第一引线、多个第一输出垫位于所述基材的同一面，所述多个第一引线与所述多个第二引线位于所述基材的相对的两面，每一个所述第一引线分别与一个第一输出垫连接，每一个所述第二引线分别与一个第二输出垫连接，所述第二引线与所述绑定区对应的部分的两个端部分别与所述第一输出垫、第二输出垫正对。
可选地，所述多个第一输出垫与所述多个第二输出垫交替设置。
可选地，所述多个第一输出垫、所述多个第二输出垫分别沿第一方向呈直线排列，所述多个第一输出垫与所述多个第二输出垫在第二方向间隔设置，所述第一方向与所述第二方向垂直。
可选地，所述第二引线在所述基材上的投影覆盖所述第一引线在所述基材上的投影。
可选地，所述基材上设置有与所述多个第二输出垫一一对应的过孔，所述第二引线通过所述过孔与所述第二输出垫连接。
可选地，所述绑定区位于所述过孔与所述第一引线之间。
可选地，所述覆晶薄膜结构还包括驱动芯片，所述驱动芯片与所述多个第一引线位于所述基材的同一面，所述第一引线、第二引线分别与所述驱动芯片连接。
本发明还提供了一种显示装置，所述显示装置包括显示面板及如上任一所述的覆晶薄膜结构，所述显示面板上设有与所述多个第一输出垫一一对应的多个第一输入垫及与所述多个第二输出垫一一对应的多个第二输入垫，所述多个第一输入垫与所述多个第一输出垫电连接，所述多个第二输入垫与所述多个第二输出垫电连接。
可选地，还包括设于所述第一输入垫与第一输出垫及第二输入垫与第二输出垫之间的导电层。
可选地，所述多个第一输入垫和所述多个第二输入垫均位于所述显示面板的边缘。
本发明提出的覆晶薄膜结构的多个第一输出垫、多个第二输出垫位于绑定区中，多个第一引线与多个第二引线位于基材的相对的两面，所述第二引线在所述基材上的投影覆盖所述第一输出垫、第二输出垫在所述基材上的投影，从而使得在压合的过程中，第一输出垫与第二输出垫受力均匀，避免压合过程中受力不均而引起的导电粒子浅、压合气泡等不良问题的出现。
附图说明
图1为覆晶薄膜结构的正视图；
图2为覆晶薄膜结构的剖面图；
图3为覆晶薄膜结构的后视图；
图4为显示装置的结构示意图；
图5为图4的局部放大图。
具体实施方式
以下，将参照附图来详细描述本发明的实施例。然而，可以以许多不同的形式来实施本发明，并且本发明不应该被解释为限制于这里阐述的具体实施例。相反，提供这些实施例是为了解释本发明的原理及其实际应用，从而使本领域的其他技术人员能够理解本发明的各种实施例和适合于特定预期应用的各种修改。在附图中，相同的标号将始终被用于表示相同的元件。
参照图1、图2及图3，本实施例提供的覆晶薄膜结构1包括基材11、多个第一输出垫12、多个第二输出垫13、多个第一引线14及多个第二引线15，基材11的一面设有绑定区10，多个第一输出垫12、多个第二输出垫13位于绑定区10中，多个第一引线14、多个第一输出垫12位于基材11的同一面，多个第一引线14与多个第二引线15位于基材11的相对的两面，每一个第一引线14分别与一个第一输出垫12连接，每一个第二引线15分别与一个第二输出垫13连接，第二引线15与绑定区10对应的部分的两个端部分别与第一输出垫12、第二输出垫13正对。
如图3所示，第二引线15与绑定区10对应的部分包括第一端部15a、第二端部15b这两个端部以及连接部15c，第一端部15a与第一输出垫12正对，第二端部15b与第二输出垫13正对，即第一端部15a的中轴线与第一输出垫12的中轴线在基材11上的投影重合，第二端部15b的中轴线与第二输出垫13的中轴线在基材11上的投影重合。连接部15c连接于第一端部15a与第二端部15b之间。
具体地，多个第一输出垫12与多个第二输出垫13交替设置，即每相邻两个第一输出垫12之间设置有一个第二输出垫13。多个第一输出垫12、多个第二输出垫13分别沿第一方向呈直线排列，多个第一输出垫12与多个第二输出垫13在第二方向间隔设置，第一方向与第二方向垂直，其中，第一方向为图1 中的x方向，第二方向为图1中的y方向。
本实施例中的覆晶薄膜结构1为沿y方向的双排结构，其中，在y方向上的第一排输出垫为第二输出垫13，在y方向上的第二排输出垫为第一输出垫12。第一输出垫12、第二输出垫13的形状均为长条形且均与x方向垂直，这样可以缩短覆晶薄膜结构1在x方向上的长度。
为了使得整个覆晶薄膜结构的布线更整洁，第二引线15在基材11上的投影覆盖第一引线14在基材11上的投影，即第一引线14与第二引线15正对。
基材11上设置有与多个第二输出垫13一一对应的过孔110，第二引线15通过过孔110与第二输出垫13连接。其中，第二引线15穿过过孔110后再通过导线与第二输出垫13电连接。较佳地，绑定区10位于过孔110与第一引线14之间，即过孔110不在绑定区10内，这样，可以避免在压合过程中对第二引线15与过孔110中的导线的连接处施力而造成第二引线15与第二输出垫13接触不良。
本实施例中的覆晶薄膜结构1还包括驱动芯片16，驱动芯片16与多个第一引线14位于基材11的同一面，第一引线14、第二引线15分别与驱动芯片16连接，即第一输出垫12通过第一引线14连接至驱动芯片16，第二输出垫13通过第二引线15连接至驱动芯片16。其中，第二引线15通过过孔111与驱动芯片16连接。
此外，本实施例中的覆晶薄膜结构1还包括第三输入垫17，第三输入垫17与绑定区10分别位于基材11的两端，驱动芯片16位于第三输入垫17与绑定区10之间，第三输入垫17通过导线与驱动芯片16连接，覆晶薄膜结构1通过第三输入垫17与驱动电路连接(图未示)并接受驱动电路的驱动信号。
参照图4、图5，本实施例还提供了一种显示装置，其包括显示面板2及上述覆晶薄膜结构1，显示面板2上设有与多个第一输出垫12一一对应的多个第一输入垫21及与多个第二输出垫13一一对应的多个第二输入垫22，多个第一输入垫21与多个第一输出垫12电连接，多个第二输入垫22与多个第二输出垫13电连接。通过第一输出垫12、第二输出垫13、第一引线14、第二引线15、第一输入垫21、第二输入垫22便可以将驱动芯片16与显示面板2电连接，从而将驱动电路的驱动信号传送给显示面板2。
本实施例中的显示面板2包括基板23、配向膜层24及显示层25，其中，显示层25为OLED，当然，这里不做限定。配向膜层24位于基板23与显示层25之 间，配向膜层24和基板23的边缘超出显示层25，超出部分即为显示面板的边框区域，第一输入垫21、第二输入垫22位于该边框区域中。
绑定区10与边框区域之间还设有导电层26，导电层26完全覆盖第一输入垫21和第二输入垫22，第一输入垫21、第二输入垫22通过导电层26与第一输出垫12、第二输出垫13电连接。
参照图5，在压合过程中，本压压头作用于第二引线15上并将第一输出垫12、第二输出垫13与第一输入垫21、第二输入垫22进行压合，由于第二引线15与绑定区10对应的部分的两个端部分别与第一输出垫12、第二输出垫13正对，即第一端部15a与第一输出垫12正对，第二端部15b与第二输出垫13正对，也就是第一端部15a的中轴线与第一输出垫12的中轴线在基材11上的投影重合，第二端部15b的中轴线与第二输出垫13的中轴线在基材11上的投影重合，这样，在压合时，第一输出垫12、第二输出垫13及第一输入垫21、第二输入垫22受力均匀，因此，可以避免压合过程中受力不均而引起的导电粒子浅、压合气泡等不良问题的出现。
以上所述仅是本申请的具体实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本申请原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本申请的保护范围。

Claims (16)

  1. 一种覆晶薄膜结构，其中，包括基材、多个第一输出垫、多个第二输出垫、多个第一引线及多个第二引线，所述基材的一面设有绑定区，所述多个第一输出垫、多个第二输出垫位于所述绑定区中，所述多个第一引线、多个第一输出垫位于所述基材的同一面，所述多个第一引线与所述多个第二引线位于所述基材的相对的两面，每一个所述第一引线分别与一个第一输出垫连接，每一个所述第二引线分别与一个第二输出垫连接，所述第二引线与所述绑定区对应的部分的两个端部分别与所述第一输出垫、第二输出垫正对。
  2. 根据权利要求1所述的覆晶薄膜结构，其中，所述多个第一输出垫与所述多个第二输出垫交替设置。
  3. 根据权利要求2所述的覆晶薄膜结构，其中，所述多个第一输出垫、所述多个第二输出垫分别沿第一方向呈直线排列，所述多个第一输出垫与所述多个第二输出垫在第二方向间隔设置，所述第一方向与所述第二方向垂直。
  4. 根据权利要求1所述的覆晶薄膜结构，其中，所述第二引线在所述基材上的投影覆盖所述第一引线在所述基材上的投影。
  5. 根据权利要求1所述的覆晶薄膜结构，其中，所述基材上设置有与所述多个第二输出垫一一对应的过孔，所述第二引线通过所述过孔与所述第二输出垫连接。
  6. 根据权利要求5所述的覆晶薄膜结构，其中，所述绑定区位于所述过孔与所述第一引线之间。
  7. 根据权利要求1所述的覆晶薄膜结构，其中，还包括驱动芯片，所述驱动芯片与所述多个第一引线位于所述基材的同一面，所述第一引线、第二引线分别与所述驱动芯片连接。
  8. 一种显示装置，其中，包括显示面板及覆晶薄膜结构，所述覆晶薄膜结构包括基材、多个第一输出垫、多个第二输出垫、多个第一引线及多个第二引线，所述基材的一面设有绑定区，所述多个第一输出垫、多个第二输出垫位于所述绑定区中，所述多个第一引线、多个第一输出垫位于所述基材的同一面，所述多个第一引线与所述多个第二引线位于所述基材的相对的两面，每一个所 述第一引线分别与一个第一输出垫连接，每一个所述第二引线分别与一个第二输出垫连接，所述第二引线与所述绑定区对应的部分的两个端部分别与所述第一输出垫、第二输出垫正对，所述显示面板上设有与所述多个第一输出垫一一对应的多个第一输入垫及与所述多个第二输出垫一一对应的多个第二输入垫，所述多个第一输入垫与所述多个第一输出垫电连接，所述多个第二输入垫与所述多个第二输出垫电连接。
  9. 根据权利要求8所述的显示装置，其中，所述多个第一输出垫与所述多个第二输出垫交替设置。
  10. 根据权利要求9所述的显示装置，其中，所述多个第一输出垫、所述多个第二输出垫分别沿第一方向呈直线排列，所述多个第一输出垫与所述多个第二输出垫在第二方向间隔设置，所述第一方向与所述第二方向垂直。
  11. 根据权利要求8所述的显示装置，其中，所述第二引线在所述基材上的投影覆盖所述第一引线在所述基材上的投影。
  12. 根据权利要求8所述的显示装置，其中，所述基材上设置有与所述多个第二输出垫一一对应的过孔，所述第二引线通过所述过孔与所述第二输出垫连接。
  13. 根据权利要求12所述的显示装置，其中，所述绑定区位于所述过孔与所述第一引线之间。
  14. 根据权利要求8所述的显示装置，其中，还包括驱动芯片，所述驱动芯片与所述多个第一引线位于所述基材的同一面，所述第一引线、第二引线分别与所述驱动芯片连接。
  15. 根据权利要求8所述的显示装置，其中，还包括设于所述第一输入垫与第一输出垫及第二输入垫与第二输出垫之间的导电层。
  16. 根据权利要求8所述的显示装置，其中，所述多个第一输入垫和所述多个第二输入垫均位于所述显示面板的边缘。
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