WO2019111769A1 - ランプの点灯方法 - Google Patents

ランプの点灯方法 Download PDF

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Publication number
WO2019111769A1
WO2019111769A1 PCT/JP2018/043624 JP2018043624W WO2019111769A1 WO 2019111769 A1 WO2019111769 A1 WO 2019111769A1 JP 2018043624 W JP2018043624 W JP 2018043624W WO 2019111769 A1 WO2019111769 A1 WO 2019111769A1
Authority
WO
WIPO (PCT)
Prior art keywords
exposure
power
discharge lamp
lamp
light
Prior art date
Application number
PCT/JP2018/043624
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
池田　富彦
Original Assignee
フェニックス電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by フェニックス電機株式会社 filed Critical フェニックス電機株式会社
Priority to KR1020207015668A priority Critical patent/KR20200096916A/ko
Priority to CN201880076452.4A priority patent/CN111466011B/zh
Priority to JP2019558157A priority patent/JP7278596B2/ja
Publication of WO2019111769A1 publication Critical patent/WO2019111769A1/ja

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008—Production of exposure light, i.e. light sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J61/00—Gas-discharge or vapour-discharge lamps
    • H01J61/84—Lamps with discharge constricted by high pressure
    • H01J61/88—Lamps with discharge constricted by high pressure with discharge additionally constricted by envelope
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/40—Control techniques providing energy savings, e.g. smart controller or presence detection

Definitions

  • the present invention relates to, for example, a method of lighting a lamp that emits light used for exposure of a printed wiring board or the like.
  • a printed wiring board in which a wiring pattern is formed of a metal such as copper on a resin or glass epoxy substrate is used.
  • Photo etching technology is used to form a wiring pattern on these printed wiring boards.
  • a photoresist which is a photosensitive agent, is coated on the entire surface of the substrate on which the metal layer to be the wiring is formed, and the irradiation light from the exposure device is irradiated through the same photomask as the wiring pattern.
  • the photoresist there are a negative photoresist in which the solubility of the photoresist is reduced by the irradiation light, and a positive photoresist in which the solubility of the photoresist is increased by the irradiation light.
  • the photoresist portion whose solubility has been relatively increased by the irradiation light is chemically treated and removed, and when the exposed metal layer is removed by etching, only the metal layer under the portion where the photoresist remains remains, and the photoresist is removed.
  • the wiring pattern is formed on the substrate.
  • a discharge lamp with a large amount of light emission per lamp is used as a light source to ensure uniform exposure over the entire irradiation surface. ing.
  • the discharge lamp excites mercury enclosed in the internal space by causing an arc discharge between a pair of electrodes arranged to face each other in a hermetically sealed internal space in the light emitting tube, to thereby emit ultraviolet light. Is made to emit light.
  • the type of photoresist determines the optimum exposure time, that is, the length of time for which the light from the discharge lamp is applied to the photoresist. For this reason, a shutter is disposed between the discharge lamp and the object to be exposed (such as a photoresist), and the object to be exposed is exposed with the optimum exposure time by opening the shutter only for the necessary time. It is generally practiced to keep the shutter closed while replacing the exposure object. (For example, patent document 1).
  • the present invention has been made in view of such problems, and an object of the present invention is to provide a discharge lamp capable of reducing unnecessary power which does not contribute to the exposure of an exposure object and prolonging the life of the lamp. It is to provide a lighting method.
  • a lamp lighting method which supplies standby power lower than the exposure power and capable of maintaining the lighting state of the lamp with respect to the lamp except for the exposure time.
  • the lamp is a discharge lamp
  • the time for supplying the exposure power is a steady internal pressure of the discharge lamp when the internal pressure of the discharge lamp continues to supply the exposure power to the discharge lamp. Shorter than the time to reach.
  • the lamp is an LED (light emitting diode), and the time for supplying the exposure power is a steady state junction of the LED when the junction temperature of the LED continues to supply the exposure power to the LED. Shorter than the time to reach the temperature.
  • the power supplied to the lamp is stopped and turned off except during the exposure time.
  • the irradiation intensity from the lamp is changed during the exposure time in accordance with the light receiving sensitivity of the photoresist to be exposed.
  • the present invention it is possible to provide a lamp lighting method capable of reducing unnecessary power which does not contribute to the exposure of an exposure object and prolonging the life of the lamp.
  • FIG. 2 is a cross-sectional view showing an example of a discharge lamp 110. It is a graph which shows an example of the electric power supplied to the discharge lamp 110 by the lighting method which concerns on this invention. It is a graph which shows another example of the electric power supplied to the discharge lamp 110 by the lighting method which concerns on this invention.
  • FIG. 1 It is a graph which shows an example of the relation between the elapsed time after starting supply of electric power to LED by the lighting method concerning modification 1, and the irradiation intensity of the light irradiated from the LED concerned. It is a figure which shows an example of the irradiation intensity of the light within exposure time by the lighting method which concerns on the modification 2.
  • FIG. 2 It is a figure which shows an example of the irradiation intensity of the light within exposure time by the lighting method which concerns on the modification 2.
  • FIG. It is a figure which shows an example of the irradiation intensity of the light within exposure time by the lighting method which concerns on the modification 2.
  • FIG. 1 It is a figure which shows an example of the irradiation intensity of the light within exposure time by the lighting method which concerns on the modification 2.
  • FIG. 2 It is a figure which shows an example of the irradiation intensity of the light within exposure time by the lighting method which concerns on the modification 2.
  • FIG. 1 shows an exposure apparatus 10 according to a first embodiment to which the present invention is applied.
  • the exposure apparatus 10 is generally configured of an exposure device 50, an integrator 12, a concave mirror 14, an irradiation surface 16, and a shutter 24.
  • the exposure apparatus 50 emits light including a wavelength suitable for the exposure of the exposure object X.
  • the details of the exposure apparatus 50 will be described after the configuration of the exposure apparatus 10 is described.
  • the integrator 12 has an incident surface 18 for receiving the light from the exposure device 50, and an emission surface 20 for emitting the light after improving the uniformity of the received light.
  • a plurality of fly's eye lenses 21 are formed on the entrance surface 18 and the exit surface 20, respectively.
  • the concave mirror 14 has a reflective concave surface 22 inside thereof.
  • the concave mirror 14 reflects the light emitted from the integrator 12 by the reflecting concave surface 22 into parallel light.
  • the irradiation surface 16 is light that receives parallel light from the concave mirror 14 and is disposed in a direction substantially orthogonal to the parallel light.
  • An exposure object X is placed on the irradiation surface 16.
  • a photosensitive agent or a photoresist is applied to the surface of the exposure object X.
  • a desired circuit pattern or the like is formed on the surface of the exposure object X by the parallel light from the concave mirror 14 irradiating a desired region of the exposure object X.
  • the shutter 24 is a device disposed on the side of the exit surface 20 of the integrator 12 for opening and closing a path (light path) of light from the discharge lamp 110.
  • a path light path
  • the shutter 24 is opened in accordance with the exposure time of the exposure object X, the light from the discharge lamp 110 reaches the exposure object X, and the shutter 24 is closed for a time other than the exposure time.
  • Light from the light source 16 does not reach the illuminated surface 16 undesirably.
  • the position at which the shutter 24 is disposed is not limited to the present embodiment, and may be disposed at another position on the optical path from the discharge lamp 110 to the exposure object X.
  • FIG. 2 is a view showing an exposure apparatus 50 according to the first embodiment to which the present invention is applied.
  • FIG. 3 is a plan view of the exposure apparatus 50.
  • the exposure apparatus 50 includes a plurality of light source devices 100, a frame 52, a discharge lamp switch 53, a discharge lamp power supply 54, and a control unit 60.
  • the light source device 100 emits light including a wavelength suitable for the exposure of the exposure object X.
  • the light source device 100 is generally configured of a discharge lamp 110, a reflector 150, and an insulating base 170.
  • the reflector 150 and the insulating base 170 may be collectively described as a reflector container 151.
  • the discharge lamp 110 has a light emitting tube portion 112 and a pair of seal portions 114 extending from the light emitting tube portion 112.
  • the light emitting tube portion 112 and the pair of seal portions 114 are integrally formed of quartz glass. Furthermore, an internal space 116 sealed by a seal portion 114 is formed in the light emitting tube portion 112.
  • each seal portion 114 of the discharge lamp 110 a buried foil 118 made of molybdenum and one end connected to one end of the foil 118 and the other end made of tungsten disposed in the internal space 116
  • a pair of electrodes 120 and a pair of lead rods 122 each having one end connected to the other end of the foil 118 and the other end extending from the seal portion 114 to the outside are provided.
  • predetermined amounts of mercury 124 and halogen for example, bromine
  • one seal portion 114 is inserted into the seal portion insertion hole 156 of the reflector 150.
  • the discharge lamp 110 may be for alternating current lighting or direct current lighting.
  • the reflector 150 has a bowl-shaped reflective surface 152 on its inner surface.
  • the reflecting surface 152 reflects part of the light from the discharge lamp 110 disposed so that the light emitting tube 112 is positioned inside the reflector 150.
  • the reflecting surface 152 is defined by a paraboloid of revolution.
  • the light emitting point in the discharge lamp 110 (generally, the central position of the arc formed between the pair of electrodes 120 in the internal space 116) coincides with the focal point of the paraboloid of revolution.
  • the light emitted from the light emitting point of the discharge lamp 110 and reflected by the reflection surface 152 is substantially parallel light from the opening 154 of the reflector 150.
  • the shape of the reflecting surface 152 is not limited to this, and may be a shape of an ellipsoid of revolution, another rotating surface, or a surface other than the rotating surface. Further, it is not essential to make the light emitting point coincide with the focal point, and the light emitting point may be shifted from the focal point if necessary.
  • a bottom neck portion 155 is provided to project from the side opposite to the opening 154 in the reflector 150. Furthermore, on the reflection surface 152 of the reflector 150, a seal portion insertion hole 156 in which one seal portion 114 of the discharge lamp 110 is inserted is formed. The seal portion insertion hole 156 is formed from the bottom of the reflective surface 152 to the tip of the bottom neck 155.
  • the light emitted from the discharge lamp 110 has a predetermined angle (opening angle) centered on the light traveling along the central axis CL of the reflecting surface 152. In the front of the reflector 150.
  • the insulating base 170 is formed of an electrical insulator such as ceramic, and one seal portion of the discharge lamp 110 inserted in the bottom and neck portion 155 of the reflector 150 and the seal portion insertion hole 156 A reflector insertion hole 172 is formed in which 114 is inserted. By inserting the bottom and neck portion 155 and the seal portion 114 into the reflector insertion hole 172, the insulating base 170 covers the seal portion insertion hole 156 from the outside.
  • an inner space 174 communicating with the above-described reflector insertion hole 172 is formed in the insulating base 170, and the power cable insertion hole through which the inner cable 174 and the outside communicate with each other and the power cable A is inserted. 176 are formed.
  • the insulating base 170 and the discharge lamp 110 are fixed to each other by an inorganic adhesive C having electrical insulation and high thermal conductivity.
  • the end of the bottom neck 155 of the reflector 150 and one seal portion 114 of the discharge lamp 110 are inserted into the reflector insertion hole 172 of the insulating base 170, and the inner space 174 of the insulating base 170 is further inserted.
  • the inner space 174 is filled with the inorganic adhesive C.
  • the frame 52 is a substantially rectangular parallelepiped member in which a plurality of recesses 58 to which the plurality of light source devices 100 are attached are formed.
  • the discharge lamp power supply 54 supplies necessary power to the discharge lamp 110 of each light source device 100 attached to the frame 52. Further, the discharge lamp switch 53 turns on / off the current supplied to the discharge lamp 110.
  • the control unit 60 has a function of operating the discharge lamp power supply 54 to control the power supplied from the discharge lamp power supply 54 to the discharge lamp 110. Specifically, as shown in FIG. 6, when the discharge lamp power source 54 exposes the exposure object X, the controller 60 controls the exposure power H (only for the time necessary for the exposure (exposure time)). For example, the rated power of the discharge lamp 110 is supplied. Further, control is performed to supply standby power L lower than the exposure power H to the discharge lamp 110 and capable of maintaining the lighting state of the discharge lamp 110 except for the exposure time.
  • FIG. 6 shows an example in which the discharge lamp power supply 54 supplies the pulse-wave shaped exposure power H
  • the waveform of the exposure power H supplying the discharge lamp power supply 54 is limited to this.
  • the standby power L may be increased or decreased linearly (linearly) from the standby power L to the exposure power H, or, although not shown, the quadratic (parabolic) May be increased or decreased.
  • the value of the exposure power H during the exposure time may not be constant. Even if relatively high exposure power is supplied in the first half of the exposure time as in FIG.
  • the amount of power supplied within the exposure time (The value obtained by time-integrating the power may be equivalent to the patterns of FIG. 6 and FIG. Further, according to the characteristics of the exposure object X (for example, resist), as shown in FIGS. 9 and 10, the power supplied to the discharge lamp 110 is changed during the exposure time to change the light emission intensity of the discharge lamp 110. May be
  • the discharge lamp power source 54 is operated for a predetermined time (that is, a predetermined exposure time). ), Supplies the exposure power H higher than the start power to the discharge lamp 110.
  • the shutter 24 of the exposure device 10 is opened, and the exposure light from the discharge lamp 110 is applied to the exposure object X to carry out the exposure operation.
  • the shutter 24 is closed, and the power supplied from the discharge lamp power supply 54 to the discharge lamp 110 returns from the exposure power H to the standby power L. Thereafter, the exposure object X after the exposure is replaced with the unexposed exposure object X, and the above-described exposure operation is performed again. Thereafter, this exposure operation is repeated.
  • the standby power L relatively low is supplied to the discharge lamp 110 when the light from the discharge lamp 110 does not contribute to the exposure of the exposure object X because the shutter 24 is closed, unnecessary power is reduced. be able to.
  • the pressure in the internal space 116 of the light emitting tube portion 112 in the lit discharge lamp 110 is relatively low when the standby power L is supplied, and the supply of the exposure power H. The pressure starts to rise. The pressure which started to rise becomes maximum when it returns from the exposure power H to the standby power L, and starts to decrease. Such behavior is repeated thereafter.
  • the internal pressure of the discharge lamp 110 discharges the exposure power H during the time of supplying the exposure power H. It is shorter than the time to reach the steady internal pressure of the discharge lamp 110 (that is, the pressure state as illustrated in FIG. 8) when the supply to 110 is continued. For this reason, even if the exposure power H when performing the exposure operation of the exposure object X matches the rated power in the conventional method and the same amount of light is emitted, the light emitting tube portion of the discharge lamp 110 The peak pressure of the internal space 116 at 112 can be kept low compared to when using the conventional method.
  • the junction temperature of the LED gives exposure power to the LED
  • the exposure power is supplied in a time shorter than the time required to reach the steady junction temperature of the LED when the supply is continued.
  • the standby power L lower than the exposure power H is supplied except for the exposure time, but when an LED or a laser is used as a lamp, it is supplied other than the exposure time
  • the power may be shut off to turn off the LED or the laser.
  • the irradiation intensity of the light emitted from the light source device 100 within the exposure time may be constant.
  • the continuous exposure time is divided into, for example, two ("first exposure time” and "second exposure time"), and irradiation from the light source device 100 is performed in these first exposure time and second exposure time. It is also possible to change the irradiation intensity of the received light.
  • FIG. 14 described above shows an example in which the irradiation intensity is strong in the first exposure time and is weak in the second exposure time
  • the first exposure time is, as shown in FIG.
  • the irradiation intensity may be weak, and the irradiation intensity may be stronger in the second exposure time than this.
  • the irradiation intensity may be gradually increased in the first exposure time, and may be constant in the second exposure time.
  • the continuous exposure time may be divided into three or more. For example, as shown in FIG. 17, the irradiation intensity is gradually increased in the first exposure time, and the irradiation intensity is made constant in the second exposure time.
  • the irradiation intensity may be gradually reduced in the third exposure time. Further, as shown in FIG. 18, the irradiation intensity is gradually increased rapidly in the first exposure time, made constant after the irradiation intensity is first dropped sharply in the second exposure time, and made constant first in the third exposure time. And may be reduced quadratically. It is possible to change the irradiation intensity in this way as well when using an LED or a laser as the lamp, as well as using the discharge lamp 110 as a matter of course.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Circuit Arrangements For Discharge Lamps (AREA)
  • Discharge Lamps And Accessories Thereof (AREA)
  • Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
PCT/JP2018/043624 2017-12-08 2018-11-27 ランプの点灯方法 WO2019111769A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020207015668A KR20200096916A (ko) 2017-12-08 2018-11-27 램프의 점등 방법
CN201880076452.4A CN111466011B (zh) 2017-12-08 2018-11-27 灯的点亮方法
JP2019558157A JP7278596B2 (ja) 2017-12-08 2018-11-27 ランプの点灯方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017236525 2017-12-08
JP2017-236525 2017-12-08

Publications (1)

Publication Number Publication Date
WO2019111769A1 true WO2019111769A1 (ja) 2019-06-13

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ID=66751056

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2018/043624 WO2019111769A1 (ja) 2017-12-08 2018-11-27 ランプの点灯方法

Country Status (5)

Country Link
JP (1) JP7278596B2 (ko)
KR (1) KR20200096916A (ko)
CN (1) CN111466011B (ko)
TW (2) TWI794352B (ko)
WO (1) WO2019111769A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022224576A1 (ja) * 2021-04-23 2022-10-27 株式会社ブイ・テクノロジー 照明装置の制御方法及び露光装置

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JP2000003846A (ja) * 1998-06-15 2000-01-07 Canon Inc 露光装置
JP2008027874A (ja) * 2006-07-25 2008-02-07 Ccs Inc 光照射システム及び光制御装置
JP2010056219A (ja) * 2008-08-27 2010-03-11 Stanley Electric Co Ltd 半導体発光素子のジャンクション温度の制御方法
JP2010123804A (ja) * 2008-11-20 2010-06-03 Moritex Corp Ｌｅｄ駆動装置
WO2012090489A1 (ja) * 2010-12-27 2012-07-05 パナソニック株式会社 発光ダイオード用駆動回路及びｌｅｄ光源
JP2012174807A (ja) * 2011-02-18 2012-09-10 Ushio Inc 紫外線照射装置
JP2012212836A (ja) * 2011-03-31 2012-11-01 Ushio Inc 放電ランプ点灯装置
WO2013147052A1 (ja) * 2012-03-29 2013-10-03 株式会社オーク製作所 放電ランプを備えた照明装置

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JP2002373840A (ja) 2001-06-14 2002-12-26 Fuji Electric Co Ltd 露光装置および露光方法
JP4937808B2 (ja) * 2007-03-26 2012-05-23 フェニックス電機株式会社 光源装置ならびにこれを用いた露光装置
TWI456356B (zh) * 2009-04-09 2014-10-11 Nsk Technology Co Ltd 曝光裝置用之光照射裝置及其點亮控制方法、曝光裝置及基板
JP2011014766A (ja) * 2009-07-03 2011-01-20 Koito Mfg Co Ltd 発光モジュールおよび車両用灯具

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Publication number Priority date Publication date Assignee Title
JP2000003846A (ja) * 1998-06-15 2000-01-07 Canon Inc 露光装置
JP2008027874A (ja) * 2006-07-25 2008-02-07 Ccs Inc 光照射システム及び光制御装置
JP2010056219A (ja) * 2008-08-27 2010-03-11 Stanley Electric Co Ltd 半導体発光素子のジャンクション温度の制御方法
JP2010123804A (ja) * 2008-11-20 2010-06-03 Moritex Corp Ｌｅｄ駆動装置
WO2012090489A1 (ja) * 2010-12-27 2012-07-05 パナソニック株式会社 発光ダイオード用駆動回路及びｌｅｄ光源
JP2012174807A (ja) * 2011-02-18 2012-09-10 Ushio Inc 紫外線照射装置
JP2012212836A (ja) * 2011-03-31 2012-11-01 Ushio Inc 放電ランプ点灯装置
WO2013147052A1 (ja) * 2012-03-29 2013-10-03 株式会社オーク製作所 放電ランプを備えた照明装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022224576A1 (ja) * 2021-04-23 2022-10-27 株式会社ブイ・テクノロジー 照明装置の制御方法及び露光装置

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TWI794352B (zh) 2023-03-01
KR20200096916A (ko) 2020-08-14
CN111466011B (zh) 2023-05-23
JPWO2019111769A1 (ja) 2020-11-26
TW201931438A (zh) 2019-08-01
TWI815773B (zh) 2023-09-11
TW202324501A (zh) 2023-06-16
JP7278596B2 (ja) 2023-05-22
CN111466011A (zh) 2020-07-28

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