WO2019100559A1 - 点灯回点治具及其检测面板的方法 - Google Patents
点灯回点治具及其检测面板的方法 Download PDFInfo
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- WO2019100559A1 WO2019100559A1 PCT/CN2018/072310 CN2018072310W WO2019100559A1 WO 2019100559 A1 WO2019100559 A1 WO 2019100559A1 CN 2018072310 W CN2018072310 W CN 2018072310W WO 2019100559 A1 WO2019100559 A1 WO 2019100559A1
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1306—Details
- G02F1/1309—Repairing; Testing
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2300/00—Aspects of the constitution of display devices
- G09G2300/04—Structural and physical details of display devices
- G09G2300/0404—Matrix technologies
- G09G2300/0408—Integration of the drivers onto the display substrate
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2300/00—Aspects of the constitution of display devices
- G09G2300/04—Structural and physical details of display devices
- G09G2300/0404—Matrix technologies
- G09G2300/0413—Details of dummy pixels or dummy lines in flat panels
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2300/00—Aspects of the constitution of display devices
- G09G2300/04—Structural and physical details of display devices
- G09G2300/0421—Structural details of the set of electrodes
- G09G2300/0426—Layout of electrodes and connections
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2330/00—Aspects of power supply; Aspects of display protection and defect management
- G09G2330/12—Test circuits or failure detection circuits included in a display system, as permanent part thereof
Definitions
- the present invention relates to the field of liquid crystal displays, and more particularly to a method for lighting a point return fixture and a method for detecting the same.
- LCDs liquid crystal displays
- LCDs liquid crystal displays
- notebooks because of their high image quality, power saving, thin body and wide application range.
- each sub-pixel has a thin film transistor (TFT) whose gate is connected to a horizontal scanning line, a source is connected to a vertical data line, and a drain is connected to a drain.
- TFT thin film transistor
- Applying a sufficient voltage on the horizontal scanning line causes all the TFTs on the horizontal scanning line to be turned on.
- the pixel electrodes on the horizontal scanning line are connected to the data lines in the vertical direction, thereby connecting the data lines.
- the display signal voltage is written into the pixel, and the transmittance of different liquid crystals is controlled to achieve the effect of controlling the color.
- the driving of the horizontal scanning line of the active liquid crystal display panel is mainly completed by an external chip (IC) of the panel, and the external IC can control the stepwise charging and discharging of the horizontal scanning lines of each level.
- IC external chip
- Gate Driver On Array (GOA) technology which uses the existing thin film transistor liquid crystal display array (Array) process to fabricate the gate scan drive signal circuit on the Array substrate to realize the Gate on the Array substrate. The way the line scan is driven.
- the basic process of a typical liquid crystal display is divided into four segments: Array, Colour Filter, Cell, and Module.
- the array process mainly includes forming a TFT on a glass substrate by using a coating, exposure, development, etching, etc.; the process of forming a package mainly includes forming a liquid crystal cutting lob and injecting a liquid crystal material; the module process mainly includes adding the cut panel. Install driver chips, printed circuit boards, backlight modules, etc.
- a plurality of inspection procedures are required.
- One of the most important inspection procedures is to test the cut-out liquid crystal cell, that is, to form a box-stage test to confirm whether the liquid crystal cell has defects.
- the test process generally first inputs a test signal to the liquid crystal panel to make the pixels appear color, and then observes each pixel one by one through the defect detecting device. This process is called a Light-on Test.
- the factory generally bonds a cof bonding pad through a cell test pad, and inputs a test signal to the liquid crystal panel through a box test pad.
- a chip on film is formed by bonding a chip (a source driver IC or a gate driver IC) to a flexible wiring board on which a wiring pattern is formed.
- the wiring pattern of the flip chip is usually composed of an inner lead connected to the electrodes of the chip and an outer lead connected to an external circuit.
- each pixel is controlled by a grid line and a data line which are criss-crossed on the substrate to realize display of an image.
- the scan signal and the data signal are emitted from a control chip in the liquid crystal display, and the scan signal and the data signal are usually transmitted to the gate lines and the data lines on the substrate, respectively, by using a flip chip.
- the flip chip is connected to a set of sector leads on the substrate through a set of connection leads, and then connected to the gate lines or data lines of the display area.
- FIG. 1 it is a schematic diagram of the disconnection between the bonding test pad and the flip chip bonding pad after the detection of the boxing stage in the prior art.
- the box-forming test pad is bonded to the flip-chip bonding pad 1 of the flip-chip film in the bonding area shown in the box of FIG. 1, and the box-stage detecting device can test the pad through the box. Enter a test signal to the display panel.
- the laser device is used to disconnect the trace between the box-testing test pad and the flip-chip bonding pad to prevent ESD (electrostatic discharge) from soldering.
- ESD electrostatic discharge
- the detection stage in the box-forming stage often causes leakage (issues in the module stage detection) and Inspection (there is no such problem in the module stage), resulting in loss of yield, material waste, and cost loss; at this time, the box-stage inspection equipment often performs a perfect inspection scheme because there is no corresponding issue panel sample. The plan could not be improved in time, resulting in the program not being able to control in time. Since the trace between the box test pad and the flip chip bond pad has been disconnected after the card phase is detected, it is impossible to return to the box stage and perform the lighting test again.
- Another object of the present invention is to provide a method for lighting a point return fixture detection panel, so that the module stage panel can be returned to the cassette stage for detection.
- the present invention provides a lighting back point fixture comprising: a flexible circuit board and an X board; the flexible circuit board is provided with a joint area at one end for bonding to the X board, and the other end is provided a bonding region for bonding to a flip chip of the liquid crystal panel cut into a test soldering pad; the X plate being provided with a detecting pad for connecting the card phase detecting device and the flexible circuit board; the flexible circuit The board is provided with internal wiring for connecting the detecting pad and the flip chip of the liquid crystal panel when the flexible circuit board is simultaneously bonded to the X board and the liquid crystal panel.
- the detecting pad comprises a GOA signal detecting pad.
- the detecting pad comprises a data trace detecting pad.
- the data trace detection pad includes a red pixel data trace pad, a green pixel data trace pad, and a blue pixel data trace pad.
- red pixel data traces drawn from the red pixel data trace pads green pixel data traces drawn from the green pixel data trace pads, and from the blue The blue pixel data traces from the color pixel data trace pads are shorted together.
- the invention also provides a method for lighting a point return fixture detection panel, comprising:
- Step 10 providing a flexible circuit board and an X board
- Step 20 the bonding region provided at one end of the flexible circuit board is bonded to the X board, and the bonding region provided at the other end is bonded to the flip chip of the liquid crystal panel cut into the box test pad;
- Step 30 The X board is provided with a detection pad for connecting the box stage detecting device and the flexible circuit board;
- Step 40 When the flexible circuit board is simultaneously joined to the X board and the liquid crystal panel, the detecting pad and the flip chip of the liquid crystal panel are connected through an internal trace of the flexible circuit board.
- the detecting pad comprises a GOA signal detecting pad.
- the detecting pad comprises a data trace detecting pad.
- the data trace detection pad includes a red pixel data trace pad, a green pixel data trace pad, and a blue pixel data trace pad.
- red pixel data traces drawn from the red pixel data trace pads green pixel data traces drawn from the green pixel data trace pads, and from the blue The blue pixel data traces from the color pixel data trace pads are shorted together.
- the present invention also provides a lighting back point fixture comprising: a flexible circuit board and an X board; the flexible circuit board is provided with a bonding area at one end for bonding to the X board, and the other end is provided with a bonding area for bonding To a flip chip of the liquid crystal panel cut into a test soldering pad; the X board is provided with a detecting pad for connecting the card phase detecting device and the flexible circuit board; the flexible circuit board is provided with an internal walking a wire, the inner trace is used to connect the detecting pad and the flip chip of the liquid crystal panel when the flexible circuit board is simultaneously bonded to the X board and the liquid crystal panel;
- the detecting pad comprises a GOA signal detecting pad
- the detecting pad comprises a data trace detecting pad
- the data trace detection pad includes a red pixel data trace pad, a green pixel data trace pad, and a blue pixel data trace pad;
- red pixel data traces drawn from the red pixel data trace pads green pixel data traces drawn from the green pixel data trace pads, and from the blue The blue pixel data traces from the color pixel data trace pads are shorted together.
- the lighting point return fixture of the present invention and the method for detecting the same can improve the detection yield and reduce the waste of material, machine, manpower, etc.; the convenient module stage panel can be returned to the box stage for detection.
- FIG. 1 is a schematic view showing the disconnection of a trace between a package test pad and a flip chip bond pad after the detection of the card forming stage in the prior art
- FIG. 2 is a schematic view showing the internal connection of a preferred embodiment of the lighting point return point fixture according to the present invention
- FIG. 3 is a schematic view showing the application of a preferred embodiment of the lighting point return point fixture of the present invention.
- the lighting point return fixture of the present invention mainly comprises: a flexible circuit board 10 and an X board 20; the flexible circuit board 10 is provided with a joint area at one end for joining to the X board 20, and the other end is provided with a joint area for Bonding to the flip chip of the liquid crystal panel 40 cut into the test strip 30; the X board 20 is provided with a detecting pad 50 for connecting the cassette stage detecting device and the flexible circuit board 10; The circuit board 10 is provided with an internal trace 60 for connecting the detecting pad 50 and the liquid crystal panel 40 when the flexible circuit board 10 is simultaneously bonded to the X board 20 and the liquid crystal panel 40. A flip chip.
- the test pad 50 may include a GOA signal detecting pad, that is, pads P1 to Pn+1.
- the detection pad may further include a data trace detection pad, that is, a pad R/G/B, which are a red pixel data trace pad, a green pixel data trace pad, and a blue pixel data trace pad.
- a pad R/G/B which are a red pixel data trace pad, a green pixel data trace pad, and a blue pixel data trace pad.
- the red pixel data traces drawn from the red pixel data trace pads, the green pixel data traces from the green pixel data trace pads, and the traces from the blue pixel data trace pads
- the blue pixel data traces are shorted together; that is, on the X board 20, the pads R, G, and B respectively lead to a plurality of data traces, and are shorted together to make them into a box.
- the connection is consistent in the general detection of the stage.
- the invention designs an IC-free flexible circuit board (FPC) and an X-board (Xboard-B) as a return point board at the product design stage, and can be bonded on the liquid crystal panel instead of the cut box.
- Test pad the invention is applicable to GOA products; the invention can improve the detection yield and reduce the waste of materials, machine, manpower and the like.
- FIG. 3 it is a schematic diagram of an application of a preferred embodiment of a lighting point return fixture according to the present invention.
- the liquid crystal panel display area of the liquid crystal panel 40 is provided with a GOA module for driving, so that the cut-out box-forming test pads 30 are provided on both sides, and when the lighting is returned, the left and right sides are respectively
- a flexible circuit board 10 and an X board 20 are used as the lighting point return jig to be connected to the liquid crystal panel 40.
- the invention also provides a method for the lighting point detection tool detecting panel, which mainly comprises:
- Step 10 providing a flexible circuit board and an X board
- Step 20 the bonding region provided at one end of the flexible circuit board is bonded to the X board, and the bonding region provided at the other end is bonded to the flip chip of the liquid crystal panel cut into the box test pad;
- Step 30 The X board is provided with a detection pad for connecting the box stage detecting device and the flexible circuit board;
- Step 40 When the flexible circuit board is simultaneously joined to the X board and the liquid crystal panel, the detecting pad and the flip chip of the liquid crystal panel are connected through an internal trace of the flexible circuit board.
- the lighting test can be re-completed from the box-stage inspection equipment.
- the lighting point return fixture of the present invention and the method for detecting the same can improve the detection yield and reduce the waste of material, machine, manpower, etc.; the convenient module stage panel can be returned to the box stage for detection.
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Abstract
一种点灯回点治具及其检测面板的方法。该点灯回点治具包括:柔性电路板(10)和X板(20);所述柔性电路板(10)一端设有接合区域用以接合到所述X板(20)上,另一端设有接合区域用以接合到切断成盒测试焊垫(30)的液晶面板(40)的覆晶薄膜上;所述X板(20)上设有供成盒阶段检测设备和所述柔性电路板(10)连接的检测焊垫(50);所述柔性电路板(10)设有内部走线(60),当所述柔性电路板(10)同时接合到所述X板(20)和液晶面板(40)时,所述内部走线(60)用于连通所述检测焊垫(50)和液晶面板(40)的覆晶薄膜。该点灯回点治具及其检测面板的方法可以提高检测良率及减小物料、机台、人力等成本浪费;使模组阶段面板可以返回成盒阶段进行检测。
Description
本发明涉及液晶显示器领域,尤其涉及一种点灯回点治具及其检测面板的方法。
液晶显示器(Liquid Crystal Display,LCD)等平面显示装置因具有高画质、省电、机身薄及应用范围广等优点,而被广泛的应用于手机、电视、个人数字助理、数字相机、笔记本电脑、台式计算机等各种消费性电子产品,成为显示装置中的主流。
主动式液晶显示器中,每个子像素具有一个薄膜晶体管(TFT),其栅极(Gate)连接至水平扫描线,源极(Source)连接至垂直方向的数据线,漏极(Drain)则连接至像素电极。在水平扫描线上施加足够的电压,会使得该条水平扫描线上的所有TFT打开,此时该条水平扫描线上的像素电极会与垂直方向上的数据线连通,从而将数据线上的显示信号电压写入像素,控制不同液晶的透光度进而达到控制色彩的效果。目前主动式液晶显示面板水平扫描线的驱动主要由面板外接的芯片(IC)来完成,外接的IC可以控制各级水平扫描线的逐级充电和放电。阵列基板行驱动(Gate Driver On Array,简称GOA)技术,也就是利用现有薄膜晶体管液晶显示器阵列(Array)制程将栅极(Gate)行扫描驱动信号电路制作在Array基板上,实现对Gate逐行扫描的驱动方式。
典型的液晶显示器的基本制程分为四段:阵列制程(Array)、彩膜制程(Colour Filter)、成盒制程(Cell)、模组制程(Module)。其中阵列制程主要包括使用镀膜、曝光、显影、刻蚀等技术在玻璃基板上形成TFT;成盒制程主要包括形成液晶切割裂片,并注入液晶材料;模组制程则主要包括将切割完成的面板加装驱动芯片、印刷线路板、背光模组等。
液晶显示器在制作的过程中,需要进行多个检验程序,其中一个很重要检验程序就是对切割完成的液晶盒进行测试,即成盒阶段检测,以确认液晶盒是否存在缺陷。该测试过程一般先是对液晶面板输入测试信号,使其像素呈现色彩,接着通过缺陷检测装置逐一观察各个像素是否良好,此过程称为点灯测试(Light-on Test)。目前工厂在大批量生产时,一般通过成盒测试焊垫(cell test pad)接合覆晶薄膜接合焊垫(cof bonding pad),通过 成盒测试焊垫对液晶面板输入测试信号。
覆晶薄膜(Chip On Film,简称COF)是将芯片(源极驱动IC或栅极驱动IC等)接合并安装在形成了布线图形的柔性布线基板上构成的。覆晶薄膜的布线图形通常由与芯片的电极连接的内引线和与外部电路连接的外引线构成。在液晶显示器中,由基板上纵横交错的栅线和数据线控制各个像素,以实现图像的显示。扫描信号和数据信号是从液晶显示器中的控制芯片发出的,通常利用覆晶薄膜将扫描信号和数据信号分别传输至基板上的栅线和数据线。具体的,覆晶薄膜通过一组连接引线连接至基板上的一组扇形引线,再连接至显示区域的栅线或数据线。
如图1所示,其为现有技术中成盒阶段检测后成盒测试焊垫与覆晶薄膜接合焊垫之间走线断开示意图。成盒阶段检测时成盒测试焊垫在图1方框所示接合区域(bonding area)与覆晶薄膜的覆晶薄膜接合焊垫1相接合,成盒阶段检测设备可以经由成盒测试焊垫向显示面板输入测试信号。在GOA产品生产过程中,液晶面板在经过成盒阶段检测设备后,会使用激光设备将成盒测试焊垫与覆晶薄膜接合焊垫之间的走线断开,防止ESD(静电释放)从焊垫处引至面板内,导致异常发生。
因检测机台方案(recipe)单一,当制程有轻微波动或者有新不良发生的时候,成盒阶段检测机台常常会造成漏放(在模组阶段检测时检出问题(issue))以及过检(在模组阶段未发生该类似问题),造成良率损失、物料浪费以及成本损失;而此时成盒阶段检测设备常常因为无相应问题面板(issue panel)样品来进行完善检测方案,使得方案无法及时完善,导致该方案不能及时进行控制。由于成盒阶段检测后成盒测试焊垫与覆晶薄膜接合焊垫之间走线已经断开,无法返回成盒阶段再次进行点灯测试。
发明内容
因此,本发明的目的在于提供一种点灯回点治具,使模组阶段面板可以返回成盒阶段进行检测。
本发明的另一目的在于提供一种点灯回点治具检测面板的方法,使模组阶段面板可以返回成盒阶段进行检测。
为实现上述目的,本发明提供了一种点灯回点治具,包括:柔性电路板和X板;所述柔性电路板一端设有接合区域用以接合到所述X板上,另一端设有接合区域用以接合到切断成盒测试焊垫的液晶面板的覆晶薄膜上;所述X板上设有供成盒阶段检测设备和所述柔性电路板连接的检测焊垫;所述柔性电路板设有内部走线,当所述柔性电路板同时接合到所述X板和 液晶面板时,所述内部走线用于连通所述检测焊垫和液晶面板的覆晶薄膜。
其中,所述检测焊垫包括GOA信号检测焊垫。
其中,所述检测焊垫包括数据走线检测焊垫。
其中,所述数据走线检测焊垫包括红色像素数据走线焊垫,绿色像素数据走线焊垫,以及蓝色像素数据走线焊垫。
其中,在所述X板上,自所述红色像素数据走线焊垫引出的红色像素数据走线,自所述绿色像素数据走线焊垫引出的绿色像素数据走线,以及自所述蓝色像素数据走线焊垫引出的蓝色像素数据走线各自短接在一起。
本发明还提供了一种点灯回点治具检测面板的方法,包括:
步骤10、提供柔性电路板和X板;
步骤20、所述柔性电路板一端设有的接合区域接合到所述X板上,另一端设有的接合区域接合到切断成盒测试焊垫的液晶面板的覆晶薄膜上;
步骤30、所述X板上设置供成盒阶段检测设备和所述柔性电路板连接的检测焊垫;
步骤40、当所述柔性电路板同时接合到所述X板和液晶面板时,通过所述柔性电路板的内部走线连通所述检测焊垫和液晶面板的覆晶薄膜。
其中,所述检测焊垫包括GOA信号检测焊垫。
其中,所述检测焊垫包括数据走线检测焊垫。
其中,所述数据走线检测焊垫包括红色像素数据走线焊垫,绿色像素数据走线焊垫,以及蓝色像素数据走线焊垫。
其中,在所述X板上,自所述红色像素数据走线焊垫引出的红色像素数据走线,自所述绿色像素数据走线焊垫引出的绿色像素数据走线,以及自所述蓝色像素数据走线焊垫引出的蓝色像素数据走线各自短接在一起。
本发明还提供一种点灯回点治具,包括:柔性电路板和X板;所述柔性电路板一端设有接合区域用以接合到所述X板上,另一端设有接合区域用以接合到切断成盒测试焊垫的液晶面板的覆晶薄膜上;所述X板上设有供成盒阶段检测设备和所述柔性电路板连接的检测焊垫;所述柔性电路板设有内部走线,当所述柔性电路板同时接合到所述X板和液晶面板时,所述内部走线用于连通所述检测焊垫和液晶面板的覆晶薄膜;
其中,所述检测焊垫包括GOA信号检测焊垫;
其中,所述检测焊垫包括数据走线检测焊垫;
其中,所述数据走线检测焊垫包括红色像素数据走线焊垫,绿色像素数据走线焊垫,以及蓝色像素数据走线焊垫;
其中,在所述X板上,自所述红色像素数据走线焊垫引出的红色像素 数据走线,自所述绿色像素数据走线焊垫引出的绿色像素数据走线,以及自所述蓝色像素数据走线焊垫引出的蓝色像素数据走线各自短接在一起。
综上,本发明的点灯回点治具及其检测面板的方法可以提高检测良率及减小物料、机台、人力等成本浪费;方便模组阶段面板可以返回成盒阶段进行检测。
下面结合附图,通过对本发明的具体实施方式详细描述,将使本发明的技术方案及其他有益效果显而易见。
附图中,
图1为现有技术中成盒阶段检测后成盒测试焊垫与覆晶薄膜接合焊垫之间走线断开示意图;
图2为本发明点灯回点治具一较佳实施例接合后的内部连线示意图;
图3为本发明点灯回点治具一较佳实施例的应用示意图。
参见图2,其为本发明点灯回点治具一较佳实施例接合后的内部连线示意图。本发明的点灯回点治具主要包括:柔性电路板10和X板20;所述柔性电路板10一端设有接合区域用以接合到所述X板20上,另一端设有接合区域用以接合到切断成盒测试焊垫30的液晶面板40的覆晶薄膜上;所述X板20上设有供成盒阶段检测设备和所述柔性电路板10连接的检测焊垫50;所述柔性电路板10设有内部走线60,当所述柔性电路板10同时接合到所述X板20和液晶面板40时,所述内部走线60用于连通所述检测焊垫50和液晶面板40的覆晶薄膜。通过采用柔性电路板10和X板20替代成盒测试焊垫30,即可由成盒阶段检测设备重新完成点灯测试。
检测焊垫50可以包括GOA信号检测焊垫,即焊垫P1~Pn+1。检测焊垫还可以包括数据走线检测焊垫,即焊垫R/G/B,分别为红色像素数据走线焊垫,绿色像素数据走线焊垫,以及蓝色像素数据走线焊垫。在X板20上,自红色像素数据走线焊垫引出的红色像素数据走线,自绿色像素数据走线焊垫引出的绿色像素数据走线,以及自蓝色像素数据走线焊垫引出的蓝色像素数据走线各自短接在一起;也就是在X板20上,焊垫R、G、B分别引出多条数据走线,并且分别短接(short)在一起,使得其与成盒阶段一般检测时连接方式一致。
本发明通过在产品设计阶段设计一款无IC的柔性电路板(FPC)以及 一款X板(Xboard-B)作为回点板,可接合(bonding)在液晶面板上,替代已切断的成盒测试焊垫;本发明适用于GOA产品;本发明可提高检测良率及减小物料、机台、人力等成本浪费。
参见图3,其为本发明点灯回点治具一较佳实施例的应用示意图。在此较佳实施例中,液晶面板40的液晶面板显示区左右均设有GOA模块进行驱动,因此两侧均有切断的成盒测试焊垫30,在进行点灯回点时,左右两侧各采用一个柔性电路板10和X板20作为点灯回点治具,连接到液晶面板40上。
本发明还提供了该点灯回点治具检测面板的方法,主要包括:
步骤10、提供柔性电路板和X板;
步骤20、所述柔性电路板一端设有的接合区域接合到所述X板上,另一端设有的接合区域接合到切断成盒测试焊垫的液晶面板的覆晶薄膜上;
步骤30、所述X板上设置供成盒阶段检测设备和所述柔性电路板连接的检测焊垫;
步骤40、当所述柔性电路板同时接合到所述X板和液晶面板时,通过所述柔性电路板的内部走线连通所述检测焊垫和液晶面板的覆晶薄膜。
通过采用柔性电路板和X板替代成盒测试焊垫,即可由成盒阶段检测设备重新完成点灯测试。
综上,本发明的点灯回点治具及其检测面板的方法可以提高检测良率及减小物料、机台、人力等成本浪费;方便模组阶段面板可以返回成盒阶段进行检测。
以上所述,对于本领域的普通技术人员来说,可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形,而所有这些改变和变形都应属于本发明后附的权利要求的保护范围。
Claims (11)
- 一种点灯回点治具,包括:柔性电路板和X板;所述柔性电路板一端设有接合区域用以接合到所述X板上,另一端设有接合区域用以接合到切断成盒测试焊垫的液晶面板的覆晶薄膜上;所述X板上设有供成盒阶段检测设备和所述柔性电路板连接的检测焊垫;所述柔性电路板设有内部走线,当所述柔性电路板同时接合到所述X板和液晶面板时,所述内部走线用于连通所述检测焊垫和液晶面板的覆晶薄膜。
- 如权利要求1所述的点灯回点治具,其中,所述检测焊垫包括GOA信号检测焊垫。
- 如权利要求1所述的点灯回点治具,其中,所述检测焊垫包括数据走线检测焊垫。
- 如权利要求3所述的点灯回点治具,其中,所述数据走线检测焊垫包括红色像素数据走线焊垫,绿色像素数据走线焊垫,以及蓝色像素数据走线焊垫。
- 如权利要求4所述的点灯回点治具,其中,在所述X板上,自所述红色像素数据走线焊垫引出的红色像素数据走线,自所述绿色像素数据走线焊垫引出的绿色像素数据走线,以及自所述蓝色像素数据走线焊垫引出的蓝色像素数据走线各自短接在一起。
- 一种点灯回点治具检测面板的方法,包括:步骤10、提供柔性电路板和X板;步骤20、所述柔性电路板一端设有的接合区域接合到所述X板上,另一端设有的接合区域接合到切断成盒测试焊垫的液晶面板的覆晶薄膜上;步骤30、所述X板上设置供成盒阶段检测设备和所述柔性电路板连接的检测焊垫;步骤40、当所述柔性电路板同时接合到所述X板和液晶面板时,通过所述柔性电路板的内部走线连通所述检测焊垫和液晶面板的覆晶薄膜。
- 如权利要求6所述的点灯回点治具检测面板的方法,其中,所述检测焊垫包括GOA信号检测焊垫。
- 如权利要求6所述的点灯回点治具检测面板的方法,其中,所述检测焊垫包括数据走线检测焊垫。
- 如权利要求8所述的点灯回点治具检测面板的方法,其中,所述数据走线检测焊垫包括红色像素数据走线焊垫,绿色像素数据走线焊垫,以 及蓝色像素数据走线焊垫。
- 如权利要求9所述的点灯回点治具检测面板的方法,其中,在所述X板上,自所述红色像素数据走线焊垫引出的红色像素数据走线,自所述绿色像素数据走线焊垫引出的绿色像素数据走线,以及自所述蓝色像素数据走线焊垫引出的蓝色像素数据走线各自短接在一起。
- 一种点灯回点治具,包括:柔性电路板和X板;所述柔性电路板一端设有接合区域用以接合到所述X板上,另一端设有接合区域用以接合到切断成盒测试焊垫的液晶面板的覆晶薄膜上;所述X板上设有供成盒阶段检测设备和所述柔性电路板连接的检测焊垫;所述柔性电路板设有内部走线,当所述柔性电路板同时接合到所述X板和液晶面板时,所述内部走线用于连通所述检测焊垫和液晶面板的覆晶薄膜;其中,所述检测焊垫包括GOA信号检测焊垫;其中,所述检测焊垫包括数据走线检测焊垫;其中,所述数据走线检测焊垫包括红色像素数据走线焊垫,绿色像素数据走线焊垫,以及蓝色像素数据走线焊垫;其中,在所述X板上,自所述红色像素数据走线焊垫引出的红色像素数据走线,自所述绿色像素数据走线焊垫引出的绿色像素数据走线,以及自所述蓝色像素数据走线焊垫引出的蓝色像素数据走线各自短接在一起。
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| KR102626707B1 (ko) * | 2018-12-27 | 2024-01-17 | 엘지디스플레이 주식회사 | 표시장치 |
| CN110673408A (zh) * | 2019-09-02 | 2020-01-10 | 深圳市华星光电技术有限公司 | 显示屏 |
| CN110444135B (zh) * | 2019-06-11 | 2022-12-23 | 重庆惠科金渝光电科技有限公司 | 一种显示装置及其检测方法和覆晶薄膜 |
| CN110676268B (zh) * | 2019-09-29 | 2022-02-22 | 武汉华星光电半导体显示技术有限公司 | 一种阵列基板、显示面板 |
| CN111754904A (zh) * | 2020-06-19 | 2020-10-09 | 北京瑞荣达电子技术有限公司 | 一种液晶面板防干扰检测装置 |
| CN112331117B (zh) * | 2020-11-05 | 2022-06-03 | 北海惠科光电技术有限公司 | 液晶面板和液晶面板数据线电压检测方法 |
| CN112415821A (zh) * | 2020-11-20 | 2021-02-26 | 京东方科技集团股份有限公司 | 一种叠屏显示装置 |
| CN113035099A (zh) * | 2021-03-18 | 2021-06-25 | 深圳市联测光电科技有限公司 | 液晶面板的色斑修复方法及所用系统测试架构与de-mura设备 |
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