WO2019098350A1 - 放熱板及びその製造方法 - Google Patents
放熱板及びその製造方法 Download PDFInfo
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- WO2019098350A1 WO2019098350A1 PCT/JP2018/042574 JP2018042574W WO2019098350A1 WO 2019098350 A1 WO2019098350 A1 WO 2019098350A1 JP 2018042574 W JP2018042574 W JP 2018042574W WO 2019098350 A1 WO2019098350 A1 WO 2019098350A1
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- composite
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- heat sink
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- 238000004519 manufacturing process Methods 0.000 title claims description 73
- 230000017525 heat dissipation Effects 0.000 title abstract description 23
- 239000002131 composite material Substances 0.000 claims abstract description 255
- 239000000463 material Substances 0.000 claims abstract description 62
- 239000011159 matrix material Substances 0.000 claims abstract description 14
- 238000005096 rolling process Methods 0.000 claims description 173
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Classifications
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B1/00—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
- B21B1/38—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling sheets of limited length, e.g. folded sheets, superimposed sheets, pack rolling
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/24—After-treatment of workpieces or articles
- B22F3/26—Impregnating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
- B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K23/00—Alumino-thermic welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/027—Thermal properties
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C27/00—Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
- C22C27/04—Alloys based on tungsten or molybdenum
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
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- H01L21/4882—Assembly of heatsink parts
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- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
- B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
- B22F2007/042—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal characterised by the layer forming method
- B22F2007/045—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal characterised by the layer forming method accompanied by fusion or impregnation
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
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- C22C1/04—Making non-ferrous alloys by powder metallurgy
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- C—CHEMISTRY; METALLURGY
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T428/00—Stock material or miscellaneous articles
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- Y10T428/1291—Next to Co-, Cu-, or Ni-base component
Definitions
- the present invention relates to a heat dissipation plate used to efficiently dissipate the heat generated from a heating element such as a semiconductor element and a method of manufacturing the same.
- heat sink In order to efficiently dissipate the heat generated from the semiconductor element from the semiconductor device, a heat sink (heat sink) is used.
- This heat sink is required to have high thermal conductivity in terms of its function, and is joined to a semiconductor, ceramic circuit board, metal package member, etc. by soldering or brazing, so the coefficient of thermal expansion (low heat The coefficient of expansion) is required.
- a Mo—Cu composite material is used as a heat dissipation plate having a high thermal conductivity and a low thermal expansion coefficient (eg, Patent Document 1).
- the Mo-Cu composite used for the heat sink is formed into a green compact by pressing Mo powder or a mixed powder of Mo powder and Cu powder into a green compact, and the green compact is subjected to reduction sintering as necessary. Thereafter, Cu infiltration or densification is applied to form a Mo--Cu composite, which is manufactured by rolling this Mo--Cu composite.
- this Mo-Cu composite material Since Mo hardly dissolves with Cu, this Mo-Cu composite material has a two-phase structure of Mo and Cu, and is a heat sink that utilizes the characteristics of Mo, which has a low thermal expansion coefficient, and Cu, which has a high thermal conductivity. be able to.
- Patent Document 2 shows, as a heat dissipation plate based on the Mo-Cu composite material as described above, one obtained by pressure-bonding a Cu plate to both surfaces of the Mo-Cu composite material obtained through a specific rolling process.
- the heat sink has a thermal conductivity higher than that of the [Cu / Mo / Cu] clad material, and is excellent in press punching property.
- an object of the present invention is to provide a low thermal expansion coefficient, high thermal conductivity heat sink having a clad structure of Mo—Cu composite and Cu material.
- Another object of the present invention is to provide a manufacturing method capable of stably and inexpensively manufacturing a heat sink having such excellent thermal characteristics.
- the number of laminations of the Mo--Cu composite material and the Cu material should be 5 or more, ie, Cu / (Cu-Mo) / Cu / (by using Cu-Mo) / Cu structure (5-layer clad structure) or Cu / (Cu-Mo) / Cu / (Cu-Mo) / Cu structure (7-layer clad structure) Not only the in-plane thermal expansion coefficient is lower than the Cu / (Cu-Mo) / Cu structure (three-layer clad structure) having the same plate thickness and density, but the thermal conductivity in the plate thickness direction is also comparable I found it to be about as high.
- the thermal conductivity is particularly significantly improved by making the thickness of the outermost Cu layer smaller than the thickness of the Cu layer of the intermediate layer.
- the material is cold-rolled at a high reduction rate (total reduction rate) or warm-rolled by warm rolling at a temperature of about 250 ° C. or less at which the surface is not significantly oxidized. It has been found that the expansion rate is reduced more effectively.
- the present invention has been made based on the above findings and has the following gist.
- Cu layers and Cu-Mo composite layers are alternately stacked in the thickness direction to form three or more Cu layers and two or more Cu-Mo composite layers, A heat sink whose outer layer is a Cu layer, A heat sink characterized in that the Cu-Mo composite layer has a plate thickness sectional structure in which a flat Mo phase is dispersed in a Cu matrix.
- the thickness t 2 of the Cu layer of the outermost layer of double-sided Cu layer having a thickness of t 1 and the intermediate layer (1a) (1b) satisfies t 1 ⁇ t 2
- a heat sink characterized by
- the Cu-Mo composite material (a) is a step of pressing and molding a mixed powder of Mo powder and Cu powder to obtain a green compact, and reducing the green compact
- a method of manufacturing a heat sink characterized by being obtained through a process of sintering in a hydrogen atmosphere or in a vacuum to obtain a sintered body.
- the Cu-Mo composite material (a) is a step of pressing and molding a mixed powder of Mo powder and Cu powder to obtain a green compact, and reducing the green compact
- a method of manufacturing a heat sink characterized in that it is obtained through a step of sintering in a porous atmosphere or in a vacuum to obtain a sintered body, and a step of densifying the sintered body.
- the Cu-Mo composite material (a) is a step of pressing and forming Mo powder or a mixed powder of Mo powder and Cu powder to obtain a green compact, A step of sintering the body in a reducing atmosphere or in vacuum to obtain a sintered body, and a step of impregnating the sintered body with Cu melted in a non-oxidizing atmosphere or in vacuum.
- a method of manufacturing a heat sink characterized in that [15] The method for producing a heat sink according to any one of the above [11] to [14], wherein a rolling reduction of cold rolling (x) is 70 to 99%.
- the Cu-Mo composite material (a) is a step of pressing and molding a mixed powder of Mo powder and Cu powder to obtain a green compact, and reducing the green compact A step of sintering in a reactive atmosphere or in vacuum to obtain a sintered body, a step of densifying the sintered body, and a step of rolling (y) the densified Cu-Mo composite material A method of manufacturing a heat sink characterized in that it is obtained through [19]
- the Cu-Mo composite material (a) is a step of press-forming Mo powder or a mixed powder of Mo powder and Cu powder to obtain a green compact, and A step of sintering the body in a reducing atmosphere or vacuum to form a sintered body, a step of impregnating the sintered body with Cu melted in a non-oxidizing atmosphere or vacuum, and impregnating the Cu A method of manufacturing a heat sink characterized
- Method of manufacturing a heat sink [22] A method of manufacturing a heat sink, wherein rolling (y) is performed by cross rolling in the manufacturing method according to any one of the above [18] to [21]. [23] In the production method according to any one of the above [18] to [22], when the Cu—Mo composite material (a) is unidirectionally rolled by rolling (y), Cu— may be cold rolled (x) A method of manufacturing a heat sink, comprising rolling the Mo composite material in a direction perpendicular to the rolling direction of rolling (y).
- the Cu-Mo composite (a) is characterized in that a plurality of unit Cu-Mo composites (a u ) are stacked. How to manufacture a heat sink.
- the manufacturing method according to any one of the above [11] to [23] in the Cu-Mo composite (a), a plurality of unit Cu-Mo composites (a u ) are connected via a Cu thin plate for bonding The manufacturing method of the heat sink characterized by laminating
- the Cu material (b) is a laminate of a plurality of unit Cu materials (b u ).
- Method. The method according to any one of the above [11] to [26], wherein the Cu—Mo composite (a) has a Cu content of 10 to 50% by mass.
- the Cu content of the Cu-Mo composite (a) is less than 20 mass%, and the Cu-Mo composite obtained by combining cold rolling (x) and rolling (y) (A) including a production method in which the rolling reduction (y) of the Cu-Mo composite (a) is not performed, wherein the total rolling reduction in (a) is 70% or more.
- a method of manufacturing a heat sink characterized by performing warm rolling of the following (1) and / or (2). (1) Perform warm rolling instead of cold rolling (x). (2) The rolling (y) is performed by warm rolling.
- a production method (wherein Cu is a total reduction ratio of 96% or more of a Cu—Mo composite (a) obtained by combining cold rolling (x) and rolling (y)) A manufacturing method without rolling (y) of the Mo composite (a).
- a method of manufacturing a heat sink characterized by performing warm rolling of the following (1) and / or (2). (1) Perform warm rolling instead of cold rolling (x). (2) The rolling (y) is performed by warm rolling.
- a semiconductor package comprising the heat sink of any one of the above [1] to [10].
- a semiconductor module comprising the semiconductor package of the above [32].
- the heat sink of the present invention has excellent thermal characteristics of low thermal expansion and high thermal conductivity. Further, according to the manufacturing method of the present invention, a heat sink having such excellent thermal characteristics can be manufactured stably and at low cost.
- Explanatory drawing which shows typically the plate
- Explanatory drawing which shows typically the plate
- thermo characteristics thermal conductivity in the plate thickness direction, in-plane average coefficient of thermal expansion from 50 ° C. to 400 ° C.
- thermal characteristics thermal conductivity in the plate thickness direction, in-plane average thermal expansion coefficient from 50 ° C. to 800 ° C.
- thermal characteristics thermal conductivity in the plate thickness direction, in-plane average coefficient of thermal expansion from 50 ° C.
- the heat sink is a view showing a relationship between the thickness t 1 and a ratio t 1 / T and the plate thickness direction of the thermal conductivity of the plate thickness T of the outermost layer of the Cu layer
- the heat sink of the present invention is composed of three or more Cu layers and two or more Cu-Mo composite layers by alternately laminating Cu layers and Cu-Mo composite layers in the thickness direction.
- FIG. 1 schematically shows a thickness cross section of a heat sink of the present invention having a five-layer clad structure (FIG. 1 (A)) and a seven-layer clad structure (FIG. 1 (B)).
- 1a is the outermost Cu layer on both surfaces
- 1b is the intermediate Cu layer.
- the Cu--Mo composite layer and the Cu layer of the heat sink according to the present invention are constructed by diffusion bonding of the laminated Cu--Mo composite and Cu material, and a diffusion bonding portion is provided between the two layers.
- a sound diffusion bonding portion can be obtained.
- the diffusion bonding of Cu between the two members (Cu and Cu material of Cu-Mo composite material) prevents the oxide film and the fine voids from remaining in the bonding interface. , A healthy joint is obtained.
- the heat dissipating plate of the present invention which has the above-mentioned five or more layers of clad structure and the outermost layers of both surfaces are Cu layers (for example, a heat dissipating plate of Cu / (Cu-Mo) / Cu / (Cu-Mo) / Cu structure) Has a high thermal conductivity compared to the heat sink of the Cu / (Cu-Mo) / Cu structure shown in Patent Document 2, which is considered to be due to the following reasons.
- the thermal conductivity is outer layer (Cu layer)> inner layer (Cu-Mo composite layer) Because the heat in the outer layer (Cu layer) is reflected / scattered at the interface between the outer layer and the inner layer and the heat flow is disturbed, the heat is not transmitted to the inner layer (Cu-Mo composite layer) side well, It is considered that high heat transfer resistance occurs due to the interface between the inner layers, and the heat conductivity in the thickness direction is lowered accordingly.
- the decrease in thermal conductivity in the thickness direction due to such a cause depends on the thickness of the outermost Cu layer, and the thinner the outermost Cu layer, the smaller the amount of heat reflected / scattered at the interface with the inner layer As a result, the degree of decrease in thermal conductivity decreases. Therefore, when the heat sink of the present invention having a clad structure of five or more layers and the heat sink of the three-layer clad structure described in Patent Document 2 are compared, if the plate thickness and density are the same, the heat sink of the present invention Since the thickness of the outermost Cu layer of the plate is smaller, it is considered that the thermal conductivity in the plate thickness direction is higher than that of the three-layered clad heat sink.
- the outermost Cu layer can be made thinner by increasing the thickness of the intermediate Cu layer, so the outermost Cu layer can be made of the intermediate layer By making the thickness smaller than the thickness of the Cu layer, the thermal conductivity in the thickness direction can be further increased. Further, in the heat sink of the present invention, by constraining the Cu layer by the Mo-Cu composite layer by enhancing the number of laminated layers of the Mo-Cu composite and the Cu material, the sheet thickness and the density are the same. If it is, the thermal expansion coefficient becomes lower than the heat sink of three-layer clad structure.
- the number of laminated layers (the total number of layers of the Cu layer and the Cu-Mo composite layer) in the clad structure is not particularly limited, and the larger the number of laminated layers, the lower the coefficient of thermal expansion, and the higher the hardness and the lower the ductility Cu-Mo The thinner the thickness of the composite layer, the better the pressability, which is advantageous for press working.
- heat is applied to the heat sink, if the outermost layer is a Cu layer, heat is introduced due to the high thermal conductivity of Cu, but as described above, the interface with the next lower Cu-Mo composite layer with low thermal conductivity The amount of heat that enters the Cu-Mo composite layer is limited because heat is reflected and scattered.
- the thermal conductivity at the interface is small. Therefore, even if the number of stacked layers is 7 or more, if the ratio of the thickness of the outermost Cu layer is small (generally, the ratio of the thickness of the outermost Cu layer is small with 7 or more), the number of stacked layers increases Although the thermal conductivity in the thickness direction tends to decrease slightly, it can contribute to the decrease of the thermal expansion coefficient and press processability, the thickness ratio of each layer of the Cu-Mo composite layer becomes small, and the heat transfer resistance of the layer also decreases.
- the number of laminations is not particularly limited, and the number of laminations may be determined according to the application and the thickness of the product. For example, when the invention examples 1 (5 layers) and 11 (7 layers) of the working examples, and the invention examples 2 (5 layers) and 12 (7 layers) are compared, the 7 layers are the heat.
- the conductivity is higher because, as shown in FIG. 8, the thickness of the outermost Cu layer of the invention example 11 is greater than that of the invention example 1 and that of the invention example 12 is greater than that of the invention example 2. This is considered to be due to the smallness ratio.
- the Cu content of the Cu-Mo composite layer is not particularly limited, but generally about 10 to 50% by mass is suitable.
- the higher the Cu content the better the cold rolling property is in the case of cold rolling at a high pressure rate, and the reduction effect of the thermal expansion coefficient by cold rolling at a high pressure rate is easily obtained.
- the Cu content of the Cu—Mo composite layer is preferably about 10 to 50% by mass.
- the Cu content of the Cu-Mo composite layer is preferably 30% by mass or less, while the Cu content of the Cu-Mo composite layer (Cu-Mo composite) is If it is less than 20% by mass, there is a possibility of causing a problem in the cold rolling property, so from the viewpoint of the heat characteristics of the heat sink and the cold rolling property, the Cu content of the Cu-Mo composite layer is 20 to 30% by mass It is more preferable to set it as a degree.
- the Cu-Mo composite layer may have a structure composed entirely of an integral Cu-Mo composite, but a structure in which a plurality of unit Cu-Mo composite layers are laminated via a very thin Cu layer for bonding It may be
- the Cu layer for bonding has almost no influence on the thermal characteristics of the heat sink if the thickness is about 75 ⁇ m or less, so the thickness is preferably 75 ⁇ m or less, more preferably 25 ⁇ m or less .
- the Cu layer for bonding constitutes a part of the Cu-Mo composite layer, and therefore, unlike the Cu layer alternately laminated with the Cu-Mo composite layer in the heat sink of the present invention , This Cu layer is not included.
- the heat sink of the present invention is manufactured by alternately laminating a Cu-Mo composite material (a) and a Cu material (b), diffusion bonding this laminated body, and rolling it,
- the Cu-Mo composite (a) used in this production may not be a single plate material, but may be composed of a plurality of laminated thin Cu-Mo composites (unit Cu-Mo composite). This is because the Cu—Mo composite may become thinner when the rolling reduction is increased.
- the unit Cu-Mo composites When composed of a plurality of thin unit Cu-Mo composites in which the Cu-Mo composite (a) is laminated, particularly when the Cu content of the Cu-Mo composite is relatively small, the unit Cu-Mo composites In order to improve the bondability of each other, a plurality of unit Cu-Mo composites are laminated via a Cu thin plate (including the case of Cu foil) (ie, a thin Cu plate between each unit Cu-Mo composite Preferably, diffusion bonding is performed via the Cu thin plate.
- the Cu layer for bonding in the Cu—Mo composite layer of the above-described heat sink is a thin sheet of the Cu thin plate drawn by rolling.
- the bonding Cu layer constituting the Cu—Mo composite layer is a very thin intermediate Cu layer, so the heat transfer resistance is so small as to be negligible, and it hardly affects the thermal characteristics of the heat sink. That is, the heat characteristics of the heat dissipating plate having the bonding Cu layer in the Cu—Mo composite layer and the heat dissipating plate not having the bonding Cu layer hardly change.
- FIGS. 2 and 3 show the thermal characteristics of some of the heat sinks of the examples described later in an organized manner
- FIG. 2 shows the thermal conductivity in the plate thickness direction (thermal conductivity at room temperature) And in-plane average thermal expansion coefficient from 50 ° C to 800 ° C
- Fig. 3 shows thermal conductivity in the thickness direction (thermal conductivity at room temperature) and in-plane average thermal expansion from 50 ° C to 400 ° C. The rates are shown respectively.
- the in-plane thermal expansion coefficient is measured by a push rod type displacement detection method.
- “in-plane average thermal expansion coefficient from 50 ° C. to 400 ° C.” is 50 ° C. and 400 ° C.
- the heat radiation plate (comparative examples 7 to 10, 13) consisting of a single Cu-Mo composite material, the heat radiation consisting of the three-layer clad material of Cu / (Cu-Mo) / Cu structure of Patent Document 2
- the thermal characteristics of the plate (comparative examples 1 and 2) and the heat dissipation plate (inventive examples 1, 2, 11 and 12) formed of the five-layer and seven-layer clad materials of the present invention are shown. In the figure, those enclosed by circles and connected by arrows are heat sinks having substantially the same density.
- the heat sink of the Cu / (Cu-Mo) / Cu structure of Patent Document 2 is a heat sink of the Cu-Mo composite alone.
- the thermal conductivity in the thickness direction is slightly lower than that in the thickness direction, the in-plane thermal expansion coefficient is greatly reduced.
- the heat sink of the present invention has a lower coefficient of thermal expansion in the plane and a thermal conductivity in the thickness direction. It's getting higher.
- FIG. 4 and 5 show the graphs of FIG. 2 and FIG. 3 to which comparative examples of the Cu-Mo composite alone having different Cu contents are added, and FIG. 4 shows the thermal conductivity in the plate thickness direction (room temperature Figure 5 shows the thermal conductivity in the plate thickness direction (thermal conductivity at room temperature) and the plate surface in the plate surface from 50 ° C to 400 ° C. The average coefficients of thermal expansion are shown respectively.
- the broken line in the figure indicates that the lower the Cu content (the higher the Mo content), the lower the thermal conductivity in the thickness direction and the lower the in-plane thermal expansion coefficient of the Cu-Mo composite alone. ing.
- 6 and 7 show the graphs of FIG. 4 and FIG. 5 further adding other invention examples etc. in which the thickness of the outermost Cu layer and the Cu content of the Cu—Mo composite layer are different.
- 6 shows the thermal conductivity in the plate thickness direction (thermal conductivity at room temperature) and the in-plane average thermal expansion coefficient from 50 ° C. to 800 ° C.
- FIG. 7 shows the thermal conductivity in the plate thickness direction (room temperature Thermal conductivity) and an in-plane average thermal expansion coefficient from 50.degree. C. to 400.degree. C., respectively.
- the heat sink of the present invention is a single Cu-Mo composite material having the same thickness and density regardless of the difference between the thickness of the outermost Cu layer and the Cu content of the Cu-Mo composite layer.
- the heat radiating plate of Example organize the relationship between the ratio t 1 / T and the plate thickness direction of the heat conductivity of the thickness t 1 and the thickness T of the outermost layer of the Cu layer 1a (see FIG. 1) In the figure, what is connected by a solid line is a heat sink having substantially the same density. According to this, the smaller the ratio of the thickness t 1 of the outermost Cu layer has a higher thickness direction of the heat conductivity, it can be seen that t 1 /T ⁇ 0.2 is preferred.
- the thickness t 2 of the Cu layer 1b having a thickness of t 1 and the intermediate layer of Cu layer 1a is the outermost layer of the double-sided satisfies t 1 ⁇ t 2.
- the thickness t 1 of the Cu layer 1a is the outermost layer of double-sided is preferred since better as thin as possible can increase the thermal conductivity.
- t 1 > t 2 the thickness of the outermost Cu layer of the three-layer clad structure is approached, and the effect of improving the thermal conductivity in the present invention is reduced.
- the thickness t 2 of the Cu layer 1b having a thickness of t 1 and the intermediate layer of Cu layer 1a is the outermost layer of the double-sided satisfies t 1 ⁇ t 2.
- a heat sink with 9 or more layers (the number of stacked layers of the Cu layer and Cu-Mo composite layer) (9 or more layers of Cu layer 1b in the middle layer) it is preferred that greater thickness t 2 closer Cu layer 1b.
- Heat flow q (W) CA ( ⁇ 1- ⁇ 2 ) [ ⁇ ; temperature, C; thermal conductance from point 1 to point 2, A: cross section of material through which heat flow flows]
- C ⁇ / L [ ⁇ : thermal conductivity (W / m ⁇ K), L: thickness of material (m)]
- the thermal conductance refers to the amount of heat flowing per unit time and a constant area when the temperature difference between both surfaces of the material is 1 ° C., and represents the heat transferability.
- the heat transfer resistance R is an inverse number of C.
- the heat transfer resistance R CLAD of the entire five-layer clad material is given by the following equation.
- L 1 to L 5 are the thicknesses of the first to fifth layers
- ⁇ Cu is the thermal conductivity of the Cu layer
- ⁇ Cu—Mo is the thermal conductivity of the Cu—Mo composite layer
- R 1 , R 2 , R 3 , R 4 and R 5 are heat transfer resistances of each layer
- R 12 , R 23 , R 34 and R 45 are heat transfer resistances of each layer interface
- 12 , 23 , 23 and 45 are each from above Show each layer of
- R 12 , R 23 , R 34 and R 45 are the degree of heat flow disturbance due to heat reflection and heat scatter
- the first layer (the outermost layer) of the low R 1 Cu layer to the second layer of the high R 2 Cu—Mo composite The heat flow is reduced when entering the body layer, and in the first Cu layer, not only the original heat transfer resistance R 1 but also the heat transfer resistance of R 12 for the interface is added.
- R 1 the thickness of the first (outmost) Cu layer
- R 1 the thickness of the first (outmost) Cu layer
- R 12 the amount added to the Cu layer by heat reflection and heat scattering is also small, and accordingly R 12 is also small .
- R 1 and R 12 also approach zero.
- the interface between the second Cu-Mo composite layer and the third Cu layer receives heat from the layer with high heat transfer resistance to the lower layer, and with the Cu phase in the Cu-Mo composite layer R 23 may be considered to be almost zero because it is completely diffusion-bonded and integrated with the Cu layer, and the continuity of the Cu is present.
- R 45 may be considered to be zero as well.
- the heat transfer resistance of R 34 for the interface with the fourth Cu—Mo composite layer is added to the heat transfer resistance R 3 of the third Cu layer.
- the thickness L 1 of the first Cu layer is the third Cu R 34 is smaller than R 12 even though it is the same as the layer thickness L 3 .
- the heat flow rate in the explanation is a tentative value
- the Cu-Mo composite layer of the five-layer clad material and the Cu layer have the same thickness, respectively, the heat flow of 100 at first.
- the first Cu layer there is a heat transfer resistance of (L 1 / ⁇ Cu ) + R 12 in the first Cu layer, and the heat flow is restricted to 80.
- the second Cu-Mo composite layer there is a heat transfer resistance of (L 2 / ⁇ Cu-Mo ) + R 23 (R 23 00), the heat flow is narrowed to 60, and the third Cu Enter the entrance of the stratum.
- R 34 when entering the third Cu layer to the fourth Cu-Mo composite layer is not the heat transfer resistance from the heat flow 100 but the heat transfer resistance from the heat flow 60, so R 12 > R It becomes 34 . From the above, by making the outermost Cu layer thinner than the inner (intermediate layer) Cu layer, the heat transfer resistance R CLAD of the entire clad material is reduced.
- the thickness of the Cu layer is the inside of the board (plate It is preferable to increase the thickness toward the thickness center). Furthermore, the combination of the Cu layer and the Cu-Mo composite layer is thicker from the combination of the thin Cu layer on the outer layer side (the heat inlet side) and the thin Cu-Mo composite layer to the inside (plate thickness center) It is believed that the combination reduces the reflection and scattering at the heat flow interface, so that not only the thickness of the Cu layer but also the thickness of the Cu-Mo composite layer can be formed inside the plate (center of plate thickness) It is preferable to increase the thickness gradually.
- 5-layer clad material (inventive example) of the embodiments described below are all the thickness t 2 of the Cu layer 1b having a thickness of t 1 and the intermediate layer of Cu layer 1a is the outermost layer of both sides t 1 ⁇ t 2
- the degree of t 1 ⁇ t 2 is that in the invention examples 3 to 10, 13 to 21 is t 1 / t 2 ⁇ 0.4, and the invention examples 3 to 8, 13 to 17, 19 to 21 are t 1 / T 2 ⁇ 0.1
- Invention Examples 3 to 6, 13 to 16, and 19 to 21 satisfy t 1 / t 2 ⁇ 0.06.
- the thickness of each of the Cu-Mo composite layer and the Cu layer, the thickness ratio of the Cu-Mo composite layer to the Cu layer, the thickness of the heat sink, etc. are not particularly limited. And symmetrical structure in the thickness direction centering around the central Cu layer in the thickness direction (the structure in which the thicknesses of the Cu layer and the Cu-Mo composite layer are symmetrical) so that no warpage or distortion occurs in practical use. Is preferred. Moreover, although the plate thickness of a heat sink is about 1 mm in many cases, there is no restriction
- the lower limit is not particularly thickness t 1 of the outermost Cu layers 1a, the manufacture of the thickness t 1 is extremely small as the cladding material is difficult, also, the thickness of the Cu layer of the intermediate layer is larger As a result, the thermal expansion coefficient becomes high, so the practical lower limit is about 0.01 mm.
- the layer thickness ratio between the Cu-Mo composite layer and the Cu layer when the layer thickness ratio of the Cu layer to the Cu-Mo composite layer is large, the thermal conductivity becomes high, but the Cu-Mo composite layer Since the constraint of the intermediate Cu layer is weakened, the coefficient of thermal expansion is high. On the other hand, when the layer thickness ratio of the Cu layer is small, the coefficient of thermal expansion is low, but the thermal conductivity is low. Therefore, the layer thickness ratio between the Cu-Mo composite layer and the Cu layer may be appropriately selected according to the thermal characteristics (thermal conductivity, thermal expansion coefficient) to be obtained, but low temperature (for example, 200.degree. C., 400.degree.
- the Cu layer In order to lower the coefficient of thermal expansion in (1), the Cu layer should not be too thick relative to the Cu-Mo composite layer. Moreover, since the Cu content of the Cu-Mo composite layer and the layer thickness ratio between the Cu-Mo composite layer and the Cu layer are linked to the density of the heat sink, this density is about 9.25 to 9.55 g / cm 3 Is preferable, and about 9.30 to 9.45 g / cm 3 is particularly preferable.
- the heat sink of the present invention is manufactured by diffusion bonding a Cu-Mo composite material manufactured in advance and a Cu material and then rolling, and rolling may also be performed in the manufacturing process of the Cu-Mo composite material.
- the Mo phase dispersed in the Cu matrix of the Cu-Mo composite layer has a flatly stretched morphology, and the Mo phase dispersed in the thickness cross-sectional structure is usually
- the aspect ratio (aspect ratio in the rolling direction) is more than two.
- the aspect ratio is the major axis / minor axis (length ratio) of the Mo phase in the thickness cross-sectional structure in the rolling direction, for example, the thickness cross-sectional structure in the rolling direction (ion milled plate
- the thick cross-sectional structure can be observed by SEM or the like, and the major axis / minor axis of each Mo phase contained in any one field of view can be determined, and the average value thereof can be defined.
- the Mo phase dispersed in the Cu matrix of the Cu-Mo composite layer is a flatly drawn form due to the Mo content of the Cu-Mo composite layer, the form of rolling (one-way rolling, cross rolling), etc.
- the flatly drawn Mo phase has a form close to an island shape independent of each other, but the Mo content is large.
- the flatly drawn Mo phases are connected to each other, and the non-striped non-uniform shape in which such Mo phase and Cu matrix are mixed becomes a marble-like form (rolled structure). Therefore, in the latter case, the aspect ratio clearly exceeds 2, but it may not be possible to specifically quantify.
- the semiconductor package to which the heat sink of the present invention is mainly applied is about 200 ° C. at the time of semiconductor operation from normal temperature (may be about -50 ° C. in the cold region) since the semiconductor repeatedly operates and stops. Repeat until the temperature rise. Therefore, the heat sink needs to have a low coefficient of thermal expansion to cope with thermal fatigue. In addition, it is important that the coefficient of thermal expansion is as low as about 800 ° C. in applications where brazing is performed, and about 400 ° C. in applications where soldering is performed. On the other hand, the heat sink is required to have high thermal conductivity, particularly high thermal conductivity in the thickness direction, in order to obtain high heat dissipation.
- the heat sink of the present invention has excellent thermal characteristics having both a high thermal conductivity and a low coefficient of thermal expansion, but specifically, the thermal conductivity in the thickness direction (thermal conductivity at room temperature) is It is preferably 200 W / m ⁇ K or more, and more preferably 250 W / m ⁇ K or more. Further, the in-plane average thermal expansion coefficient from 50 ° C. to 800 ° C. is preferably 10.0 ppm / K or less, and more preferably 8.0 ppm / K or less.
- the heat sink of the present invention may be plated with Ni plating or the like on its surface for the purpose of corrosion prevention or bonding with other members (brazing bonding or soldering bonding).
- the plating film is formed to a thickness that does not significantly affect the thermal characteristics of the heat sink.
- the type of plating is not particularly limited, and, for example, Ni plating, Au plating, Ag plating, etc. can be applied, and plating selected from these can be applied singly or in combination of two or more layers.
- the plating film may be provided only on one side of the heat sink (one surface of the outermost Cu layers) or may be provided on both sides of the heat sink.
- Cu plating may be applied as a base to improve the plating property when plating the surface of the heat sink, such as Ni plating, but the heat sink of the present invention is most suitable. Since the outer layer is a Cu layer, it is not necessary to apply such a base plating.
- a method of manufacturing the heat sink of the present invention described above will be described.
- a Cu—Mo composite (a) and a Cu material (b) having a plate thickness cross-sectional structure in which an Mo phase is dispersed in a Cu matrix are laminated.
- the Cu-Mo composite (a) is manufactured in advance, but this Cu-Mo composite (a) is a method which does not perform rolling (for example, the methods of (i) to (iii) described later) Or the rolling (y) method (for example, methods (iv) and (v) described later).
- this Cu-Mo composite (a) is a method which does not perform rolling (for example, the methods of (i) to (iii) described later) Or the rolling (y) method (for example, methods (iv) and (v) described later).
- the method of manufacturing a heat sink according to the present invention in order to prevent ear cracking and the like due to cold rolling when the Cu content of the Cu-Mo composite (a) is relatively low, Perform warm rolling of 1) or / and (2). The manufacturing method will be described in detail later. (1) Perform warm rolling instead of cold rolling (x). (2) The rolling (y) is performed by warm rolling.
- the thicknesses of the Cu-Mo composite material (a) and the Cu material (b) are appropriately selected according to the thicknesses of the Cu-Mo composite layer and the Cu layer of the heat sink to be manufactured.
- Cu-Mo composite material (a) and Cu material (b) may each be comprised with the board
- Cu-Mo composite material (a) consisting of a plurality of unit Cu-Mo composite materials (a u ) and single Cu material (b) are laminated; Cu-Mo composite material (a) and Cu material (b) composed of a plurality of unit Cu materials (b u ) are laminated, (3) Cu-Mo composite material (a u ) composed of a plurality of unit Cu-Mo composite materials (a u )
- a laminate is made of either of the Mo composite (a) and the Cu material (b) composed of a plurality of unit Cu materials (b u ) laminated, and this laminate is diffusion-bonded.
- a plurality of unit Cu-Mo composites (a u ) are laminated via a Cu thin plate (including the case of Cu foil) (ie, between each unit Cu-Mo composite (a u )
- diffusion bonding is performed via a thin Cu plate.
- the Cu layer for bonding in the Cu—Mo composite layer of the above-described heat sink is a thin sheet of the Cu thin plate drawn by rolling.
- the thickness of the Cu thin plate is preferably such that the thickness of the bonding Cu layer in the Cu-Mo composite layer of the heat sink is 75 ⁇ m or less (more preferably 25 ⁇ m or less).
- the Cu-Mo composite (a) the following can be used.
- a pure Cu board a pure Cu foil is included) is usually used.
- Cu-Mo composites are qualitatively known to decrease in thermal expansion coefficient by rolling, and rolling of Cu-Mo composites is also performed in the prior art. Since Mo particles are hard and small in primary particles, they are considered to be difficult to be deformed by rolling. Therefore, rolling of the Cu-Mo composite is carried out by warm rolling only at about 200 to 400 ° C. There is. In addition, a method of performing cold rolling by secondary rolling on a 65 mass% Mo-35 mass% Cu composite material has also been proposed, but warm rolling is performed in primary rolling.
- the effect of lowering the coefficient of thermal expansion can be expected by the cold rolling.
- the Cu content of the Cu-Mo composite is relatively small (for example, the Cu content is 30% by mass or less), although the degree is relatively small, the same effect as described above can be obtained.
- the Cu content of the Cu—Mo composite is relatively small, the restraint by Mo is strengthened as described above, and therefore, the effect of lowering the thermal expansion coefficient from this surface can be expected.
- the Cu-Mo composite (a) is manufactured in advance, but as the Cu-Mo composite (a), for example, one obtained by any of the following methods (i) to (iii) Can be used.
- (I) Through a step of pressing and molding a mixed powder of Mo powder and Cu powder to obtain a green compact and a step of sintering the green compact in a reducing atmosphere or in vacuum to obtain a sintered body Obtained Cu-Mo composite (a)
- IIi) a step of pressing and molding a mixed powder of Mo powder and Cu powder to obtain a green compact, and a step of sintering the green compact in a reducing atmosphere or in vacuum to obtain a sintered body
- Cu-Mo composite material (a) obtained through the step of densifying the sintered body
- the cold rolling (x) of the clad material causes a reduction in pressure It is desirable to roll at a rate of 70 to 99%, more preferably 80 to 99%, particularly preferably 90 to 96%.
- This rolling reduction is also the rolling reduction of the Cu—Mo composite (a).
- the effect of reducing the thermal expansion coefficient is obtained by cold rolling at a high pressure ratio, and the thermal conductivity tends to decrease if the rolling reduction ratio is excessively high.
- it By setting it as%, preferably 96%, it is possible to effectively reduce the thermal expansion coefficient while suppressing the decrease in the thermal conductivity.
- Cold rolling (x) is performed in multiple passes.
- Cold rolling (x) may be performed in one direction, but the in-plane anisotropy is obtained by reducing the difference in thermal expansion coefficient between two directions (X-axis direction and Y-axis direction) orthogonal to each other in the plate surface.
- cross rolling in which rolling is performed in two directions orthogonal to each other may be performed.
- rolling in two directions orthogonal to each other may be performed at different rolling reductions, but when it is desired to obtain a rolled plate having uniform thermal characteristics with no difference in thermal expansion coefficient between the X axis direction and the Y axis direction. It is preferable to roll at the same rolling reduction.
- the Cu-Mo composite material (a) one obtained by the following method (iv) or (v) may be used.
- (Iv) a step of pressure-molding a mixed powder of Mo powder and Cu powder to obtain a green compact, a step of sintering the green compact in a reducing atmosphere or in vacuum to form a sintered body, Cu-Mo composite (a) obtained through a step of densifying the sintered body and a step of rolling (y) the densified Cu-Mo composite (V)
- Cu-Mo composite (a) a step of pressure
- Rolling (y) can be performed by cold rolling.
- rolling (y) can be performed by cold rolling, but depending on the case, warm rolling may be performed.
- rolling (y) may be performed in one direction, but the in-plane anisotropy can be obtained by reducing the difference in thermal expansion coefficient between two directions (X-axis direction and Y-axis direction) orthogonal to each other in the plate surface. In order to reduce, cross rolling in which rolling is performed in two directions orthogonal to each other may be performed.
- the cold rolling (x) of the clad material requires cold rolling
- the rolling reduction ratio such that the total rolling reduction of the Cu-Mo composite (a) obtained by combining (x) and rolling (y) is 70 to 99%, more preferably 80 to 99%, and particularly preferably 90 to 96%. It is desirable to roll at The reason is the same as above. Also, if the Cu-Mo composite (a) is unidirectionally rolled by rolling (y) for the same reason as the cross rolling described above, the Cu-Mo composite is rolled by cold rolling (x) ( The rolling may be performed in the direction perpendicular to the rolling direction of y).
- the Cu content of the Cu-Mo composite (a) when the Cu content of the Cu-Mo composite (a) is relatively low, it depends on the total rolling reduction of the material, but prevents ear cracking and the like due to cold rolling.
- a manufacturing method that incorporates warm rolling when the Cu content of the Cu-Mo composite (a) is relatively low, it depends on the total rolling reduction of the material, but prevents ear cracking and the like due to cold rolling.
- Warm rolling is preferably performed under the following conditions. That is, the total reduction ratio of the material (the total reduction ratio of the total reduction ratio of the Cu-Mo composite alone and the reduction ratio of the Cu-Mo composite at the time of clad material rolling) is 70% or more.
- warm rolling of the following (1) and / or (2) is preferably performed, and in particular, in the case where the Cu content is 15 mass% or less It is preferable to perform warm rolling of the following (1) and (2).
- the Cu content of the Cu-Mo composite (a) is 20 to 30 mass% and the total rolling reduction of the material is particularly high (for example, the total rolling reduction of 96% or more)
- Warm rolling is performed instead of the cold rolling (x).
- the above rolling (y) is performed by warm rolling.
- warm rolling makes it easier to change the relative position of Mo particles in the Cu matrix, and it is less likely to cause work hardening of Cu, so Mo particles are deformed by the Cu phase compared to cold rolling.
- the distance between Mo particles tends to be low compared to cold rolling, but the rate of decrease in thermal expansion coefficient due to rolling tends to be low. Since the relative position change between the Cu phase and the Mo particles is unlikely to occur because the length of the steel is short, the Mo particles are easily deformed. Therefore, even if warm rolling is performed under the above conditions, there is no difference from cold rolling. A heat sink having thermal characteristics is obtained.
- Warm rolling is preferably performed at a temperature of about 200 to 300.degree.
- step (A) the step of press-forming Mo powder or a mixed powder of Mo powder and Cu powder into a green compact
- step (B) the step of press-forming Mo powder or a mixed powder of Mo powder and Cu powder into a green compact
- step (C1) the step of press-forming Mo powder or a mixed powder of Mo powder and Cu powder into a green compact
- step (D) the step of rolling (y) the Cu-infiltrated or densified Cu—Mo composite.
- the Mo powder or the mixed powder of the Mo powder and the Cu powder is pressure-formed into a green compact according to a conventional method.
- a Cu powder of an amount corresponding to the Cu content of the Cu—Mo composite material (a) is blended in the case of performing the densification treatment (step (C1)).
- the purity and particle size of the Mo powder and the Cu powder are not particularly limited, but generally, as the Mo powder, one having a purity of 99.95% by mass or more and an FSSS average particle diameter of about 1 to 8 ⁇ m is used.
- the Cu powder is usually pure Cu such as electrolytic copper powder or atomized copper powder and has an average particle diameter D50 of about 5 to 50 ⁇ m.
- step (A) Mo powder or a mixed powder of Mo powder and Cu powder is filled in a mold, and pressure is adjusted while adjusting the pressure according to the target value of the filling property of the mixed powder to be used and the forming density of the green compact. It shape
- the green compact obtained in the step (A) is sintered in a reducing atmosphere (such as a hydrogen atmosphere) or in vacuum to form a sintered body. This sintering may also be performed under ordinary conditions, and in the case of a green compact of a mixed powder of Mo powder and Cu powder, it is about 30 to 1000 minutes at a temperature of about 900 to 1050 ° C. (preferably 950 to 1000 ° C.).
- the sintered body (porous body) obtained in the step (B) is impregnated with Cu melted in a non-oxidizing atmosphere or in vacuum (infiltration of Cu) to obtain a Cu-Mo composite Get (a).
- Cu infiltration results in a desired Cu content.
- Infiltration of Cu may also be performed under ordinary conditions.
- a Cu plate or Cu powder is disposed on the upper surface and / or the lower surface of the sintered body, and held at a temperature of about 1083 to 1300 ° C. (preferably 1150 to 1250 ° C.) for 20 to 600 minutes.
- the non-oxidizing atmosphere is not particularly limited, a hydrogen atmosphere is preferable.
- the sintering temperature is first obtained in a state in which a Cu plate for Cu infiltration or a Cu powder is disposed on the green compact obtained in the step (A).
- the temperature may be raised to the Cu infiltration temperature to carry out the step (C1).
- the Cu-Mo composite (infiltrated body) obtained in this step (C1) is subjected to surface grinding (for example, to remove excess pure Cu remaining on the surface prior to cold rolling in the next step) (for example, It is preferable to perform surface grinding processing by a milling machine, a grindstone or the like.
- the sintered body obtained in the step (B) is subjected to a densification treatment to obtain a Cu—Mo composite (a).
- a densification treatment to obtain a Cu—Mo composite (a).
- the temperature is further raised to dissolve Cu (processing for holding at about 1200 to 1300 ° C. for about 20 to 120 minutes), and then densification in step (C2) You may process.
- This densification treatment requires high temperature and pressure, and can be performed by methods such as hot pressing, spark plasma sintering (SPS), and heat rolling. By this densification treatment, the voids in the sintered body are reduced to densify and the relative density is increased.
- the Cu-Mo composite obtained in the step (C1) or (C2) is rolled at a predetermined rolling reduction for the purpose of reducing the thermal expansion coefficient of the Cu-Mo composite (a) Apply (y).
- homogenization aging heat treatment may be performed at a temperature of about 800 to 1000 ° C., if necessary.
- the heat sink of the present invention can be made into a product as it is by cold rolling or warm rolling, or by further performing a softening heat treatment. Moreover, you may metal-plate Ni plating etc. on the surface in order to improve the corrosion resistance and the performance with respect to electrolytic corrosion which assumed use as a base of a semiconductor as needed. In this case, the plating film is formed to a thickness that does not significantly affect the thermal characteristics of the heat sink.
- the type of plating is not particularly limited, and, for example, Ni plating, Au plating, Ag plating, etc. can be applied, and plating selected from these can be applied singly or in combination of two or more layers. Plating may be performed only on one side of the heat sink (one surface of the outermost Cu layers) or may be performed on both sides of the heat sink.
- the heat sink of the present invention can be suitably used for semiconductor packages such as ceramic packages and metal packages provided in various semiconductor modules, and high heat dissipation and durability can be obtained.
- semiconductor packages such as ceramic packages and metal packages provided in various semiconductor modules
- high heat dissipation and durability can be obtained.
- the low thermal expansion coefficient is maintained even after being exposed to a high temperature exceeding 800 ° C. Therefore, there is no problem in applications such as brazing where the bonding temperature is as high as 750 ° C. Applicable
- the in-plane thermal expansion coefficient is measured by a push bar displacement detection method, and the difference between the elongation at 50 ° C-400 ° C and 50 ° C-800 ° C is divided by the temperature difference Then, the in-plane average thermal expansion coefficient from 50 ° C. to 400 ° C. and the in-plane average thermal expansion coefficient from 50 ° C. to 800 ° C. were determined. Further, the thermal conductivity in the thickness direction (thermal conductivity at room temperature) was measured by a flash method. (4) Evaluation of thermal characteristics Tables 1 to 6 show the thermal characteristics of each sample together with the manufacturing conditions. According to this, it is understood that the thermal conductivity in the thickness direction of the invention example is significantly increased as compared with the comparative example.
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Abstract
Description
特許文献2には、上記のようなMo-Cu複合材をベースとした放熱板として、特定の圧延工程を経て得られたMo-Cu複合材の両面にCu板を圧着したものが示されており、この放熱板は、[Cu/Mo/Cu]クラッド材よりも高い熱伝導率を有し、プレス打ち抜き性にも優れているとしている。
近年、半導体の高出力化により放熱板の放熱性がより重要になっている。一方、半導体モジュールの小型化へのニーズも高く、放熱板もより小さな面積からの放熱が求められている。そのため、板面方向での放熱よりも、厚さ方向での放熱性がより重要となってきている。
したがって本発明の目的は、Mo-Cu複合材とCu材のクラッド構造を有する低熱膨張率、高熱伝導率の放熱板を提供することにある。
また、本発明の他の目的は、そのような優れた熱特性を有する放熱板を安定して且つ低コストに製造することができる製造方法を提供することにある。
[1]板厚方向において、Cu層とCu-Mo複合体層が交互に積層することで3層以上のCu層と2層以上のCu-Mo複合体層で構成されるとともに、両面の最外層がCu層からなる放熱板であって、
Cu-Mo複合体層は、Cuマトリクス中に扁平なMo相が分散した板厚断面組織を有することを特徴とする放熱板。
[2]上記[1]の放熱板において、両面の最外層のCu層(1a)の厚さt1と中間層のCu層(1b)の厚さt2がt1≦t2を満足することを特徴とする放熱板。
[4]上記[2]又は[3]の放熱板において、両面の最外層のCu層(1a)の厚さt1と中間層のCu層(1b)の厚さt2がt1<t2を満足することを特徴とする放熱板。
[5]上記[4]の放熱板において、Cu層とCu-Mo複合体層の全層数が9層以上の放熱板であって、中間層の複数のCu層(1b)は、板厚中心に近いCu層(1b)ほど厚さt2が厚いことを特徴とする放熱板。
[6]上記[1]~[5]のいずれかの放熱板において、Cu-Mo複合体層は、複数の単位Cu-Mo複合体層が厚さ75μm以下の接合用のCu層を介して積層した構造を有することを特徴とする放熱板。
[8]上記[1]~[6]のいずれかの放熱板において、Cu-Mo複合体層はCu含有量が20~30質量%であることを特徴とする放熱板。
[9]上記[1]~[8]のいずれかの放熱板において、板厚方向の熱伝導率が200W/m・K以上、50℃から800℃までの板面内平均熱膨張率が8.0ppm/K以下であることを特徴とする放熱板。
[10]上記[1]~[9]のいずれかの放熱板において、積層したCu層とCu-Mo複合体層とからなる放熱板本体の片面又は両面にめっき皮膜が形成されたことを特徴とする放熱板。
[12]上記[11]の製造方法において、Cu-Mo複合材(a)は、Mo粉末とCu粉末の混合粉末を加圧成形して圧粉体とする工程と、前記圧粉体を還元性雰囲気中又は真空中で焼結して焼結体とする工程を経て得られたものであることを特徴とする放熱板の製造方法。
[13]上記[11]の製造方法において、Cu-Mo複合材(a)は、Mo粉末とCu粉末の混合粉末を加圧成形して圧粉体とする工程と、前記圧粉体を還元性雰囲気中又は真空中で焼結して焼結体とする工程と、前記焼結体を緻密化処理する工程を経て得られたものであることを特徴とする放熱板の製造方法。
[15]上記[11]~[14]のいずれかの製造方法において、冷間圧延(x)の圧下率が70~99%であることを特徴とする放熱板の製造方法。
[16]上記[15]の製造方法において、冷間圧延(x)の圧下率が90~96%であることを特徴とする放熱板の製造方法。
[17]上記[11]~[16]のいずれかの製造方法において、冷間圧延(x)をクロス圧延で行うことを特徴とする放熱板の製造方法。
[19]上記[11]の製造方法において、Cu-Mo複合材(a)は、Mo粉末又はMo粉末とCu粉末の混合粉末を加圧成形して圧粉体とする工程と、前記圧粉体を還元性雰囲気中又は真空中で焼結して焼結体とする工程と、前記焼結体に非酸化性雰囲気中又は真空中で溶融したCuを含浸させる工程と、前記Cuを含浸させたCu-Mo複合材に圧延(y)を施す工程を経て得られたものであることを特徴とする放熱板の製造方法。
[20]上記[18]又は[19]の製造方法において、冷間圧延(x)と圧延(y)を合わせたCu-Mo複合材(a)の総圧下率が70~99%であることを特徴とする放熱板の製造方法。
[22]上記[18]~[21]のいずれかの製造方法において、圧延(y)をクロス圧延で行うことを特徴とする放熱板の製造方法。
[23]上記[18]~[22]のいずれかの製造方法において、圧延(y)でCu-Mo複合材(a)を一方向圧延した場合に、冷間圧延(x)では、Cu-Mo複合材を圧延(y)の圧延方向と直交する方向に圧延することを特徴とする放熱板の製造方法。
[24]上記[11]~[23]のいずれかの製造方法において、Cu-Mo複合材(a)は、複数の単位Cu-Mo複合材(au)が積層したものであることを特徴とする放熱板の製造方法。
[25]上記[11]~[23]のいずれかの製造方法において、Cu-Mo複合材(a)は、複数の単位Cu-Mo複合材(au)が接合用のCu薄板を介して積層したものであることを特徴とする放熱板の製造方法。
[27]上記[11]~[26]のいずれかの製造方法において、Cu-Mo複合材(a)はCu含有量が10~50質量%であることを特徴とする放熱板の製造方法。
[28]上記[11]~[26]のいずれかの製造方法において、Cu-Mo複合材(a)はCu含有量が20~30質量%であることを特徴とする放熱板の製造方法。
[29]上記[27]の製造方法において、Cu-Mo複合材(a)のCu含有量が20mass%未満であり、冷間圧延(x)と圧延(y)を合わせたCu-Mo複合材(a)の総圧下率が70%以上である製造方法(但し、Cu-Mo複合材(a)の圧延(y)を行わない製造方法を含む。)であって、
下記(1)又は/及び(2)の温間圧延を行うことを特徴とする放熱板の製造方法。
(1)冷間圧延(x)に代えて温間圧延を行う。
(2)圧延(y)を温間圧延で行う。
下記(1)又は/及び(2)の温間圧延を行うことを特徴とする放熱板の製造方法。
(1)冷間圧延(x)に代えて温間圧延を行う。
(2)圧延(y)を温間圧延で行う。
[31]上記[11]~[30]のいずれかの製造方法において、積層したCu-Mo複合体層とCu層とからなる放熱板本体の片面又は両面にめっき皮膜を形成することを特徴とする放熱板の製造方法。
[32]上記[1]~[10]のいずれかの放熱板を備えたことを特徴とする半導体パッケージ。
[33]上記[32]の半導体パッケージを備えたことを特徴とする半導体モジュール。
また、本発明の放熱板は、Mo-Cu複合材とCu材の積層数を多層化することにより、Mo-Cu複合体層によるCu層の拘束性が高められるため、板厚と密度が同じであれば、3層クラッド構造の放熱板よりも熱膨張率が低くなる。
図8は、実施例の放熱板について、最外層のCu層1aの厚さt1と板厚T(図1参照)の比率t1/Tと板厚方向の熱伝導率との関係を整理したものであり、図中、実線でつないだものが、密度がほぼ同等の放熱板である。これによれば、最外層のCu層の厚さt1の比率が小さいほど板厚方向の熱伝導率が高くなっており、t1/T≦0.2が好ましいことが判る。
また、さらに好ましい条件としては、両面の最外層のCu層1aの厚さt1と中間層のCu層1bの厚さt2がt1<t2を満足することが好ましい。また、Cu層とCu-Mo複合体層の全層数(積層数)が9層以上の放熱板(中間層のCu層1bを3層以上有する放熱板)の場合には、板厚中心に近いCu層1bほど厚さt2が厚いことが好ましい。これらの理由は以下のように考えられる。
熱流q(W)=CA(θ1-θ2)[θ;温度、C;点1から点2までの熱コンダクタンス、A:熱流の流れる材料の断面積]
C=λ/L[λ:熱伝導率(W/m・K)、L:材料の厚さ(m)]
熱コンダクタンスとは、材料両面の温度差が1℃の時、一定面積、一定時間当たり流れる熱量のことで、熱の伝わりやすさを表す。ここで、伝熱抵抗RはCの逆数となる。
5層クラッド材全体の伝熱抵抗RCLADは次の式で与えられる。
RCLAD=(L1/λCu)+(L2/λCu-Mo)+(L3/λCu)+(L4/λCu-Mo)+(L5/λCu)+R12+R23+R34+R45
=R1+R2+R3+R4+R5+R12+R23+R34+R45
ここで、L1~L5は1層目~5層目までの各層の厚さ、λCuはCu層の熱伝導率、λCu-MoはCu-Mo複合体層の熱伝導率、R1,R2,R3,R4,R5は各層の伝熱抵抗、R12,R23,R34,R45は各層界面の伝熱抵抗、12、23、23、45はそれぞれ上からの各層間を示す。
ここでR12,R23,R34,R45は、材料ではなく界面での熱反射、熱散乱による熱流の乱れの度合い、すなわち負荷(抵抗)である。
なお、後述する実施例の5層クラッド材(発明例)は、いずれも両面の最外層のCu層1aの厚さt1と中間層のCu層1bの厚さt2がt1<t2であるが、そのt1<t2の程度は、発明例3~10、13~21がt1/t2≦0.4、発明例3~8、13~17、19~21がt1/t2≦0.1、発明例3~6、13~16、19~21がt1/t2≦0.06となっている。
なお、最外層のCu層1aの厚さt1の下限は特にないが、厚さt1が極端に小さいとクラッド材としての製造が難しくなり、また、中間層のCu層の厚さが大きくなって熱膨張率が高くなるので、0.01mm程度が事実上の下限となる。
また、Cu-Mo複合体層のCu含有量やCu-Mo複合体層とCu層の層厚比は放熱板の密度にリンクするので、この密度は9.25~9.55g/cm3程度であることが好ましく、9.30~9.45g/cm3程度であることが特に好ましい。
本発明の放熱板は、高熱伝導率と低熱膨張率を兼ね備えた優れた熱特性を有するものであるが、具体的には、板厚方向での熱伝導率(室温での熱伝導率)が200W/m・K以上であることが好ましく、250W/m・K以上であることがより好ましい。また、50℃から800℃までの板面内平均熱膨張率が10.0ppm/K以下であることが好ましく、8.0ppm/K以下であることがより好ましい。
なお、放熱板の材質によっては、放熱板表面にNiめっきなどのめっきを施す際のめっき性の改善のために、その下地としてCuめっきを施す場合があるが、本発明の放熱板は、最外層がCu層であるため、そのような下地めっきを施す必要はない。
本発明の放熱板の製造方法の一実施形態では、Cuマトリクス中にMo相が分散した板厚断面組織を有するCu-Mo複合材(a)とCu材(b)を積層させ、この積層体を拡散接合した後、冷間圧延(x)を施すことにより、Cu-Mo複合材(a)によるCu-Mo複合体層とCu材(b)によるCu層が積層した放熱板を得る。ここで、Cu-Mo複合材(a)は予め製作されたものであるが、このCu-Mo複合材(a)は圧延を行わない方法(例えば、後述する(i)~(iii)の方法)で製作したものでもよいし、圧延(y)を行う方法(例えば、後述する(iv)、(v)の方法)で製作したものでもよい。
また、本発明の放熱板の製造方法の他の実施形態では、Cu-Mo複合材(a)のCu含有量が比較的低い場合に、冷間圧延による耳ワレなどを防止するために下記(1)又は/及び(2)の温間圧延を行う。なお、この製造方法については、後に詳述する。
(1)冷間圧延(x)に代えて温間圧延を行う。
(2)圧延(y)を温間圧延で行う。
なお、Cu-Mo複合材(a)とCu材(b)は、それぞれ単体の板材で構成してもよいが、Cu-Mo複合材(a)を積層した複数枚の薄いCu-Mo複合材(単位Cu-Mo複合材(au))で構成してもよいし、Cu材(b)を積層した複数枚の薄いCu材(単位Cu材(bu))で構成してもよい。これは、Cu-Mo複合材やCu材は圧延の圧下率を大きくした場合に薄くなる可能性があるためである。したがって、その場合には、(1)複数枚の単位Cu-Mo複合材(au)からなるCu-Mo複合材(a)と単体のCu材(b)を積層させる、(2)単体のCu-Mo複合材(a)と複数枚の単位Cu材(bu)からなるCu材(b)を積層させる、(3)複数枚の単位Cu-Mo複合材(au)からなるCu-Mo複合材(a)と複数枚の単位Cu材(bu)からなるCu材(b)を積層させる、のいずれかによる積層体とし、この積層体を拡散接合する。
積層体の拡散接合を行う方法に特に制限はないが、放電プラズマ焼結(SPS)、ホットプレスによる拡散接合が好ましい。
Cu-Mo複合材(a)は、下記のようなものを用いることができる。また、Cu材(b)としては、通常、純Cu板(純Cu箔を含む)を用いる。
また、Cu-Mo複合材のCu含有量が比較的少ない場合(例えば、Cu含有量30%質量以下)でも、その程度は相対的に小さくなるものの、上記と同様の効果が得られる。一方、Cu-Mo複合材のCu含有量が比較的少ない場合には、上述したようにMoによる拘束が強化されるので、この面からの熱膨張率の低下効果が期待できる。
(i)Mo粉末とCu粉末の混合粉末を加圧成形して圧粉体とする工程と、前記圧粉体を還元性雰囲気中又は真空中で焼結して焼結体とする工程を経て得られたCu-Mo複合材(a)
(ii)Mo粉末とCu粉末の混合粉末を加圧成形して圧粉体とする工程と、前記圧粉体を還元性雰囲気中又は真空中で焼結して焼結体とする工程と、前記焼結体を緻密化処理する工程を経て得られたCu-Mo複合材(a)
(iii)Mo粉末又はMo粉末とCu粉末の混合粉末を加圧成形して圧粉体とする工程と、前記圧粉体を還元性雰囲気中又は真空中で焼結して焼結体とする工程と、前記焼結体に非酸化性雰囲気中又は真空中で溶融したCuを含浸させる工程を経て得られたCu-Mo複合材(a)
冷間圧延(x)は、一方向圧延としてもよいが、板面内で直交する2方向(X軸方向、Y軸方向)間の熱膨張率の差を小さくして面内異方性を減ずるために、直交する2方向で圧延を行うクロス圧延を行ってもよい。ここで、直交する2方向での圧延は、異なる圧下率で行ってもよいが、X軸方向とY軸方向で熱膨張率差のない均一な熱特性を有する圧延板を得たい場合には、同じ圧下率で圧延するのが好ましい。
(iv)Mo粉末とCu粉末の混合粉末を加圧成形して圧粉体とする工程と、前記圧粉体を還元性雰囲気中又は真空中で焼結して焼結体とする工程と、前記焼結体を緻密化処理する工程と、前記緻密化処理されたCu-Mo複合材に圧延(y)を施す工程を経て得られたCu-Mo複合材(a)
(v)Mo粉末又はMo粉末とCu粉末の混合粉末を加圧成形して圧粉体とする工程と、前記圧粉体を還元性雰囲気中又は真空中で焼結して焼結体とする工程と、前記焼結体に非酸化性雰囲気中又は真空中で溶融したCuを含浸させる工程と、前記Cuを含浸させたCu-Mo複合材に圧延(y)を施す工程を経て得られたCu-Mo複合材(a)
すなわち、材料の総圧下率(Cu-Mo複合材単体での圧下率とクラッド材圧延時のCu-Mo複合材の圧下率を合わせた総圧下率)が70%以上であって、Cu-Mo複合材(a)のCu含有量が20mass%未満の場合には、下記(1)又は/及び(2)の温間圧延を行うことが好ましく、特にCu含有量が15mass%以下の場合には、下記(1)及び(2)の温間圧延を行うことが好ましい。また、Cu-Mo複合材(a)のCu含有量が20~30mass%であって、材料の総圧下率が特に高い場合(例えば総圧下率96%以上)にも、下記(1)又は/及び(2)の温間圧延を行うことが好ましい。
(1)上記冷間圧延(x)に代えて温間圧延を行う。
(2)上記圧延(y)を温間圧延で行う。
温間圧延は200~300℃程度の温度で行うことが好ましい。温間圧延の温度が300℃超では、Moが酸化して表面酸化物が生成しやすくなり、それが圧延中に剥離して製品の品質に悪影響を及ぼすなどの問題を生じやすい。
なお、上記(1)、(2)のいずれか一方の温間圧延を行う場合、Cu-Mo複合材(a)のCu含有量や厚さなどに応じて圧延性を考慮し、いずれか一方が選択される。
以下の説明において、Mo粉末又はMo粉末とCu粉末の混合粉末を加圧成形して圧粉体とする工程を工程(A)、前記圧粉体を還元性雰囲気中又は真空中で焼結して焼結体とする工程を工程(B)、前記焼結体に非酸化性雰囲気中又は真空中で溶融したCuを含浸させる工程を工程(C1)、前記焼結体を緻密化処理する工程を工程(C2)、Cu溶浸又は緻密化処理したCu-Mo複合材に圧延(y)を施す工程を工程(D)という。
Mo粉末やCu粉末の純度や粒径は特に限定しないが、通常、Mo粉末としては、純度が99.95質量%以上、FSSS平均粒径が1~8μm程度のものが用いられる。また、Cu粉末としては、通常、電解銅粉やアトマイズ銅粉末などの純Cuであって、平均粒径D50が5~50μm程度のものが用いられる。
工程(B)では、工程(A)で得られた圧粉体を還元性雰囲気(水素雰囲気など)中又は真空中で焼結して焼結体とする。この焼結も通常の条件で行えばよく、Mo粉末とCu粉末の混合粉末の圧粉体の場合には、900~1050℃(好ましくは950~1000℃)程度の温度で30~1000分程度保持する条件で行うことが好ましい。また、Mo粉末の圧粉体の場合には、1100~1400℃(好ましくは1200~1300℃)程度の温度で30~1000分程度保持する条件で行うことが好ましい。
Cuの溶浸も通常の条件で行えばよい。例えば、焼結体の上面及び/又は下面にCu板やCu粉末を配置し、1083~1300℃(好ましくは1150~1250℃)程度の温度で20~600分保持する。非酸化性雰囲気は特に限定しないが、水素雰囲気が好ましい。また、溶浸した後の加工性向上の観点からは、真空中で溶浸するのが好ましい。
なお、この工程(C1)で得られたCu-Mo複合材(溶浸体)は、次工程での冷間圧延に先立ち、表面に残留した余剰の純Cuを除去するために表面研削(例えば、フライス盤や砥石などによる表面研削加工)を施すことが好ましい。
この緻密化処理には高い温度と圧力が必要であり、ホットプレス、放電プラズマ焼結(SPS)、加熱圧延などの方法で行うことができる。この緻密化処理により、焼結体中の空隙を減らし緻密化させ、相対密度を高める。
工程(D)では、Cu-Mo複合材(a)の熱膨張率を低下させることを目的として、工程(C1)又は(C2)で得られたCu-Mo複合材に所定の圧下率で圧延(y)を施す。
なお、工程(C1)又は(C2)で得られたCu-Mo複合材を圧延する前に、必要に応じて800~1000℃程度の温度で均質化時効熱処理を施してもよい。
Mo粉末(FSSS平均粒径:6μm)と純Cu粉末(平均粒径D50:5μm)を所定の割合で混合した混合粉末を型(50mm×50mm)に入れて加圧成形し、後工程の冷間圧延での圧下率に応じた厚さの圧粉体とした。この圧粉体を水素雰囲気中で焼結(1000℃、600分)して焼結体を得た。次いで、この焼結体の上面に純Cu板を置き、水素雰囲気中で1200℃に加熱(保持時間180分)して純Cu板を溶解させ、この溶解したCuを焼結体に含浸させることで、所定のCu含有量のCu-Mo複合材を得た。このCu-Mo複合材を、表面に残留するCuをフライス盤を用いて除去した後、所定の圧下率で一方向の圧延(y)(冷間圧延)を施し、Cu-Mo複合材を製作した。
(2.1)本発明例
上記のようにして得られた所定の板厚のCu-Mo複合材と純Cu板を、Cu/(Cu-Mo)/Cu/(Cu-Mo)/Cuの5層構造又はCu/(Cu-Mo)/Cu/(Cu-Mo)/Cu/(Cu-Mo)/Cuの7層構造に積層させ、この積層体を放電プラズマ焼結(SPS)装置(住友石炭鉱業(株)社製「DR.SINTER SPS-1050」)を用いて、950℃、18分保持、加圧力20MPaの条件で拡散接合させた。次いで、上記Cu-Mo複合材の圧延(y)(冷間圧延)と同じ圧下率で、圧延(y)の圧延方向と直交する方向に圧延(冷間圧延)し、本発明例の放熱板(板厚1mm)を製造した。
(2.2)比較例
Cu-Mo複合材と純Cu板をCu/(Cu-Mo)/Cuの3層構造とした以外は、本発明例と同一の条件で比較例の放熱板(板厚1mm)を製造した(比較例1、2、11)。
また、上記Cu-Mo複合材単体も比較例の放熱板(板厚1mm)とした(比較例3~10、12~14)。
各供試体について、板面内熱膨張率を押棒式変位検出法で測定し、50℃-400℃と50℃-800℃における各伸び量の差を温度差で割り算して、50℃から400℃までの板面内平均熱膨張率と50℃から800℃までの板面内平均熱膨張率を求めた。また、板厚方向の熱伝導率(室温での熱伝導率)をフラッシュ法で測定した。
(4)熱特性の評価
表1~表6に、各供試体の熱特性を製造条件とともに示す。これによれば、比較例に較べて本発明例は板厚方向の熱伝導率が大幅に増加していることが判る。
Claims (33)
- 板厚方向において、Cu層とCu-Mo複合体層が交互に積層することで3層以上のCu層と2層以上のCu-Mo複合体層で構成されるとともに、両面の最外層がCu層からなる放熱板であって、
Cu-Mo複合体層は、Cuマトリクス中に扁平なMo相が分散した板厚断面組織を有することを特徴とする放熱板。 - 両面の最外層のCu層(1a)の厚さt1と中間層のCu層(1b)の厚さt2がt1≦t2を満足することを特徴とする請求項1に記載の放熱板。
- 両面の最外層のCu層(1a)の厚さt1と板厚Tがt1/T≦0.2を満足することを特徴とする請求項2に記載の放熱板。
- 両面の最外層のCu層(1a)の厚さt1と中間層のCu層(1b)の厚さt2がt1<t2を満足することを特徴とする請求項2又は3に記載の放熱板。
- Cu層とCu-Mo複合体層の全層数が9層以上の放熱板であって、中間層の複数のCu層(1b)は、板厚中心に近いCu層(1b)ほど厚さt2が厚いことを特徴とする請求項4に記載の放熱板。
- Cu-Mo複合体層は、複数の単位Cu-Mo複合体層が厚さ75μm以下の接合用のCu層を介して積層した構造を有することを特徴とする請求項1~5のいずれかに記載の放熱板。
- Cu-Mo複合体層はCu含有量が10~50質量%であることを特徴とする請求項1~6のいずれかに記載の放熱板。
- Cu-Mo複合体層はCu含有量が20~30質量%であることを特徴とする請求項1~6のいずれかに記載の放熱板。
- 板厚方向の熱伝導率が200W/m・K以上、50℃から800℃までの板面内平均熱膨張率が10.0ppm/K以下であることを特徴とする請求項1~8のいずれかに記載の放熱板。
- 積層したCu層とCu-Mo複合体層とからなる放熱板本体の片面又は両面にめっき皮膜が形成されたことを特徴とする請求項1~9のいずれかに記載の放熱板。
- 請求項1~10のいずれかに記載の放熱板の製造方法であって、
Cuマトリクス中にMo相が分散した板厚断面組織を有するCu-Mo複合材(a)とCu材(b)を積層させ、該積層体を拡散接合した後、冷間圧延(x)を施すことにより、Cu-Mo複合材(a)によるCu-Mo複合体層とCu材(b)によるCu層が積層した放熱板を得ることを特徴とする放熱板の製造方法。 - Cu-Mo複合材(a)は、Mo粉末とCu粉末の混合粉末を加圧成形して圧粉体とする工程と、前記圧粉体を還元性雰囲気中又は真空中で焼結して焼結体とする工程を経て得られたものであることを特徴とする請求項11に記載の放熱板の製造方法。
- Cu-Mo複合材(a)は、Mo粉末とCu粉末の混合粉末を加圧成形して圧粉体とする工程と、前記圧粉体を還元性雰囲気中又は真空中で焼結して焼結体とする工程と、前記焼結体を緻密化処理する工程を経て得られたものであることを特徴とする請求項11に記載の放熱板の製造方法。
- Cu-Mo複合材(a)は、Mo粉末又はMo粉末とCu粉末の混合粉末を加圧成形して圧粉体とする工程と、前記圧粉体を還元性雰囲気中又は真空中で焼結して焼結体とする工程と、前記焼結体に非酸化性雰囲気中又は真空中で溶融したCuを含浸させる工程を経て得られたものであることを特徴とする請求項11に記載の放熱板の製造方法。
- 冷間圧延(x)の圧下率が70~99%であることを特徴とする請求項11~14のいずれかに記載の放熱板の製造方法。
- 冷間圧延(x)の圧下率が90~96%であることを特徴とする請求項15に記載の放熱板の製造方法。
- 冷間圧延(x)をクロス圧延で行うことを特徴とする請求項11~16のいずれかに記載の放熱板の製造方法。
- Cu-Mo複合材(a)は、Mo粉末とCu粉末の混合粉末を加圧成形して圧粉体とする工程と、前記圧粉体を還元性雰囲気中又は真空中で焼結して焼結体とする工程と、前記焼結体を緻密化処理する工程と、前記緻密化処理されたCu-Mo複合材に圧延(y)を施す工程を経て得られたものであることを特徴とする請求項11に記載の放熱板の製造方法。
- Cu-Mo複合材(a)は、Mo粉末又はMo粉末とCu粉末の混合粉末を加圧成形して圧粉体とする工程と、前記圧粉体を還元性雰囲気中又は真空中で焼結して焼結体とする工程と、前記焼結体に非酸化性雰囲気中又は真空中で溶融したCuを含浸させる工程と、前記Cuを含浸させたCu-Mo複合材に圧延(y)を施す工程を経て得られたものであることを特徴とする請求項11に記載の放熱板の製造方法。
- 冷間圧延(x)と圧延(y)を合わせたCu-Mo複合材(a)の総圧下率が70~99%であることを特徴とする請求項18又は19に記載の放熱板の製造方法。
- 冷間圧延(x)と圧延(y)を合わせたCu-Mo複合材(a)の総圧下率が90~96%であることを特徴とする請求項20に記載の放熱板の製造方法。
- 圧延(y)をクロス圧延で行うことを特徴とする請求項18~21のいずれかに記載の放熱板の製造方法。
- 圧延(y)でCu-Mo複合材(a)を一方向圧延した場合に、冷間圧延(x)では、Cu-Mo複合材を圧延(y)の圧延方向と直交する方向に圧延することを特徴とする請求項18~22のいずれかに記載の放熱板の製造方法。
- Cu-Mo複合材(a)は、複数の単位Cu-Mo複合材(au)が積層したものであることを特徴とする請求項11~23のいずれかに記載の放熱板の製造方法。
- Cu-Mo複合材(a)は、複数の単位Cu-Mo複合材(au)が接合用のCu薄板を介して積層したものであることを特徴とする請求項11~23のいずれかに記載の放熱板の製造方法。
- Cu材(b)は、複数の単位Cu材(bu)が積層したものであることを特徴とする請求項11~25のいずれかに記載の放熱板の製造方法。
- Cu-Mo複合材(a)はCu含有量が10~50質量%であることを特徴とする請求項11~26のいずれかに記載の放熱板の製造方法。
- Cu-Mo複合材(a)はCu含有量が20~30質量%であることを特徴とする請求項11~26のいずれかに記載の放熱板の製造方法。
- Cu-Mo複合材(a)のCu含有量が20mass%未満であり、冷間圧延(x)と圧延(y)を合わせたCu-Mo複合材(a)の総圧下率が70%以上である製造方法(但し、Cu-Mo複合材(a)の圧延(y)を行わない製造方法を含む。)であって、
下記(1)又は/及び(2)の温間圧延を行うことを特徴とする請求項27に記載の放熱板の製造方法。
(1)冷間圧延(x)に代えて温間圧延を行う。
(2)圧延(y)を温間圧延で行う。 - 冷間圧延(x)と圧延(y)を合わせたCu-Mo複合材(a)の総圧下率が96%以上である製造方法(但し、Cu-Mo複合材(a)の圧延(y)を行わない製造方法を含む。)であって、
下記(1)又は/及び(2)の温間圧延を行うことを特徴とする請求項28に記載の放熱板の製造方法。
(1)冷間圧延(x)に代えて温間圧延を行う。
(2)圧延(y)を温間圧延で行う。 - 積層したCu-Mo複合体層とCu層とからなる放熱板本体の片面又は両面にめっき皮膜を形成することを特徴とする請求項11~30のいずれかに記載の放熱板の製造方法。
- 請求項1~10のいずれかに記載の放熱板を備えたことを特徴とする半導体パッケージ。
- 請求項32に記載の半導体パッケージを備えたことを特徴とする半導体モジュール。
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EP3712935A4 (en) | 2021-01-06 |
JP2019096654A (ja) | 2019-06-20 |
EP3712935A1 (en) | 2020-09-23 |
KR20200088404A (ko) | 2020-07-22 |
US11646243B2 (en) | 2023-05-09 |
CN111357100A (zh) | 2020-06-30 |
JP6455896B1 (ja) | 2019-01-23 |
CN111357100B (zh) | 2023-09-01 |
US20200395268A1 (en) | 2020-12-17 |
KR102347859B1 (ko) | 2022-01-05 |
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