JPWO2022138711A1 - - Google Patents

Info

Publication number
JPWO2022138711A1
JPWO2022138711A1 JP2022571545A JP2022571545A JPWO2022138711A1 JP WO2022138711 A1 JPWO2022138711 A1 JP WO2022138711A1 JP 2022571545 A JP2022571545 A JP 2022571545A JP 2022571545 A JP2022571545 A JP 2022571545A JP WO2022138711 A1 JPWO2022138711 A1 JP WO2022138711A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022571545A
Other versions
JPWO2022138711A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022138711A1 publication Critical patent/JPWO2022138711A1/ja
Publication of JPWO2022138711A5 publication Critical patent/JPWO2022138711A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
    • B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2022571545A 2020-12-24 2021-12-22 Pending JPWO2022138711A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020214612 2020-12-24
PCT/JP2021/047541 WO2022138711A1 (ja) 2020-12-24 2021-12-22 複合材料、半導体パッケージ及び複合材料の製造方法

Publications (2)

Publication Number Publication Date
JPWO2022138711A1 true JPWO2022138711A1 (ja) 2022-06-30
JPWO2022138711A5 JPWO2022138711A5 (ja) 2023-09-14

Family

ID=82159785

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022571545A Pending JPWO2022138711A1 (ja) 2020-12-24 2021-12-22

Country Status (5)

Country Link
JP (1) JPWO2022138711A1 (ja)
KR (1) KR20230122028A (ja)
CN (1) CN116648315A (ja)
DE (1) DE112021006684T5 (ja)
WO (1) WO2022138711A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117531833B (zh) * 2024-01-10 2024-04-02 太原理工大学 一种大厚比镁/钛复合板脉冲电流辅助轧制复合方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06268117A (ja) * 1993-03-15 1994-09-22 Sumitomo Electric Ind Ltd 半導体装置用放熱基板およびその製造方法
JP4227610B2 (ja) * 2005-10-03 2009-02-18 京セラ株式会社 放熱基体の製造方法
JP3862737B1 (ja) * 2005-10-18 2006-12-27 栄樹 津島 クラッド材およびその製造方法、クラッド材の成型方法、クラッド材を用いた放熱基板
JP2007142126A (ja) * 2005-11-18 2007-06-07 Allied Material Corp 複合材料及び半導体搭載用放熱基板、及びそれを用いたセラミックパッケージ
WO2015182385A1 (ja) * 2014-05-29 2015-12-03 株式会社アライドマテリアル ヒートスプレッダとその製造方法
JP6455896B1 (ja) 2017-11-18 2019-01-23 Jfe精密株式会社 放熱板及びその製造方法
JP6732395B1 (ja) * 2019-08-29 2020-07-29 Jfe精密株式会社 放熱板

Also Published As

Publication number Publication date
CN116648315A (zh) 2023-08-25
WO2022138711A1 (ja) 2022-06-30
KR20230122028A (ko) 2023-08-22
DE112021006684T5 (de) 2023-10-26

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Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230427