JPWO2022172856A1 - - Google Patents
Info
- Publication number
- JPWO2022172856A1 JPWO2022172856A1 JP2022580598A JP2022580598A JPWO2022172856A1 JP WO2022172856 A1 JPWO2022172856 A1 JP WO2022172856A1 JP 2022580598 A JP2022580598 A JP 2022580598A JP 2022580598 A JP2022580598 A JP 2022580598A JP WO2022172856 A1 JPWO2022172856 A1 JP WO2022172856A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021019837 | 2021-02-10 | ||
| PCT/JP2022/004284 WO2022172856A1 (ja) | 2021-02-10 | 2022-02-03 | 複合材料、ヒートスプレッダ及び半導体パッケージ |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022172856A1 true JPWO2022172856A1 (ja) | 2022-08-18 |
Family
ID=82837849
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022580598A Pending JPWO2022172856A1 (ja) | 2021-02-10 | 2022-02-03 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2022172856A1 (ja) |
| WO (1) | WO2022172856A1 (ja) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3548991B2 (ja) * | 1997-08-22 | 2004-08-04 | 株式会社アライドマテリアル | 放熱基板及びその製造方法 |
| JP3856640B2 (ja) * | 2000-01-26 | 2006-12-13 | 株式会社アライドマテリアル | 半導体搭載用放熱基板材料、その製造方法、及びそれを用いたセラミックパッケージ |
| JP2002121639A (ja) * | 2000-10-18 | 2002-04-26 | Sumitomo Electric Ind Ltd | 放熱基板およびそれを用いたハイパワー高周波トランジスターパッケージ |
| US10215512B2 (en) * | 2014-05-29 | 2019-02-26 | A.L.M.T. Corp. | Heat spreader and method for manufacturing the same |
| JP6455896B1 (ja) * | 2017-11-18 | 2019-01-23 | Jfe精密株式会社 | 放熱板及びその製造方法 |
| KR20200108599A (ko) * | 2019-03-11 | 2020-09-21 | 주식회사 더굿시스템 | 방열판재 |
-
2022
- 2022-02-03 WO PCT/JP2022/004284 patent/WO2022172856A1/ja active Application Filing
- 2022-02-03 JP JP2022580598A patent/JPWO2022172856A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022172856A1 (ja) | 2022-08-18 |