WO2019090915A1 - 一种柔性基板及其制备方法 - Google Patents

一种柔性基板及其制备方法 Download PDF

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Publication number
WO2019090915A1
WO2019090915A1 PCT/CN2017/117361 CN2017117361W WO2019090915A1 WO 2019090915 A1 WO2019090915 A1 WO 2019090915A1 CN 2017117361 W CN2017117361 W CN 2017117361W WO 2019090915 A1 WO2019090915 A1 WO 2019090915A1
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flexible substrate
substrate material
wet film
vacuum
polyimide
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PCT/CN2017/117361
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English (en)
French (fr)
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王选芸
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武汉华星光电半导体显示技术有限公司
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Publication of WO2019090915A1 publication Critical patent/WO2019090915A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a flexible substrate and a method of fabricating the same.
  • the flexible display method is a method of fabricating a device on the surface of a flexible substrate composed of a flexible material.
  • flexible flexible devices made of flexible substrates will become the mainstream equipment for next-generation optoelectronic devices.
  • Flexible devices such as displays, chips, circuits, power supplies, sensors, etc. can realize functions that traditional optoelectronic devices cannot achieve, and have the advantages of low cost or good user experience.
  • the flexible substrate needs to be peeled off from the hard substrate after the device is prepared.
  • the thickness of the flexible polyimide substrate is only a few ten micrometers, and it is impossible to complete all the processes directly on the flexible polyimide substrate. Therefore, glass is selected as the substrate of the flexible polyimide substrate.
  • the polyimide material used in the flexible polyimide substrate is a liquid material, which needs to be cured at a high temperature, and the glass is easily heated and expanded in a high temperature and low pressure environment, and is applied to When the flexible substrate is used, it is prone to bending and warping.
  • the invention provides a flexible substrate and a preparation method thereof, which can effectively avoid the phenomenon that the glass substrate is bent or warped.
  • a technical solution adopted by the present invention is to provide a method for preparing a flexible substrate, the method comprising:
  • the glass substrate coated with the wet film of the flexible substrate material is vacuum dried to remove a part of the solvent in the wet film of the flexible substrate material, the flexible substrate material being polyimide;
  • the vacuum-dried flexible substrate material is subjected to solidification molding, wherein the temperature at which the curing is performed is matched with the temperature at which the vacuum drying is performed, and the thickness of the flexible substrate material film after vacuum drying is the same as the flexible substrate.
  • the ratio between the thicknesses of the wet films of the materials is within a predetermined ratio range.
  • another technical solution adopted by the present invention is to provide a method for preparing a flexible substrate, the method comprising:
  • the glass substrate coated with the wet film of flexible substrate material is vacuum dried to remove a part of the solvent in the wet film of the flexible substrate material;
  • the vacuum-dried flexible substrate material is subjected to solidification molding, wherein the temperature at which the curing is performed is matched with the temperature at which the vacuum drying is performed.
  • another technical solution adopted by the present invention is to provide a flexible substrate including a glass substrate and a flexible substrate film, wherein the flexible substrate is produced by the following method, including :
  • the glass substrate coated with the wet film of flexible substrate material is vacuum dried to remove a part of the solvent in the wet film of the flexible substrate material;
  • the vacuum-dried flexible substrate material is subjected to solidification molding, wherein the temperature at which the curing is performed is matched with the temperature at which the vacuum drying is performed.
  • the method for preparing the flexible substrate comprises: vacuum drying a glass substrate coated with a wet film of a flexible substrate material to remove the flexible substrate. a part of the solvent in the wet film of the material; curing the vacuum-dried flexible substrate material, wherein the temperature at which the curing is performed matches the temperature at which the vacuum drying is performed.
  • the flexible substrate material can be prevented from solidifying rapidly, and during the reaction process, the flexible substrate material can be thinned at a uniform speed, thereby preventing the glass substrate from being bent. Warping and other phenomena.
  • FIG. 1 is a schematic flow chart of an embodiment of a method for preparing a flexible substrate of the present invention
  • FIG. 2 is a schematic flow chart of another embodiment of a method for preparing a flexible substrate according to the present invention.
  • FIG 3 is a schematic structural view of an embodiment of a flexible substrate of the present invention.
  • FIG. 1 is a schematic flow chart of an embodiment of a method for preparing a flexible substrate according to the present invention.
  • a method for preparing a flexible substrate provided by an embodiment of the present invention includes:
  • step S101 the glass substrate coated with the wet film of the flexible substrate material is vacuum dried to remove a part of the solvent in the wet film of the flexible substrate material.
  • the glass substrate coated with the wet film of the flexible substrate material is subjected to two vacuuming, wherein the first pumping rate is less than the second pumping rate, and the first time is 20-100 s.
  • the second time is 400-600s, such as 400s, 500s or 600s.
  • the apparatus for vacuum drying may be, but is not limited to, a thermal vacuum drying apparatus (HVCD).
  • HVCD thermal vacuum drying apparatus
  • the volume fraction of solvent in the wet film of the flexible substrate material removed is 50-90%, such as 50%, 70% or 80%.
  • the solvent in the wet film of the flexible substrate material diffuses to the surface of the wet film of the flexible substrate material by a pressure difference or a concentration difference, because the boiling point of the solvent is lowered under vacuum, when the vacuum chamber is When the pressure drops to a certain level, the solvent evaporates into a gas and is drawn out of the vacuum chamber during the pumping process. It will be appreciated that the solvent concentration of the wet film surface of the flexible substrate material is greater, while the concentration of the wet film surface away from the flexible substrate material is less, resulting in a concentration difference.
  • the solvent is more volatile, and the thickness of the wet film of the flexible substrate material on the surface of the glass substrate is thinned by vacuum pumping, and the thinning process is controlled by controlling the pumping rate to make the thinning process uniform, thereby making the thinning process
  • the medium glass substrate is subjected to uniform stress, thereby preventing the glass substrate from being bent and warped.
  • the flexible substrate material is polyimide.
  • the temperature at which vacuum drying is performed is in the range of 50 to 120 ° C, for example, 50 ° C, 80 ° C or 120 ° C, and the pressure is 50 Pa or less.
  • the first pumping rate is lower than the second pumping rate, that is, the pumping process in the vacuum chamber is controlled to be less than or equal to 50 Pa by the pumping process after the slow pumping and the quick pumping, to apply the flexible substrate material. While the solvent in the wet film is removed from the vacuum chamber, the amount of expansion and contraction of the flexible substrate material can be effectively controlled, thereby avoiding deformation of the glass substrate.
  • the ratio between the thickness of the flexible substrate material film after vacuum drying and the thickness of the flexible substrate material wet film is within a predetermined ratio range. Further, the thickness of the polyimide film after vacuum drying is wet with polyimide. The ratio between the thicknesses of the films ranges from 1.5 to 2:1, for example, 1.5:1, 1.75:1 or 2:1, and the like.
  • the thickness of the polyimide wet film ranges from 200 to 300 ⁇ m, for example, 200 ⁇ m, 250 ⁇ m or 300 ⁇ m.
  • step S102 the vacuum-dried flexible substrate material is subjected to solidification molding, wherein the temperature at which the curing is performed is matched with the temperature at which vacuum drying is performed.
  • the vacuum-dried flexible substrate material is baked in a baking apparatus (Oven) to cause a cross-linking reaction, thereby solidifying and molding.
  • a baking apparatus Oven
  • the curing is carried out at a temperature in the range of 50-120 ° C, such as 50 ° C, 80 ° C or 120 ° C, to match the temperature at which the vacuum drying is carried out.
  • the initial temperature for curing molding is 50-120 ° C, and then a constant temperature state is maintained in the baking apparatus, so that the temperature of the curing molding is matched with the temperature for vacuum drying, and the flexible substrate material can be effectively prevented.
  • the surface is rapidly solidified, and during the reaction process, the speed of the wet film of the flexible substrate material can be made uniform, thereby avoiding the occurrence of defects such as bending and warpage of the glass substrate.
  • step S101 vacuum drying a glass substrate coated with a wet film of a flexible substrate material, further comprising:
  • step S103 the glass substrate is cleaned.
  • the cleaning process includes at least ultraviolet light treatment, brush cleaning, chemical liquid cleaning, and two-fluid cleaning.
  • the air knife drying system is used for drying treatment.
  • step S104 the flexible substrate material is coated on the glass substrate.
  • the method before the coating the flexible substrate material on the glass substrate, the method further comprises:
  • the flexible substrate material is subjected to a defoaming treatment.
  • the time of the defoaming treatment is in the range of 12-24 h, for example 12 h, 18 h or 24 h.
  • the viscosity of the polyimide is 5000-7000, that is, the viscosity is large, the gas is not easily discharged in the polyimide material, and the gas can be quickly discharged by stirring.
  • the flexible substrate preparation method provided by the embodiment includes: vacuum drying a glass substrate coated with a wet film of a flexible substrate material to remove a part of the solvent in the wet film of the flexible substrate material; vacuum drying The latter flexible substrate material is subjected to solidification molding in which the temperature at which the curing is performed is matched with the temperature at which vacuum drying is performed.
  • the temperature of the solidification molding is matched with the temperature of the vacuum drying, thereby avoiding rapid curing of the flexible substrate material, and in the reaction process, the wet film of the flexible substrate material can be reduced.
  • the thin speed is uniform, thereby avoiding the phenomenon of bending and warping of the glass substrate.
  • an embodiment of the present invention further provides a flexible substrate 100 including a glass substrate 10 and a flexible substrate film 30 obtained by the above method.
  • the temperature of the solidification molding of the flexible substrate 100 is matched with the temperature of the vacuum drying, thereby avoiding the rapid curing of the flexible substrate film 30, thereby preventing the glass substrate 10 from being bent. Warping and other phenomena.

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Abstract

本发明公开了一种柔性基板及其制备方法，其中所述制备方法包括：将涂布有柔性衬底材料湿膜的玻璃基板进行真空干燥，以去除所述柔性衬底材料湿膜中的部分溶剂；将真空干燥后的柔性衬底材料进行固化成型，其中，所述进行固化成型的温度与所述进行真空干燥的温度相匹配。通过上述方式，本发明能够有效避免玻璃基板出现弯曲、翘曲等现象。

Description

一种柔性基板及其制备方法
【技术领域】
本发明涉及显示技术领域，特别是涉及一种柔性基板及其制备方法。
【背景技术】
柔性显示方法是一种在柔性材料构成的柔性基板的表面上制备器件的方法。随着科技的发展和进步，采用柔性基板制成的可弯曲的柔性器件将成为下一代光电子器件的主流设备。如显示器、芯片、电路、电源、传感器等柔性器件可以实现传统光电子器件所不能实现的功能，具有低成本或用户体验佳等优势。
以柔性AMOLED为例，需要在硬质基板表面先制备或吸附柔性基板，在制备器件后需将柔性基板从硬质基板上剥离。柔性聚酰亚胺基板的厚度只有十几微米，不可能直接在柔性聚酰亚胺基板上完成所有制程，因此选用玻璃作为柔性聚酰亚胺基板的衬底。
本申请的发明人在长期的研究过程中发现，柔性聚酰亚胺基板所使用的聚酰亚胺材料为液体材料，需进行高温固化成型，在高温和低压环境下玻璃容易受热膨胀，应用至柔性基板时，易出现弯曲、翘曲等现象。
【发明内容】
本发明提供一种柔性基板及其制备方法，能够有效避免玻璃基板出现弯曲、翘曲等现象。
为解决上述技术问题，本发明采用的一个技术方案是：提供一种柔性基板的制备方法，所述方法包括：
将涂布有柔性衬底材料湿膜的玻璃基板进行真空干燥，以去除所述柔性衬底材料湿膜中的部分溶剂，所述柔性衬底材料为聚酰亚胺；
将真空干燥后的柔性衬底材料进行固化成型，其中，所述进行固化成型的温度与所述进行真空干燥的温度相匹配，真空干燥后的柔性衬底材料薄膜的厚度与所述柔性衬底材料湿膜的厚度之间的比例在预定比例范围内。
为解决上述技术问题，本发明采用的另一个技术方案是：提供一种柔性基板的制备方法，所述方法包括：
将涂布有柔性衬底材料湿膜的玻璃基板进行真空干燥，以去除所述柔性衬底材料湿膜中的部分溶剂；
将真空干燥后的柔性衬底材料进行固化成型，其中，所述进行固化成型的温度与所述进行真空干燥的温度相匹配。
为解决上述技术问题，本发明采用的另一个技术方案是：提供一种柔性基板，所述柔性基板包括玻璃基板和柔性衬底膜，其中，所述柔性基板是通过下述方法制得，包括：
将涂布有柔性衬底材料湿膜的玻璃基板进行真空干燥，以去除所述柔性衬底材料湿膜中的部分溶剂；
将真空干燥后的柔性衬底材料进行固化成型，其中，所述进行固化成型的温度与所述进行真空干燥的温度相匹配。
本发明的有益效果是：区别于现有技术的情况，本发明提供的柔性基板的制备方法包括：将涂布有柔性衬底材料湿膜的玻璃基板进行真空干燥，以去除所述柔性衬底材料湿膜中的部分溶剂；将真空干燥后的柔性衬底材料进行固化成型，其中，所述进行固化成型的温度与所述进行真空干燥的温度相匹配。通过将固化成型的温度与真空干燥的温度相匹配，从而避免柔性衬底材料快速固化，且在反应过程中，能使得柔性衬底材料湿膜减薄的速度均匀，进而避免玻璃基板出现弯曲、翘曲等现象。
【附图说明】
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图，其中：
图1是本发明柔性基板的制备方法一实施方式的流程示意图；
图2是本发明柔性基板的制备方法另一实施方式的流程示意图；
图3是本发明柔性基板一实施方式的结构示意图。
【具体实施方式】
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，均属于本发明保护的范围。
参阅图1，图1是本发明柔性基板的制备方法一实施方式的流程示意图。本发明实施方式提供的柔性基板的制备方法包括：
步骤S101，将涂布有柔性衬底材料湿膜的玻璃基板进行真空干燥，以去除柔性衬底材料湿膜中的部分溶剂。
具体的，对涂布有柔性衬底材料湿膜的玻璃基板进行两次抽真空，其中，第一次的抽气速率小于第二次的抽气速率，第一次的时间为20-100s，例如20s、50s或100s，第二次的时间为400-600s，例如400s、500s或600s。
可以理解，进行真空干燥的设备可为但不限于热真空干燥设备(HVCD)。
进行干燥后，去除的柔性衬底材料湿膜中的溶剂的体积分数为50-90%，例如50%、70%或80%。
在进行真空干燥的过程中，柔性衬底材料湿膜中的溶剂通过压力差或浓度差，扩散到柔性衬底材料湿膜的表面，因在真空状态下，溶剂的沸点降低，当真空室内的压力降到一定程度时，溶剂挥发成气体并在抽气的过程中被抽出真空室。可以理解，柔性衬底材料湿膜表面的溶剂浓度较大，而远离柔性衬底材料湿膜表面的浓度较小，从而造成浓度差。
通过真空干燥，溶剂挥发的较多，且通过真空抽气，玻璃基板表面的柔性衬底材料湿膜的厚度减薄，同时通过控制抽气速率以控制减薄速率均匀，从而使得在减薄过程中玻璃基板受到的应力均匀，进而避免玻璃基板出现弯曲、翘曲的现象。
在本实施方式中，柔性衬底材料为聚酰亚胺。
在本实施方式中，进行真空干燥的温度范围为50-120℃，例如50℃、80℃或120℃，压力为小于或等于50pa。
可以理解，第一次的抽气速率小于第二次的抽气速率，即通过先慢抽后快抽的抽气过程，将真空室内的压力控制在小于或等于50pa，以将柔性衬底材料湿膜中的溶剂移出真空室的同时，能有效控制柔性衬底材料的伸缩量，从而避免造成玻璃基板变形。
真空干燥后的柔性衬底材料薄膜的厚度与柔性衬底材料湿膜的厚度之间的比例在预定比例范围内，进一步的，真空干燥后的聚酰亚胺薄膜的厚度与聚酰亚胺湿膜的厚度之间的比例范围为1.5-2:1，例如，1.5:1、1.75:1或2:1等。
聚酰亚胺湿膜的厚度范围为200-300μm，例如200μm、250μm或300μm。
步骤S102，将真空干燥后的柔性衬底材料进行固化成型，其中，进行固化成型的温度与进行真空干燥的温度相匹配。
本实施方式中，真空干燥后的柔性衬底材料在烘烤设备(Oven)中进行烘烤以发生交联化反应，从而固化成型。
在一实施方式中，进行固化成型的温度范围是50-120℃，例如50℃、80℃或120℃，以与进行真空干燥的温度相匹配。
可以理解，进行固化成型的起始温度为50-120℃，后续在烘烤设备中保持一恒温状态，使得进行固化成型的温度与进行真空干燥的温度相匹配后，能够有效防止柔性衬底材料的表面快速固化，且在反应过程中，能使得柔性衬底材料湿膜减薄的速度均匀，从而避免玻璃基板出现弯曲、翘曲等不良现象。
在一实施方式中，请参阅图2，步骤S101，将涂布有柔性衬底材料湿膜的玻璃基板进行真空干燥，还包括：
步骤S103，将玻璃基板进行清洗。
可以理解，清洗的过程至少包括紫外光处理、毛刷清洗、药液清洗以及二流体清洗，在清洗结束后，经风刀干燥系统以进行干燥处理。
步骤S104，将柔性衬底材料涂布至玻璃基板上。
在一实施方式中，将柔性衬底材料涂布在玻璃基板上之前还包括：
对柔性衬底材料进行脱泡处理。
其中，脱泡处理的时间范围为12-24h，例如12h、18h或24h。
选用聚酰亚胺作为柔性衬底材料时，因聚酰亚胺的粘度是5000-7000，即粘度较大，气体在聚酰亚胺材料中不易排出，通过搅拌能快速将气体排出。
区别于现有技术，本实施方式提供的柔性基板制备方法包括：将涂布有柔性衬底材料湿膜的玻璃基板进行真空干燥，以去除柔性衬底材料湿膜中的部分溶剂；将真空干燥后的柔性衬底材料进行固化成型，其中，进行固化成型的温度与进行真空干燥的温度相匹配。本实施方式提供的柔性基板制备方法过程中，通过将固化成型的温度与真空干燥的温度相匹配，从而避免柔性衬底材料快速固化，且在反应过程中，能使得柔性衬底材料湿膜减薄的速度均匀，进而避免玻璃基板出现弯曲、翘曲等现象。
请参阅图3，本发明实施方式还提供一种柔性基板100，该柔性基板100包括玻璃基板10和柔性衬底膜30，该柔性基板100是通过上述方法获得的。
区别于现有技术，本实施方式提供的柔性基板100在制备过程中，固化成型的温度与真空干燥的温度相匹配，从而避免柔性衬底膜30快速固化，进而避免该玻璃基板10出现弯曲、翘曲等现象。
以上所述仅为本发明的实施方式，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (17)

  1. 一种柔性基板的制备方法，其中，所述方法包括：
    将涂布有柔性衬底材料湿膜的玻璃基板进行真空干燥，以去除所述柔性衬底材料湿膜中的部分溶剂，所述柔性衬底材料为聚酰亚胺；
    将真空干燥后的柔性衬底材料进行固化成型，其中，所述进行固化成型的温度与所述进行真空干燥的温度相匹配，真空干燥后的柔性衬底材料薄膜的厚度与所述柔性衬底材料湿膜的厚度之间的比例在预定比例范围内。
  2. 根据权利要求1所述的方法，其中，所述进行真空干燥的温度范围为50-120℃，压力为小于或等于50pa。
  3. 根据权利要求1所述的方法，其中，所述进行固化成型的温度范围是50-120℃。
  4. 根据权利要求1所述的方法，其中，所述柔性衬底材料为聚酰亚胺，真空干燥后的聚酰亚胺薄膜的厚度与聚酰亚胺湿膜的厚度之间的比例范围为1.5-2:1。
  5. 根据权利要求4所述的方法，其中，聚酰亚胺湿膜的厚度范围为200-300μm。
  6. 根据权利要求1所述的方法，其中，所述将涂布有柔性衬底材料湿膜的玻璃基板进行真空干燥的步骤中，包括：
    对涂布有柔性衬底材料湿膜的玻璃基板进行两次抽真空，其中，第一次的抽气速率小于第二次的抽气速率，第一次的时间为20-100s，第二次的时间为400-600s。
  7. 根据权利要求1所述的方法，其中，所述进行干燥后，去除的所述柔性衬底材料湿膜中的溶剂的体积分数为50-90%。
  8. 一种柔性基板的制备方法，其中，所述方法包括：
    将涂布有柔性衬底材料湿膜的玻璃基板进行真空干燥，以去除所述柔性衬底材料湿膜中的部分溶剂；
    将真空干燥后的柔性衬底材料进行固化成型，其中，所述进行固化成型的温度与所述进行真空干燥的温度相匹配。
  9. 根据权利要求8所述的方法，其中，所述柔性衬底材料为聚酰亚胺。
  10. 根据权利要求8所述的方法，其中，所述进行真空干燥的温度范围为50-120℃，压力为小于或等于50pa。
  11. 根据权利要求8所述的方法，其中，所述进行固化成型的温度范围是50-120℃。
  12. 根据权利要求8所述的方法，其中，真空干燥后的柔性衬底材料薄膜的厚度与所述柔性衬底材料湿膜的厚度之间的比例在预定比例范围内。
  13. 根据权利要求12所述的方法，其中，所述柔性衬底材料为聚酰亚胺，真空干燥后的聚酰亚胺薄膜的厚度与聚酰亚胺湿膜的厚度之间的比例范围为1.5-2:1。
  14. 根据权利要求13所述的方法，其中，聚酰亚胺湿膜的厚度范围为200-300μm。
  15. 根据权利要求8所述的方法，其中，所述将涂布有柔性衬底材料湿膜的玻璃基板进行真空干燥的步骤中，包括：
    对涂布有柔性衬底材料湿膜的玻璃基板进行两次抽真空，其中，第一次的抽气速率小于第二次的抽气速率，第一次的时间为20-100s，第二次的时间为400-600s。
  16. 根据权利要求8所述的方法，其中，所述进行干燥后，去除的所述柔性衬底材料湿膜中的溶剂的体积分数为50-90%。
  17. 一种柔性基板，其中，所述柔性基板包括玻璃基板及柔性衬底膜，其中，所述柔性基板是通过权利要求8中的方法制得的。
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