WO2019088078A1 - ロール包装体 - Google Patents

ロール包装体 Download PDF

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Publication number
WO2019088078A1
WO2019088078A1 PCT/JP2018/040272 JP2018040272W WO2019088078A1 WO 2019088078 A1 WO2019088078 A1 WO 2019088078A1 JP 2018040272 W JP2018040272 W JP 2018040272W WO 2019088078 A1 WO2019088078 A1 WO 2019088078A1
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WO
WIPO (PCT)
Prior art keywords
resin film
film
winding core
roll
packaging
Prior art date
Application number
PCT/JP2018/040272
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
貴至 西村
Original Assignee
積水化学工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 積水化学工業株式会社 filed Critical 積水化学工業株式会社
Priority to KR1020207012132A priority Critical patent/KR20200076690A/ko
Priority to CN201880070085.7A priority patent/CN111278749B/zh
Publication of WO2019088078A1 publication Critical patent/WO2019088078A1/ja

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D75/00—Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes, or webs of flexible sheet material, e.g. in folded wrappers
    • B65D75/04—Articles or materials wholly enclosed in single sheets or wrapper blanks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/67—Containers, packaging elements or packages, specially adapted for particular articles or materials for web or tape-like material
    • B65D85/671—Containers, packaging elements or packages, specially adapted for particular articles or materials for web or tape-like material wound in flat spiral form
    • B65D85/672—Containers, packaging elements or packages, specially adapted for particular articles or materials for web or tape-like material wound in flat spiral form on cores

Definitions

  • the present invention relates to a roll package in which a resin film is wound on the outer peripheral surface of a winding core.
  • a resin film is used to form an insulating layer for insulating the inner layers or to form an insulating layer located on the surface layer portion.
  • a polyimide film is often used to form a flexible insulating layer.
  • the original film of a resin film may be wound by roll shape.
  • the roll film wound raw film may be stored or transported. During the storage and transportation, the roll-formed raw film is exposed to various environments, and an impact is applied to the roll-formed raw film.
  • Patent Document 1 discloses a polyimide film roll in which a polyimide film having a thickness of 1 ⁇ m or more and 30 ⁇ m or less is wound in a roll, and a roll body of the polyimide film is packaged by a sheet material for packaging. There is.
  • the packaging sheet material is formed of a metal material.
  • a resin film containing an inorganic filler is used to form an insulating layer having a low dielectric loss tangent.
  • a resin film containing an inorganic filler when the resin film is bent or an impact is applied to the resin film, the resin film is likely to be cracked or broken. If the content of the inorganic filler is small, even if the occurrence of cracks or cracks in the resin film can be prevented, the resin film is bent if the content of the inorganic filler in the resin film is large. When the resin film is subjected to an impact, the resin film is likely to be cracked or broken.
  • An object of the present invention is to provide a roll package that can prevent the occurrence of cracks or breakage of a resin film.
  • a winding core, a resin film, and a packaging film are provided, and an axial dimension of the winding core is larger than a width direction dimension of the resin film, and an end portion of the winding core
  • the resin film is wound in the form of a roll on the outer peripheral surface of the winding core in the area excluding the outer peripheral surface of the above, and the packaging film is wound on the outer peripheral surface of the roll of resin film.
  • the roll packaging body is provided, wherein the packaging film extends on the side surface of the roll body of the resin film, and the resin film includes an inorganic filler at 30% by weight or more.
  • a shock absorbing material is disposed on the outer peripheral surface of the end of the winding core.
  • the winding core has an opening on both sides in the axial direction, and the packaging film is folded in the opening of the winding core.
  • a shock absorbing material is disposed on the outer peripheral surface of the end of the winding core via the packaging film.
  • the roll package includes a holding member for holding the winding core, the resin film, and the packaging film in a suspended manner, and
  • the holding members are attached to both sides in the axial direction.
  • the winding core has an opening on both sides in the axial direction
  • the holding member has a holding member main body and an insertion portion
  • the holding is The insertion portion of the member is inserted into the opening of the winding core.
  • the tip of the insertion portion of the holding member inserted into the opening of the winding core is the end of the resin film It is located inside the part.
  • a buffer film is disposed between the roll body of the resin film and the packaging film.
  • the resin film contains the inorganic filler at 60% by weight or more.
  • the resin film contains a thermosetting compound and a curing agent.
  • thermosetting compound is an epoxy compound.
  • the resin film is a B-stage film.
  • the roll package according to the present invention includes a winding core, a resin film, and a packaging film.
  • the axial dimension of the winding core is larger than the width dimension of the resin film.
  • the resin film is wound in a roll on the outer peripheral surface of the winding core in a region excluding the outer peripheral surface of the end portion of the winding core.
  • the packaging film is wound on the outer peripheral surface of the roll body, and the packaging film extends on the side surface of the roll body of the resin film.
  • the resin film contains an inorganic filler at 30% by weight or more.
  • FIG. 1 is a cross-sectional view schematically showing a roll package according to a first embodiment of the present invention.
  • FIG. 2 is a perspective view schematically showing a roll package according to a second embodiment of the present invention.
  • FIG. 3 is a perspective view schematically showing a roll package according to a third embodiment of the present invention.
  • FIG. 4 is a perspective view schematically showing a shock absorbing material.
  • FIG. 5 is a perspective view schematically showing the holding member.
  • the roll package according to the present invention includes a winding core, a resin film, and a packaging film.
  • the axial dimension of the winding core is larger than the width dimension of the resin film.
  • the resin film is wound in a roll on the outer peripheral surface of the winding core in a region excluding the outer peripheral surface of the end portion of the winding core.
  • the packaging film is wound on the outer peripheral surface of the roll body, and the packaging film extends on the side surface of the roll body of the resin film.
  • the resin film contains an inorganic filler at 30% by weight or more.
  • the resin film containing a relatively large amount of the inorganic filler is wound in a roll, the generation of the crack or the crack of the resin film can be prevented.
  • the occurrence of cracks or breakage of the resin film can be prevented, so that even when the resin film is laminated on the substrate, voids are not easily generated. Furthermore, when the insulating layer is formed of a resin film, the insulation reliability can be enhanced.
  • the resin film is preferably a resin film used to form an insulating layer in a printed wiring board.
  • FIG. 1 is a cross-sectional view schematically showing a roll package according to a first embodiment of the present invention.
  • FIG. 1 and the drawings to be described later different portions can be replaced with each other.
  • the roll package 1 includes a winding core 3, a resin film 2, a packaging film 4, a buffer material 5, a holding member 6, and a buffer film 7.
  • the winding core 3 has an opening 3a on both sides in the axial direction.
  • the inside of the winding core 3 is hollow.
  • the winding core 3 is cylindrical.
  • the axial dimension of the winding core 3 is larger than the width dimension of the resin film 2.
  • the resin film 2 is wound in a roll shape on the outer peripheral surface of the winding core 3 in a region excluding the outer peripheral surface of the end portion of the winding core 3.
  • the resin film 2 is not wound on the outer peripheral surface of the end of the winding core 3.
  • the winding core 3 and the resin film 2 are in contact on the outer peripheral surface of the winding core 3.
  • Another film may be disposed between the winding core and the resin film.
  • the resin film 2 is wound in a roll form from one end to the other end in the length direction.
  • the width direction of the resin film 2 corresponds to the axial direction of the winding core 3.
  • the resin film 2 Since the resin film 2 is wound in a roll, the resin film 2 is wound on the outer peripheral surface of the winding core 3 one or more times.
  • the resin film 2 is a roll body.
  • the resin film is preferably wound twice or more on the outer peripheral surface of the winding core, and the resin film on the inner periphery and the resin film on the outer periphery are preferably laminated.
  • a buffer film 7 is disposed between the roll of the resin film 2 and the packaging film 4.
  • the resin film 2 and the buffer film 7 are in contact on the outer peripheral surface of the resin film 2.
  • the outer peripheral surface of the resin film 2 is protected by the buffer film 7.
  • the buffer film 7 is wound around the outer peripheral surface of the resin film 2 once or more than once.
  • the buffer film may be wound more than once around the outer peripheral surface of the resin film.
  • a buffer film may not be used.
  • a packaging film 4 is wound on the outer peripheral surface of the roll body of the resin film 2.
  • the packaging film 4 is wound on the outer peripheral surface of the roll body of the resin film 2 via the buffer film 7.
  • the packaging film may be wound directly on the outer peripheral surface of the roll of resin film without the buffer film.
  • the packaging film 4 is on the end of the winding core 3.
  • a packaging film 4 is wound on the outer peripheral surface of the end of the winding core 3.
  • the buffer film 7 and the packaging film 4 are in contact with each other on the outer peripheral surface of the buffer film 7.
  • the winding core 3 and the packaging film 4 are in contact on the end of the winding core 3.
  • the resin film 2 and the packaging film 4 are not in contact with each other on the outer peripheral surface of the resin film 2.
  • the packaging film 4 is on the side of the roll of the resin film 2.
  • the packaging film portion extending on the side surface of the roll of resin film is located on the side of the side of the roll of resin film.
  • the packaging film may or may not be in contact with the side surface of the resin film roll body as long as the packaging film reaches the side surface of the resin film roll body. There may be a space between the packaging film and the side surface of the roll of resin film, and other members may be disposed.
  • the packaging film 4 is folded into the opening 3 a of the winding core 3. For this reason, in the roll packaging 1, the packaging film 4 is well held. By folding the packaging film 4 into the opening 3 a of the winding core 3, it is possible to prevent the shape of the packaging form from being broken.
  • a shock absorbing material 5 is disposed on the outer peripheral surface of the end portion of the winding core 3 via the packaging film 4.
  • the cushioning material 5 shown in FIG. 4 (a) is used.
  • a shock absorbing material 5 is disposed on the outer peripheral surface of the end portion of the winding core 3 via the packaging film 4.
  • the buffer material 5 has a rectangular parallelepiped shape, and has an opening corresponding to the size of the end of the winding core 3 in the rectangular parallelepiped.
  • the buffer material 5 is externally inserted to the winding core 3 so that the end of the winding core 3 is positioned in the opening of the buffer material 5 from the outside in the axial direction of the winding core 3 to the inside.
  • the packaging material is well protected by the buffer material 5 and the side surface of the roll body of the resin film 2 is protected.
  • the buffer material 5 extends to the outside of the packaging film 4 in the radial direction of the annularly wound packaging film 4. No cushioning material may be used.
  • the cushioning material 5A includes a first cushioning member 5a and a second cushioning member 5b.
  • the shock absorbing material 5A has a shape obtained by cutting the shock absorbing material 5 at the center.
  • the first buffer member 5a and the second buffer member 5b have semicircular recesses.
  • the cushioning material 5A in which the first cushioning member 5a and the second cushioning member 5b are combined has a rectangular parallelepiped shape, and has an opening corresponding to the size of the end of the winding core in the rectangular parallelepiped. .
  • the buffer 5A By fitting the recess of the first buffer member 5a of the buffer 5A and the recess of the second buffer 5b onto the outer peripheral surface of the end of the winding core, the buffer 5A is formed at the end of the winding core It can be easily arranged on the outer peripheral surface.
  • the cushioning material 5 is less likely to cause unintended detachment from the roll package than the cushioning material 5A.
  • the shock absorbing material 5A is easier to remove than the shock absorbing material 5.
  • only the 1st buffer member 5a may be used as a buffer material, and only the 2nd buffer member 5b may be used.
  • the shape of the opening of the said shock absorbing material can be changed according to the shape of the edge part of a winding core.
  • the outer shape of the cushioning material may be a polygon such as a square, or may be circular.
  • Holding members 6 are attached to both axial sides of the winding core 3.
  • the holding member 6 shown in FIG. 5 is used.
  • the holding member 6 is a member for holding the winding core 3, the resin film 2 and the packaging film 4 in a suspended manner. As shown in FIG. 1, the holding member 6 may not hold the cushioning material 5 in a suspended manner. The holding member may hold the cushioning material in a suspended manner.
  • the holding member 6 extends to the outside of the packaging film 4 in the radial direction of the annularly wound packaging film 4.
  • the holding member 6 has a holding member main body 6a and an insertion portion 6b.
  • the insertion portion 6 b of the holding member 6 is inserted into the opening 3 a of the winding core 3.
  • the insertion portion 6 b of the holding member 6 is inserted into the winding core 3 so that the insertion portion 6 b of the holding member 6 is positioned in the opening 3 a of the winding core 3 and in the opening of the cushioning material 5.
  • the tip end of the insertion portion 6 b of the holding member 6 inserted into the opening 3 a of the winding core 3 is located inside the end of the resin film 2.
  • the winding core 3, the resin film 2 and the packaging film 4 can be more favorably held in a suspended manner.
  • the leading end of the insertion portion of the holding member inserted in the opening of the winding core may be located outside the end of the resin film, and is aligned with the end of the resin film May be
  • the holding member may not be used.
  • the roll package 1 can be placed on the mounting surface as shown in FIG.
  • the holding member 6 is in contact with the mounting surface.
  • the shock absorbing material 5 is in contact with the mounting surface.
  • the cushioning material may not be in contact with the mounting surface.
  • FIG. 2 is a perspective view schematically showing a roll package according to a second embodiment of the present invention.
  • the roll package 11A includes a winding core 3, a resin film 2, and a packaging film 4A.
  • the winding core 3 and the resin film 2 are configured in the same manner.
  • the roll wrapping body 11A is not provided with a shock absorbing material, a holding member, and a shock absorbing film.
  • a packaging film 4A is wound on the outer peripheral surface of the roll body of the resin film 2.
  • the resin film 2 and the packaging film 4A are in contact with each other on the outer peripheral surface of the resin film 2.
  • the packaging film 4A extends on the side surface of the roll body of the resin film 2.
  • the winding core 3 and the packaging film 4A are in contact with each other on the end of the winding core 3.
  • the end of the packaging film 4 is in contact with the outer peripheral surface of the end of the winding core 3.
  • the packaging film 4A is not folded into the opening 3a of the winding core 3.
  • a buffer material may be used with respect to 11 A of roll packaging bodies shown in FIG. 2, a holding member may be used, and a buffer film may be used.
  • FIG. 3 is a perspective view schematically showing a roll package according to a third embodiment of the present invention.
  • the roll packaging body 11B includes the winding core 3, the resin film 2, and the packaging film 4.
  • the winding core 3, the resin film 2 and the packaging film 4 are configured in the same manner.
  • the roll wrapping body 11 ⁇ / b> B does not include a shock absorbing material, a holding member, and a shock absorbing film.
  • the packaging film 4 is folded into the opening 3 a of the winding core 3. As described above, the packaging film 4 is configured in the same manner for the roll package 11 B and the roll package 1. However, in the roll packaged body 11B, the end portion of the packaging film 4 is not in contact with the outer peripheral surface of the end portion of the winding core 3 because the cushioning material and the holding member are not used.
  • a shock absorbing material may be used with respect to roll packaging body 11B shown in FIG. 3, and a holding member may be used.
  • the end of the packaging film 4 is in contact with the outer peripheral surface of the end of the winding core 3 by using the cushioning material 5 with respect to the roll packaged body 11B illustrated in FIG. 3.
  • the shock absorbing material 5 and the holding member 6 for the roll packaged body 11B shown in FIG. 3 it is possible to obtain a roll packaged body which differs only in the use or non-use of the buffer film as compared with the roll packaged body 1 shown in FIG. Can.
  • the material of the winding core is not particularly limited.
  • the material of the winding core is preferably a plastic resin because it is excellent in processability, lightness and strength.
  • plastic resin examples include polyethylene (PE) resin, polypropylene (PP) resin, polystyrene (PS) resin, acrylonitrile butadiene styrene (ABS) resin, nylon resin, and polyvinyl chloride resin.
  • PE polyethylene
  • PP polypropylene
  • PS polystyrene
  • ABS acrylonitrile butadiene styrene
  • the axial dimension of the winding core is larger than the width dimension of the resin film.
  • the axial dimension of the winding core is preferably 20 cm or more, more preferably 25 cm or more, preferably 100 cm or less, more preferably 95 cm or less.
  • the axial dimension of the winding core is preferably 1 cm or more larger than the width direction dimension of the resin film, and more preferably 2 cm or larger.
  • the winding core preferably has an opening on both sides in the axial direction, and the winding core is preferably cylindrical.
  • the resin film is wound in a roll shape on the outer peripheral surface of the winding core in a region excluding the outer peripheral surface of the end portion of the winding core. It is preferable that the external shape of the part by which the said resin film of the said winding core is wound is a circle. It is preferable that the part by which the said resin film of the said winding core is wound has a cavity inside.
  • the inner diameter and the thickness of the winding core are appropriately set in consideration of the strength and lightness of the winding core and the like.
  • winding cores having an inner diameter of 7.6 cm (3 inches) and a thickness of 4 mm can be used.
  • the said resin film is wound by roll shape on the outer peripheral surface of the said winding core in area
  • the said resin film is a roll body.
  • the length of the resin film is preferably 20 m or more, and preferably 300 m or less. Even when the resin film is wound on the outer peripheral surface of the winding core when the length of the resin film is equal to or less than the upper limit, the misalignment of the resin film can be favorably suppressed.
  • the widthwise dimension of the resin film is preferably 20 cm or more, more preferably 25 cm or more, preferably 100 cm or less, more preferably 95 cm or less.
  • the said resin film contains the inorganic filler mentioned later. It is preferable that the said resin film contains the thermosetting compound and hardening
  • the resin film contains an inorganic filler.
  • the use of the inorganic filler reduces the dimensional change of the cured resin film due to heat. Furthermore, the surface roughness of the surface of the cured product of the resin film is further reduced, and the adhesion strength between the insulating layer and the metal layer is increased.
  • the inorganic filler may be used alone or in combination of two or more.
  • examples of the inorganic filler include silica, talc, clay, mica, hydrotalcite, alumina, magnesium oxide, aluminum hydroxide, aluminum nitride, and boron nitride.
  • the above-mentioned inorganic filler is preferably silica or alumina, more preferably silica, and still more preferably fused silica.
  • silica the thermal expansion coefficient of the cured product is further lowered, the surface roughness of the surface of the cured product is effectively reduced, and the adhesion strength between the insulating layer and the metal layer is effectively enhanced.
  • the shape of the silica is preferably spherical.
  • the inorganic filler is spherical silica Is preferred.
  • the average particle diameter of the above inorganic filler is preferably 10 nm or more, more preferably 50 nm or more, still more preferably 100 nm or more, preferably 5 ⁇ m or less, more preferably 3 ⁇ m or less, still more preferably 1 ⁇ m or less, particularly preferably 0.5 ⁇ m It is below.
  • the adhesive strength of an insulating layer and a metal layer becomes it still higher that the average particle diameter of the said inorganic filler is more than the said minimum and below the said upper limit.
  • the average particle diameter of the above-mentioned inorganic filler a value of median diameter (d50) which is 50% is adopted.
  • the average particle size can be measured using a laser diffraction scattering type particle size distribution measuring apparatus.
  • the inorganic filler is preferably spherical, and more preferably spherical silica. In this case, the surface roughness of the surface of the cured product is effectively reduced, and the adhesion strength between the insulating layer and the metal layer is effectively enhanced.
  • the aspect ratio of the inorganic filler is preferably 2 or less, more preferably 1.5 or less.
  • the inorganic filler is preferably surface-treated, more preferably a surface-treated product with a coupling agent, and still more preferably a surface-treated product with a silane coupling agent.
  • a coupling agent preferably a surface-treated product with a coupling agent
  • a silane coupling agent preferably a silane coupling agent
  • silane coupling agent a silane coupling agent, a titanium coupling agent, an aluminum coupling agent etc.
  • silane coupling agent examples include methacryl silane, acryl silane, aminosilane, imidazole silane, vinyl silane, and epoxy silane.
  • the content of the inorganic filler is 30% by weight or more in 100% by weight of the resin film.
  • the content of the inorganic filler is preferably 50% by weight or more, more preferably 60% by weight or more, still more preferably 70% by weight or more, preferably 90% by weight or less, of 100% by weight of the resin film. It is at most 85 wt%, more preferably at most 83 wt%, particularly preferably at most 80 wt%.
  • the content of the inorganic filler is the lower limit or more and the upper limit or less, the surface roughness of the surface of the insulating layer is further reduced, and the adhesion strength between the insulating layer and the metal layer is further enhanced, and the insulation is Finer wiring is formed by the surface of the layer.
  • this inorganic filler it is also possible to improve the smear removability simultaneously with lowering the thermal expansion coefficient of the insulating layer.
  • the content of the inorganic filler is at least the lower limit, the dielectric loss tangent is effectively reduced.
  • thermosetting compound It is preferable that the said resin film contains a thermosetting compound.
  • the said thermosetting compound is not specifically limited.
  • thermosetting compound conventionally known thermosetting compounds can be used.
  • thermosetting compound examples include styrene compounds, phenoxy compounds, oxetane compounds, epoxy compounds, episulfide compounds, (meth) acrylic compounds, phenol compounds, amino compounds, unsaturated polyester compounds, polyurethane compounds, silicone compounds, and polyimide compounds. It can be mentioned. Only one type of the thermosetting compound may be used, or two or more types may be used in combination.
  • the thermosetting compound is preferably an epoxy compound.
  • the epoxy compound refers to an organic compound having at least one epoxy group. Only one type of the thermosetting compound and the epoxy compound may be used, or two or more types may be used in combination.
  • epoxy compounds examples include bisphenol A type epoxy compounds, bisphenol F type epoxy compounds, bisphenol S type epoxy compounds, phenol novolac type epoxy compounds, biphenyl type epoxy compounds, biphenyl novolac type epoxy compounds, biphenol type epoxy compounds, naphthalene type epoxy compounds , Fluorene type epoxy compounds, phenol aralkyl type epoxy compounds, naphthol aralkyl type epoxy compounds, dicyclopentadiene type epoxy compounds, anthracene type epoxy compounds, epoxy compounds having an adamantane skeleton, epoxy compounds having a tricyclodecane skeleton, naphthalene ether type
  • skeleton, etc. are mentioned.
  • the epoxy compound preferably has an aromatic skeleton, preferably has a biphenyl skeleton, and is preferably a biphenyl type epoxy compound.
  • the molecular weight of the epoxy compound is more preferably 1,000 or less. In this case, when the resin film is laminated on the substrate, the inorganic filler can be uniformly present.
  • the molecular weight of the epoxy compound and the molecular weight of the curing agent described later mean the molecular weight that can be calculated from the structural formula. Do. Moreover, when an epoxy compound or a hardening
  • the content of the thermosetting compound (epoxy compound when the thermosetting compound is an epoxy compound) in 100% by weight of the resin film is preferably 10% by weight or more, more preferably 20% by weight or more, and preferably Is 70% by weight or less, more preferably 65% by weight or less, still more preferably 60% by weight or less, and particularly preferably 55% by weight or less.
  • the adhesive strength of an insulating layer and a metal layer can be further heightened as the said content is more than the said minimum and below the said upper limit.
  • the resin film preferably contains a curing agent.
  • the curing agent is not particularly limited.
  • a conventionally known curing agent can be used as the above-mentioned curing agent. Only one type of the curing agent may be used, or two or more types may be used in combination.
  • cyanate ester compounds cyanate ester curing agents
  • phenol compounds phenol curing agents
  • amine compounds amine curing agents
  • thiol compounds thiol curing agents
  • imidazole compounds phosphine compounds
  • acid anhydrides Active ester compounds and dicyandiamide
  • the thermosetting compound is an epoxy compound
  • the curing agent preferably has a functional group capable of reacting with the epoxy group of the epoxy compound.
  • novolak-type cyanate ester resin novolak-type cyanate ester resin, bisphenol-type cyanate ester resin, the prepolymer by which these were partially trimerized, etc.
  • the novolac type cyanate ester resin include phenol novolac type cyanate ester resin and alkylphenol type cyanate ester resin.
  • bisphenol type cyanate ester resin bisphenol A type cyanate ester resin, bisphenol E type cyanate ester resin, tetramethyl bisphenol F type cyanate ester resin, etc. are mentioned.
  • cyanate ester compounds include phenol novolac type cyanate ester resins ("PT-30” and “PT-60” manufactured by Lonza Japan Co., Ltd.), and prepolymers in which bisphenol type cyanate ester resins are trimerized (Lonza Japan Company-made “BA-230S”, “BA-3000S”, “BTP-1000S” and “BTP-6020S” etc. are mentioned.
  • phenol compound examples include novolac type phenol, biphenol type phenol, naphthalene type phenol, dicyclopentadiene type phenol, aralkyl type phenol and dicyclopentadiene type phenol.
  • novolac type phenol (“TD-2091” manufactured by DIC Corporation), biphenyl novolac type phenol (“MEH-7851” manufactured by Meiwa Kasei Co., Ltd.), aralkyl type phenol compound (“MEH manufactured by Meiwa Chemical Co., Ltd.”
  • phenol having an aminotriazine skeleton (“LA1356” and “LA3018-50P” manufactured by DIC Corporation).
  • the curing agent preferably contains an active ester compound.
  • the active ester compound refers to a compound having at least one ester bond in the structure and having an aromatic ring bonded to both sides of the ester bond.
  • the compound represented by following formula (1) as a preferable example of an active ester compound is mentioned.
  • X1 and X2 each represent a group containing an aromatic ring.
  • the group containing the said aromatic ring the benzene ring which may have a substituent, the naphthalene ring which may have a substituent, etc. are mentioned.
  • a hydrocarbon group is mentioned as said substituent.
  • the carbon number of the hydrocarbon group is preferably 12 or less, more preferably 6 or less, and still more preferably 4 or less.
  • the combination of X 1 and X 2 is a combination of a benzene ring which may have a substituent and a benzene ring which may have a substituent, and which has a substituent
  • a combination of a benzene ring which may be substituted with a naphthalene ring which may have a substituent is also included.
  • the combination of X 1 and X 2 includes a combination of a naphthalene ring which may have a substituent and a naphthalene ring which may have a substituent.
  • the said active ester compound is not specifically limited.
  • Examples of commercially available products of the above active ester compounds include "HPC-8000-65T”, “EXB9416-70BK”, “EXB8100-65T” and “EXB-8000L-65MT” manufactured by DIC Corporation.
  • curing agent is 1000 or less. In this case, when the resin film is laminated on the substrate, the inorganic filler can be uniformly present.
  • the content of the total of the thermosetting compound and the curing agent and the total content of the epoxy compound and the curing agent are preferably 100% by weight of the component excluding the inorganic filler in the resin film. Is 75% by weight or more, more preferably 80% by weight or more, preferably 99% by weight or less, and more preferably 97% by weight or less.
  • a still better cured product is obtained when the total content of the thermosetting compound and the curing agent and the total content of the epoxy compound and the curing agent are the lower limit or more and the upper limit or less. Since the melt viscosity can be adjusted, the dispersibility of the inorganic filler is improved. Furthermore, in the curing process, the resin film can be prevented from wetting and spreading in an unintended region.
  • the dimensional change of the cured product due to heat can be further suppressed.
  • the total content of the thermosetting compound and the curing agent and the total content of the epoxy compound and the curing agent are at least the lower limit, the melt viscosity does not become too low, and the curing process Therefore, the insulating film tends to be difficult to spread excessively in the unintended region.
  • the total content of the thermosetting compound and the curing agent and the total content of the epoxy compound and the curing agent are less than or equal to the upper limit, it is easy to bury the circuit board in holes or asperities.
  • the inorganic filler tends to be difficult to be present unevenly.
  • the content of the curing agent is preferably 30% by weight or more, more preferably 40% by weight or more, and preferably 70% by weight or less in 100% by weight of the components excluding the inorganic filler in the resin film. Preferably it is 60 weight% or less.
  • the content of the curing agent is at least the lower limit and the upper limit, a more favorable cured product is obtained, and the dielectric loss tangent is effectively reduced.
  • the resin film preferably contains a thermoplastic resin.
  • the thermoplastic resin include polyvinyl acetal resin and phenoxy resin. Only one type of the thermoplastic resin may be used, or two or more types may be used in combination.
  • the thermoplastic resin is preferably a phenoxy resin from the viewpoint of effectively reducing the dielectric loss tangent and effectively improving the adhesion of the metal wiring regardless of the curing environment.
  • the use of the phenoxy resin suppresses the deterioration of the embeddability of the resin film to the holes or irregularities of the circuit board and the nonuniformity of the inorganic filler.
  • the use of a phenoxy resin makes it possible to adjust the melt viscosity, so that the dispersibility of the inorganic filler is improved, and the resin film hardly wets and spreads in an unintended region in the curing process.
  • the phenoxy resin is not particularly limited. A conventionally known phenoxy resin can be used as the phenoxy resin.
  • the phenoxy resin may be used alone or in combination of two or more.
  • phenoxy resin examples include a bisphenol A type skeleton, a bisphenol F type skeleton, a bisphenol S type skeleton, a biphenyl skeleton, a novolak skeleton, a naphthalene skeleton, and a phenoxy skeleton having a skeleton such as an imide skeleton.
  • Examples of commercial products of the phenoxy resin include “YP50”, “YP55” and “YP70” manufactured by Nippon Steel Sumikin Chemical Co., Ltd., and “1256B40”, “4250”, “4256H40”, “4275” manufactured by Mitsubishi Chemical Corporation. And “YX6954BH30” and “YX8100BH30”.
  • the weight average molecular weight of the thermoplastic resin is preferably 5000 or more, more preferably 10000 or more, preferably 100000 or less, more preferably 50000 or less.
  • the said weight average molecular weight of the said thermoplastic resin shows the weight average molecular weight in polystyrene conversion measured by gel permeation chromatography (GPC).
  • the content of the thermoplastic resin and the phenoxy resin is not particularly limited.
  • the content of the thermoplastic resin (the content of the phenoxy resin when the thermoplastic resin is a phenoxy resin) is preferably 1% by weight or more in 100% by weight of the component excluding the inorganic filler in the resin film. More preferably, it is 5% by weight or more, preferably 30% by weight or less, and more preferably 15% by weight or less.
  • the content of the thermoplastic resin is not less than the lower limit and not more than the upper limit, the embedding property of the resin film to the holes or the unevenness of the circuit board is improved.
  • thermoplastic resin When the content of the thermoplastic resin is equal to or more than the above lower limit, the formation of the resin film is further facilitated, and a better insulating layer can be obtained.
  • the thermal expansion coefficient of an insulating layer becomes it still lower that content of the said thermoplastic resin is below the said upper limit.
  • the surface roughness of the surface of the cured product is further reduced, and the adhesion strength between the insulating layer and the metal layer is further enhanced.
  • the resin film preferably contains a curing accelerator.
  • the use of the above curing accelerator makes the curing speed faster. By rapidly curing the resin film, the crosslinked structure in the cured product becomes uniform, and the number of unreacted functional groups is reduced, resulting in an increase in the crosslinking density.
  • the curing accelerator is not particularly limited, and conventionally known curing accelerators can be used.
  • the said hardening accelerator may be used only by 1 type, and 2 or more types may be used together.
  • an imidazole compound As said hardening accelerator, an imidazole compound, a phosphorus compound, an amine compound, an organic metal compound etc. are mentioned, for example.
  • Examples of the phosphorus compounds include triphenylphosphine and the like.
  • Examples of the amine compound include diethylamine, triethylamine, diethylenetetramine, triethylenetetramine and 4,4-dimethylaminopyridine.
  • organic metal compounds examples include zinc naphthenate, cobalt naphthenate, tin octylate, cobalt octylate, bis (acetylacetonato) cobalt (II), and tris (acetylacetonato) cobalt (III).
  • the content of the curing accelerator is not particularly limited.
  • the content of the curing accelerator is preferably 0.005% by weight or more, more preferably 0.01% by weight or more, preferably 5% by weight or less, in 100% by weight of the components excluding the inorganic filler in the resin film. More preferably, it is 3% by weight or less.
  • the resin film does not contain or contains a solvent. Moreover, the said solvent may be used in order to obtain the slurry containing the said inorganic filler.
  • the solvent may be used alone or in combination of two or more.
  • solvents acetone, methanol, ethanol, butanol, 2-propanol, 2-methoxyethanol, 2-ethoxyethanol, 1-methoxy-2-propanol, 2-acetoxy-1-methoxypropane, toluene, xylene, methyl ethyl ketone
  • examples include N, N-dimethylformamide, methyl isobutyl ketone, N-methyl-pyrrolidone, n-hexane, cyclohexane, cyclohexanone and naphtha as a mixture.
  • the solvents are removed when the resin film is molded using a resin composition.
  • a solvent may remain in the resin film.
  • the residual amount of this solvent is preferably small. Therefore, the boiling point of the solvent is preferably 200 ° C. or less, more preferably 180 ° C. or less.
  • the content of the solvent in the resin film is not particularly limited. The content of the solvent can be appropriately changed to such an extent that the layer shape of the resin film can be maintained.
  • the above resin film contains a leveling agent, a flame retardant, a coupling agent, a coloring agent, an antioxidant, an anti-oxidant, an anti-UV deterioration agent, and a light-off
  • a foaming agent, a thickener, a thixotropic agent, and other thermosetting resins other than the above-mentioned thermosetting compound may be added.
  • silane coupling agent a silane coupling agent, a titanium coupling agent, an aluminum coupling agent etc. are mentioned.
  • silane coupling agent examples include vinylsilane, aminosilane, imidazolesilane and epoxysilane.
  • thermosetting resin examples include polyphenylene ether resin, divinyl benzyl ether resin, polyarylate resin, diallyl phthalate resin, polyimide resin, benzoxazine resin, benzoxazole resin, bismaleimide resin, acrylate resin and the like.
  • the above-mentioned resin film for example, after extruding the resin film material using an extruder, after extruding, an extrusion molding method of forming into a film by T die or circular die etc., resin containing solvent
  • the method include a casting method in which a film material is cast and formed into a film, and other film forming methods conventionally known.
  • a resin film material may be laminated on a base material and dried by heating to obtain a resin film.
  • the extrusion molding method or the casting molding method is preferable because it can cope with thinning.
  • the film includes a sheet.
  • a resin film which is a B-stage film can be obtained by molding a resin film material into a film and heating and drying the film at, for example, 50 ° C. to 150 ° C. for 1 minute to 10 minutes so that curing by heat does not proceed too much. it can.
  • the film-like resin film obtainable by the above-described drying step is referred to as a B-stage film.
  • the B-stage film is in a semi-cured state.
  • the semi-cured product is not completely cured, and curing can be further advanced.
  • the resin film is preferably a B-stage film.
  • the thickness of the resin film is preferably 5 ⁇ m.
  • the thickness is more preferably 10 ⁇ m or more, preferably 200 ⁇ m or less, and more preferably 100 ⁇ m or less.
  • a base material may be laminated on the first surface of the resin film, and a protective film may be laminated on the second surface opposite to the first surface of the resin film.
  • a base material is laminated on the first surface of the resin film, and the second opposite to the first surface of the resin film. It is preferable that a protective film is laminated on the surface of.
  • the substrate examples include metal foil, polyester resin film substrate such as polyethylene terephthalate film and polybutylene terephthalate film, olefin resin film substrate such as polyethylene film and polypropylene film, and polyimide film substrate.
  • the surface of the substrate may be subjected to release treatment, if necessary.
  • the substrate may be a metal foil or a resin film substrate. It is preferable that the said base material is a resin film base material. When using metal foil as said base material, it is preferable that the said metal foil is copper foil.
  • the thickness of the substrate is preferably 5 ⁇ m or more, more preferably 10 ⁇ m or more, preferably 75 ⁇ m or less, from the viewpoint of improving the operability of the resin film and the laminating property of the resin film. 60 ⁇ m or less.
  • Examples of the material of the protective film include polyolefins such as polypropylene and polyethylene, and polyethylene terephthalate.
  • the material of the protective film is preferably a polyolefin, more preferably polypropylene.
  • the thickness of the protective film is preferably 5 ⁇ m or more, more preferably 10 ⁇ m or more, preferably 75 ⁇ m or less, more preferably 60 ⁇ m or less.
  • the substrate or the protective film when the substrate and the protective film are laminated on the resin film, the substrate or the protective film is in contact with the outer peripheral surface of the winding core, and the substrate or the protection A film is in contact with the packaging film or the buffer film.
  • the packaging film is wound on the outer peripheral surface of the roll body of the resin film.
  • the packaging film extends on the side surface of the roll body of the resin film. If the packaging film does not reach the side surface of the roll of resin film, the resin film is likely to be cracked or broken at the side surface. In the case where the packaging film does not reach the side surface of the roll of resin film, the cause of the occurrence of cracks or cracks in the resin film is not clear on the side, but the solvent remaining in the resin film is the roll of resin film. By volatilizing from the side, it is considered that the bending resistance and the impact resistance of the resin film are reduced.
  • the packaging film is folded.
  • the packaging film is preferably wound in one or more turns on the surface of the roll of the resin film, and is wound in two or more turns. More preferable.
  • the material of the packaging film is not particularly limited, and examples thereof include polyethylene, polypropylene, and polyvinylidene chloride.
  • the thickness of the packaging film is preferably 5 ⁇ m or more, more preferably 10 ⁇ m or more, preferably 50 ⁇ m or less, and more preferably 45 ⁇ m or less.
  • the shock absorbing material is arrange
  • the buffer material By disposing the buffer material on the outer peripheral surface of the end portion of the winding core, it is possible to favorably suppress the winding displacement of the resin film.
  • the shock absorbing material By arranging the shock absorbing material on the outer peripheral surface of the end of the winding core, the impact resistance of the roll package can be enhanced, and breakage of the winding core (in particular, the end of the winding core) can be prevented. .
  • the material of the cushioning material is preferably expanded polystyrene, polyurethane foam, polyethylene foam, or polypropylene foam.
  • the packaging film is folded in the opening of the winding core, on the outer peripheral surface of the end of the winding core. It is preferable that a shock absorbing material be disposed via the packaging film. In this case, the winding displacement of the resin film can be suppressed more favorably.
  • the cushioning material is arranged to cover the entire outer peripheral surface of the end of the winding core.
  • the cushioning material is arranged to cover the entire outer peripheral surface of the end of the winding core.
  • the roll package according to the present invention preferably includes a holding member.
  • the holding member is a member for holding the winding core, the resin film, and the packaging film in a suspended manner.
  • the roll package according to the present invention includes the holding member, the winding core, the resin film, the packaging film, and the cushioning material may be suspended in a suspended manner, and the winding excluding the cushioning material is performed.
  • the core, the resin film and the packaging film may be suspended in a suspended manner.
  • a roll package provided with a holding member
  • a packing material such as a cardboard box
  • the winding core, the resin film, and the packing film do not contact the packing material, so the impact is caused during transportation.
  • the occurrence of cracks or breakage of the resin film can be more effectively prevented.
  • the holding member be attached to both sides in the axial direction of the winding core.
  • the holding member When the winding core has an opening on both sides in the axial direction, the holding member has a holding member main body and an insertion portion, and the insertion portion of the holding member is in the opening of the winding core. Preferably it is inserted.
  • the tip of the insertion portion of the holding member inserted in the inner side be positioned inside the end of the resin film.
  • the holding member preferably has a certain degree of strength.
  • the material of the holding member include polypropylene (PP) resin, acrylonitrile butadiene styrene (ABS) resin, and polyethylene (PE) resin.
  • the shape of the holding member is not particularly limited, but is preferably a rectangular solid from the viewpoint of holding the winding core, the resin film, and the packaging film in a suspended manner.
  • the shape of the insertion portion can be changed according to the shape of the opening of the end of the winding core.
  • the outer shape of the holding member is preferably a polygon such as a square.
  • buffer film In the roll package according to the present invention, it is preferable that a buffer film be disposed between the roll of the resin film and the packaging film.
  • the buffer film By providing the buffer film, it is possible to further prevent the occurrence of a crack or a crack of the resin film due to an external impact. Moreover, when a roll package body is stored at low temperature (for example, 5 degrees C or less), generation
  • the material of the said buffer film is a polyethylene foam etc.
  • a polyethylene foam etc. are mentioned, for example. It is preferable that the material of the said buffer film is a polyethylene foam.
  • winding core packaging film, buffer material, holding member, buffer film, base material, and protective film were prepared.
  • Winding core The winding core A and the winding core B of the shape shown in FIG. 1 were prepared. The details of the winding core A and the winding core B are as follows.
  • Winding core A Material: Acrylonitrile Butadiene Styrene (ABS) Resin Axial dimension of winding core: 56 cm Winding core thickness: 0.4 cm Inner diameter of winding core: 7.6 cm
  • Winding core B Material: Acrylonitrile Butadiene Styrene (ABS) resin Core dimension of the winding core: 51 cm Winding core thickness: 0.4 cm Inner diameter of winding core: 7.6 cm
  • Packaging film A (“Stretch film” manufactured by Sanyo Chemical Co., Ltd., 15 ⁇ m thick)
  • Packaging film B Silicon Wrap (registered trademark)” manufactured by Asahi Kasei Corp., thickness 11 ⁇ m
  • Plastic holding member having the shape shown in FIG. 1
  • Buffer film Buffer film (Lightlon S” manufactured by Sekisui Plastics Co., Ltd.)
  • Example 1 Preparation of resin film material: 107 parts by weight of a cyclohexanone slurry (solid content: 70% by weight) of aminophenylsilane-treated silica ("SOC 2" manufactured by Admatex Co., Ltd.) was prepared. To this slurry, 11 parts by weight of a biphenyl type epoxy compound ("NC 3000H” manufactured by Nippon Kayaku Co., Ltd.), 5 parts by weight of a bisphenol A type epoxy compound ("850S” manufactured by DIC), 7.9 parts by weight of cyclohexanone, and methyl ethyl ketone 7.7 parts by weight were added.
  • a biphenyl type epoxy compound (“NC 3000H” manufactured by Nippon Kayaku Co., Ltd.)
  • a bisphenol A type epoxy compound (“850S” manufactured by DIC)
  • a methyl ethyl ketone and cyclohexanone mixed solution (solid content: 30% by weight) of bisphenol acetophenone skeleton phenoxy resin ("YX6954" manufactured by Mitsubishi Chemical Corporation) was prepared.
  • 2.5 parts by weight of the mixed solution (solid content 30% by weight), 0.1 parts by weight of 2-ethyl-4-methylimidazole (“2E4MZ” manufactured by Shikoku Kasei Kogyo Co., Ltd.), and a leveling agent (manufactured by Kushimoto Kasei Co., Ltd.) LS-480 ′ ′) 0.01 parts by weight was further added.
  • the mixture was stirred at 1200 rpm for 30 minutes to obtain a resin film material (varnish).
  • Preparation of laminated film of base material, resin film and protective film The resulting resin film material was coated on a substrate using a die coater, and then dried at an average temperature of 100 ° C. for 3 minutes to evaporate the solvent. Thus, a resin film (B-stage film) having a thickness of 40 ⁇ m and a residual amount of solvent of 1.0% by weight or more and 3.0% by weight or less was formed on the substrate.
  • a protective film was thermally laminated at a temperature of 50 ° C. on the surface opposite to the substrate side of the resin film to obtain a laminated film in which the resin film is a B-stage film.
  • Preparation of roll packaging The obtained laminated film was slit so that the dimension in the width direction was 51 cm.
  • the laminated film was wound 100 m in a roll on the outer peripheral surface of the winding core A in a region excluding the outer peripheral surface of the end portion of the winding core A to prepare a roll body of a resin film (laminated film).
  • the buffer film is wound one turn on the outer peripheral surface of the roll body of the obtained resin film (laminated film), the packaging film A is wound two turns on the outside, and the packaging film A is folded in the opening of the winding core A It is.
  • a shock absorbing material was disposed on the outer peripheral surface of the end portion of the winding core A so as to completely cover the outer peripheral surface of the end portion of the winding core A via the packaging film A.
  • the insertion portion of the holding member is inserted into the opening of the winding core A so that the tip of the insertion portion of the holding member is located inside the end of the resin film in the axial direction of the winding core A
  • the holding members were attached to both sides in the axial direction of the winding core A to obtain a roll package.
  • Example 2 A roll package was obtained in the same manner as in Example 1 except that no cushioning material was placed at the time of preparation of the roll package.
  • Example 3 The holding member is arranged such that the buffer film is not disposed at the time of preparation of the roll package, and the tip of the insertion portion of the holding member is located outside the end of the resin film in the axial direction of the winding core A A roll package was obtained in the same manner as in Example 1 except that the insertion portion of (1) was inserted into the opening of the winding core.
  • Preparation of roll packaging The obtained laminated film was slit so that the dimension in the width direction was 51 cm.
  • the laminated film was wound 100 m in a roll on the outer peripheral surface of the winding core A in a region excluding the outer peripheral surface of the end portion of the winding core A to prepare a roll body of a resin film (laminated film).
  • the wrapping film B was wound twice around the outside of the roll body of the obtained resin film (laminated film) so that the wrapping film B did not reach on the side surface of the roll body.
  • the insertion portion of the holding member is inserted into the opening of the winding core A so that the tip of the insertion portion of the holding member is located outside the end of the resin film in the axial direction of the winding core A
  • the holding members were attached to both sides in the axial direction of the winding core A to obtain a roll package.
  • the roll package is placed on the mounting surface in the cardboard box, the winding core A, the resin film, and the packaging film B are held in a suspended manner.
  • Preparation of roll packaging The obtained laminated film was slit so that the dimension in the width direction was 51 cm. This laminated film was wound on the outer peripheral surface of the winding core B in the form of a roll of 100 m of the laminated film thus obtained, to form a roll body of a resin film (laminated film).
  • the widthwise dimension of the resin film (laminated film) and the axial dimension of the winding core B have the same length, so in Comparative Example 2, the resin film (laminated film) on the entire outer peripheral surface of the winding core Is wound.
  • the wrapping film B was wound twice around the outside of the roll body of the obtained resin film (laminated film) so that the wrapping film B did not reach on the side surface of the roll body.
  • the insertion portion of the holding member is inserted into the opening of the winding core B so that the tip of the insertion portion of the holding member is positioned inside the end of the resin film in the axial direction of the winding core B
  • the holding members were attached to both sides of the winding core B in the axial direction to obtain a roll package.
  • the roll package is placed on the mounting surface in the cardboard box, the winding core B, the resin film, and the packaging film B are held in a suspended manner.
  • Example 3 In the same manner as in Example 1, a laminated film was obtained. The obtained laminated film was slit so that the dimension in the width direction was 51 cm. This laminated film was wound on the outer peripheral surface of the winding core B in the form of a roll of 100 m of the laminated film thus obtained, to form a roll body of a resin film (laminated film). The widthwise dimension of the resin film (laminated film) and the axial dimension of the winding core B have the same length, so in Comparative Example 3, the resin film (laminated film) on the entire outer peripheral surface of the winding core Is wound.
  • the packaging film A was wound twice, and the packaging film A was folded into the opening of the winding core B. Then, the insertion portion of the holding member is inserted into the opening of the winding core so that the tip of the insertion portion of the holding member is positioned inside the end of the resin film in the axial direction of the winding core B Holding members were attached to both sides of the winding core in the axial direction to obtain a roll package.
  • the roll package was placed on the mounting surface in the cardboard box, the winding core B, the resin film, and the packaging film A were suspended in a suspended manner.
  • a 100 mm long ⁇ 100 mm wide laminated board was prepared in which a copper foil having a thickness of 25 ⁇ m was laminated on a glass epoxy substrate having a thickness of 400 ⁇ m.
  • the copper foil was etched, and circular recesses with a diameter of 100 ⁇ m and a depth of 25 ⁇ m were provided in total of 30 in the longitudinal direction and 30 in the lateral direction in a total area of 30 mm ⁇ 30 mm.
  • the distance between the centers of adjacent circles is 900 ⁇ m.
  • the evaluation substrate was obtained.
  • Judgment criteria of void no void was observed in the recess (the percentage of the recess in which the void was observed is 0%) :: The percentage of recesses in which voids are observed is more than 0% and less than 5%. ⁇ : the percentage of recesses in which voids are detected is 5% or more.
  • the roll packages obtained in Examples 1 to 3 and Comparative Example 1 were packaged in a cardboard box of inner dimensions 59 cm ⁇ 17 cm ⁇ 17 cm.
  • the roll package obtained in Comparative Examples 2 and 3 was packed in a cardboard box with an inner size of 54.5 cm ⁇ 17 cm ⁇ 17 cm.
  • the roll package packed in a cardboard box was stored in a refrigerator at a temperature of 5 ° C. or less for one week. After storage, the corrugated box packed with the roll package was dropped from a height of 1 m from the ground. After dropping, the roll packaged body was visually observed to evaluate the winding deviation of the resin film.
  • Table 1 The composition of the roll package and the results are shown in Table 1 below.
  • Table 1 in the column of the presence or absence of the arrangement of the buffer film, the buffer agent and the holding member, "o” is described when arranged, and "x” is described when not arranged.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Packaging Of Machine Parts And Wound Products (AREA)
  • Packages (AREA)
  • Storage Of Web-Like Or Filamentary Materials (AREA)
  • Buffer Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
PCT/JP2018/040272 2017-11-02 2018-10-30 ロール包装体 WO2019088078A1 (ja)

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JP2002308343A (ja) * 2001-04-09 2002-10-23 Kuraray Co Ltd 包装用材料及びフィルム巻取体
JP2017066399A (ja) * 2015-09-30 2017-04-06 積水化学工業株式会社 樹脂組成物、積層体及び積層構造体の製造方法

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TWI762368B (zh) * 2020-07-03 2022-04-21 南韓商Ｓｋ納力世有限公司 用於容置銅箔的設備

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