WO2019082698A1 - Composition de résine thermodurcissable, préimprégné, stratifié à revêtement métallique, carte de circuit imprimé, film à base de résine, et feuille métallique comprenant de la résine - Google Patents

Composition de résine thermodurcissable, préimprégné, stratifié à revêtement métallique, carte de circuit imprimé, film à base de résine, et feuille métallique comprenant de la résine

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Publication number
WO2019082698A1
WO2019082698A1 PCT/JP2018/038155 JP2018038155W WO2019082698A1 WO 2019082698 A1 WO2019082698 A1 WO 2019082698A1 JP 2018038155 W JP2018038155 W JP 2018038155W WO 2019082698 A1 WO2019082698 A1 WO 2019082698A1
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WO
WIPO (PCT)
Prior art keywords
thermosetting resin
resin composition
resin
cured product
insulating layer
Prior art date
Application number
PCT/JP2018/038155
Other languages
English (en)
Japanese (ja)
Inventor
龍史 高橋
心平 小畑
泰則 安部
智 六車
Original Assignee
パナソニックＩｐマネジメント株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パナソニックＩｐマネジメント株式会社 filed Critical パナソニックＩｐマネジメント株式会社
Priority to CN201880067404.9A priority Critical patent/CN111212877A/zh
Priority to JP2019551002A priority patent/JP7289103B2/ja
Priority to US16/757,677 priority patent/US11414528B2/en
Publication of WO2019082698A1 publication Critical patent/WO2019082698A1/fr

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    • C08J2361/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2433/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
    • C08J2433/04—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2451/00—Characterised by the use of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2207/00—Properties characterising the ingredient of the composition
    • C08L2207/53—Core-shell polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

Definitions

  • the present disclosure relates generally to thermosetting resin compositions, prepregs, metal-clad laminates and printed wiring boards.
  • the present disclosure relates to a thermosetting resin composition containing a thermosetting resin and an inorganic filler, a prepreg provided with a semi-cured product of the thermosetting resin composition, and a metal-clad provided with a cured product of the prepreg.
  • the present invention relates to a laminated board and a printed wiring board.
  • Patent Document 1 discloses a cured product obtained by curing an epoxy resin composition.
  • the epoxy resin composition contains, as essential components, an epoxy resin and a predetermined polyhydroxy resin curing agent.
  • the content of naphthols in the polyhydroxy resin is 0.8% by weight or less, and the Gardner color number of the 10% by weight methyl ethyl ketone solution of the polyhydroxy resin is 13 or less.
  • a liquid photosensitive resist is applied to both sides of a substrate such as a printed wiring board or a film-like photosensitive resist (dry film) is adhered, and then double-sided exposure is performed to obtain a desired pattern on each side. It is practiced to form a cured film having
  • An object of the present disclosure is to provide a thermosetting resin composition, a prepreg, a metal-clad laminate, a printed wiring board, a film with resin, and a metal foil with resin that can obtain a cured product having high ultraviolet shielding properties. .
  • thermosetting resin composition is a thermosetting resin composition containing a thermosetting resin and an inorganic filler.
  • the thermosetting resin contains a curing agent.
  • curing agent is 15 or more.
  • the content of the curing agent is 10% by mass or more based on the total solid content of the thermosetting resin composition.
  • a prepreg according to an aspect of the present disclosure includes a substrate, and a semi-cured product of the thermosetting resin composition impregnated in the substrate.
  • the metal-clad laminate according to an aspect of the present disclosure includes an insulating layer formed of a cured product of the prepreg, and a metal layer formed on one side or both sides of the insulating layer.
  • a printed wiring board includes an insulating layer formed of a cured product of the prepreg, and a conductor wiring formed on one side or both sides of the insulating layer.
  • FIG. 1 is a schematic cross-sectional view of a prepreg according to an embodiment of the present disclosure.
  • FIG. 2 is a schematic cross-sectional view of a metal-clad laminate according to an embodiment of the present disclosure.
  • FIG. 3 is a schematic cross-sectional view of a printed wiring board according to an embodiment of the present disclosure.
  • FIG. 4A to FIG. 4D are schematic cross-sectional views showing each step of the method for manufacturing the printed wiring board of the same.
  • 5A to 5C are schematic cross sectional views showing each step of a method of manufacturing a coated printed wiring board.
  • FIG. 6A is a schematic cross-sectional view of a film with resin according to an embodiment of the present disclosure.
  • FIG. 6B is a schematic cross-sectional view showing another example of the resin-coated film according to the embodiment of the present disclosure.
  • FIG. 7 is a schematic cross-sectional view of a resin-attached metal foil according to an embodiment of the present disclosure.
  • thermosetting resin composition contains a thermosetting resin and an inorganic filler.
  • the thermosetting resin contains a curing agent.
  • curing agent is 15 or more.
  • the content of the curing agent is 10% by mass or more with respect to the total solid content of the thermosetting resin composition.
  • the curing agent easily absorbs ultraviolet rays, and such a curing agent is contained in the thermosetting resin composition in a predetermined amount to obtain a cured product having high ultraviolet shielding properties. it can.
  • thermosetting resin composition contains a thermosetting resin and an inorganic filler.
  • a thermosetting resin and an inorganic filler are essential components.
  • the thermosetting resin composition may further contain optional components other than the essential components as long as the effects of the essential components are not impaired.
  • each ingredient of an essential ingredient and an arbitrary ingredient is explained.
  • Thermosetting resin is a low molecular weight compound (for example, prepolymer or oligomer) having a reactive group.
  • a crosslinking reaction (curing reaction) proceeds to form an insoluble and infusible substance (cured product) having a three-dimensional structure.
  • thermosetting resin epoxy resin, bismaleimide resin, phenol resin and cyanate resin can be mentioned.
  • epoxy resin examples include triphenylmethane type epoxy resin, biphenylaralkyl type epoxy resin, naphthalene type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, and dicyclopentadiene-containing phenol novolac type epoxy resin Be
  • the epoxy equivalent is preferably in the range of 158 g / eq or more and 275 g / eq or less, more preferably in the range of 158 g / eq or more and 235 g / eq or less.
  • Tg glass transition temperature
  • Bismaleimide resins can give cured products having higher heat resistance than epoxy resins.
  • the thermosetting resin contains a curing agent.
  • the Gardner color number of the 3% by mass methyl ethyl ketone solution of the curing agent is 15 or more.
  • the Gardner color number can be determined by the Gardner color number test method.
  • the Gardner color number definition and the Gardner color number test method conform to JIS K 0071-2.
  • the Gardner color number is a color number determined by comparing the transmitted colors of the Gardner color number standard solution and the sample.
  • Gardner color number standard solutions are prepared using potassium hexachloroplatinate (IV), iron (III) chloride, cobalt (II) chloride and hydrochloric acid.
  • the Gardner color number is represented by a color number in the range of 1-18.
  • the color of the sample is represented by a single integer. Exceptionally, if the color of the sample lies between two Gardner color standard solutions, then the Gardner color number closest to the sample is determined and it is expressed as "bright” or "dark” than that color number .
  • standard color glasses having the same transmission color may be used.
  • the above sample is a 3% by weight methyl ethyl ketone solution of a curing agent. That is, this sample is prepared by dissolving the curing agent in methyl ethyl ketone as the solvent so that the concentration of the curing agent as the solute is 3% by mass.
  • the hardening agent which makes the Gardner color number of a 3 mass% methyl ethyl ketone solution 15 or more may be called a 1st hardening agent.
  • a curing agent other than the first curing agent may be referred to as a second curing agent. That is, the Gardner color number of the 3% by mass methyl ethyl ketone solution of the second curing agent is in the range of 1 or more and 14 or less. Unless otherwise noted, the Gardner color number means the Gardner color number of a 3% by weight methyl ethyl ketone solution.
  • the first curing agent has a Gardner color number of 15 or more (the upper limit is 18), high UV shielding properties can be imparted to the cured product when it is contained in the thermosetting resin composition. That is, the first curing agent crosslinks to form a cured product, but the portion derived from the first curing agent in the cured product can absorb ultraviolet light.
  • the second curing agent may not impart as high ultraviolet shielding properties to the cured product as the first curing agent, but may be used in combination with the first curing agent.
  • the content of the first curing agent is 10% by mass or more with respect to the total solid content of the thermosetting resin composition.
  • a cured product having a high ultraviolet shielding property can be obtained.
  • an insulating layer is formed of such a cured product, when ultraviolet light is irradiated to one surface of the insulating layer, the ultraviolet light is absorbed inside the insulating layer and shielded, and transmitted from the other surface. Is suppressed.
  • Ultraviolet light is ultraviolet light in a wavelength range sufficient to sensitize a photosensitive resist.
  • the wavelength of ultraviolet light is in the range of 350 nm to 450 nm.
  • the ultraviolet shielding property of the cured product is lowered.
  • the insulating layer is formed of such a cured product, some ultraviolet rays may be absorbed inside the insulating layer when ultraviolet rays are irradiated to one surface of the insulating layer, but the remaining ultraviolet rays are the other. It can penetrate from the surface.
  • the first curing agent that easily absorbs ultraviolet light as compared to the second curing agent is contained in the thermosetting resin composition at a content of 10% by mass or more, so that curing with high ultraviolet shielding properties is achieved. You can get things.
  • the first curing agent examples include naphthalene type phenol resins and novolac type phenol resins.
  • the naphthalene type phenol resin contains at least one naphthalene ring and at least one benzene ring in one molecule.
  • the naphthalene rings, the benzene rings, and the naphthalene ring and the benzene ring are linked, for example, by a divalent organic group (such as a methylene group (—CH 2 —) or the like).
  • a divalent organic group such as a methylene group (—CH 2 —) or the like.
  • each of the naphthalene rings has at least one hydroxy group (—OH), and each of the benzene rings has at least one hydroxy group (phenolic hydroxy group).
  • the naphthalene type phenol resin contains at least one naphthol skeleton and at least one phenol skeleton in one molecule.
  • the naphthol skeleton is represented, for example, by the following formula (A) or the following formula (C).
  • the naphthol skeleton is a skeleton in which one or more hydrogens in a naphthalene ring are substituted with a hydroxy group.
  • the phenol skeleton is represented, for example, by the following formula (B).
  • the phenol skeleton is a skeleton in which one or more hydrogens in a benzene ring are substituted with a hydroxy group.
  • R1, R3 and R5 are a hydrogen atom (H), methyl group (-CH 3), a methoxy group (-OCH 3) or a hydroxy group
  • R1, R3 And / or R5 is a hydroxy group
  • each of R2 and R4 is a hydrogen atom, a methyl group or a hydroxy group
  • at least one of R2 and R4 is a hydroxy group. Note that one line segment in the formula (A) and two line segments in the formula (B) and the formula (C) represent a bond with another structural part.
  • the conjugated system becomes larger than the novolak type phenol resin containing a benzene ring. Therefore, the absorption peak wavelength of the naphthalene type phenol resin is located on the longer wavelength side than the absorption peak wavelength of the novolak type phenol resin. That is, the naphthalene type phenol resin absorbs ultraviolet rays more easily than the novolak type phenol resin. Therefore, the first curing agent preferably contains a naphthalene type phenolic resin.
  • the Tg of the cured product can be increased. Therefore, the heat resistance and the flame resistance of the cured product can be improved. Furthermore, the hygroscopicity and coefficient of thermal expansion of the cured product can also be reduced.
  • the naphthalene type phenol resin is represented by the following formula (D).
  • This naphthalene type phenol resin contains the naphthol skeleton represented by Formula (A) and Formula (C), and the phenol skeleton represented by Formula (B).
  • each of R1, R3 and R5 is a hydrogen atom, a methyl group, a methoxy group or a hydroxy group, and at least one of R1, R3 and R5 is a hydroxy group.
  • each of R2 and R4 is a hydrogen atom, a methyl group or a hydroxy group, and at least one of R2 and R4 is a hydroxy group.
  • n is an integer of 1 to 3 and m is an integer of 0 to 3.
  • the arrangement order of the phenol skeleton represented by the formula (B) and the naphthol skeleton represented by the formula (C) is not particularly limited. That is, in the naphthalene type phenol resin represented by the formula (D), the phenol skeletons represented by the formula (B) may or may not be continuous, and are represented by the formula (C) The naphthol skeletons may or may not be continuous with each other.
  • the naphthalene type phenol resin represented by the formula (D) has one naphthol skeleton represented by the formula (A), n phenol skeletons represented by the formula (B), and It is sufficient to have m naphthol skeletons to be represented.
  • the naphthalene type phenol resin is represented by the following formula (E).
  • This naphthalene type phenol resin is a specific example of the naphthalene type phenol resin represented by Formula (D).
  • R1 is a hydrogen atom, a methyl group or a methoxy group.
  • R2 is a hydrogen atom or a methyl group.
  • n is an integer of 1 to 3 and m is an integer of 0 to 3.
  • the naphthalene type phenolic resin is preferably oxidized.
  • the hydroxy group which the naphthalene ring contained in a naphthalene type phenol resin has is oxidized.
  • an oxidized naphthalene type phenolic resin has a naphthoquinone skeleton.
  • the naphthoquinone skeleton includes, for example, a 1,4-naphthoquinone skeleton represented by the following formula (F) and a 1,2-naphthoquinone skeleton represented by the following formula (G).
  • each of R 6 and R 7 is a hydrogen atom, a methyl group, an ethyl group (—CH 2 CH 3 ) or a methoxy group.
  • the two line segments in the formula (F) and the formula (G) represent a bond with another structural part.
  • the oxidized naphthalene type phenol resin has a skeleton of at least one of a 1,4-naphthoquinone skeleton represented by the formula (F) and a 1,2-naphthoquinone skeleton represented by the formula (G) including.
  • the naphthalene type phenol resin thus oxidized can be obtained, for example, by oxidizing the naphthalene type phenol resin represented by the formula (D) or the formula (E).
  • a method of oxidation treatment for example, (1) a method in which a naphthalene type phenol resin is placed in a non-sealed container and this container is left or stirred in the presence of air; (2) a naphthalene type phenol resin is placed in the non-sealed container A method of leaving or stirring while bubbling oxygen into the container, (3) a method of enclosing the naphthalene type phenol resin together with air in a closed container and leaving or stirring may be mentioned.
  • the temperature of the oxidation treatment is, for example, in the range of 50 ° C. or more and 100 ° C. or less.
  • the oxidation treatment time is, for example, in the range of 6 hours or more and 72 hours or less.
  • the oxidation of the naphthalene type phenol resin further shifts the absorption peak wavelength to the long wavelength side.
  • the curing agent contained in the thermosetting resin composition is preferably only the first curing agent, but may be both the first curing agent and the second curing agent.
  • the thermosetting resin preferably further contains a reactive flame retardant.
  • the reactive flame retardant forms a crosslinked structure when the thermosetting resin composition cures.
  • Specific examples of the reactive flame retardant include phosphorus-modified phenolic resin, tetrabromobisphenol A and tribromophenol.
  • the reactive flame retardant does not stand alone in the cured product and participates in the formation of the cross-linked structure, so it is possible to improve the flame resistance (flame retardancy) of the cured product while suppressing bleed out.
  • the reactive flame retardant is preferably a reactive phosphorous flame retardant.
  • a halogen-free thermosetting resin composition can be obtained by using a reactive phosphorus-based flame retardant instead of a halogen.
  • a phosphorus modified phenol resin is mentioned as a specific example of a reaction type phosphorus flame retardant.
  • the reactive phosphorus-based flame retardant is a phosphorus-modified phenolic resin
  • the hydroxyl equivalent is preferably in the range of 350 g / eq to 600 g / eq, and more preferably in the range of 373 g / eq to 550 g / eq. It is.
  • the inorganic filler can contribute to the improvement of the dimensional stability of the cured product of the thermosetting resin composition, and the like.
  • Specific examples of the inorganic filler include fused silica, aluminum hydroxide, magnesium hydroxide, E glass powder, aluminum oxide, magnesium oxide, titanium dioxide, potassium titanate, calcium silicate, calcium carbonate, clay and talc. Among these, fused silica and aluminum hydroxide are preferred.
  • the fused silica is spherical, the moldability can be secured even if the content in the thermosetting resin composition is large to a certain extent. Furthermore, the fused silica can contribute to the reduction of the thermal expansion coefficient of the cured product, the improvement of the laser processability, the improvement of the drillability, and the stabilization of dimensions. However, if the fused silica is excessive, the moldability of the thermosetting resin composition may be reduced. Further, since the fused silica is harder than aluminum hydroxide, if the content is excessive, the laser machinability and the drillability of the cured product may be reduced.
  • Aluminum hydroxide can contribute to the improvement of the flame resistance of the cured product. However, if aluminum hydroxide is excessive, the moldability of the thermosetting resin composition may be reduced or the cured product may be more susceptible to moisture absorption than when using the same amount of fused silica. .
  • Fused silica and aluminum hydroxide may be used in combination or only fused silica may be used among them.
  • the proportion of the fused silica is preferably in the range of 50% by mass to 100% by mass with respect to the total mass of the fused silica and the aluminum hydroxide.
  • Such optimum amounts provide the advantages of fused silica and aluminum hydroxide, respectively. That is, it is possible to realize a reduction in the thermal expansion coefficient of the cured product, an improvement in the flame resistance, the laser processability and the drill processability.
  • the average particle size of the inorganic filler is preferably in the range of 0.5 ⁇ m to 5 ⁇ m.
  • the "average particle size” means the particle size (d50) at an integrated value of 50% in the particle size distribution measured by the laser diffraction / scattering method.
  • the content of the inorganic filler is preferably 200 parts by mass or less with respect to 100 parts by mass of the thermosetting resin.
  • the content of the inorganic filler is 200 parts by mass or less, the moldability of the thermosetting resin composition can be improved. Furthermore, the generation of voids in the cured product of the thermosetting resin composition can be suppressed.
  • the content of the inorganic filler is preferably 50 parts by mass or more with respect to 100 parts by mass of the thermosetting resin.
  • Optional Components include core-shell rubbers, acrylic resins, additive-type flame retardants and curing accelerators. These components will be described in order below.
  • thermosetting resin composition preferably further contains a core-shell rubber, an acrylic resin, or both a core-shell rubber and an acrylic resin.
  • Core-shell rubber is an aggregate of rubber particles having a core-shell structure.
  • the rubber particles are formed of a core and a shell. At least one of the core and the shell has elasticity.
  • the core-shell rubber contains silicone in at least one of the core and the shell. This can further improve the thermal shock resistance. That is, compared with the case where it does not contain silicone, impact resistance can be improved also at lower temperature.
  • the core is particulate rubber.
  • the rubber may be a copolymer or homopolymer.
  • a silicone / acrylic copolymer is mentioned as a specific example of a copolymer.
  • a cross-linked acrylic polymer is mentioned as a specific example of a homopolymer.
  • the crosslinked acrylic polymer is a homopolymer of an acrylic monomer and has a three-dimensional crosslinked structure.
  • the shell is present on the surface of the core.
  • the shell consists of a plurality of graft chains. One end of each graft chain is bonded to the surface of the core to be a fixed end, and the other end is a free end.
  • the graft chain may be a copolymer or a homopolymer.
  • An acrylonitrile / styrene copolymer is mentioned as a specific example of a copolymer.
  • Polymethyl methacrylate is mentioned as a specific example of a homopolymer.
  • the average particle size of the core-shell rubber is preferably in the range of 0.1 ⁇ m to 0.7 ⁇ m.
  • the average particle diameter of the core-shell rubber is 0.1 ⁇ m or more, the impact resistance of the cured product can be further enhanced.
  • the average particle size of the core-shell rubber is 0.7 ⁇ m or less, the core-shell rubber can be easily dispersed uniformly in the thermosetting resin composition, and as a result, it can be easily dispersed uniformly in the cured product.
  • the content of the core-shell rubber is preferably in the range of 10 parts by mass to 30 parts by mass with respect to 100 parts by mass of the thermosetting resin.
  • the content of the core-shell rubber is in this range, the impact resistance, the drillability and the laser processability of the cured product can be improved while appropriately maintaining the moldability of the thermosetting resin composition. .
  • the acrylic resin preferably has a structure represented by at least the following formula (2) and the following formula (3) among the following formulas (1), (2) and (3). Although the acrylic resin which has such a structure is demonstrated below, it is not limited to this acrylic resin.
  • X in Formula (1), y in Formula (2), and z in Formula (3) satisfy the following relational expressions.
  • x: y: z (mole fraction) 0: 0.95: 0.05 to 0.2: 0.6: 0.2 (however, x + y + z 1 1, 0 x x 0.2 0.2, 0.6) It is ⁇ y ⁇ 0.95, 0.05 ⁇ z ⁇ 0.2).
  • R1 is a hydrogen atom or a methyl group
  • R2 is a hydrogen atom, an alkyl group, a glycidyl group and an epoxidized alkyl group, at least one of a glycidyl group and an epoxidized alkyl group including.
  • R3 is a hydrogen atom or a methyl group
  • R4 is a phenyl group (-Ph), - COOCH 2 Ph, or -COO (CH 2) a 2 Ph.
  • the main chain of the acrylic resin has a structure represented by at least Formula (2) and Formula (3) among Formula (1), Formula (2) and Formula (3).
  • the main chain of the acrylic resin has a structure represented by Formula (1), Formula (2) and Formula (3)
  • the arrangement of structures represented by Formula (1), Formula (2) and Formula (3) The order is not particularly limited.
  • the structures represented by Formula (1) may or may not be continuous, and the structures represented by Formula (2) are continuous.
  • the structures represented by the formula (3) may or may not be continuous.
  • the arrangement order of the structures represented by Formula (2) and Formula (3) is not particularly limited.
  • the structures represented by Formula (2) may or may not be continuous with each other, and the structures represented by Formula (3) are continuous with each other. It does not have to be continuous either.
  • R 2 in the formula (2) contains at least one of a glycidyl group and an epoxidized alkyl group among a hydrogen atom, an alkyl group, a glycidyl group and an epoxidized alkyl group Supplementary explanation of As a premise, R2 in the structure represented by one formula (2) is one.
  • the case where an acrylic resin has only one structure represented by Formula (2), and the case where it has two or more are divided and demonstrated.
  • R2 is a glycidyl group or an epoxidized alkyl group.
  • R2 in the structure represented by at least one formula (2) is a glycidyl group or an epoxidized alkyl group
  • the remaining R2 in the structure represented by Formula (2) is a hydrogen atom or an alkyl group. Since R2 in the structure represented by at least one formula (2) is a glycidyl group or an epoxidized alkyl group, R2 in all the structures represented by formula (2) is a glycidyl group or epoxidized It may be an alkyl group.
  • Structure represented by the formula (3) is a phenyl group (-Ph), - COOCH 2 Ph , -COO (CH 2) has a 2 Ph.
  • -Ph, -COOCH 2 Ph, -COO ( CH 2) 2 Ph is because it is thermally stable, the strength of the cured product of the prepreg is improved. Therefore, it is possible to improve the moisture absorption heat resistance of the metal-clad laminate 2 and the printed wiring board 3 (hereinafter sometimes collectively referred to as a "substrate”) substrate manufactured using a prepreg as a material.
  • the acrylic resin preferably has no unsaturated bond such as a double bond or a triple bond between adjacent carbon atoms. That is, it is preferable that adjacent carbon atoms of the acrylic resin be bonded by a saturated bond (single bond). Thereby, since it is possible to reduce oxidation over time, it is possible to suppress loss of elasticity and brittleness.
  • the weight average molecular weight (Mw) of the acrylic resin is preferably in the range of 200,000 or more and 850,000 or less.
  • Mw weight average molecular weight
  • the chemical resistance of the cured product can be improved.
  • the weight average molecular weight of the acrylic resin is 850,000 or less, the moldability of the thermosetting resin composition can be improved.
  • the cured product of the prepreg hardly absorbs moisture, whereby the moisture resistance of the substrate can be improved, and the insulation reliability can be improved. Further, even if the cured product of the prepreg absorbs moisture, the moisture absorption heat resistance of the substrate can be improved because the breaking strength of the resin constituting the cured product is increased.
  • An acrylic resin is a prepolymer having at least one or more epoxy groups in one molecule.
  • the epoxy group is one of the functional groups possessed by the acrylic resin.
  • the epoxy equivalent of the acrylic resin is preferably in the range of 1250 g / eq or more and 100000 g / eq or less, and more preferably in the range of 2500 g / eq or more and 7000 g / eq or less.
  • the epoxy equivalent in this case means the mass of the acrylic resin containing one equivalent of epoxy group. The lower the epoxy equivalent, the higher the concentration of epoxy groups, and the higher the epoxy equivalent, the lower the concentration of epoxy groups.
  • the content of the acrylic resin is preferably in the range of 10 parts by mass to 30 parts by mass with respect to 100 parts by mass of the thermosetting resin.
  • cured material with respect to a metal can be improved because content of an acrylic resin is 10 mass parts or more.
  • the cured product can be made hard to burn.
  • the core-shell rubber and the acrylic resin may be used in combination or only the core-shell rubber may be used among them.
  • the proportion of the core-shell rubber is preferably in the range of 50% by mass to 100% by mass with respect to the total mass of the core-shell rubber and the acrylic resin.
  • Such optimum amounts provide the advantages of core-shell rubber and acrylic resin, respectively. That is, it is possible to realize improvement in impact resistance, thermal shock resistance, laser processability, drill processability, and adhesion to metal of the cured product.
  • the additive-type flame retardant will be described.
  • Specific examples of the additive type flame retardant include phosphoric acid ester compounds, phosphazene compounds and antimony oxide.
  • the addition type flame retardant being contained in the thermosetting resin composition, it is possible to improve the flame resistance of the cured product.
  • the additive-type flame retardant is preferably an additive-type phosphorus-based flame retardant.
  • a halogen-free thermosetting resin composition can be obtained by using an additive type phosphorus-based flame retardant instead of a halogen.
  • Specific examples of the addition type phosphorus-based flame retardant include phosphoric acid ester compounds, phosphazene compounds, phosphorous acid ester compounds, phosphine compounds, phosphinate compounds, polyphosphate compounds, phosphonium salt compounds and phosphine oxide compounds.
  • the curing accelerator is appropriately selected according to the thermosetting resin and the curing agent.
  • a specific example of the curing accelerator is 2-ethyl-4-methylimidazole.
  • thermosetting resin composition optional components which are preferably not contained in the thermosetting resin composition will be described.
  • thermosetting resin composition preferably contains substantially no pigment and dye.
  • Some pigments and dyes may be capable of absorbing ultraviolet light, but if at least one of the pigment and the dye is substantially contained in the thermosetting resin composition, the following problems may occur.
  • pigments and dyes can not form a crosslinked structure because they do not have a crosslinking point that can react with a thermosetting resin. Therefore, if the pigment and the dye are contained in excess in the cured product 51, the heat resistance of the cured product 51 may be reduced.
  • the cured product 51 may not be uniformly colored. That is, the pigment is locally aggregated on the surface of the cured product 51, and the local aggregation causes the generation of light and shade, resulting in non-uniform coloring.
  • the cured product 51 may not be uniformly colored. That is, the dye is locally deposited on the surface of the cured product 51, and the local deposition causes density to be generated, resulting in non-uniform coloring.
  • thermosetting resin composition when the thermosetting resin composition cures, the first curing agent that absorbs ultraviolet light forms a cross-linked structure and does not exist in isolation in the cured product. Problems like this are unlikely to occur.
  • the thermosetting resin composition may contain at least one of a pigment and a dye as long as the ultraviolet shielding effect is not impaired.
  • the thermosetting resin composition preferably contains substantially no halogen.
  • the thermosetting resin composition is free of halogen, generation of dioxins can be suppressed when a printed wiring board or the like containing a cured product is incinerated.
  • a phosphorus-containing flame retardant may be contained in the thermosetting resin composition instead of the halogen as described above.
  • the thermosetting resin composition may contain a slight amount of halogen as long as the ultraviolet shielding effect is not impaired and the generation of dioxins can be suppressed.
  • Prepreg A prepreg 1 according to this embodiment is shown in FIG.
  • the prepreg 1 is in the form of a sheet or a film as a whole.
  • the prepreg 1 is used for the material of the metal-clad laminate 2, the material of the printed wiring board 3, and the multilayering (build-up method) of the printed wiring board 3.
  • the prepreg 1 is provided with a substrate 4 and a semi-cured product 50 of the thermosetting resin composition impregnated in the substrate 4.
  • Examples of the substrate 4 include woven and non-woven fabrics.
  • a glass cloth is mentioned as a specific example of a woven fabric.
  • a glass nonwoven fabric is mentioned as a specific example of a nonwoven fabric.
  • the glass cloth and the glass non-woven fabric are formed of glass fibers, they may be formed of reinforcing fibers other than glass fibers.
  • the reinforcing fibers include aromatic polyamide fibers, liquid crystal polyester fibers, poly (paraphenylene benzobisoxazole) (PBO) fibers, and polyphenylene sulfide (PPS) resin fibers.
  • One prepreg 1 is provided with at least one substrate 4.
  • the semi-cured product 50 is in the semi-cured state of the thermosetting resin composition.
  • the semi-cured state means a state of an intermediate stage (B stage) of the curing reaction.
  • the intermediate stage is a stage between the stage of the varnish state (A stage) and the stage of the cured state (C stage).
  • the prepreg 1 is once melted and then completely cured to be in a cured state.
  • the cured product of the prepreg 1 can form the insulating layer of the substrate.
  • the prepreg 1 preferably has a thickness of 100 ⁇ m or less, more preferably 60 ⁇ m or less, and still more preferably 40 ⁇ m or less. Thus, the thickness of the insulating layer can be reduced, and thinning of the substrate can be realized.
  • the thickness of the prepreg 1 is preferably 10 ⁇ m or more.
  • the metal-clad laminated board 2 which concerns on this embodiment is shown in FIG.
  • the metal-clad laminate 2 includes an insulating layer 52 and a metal layer 80.
  • the metal-clad laminate 2 is used as a material of the printed wiring board 3 or the like.
  • the insulating layer 52 is formed of the cured product 51 of the prepreg 1.
  • the insulating layer 52 has one base 4 but may have two or more bases 4.
  • the thickness of the insulating layer 52 is not particularly limited.
  • a thick insulating layer 52 is effective for UV shielding, and a thin insulating layer 52 is effective for thinning a substrate.
  • the thickness of the insulating layer 52 is preferably 100 ⁇ m or less, more preferably 60 ⁇ m or less, and still more preferably 40 ⁇ m or less.
  • the UV shielding property largely contributes to the first curing agent, it is also effective to secure the thickness of the insulating layer 52 to a certain extent, so that the thickness of the insulating layer 52 is preferably 10 ⁇ m or more, and 15 ⁇ m or more It is more preferable that
  • the metal layer 80 is formed on one side or both sides of the insulating layer 52.
  • a copper layer can be mentioned.
  • the metal layer 80 is formed on both sides of the insulating layer 52, but the metal layer 80 may be formed on only one side of the insulating layer 52.
  • the metal-clad laminate 2 in which the metal layers 80 are formed on both surfaces of the insulating layer 52 is a double-sided metal-clad laminate.
  • the metal-clad laminate 2 in which the metal layer 80 is formed only on one side of the insulating layer 52 is a single-sided metal-clad laminate.
  • the printed wiring board 3 which concerns on this embodiment is shown in FIG.
  • the printed wiring board 3 includes an insulating layer 52 and conductor wires 81.
  • the term "printed wiring board” means one in which the electronic component is not soldered but is in the form of wiring only.
  • the insulating layer 52 is formed of the cured product 51 of the prepreg 1.
  • the insulating layer 52 is the same as the insulating layer 52 of the metal-clad laminate 2 described above.
  • the conductor wiring 81 is formed on one side or both sides of the insulating layer 52. In FIG. 3, the conductor wiring 81 is formed on both surfaces of the insulating layer 52, but the conductor wiring 81 may be formed on one surface of the insulating layer 52.
  • the printed wiring board 3 can be manufactured by removing the unnecessary part of the metal layer 80 of the metal-clad laminate 2. A necessary part remaining after removing the unnecessary part of the metal layer 80 becomes the conductor wiring 81.
  • the first etching resist 61 is applied or adhered to one metal layer 80 of the metal-clad laminate 2, and the second etching resist 62 is applied or adhered to the other metal layer 80.
  • the 1st etching resist 61 and the 2nd etching resist 62 are negative resists is explained below, it may be positive resist.
  • the first photomask 601 is overlaid on the first etching resist 61
  • the second photomask 602 is overlaid on the second etching resist 62.
  • the first photomask 601 has a light transmitting portion 601 a and a light shielding portion 601 b.
  • the second photomask 602 has a light transmitting portion 602 a and a light shielding portion 602 b.
  • the ultraviolet light UV passes through the light transmitting portion 601a and is blocked by the light shielding portion 601b.
  • the portion of the first etching resist 61 which is transmitted through the light transmitting portion 601 a and irradiated with the ultraviolet light UV is cured by photopolymerization to form a first resist layer 61 a.
  • the ultraviolet light UV passes through the light transmitting portion 602a and is blocked by the light shielding portion 602b.
  • the portion of the second etching resist 62 which is transmitted through the light transmitting portion 602a and irradiated with the ultraviolet light UV is cured by photopolymerization to form a second resist layer 62a.
  • a portion of the first etching resist 61 and the second etching resist 62 which has not been irradiated with the ultraviolet light UV is removed by a developer.
  • the first resist layer 61a and the second resist layer 62a do not dissolve in the developer and remain.
  • the portions other than the first resist layer 61a and the second resist layer 62a are dissolved in the developer and removed.
  • portions of the metal layer 80 not protected by the first resist layer 61a and the second resist layer 62a are removed by an etching solution.
  • (2.5) Coated Printed Wiring Board A method of manufacturing the coated printed wiring board 30 will be described. Specifically, the printed wiring board 3 shown in FIG. 3 is processed into a coated printed wiring board 30 shown in FIG. 5C.
  • the first solder resist 71 is applied or adhered to one surface of the printed wiring board 3 and the second solder resist 72 is applied or adhered to the other surface.
  • the 1st solder resist 71 and the 2nd solder resist 72 are negative resists is explained below, it may be a positive resist.
  • the first photomask 701 is overlaid on the first solder resist 71
  • the second photomask 702 is overlaid on the second solder resist 72.
  • the first photomask 701 has a light transmitting portion 701 a and a light shielding portion 701 b.
  • the second photomask 702 has a light transmitting portion 702 a and a light shielding portion 702 b.
  • each of the first photomask 701 and the second photomask 702 is irradiated with ultraviolet light UV.
  • the ultraviolet light UV passes through the light transmitting portion 701a and is blocked by the light shielding portion 701b.
  • the portion of the first solder resist 71 which is transmitted through the light transmitting portion 701 a and irradiated with the ultraviolet light UV is cured by photopolymerization to form a first resist layer 71 a.
  • the ultraviolet rays UV pass through the first solder resist 71 and are applied to the insulating layer 52 in the places where the conductor wiring 81 does not exist between the first solder resist 71 and the insulating layer 52.
  • the insulating layer 52 is formed of the cured product 51 of the prepreg 1, it has high ultraviolet shielding properties. Therefore, even if there is ultraviolet light UV transmitted through the light transmitting portion 701 a of the first photomask 701 and further transmitted through the first solder resist 71, the ultraviolet light UV is blocked by the insulating layer 52. Therefore, it is possible to suppress the transmission through the insulating layer 52 and the exposure of the second solder resist 72 on the opposite side. That is, so-called back burning can be suppressed.
  • the ultraviolet light UV passes through the light transmitting portion 702a and is blocked by the light shielding portion 702b.
  • the portion of the second solder resist 72 which is transmitted through the light transmitting portion 702 a and irradiated with the ultraviolet light UV is cured by photopolymerization to form a second resist layer 72 a.
  • the conductor wiring 81 is present even if the ultraviolet ray UV passes through the second solder resist 72.
  • the ultraviolet rays UV are reflected by the conductor wiring 81.
  • the ultraviolet light UV passes through the second solder resist 72 and is irradiated to the insulating layer 52.
  • the insulating layer 52 is formed of the cured product 51 of the prepreg 1, it has high ultraviolet shielding properties. Therefore, even if there is ultraviolet light UV transmitted through the light transmitting portion 702 a of the second photomask 702 and further transmitted through the second solder resist 72, the ultraviolet light UV is blocked by the insulating layer 52. Therefore, it is possible to suppress the transmission of the insulating layer 52 and the exposure of the first solder resist 71 on the opposite side. That is, so-called back burning can be suppressed.
  • first solder resist 71 and the second solder resist 72 which has not been irradiated with the ultraviolet light UV is removed by a developer.
  • the first resist layer 71a and the second resist layer 72a do not dissolve in the developer and remain.
  • the portions other than the first resist layer 71a and the second resist layer 72a are dissolved in the developer and removed.
  • the coated printed wiring board 30 is obtained as described above.
  • a portion of the conductor wiring 81 not protected by the first resist layer 71a and the second resist layer 72a can be a pad 81a.
  • An electronic component (not shown) can be soldered to the pad 81a.
  • the printed circuit board electronic components are soldered to the pads 81 a of the coated printed wiring board 30 so as to operate as an electronic circuit. Furthermore, the semiconductor package is one in which the electronic components of the printed circuit board are sealed.
  • the film with resin 10 is shown in FIG. 6A.
  • the film with resin 10 is in the form of a film or a sheet as a whole.
  • the film with resin 10 includes a resin layer 11 and a support film 12.
  • the film with resin 10 is used for multilayering (build-up method) of the printed wiring board 3 or the like.
  • the resin layer 11 is formed of a semi-cured product 50 of a thermosetting resin composition.
  • the semi-cured product 50 can be a cured product 51 with high ultraviolet shielding property by being heated.
  • the resin layer 11 can form the insulating layer 52.
  • the resin layer 11 preferably has a thickness of 100 ⁇ m or less, more preferably 60 ⁇ m or less, and still more preferably 40 ⁇ m or less. Thus, the thickness of the insulating layer 52 can be reduced, and thinning of the substrate can be realized.
  • the thickness of the resin layer 11 is preferably 10 ⁇ m or more.
  • the support film 12 supports the resin layer 11. By supporting in this way, the semi-cured resin layer 11 can be handled easily.
  • the support film 12 is, for example, an electrically insulating film.
  • Specific examples of the support film 12 include polyethylene terephthalate (PET) film, polyimide film, polyester film, polyparabanic acid film, polyetheretherketone film, polyphenylene sulfide film, aramid film, polycarbonate film, and polyarylate film.
  • PET polyethylene terephthalate
  • a release agent layer may be provided on the surface of the support film 12 that supports the resin layer 11.
  • the support film 12 can be peeled off from the resin layer 11 as needed by the release agent layer.
  • the support film 12 is peeled off from the insulating layer 52.
  • the protective film 13 is, for example, an electrically insulating film.
  • Specific examples of the protective film 13 include polyethylene terephthalate (PET) film, polyolefin film, polyester film, and polymethylpentene film.
  • PET polyethylene terephthalate
  • the protective film 13 is not limited to these films.
  • a release agent layer (not shown) may be provided on the surface of the protective film 13 superimposed on the resin layer 11. The protective film 13 can be peeled off from the resin layer 11 as needed by the release agent layer.
  • the metal foil with resin 100 which concerns on this embodiment is shown in FIG.
  • the metal foil with resin 100 is in the form of a film or a sheet as a whole.
  • the metal foil with resin 100 includes a resin layer 101 and a metal foil 102.
  • the metal foil with resin 100 is used for multilayering (build-up method) of the printed wiring board 3 or the like.
  • the resin layer 101 is formed of a semi-cured product 50 of a thermosetting resin composition.
  • the semi-cured product 50 can be a cured product 51 with high ultraviolet shielding property by being heated.
  • the resin layer 101 can form the insulating layer 52.
  • the resin layer 101 preferably has a thickness of 100 ⁇ m or less, more preferably 60 ⁇ m or less, and still more preferably 40 ⁇ m or less. Thus, the thickness of the insulating layer 52 can be reduced, and thinning of the substrate can be realized.
  • the thickness of the resin layer 101 is preferably 10 ⁇ m or more.
  • the resin layer 101 is adhered to the metal foil 102.
  • An example of the metal foil 102 is a copper foil.
  • the metal foil 102 can form the conductor wiring 81 by removing unnecessary portions by etching.
  • thermosetting resin composition according to the first aspect is a thermosetting resin composition containing a thermosetting resin and an inorganic filler.
  • the thermosetting resin contains a curing agent.
  • curing agent is 15 or more.
  • the content of the curing agent is 10% by mass or more with respect to the total solid content of the thermosetting resin composition.
  • the curing agent contains a naphthalene type phenolic resin.
  • ultraviolet rays are more easily absorbed than novolak-type phenolic resin.
  • thermosetting resin composition according to the third aspect in the first or second aspect, the content of the inorganic filler is 200 parts by mass or less with respect to 100 parts by mass of the thermosetting resin.
  • the moldability of the thermosetting resin composition can be improved. Furthermore, the generation of voids in the cured product (51) can be suppressed.
  • thermosetting resin composition according to the fourth aspect in any of the first to third aspects, the thermosetting resin further contains a reactive flame retardant.
  • the flame resistance of the cured product (51) can be improved.
  • thermosetting resin composition according to the fifth aspect in any of the first to fourth aspects, further contains a core-shell rubber, an acrylic resin, or both a core-shell rubber and an acrylic resin.
  • At least one of the impact resistance, the thermal shock resistance, the laser machinability and the drill machinability, and the adhesion to metal of the cured product can be improved.
  • thermosetting resin composition according to the sixth aspect further contains an additive-type flame retardant in any of the first to fifth aspects.
  • the flame resistance of the cured product (51) can be further improved.
  • a prepreg (1) according to a seventh aspect comprises a substrate (4) and a semi-cured product (50) of any one of the first to sixth thermosetting resin compositions impregnated in the substrate (4) And.
  • a cured product (51) having high ultraviolet shielding properties can be obtained.
  • the prepreg (1) according to the eighth aspect has a thickness of 100 ⁇ m or less in the seventh aspect.
  • a cured product (51) having a thickness of 100 ⁇ m or less and having a high ultraviolet shielding property can be obtained.
  • the metal-clad laminate (2) according to the ninth aspect comprises an insulating layer (52) formed of the cured product (51) of the prepreg (1) according to the seventh or eighth aspect, and one surface of the insulating layer (52). Or a metal layer (80) formed on both sides.
  • the ultraviolet shielding properties of the insulating layer (52) can be enhanced.
  • the printed wiring board (3) according to the tenth aspect includes an insulating layer (52) formed of the cured product (51) of the prepreg (1) of the seventh or eighth aspect, and one side of the insulating layer (52) or And conductor wiring (81) formed on both sides.
  • the ultraviolet shielding properties of the insulating layer (52) can be enhanced.
  • a resin-laminated film (10) according to an eleventh aspect comprises a resin layer (11) formed of the semi-cured product (50) of any one of the first to sixth thermosetting resin compositions, and a resin layer (11) And a support film (12) for supporting the
  • a cured product (51) having high ultraviolet shielding properties can be obtained.
  • the resin-coated metal foil (100) according to the twelfth aspect comprises a resin layer (101) formed of a semi-cured product (50) of any one of the first to sixth thermosetting resin compositions, and a resin layer And 101) a bonded metal foil (102).
  • a cured product (51) having high ultraviolet shielding properties can be obtained.
  • thermosetting resin composition The following were prepared as a raw material of a thermosetting resin composition.
  • Triphenylmethane type epoxy resin (manufactured by Nippon Kayaku Co., Ltd., trade name "EPPN-502H”, epoxy equivalent: 158 to 178 g / eq) -Naphthalene type epoxy resin (made by DIC Corporation, trade name "HP-9900", epoxy equivalent: 272 g / eq) -Naphthalene type epoxy resin (made by DIC Corporation, trade name "HP-4710", epoxy equivalent: 170 g / eq) -Bismaleimide resin (manufactured by Nippon Kayaku Co., Ltd., trade name "MIR-3000", manufactured by Nippon Kayaku Co., Ltd.) (Hardener: First hardener) The naphthalene type phenol resin represented by the formula (E) was placed in a non-sealed container, and the container was stirred in the presence of air. The temperature of the oxidation treatment is adjusted within the range of 50 ° C.
  • Reactive flame retardant Reactive phosphorus flame retardant (phosphorus-modified phenolic resin, Dow Chemical, trade name "XZ-92741", hydroxyl equivalent: 550 g / eq)
  • Reactive-type phosphorus-based flame retardant phosphorus-modified phenolic resin, manufactured by DIC Corporation, trade name "HPC-9080", hydroxyl equivalent: 373 g / eq)
  • (Inorganic filler) ⁇ Fused silica (Admatex Co., Ltd., trade name "SC-2500 SEJ”, average particle size: 0.5 ⁇ m)
  • Aluminum hydroxide (Sumitomo Chemical Co., Ltd., trade name "C-301N", average particle diameter: 1.5 ⁇ m)
  • Aluminum hydroxide (Sumitomo Chemical Co., Ltd., trade name "CL-303", average particle diameter: 4 ⁇ m) (Core shell rubber) Core-shell rubber (Mitsubishi Chemical Corporation, trade name "SRK200A”, core: silicone
  • thermosetting resin composition was prepared by diluting and stirring, mixing and homogenizing.
  • a mixed solvent of toluene and methyl ethyl ketone (volume ratio 1:10) was used in Example 8 and only methyl ethyl ketone was used in the other Examples and Comparative Examples.
  • thermosetting resin composition was impregnated into a glass cloth (# 1017 type, E glass, manufactured by Nitto Boseki Co., Ltd.) so that the thickness of the cured product of the prepreg was 25 ⁇ m.
  • the thermosetting resin composition impregnated in the glass cloth was heated and dried by a non-contact type heating unit until it was in a semi-cured state. The heating temperature was 130 to 140.degree.
  • the resin content (resin amount) of the prepreg was in the range of 68% by mass to 74% by mass with respect to the entire prepreg (100% by mass).
  • a copper foil (thickness: 12 ⁇ m) was stacked on both sides of one prepreg, and heat compression molding was performed to produce a second double-sided metal-clad laminate with a 25 ⁇ m-thick insulating layer.
  • the conditions of heat and pressure molding are 210 ° C., 4 MPa, and 120 minutes.
  • UV ray screening rate Sample between the exposure machine (Hitec Co., Ltd., model number "HTE-3000M”) and the ultraviolet light meter (Oak Co., Ltd., model number "UV-M02", light receiver "UV-42" (peak wavelength 400 nm))
  • the transmittance of the ultraviolet light transmitted through the sample from the exposure device to the light receiver was measured by an ultraviolet light meter.
  • an ultraviolet-ray shielding rate (%) was computed according to the following formula.
  • UV shielding rate (%) 100-transmittance ⁇ moldability>
  • the surface of the sample was visually observed to confirm the presence or absence of the thin film, and the cross section of the sample was observed by a microscope to confirm the presence or absence of the void.
  • the size of the sample is 410 mm ⁇ 510 mm ⁇ thickness 25 ⁇ m.
  • the moldability was determined based on the following criteria.
  • Tg of the sample was measured using a dynamic viscoelasticity measurement device (manufactured by SII Nano Technology Inc., model: DMS 6100).
  • Tg was taken as the temperature at which tan ⁇ is maximized.
  • the size of the sample is 5 mm ⁇ 50 mm ⁇ 25 ⁇ m in thickness.
  • the measurement conditions were: deformation mode: tension, frequency: 10 Hz, temperature rising rate: 5 ° C./min.
  • the heat resistance of the second double-sided metal-clad laminate was evaluated based on JIS C6481 using a small-sized high-temperature chamber (manufactured by Espec Corporation, model: STH-120). Specifically, the second double-sided metal-clad laminate was allowed to stand in the above-described small-sized high-temperature chamber set at 270 ° C. for 1 hour, then taken out, and the presence or absence of swelling (delamination) of the copper foil was confirmed. .
  • the size of the sample is 50 mm ⁇ 50 mm ⁇ thickness 49 ⁇ m (thickness 25 ⁇ m of insulating layer, thickness 12 ⁇ m of copper foil on both sides of insulating layer).
  • Reference Signs List 1 prepreg 2 metal-clad laminate 3 printed wiring board 4 base 50 semi-cured product 51 cured product 52 insulating layer 80 metal layer 81 conductor wiring

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Abstract

La présente invention concerne une composition de résine thermodurcissable qui contient une résine thermodurcissable et une charge inorganique. La résine thermodurcissable contient un agent de durcissement. Une solution de méthyl éthylcétone contenant 3 % en masse de l'agent de durcissement a une échelle de couleur Gardner de 15 ou plus. La quantité contenue de l'agent de durcissement est de 10 % en masse ou plus par rapport à la teneur totale en solides de la composition de résine thermodurcissable.
PCT/JP2018/038155 2017-10-25 2018-10-12 Composition de résine thermodurcissable, préimprégné, stratifié à revêtement métallique, carte de circuit imprimé, film à base de résine, et feuille métallique comprenant de la résine WO2019082698A1 (fr)

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CN201880067404.9A CN111212877A (zh) 2017-10-25 2018-10-12 热固性树脂组合物、预浸料、覆金属层压体、印刷线路板、具有树脂的膜以及具有树脂的金属箔
JP2019551002A JP7289103B2 (ja) 2017-10-25 2018-10-12 熱硬化性樹脂組成物、プリプレグ、金属張積層板、プリント配線板、樹脂付きフィルム及び樹脂付き金属箔
US16/757,677 US11414528B2 (en) 2017-10-25 2018-10-12 Thermosetting resin composition, prepreg, metal-clad laminate, printed wiring board, film with resin, and metal foil with resin

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WO2023210567A1 (fr) * 2022-04-27 2023-11-02 三菱瓦斯化学株式会社 Composition de résine, produit durci, préimprégné, plaque stratifiée plaquée de feuille métallique, feuille composite de résine, carte de circuit imprimé, dispositif semi-conducteur et procédé de fabrication de carte de circuit imprimé

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