WO2019073956A1 - Tampon de maintien et son procédé de fabrication - Google Patents

Tampon de maintien et son procédé de fabrication Download PDF

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Publication number
WO2019073956A1
WO2019073956A1 PCT/JP2018/037550 JP2018037550W WO2019073956A1 WO 2019073956 A1 WO2019073956 A1 WO 2019073956A1 JP 2018037550 W JP2018037550 W JP 2018037550W WO 2019073956 A1 WO2019073956 A1 WO 2019073956A1
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WIPO (PCT)
Prior art keywords
holding
resin sheet
resin
holding pad
holding surface
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PCT/JP2018/037550
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English (en)
Japanese (ja)
Inventor
幸史 広田
敏秀 前田
貴宏 久米
Original Assignee
富士紡ホールディングス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士紡ホールディングス株式会社 filed Critical 富士紡ホールディングス株式会社
Priority to KR1020207007543A priority Critical patent/KR102593855B1/ko
Priority to CN201880057479.9A priority patent/CN111051002B/zh
Publication of WO2019073956A1 publication Critical patent/WO2019073956A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Definitions

  • the present invention relates to a holding pad and a method of manufacturing the same.
  • Patent Document 1 discloses that a recess is provided on the surface of a holding pad to control the removability after polishing while securing the retainability of an object to be polished.
  • Patent Document 2 discloses that the removability of a glass substrate after polishing is improved by providing pores of 0.1 to 1.0 mm at predetermined intervals on the surface of a holding pad made of porous soft resin. Is disclosed.
  • the slurry easily infiltrates into the holding pad made of porous soft resin from the pores provided on the holding surface of the holding pad, and the holding pad is chemically modified by the permeation of the slurry.
  • the holding pad is chemically modified by the permeation of the slurry.
  • the present invention has been made in view of the above problems, and can exert an adsorptive force so as not to cause lateral displacement during polishing, but can suppress cracking when peeling an object to be polished.
  • the present inventors diligently studied to solve the above problems. As a result, it has been found that the problem can be solved by the holding surface having predetermined permeability, and the present invention has been completed.
  • a holding pad comprising a resin sheet having a holding surface for holding an object to be polished, the holding pad comprising:
  • the permeation rate of ethanol to the holding surface represented by the following formula (1) is 1.0 to 2.0 degrees / second.
  • Penetration rate (C 0 -C 20) / 20 ⁇ (1)
  • C 0 contact angle of the ethanol with respect to the holding surface immediately after dropping the ethanol onto the holding surface
  • C 20 contact angle of the ethanol with the holding surface after 20 seconds from the dropping of the ethanol
  • Water is dropped on the holding surface, and a contact angle W 0 of the water with respect to the holding surface immediately after the dropping of the water is 100 to 150 degrees.
  • the holding pad as described in [1].
  • the average micropore diameter of the micropores formed in the holding surface is 0.1 to 5.0 ⁇ m, The holding pad as described in [1] or [2].
  • the micropore area of the micropores formed in the holding surface is 5.0 ⁇ 10 4 to 5.0 ⁇ 10 6 ⁇ m 2 per 1 cm 2 of the holding surface.
  • the holding pad according to any one of [1] to [3].
  • the breaking strength of the non-foamed resin sheet obtained by dissolving the resin sheet with N, N-dimethylformamide and drying the obtained solution is 30 MPa or more.
  • the holding pad according to any one of [1] to [4].
  • the 100% modulus of the resin constituting the resin sheet is 3.0 to 10 MPa, The holding pad according to any one of [1] to [5].
  • the resin sheet contains a polyurethane resin, The holding pad according to any one of [1] to [6].
  • the resin sheet is obtained by stretching a polyurethane resin sheet, The holding pad according to any one of [1] to [7].
  • the resin sheet contains a water repellent, The holding pad according to any one of [1] to [8].
  • the water repellent includes a fluorine-based water repellent having a C 6-8 perfluoroalkyl group. The holding pad as described in [9].
  • the content of the water repellent agent is 0.5 to 5.0% by mass with respect to the total amount of the resin sheet.
  • the holding pad as described in [9] or [10].
  • Method of manufacturing holding pad Method of manufacturing holding pad.
  • the resin includes a polyurethane resin, The manufacturing method of the holding pad as described in [12].
  • a holding pad suitable for holding an object and a method of manufacturing the same can be provided.
  • FIG. 1 It is a schematic sectional drawing showing the one aspect
  • the present embodiment the present invention
  • the present invention is not limited to this, and various modifications can be made without departing from the scope of the invention. It is.
  • the holding pad of the present embodiment is a holding pad provided with a resin sheet having a holding surface for holding an object to be polished, and the permeation rate of ethanol to the holding surface represented by the following formula (1) (hereinafter referred to as Simply referred to as "the permeation rate of ethanol”) is 1.0 to 2.0 degrees / second.
  • Penetration rate (C 0 -C 20) / 20 ⁇ (1)
  • C 0 Contact angle of ethanol to the holding surface immediately after dropping ethanol onto the holding surface
  • C 20 contact angle of ethanol to the holding surface 20 seconds after dropping of ethanol
  • FIG. 1 is a schematic cross-sectional view showing one aspect of the holding pad of the present embodiment.
  • the holding pad 10 shown in FIG. 1 is an adhesive layer for adhering the substrate 11, the resin sheet 12 having the holding surface 12 a for holding the workpiece W, and the substrate 11 and the resin sheet 12. (Not shown) and an adhesive layer 14 provided on the side opposite to the surface on the resin sheet 12 side of the base material 11 for fixing the holding pad 10 to the holding surface plate.
  • the resin sheet has a holding surface for holding an object to be polished.
  • the holding pad of the present embodiment holds the object to be polished by the interaction between the holding surface and the surface of the object to be polished by pressing the object to be polished by containing an appropriate amount of water on the holding surface of the resin sheet. it can.
  • the holding surface of the resin sheet may be designed slightly larger than the object to be polished so as to easily hold the object to be polished. Furthermore, the holding surface may be configured to simultaneously hold a plurality of objects to be polished.
  • the resin sheet is provided with a film (skin layer) on the surface, and inside the sheet is provided with a large number of longitudinal bubbles in the thickness direction, and has an open cell structure in which they communicate with each other.
  • a large number of vertically elongated cells have a shape in which the cell diameter gradually decreases toward the skin layer along the thickness direction of the resin sheet. It is preferable that the skin layer is formed with micropores that can be evaluated by the permeation rate of ethanol described later.
  • the permeation rate of ethanol represented by the following formula (1) is 1.0 to 2.0 degrees / second.
  • the penetration rate of ethanol is an index indicating the balance between the adsorptive power and the releasability of the holding surface. It is preferable that the resin sheet has water repellency from the viewpoint of durability. However, if it has water repellency, the holding surface repels water and does not penetrate, so that it is not possible to evaluate the state of micropores and the like with water. Therefore, by using ethanol instead of water and measuring the permeation rate to its holding surface, it is possible to evaluate the state of fine pores and the affinity of resin sheet with water, etc. The inventors have found that the balance of peelability can be evaluated.
  • the fact that the permeation rate of ethanol is slow suggests that there are few or no micropores on the holding surface, and that the resin sheet has high water repellency, so that the adsorption power of the holding surface is high, and the durability is also enhanced. It shows that the material to be polished is difficult to peel off.
  • the fact that the penetration rate of ethanol is fast suggests that a large number of relatively large micropores are formed in the holding surface, and that the water repellency of the resin sheet is low. Although the property is good, it shows that the adsorptive power during the polishing process is lowered and the lateral deviation is apt to occur.
  • the penetration speed of ethanol is high, the slurry may easily intrude into the holding pad, and the infiltration of the slurry may lead to chemical deterioration or breakage of the holding pad.
  • the permeation rate of ethanol in the present embodiment is 1.0 to 2.0 degrees / second, preferably 1.0 to 1.8 degrees / second, and more preferably 1.0. It is -1.6 degrees / second. If the permeation rate of ethanol is less than 1.0 degree / second, the adsorptive power becomes too high, which makes it difficult to peel off the object to be polished. In addition, if the permeation rate of ethanol is more than 2.0 degrees / second, problems such as lateral displacement of an object to be polished during polishing may occur because the adsorption force is too low.
  • the penetration rate of ethanol can be adjusted by the water repellency of the micropores or matrix material formed on the holding surface.
  • Water contact angle Water is dropped on the holding surface, and the contact angle W 0 of water to the holding surface immediately after the dropping of water is preferably 100 to 150 degrees, more preferably 100 to 140 degrees, and still more preferably 100 to 130 degrees. It is.
  • contact angle W 0 of the water is not less than 100 degrees, since the water repellency of the resin sheet surface is high, the slurry penetration is suppressed, the durability of the holding pad tends to be further improved. In addition, the swelling of the holding pad due to the penetration of the slurry tends to be suppressed.
  • the contact angle W 0 of the water is less than 150 degrees, when to hold the object to be polished by using a water retentive surface hardly thick water film is formed on the holding surface, the suction force is stabilized There is a tendency.
  • the contact angle W 0 of the water can be adjusted by adding a water repellent in the control and adjustment of the resin solution of the fine pores on the surface of the resin sheet. Further, the contact angle W 0 of the water can be measured by the method described in Examples.
  • the average micropore diameter of the micropores formed on the holding surface is preferably 0.1 to 5.0 ⁇ m, more preferably 0.2 to 4.0 ⁇ m, and still more preferably 0.5 to 2.0 ⁇ m. is there.
  • the average fine pore diameter is less than 0.1 ⁇ m, the adsorptivity is higher, and the removability tends to be deteriorated.
  • the average fine pore diameter is more than 5.0 ⁇ m, although the releasability is good, the adsorptive power tends to be further reduced.
  • the average fine pore diameter can be measured by the method described in the examples.
  • the micropore area of the micropores formed in the holding surface is preferably 5.0 ⁇ 10 4 to 5.0 ⁇ 10 6 ⁇ m 2 , and more preferably 5.0 ⁇ 10 4 to 1 ⁇ 2 for the holding surface. It is 3.0 ⁇ 10 6 ⁇ m 2 . If the micropore area is less than 5.0 ⁇ 10 4 ⁇ m 2 , the adsorptive power tends to be too high, and the removability tends to deteriorate. When the micropore area is more than 5.0 ⁇ 10 6 ⁇ m 2 , although the releasability is good, the adsorptive power tends to be too low. Furthermore, the micropores are easily transferred to the surface of the object to be polished, and the flatness of the object to be polished is easily deteriorated. The micropore area can be measured by the method described in the examples.
  • resins such as polyurethane and polyurethane polyurea; acrylic resins such as polyacrylate and polyacrylonitrile; vinyl resins such as polyvinyl chloride, polyvinyl acetate and polyvinylidene fluoride; polysulfone, poly Polysulfone resins such as ether sulfone; Acylated cellulose resins such as acetylated cellulose and butyrylated cellulose; polyamide resins; and polystyrene resins.
  • polyurethane resins such as polyurethane and polyurethane polyurea
  • acrylic resins such as polyacrylate and polyacrylonitrile
  • vinyl resins such as polyvinyl chloride, polyvinyl acetate and polyvinylidene fluoride
  • polysulfone poly Polysulfone resins such as ether sulfone
  • Acylated cellulose resins such as acetylated cellulose and butyrylated cellulose
  • polyamide resins and
  • wet coagulation a resin solution in which a resin is dissolved is used as a coating, and this is immersed in a bath of a coagulation liquid (which is a poor solvent for the resin) in a resin solution impregnated. It solidifies and regenerates the resin. By replacing the solvent in the resin solution with the coagulating liquid, the resin in the resin solution is coagulated and coagulated.
  • the resin constituting the resin sheet is preferably soluble in one or more selected from the group consisting of N, N-dimethylformaldehyde, dimethylacetamide, methyl ethyl ketone and dimethyl sulfoxide.
  • polyurethane resins are preferable. Although it does not specifically limit as polyurethane-type resin, For example, polyester-type polyurethane resin, polyether-type polyurethane resin, and polycarbonate-type polyurethane resin are mentioned. Such a polyurethane-based resin has low affinity to water but does not have water repellency, and by adding a water repellent, it has water repellency. For this reason, the water repellency of a resin sheet can be adjusted by adjusting the number of addition parts of the water repellent in the solution preparation process mentioned later, and the penetration speed of ethanol is also affected.
  • the breaking strength of the non-foamed resin sheet obtained by dissolving the resin sheet with N, N-dimethylformamide and drying the obtained solution is preferably 30 MPa or more, more preferably 40 MPa or more, and still more preferably 50 MPa or more.
  • the breaking strength of the non-foamed resin sheet is 30 MPa or more, breakage of the resin sheet due to the stress of the polishing process tends to be further suppressed.
  • a resin sheet does not fracture
  • the breaking strength of the non-foamed resin sheet can be adjusted by the selection of the resin type. In addition, the breaking strength of the non-foamed resin sheet can be measured by the method described in the examples.
  • the 100% modulus of the resin constituting the resin sheet is preferably 3.0 to 10 MPa, more preferably 3.5 to 9.0 MPa, and still more preferably 4.0 to 8.0 MPa.
  • the 100% modulus of the resin constituting the resin sheet is 3.0 MPa or more, the phenomenon in which the object to be polished sinks on the holding surface due to the stress of the polishing step is suppressed.
  • the corners of the object to be polished come into contact with the holding surface to form a scratch, and the slurry infiltrates from the portion of the scratch, making it difficult to cause the phenomenon that the holding pad is chemically degraded or damaged.
  • 100% modulus of the resin constituting the resin sheet is 10 MPa or less, the adsorption force is improved, the object to be polished is appropriately held in the polishing step, and the cushioning property of the resin sheet is improved. As a result, as a result of being able to appropriately absorb excessive polishing load that may be locally generated in the polishing step, the flatness of the obtained object to be polished tends to be further improved.
  • 100% modulus of resin which comprises a resin sheet can be adjusted by selection of resin kind.
  • 100% modulus of resin which comprises a resin sheet can be measured by the method as described in an Example.
  • “100% modulus” is an index showing the hardness of resin, and it means that it is hard resin, so that this value becomes large.
  • the resin sheet preferably contains a water repellent.
  • the water repellent agent is not particularly limited.
  • PTFE polytetrafluoroethylene
  • FEP tetrafluoroethylene-hexafluoropropylene copolymer
  • PFA tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer
  • silicone-based water repellents and polyolefin-based water repellents may be mentioned.
  • fluorine-based water repellents are preferable, and fluorine-based water repellents having a C 6-8 perfluoroalkyl group are more preferable.
  • the water repellent may be used alone or in combination of two or more.
  • the fluorine-based water repellent having a perfluoroalkyl group having 6 to 8 carbon atoms is not particularly limited, and examples thereof include a compound represented by the following formula (2) and a resin modified with a perfluoroalkyl group. . Rf-R-X (2)
  • R f represents a perfluoroalkyl group, and the carbon number thereof is 3 to 8, preferably 4 to 8, more preferably 6 to 8, and still more preferably 6.
  • R represents an alkylene group, and the carbon number thereof is 2 to 6, preferably 2 to 4, and more preferably 2.
  • one having 6 carbon atoms in Rf is preferable, and one having 2 carbon atoms in R is more preferable.
  • the compound represented by Formula (2) may be synthesize
  • Commercially available products include, for example, Asahi Guard E series (trade name of AGC Seimi Chemical Co., Ltd.), NK Guard S series (trade name of Nikka Chemical Co., Ltd.), Unidyne series (trade name of Daikin Industries, Ltd.), Klisson Aassister (trade name of DIC Corporation) and the like.
  • the resin modified with a perfluoroalkyl group is not particularly limited, but for example, a polyurethane resin modified with a perfluoroalkyl group can be mentioned from the viewpoint of the dispersibility of the water repellent in the resin sheet and the temporal stability. .
  • reformation method the method of introduce
  • a resin modified by the compound represented by the formula (2) that is, a resin having a group represented by Rf-R- is preferable.
  • polyurethane resins having a group represented by Rf-R- are more preferable.
  • Such resins include, for example, the polyurethane resins described in WO 2012/172936.
  • the content of the water repellent is preferably 0.5 to 5.0% by mass, more preferably 0.5 to 4.0% by mass, still more preferably 0. It is 5 to 3.0% by mass.
  • the content of the water repellent is 0.5% by mass or more, the permeation rate of ethanol is slowed to improve the adsorptive power, and the lateral displacement is suppressed, and the penetration of the slurry is suppressed, and the durability of the holding pad is thereby improved. Improve more.
  • the content of the water repellent agent is 5.0% by mass or less, the permeation rate of ethanol can be increased, the adsorptive power can be reduced, and the releasability can be favorably maintained.
  • the resin sheet may contain a pore forming agent as described later.
  • the pore-forming agent is not particularly limited, and examples thereof include cellulose-based compounds such as cellulose acetate butyrate.
  • the pore forming agent may be used alone or in combination of two or more.
  • the holding pad of this embodiment may contain various additives which may be contained in the holding pad according to the purpose other than the above.
  • additives are not particularly limited, and include, for example, pigments or fillers such as carbon black, hydrophilic additives, and hydrophobic additives.
  • the hydrophilic additive is not particularly limited, but, for example, an anionic surfactant such as sodium lauryl sulfate, carboxylate, sulfonate, sulfate, phosphate ester; hydrophilic ester compound, ether Nonionic surfactants such as compounds, ester / ether compounds and amide compounds may be mentioned.
  • the hydrophobic additive is not particularly limited, but, for example, polyoxyethylene alkyl ether, polyoxypropylene alkyl ether, polyoxyethylene polyoxypropylene alkyl ether, perfluoroalkyl ethylene oxide adduct, glycerin fatty acid ester, propylene
  • the nonionic surfactant which the C3-C3 or more alkyl chain added like glycol fatty acid ester is mentioned.
  • the thickness of the resin sheet is not particularly limited, but is preferably 3.0 mm or less, and more preferably, in order to suppress that the object to be polished sinks into the resin sheet during the polishing step and the processing accuracy is reduced. It is 2.0 mm or less, more preferably 1.0 mm or less.
  • the lower limit of the thickness of the resin sheet is not particularly limited, but is preferably 300 ⁇ m or more. When the thickness of the resin sheet is in the above range, the thickness accuracy tends to be sufficiently secured. The thickness is measured in accordance with Japanese Industrial Standard (JIS K 6505).
  • the holding pad of the present embodiment may have a frame portion surrounding the object to be polished on the holding surface, or may not have the frame portion.
  • the frame portion prevents the object to be polished from being laterally shifted during polishing and prevents the object from jumping out of the holding surface (regulating the lateral displacement range). If lateral displacement does not easily occur, such as when the weight of the object to be polished is relatively large, the frame may not be provided. However, if such lateral displacement can occur, the shape and size of the frame may be The material is not particularly limited as long as it does not protrude from the polishing region, and for example, the inner diameter may be formed to be larger than the outer diameter of the object to be polished.
  • the holding pad of this embodiment may be provided with a cushion layer made of a foamed resin on the surface opposite to the holding surface for holding an object to be polished, or may not be provided with the cushion layer.
  • the holding pad of the present embodiment may have a fixing means of an adhesive layer or adhesive layer such as a double-sided tape or a surface fastener for fixing the holding pad to the holding platen on the surface of the holding platen side. .
  • the manufacturing method of the holding pad according to the present embodiment includes a solution preparing step of preparing a resin solution by mixing and dissolving a resin in a solvent, a coating forming step of forming a coating of the resin solution, and a coating of resin. It has the immersion process which is immersed in the solidification liquid which is a poor solvent, and produces a resin sheet, and the hole formation process which forms a fine hole in the surface of a resin sheet.
  • the solution preparation step is a step of mixing and dissolving the resin in a solvent to prepare a resin solution. Under the present circumstances, you may use the said pore formation agent, a water repellent, and another component as additives other than resin and a solvent.
  • the resin, the water repellent agent, and the pore forming agent are not particularly limited, and examples thereof include the same as described above.
  • the concentration of the resin is preferably 10 to 50% by mass, more preferably 15 to 35% by mass.
  • the solvent is not particularly limited, for example, N, N-dimethylformamide (DMF), N, N-dimethylacetamide (DMA C), methyl ethyl ketone (MEK) and dimethyl sulfoxide (DMSO).
  • the solvent may be a single solvent or a mixture of two or more solvents.
  • the coating film forming step is a step of forming a coating film of a resin solution.
  • the method of forming the coating film is not particularly limited, and for example, a method of applying a resin solution to the surface of a film-forming substrate using a coating apparatus such as a knife coater may be mentioned.
  • the thickness of the resin solution applied at this time may be appropriately adjusted so that the thickness of the resin sheet 112 finally obtained becomes a desired thickness.
  • limit especially as a material of the base material for film formation For example, resin films, such as a PET film, a fabric, and a nonwoven fabric are mentioned.
  • the immersing step is a step of immersing the coating film in a coagulating solution which is a poor solvent for resin to produce a resin sheet.
  • a coagulating solution which is a poor solvent for resin to produce a resin sheet.
  • the poor solvent those known in the prior art can be used, and it is not particularly limited, and examples thereof include water.
  • the poor solvent may be a single solvent or a mixture of two or more solvents.
  • the coagulating liquid may contain a polar solvent in the resin solution from the viewpoint of adjusting the regeneration rate of the resin. Further, the temperature of the coagulating liquid is not particularly limited as long as it can solidify the resin.
  • a film skin layer
  • innumerable minute micropores are formed in the resin in the immediate vicinity of the film.
  • the phenomenon in which the solvent contained in the coating of the resin solution diffuses into the coagulating liquid and the phenomenon in which the poor solvent penetrates from the coagulating liquid into the coating occurs in a coordinated manner.
  • a resin sheet having an open cell structure is obtained inside the coating film.
  • the substrate for film formation is a material which does not easily permeate the liquid (for example, a PET film)
  • the coagulating liquid does not permeate the substrate, and therefore, the solvent in the coating film is replaced with the poor solvent from the skin layer.
  • larger vacancies tend to be formed in the region that is inside rather than near the skin layer.
  • the resin solution contains a pore forming agent, the tip of the micropores will communicate to the surface, and micropores will be formed on the surface.
  • the obtained resin sheet for a washing
  • the resin sheet is washed in a washing solution such as water to remove the solvent such as DMF remaining in the resin sheet. Thereafter, the resin sheet may be dried in a dryer.
  • the hole forming step is not particularly limited as long as fine holes can be formed on the surface of the resin sheet, but a method of forming the fine holes by forming the fine holes by adding a hole forming agent to the resin solution or stretching the resin sheet Etc. In addition, when adding a hole formation agent, an immersion process and a hole formation process are performed simultaneously.
  • the stretch ratio of the resin sheet is 105 to 300% (meaning 1.05 times to 3 times the length of the original length), more preferably 120. It is ⁇ 250%.
  • a drawing rate is less than 105%, a micropore is not formed appropriately but it becomes easy to be broken when a drawing rate of a resin sheet is over 300%. Unfavorable.
  • the method of manufacturing a polished object of the present embodiment has a polishing step of polishing the workpiece held by the holding pad using a polishing pad.
  • the polishing process may be primary polishing (rough polishing), secondary polishing (finish polishing), or both of them.
  • polishing material of this embodiment is demonstrated to an example for chemical mechanical polishing, the manufacturing method of the grinding
  • maintenance pad 10 of this embodiment is shown.
  • the holding pad 10 is fixed on the holding surface plate 1 of the polishing machine to hold the object W to be polished.
  • the polishing liquid is supplied while holding the workpiece W on the holding surface of the holding pad 10, and the polishing pad 2 mounted on the polishing platen 3 of the polishing apparatus is pressed against the workpiece W and rotated. By doing this, the object to be polished W can be polished.
  • the method for fixing the holding pad 10 to the holding surface plate 1 is not particularly limited. However, when the holding pad 10 is provided with a double-sided tape, the release paper of the double-sided tape is removed and the holding surface is an exposed adhesive layer. Adhesively fix to the holding surface plate 1 so as to face upward. When the holding pad 10 is not provided with the double-sided tape, the holding pad 10 may be adhered and fixed to the holding surface plate 1 with an adhesive or an adhesive prepared separately.
  • the object to be polished W is held on the holding surface by including the appropriate amount of water on the holding surface of the holding pad 10 and pressing the object to be polished W. At this time, the object to be polished W is held such that the surface to be polished (processed surface) of the object to be polished W faces upward.
  • the polishing pad 2 (abrasive cloth) is mounted on the surface of the polishing platen 3 disposed so as to face the holding platen 1 above the holding platen 1 so that the polishing surface is directed downward.
  • the polishing platen 1 is lowered and moved to the holding platen 3 so that the surface to be polished of the workpiece W contacts the polishing surface of the polishing pad 2.
  • a slurry is supplied between the object to be polished W and the polishing pad 2.
  • the slurry may be water, chemical components such as an oxidant represented by hydrogen peroxide, additives, abrasive grains (abrasive particles; for example, SiC, SiO 2 , Al 2 O 3 , etc.) depending on the object to be polished and polishing conditions, etc. , CeO 2 ), etc., and the slurry may be supplied while circulating.
  • the work surface of the workpiece W is rotated by relatively rotating the holding platen 1 and the polishing platen 3 while pressing the workpiece W on the holding platen 1 with the polishing pad 2.
  • the polishing pad 2 is polished by chemical mechanical polishing (CMP).
  • CMP chemical mechanical polishing
  • the holding surface plate 1 and the polishing surface plate 3 may rotate in the same direction at different rotational speeds, or may rotate in different directions.
  • the object to be polished is not particularly limited, but, for example, thin substrates such as glass substrates for liquid crystal displays, materials such as semiconductor devices and electronic components, particularly Si substrates (silicon wafers), SiC (silicon carbide) substrates, GaAs (Gallium arsenide) substrate.
  • the polishing process can be suitably performed with a size (3130 mm ⁇ 2880 mm) called G10 and a thickness of 0.3 to 0.7 mm.
  • the resin sheet was dissolved in N, N-dimethylformamide, and the resulting solution was dried to obtain a non-foamed resin sheet (test piece).
  • the resulting resin sheet is punched into a dumbbell shape (JIS K 6550 described), the measurement sample is sandwiched by the upper and lower air chucks of the measuring machine, the measurement is started at a tension speed of 100 mm / min and the initial gripping interval of 50 mm. The value reached when cutting) was obtained as the strength (maximum load).
  • the sample thickness was measured using a thickness gauge when mounting the measurement sample on a chuck.
  • the breaking strength was measured by a method based on Japanese Industrial Standard (JIS K 6550) using a tensile universal tester (“Tensilon”, manufactured by A & D, RTC-1210A).
  • Example 1 47 parts by mass of DMF, 0.6 parts by mass of water repellent (solid content: 60% by mass) with respect to 100 parts by mass of a 30% DMF solution of polyester-based polyurethane resin (breaking strength: 55 MPa, 100% modulus: 6.0 MPa) 0.2 parts by mass of a pore forming agent (cellulose acetate butyrate) was added and mixed and stirred to prepare a resin solution. Next, a PET film was prepared as a substrate for film formation, and the above resin solution was applied thereto using a knife coater to obtain a coating film having a thickness of 1.0 mm.
  • a pore forming agent cellulose acetate butyrate
  • the obtained coating film was immersed in water, which is a coagulating liquid, together with the substrate for film formation, to coagulate and regenerate the resin, to obtain a resin sheet.
  • the resin sheet was taken out of the coagulation bath, and the substrate for film formation was peeled off from the resin sheet, and then the resin sheet was immersed in a cleaning liquid composed of water to remove DMF which is a solvent. Thereafter, the resin sheet was wound while being dried.
  • the back surface of the resin sheet (the surface on the side from which the substrate for film formation was peeled off and the surface that was in contact with the film formation substrate) was subjected to buff treatment to obtain a thickness of 0.8 mm. .
  • a double-sided tape was attached to the buffed side of the resin sheet to obtain a holding pad.
  • Example 2 A resin sheet was produced without using a pore forming agent, and a resin sheet was produced in the same manner as in Example 1 except that the obtained resin sheet was stretched by 120% in the width direction, to obtain a holding pad.
  • Example 3 A resin sheet was produced without using a pore forming agent, and a resin sheet was produced in the same manner as in Example 1 except that the obtained resin sheet was stretched 250% in the width direction, to obtain a holding pad.
  • Comparative Example 1 A resin sheet was produced in the same manner as in Example 1 except that the resin sheet was produced without using a pore forming agent and the obtained resin sheet was tried to be stretched by 310% in the width direction. On the other hand, the resin sheet was broken and a holding pad could not be obtained.
  • Comparative Example 2 A holding pad was obtained in the same manner as in Example 1 except that a resin sheet was produced without using a pore forming agent.
  • Comparative Example 3 After producing the holding pad in the same manner as in Comparative Example 2, pores (diameter 0.4 mm, interval 3 mm, depth 0.8 mm) were formed from the holding surface using a sewing needle.
  • Comparative Example 4 After the resin sheet is produced in the same manner as in Comparative Example 2, the holding surface side is also subjected to buffing, and a resin sheet is produced in the same manner as in Comparative Example 1 except that pores derived from open cells are formed in the holding surface. I got a holding pad.
  • the contact angle of ethanol was measured as follows for the holding pad. Using a solid-liquid interface analyzer (trade name "DropMaster 500" manufactured by Kyowa Interface Science Co., Ltd.) as a contact angle meter, 1 drop (concentration: 99%) of ethanol (concentration: 99%) under the conditions of temperature 20 ° C and humidity 60%. 5 ⁇ L) was dropped onto the holding surface of the holding pad. Then, the contact angle immediately after dropping was C 0 , and the contact angle after 20 seconds was C 20, and the permeation rate of ethanol was calculated by the following equation (1).
  • FIG. 4 is a graph showing the change of the contact angle of ethanol with respect to time in Examples 2 to 3 and Comparative Example 1.
  • the contact angle of water was measured as follows for the holding pad. Using a solid-liquid interface analyzer (trade name "DropMaster 500" manufactured by Kyowa Interface Science Co., Ltd.) as a contact angle meter, hold 1 drop (1 ⁇ L) of water droplets from an injection needle under the conditions of temperature 20 ° C and humidity 60% It dripped on the holding surface, and measured the contact angle immediately after dripping. In Comparative Example 4 in which the holding surface was buffed, it permeated into the holding pad simultaneously with the dropping of water, and water did not adhere on the holding surface, so that the contact angle could not be measured.
  • a solid-liquid interface analyzer trade name "DropMaster 500" manufactured by Kyowa Interface Science Co., Ltd.
  • the average fine pore size ( ⁇ m) and the micropore area per 1 cm 2 ( ⁇ m 2 ) were measured by enlarging the range of about 100 ⁇ m by 1000 times with a scanning electron microscope (JSM-5500 LV manufactured by JEOL Ltd.) 9 I observed it. This image is binarized using image processing software (Image Analyzer V20LAB Ver.1.3, manufactured by Nikon), the number of micropores (number of bubbles) is confirmed, and the area of each micropore (bubble) is equivalent to the area circle The diameter and its average value were calculated as the average fine pore diameter. Then, from the ratio of the area of the micropores, the micropore area per 1 cm 2 was determined.
  • the cutoff value (lower limit) of the bubble diameter was not set. Further, in Comparative Examples 1 and 3, no micropores were observed. Although micropores were not confirmed in Comparative Example 3 in which pores were formed in the holding surface and Comparative Example 4 in which the holding surface was subjected to buffing, openings derived from the pores and buffing were confirmed. The The average diameter of the identified openings and the area per 1 cm 2 were calculated as reference values (indicated by * 2 in the table).
  • Adhesive force Water was sprayed by spraying onto the holding surface of the holding pad processed into a 100 mm square sample, and a glass of 60 mm diameter (about 1 mm in thickness) was pressed against the sample and absorbed without wiping off the attached water. Next, a 10 kg weight was placed on the glass and rested for 1 minute. With the weight placed, the wire attached to the glass was pulled in the vertical direction at a speed of 100 mm / min with a universal tensile tester (“Tensilon”, manufactured by A & D, RTC-1210A), and the load peak value was measured. Furthermore, the measurement of the load peak value was repeated five times, and the average of the load peak values of six times in total was taken as the adsorption force. (Evaluation criteria) ⁇ : Adsorption force is 5 kgf or more and 25 kgf or less ⁇ : Adsorption force is less than 5 kgf or more than 25 kgf
  • FIG. 5 shows a micrograph of the surface of the holding surface of Examples 2 to 3 and Comparative Example 2.
  • C 0 Contact angle of ethanol to holding surface immediately after dropping ethanol
  • C 20 Contact angle of ethanol to holding surface 20 seconds after dropping of ethanol (C 0 -C 20 ) / 20: permeation rate of ethanol (degree / Second)
  • W 0 Contact angle of water with respect to the holding surface immediately after dropping water on the holding surface * 1: Reference value determined by the formula of (C 0 -Ct) / t * 2: Average of openings from pores and buffing Diameter and area
  • the holding pad of the present embodiment has industrial applicability as a holding pad of an object to be polished in the field of polishing processing.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

L'invention a trait à un tampon de maintien comprenant une feuille de résine qui a une surface de maintien pour maintenir un objet à polir, la vitesse de pénétration, exprimée dans la formule (1), de l'éthanol dans la surface de maintien est de 1,0 à 2,0 degré(s)/s. (1): vitesse de pénétration = (C0-C20)/20. C0 est l'angle de contact de l'éthanol par rapport à la surface de maintien immédiatement après la chute d'une goutte d'éthanol sur la surface de maintien, et C20 est l'angle de contact de l'éthanol par rapport à la surface de maintien 20 secondes après la chute de la goutte d'éthanol.
PCT/JP2018/037550 2017-10-10 2018-10-09 Tampon de maintien et son procédé de fabrication WO2019073956A1 (fr)

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CN201880057479.9A CN111051002B (zh) 2017-10-10 2018-10-09 保持垫及其制造方法

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JP2019069491A (ja) 2019-05-09
CN111051002B (zh) 2021-10-26

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