WO2019073956A1 - Holding pad and production method therefor - Google Patents

Holding pad and production method therefor Download PDF

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Publication number
WO2019073956A1
WO2019073956A1 PCT/JP2018/037550 JP2018037550W WO2019073956A1 WO 2019073956 A1 WO2019073956 A1 WO 2019073956A1 JP 2018037550 W JP2018037550 W JP 2018037550W WO 2019073956 A1 WO2019073956 A1 WO 2019073956A1
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WO
WIPO (PCT)
Prior art keywords
holding
resin sheet
resin
holding pad
holding surface
Prior art date
Application number
PCT/JP2018/037550
Other languages
French (fr)
Japanese (ja)
Inventor
幸史 広田
敏秀 前田
貴宏 久米
Original Assignee
富士紡ホールディングス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士紡ホールディングス株式会社 filed Critical 富士紡ホールディングス株式会社
Priority to CN201880057479.9A priority Critical patent/CN111051002B/en
Priority to KR1020207007543A priority patent/KR102593855B1/en
Publication of WO2019073956A1 publication Critical patent/WO2019073956A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Definitions

  • the present invention relates to a holding pad and a method of manufacturing the same.
  • Patent Document 1 discloses that a recess is provided on the surface of a holding pad to control the removability after polishing while securing the retainability of an object to be polished.
  • Patent Document 2 discloses that the removability of a glass substrate after polishing is improved by providing pores of 0.1 to 1.0 mm at predetermined intervals on the surface of a holding pad made of porous soft resin. Is disclosed.
  • the slurry easily infiltrates into the holding pad made of porous soft resin from the pores provided on the holding surface of the holding pad, and the holding pad is chemically modified by the permeation of the slurry.
  • the holding pad is chemically modified by the permeation of the slurry.
  • the present invention has been made in view of the above problems, and can exert an adsorptive force so as not to cause lateral displacement during polishing, but can suppress cracking when peeling an object to be polished.
  • the present inventors diligently studied to solve the above problems. As a result, it has been found that the problem can be solved by the holding surface having predetermined permeability, and the present invention has been completed.
  • a holding pad comprising a resin sheet having a holding surface for holding an object to be polished, the holding pad comprising:
  • the permeation rate of ethanol to the holding surface represented by the following formula (1) is 1.0 to 2.0 degrees / second.
  • Penetration rate (C 0 -C 20) / 20 ⁇ (1)
  • C 0 contact angle of the ethanol with respect to the holding surface immediately after dropping the ethanol onto the holding surface
  • C 20 contact angle of the ethanol with the holding surface after 20 seconds from the dropping of the ethanol
  • Water is dropped on the holding surface, and a contact angle W 0 of the water with respect to the holding surface immediately after the dropping of the water is 100 to 150 degrees.
  • the holding pad as described in [1].
  • the average micropore diameter of the micropores formed in the holding surface is 0.1 to 5.0 ⁇ m, The holding pad as described in [1] or [2].
  • the micropore area of the micropores formed in the holding surface is 5.0 ⁇ 10 4 to 5.0 ⁇ 10 6 ⁇ m 2 per 1 cm 2 of the holding surface.
  • the holding pad according to any one of [1] to [3].
  • the breaking strength of the non-foamed resin sheet obtained by dissolving the resin sheet with N, N-dimethylformamide and drying the obtained solution is 30 MPa or more.
  • the holding pad according to any one of [1] to [4].
  • the 100% modulus of the resin constituting the resin sheet is 3.0 to 10 MPa, The holding pad according to any one of [1] to [5].
  • the resin sheet contains a polyurethane resin, The holding pad according to any one of [1] to [6].
  • the resin sheet is obtained by stretching a polyurethane resin sheet, The holding pad according to any one of [1] to [7].
  • the resin sheet contains a water repellent, The holding pad according to any one of [1] to [8].
  • the water repellent includes a fluorine-based water repellent having a C 6-8 perfluoroalkyl group. The holding pad as described in [9].
  • the content of the water repellent agent is 0.5 to 5.0% by mass with respect to the total amount of the resin sheet.
  • the holding pad as described in [9] or [10].
  • Method of manufacturing holding pad Method of manufacturing holding pad.
  • the resin includes a polyurethane resin, The manufacturing method of the holding pad as described in [12].
  • a holding pad suitable for holding an object and a method of manufacturing the same can be provided.
  • FIG. 1 It is a schematic sectional drawing showing the one aspect
  • the present embodiment the present invention
  • the present invention is not limited to this, and various modifications can be made without departing from the scope of the invention. It is.
  • the holding pad of the present embodiment is a holding pad provided with a resin sheet having a holding surface for holding an object to be polished, and the permeation rate of ethanol to the holding surface represented by the following formula (1) (hereinafter referred to as Simply referred to as "the permeation rate of ethanol”) is 1.0 to 2.0 degrees / second.
  • Penetration rate (C 0 -C 20) / 20 ⁇ (1)
  • C 0 Contact angle of ethanol to the holding surface immediately after dropping ethanol onto the holding surface
  • C 20 contact angle of ethanol to the holding surface 20 seconds after dropping of ethanol
  • FIG. 1 is a schematic cross-sectional view showing one aspect of the holding pad of the present embodiment.
  • the holding pad 10 shown in FIG. 1 is an adhesive layer for adhering the substrate 11, the resin sheet 12 having the holding surface 12 a for holding the workpiece W, and the substrate 11 and the resin sheet 12. (Not shown) and an adhesive layer 14 provided on the side opposite to the surface on the resin sheet 12 side of the base material 11 for fixing the holding pad 10 to the holding surface plate.
  • the resin sheet has a holding surface for holding an object to be polished.
  • the holding pad of the present embodiment holds the object to be polished by the interaction between the holding surface and the surface of the object to be polished by pressing the object to be polished by containing an appropriate amount of water on the holding surface of the resin sheet. it can.
  • the holding surface of the resin sheet may be designed slightly larger than the object to be polished so as to easily hold the object to be polished. Furthermore, the holding surface may be configured to simultaneously hold a plurality of objects to be polished.
  • the resin sheet is provided with a film (skin layer) on the surface, and inside the sheet is provided with a large number of longitudinal bubbles in the thickness direction, and has an open cell structure in which they communicate with each other.
  • a large number of vertically elongated cells have a shape in which the cell diameter gradually decreases toward the skin layer along the thickness direction of the resin sheet. It is preferable that the skin layer is formed with micropores that can be evaluated by the permeation rate of ethanol described later.
  • the permeation rate of ethanol represented by the following formula (1) is 1.0 to 2.0 degrees / second.
  • the penetration rate of ethanol is an index indicating the balance between the adsorptive power and the releasability of the holding surface. It is preferable that the resin sheet has water repellency from the viewpoint of durability. However, if it has water repellency, the holding surface repels water and does not penetrate, so that it is not possible to evaluate the state of micropores and the like with water. Therefore, by using ethanol instead of water and measuring the permeation rate to its holding surface, it is possible to evaluate the state of fine pores and the affinity of resin sheet with water, etc. The inventors have found that the balance of peelability can be evaluated.
  • the fact that the permeation rate of ethanol is slow suggests that there are few or no micropores on the holding surface, and that the resin sheet has high water repellency, so that the adsorption power of the holding surface is high, and the durability is also enhanced. It shows that the material to be polished is difficult to peel off.
  • the fact that the penetration rate of ethanol is fast suggests that a large number of relatively large micropores are formed in the holding surface, and that the water repellency of the resin sheet is low. Although the property is good, it shows that the adsorptive power during the polishing process is lowered and the lateral deviation is apt to occur.
  • the penetration speed of ethanol is high, the slurry may easily intrude into the holding pad, and the infiltration of the slurry may lead to chemical deterioration or breakage of the holding pad.
  • the permeation rate of ethanol in the present embodiment is 1.0 to 2.0 degrees / second, preferably 1.0 to 1.8 degrees / second, and more preferably 1.0. It is -1.6 degrees / second. If the permeation rate of ethanol is less than 1.0 degree / second, the adsorptive power becomes too high, which makes it difficult to peel off the object to be polished. In addition, if the permeation rate of ethanol is more than 2.0 degrees / second, problems such as lateral displacement of an object to be polished during polishing may occur because the adsorption force is too low.
  • the penetration rate of ethanol can be adjusted by the water repellency of the micropores or matrix material formed on the holding surface.
  • Water contact angle Water is dropped on the holding surface, and the contact angle W 0 of water to the holding surface immediately after the dropping of water is preferably 100 to 150 degrees, more preferably 100 to 140 degrees, and still more preferably 100 to 130 degrees. It is.
  • contact angle W 0 of the water is not less than 100 degrees, since the water repellency of the resin sheet surface is high, the slurry penetration is suppressed, the durability of the holding pad tends to be further improved. In addition, the swelling of the holding pad due to the penetration of the slurry tends to be suppressed.
  • the contact angle W 0 of the water is less than 150 degrees, when to hold the object to be polished by using a water retentive surface hardly thick water film is formed on the holding surface, the suction force is stabilized There is a tendency.
  • the contact angle W 0 of the water can be adjusted by adding a water repellent in the control and adjustment of the resin solution of the fine pores on the surface of the resin sheet. Further, the contact angle W 0 of the water can be measured by the method described in Examples.
  • the average micropore diameter of the micropores formed on the holding surface is preferably 0.1 to 5.0 ⁇ m, more preferably 0.2 to 4.0 ⁇ m, and still more preferably 0.5 to 2.0 ⁇ m. is there.
  • the average fine pore diameter is less than 0.1 ⁇ m, the adsorptivity is higher, and the removability tends to be deteriorated.
  • the average fine pore diameter is more than 5.0 ⁇ m, although the releasability is good, the adsorptive power tends to be further reduced.
  • the average fine pore diameter can be measured by the method described in the examples.
  • the micropore area of the micropores formed in the holding surface is preferably 5.0 ⁇ 10 4 to 5.0 ⁇ 10 6 ⁇ m 2 , and more preferably 5.0 ⁇ 10 4 to 1 ⁇ 2 for the holding surface. It is 3.0 ⁇ 10 6 ⁇ m 2 . If the micropore area is less than 5.0 ⁇ 10 4 ⁇ m 2 , the adsorptive power tends to be too high, and the removability tends to deteriorate. When the micropore area is more than 5.0 ⁇ 10 6 ⁇ m 2 , although the releasability is good, the adsorptive power tends to be too low. Furthermore, the micropores are easily transferred to the surface of the object to be polished, and the flatness of the object to be polished is easily deteriorated. The micropore area can be measured by the method described in the examples.
  • resins such as polyurethane and polyurethane polyurea; acrylic resins such as polyacrylate and polyacrylonitrile; vinyl resins such as polyvinyl chloride, polyvinyl acetate and polyvinylidene fluoride; polysulfone, poly Polysulfone resins such as ether sulfone; Acylated cellulose resins such as acetylated cellulose and butyrylated cellulose; polyamide resins; and polystyrene resins.
  • polyurethane resins such as polyurethane and polyurethane polyurea
  • acrylic resins such as polyacrylate and polyacrylonitrile
  • vinyl resins such as polyvinyl chloride, polyvinyl acetate and polyvinylidene fluoride
  • polysulfone poly Polysulfone resins such as ether sulfone
  • Acylated cellulose resins such as acetylated cellulose and butyrylated cellulose
  • polyamide resins and
  • wet coagulation a resin solution in which a resin is dissolved is used as a coating, and this is immersed in a bath of a coagulation liquid (which is a poor solvent for the resin) in a resin solution impregnated. It solidifies and regenerates the resin. By replacing the solvent in the resin solution with the coagulating liquid, the resin in the resin solution is coagulated and coagulated.
  • the resin constituting the resin sheet is preferably soluble in one or more selected from the group consisting of N, N-dimethylformaldehyde, dimethylacetamide, methyl ethyl ketone and dimethyl sulfoxide.
  • polyurethane resins are preferable. Although it does not specifically limit as polyurethane-type resin, For example, polyester-type polyurethane resin, polyether-type polyurethane resin, and polycarbonate-type polyurethane resin are mentioned. Such a polyurethane-based resin has low affinity to water but does not have water repellency, and by adding a water repellent, it has water repellency. For this reason, the water repellency of a resin sheet can be adjusted by adjusting the number of addition parts of the water repellent in the solution preparation process mentioned later, and the penetration speed of ethanol is also affected.
  • the breaking strength of the non-foamed resin sheet obtained by dissolving the resin sheet with N, N-dimethylformamide and drying the obtained solution is preferably 30 MPa or more, more preferably 40 MPa or more, and still more preferably 50 MPa or more.
  • the breaking strength of the non-foamed resin sheet is 30 MPa or more, breakage of the resin sheet due to the stress of the polishing process tends to be further suppressed.
  • a resin sheet does not fracture
  • the breaking strength of the non-foamed resin sheet can be adjusted by the selection of the resin type. In addition, the breaking strength of the non-foamed resin sheet can be measured by the method described in the examples.
  • the 100% modulus of the resin constituting the resin sheet is preferably 3.0 to 10 MPa, more preferably 3.5 to 9.0 MPa, and still more preferably 4.0 to 8.0 MPa.
  • the 100% modulus of the resin constituting the resin sheet is 3.0 MPa or more, the phenomenon in which the object to be polished sinks on the holding surface due to the stress of the polishing step is suppressed.
  • the corners of the object to be polished come into contact with the holding surface to form a scratch, and the slurry infiltrates from the portion of the scratch, making it difficult to cause the phenomenon that the holding pad is chemically degraded or damaged.
  • 100% modulus of the resin constituting the resin sheet is 10 MPa or less, the adsorption force is improved, the object to be polished is appropriately held in the polishing step, and the cushioning property of the resin sheet is improved. As a result, as a result of being able to appropriately absorb excessive polishing load that may be locally generated in the polishing step, the flatness of the obtained object to be polished tends to be further improved.
  • 100% modulus of resin which comprises a resin sheet can be adjusted by selection of resin kind.
  • 100% modulus of resin which comprises a resin sheet can be measured by the method as described in an Example.
  • “100% modulus” is an index showing the hardness of resin, and it means that it is hard resin, so that this value becomes large.
  • the resin sheet preferably contains a water repellent.
  • the water repellent agent is not particularly limited.
  • PTFE polytetrafluoroethylene
  • FEP tetrafluoroethylene-hexafluoropropylene copolymer
  • PFA tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer
  • silicone-based water repellents and polyolefin-based water repellents may be mentioned.
  • fluorine-based water repellents are preferable, and fluorine-based water repellents having a C 6-8 perfluoroalkyl group are more preferable.
  • the water repellent may be used alone or in combination of two or more.
  • the fluorine-based water repellent having a perfluoroalkyl group having 6 to 8 carbon atoms is not particularly limited, and examples thereof include a compound represented by the following formula (2) and a resin modified with a perfluoroalkyl group. . Rf-R-X (2)
  • R f represents a perfluoroalkyl group, and the carbon number thereof is 3 to 8, preferably 4 to 8, more preferably 6 to 8, and still more preferably 6.
  • R represents an alkylene group, and the carbon number thereof is 2 to 6, preferably 2 to 4, and more preferably 2.
  • one having 6 carbon atoms in Rf is preferable, and one having 2 carbon atoms in R is more preferable.
  • the compound represented by Formula (2) may be synthesize
  • Commercially available products include, for example, Asahi Guard E series (trade name of AGC Seimi Chemical Co., Ltd.), NK Guard S series (trade name of Nikka Chemical Co., Ltd.), Unidyne series (trade name of Daikin Industries, Ltd.), Klisson Aassister (trade name of DIC Corporation) and the like.
  • the resin modified with a perfluoroalkyl group is not particularly limited, but for example, a polyurethane resin modified with a perfluoroalkyl group can be mentioned from the viewpoint of the dispersibility of the water repellent in the resin sheet and the temporal stability. .
  • reformation method the method of introduce
  • a resin modified by the compound represented by the formula (2) that is, a resin having a group represented by Rf-R- is preferable.
  • polyurethane resins having a group represented by Rf-R- are more preferable.
  • Such resins include, for example, the polyurethane resins described in WO 2012/172936.
  • the content of the water repellent is preferably 0.5 to 5.0% by mass, more preferably 0.5 to 4.0% by mass, still more preferably 0. It is 5 to 3.0% by mass.
  • the content of the water repellent is 0.5% by mass or more, the permeation rate of ethanol is slowed to improve the adsorptive power, and the lateral displacement is suppressed, and the penetration of the slurry is suppressed, and the durability of the holding pad is thereby improved. Improve more.
  • the content of the water repellent agent is 5.0% by mass or less, the permeation rate of ethanol can be increased, the adsorptive power can be reduced, and the releasability can be favorably maintained.
  • the resin sheet may contain a pore forming agent as described later.
  • the pore-forming agent is not particularly limited, and examples thereof include cellulose-based compounds such as cellulose acetate butyrate.
  • the pore forming agent may be used alone or in combination of two or more.
  • the holding pad of this embodiment may contain various additives which may be contained in the holding pad according to the purpose other than the above.
  • additives are not particularly limited, and include, for example, pigments or fillers such as carbon black, hydrophilic additives, and hydrophobic additives.
  • the hydrophilic additive is not particularly limited, but, for example, an anionic surfactant such as sodium lauryl sulfate, carboxylate, sulfonate, sulfate, phosphate ester; hydrophilic ester compound, ether Nonionic surfactants such as compounds, ester / ether compounds and amide compounds may be mentioned.
  • the hydrophobic additive is not particularly limited, but, for example, polyoxyethylene alkyl ether, polyoxypropylene alkyl ether, polyoxyethylene polyoxypropylene alkyl ether, perfluoroalkyl ethylene oxide adduct, glycerin fatty acid ester, propylene
  • the nonionic surfactant which the C3-C3 or more alkyl chain added like glycol fatty acid ester is mentioned.
  • the thickness of the resin sheet is not particularly limited, but is preferably 3.0 mm or less, and more preferably, in order to suppress that the object to be polished sinks into the resin sheet during the polishing step and the processing accuracy is reduced. It is 2.0 mm or less, more preferably 1.0 mm or less.
  • the lower limit of the thickness of the resin sheet is not particularly limited, but is preferably 300 ⁇ m or more. When the thickness of the resin sheet is in the above range, the thickness accuracy tends to be sufficiently secured. The thickness is measured in accordance with Japanese Industrial Standard (JIS K 6505).
  • the holding pad of the present embodiment may have a frame portion surrounding the object to be polished on the holding surface, or may not have the frame portion.
  • the frame portion prevents the object to be polished from being laterally shifted during polishing and prevents the object from jumping out of the holding surface (regulating the lateral displacement range). If lateral displacement does not easily occur, such as when the weight of the object to be polished is relatively large, the frame may not be provided. However, if such lateral displacement can occur, the shape and size of the frame may be The material is not particularly limited as long as it does not protrude from the polishing region, and for example, the inner diameter may be formed to be larger than the outer diameter of the object to be polished.
  • the holding pad of this embodiment may be provided with a cushion layer made of a foamed resin on the surface opposite to the holding surface for holding an object to be polished, or may not be provided with the cushion layer.
  • the holding pad of the present embodiment may have a fixing means of an adhesive layer or adhesive layer such as a double-sided tape or a surface fastener for fixing the holding pad to the holding platen on the surface of the holding platen side. .
  • the manufacturing method of the holding pad according to the present embodiment includes a solution preparing step of preparing a resin solution by mixing and dissolving a resin in a solvent, a coating forming step of forming a coating of the resin solution, and a coating of resin. It has the immersion process which is immersed in the solidification liquid which is a poor solvent, and produces a resin sheet, and the hole formation process which forms a fine hole in the surface of a resin sheet.
  • the solution preparation step is a step of mixing and dissolving the resin in a solvent to prepare a resin solution. Under the present circumstances, you may use the said pore formation agent, a water repellent, and another component as additives other than resin and a solvent.
  • the resin, the water repellent agent, and the pore forming agent are not particularly limited, and examples thereof include the same as described above.
  • the concentration of the resin is preferably 10 to 50% by mass, more preferably 15 to 35% by mass.
  • the solvent is not particularly limited, for example, N, N-dimethylformamide (DMF), N, N-dimethylacetamide (DMA C), methyl ethyl ketone (MEK) and dimethyl sulfoxide (DMSO).
  • the solvent may be a single solvent or a mixture of two or more solvents.
  • the coating film forming step is a step of forming a coating film of a resin solution.
  • the method of forming the coating film is not particularly limited, and for example, a method of applying a resin solution to the surface of a film-forming substrate using a coating apparatus such as a knife coater may be mentioned.
  • the thickness of the resin solution applied at this time may be appropriately adjusted so that the thickness of the resin sheet 112 finally obtained becomes a desired thickness.
  • limit especially as a material of the base material for film formation For example, resin films, such as a PET film, a fabric, and a nonwoven fabric are mentioned.
  • the immersing step is a step of immersing the coating film in a coagulating solution which is a poor solvent for resin to produce a resin sheet.
  • a coagulating solution which is a poor solvent for resin to produce a resin sheet.
  • the poor solvent those known in the prior art can be used, and it is not particularly limited, and examples thereof include water.
  • the poor solvent may be a single solvent or a mixture of two or more solvents.
  • the coagulating liquid may contain a polar solvent in the resin solution from the viewpoint of adjusting the regeneration rate of the resin. Further, the temperature of the coagulating liquid is not particularly limited as long as it can solidify the resin.
  • a film skin layer
  • innumerable minute micropores are formed in the resin in the immediate vicinity of the film.
  • the phenomenon in which the solvent contained in the coating of the resin solution diffuses into the coagulating liquid and the phenomenon in which the poor solvent penetrates from the coagulating liquid into the coating occurs in a coordinated manner.
  • a resin sheet having an open cell structure is obtained inside the coating film.
  • the substrate for film formation is a material which does not easily permeate the liquid (for example, a PET film)
  • the coagulating liquid does not permeate the substrate, and therefore, the solvent in the coating film is replaced with the poor solvent from the skin layer.
  • larger vacancies tend to be formed in the region that is inside rather than near the skin layer.
  • the resin solution contains a pore forming agent, the tip of the micropores will communicate to the surface, and micropores will be formed on the surface.
  • the obtained resin sheet for a washing
  • the resin sheet is washed in a washing solution such as water to remove the solvent such as DMF remaining in the resin sheet. Thereafter, the resin sheet may be dried in a dryer.
  • the hole forming step is not particularly limited as long as fine holes can be formed on the surface of the resin sheet, but a method of forming the fine holes by forming the fine holes by adding a hole forming agent to the resin solution or stretching the resin sheet Etc. In addition, when adding a hole formation agent, an immersion process and a hole formation process are performed simultaneously.
  • the stretch ratio of the resin sheet is 105 to 300% (meaning 1.05 times to 3 times the length of the original length), more preferably 120. It is ⁇ 250%.
  • a drawing rate is less than 105%, a micropore is not formed appropriately but it becomes easy to be broken when a drawing rate of a resin sheet is over 300%. Unfavorable.
  • the method of manufacturing a polished object of the present embodiment has a polishing step of polishing the workpiece held by the holding pad using a polishing pad.
  • the polishing process may be primary polishing (rough polishing), secondary polishing (finish polishing), or both of them.
  • polishing material of this embodiment is demonstrated to an example for chemical mechanical polishing, the manufacturing method of the grinding
  • maintenance pad 10 of this embodiment is shown.
  • the holding pad 10 is fixed on the holding surface plate 1 of the polishing machine to hold the object W to be polished.
  • the polishing liquid is supplied while holding the workpiece W on the holding surface of the holding pad 10, and the polishing pad 2 mounted on the polishing platen 3 of the polishing apparatus is pressed against the workpiece W and rotated. By doing this, the object to be polished W can be polished.
  • the method for fixing the holding pad 10 to the holding surface plate 1 is not particularly limited. However, when the holding pad 10 is provided with a double-sided tape, the release paper of the double-sided tape is removed and the holding surface is an exposed adhesive layer. Adhesively fix to the holding surface plate 1 so as to face upward. When the holding pad 10 is not provided with the double-sided tape, the holding pad 10 may be adhered and fixed to the holding surface plate 1 with an adhesive or an adhesive prepared separately.
  • the object to be polished W is held on the holding surface by including the appropriate amount of water on the holding surface of the holding pad 10 and pressing the object to be polished W. At this time, the object to be polished W is held such that the surface to be polished (processed surface) of the object to be polished W faces upward.
  • the polishing pad 2 (abrasive cloth) is mounted on the surface of the polishing platen 3 disposed so as to face the holding platen 1 above the holding platen 1 so that the polishing surface is directed downward.
  • the polishing platen 1 is lowered and moved to the holding platen 3 so that the surface to be polished of the workpiece W contacts the polishing surface of the polishing pad 2.
  • a slurry is supplied between the object to be polished W and the polishing pad 2.
  • the slurry may be water, chemical components such as an oxidant represented by hydrogen peroxide, additives, abrasive grains (abrasive particles; for example, SiC, SiO 2 , Al 2 O 3 , etc.) depending on the object to be polished and polishing conditions, etc. , CeO 2 ), etc., and the slurry may be supplied while circulating.
  • the work surface of the workpiece W is rotated by relatively rotating the holding platen 1 and the polishing platen 3 while pressing the workpiece W on the holding platen 1 with the polishing pad 2.
  • the polishing pad 2 is polished by chemical mechanical polishing (CMP).
  • CMP chemical mechanical polishing
  • the holding surface plate 1 and the polishing surface plate 3 may rotate in the same direction at different rotational speeds, or may rotate in different directions.
  • the object to be polished is not particularly limited, but, for example, thin substrates such as glass substrates for liquid crystal displays, materials such as semiconductor devices and electronic components, particularly Si substrates (silicon wafers), SiC (silicon carbide) substrates, GaAs (Gallium arsenide) substrate.
  • the polishing process can be suitably performed with a size (3130 mm ⁇ 2880 mm) called G10 and a thickness of 0.3 to 0.7 mm.
  • the resin sheet was dissolved in N, N-dimethylformamide, and the resulting solution was dried to obtain a non-foamed resin sheet (test piece).
  • the resulting resin sheet is punched into a dumbbell shape (JIS K 6550 described), the measurement sample is sandwiched by the upper and lower air chucks of the measuring machine, the measurement is started at a tension speed of 100 mm / min and the initial gripping interval of 50 mm. The value reached when cutting) was obtained as the strength (maximum load).
  • the sample thickness was measured using a thickness gauge when mounting the measurement sample on a chuck.
  • the breaking strength was measured by a method based on Japanese Industrial Standard (JIS K 6550) using a tensile universal tester (“Tensilon”, manufactured by A & D, RTC-1210A).
  • Example 1 47 parts by mass of DMF, 0.6 parts by mass of water repellent (solid content: 60% by mass) with respect to 100 parts by mass of a 30% DMF solution of polyester-based polyurethane resin (breaking strength: 55 MPa, 100% modulus: 6.0 MPa) 0.2 parts by mass of a pore forming agent (cellulose acetate butyrate) was added and mixed and stirred to prepare a resin solution. Next, a PET film was prepared as a substrate for film formation, and the above resin solution was applied thereto using a knife coater to obtain a coating film having a thickness of 1.0 mm.
  • a pore forming agent cellulose acetate butyrate
  • the obtained coating film was immersed in water, which is a coagulating liquid, together with the substrate for film formation, to coagulate and regenerate the resin, to obtain a resin sheet.
  • the resin sheet was taken out of the coagulation bath, and the substrate for film formation was peeled off from the resin sheet, and then the resin sheet was immersed in a cleaning liquid composed of water to remove DMF which is a solvent. Thereafter, the resin sheet was wound while being dried.
  • the back surface of the resin sheet (the surface on the side from which the substrate for film formation was peeled off and the surface that was in contact with the film formation substrate) was subjected to buff treatment to obtain a thickness of 0.8 mm. .
  • a double-sided tape was attached to the buffed side of the resin sheet to obtain a holding pad.
  • Example 2 A resin sheet was produced without using a pore forming agent, and a resin sheet was produced in the same manner as in Example 1 except that the obtained resin sheet was stretched by 120% in the width direction, to obtain a holding pad.
  • Example 3 A resin sheet was produced without using a pore forming agent, and a resin sheet was produced in the same manner as in Example 1 except that the obtained resin sheet was stretched 250% in the width direction, to obtain a holding pad.
  • Comparative Example 1 A resin sheet was produced in the same manner as in Example 1 except that the resin sheet was produced without using a pore forming agent and the obtained resin sheet was tried to be stretched by 310% in the width direction. On the other hand, the resin sheet was broken and a holding pad could not be obtained.
  • Comparative Example 2 A holding pad was obtained in the same manner as in Example 1 except that a resin sheet was produced without using a pore forming agent.
  • Comparative Example 3 After producing the holding pad in the same manner as in Comparative Example 2, pores (diameter 0.4 mm, interval 3 mm, depth 0.8 mm) were formed from the holding surface using a sewing needle.
  • Comparative Example 4 After the resin sheet is produced in the same manner as in Comparative Example 2, the holding surface side is also subjected to buffing, and a resin sheet is produced in the same manner as in Comparative Example 1 except that pores derived from open cells are formed in the holding surface. I got a holding pad.
  • the contact angle of ethanol was measured as follows for the holding pad. Using a solid-liquid interface analyzer (trade name "DropMaster 500" manufactured by Kyowa Interface Science Co., Ltd.) as a contact angle meter, 1 drop (concentration: 99%) of ethanol (concentration: 99%) under the conditions of temperature 20 ° C and humidity 60%. 5 ⁇ L) was dropped onto the holding surface of the holding pad. Then, the contact angle immediately after dropping was C 0 , and the contact angle after 20 seconds was C 20, and the permeation rate of ethanol was calculated by the following equation (1).
  • FIG. 4 is a graph showing the change of the contact angle of ethanol with respect to time in Examples 2 to 3 and Comparative Example 1.
  • the contact angle of water was measured as follows for the holding pad. Using a solid-liquid interface analyzer (trade name "DropMaster 500" manufactured by Kyowa Interface Science Co., Ltd.) as a contact angle meter, hold 1 drop (1 ⁇ L) of water droplets from an injection needle under the conditions of temperature 20 ° C and humidity 60% It dripped on the holding surface, and measured the contact angle immediately after dripping. In Comparative Example 4 in which the holding surface was buffed, it permeated into the holding pad simultaneously with the dropping of water, and water did not adhere on the holding surface, so that the contact angle could not be measured.
  • a solid-liquid interface analyzer trade name "DropMaster 500" manufactured by Kyowa Interface Science Co., Ltd.
  • the average fine pore size ( ⁇ m) and the micropore area per 1 cm 2 ( ⁇ m 2 ) were measured by enlarging the range of about 100 ⁇ m by 1000 times with a scanning electron microscope (JSM-5500 LV manufactured by JEOL Ltd.) 9 I observed it. This image is binarized using image processing software (Image Analyzer V20LAB Ver.1.3, manufactured by Nikon), the number of micropores (number of bubbles) is confirmed, and the area of each micropore (bubble) is equivalent to the area circle The diameter and its average value were calculated as the average fine pore diameter. Then, from the ratio of the area of the micropores, the micropore area per 1 cm 2 was determined.
  • the cutoff value (lower limit) of the bubble diameter was not set. Further, in Comparative Examples 1 and 3, no micropores were observed. Although micropores were not confirmed in Comparative Example 3 in which pores were formed in the holding surface and Comparative Example 4 in which the holding surface was subjected to buffing, openings derived from the pores and buffing were confirmed. The The average diameter of the identified openings and the area per 1 cm 2 were calculated as reference values (indicated by * 2 in the table).
  • Adhesive force Water was sprayed by spraying onto the holding surface of the holding pad processed into a 100 mm square sample, and a glass of 60 mm diameter (about 1 mm in thickness) was pressed against the sample and absorbed without wiping off the attached water. Next, a 10 kg weight was placed on the glass and rested for 1 minute. With the weight placed, the wire attached to the glass was pulled in the vertical direction at a speed of 100 mm / min with a universal tensile tester (“Tensilon”, manufactured by A & D, RTC-1210A), and the load peak value was measured. Furthermore, the measurement of the load peak value was repeated five times, and the average of the load peak values of six times in total was taken as the adsorption force. (Evaluation criteria) ⁇ : Adsorption force is 5 kgf or more and 25 kgf or less ⁇ : Adsorption force is less than 5 kgf or more than 25 kgf
  • FIG. 5 shows a micrograph of the surface of the holding surface of Examples 2 to 3 and Comparative Example 2.
  • C 0 Contact angle of ethanol to holding surface immediately after dropping ethanol
  • C 20 Contact angle of ethanol to holding surface 20 seconds after dropping of ethanol (C 0 -C 20 ) / 20: permeation rate of ethanol (degree / Second)
  • W 0 Contact angle of water with respect to the holding surface immediately after dropping water on the holding surface * 1: Reference value determined by the formula of (C 0 -Ct) / t * 2: Average of openings from pores and buffing Diameter and area
  • the holding pad of the present embodiment has industrial applicability as a holding pad of an object to be polished in the field of polishing processing.

Abstract

A holding pad comprising a resin sheet which has a holding surface for holding an object to be polished, wherein the penetration speed, expressed in formula (1), of ethanol into the holding surface is 1.0 to 2.0 deg/s. (1): penetration speed = (C0-C20)/20. C0 is the contact angle of ethanol in relation to the holding surface immediately after a droplet of ethanol has fallen onto the holding surface, and C20 is the contact angle of ethanol in relation to the holding surface 20 seconds after the droplet of ethanol has fallen.

Description

保持パッド及びその製造方法Holding pad and method of manufacturing the same
　本発明は、保持パッド及びその製造方法に関する。 The present invention relates to a holding pad and a method of manufacturing the same.
　近年、液晶ディスプレイ用等に用いるガラス基板は厚みの高精度化や薄膜化が進んでいる。このような被研磨物を研磨加工する際には、保持パッドで被研磨物を保持し、研磨パッドによって研磨することで行われるが、保持パッドは研磨加工時に被研磨物に横ずれが生じないよう保持パッドの吸着力は高いことが望ましいとされる。しかし、一方で、このような被研磨物を研磨加工に供する場合、保持パッドの吸着力が高すぎると研磨加工後に被研磨物を保持パッドから剥離する際に割れが生じやすくなるという問題が生じる。この剥離の際の割れの問題は、ガラス基板などの被研磨物の薄膜化に加え更に大型化によってもより深刻なものとなっている。 In recent years, with regard to glass substrates used for liquid crystal displays and the like, thickness precision and thickness reduction have been advanced. When such an object to be polished is polished, the object to be polished is held by the holding pad and polished by the polishing pad, but the holding pad does not cause lateral displacement in the object to be polished at the time of polishing It is desirable that the adsorptive power of the holding pad be high. However, on the other hand, when such an object to be polished is subjected to polishing, if the adsorption force of the holding pad is too high, there is a problem that cracking tends to occur when the object to be polished is peeled off from the holding pad after polishing. . The problem of cracking at the time of exfoliation is becoming more serious as well as the film thickness of the object to be polished such as a glass substrate is further increased.
　このような被研磨物の割れを抑制するためには、保持パッドの吸着力を抑えるような調整をすることが有効である。例えば、特許文献１には、保持パッド表面上に凹部を設け、被研磨物の保持性を確保しつつ、研磨後の剥離性をコントロールすることが開示されている。また、特許文献２には、多孔質軟質樹脂からなる保持パッド表面上に０．１～１．０ｍｍの細孔を所定の間隔で設けることにより、研磨後のガラス基板の剥離性を改善することが開示されている。 In order to suppress such cracking of the object to be polished, it is effective to perform adjustment so as to suppress the adsorption force of the holding pad. For example, Patent Document 1 discloses that a recess is provided on the surface of a holding pad to control the removability after polishing while securing the retainability of an object to be polished. Further, Patent Document 2 discloses that the removability of a glass substrate after polishing is improved by providing pores of 0.1 to 1.0 mm at predetermined intervals on the surface of a holding pad made of porous soft resin. Is disclosed.
特開２０１３－１０７１３７号公報JP, 2013-107137, A 特開２００４－１５４９２０号公報JP 2004-154920 A
　しかしながら、特許文献１に記載の方法では、保持パッドの保持面に形成された凹部が研磨加工時の研磨圧により被研磨物の表面に転写され、結果として得られる被研磨物の平坦性が悪化するという問題がある。 However, in the method described in Patent Document 1, the recess formed on the holding surface of the holding pad is transferred to the surface of the object to be polished by the polishing pressure during polishing, and the flatness of the resulting object to be polished is deteriorated. Have the problem of
　また、特許文献２に記載の方法においては、保持パッドの保持面に設けられた細孔から、多孔質軟質樹脂からなる保持パッド内にスラリーが浸入しやすく、スラリーの浸入により保持パッドが化学的に劣化・膨潤・破損を誘発するという問題がある。 Further, in the method described in Patent Document 2, the slurry easily infiltrates into the holding pad made of porous soft resin from the pores provided on the holding surface of the holding pad, and the holding pad is chemically modified by the permeation of the slurry. There is a problem of inducing deterioration, swelling and breakage in the
　本発明は、上記問題点に鑑みてなされたものであって、研磨時の横ずれなどが生じないように吸着力を発揮できる一方で、被研磨物を剥離する際において割れを抑制することができ、特に薄膜化及び大型化された被研磨物を保持するのに好適な保持パッド及びその製造方法を提供することを目的とする。 The present invention has been made in view of the above problems, and can exert an adsorptive force so as not to cause lateral displacement during polishing, but can suppress cracking when peeling an object to be polished. In particular, it is an object of the present invention to provide a holding pad suitable for holding a thin and large-sized object to be polished and a method of manufacturing the same.
　本発明者らは上記問題点を解決するために鋭意検討した。その結果、保持面が所定の浸透性を有することにより、上記課題を解決し得ることを見出して、本発明を完成するに至った。 The present inventors diligently studied to solve the above problems. As a result, it has been found that the problem can be solved by the holding surface having predetermined permeability, and the present invention has been completed.
　すなわち、本発明は以下のとおりである。
〔１〕
　被研磨物を保持するための保持面を有する樹脂シートを備える保持パッドであって、
　下記式（１）で表されるエタノールの前記保持面への浸透速度が、１．０～２．０度／秒である、
　保持パッド。
　浸透速度＝（Ｃ０－Ｃ２０）／２０　　　・・・　（１）
　Ｃ０：前記保持面にエタノールを滴下した直後の前記保持面に対する前記エタノールの接触角
　Ｃ２０：前記エタノールの滴下から２０秒後の前記保持面に対する前記エタノールの前記接触角
〔２〕
　前記保持面に水を滴下し、前記水の滴下直後の前記保持面に対する前記水の接触角Ｗ０が、１００～１５０度である、
　〔１〕に記載の保持パッド。
〔３〕
　前記保持面に形成された微細孔の平均微細孔径が、０．１～５．０μｍである、
　〔１〕又は〔２〕に記載の保持パッド。
〔４〕
　前記保持面に形成された微細孔の微細孔面積が、保持面１ｃｍ２当たり、５．０×１０４～５．０×１０６μｍ２である、
　〔１〕～〔３〕のいずれか１項に記載の保持パッド。
〔５〕
　前記樹脂シートをＮ，Ｎ－ジメチルホルムアミドで溶解し、得られた溶解液を乾燥させて得られる無発泡樹脂シートの破断強度が、３０ＭＰａ以上である、
　〔１〕～〔４〕のいずれか１項に記載の保持パッド。
〔６〕
　前記樹脂シートを構成する樹脂の１００％モジュラスが、３．０～１０ＭＰａである、
　〔１〕～〔５〕のいずれか１項に記載の保持パッド。
〔７〕
　前記樹脂シートが、ポリウレタン系樹脂を含有する、
　〔１〕～〔６〕のいずれか１項に記載の保持パッド。
〔８〕
　前記樹脂シートが、ポリウレタン樹脂シートを延伸したものである、
　〔１〕～〔７〕のいずれか１項に記載の保持パッド。
〔９〕
　前記樹脂シートが、撥水剤を含有する、
　〔１〕～〔８〕のいずれか１項に記載の保持パッド。
〔１０〕
　前記撥水剤が、炭素数が６～８のパーフルオロアルキル基を有するフッ素系撥水剤を含む、
　〔９〕に記載の保持パッド。
〔１１〕
　前記撥水剤の含有量が、前記樹脂シートの総量に対して、０．５～５．０質量％である、
　〔９〕又は〔１０〕に記載の保持パッド。
〔１２〕
　樹脂を溶媒中に混合溶解して樹脂溶液を調製する溶液調製工程と、
　前記樹脂溶液の塗膜を形成する塗膜形成工程と、
　前記塗膜を、前記樹脂の貧溶媒である凝固液に浸漬して、樹脂シートを作製する浸漬工程と、
　前記樹脂シートを延伸して、該樹脂シートの表面に微細孔を形成する孔形成工程と、を有する、
　保持パッドの製造方法。
〔１３〕
　前記樹脂が、ポリウレタン系樹脂を含む、
　〔１２〕に記載の保持パッドの製造方法。 That is, the present invention is as follows.
[1]
A holding pad comprising a resin sheet having a holding surface for holding an object to be polished, the holding pad comprising:
The permeation rate of ethanol to the holding surface represented by the following formula (1) is 1.0 to 2.0 degrees / second.
Holding pad.
Penetration rate = (C 0 -C 20) / 20 ··· (1)
C 0 : contact angle of the ethanol with respect to the holding surface immediately after dropping the ethanol onto the holding surface C 20 : contact angle of the ethanol with the holding surface after 20 seconds from the dropping of the ethanol [2]
Water is dropped on the holding surface, and a contact angle W 0 of the water with respect to the holding surface immediately after the dropping of the water is 100 to 150 degrees.
The holding pad as described in [1].
[3]
The average micropore diameter of the micropores formed in the holding surface is 0.1 to 5.0 μm,
The holding pad as described in [1] or [2].
[4]
The micropore area of the micropores formed in the holding surface is 5.0 × 10 4 to 5.0 × 10 6 μm 2 per 1 cm 2 of the holding surface.
The holding pad according to any one of [1] to [3].
[5]
The breaking strength of the non-foamed resin sheet obtained by dissolving the resin sheet with N, N-dimethylformamide and drying the obtained solution is 30 MPa or more.
The holding pad according to any one of [1] to [4].
[6]
The 100% modulus of the resin constituting the resin sheet is 3.0 to 10 MPa,
The holding pad according to any one of [1] to [5].
[7]
The resin sheet contains a polyurethane resin,
The holding pad according to any one of [1] to [6].
[8]
The resin sheet is obtained by stretching a polyurethane resin sheet,
The holding pad according to any one of [1] to [7].
[9]
The resin sheet contains a water repellent,
The holding pad according to any one of [1] to [8].
[10]
The water repellent includes a fluorine-based water repellent having a C 6-8 perfluoroalkyl group.
The holding pad as described in [9].
[11]
The content of the water repellent agent is 0.5 to 5.0% by mass with respect to the total amount of the resin sheet.
The holding pad as described in [9] or [10].
[12]
A solution preparing step of preparing a resin solution by mixing and dissolving the resin in a solvent;
A coating film forming step of forming a coating film of the resin solution;
An immersing step of immersing the coating film in a coagulating solution which is a poor solvent for the resin to prepare a resin sheet;
Forming a fine hole on the surface of the resin sheet by stretching the resin sheet;
Method of manufacturing holding pad.
[13]
The resin includes a polyurethane resin,
The manufacturing method of the holding pad as described in [12].
　本発明によれば、研磨時の横ずれなどが生じないように吸着力を発揮できる一方で、被研磨物を剥離する際において割れを抑制することができ、特に薄膜化及び大型化された被研磨物を保持するのに好適な保持パッド及びその製造方法を提供することができる。 According to the present invention, while it is possible to exert an adsorptive force so as not to cause lateral displacement during polishing, it is possible to suppress cracking when peeling an object to be polished, and in particular to thin the film and increase its size. A holding pad suitable for holding an object and a method of manufacturing the same can be provided.
本実施形態の保持パッドの一態様を表す概略断面図である。It is a schematic sectional drawing showing the one aspect | mode of the holding pad of this embodiment. 本実施形態の保持パッドを用いて被研磨物の研磨を行う方法を示す模式図である。It is a schematic diagram which shows the method of grind | polishing a to-be-polished thing using the holding pad of this embodiment. エタノールの浸透速度の測定方法を表す模式図である。It is a schematic diagram showing the measuring method of the permeation rate of ethanol. 実施例２～３と比較例２の時間ごとのエタノールの接触角の変化を示すグラフを示す。The graph which shows the change of the contact angle of ethanol with time of Example 2-3 and the comparative example 2 is shown. 実施例２～３と比較例２の保持面の表面の顕微鏡写真を示す。The microscope picture of the surface of the holding surface of Examples 2-3 and the comparative example 2 is shown.
　以下、本発明の実施の形態（以下、「本実施形態」という。）について詳細に説明するが、本発明はこれに限定されるものではなく、その要旨を逸脱しない範囲で様々な変形が可能である。 Hereinafter, the embodiment of the present invention (hereinafter referred to as "the present embodiment") will be described in detail, but the present invention is not limited to this, and various modifications can be made without departing from the scope of the invention. It is.
〔保持パッド〕
　本実施形態の保持パッドは、被研磨物を保持するための保持面を有する樹脂シートを備える保持パッドであって、下記式（１）で表されるエタノールの保持面への浸透速度（以下、単に「エタノールの浸透速度」ともいう。）が、１．０～２．０度／秒である。
　浸透速度＝（Ｃ０－Ｃ２０）／２０　　　・・・　（１）
　Ｃ０：保持面にエタノールを滴下した直後の保持面に対するエタノールの接触角
　Ｃ２０：エタノールの滴下から２０秒後の保持面に対するエタノールの接触角 [Holding pad]
The holding pad of the present embodiment is a holding pad provided with a resin sheet having a holding surface for holding an object to be polished, and the permeation rate of ethanol to the holding surface represented by the following formula (1) (hereinafter referred to as Simply referred to as "the permeation rate of ethanol") is 1.0 to 2.0 degrees / second.
Penetration rate = (C 0 -C 20) / 20 ··· (1)
C 0 : Contact angle of ethanol to the holding surface immediately after dropping ethanol onto the holding surface C 20 : contact angle of ethanol to the holding surface 20 seconds after dropping of ethanol
　図１に、本実施形態の保持パッドの一態様を表す概略断面図を示す。図１に示す保持パッド１０は、基材１１と、被研磨物Ｗを保持する保持面１２ａを有する樹脂シート１２と、基材１１と樹脂シート１２との間にこれらを接着するための接着層（図示せず）と、基材１１の樹脂シート１２側の面と反対面側に保持パッド１０を保持定盤に固定するために設けられた接着層１４と、を備える。 FIG. 1 is a schematic cross-sectional view showing one aspect of the holding pad of the present embodiment. The holding pad 10 shown in FIG. 1 is an adhesive layer for adhering the substrate 11, the resin sheet 12 having the holding surface 12 a for holding the workpiece W, and the substrate 11 and the resin sheet 12. (Not shown) and an adhesive layer 14 provided on the side opposite to the surface on the resin sheet 12 side of the base material 11 for fixing the holding pad 10 to the holding surface plate.
〔樹脂シート〕
　樹脂シートは、被研磨物を保持するための保持面を有する。本実施形態の保持パッドは、樹脂シートの保持面に適量の水を含ませて被研磨物を押し付けることで、保持面と被研磨物の表面との相互作用により被研磨物を保持することができる。樹脂シートの保持面は、被研磨物を保持しやすいように被研磨物よりやや大きく設計されていてもよい。さらに、保持面は、複数の被研磨物を同時に保持できるよう構成されていてもよい。 [Resin sheet]
The resin sheet has a holding surface for holding an object to be polished. The holding pad of the present embodiment holds the object to be polished by the interaction between the holding surface and the surface of the object to be polished by pressing the object to be polished by containing an appropriate amount of water on the holding surface of the resin sheet. it can. The holding surface of the resin sheet may be designed slightly larger than the object to be polished so as to easily hold the object to be polished. Furthermore, the holding surface may be configured to simultaneously hold a plurality of objects to be polished.
　樹脂シートは、表面には皮膜（スキン層）を備え、シートの内部には厚み方向に縦長の多数の気泡を備え、それらが連通した連続気泡構造を有する。縦長の多数の気泡は、樹脂シートの厚み方向に沿って、スキン層に向かって気泡径が漸次小さくなる形状である。スキン層には、後述するエタノールの浸透速度により評価することのできる微細孔が形成されたものであることが好ましい。 The resin sheet is provided with a film (skin layer) on the surface, and inside the sheet is provided with a large number of longitudinal bubbles in the thickness direction, and has an open cell structure in which they communicate with each other. A large number of vertically elongated cells have a shape in which the cell diameter gradually decreases toward the skin layer along the thickness direction of the resin sheet. It is preferable that the skin layer is formed with micropores that can be evaluated by the permeation rate of ethanol described later.
〔保持面〕
　保持面は、下記式（１）で表されるエタノールの浸透速度が、１．０～２．０度／秒であるものである。 [Holding surface]
In the holding surface, the permeation rate of ethanol represented by the following formula (1) is 1.0 to 2.0 degrees / second.
（エタノールの浸透速度）
　本実施形態において、保持面へのエタノールの浸透速度は、保持面にエタノールを滴下した直後の保持面に対するエタノールの接触角Ｃ０と、エタノールの滴下から２０秒後の保持面に対するエタノールの接触角Ｃ２０に基づいて、下記式（１）で示される。
　浸透速度＝（Ｃ０－Ｃ２０）／２０　　　・・・　（１） (Permeation rate of ethanol)
In the present embodiment, the permeation rate of ethanol to the holding surface is determined by the contact angle C 0 of ethanol with respect to the holding surface immediately after dropping ethanol onto the holding surface, and the contact angle of ethanol with respect to the holding surface 20 seconds after dropping ethanol. based on the C 20, represented by the following formula (1).
Penetration rate = (C 0 -C 20) / 20 ··· (1)
　このエタノールの浸透速度は、保持面の吸着力と剥離性のバランスを示す指標となる。樹脂シートは耐久性の観点より撥水性を有することが好ましい。しかし、撥水性を有すると保持面は水をはじき、浸透しないことから水によって微細孔の状態等を評価することができない。そこで、水の代わりにエタノールを用い、その保持面に対する浸透速度を測定することによって微細孔の状態や樹脂シートの水との親和性などを評価でき、それらから総合的な保持面の吸着力と剥離性のバランスを評価可能であることを発明者らは見出した。 The penetration rate of ethanol is an index indicating the balance between the adsorptive power and the releasability of the holding surface. It is preferable that the resin sheet has water repellency from the viewpoint of durability. However, if it has water repellency, the holding surface repels water and does not penetrate, so that it is not possible to evaluate the state of micropores and the like with water. Therefore, by using ethanol instead of water and measuring the permeation rate to its holding surface, it is possible to evaluate the state of fine pores and the affinity of resin sheet with water, etc. The inventors have found that the balance of peelability can be evaluated.
　具体的には、エタノールの浸透速度が遅いことは、保持面の微細孔が少ない又はないこと、及び樹脂シートの撥水性が高いことを示唆し、保持面の吸着力が高く、耐久性も高まるものの被研磨物が剥離しにくいことを示す。一方で、エタノールの浸透速度が速いことは、保持面に比較的に大きい微細孔が多数形成されていること、及び樹脂シートの撥水性が低いことを示唆し、研磨後の被研磨物の剥離性は良好であるものの、研磨工程中の吸着力が低下し、横ずれが生じやすいことを示す。また、エタノールの浸透速度が速いことは、スラリーが保持パットに浸入しやすいことともなり、スラリーの浸入により保持パッドの化学的な劣化や破損にもつながる。 Specifically, the fact that the permeation rate of ethanol is slow suggests that there are few or no micropores on the holding surface, and that the resin sheet has high water repellency, so that the adsorption power of the holding surface is high, and the durability is also enhanced. It shows that the material to be polished is difficult to peel off. On the other hand, the fact that the penetration rate of ethanol is fast suggests that a large number of relatively large micropores are formed in the holding surface, and that the water repellency of the resin sheet is low. Although the property is good, it shows that the adsorptive power during the polishing process is lowered and the lateral deviation is apt to occur. In addition, if the penetration speed of ethanol is high, the slurry may easily intrude into the holding pad, and the infiltration of the slurry may lead to chemical deterioration or breakage of the holding pad.
　このような観点から、本実施形態におけるエタノールの浸透速度は、１．０～２．０度／秒であり、好ましくは１．０～１．８度／秒であり、より好ましくは１．０～１．６度／秒である。エタノールの浸透速度が１．０度／秒未満であると、吸着力が高くなりすぎるため、被研磨物の剥離が困難となる。また、エタノールの浸透速度が２．０度／秒超過であると、吸着力が低下しすぎるために研磨中の被研磨物の横ずれなどの問題が生じる。 From such a viewpoint, the permeation rate of ethanol in the present embodiment is 1.0 to 2.0 degrees / second, preferably 1.0 to 1.8 degrees / second, and more preferably 1.0. It is -1.6 degrees / second. If the permeation rate of ethanol is less than 1.0 degree / second, the adsorptive power becomes too high, which makes it difficult to peel off the object to be polished. In addition, if the permeation rate of ethanol is more than 2.0 degrees / second, problems such as lateral displacement of an object to be polished during polishing may occur because the adsorption force is too low.
　エタノールの浸透速度は、保持面に形成される微細孔若しくはマトリックス材料の撥水性により調整することができる。表面に微細孔を形成する方法は問わないが、一例としては原反の作製において孔形成剤を添加することで微細孔の形成を促進する方法や、樹脂シートを延伸して微細孔を形成することも可能である。 The penetration rate of ethanol can be adjusted by the water repellency of the micropores or matrix material formed on the holding surface. There is no limitation on the method of forming micropores on the surface, but as an example, a method of promoting the formation of micropores by adding a pore forming agent in the preparation of a raw fabric, or stretching the resin sheet to form micropores It is also possible.
（水の接触角）
　保持面に水を滴下し、水の滴下直後の保持面に対する水の接触角Ｗ０は、好ましくは１００～１５０度であり、より好ましくは１００～１４０度であり、さらに好ましくは１００～１３０度である。水の接触角Ｗ０が１００度以上であることにより、樹脂シート表面の撥水性が高いことから、スラリーの侵入が抑制され、保持パッドの耐久性がより向上する傾向にある。また、スラリーの侵入に伴う保持パッドの膨潤も抑制される傾向にある。また、水の接触角Ｗ０が１５０度以下であることにより、保持面に水を用いて被研磨物を保持させる際に、保持面に厚い水膜が形成され難くなり、吸着力が安定する傾向にある。なお、水の接触角Ｗ０は、樹脂シートの表面の微細孔の制御及び樹脂溶液の調整において撥水剤を添加することにより調整することができる。また、水の接触角Ｗ０は、実施例に記載の方法により測定することができる。 (Water contact angle)
Water is dropped on the holding surface, and the contact angle W 0 of water to the holding surface immediately after the dropping of water is preferably 100 to 150 degrees, more preferably 100 to 140 degrees, and still more preferably 100 to 130 degrees. It is. By contact angle W 0 of the water is not less than 100 degrees, since the water repellency of the resin sheet surface is high, the slurry penetration is suppressed, the durability of the holding pad tends to be further improved. In addition, the swelling of the holding pad due to the penetration of the slurry tends to be suppressed. Further, the contact angle W 0 of the water is less than 150 degrees, when to hold the object to be polished by using a water retentive surface hardly thick water film is formed on the holding surface, the suction force is stabilized There is a tendency. The contact angle W 0 of the water can be adjusted by adding a water repellent in the control and adjustment of the resin solution of the fine pores on the surface of the resin sheet. Further, the contact angle W 0 of the water can be measured by the method described in Examples.
（平均微細孔径）
　保持面に形成された微細孔の平均微細孔径は、好ましくは０．１～５．０μｍであり、より好ましくは０．２～４．０μｍであり、さらに好ましくは０．５～２．０μｍである。平均微細孔径が０．１μｍ未満であることにより、吸着力がより高く、剥離性が悪化する傾向にある。また、平均微細孔径が５．０μｍ超過であることにより、剥離性は良好であるものの、吸着力がより低下する傾向にある。また、平均微細孔径は、実施例に記載の方法により測定することができる。 (Average fine pore size)
The average micropore diameter of the micropores formed on the holding surface is preferably 0.1 to 5.0 μm, more preferably 0.2 to 4.0 μm, and still more preferably 0.5 to 2.0 μm. is there. When the average fine pore diameter is less than 0.1 μm, the adsorptivity is higher, and the removability tends to be deteriorated. In addition, when the average fine pore diameter is more than 5.0 μm, although the releasability is good, the adsorptive power tends to be further reduced. Also, the average fine pore diameter can be measured by the method described in the examples.
（微細孔面積）
　保持面に形成された微細孔の微細孔面積は、保持面１ｃｍ２当たり、好ましくは５．０×１０４～５．０×１０６μｍ２であり、より好ましくは５．０×１０４～３．０×１０６μｍ２である。微細孔面積が５．０×１０４μｍ２未満であると、吸着力が高すぎて剥離性が悪化する傾向にある。また、微細孔面積が５．０×１０６μｍ２超過であると、剥離性は良好であるものの、吸着力が低下しすぎる傾向にある。更には、微細孔が被研磨物の表面に転写されやすくなり、被研磨物の平坦性が悪化しやすくなるという問題を露呈する。なお、微細孔面積は、実施例に記載の方法により測定することができる。 (Fine pore area)
The micropore area of the micropores formed in the holding surface is preferably 5.0 × 10 4 to 5.0 × 10 6 μm 2 , and more preferably 5.0 × 10 4 to 1 × 2 for the holding surface. It is 3.0 × 10 6 μm 2 . If the micropore area is less than 5.0 × 10 4 μm 2 , the adsorptive power tends to be too high, and the removability tends to deteriorate. When the micropore area is more than 5.0 × 10 6 μm 2 , although the releasability is good, the adsorptive power tends to be too low. Furthermore, the micropores are easily transferred to the surface of the object to be polished, and the flatness of the object to be polished is easily deteriorated. The micropore area can be measured by the method described in the examples.
〔樹脂〕
　樹脂シートを構成するマトリックス材料である樹脂としては、特に制限されないが、製法上の観点から湿式凝固可能な樹脂が好ましい。そのような樹脂としては、例えば、ポリウレタン、ポリウレタンポリウレア等のポリウレタン系樹脂；ポリアクリレート、ポリアクリロニトリル等のアクリル系樹脂；ポリ塩化ビニル、ポリ酢酸ビニル、ポリフッ化ビニリデン等のビニル系樹脂；ポリサルホン、ポリエーテルサルホン等のポリサルホン系樹脂；アセチル化セルロース、ブチリル化セルロース等のアシル化セルロース系樹脂；ポリアミド系樹脂；及びポリスチレン系樹脂が挙げられる。なお、「湿式凝固」とは、樹脂を溶解させた樹脂溶液を塗膜にし、これを凝固液（樹脂に対して貧溶媒である。）の槽に浸漬することにより、含浸した樹脂溶液中の樹脂を凝固再生させるものである。樹脂溶液中の溶媒と凝固液とが置換されることにより樹脂溶液中の樹脂が凝集して凝固される。なお、湿式凝固に用いる観点から、樹脂シートを構成する樹脂は、Ｎ，Ｎ－ジメチルホルムアルデヒド、ジメチルアセトアミド、メチルエチルケトン、及びジメチルスルホキシドからなる群より選ばれる１種以上に可溶であることが好ましい。 〔resin〕
Although it does not restrict | limit especially as resin which is a matrix material which comprises a resin sheet, The resin which can be wet-coagulated from a viewpoint of a manufacturing method is preferable. Examples of such resins include polyurethane resins such as polyurethane and polyurethane polyurea; acrylic resins such as polyacrylate and polyacrylonitrile; vinyl resins such as polyvinyl chloride, polyvinyl acetate and polyvinylidene fluoride; polysulfone, poly Polysulfone resins such as ether sulfone; Acylated cellulose resins such as acetylated cellulose and butyrylated cellulose; polyamide resins; and polystyrene resins. In addition, in "wet coagulation", a resin solution in which a resin is dissolved is used as a coating, and this is immersed in a bath of a coagulation liquid (which is a poor solvent for the resin) in a resin solution impregnated. It solidifies and regenerates the resin. By replacing the solvent in the resin solution with the coagulating liquid, the resin in the resin solution is coagulated and coagulated. From the viewpoint of use for wet coagulation, the resin constituting the resin sheet is preferably soluble in one or more selected from the group consisting of N, N-dimethylformaldehyde, dimethylacetamide, methyl ethyl ketone and dimethyl sulfoxide.
　上記のなかでも、ポリウレタン系樹脂が好ましい。ポリウレタン系樹脂としては、特に限定されないが、例えば、ポリエステル系ポリウレタン樹脂、ポリエーテル系ポリウレタン樹脂、及びポリカーボネート系ポリウレタン樹脂が挙げられる。このようなポリウレタン系樹脂は水との親和性が低いものの撥水性までは有さず、撥水剤を添加することで撥水性を有するようになる。このため、後述する溶液調製工程における撥水剤の添加部数を調整することで、樹脂シートの撥水性を調整することができ、エタノールの浸透速度にも影響を与える。 Among the above, polyurethane resins are preferable. Although it does not specifically limit as polyurethane-type resin, For example, polyester-type polyurethane resin, polyether-type polyurethane resin, and polycarbonate-type polyurethane resin are mentioned. Such a polyurethane-based resin has low affinity to water but does not have water repellency, and by adding a water repellent, it has water repellency. For this reason, the water repellency of a resin sheet can be adjusted by adjusting the number of addition parts of the water repellent in the solution preparation process mentioned later, and the penetration speed of ethanol is also affected.
（破断強度）
　樹脂シートをＮ，Ｎ－ジメチルホルムアミドで溶解し、得られた溶液を乾燥させて得られる無発泡樹脂シートの破断強度は、好ましくは３０ＭＰａ以上であり、より好ましくは４０ＭＰａ以上であり、さらに好ましくは５０ＭＰａ以上である。無発泡樹脂シートの破断強度が３０ＭＰａ以上であることにより、研磨工程の応力による樹脂シートの破断がより抑制される傾向にある。また、樹脂シートは破断しないことが好ましいため、その観点から破断強度の上限については特に制限はないが、例示するのであれば１０００ＭＰａ以下である。無発泡樹脂シートの破断強度は、樹脂種の選択により調整することができる。また、無発泡樹脂シートの破断強度は、実施例に記載の方法により測定することができる。 (Breaking strength)
The breaking strength of the non-foamed resin sheet obtained by dissolving the resin sheet with N, N-dimethylformamide and drying the obtained solution is preferably 30 MPa or more, more preferably 40 MPa or more, and still more preferably 50 MPa or more. When the breaking strength of the non-foamed resin sheet is 30 MPa or more, breakage of the resin sheet due to the stress of the polishing process tends to be further suppressed. Moreover, since it is preferable that a resin sheet does not fracture | rupture, there is no restriction | limiting in particular about the upper limit of breaking strength from that point of view, but if it illustrates, it is 1000 MPa or less. The breaking strength of the non-foamed resin sheet can be adjusted by the selection of the resin type. In addition, the breaking strength of the non-foamed resin sheet can be measured by the method described in the examples.
（１００％モジュラス）
　樹脂シートを構成する樹脂の１００％モジュラスは、好ましくは３．０～１０ＭＰａであり、より好ましくは３．５～９．０ＭＰａであり、さらに好ましくは４．０～８．０ＭＰａである。樹脂シートを構成する樹脂の１００％モジュラスが３．０ＭＰａ以上であることにより、研磨工程の応力により保持面に被研磨物が沈み込む現象が抑制される。これにより、保持面に被研磨物の角が接触して傷が形成され、傷の部分からスラリーが浸入し、保持パッドが化学的に劣化・破損する現象が生じにくくなる。また、樹脂シートを構成する樹脂の１００％モジュラスが１０ＭＰａ以下であることにより、吸着力が向上し、研磨工程において被研磨物の保持が適切に行われ、また、樹脂シートのクッション性が向上することにより、研磨工程において局所的に生じ得る過度の研磨負担を適切に吸収することができる結果、得られる被研磨物の平坦性がより向上する傾向にある。なお、樹脂シートを構成する樹脂の１００％モジュラスは、樹脂種の選択により調整することができる。また、樹脂シートを構成する樹脂の１００％モジュラスは、実施例に記載の方法により測定することができる。なお、「１００％モジュラス」は、樹脂の硬さを表す指標であり、この値が大きくなるほど、硬い樹脂であることを意味する。 (100% modulus)
The 100% modulus of the resin constituting the resin sheet is preferably 3.0 to 10 MPa, more preferably 3.5 to 9.0 MPa, and still more preferably 4.0 to 8.0 MPa. When the 100% modulus of the resin constituting the resin sheet is 3.0 MPa or more, the phenomenon in which the object to be polished sinks on the holding surface due to the stress of the polishing step is suppressed. As a result, the corners of the object to be polished come into contact with the holding surface to form a scratch, and the slurry infiltrates from the portion of the scratch, making it difficult to cause the phenomenon that the holding pad is chemically degraded or damaged. In addition, when the 100% modulus of the resin constituting the resin sheet is 10 MPa or less, the adsorption force is improved, the object to be polished is appropriately held in the polishing step, and the cushioning property of the resin sheet is improved. As a result, as a result of being able to appropriately absorb excessive polishing load that may be locally generated in the polishing step, the flatness of the obtained object to be polished tends to be further improved. In addition, 100% modulus of resin which comprises a resin sheet can be adjusted by selection of resin kind. Moreover, 100% modulus of resin which comprises a resin sheet can be measured by the method as described in an Example. In addition, "100% modulus" is an index showing the hardness of resin, and it means that it is hard resin, so that this value becomes large.
〔撥水剤〕
　樹脂シートは、撥水剤を含有することが好ましい。撥水剤としては、特に制限されないが、例えば、ポリテトラフルオロエチレン（ＰＴＦＥ）、テトラフルオロエチレン－ヘキサフルオロプロピレン共重合体（ＦＥＰ）、テトラフルオロエチレン－パーフルオロアルキルビニルエーテル共重合体（ＰＦＡ）等のフッ素系撥水剤の他、シリコーン系撥水剤、ポリオレフィン系撥水剤が挙げられる。このなかでも、フッ素系撥水剤が好ましく、炭素数が６～８のパーフルオロアルキル基を有するフッ素系撥水剤がより好ましい。このような撥水剤を用いることにより、スラリーの侵入を抑制することにより保持パッドの耐久性がより向上する傾向にある。撥水剤は、１種を単独で又は２種以上を組み合わせて用いられる。 [Water repellant]
The resin sheet preferably contains a water repellent. The water repellent agent is not particularly limited. For example, polytetrafluoroethylene (PTFE), tetrafluoroethylene-hexafluoropropylene copolymer (FEP), tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA), etc. In addition to the fluorine-based water repellents listed above, silicone-based water repellents and polyolefin-based water repellents may be mentioned. Among these, fluorine-based water repellents are preferable, and fluorine-based water repellents having a C 6-8 perfluoroalkyl group are more preferable. By using such a water repellent, the durability of the holding pad tends to be further improved by suppressing the penetration of the slurry. The water repellent may be used alone or in combination of two or more.
　炭素数が６～８のパーフルオロアルキル基を有するフッ素系撥水剤としては、特に制限されないが、例えば、下記式（２）で表される化合物、パーフルオロアルキル基で変性した樹脂が挙げられる。
　Ｒｆ－Ｒ－Ｘ　　　（２） The fluorine-based water repellent having a perfluoroalkyl group having 6 to 8 carbon atoms is not particularly limited, and examples thereof include a compound represented by the following formula (2) and a resin modified with a perfluoroalkyl group. .
Rf-R-X (2)
　式（２）中、Ｒｆは、パーフルオロアルキル基を表し、その炭素数は、３～８であり、好ましくは４～８であり、より好ましくは６～８であり、さらに好ましくは６である。また、Ｒは、アルキレン基を表し、その炭素数は２～６であり、好ましくは２～４であり、より好ましくは２である。さらに、Ｘは、水酸基、ＣＨ2＝ＣＨＣ（＝Ｏ）ＣＯ－、Ｈ（ＯＣＨ2ＣＨ2）xＯ－、又はＹＳＯ3－〔Ｙは、水素原子又はＮＨ4を表す。〕を表し、好ましくは水酸基である。特に、Ｒｆの炭素数が６であるものが好ましく、さらにＲの炭素数が２であるものが好ましい。式（２）で表される化合物は常法により合成してもよく、市販品を入手してもよい。市販品としては、例えば、アサヒガードＥシリーズ（ＡＧＣセイミケミカル株式会社製商品名）、ＮＫガードＳシリーズ（日華化学株式会社製商品名）、ユニダインシリーズ（ダイキン工業株式会社製商品名）、クリスボンアシスター（ＤＩＣ株式会社製商品名）などが挙げられる。 In formula (2), R f represents a perfluoroalkyl group, and the carbon number thereof is 3 to 8, preferably 4 to 8, more preferably 6 to 8, and still more preferably 6. . R represents an alkylene group, and the carbon number thereof is 2 to 6, preferably 2 to 4, and more preferably 2. Furthermore, X represents a hydroxyl group, CH 2 CHCHC (= O) CO—, H (OCH 2 CH 2 ) x O—, or YSO 3 — [Y represents a hydrogen atom or NH 4 . And preferably a hydroxyl group. In particular, one having 6 carbon atoms in Rf is preferable, and one having 2 carbon atoms in R is more preferable. The compound represented by Formula (2) may be synthesize | combined by a conventional method, and may obtain a commercial item. Commercially available products include, for example, Asahi Guard E series (trade name of AGC Seimi Chemical Co., Ltd.), NK Guard S series (trade name of Nikka Chemical Co., Ltd.), Unidyne series (trade name of Daikin Industries, Ltd.), Klisson Aassister (trade name of DIC Corporation) and the like.
　また、パーフルオロアルキル基で変性した樹脂としては、特に制限されないが、例えば、樹脂シート中における撥水剤の分散性及び経時安定性の観点から、パーフルオロアルキル基で変性したポリウレタン樹脂が挙げられる。また、変性方法としては、例えば、樹脂の末端及び／又は側鎖にパーフルオロアルキル基を導入する方法が挙げられる。また、樹脂シート中における撥水剤の分散性及び経時安定性の観点から、式（２）で表される化合物により変性した樹脂、すなわち、Ｒｆ－Ｒ－で表される基を有する樹脂が好ましく、Ｒｆ－Ｒ－で表される基を有するポリウレタン樹脂がより好ましい。そのような樹脂としては、例えば、国際公開第２０１２／１７２９３６号に記載のポリウレタン樹脂が挙げられる。 Further, the resin modified with a perfluoroalkyl group is not particularly limited, but for example, a polyurethane resin modified with a perfluoroalkyl group can be mentioned from the viewpoint of the dispersibility of the water repellent in the resin sheet and the temporal stability. . Moreover, as a modification | reformation method, the method of introduce | transducing a perfluoroalkyl group into the terminal and / or side chain of resin is mentioned, for example. In addition, from the viewpoint of the dispersibility of the water repellent in the resin sheet and the temporal stability, a resin modified by the compound represented by the formula (2), that is, a resin having a group represented by Rf-R- is preferable. And polyurethane resins having a group represented by Rf-R- are more preferable. Such resins include, for example, the polyurethane resins described in WO 2012/172936.
　撥水剤の含有量は、樹脂シートの総量に対して、好ましくは０．５～５．０質量％であり、より好ましくは０．５～４．０質量％であり、さらに好ましくは０．５～３．０質量％である。撥水剤の含有量が０．５質量％以上であることにより、エタノールの浸透速度が遅くなり吸着力が向上し、横ずれを抑制するとともに、スラリーの侵入を抑制することにより保持パッドの耐久性がより向上する。また、撥水剤の含有量が５．０質量％以下であることにより、エタノールの浸透速度が速くなり吸着力が低減でき、剥離性を良好に保つことができる。 The content of the water repellent is preferably 0.5 to 5.0% by mass, more preferably 0.5 to 4.0% by mass, still more preferably 0. It is 5 to 3.0% by mass. When the content of the water repellent is 0.5% by mass or more, the permeation rate of ethanol is slowed to improve the adsorptive power, and the lateral displacement is suppressed, and the penetration of the slurry is suppressed, and the durability of the holding pad is thereby improved. Improve more. Further, when the content of the water repellent agent is 5.0% by mass or less, the permeation rate of ethanol can be increased, the adsorptive power can be reduced, and the releasability can be favorably maintained.
〔孔形成剤〕
　樹脂シートは後述するように孔形成剤を含んでいてもよい。孔形成剤としては、特に制限されないが、例えば、セルロースアセテートブチレート等のセルロース系化合物が挙げられる。孔形成剤は、１種を単独で又は２種以上を組み合わせて用いられる。 [Pore forming agent]
The resin sheet may contain a pore forming agent as described later. The pore-forming agent is not particularly limited, and examples thereof include cellulose-based compounds such as cellulose acetate butyrate. The pore forming agent may be used alone or in combination of two or more.
〔その他の成分〕
　本実施形態の保持パッドは、上述の他、目的に応じて、保持パッドに含まれ得る各種添加剤を含んでもよい。そのような添加剤としては、特に限定されないが、例えば、カーボンブラック等の顔料またはフィラー、親水性添加剤、及び疎水性添加剤が挙げられる。 [Other ingredients]
The holding pad of this embodiment may contain various additives which may be contained in the holding pad according to the purpose other than the above. Such additives are not particularly limited, and include, for example, pigments or fillers such as carbon black, hydrophilic additives, and hydrophobic additives.
　親水性添加剤としては、特に限定されないが、例えば、ラウリル硫酸ナトリウム、カルボン酸塩、スルホン酸塩、硫酸エステル塩、燐酸エステル塩のようなアニオン界面活性剤；親水性のエステル系化合物、エーテル系化合物、エステル・エーテル系化合物、アミド系化合物のようなノニオン界面活性剤が挙げられる。 The hydrophilic additive is not particularly limited, but, for example, an anionic surfactant such as sodium lauryl sulfate, carboxylate, sulfonate, sulfate, phosphate ester; hydrophilic ester compound, ether Nonionic surfactants such as compounds, ester / ether compounds and amide compounds may be mentioned.
　また、疎水性添加剤としては、特に限定されないが、例えば、ポリオキシエチレンアルキルエーテル、ポリオキシプロピレンアルキルエーテル、ポリオキシエチレンポリオキシプロピレンアルキルエーテル、パーフルオロアルキルエチレンオキサイド付加物、グリセリン脂肪酸エステル、プロピレングリコール脂肪酸エステルのような炭素数３以上のアルキル鎖が付加したノニオン系界面活性剤が挙げられる。 Also, the hydrophobic additive is not particularly limited, but, for example, polyoxyethylene alkyl ether, polyoxypropylene alkyl ether, polyoxyethylene polyoxypropylene alkyl ether, perfluoroalkyl ethylene oxide adduct, glycerin fatty acid ester, propylene The nonionic surfactant which the C3-C3 or more alkyl chain added like glycol fatty acid ester is mentioned.
〔厚さ〕
　樹脂シートの厚さは、特に制限されないが、研磨工程中に被研磨物が樹脂シートに沈み込み、加工精度が低下するのを抑制するために、好ましくは３．０ｍｍ以下であり、より好ましくは２．０ｍｍ以下であり、さらに好ましくは１．０ｍｍ以下である。また、樹脂シートの厚さの下限は、特に限定されないが３００μｍ以上が好ましい。樹脂シートの厚さが上記範囲内であることにより、厚さ精度を十分に確保することができる傾向にある。厚さは、日本工業規格（ＪＩＳ　Ｋ　６５０５）に準拠して測定される。 〔thickness〕
The thickness of the resin sheet is not particularly limited, but is preferably 3.0 mm or less, and more preferably, in order to suppress that the object to be polished sinks into the resin sheet during the polishing step and the processing accuracy is reduced. It is 2.0 mm or less, more preferably 1.0 mm or less. The lower limit of the thickness of the resin sheet is not particularly limited, but is preferably 300 μm or more. When the thickness of the resin sheet is in the above range, the thickness accuracy tends to be sufficiently secured. The thickness is measured in accordance with Japanese Industrial Standard (JIS K 6505).
〔枠部〕
　本実施形態の保持パッドは、保持面上に被研磨物を囲む枠部を有していてもよいし、当該枠部を有さなくてもよい。枠部は、研磨加工中に被研磨物が横ずれを起こして、保持面から飛び出すことを防止する（横ずれ範囲を規制する）ものである。被研磨物の重量が比較的大きい場合等、横ずれが生じにくい場合、枠部は有さなくても良いが、そのような横ずれが発生し得る場合、枠部の形状及び寸法は、被研磨物が研磨領域から飛び出さないようなものであれば特に限定されず、例えば、内径が被研磨物の外径より大きくなるように形成されていてもよい。 [Frame]
The holding pad of the present embodiment may have a frame portion surrounding the object to be polished on the holding surface, or may not have the frame portion. The frame portion prevents the object to be polished from being laterally shifted during polishing and prevents the object from jumping out of the holding surface (regulating the lateral displacement range). If lateral displacement does not easily occur, such as when the weight of the object to be polished is relatively large, the frame may not be provided. However, if such lateral displacement can occur, the shape and size of the frame may be The material is not particularly limited as long as it does not protrude from the polishing region, and for example, the inner diameter may be formed to be larger than the outer diameter of the object to be polished.
〔クッション層〕
　本実施形態の保持パッドは、被研磨物を保持する保持面とは反対側の面に、発泡樹脂からなるクッション層を備えてもよいし、当該クッション層を備えなくてもよい。 [Cushion layer]
The holding pad of this embodiment may be provided with a cushion layer made of a foamed resin on the surface opposite to the holding surface for holding an object to be polished, or may not be provided with the cushion layer.
〔接着層〕
　本実施形態の保持パッドは、保持定盤側の面に、保持パッドを保持定盤に固定するための両面テープや面ファスナーのような接着層や粘着層の固定手段を有していてもよい。 [Adhesive layer]
The holding pad of the present embodiment may have a fixing means of an adhesive layer or adhesive layer such as a double-sided tape or a surface fastener for fixing the holding pad to the holding platen on the surface of the holding platen side. .
〔保持パッドの製造方法〕
　本実施形態の保持パッドの製造方法は、樹脂を溶媒中に混合溶解して樹脂溶液を調製する溶液調製工程と、樹脂溶液の塗膜を形成する塗膜形成工程と、塗膜を、樹脂の貧溶媒である凝固液に浸漬して、樹脂シートを作製する浸漬工程と、樹脂シートの表面に微細孔を形成する孔形成工程と、を有する。 [Method of manufacturing holding pad]
The manufacturing method of the holding pad according to the present embodiment includes a solution preparing step of preparing a resin solution by mixing and dissolving a resin in a solvent, a coating forming step of forming a coating of the resin solution, and a coating of resin. It has the immersion process which is immersed in the solidification liquid which is a poor solvent, and produces a resin sheet, and the hole formation process which forms a fine hole in the surface of a resin sheet.
〔溶液調製工程〕
　溶液調製工程は、樹脂を溶媒中に混合溶解して樹脂溶液を調製する工程である。この際、樹脂と溶媒以外の添加剤として、前記孔形成剤、撥水剤、その他成分を用いてもよい。 Solution preparation process
The solution preparation step is a step of mixing and dissolving the resin in a solvent to prepare a resin solution. Under the present circumstances, you may use the said pore formation agent, a water repellent, and another component as additives other than resin and a solvent.
　樹脂、撥水剤、及び孔形成剤としては、特に制限されないが、例えば、上記と同様のもが挙げられる。樹脂の濃度は、好ましくは１０～５０質量％であり、より好ましくは１５～３５質量％である。 The resin, the water repellent agent, and the pore forming agent are not particularly limited, and examples thereof include the same as described above. The concentration of the resin is preferably 10 to 50% by mass, more preferably 15 to 35% by mass.
　溶媒としては、特に制限されないが、例えば、Ｎ，Ｎ－ジメチルホルムアミド（ＤＭＦ）、Ｎ，Ｎ－ジメチルアセトアミド（ＤＭＡＣ）、メチルエチルケトン（ＭＥＫ）及びジメチルスルホキシド（ＤＭＳＯ）が挙げられる。溶媒は、１種の溶媒であっても、２種以上の溶媒を混合したものであってもよい。 The solvent is not particularly limited, for example, N, N-dimethylformamide (DMF), N, N-dimethylacetamide (DMA C), methyl ethyl ketone (MEK) and dimethyl sulfoxide (DMSO). The solvent may be a single solvent or a mixture of two or more solvents.
〔塗膜形成工程〕
　塗膜形成工程は、樹脂溶液の塗膜を形成する工程である。塗膜の形成方法については、特に制限されないが、例えば、成膜用基材の表面に樹脂溶液をナイフコーター等の塗布装置を用いて塗布する方法が挙げられる。このときに塗布する樹脂溶液の厚さは、最終的に得られる樹脂シート１１２の厚さが所望の厚さになるように、適宜調整すればよい。成膜用基材の材質としては、特に制限されないが、例えば、ＰＥＴフィルム等の樹脂フィルム、布帛及び不織布が挙げられる。 Coating film formation process
The coating film forming step is a step of forming a coating film of a resin solution. The method of forming the coating film is not particularly limited, and for example, a method of applying a resin solution to the surface of a film-forming substrate using a coating apparatus such as a knife coater may be mentioned. The thickness of the resin solution applied at this time may be appropriately adjusted so that the thickness of the resin sheet 112 finally obtained becomes a desired thickness. Although it does not restrict | limit especially as a material of the base material for film formation, For example, resin films, such as a PET film, a fabric, and a nonwoven fabric are mentioned.
〔浸漬工程〕
　浸漬工程は、塗膜を、樹脂の貧溶媒である凝固液に浸漬して、樹脂シートを作製する工程である。貧溶媒としては従来知られているものを用いることができ、特に制限されないが、例えば、水が挙げられる。貧溶媒は、１種の溶媒であっても、２種以上の溶媒を混合したものであってもよい。凝固液には、樹脂の再生速度を調整する観点から、樹脂溶液中の極性溶媒が含まれていてもよい。また、凝固液の温度は、樹脂を凝固できる温度であれば特に限定されない。 [Immersion process]
The immersing step is a step of immersing the coating film in a coagulating solution which is a poor solvent for resin to produce a resin sheet. As the poor solvent, those known in the prior art can be used, and it is not particularly limited, and examples thereof include water. The poor solvent may be a single solvent or a mixture of two or more solvents. The coagulating liquid may contain a polar solvent in the resin solution from the viewpoint of adjusting the regeneration rate of the resin. Further, the temperature of the coagulating liquid is not particularly limited as long as it can solidify the resin.
　塗膜を凝固液に浸漬すると、初めに、樹脂溶液の塗膜と凝固液との界面に皮膜（スキン層）が形成され、皮膜の直近の樹脂中に無数の緻密な微多孔が形成される。その後、樹脂溶液の塗膜に含まれる溶媒が凝固液中へ拡散する現象と、塗膜中へ凝固液から貧溶媒が浸入する現象が、協調して起こる結果、表面にはスキン層を備えつつも、塗膜の内部には連続気泡構造を有する樹脂シートが得られる。このとき、成膜用基材が液体を浸透し難いもの（例えばＰＥＴフィルム）であると、凝固液がその基材に浸透しないため、塗膜中の溶媒と貧溶媒との置換がスキン層より生じ、スキン層付近よりもその内側にある領域の方に、より大きな空孔が形成される傾向にある。また、このとき、樹脂溶液中に孔形剤が含まれている場合、表面まで微多孔の先端が連通し、表面に微細孔が形成される。 When the coating film is immersed in the coagulating liquid, a film (skin layer) is first formed at the interface between the coating of the resin solution and the coagulating liquid, and innumerable minute micropores are formed in the resin in the immediate vicinity of the film. . Thereafter, the phenomenon in which the solvent contained in the coating of the resin solution diffuses into the coagulating liquid and the phenomenon in which the poor solvent penetrates from the coagulating liquid into the coating occurs in a coordinated manner. Also, a resin sheet having an open cell structure is obtained inside the coating film. At this time, if the substrate for film formation is a material which does not easily permeate the liquid (for example, a PET film), the coagulating liquid does not permeate the substrate, and therefore, the solvent in the coating film is replaced with the poor solvent from the skin layer. As a result, larger vacancies tend to be formed in the region that is inside rather than near the skin layer. At this time, if the resin solution contains a pore forming agent, the tip of the micropores will communicate to the surface, and micropores will be formed on the surface.
　上記浸漬工程の後、得られた樹脂シートを洗浄・乾燥工程に供することが好ましい。まず、樹脂シートを水等の洗浄液中で洗浄し、樹脂シート中に残存するＤＭＦ等の溶媒を除去する。その後、樹脂シートを乾燥機中で乾燥させてもよい。 It is preferable to use the obtained resin sheet for a washing | cleaning * drying process after the said immersion process. First, the resin sheet is washed in a washing solution such as water to remove the solvent such as DMF remaining in the resin sheet. Thereafter, the resin sheet may be dried in a dryer.
〔孔形成工程〕
　孔形成工程は、樹脂シートの表面に微細孔を形成することができれば方法は特に問わないが、樹脂溶液への孔形成剤の添加による形成や、樹脂シートを延伸して微細孔を形成する方法などが挙げられる。なお、孔形成剤を添加する場合には、浸漬工程と孔形成工程とが同時に行われる。 [Pore forming process]
The hole forming step is not particularly limited as long as fine holes can be formed on the surface of the resin sheet, but a method of forming the fine holes by forming the fine holes by adding a hole forming agent to the resin solution or stretching the resin sheet Etc. In addition, when adding a hole formation agent, an immersion process and a hole formation process are performed simultaneously.
　樹脂シートを延伸して微細孔を形成する場合は、樹脂シートの延伸率は１０５～３００％（元長に対して１．０５倍～３倍の長さの意味）であり、より好ましくは１２０～２５０％である。原反シートには用いる樹脂の種類によって異なるが、延伸率が１０５％未満であると、適切に微細孔が形成されず、また、樹脂シートの延伸率は３００％超過であると破断しやすくなるため好ましくない。 When the resin sheet is stretched to form fine pores, the stretch ratio of the resin sheet is 105 to 300% (meaning 1.05 times to 3 times the length of the original length), more preferably 120. It is ~ 250%. Although it changes with kinds of resin to be used for an original fabric sheet, when a drawing rate is less than 105%, a micropore is not formed appropriately but it becomes easy to be broken when a drawing rate of a resin sheet is over 300%. Unfavorable.
〔研磨物の製造方法〕
　本実施形態の研磨物の製造方法は、上記保持パッドにより保持した被研磨物を、研磨パッドを用いて研磨する研磨工程を有する。研磨工程は、一次研磨（粗研磨）であってもよく、二次研磨（仕上げ研磨）であってもよく、それら両方の研磨を兼ねるものであってもよい。以下、化学機械研磨を例に本実施形態の研磨物の製造方法を説明するが、本実施形態の研磨物の製造方法は以下に限定されない。 [Method of producing abrasives]
The method of manufacturing a polished object of the present embodiment has a polishing step of polishing the workpiece held by the holding pad using a polishing pad. The polishing process may be primary polishing (rough polishing), secondary polishing (finish polishing), or both of them. Hereinafter, although the manufacturing method of the grinding | polishing material of this embodiment is demonstrated to an example for chemical mechanical polishing, the manufacturing method of the grinding | polishing material of this embodiment is not limited to the following.
　図２に、本実施形態の保持パッド１０を用いて被研磨物Ｗの研磨を行う場合の模式図を示す。まず、研磨機の保持定盤１上に保持パッド１０を固定し、被研磨物Ｗを保持させる。次いで、保持パッド１０の保持面に被研磨物Ｗを保持した状態で、研磨液を供給し、研磨装置の研磨用定盤３に装着された研磨パッド２を被研磨物Ｗに押し当てて回転することにより、被研磨物Ｗを研磨することができる。 The schematic diagram in the case of grind | polishing the to-be-polished thing W in FIG. 2 using the holding | maintenance pad 10 of this embodiment is shown. First, the holding pad 10 is fixed on the holding surface plate 1 of the polishing machine to hold the object W to be polished. Next, the polishing liquid is supplied while holding the workpiece W on the holding surface of the holding pad 10, and the polishing pad 2 mounted on the polishing platen 3 of the polishing apparatus is pressed against the workpiece W and rotated. By doing this, the object to be polished W can be polished.
　保持定盤１に保持パッド１０を固定する方法としては、特に限定されないが、保持パッド１０が両面テープを備えている場合には、両面テープの剥離紙を取り除き、露出した接着層で保持面が上方に向くように保持定盤１に接着固定する。また、保持パッド１０が両面テープを備えていない場合は、別に用意した接着剤又は粘着剤で保持パッド１０を保持定盤１に接着固定してもよい。 The method for fixing the holding pad 10 to the holding surface plate 1 is not particularly limited. However, when the holding pad 10 is provided with a double-sided tape, the release paper of the double-sided tape is removed and the holding surface is an exposed adhesive layer. Adhesively fix to the holding surface plate 1 so as to face upward. When the holding pad 10 is not provided with the double-sided tape, the holding pad 10 may be adhered and fixed to the holding surface plate 1 with an adhesive or an adhesive prepared separately.
　保持面に被研磨物Ｗを固定する方法としては、保持パッド１０における保持面に、適量の水を含ませて被研磨物Ｗを押し付けることで、被研磨物Ｗが保持面に保持される。このとき、被研磨物Ｗの被研磨面（加工面）が上方に向くよう被研磨物Ｗを保持する。 As a method of fixing the object to be polished W on the holding surface, the object to be polished W is held on the holding surface by including the appropriate amount of water on the holding surface of the holding pad 10 and pressing the object to be polished W. At this time, the object to be polished W is held such that the surface to be polished (processed surface) of the object to be polished W faces upward.
　一方、保持定盤１の上方で保持定盤１と対向するように配置された研磨用定盤３に、表面に研磨パッド２（研磨布）を研磨面が下方に向くように装着する。 On the other hand, the polishing pad 2 (abrasive cloth) is mounted on the surface of the polishing platen 3 disposed so as to face the holding platen 1 above the holding platen 1 so that the polishing surface is directed downward.
　次に、被研磨物Ｗの被研磨面が研磨パッド２の研磨面に接触するように、研磨定盤１を下降させ保持定盤３の方へ移動させる。そして、被研磨物Ｗと研磨パッド２との間にスラリーを供給する。スラリーは、被研磨物や研磨条件等に応じて、水、過酸化水素に代表される酸化剤などの化学成分、添加剤、砥粒（研磨粒子；例えば、ＳｉＣ、ＳｉＯ2、Ａｌ2Ｏ3、ＣｅＯ2）等を含んでいてもよく、スラリーは循環しながら供給してもよい。それと共に、保持定盤１上の被研磨物Ｗを研磨パッド２で押圧しながら、保持定盤１と研磨用定盤３とを相対的に回転させることで、被研磨物Ｗの加工面が研磨パッド２で化学機械研磨（ＣＭＰ）により研磨加工される。保持定盤１と研磨用定盤３は、互いに異なる回転速度で同方向に回転しても、異方向に回転してもよい。 Next, the polishing platen 1 is lowered and moved to the holding platen 3 so that the surface to be polished of the workpiece W contacts the polishing surface of the polishing pad 2. Then, a slurry is supplied between the object to be polished W and the polishing pad 2. The slurry may be water, chemical components such as an oxidant represented by hydrogen peroxide, additives, abrasive grains (abrasive particles; for example, SiC, SiO 2 , Al 2 O 3 , etc.) depending on the object to be polished and polishing conditions, etc. , CeO 2 ), etc., and the slurry may be supplied while circulating. At the same time, the work surface of the workpiece W is rotated by relatively rotating the holding platen 1 and the polishing platen 3 while pressing the workpiece W on the holding platen 1 with the polishing pad 2. The polishing pad 2 is polished by chemical mechanical polishing (CMP). The holding surface plate 1 and the polishing surface plate 3 may rotate in the same direction at different rotational speeds, or may rotate in different directions.
　被研磨物としては、特に限定されないが、例えば、液晶ディスプレイ用ガラス基板等の薄型基板、半導体デバイス、電子部品等の材料、特に、Ｓｉ基板（シリコンウェハ）、ＳｉＣ（シリコンカーバイト）基板、ＧａＡｓ（ガリウム砒素）基板が挙げられる。なお、液晶ディスプレイ用ガラス基板においては、Ｇ１０と称されるサイズ（３１３０ｍｍ×２８８０ｍｍ）で、且つ、厚み０．３～０．７ｍｍのものにおいて好適に研磨加工を行うことができる。 The object to be polished is not particularly limited, but, for example, thin substrates such as glass substrates for liquid crystal displays, materials such as semiconductor devices and electronic components, particularly Si substrates (silicon wafers), SiC (silicon carbide) substrates, GaAs (Gallium arsenide) substrate. In the glass substrate for liquid crystal display, the polishing process can be suitably performed with a size (3130 mm × 2880 mm) called G10 and a thickness of 0.3 to 0.7 mm.
　以下、本発明を実施例及び比較例を用いてより具体的に説明する。本発明は、以下の実施例によって何ら限定されるものではない。 Hereinafter, the present invention will be more specifically described using examples and comparative examples. The present invention is not limited at all by the following examples.
〔破断強度〕
　樹脂シートをＮ，Ｎ－ジメチルホルムアミドで溶解し、得られた溶液を乾燥させて無発泡樹脂シート（試験片）を得た。得られた樹脂シートをダンベル形状（ＪＩＳ　Ｋ　６５５０記載）に打ち抜き、測定試料を測定機の上下エアチャックにはさみ、引張速度１００ｍｍ／ｍｉｎ、初期つかみ間隔５０ｍｍで測定を開始し、測定値がピーク（切断）に達した値を強力（最大荷重）として得た。測定は３回行い、破断強度（ｋｇｆ／ｍｍ２）＝強力（最大荷重）ｋｇｆ／（厚さ（ｍｍ）×試料巾（１０ｍｍ））より破断強度を算出し、その平均値から破断強度を算出した。尚、試料厚みは、測定試料をチャック装着する際、厚み計を用いて測定した。
　破断強度は引張万能試験機（「テンシロン」、Ａ＆Ｄ社製、ＲＴＣ－１２１０Ａ）を用い、日本工業規格（ＪＩＳ　Ｋ　６５５０）に準拠した方法によって測定した。 〔Breaking strength〕
The resin sheet was dissolved in N, N-dimethylformamide, and the resulting solution was dried to obtain a non-foamed resin sheet (test piece). The resulting resin sheet is punched into a dumbbell shape (JIS K 6550 described), the measurement sample is sandwiched by the upper and lower air chucks of the measuring machine, the measurement is started at a tension speed of 100 mm / min and the initial gripping interval of 50 mm. The value reached when cutting) was obtained as the strength (maximum load). The measurement is performed three times, and the breaking strength is calculated from breaking strength (kgf / mm 2 ) = strong (maximum load) kgf / (thickness (mm) × sample width (10 mm)), and the breaking strength is calculated from the average value did. The sample thickness was measured using a thickness gauge when mounting the measurement sample on a chuck.
The breaking strength was measured by a method based on Japanese Industrial Standard (JIS K 6550) using a tensile universal tester (“Tensilon”, manufactured by A & D, RTC-1210A).
〔１００％モジュラス〕
　樹脂シートを構成する樹脂を用いて無発泡の樹脂シート（試験片）を成形し、その試験片を２５℃において１００％（元の長さの２倍の長さまで）伸ばしたときにかかる荷重（引張力）を試験片の初期断面積で除した値を１００％モジュラスとして用いた。 [100% modulus]
A load applied when a non-foamed resin sheet (test piece) is molded using a resin that constitutes the resin sheet and the test piece is stretched 100% (up to twice the original length) at 25 ° C. The value obtained by dividing the tensile force) by the initial cross-sectional area of the test piece was used as 100% modulus.
〔実施例１〕
　ポリエステル系ポリウレタン樹脂（破断強度：５５ＭＰａ、１００％モジュラス：６．０ＭＰａ）の３０％ＤＭＦ溶液１００質量部に対して、ＤＭＦ４７質量部、撥水剤（固形分６０質量％）０．６質量部、孔形成剤（セルロースアセテートブチレート）０．２質量部を添加して混合撹拌し、樹脂溶液を調製した。次に、成膜用基材として、ＰＥＴフィルムを用意し、そこに、上記樹脂溶液を、ナイフコーターを用いて塗布し、厚さ１．０ｍｍの塗膜を得た。 Example 1
47 parts by mass of DMF, 0.6 parts by mass of water repellent (solid content: 60% by mass) with respect to 100 parts by mass of a 30% DMF solution of polyester-based polyurethane resin (breaking strength: 55 MPa, 100% modulus: 6.0 MPa) 0.2 parts by mass of a pore forming agent (cellulose acetate butyrate) was added and mixed and stirred to prepare a resin solution. Next, a PET film was prepared as a substrate for film formation, and the above resin solution was applied thereto using a knife coater to obtain a coating film having a thickness of 1.0 mm.
　次いで、得られた塗膜を成膜用基材と共に、凝固液である水に浸漬し、樹脂を凝固再生して樹脂シートを得た。樹脂シートを凝固浴から取り出し、成膜用基材を樹脂シートから剥離した後、樹脂シートを水からなる洗浄液に浸漬し溶媒であるＤＭＦを除去した。その後、樹脂シートを乾燥しつつ巻き取った。次に、樹脂シートの裏面（成膜用基材を剥離した側の面であって、成膜基材に接触していた面）に対してバフ処理を施して、０．８ｍｍの厚さとした。次に、樹脂シートのバフ処理を施した面に、両面テープを貼り合わせ、保持パッドを得た。 Subsequently, the obtained coating film was immersed in water, which is a coagulating liquid, together with the substrate for film formation, to coagulate and regenerate the resin, to obtain a resin sheet. The resin sheet was taken out of the coagulation bath, and the substrate for film formation was peeled off from the resin sheet, and then the resin sheet was immersed in a cleaning liquid composed of water to remove DMF which is a solvent. Thereafter, the resin sheet was wound while being dried. Next, the back surface of the resin sheet (the surface on the side from which the substrate for film formation was peeled off and the surface that was in contact with the film formation substrate) was subjected to buff treatment to obtain a thickness of 0.8 mm. . Next, a double-sided tape was attached to the buffed side of the resin sheet to obtain a holding pad.
〔実施例２〕
　孔形成剤を使用せずに樹脂シートを作製し、得られた樹脂シートを幅方向に１２０％延伸したこと以外は、実施例１と同様に樹脂シートを作製して、保持パッドを得た。 Example 2
A resin sheet was produced without using a pore forming agent, and a resin sheet was produced in the same manner as in Example 1 except that the obtained resin sheet was stretched by 120% in the width direction, to obtain a holding pad.
〔実施例３〕
　孔形成剤を使用せずに樹脂シートを作製し、得られた樹脂シートを幅方向に２５０％延伸したこと以外は、実施例１と同様に樹脂シートを作製して、保持パッドを得た。 [Example 3]
A resin sheet was produced without using a pore forming agent, and a resin sheet was produced in the same manner as in Example 1 except that the obtained resin sheet was stretched 250% in the width direction, to obtain a holding pad.
〔比較例１〕
　孔形成剤を使用せずに樹脂シートを作製し、得られた樹脂シートを幅方向に３１０％延伸することを試みた以外は、実施例１と同様に樹脂シートを作製したが、延伸の際に樹脂シートが破断し、保持パッドを得ることが出来なかった。 Comparative Example 1
A resin sheet was produced in the same manner as in Example 1 except that the resin sheet was produced without using a pore forming agent and the obtained resin sheet was tried to be stretched by 310% in the width direction. On the other hand, the resin sheet was broken and a holding pad could not be obtained.
〔比較例２〕
　孔形成剤を使用せずに樹脂シートを作製した以外は、実施例１と同様に保持パッドを得た。 Comparative Example 2
A holding pad was obtained in the same manner as in Example 1 except that a resin sheet was produced without using a pore forming agent.
〔比較例３〕
　比較例２と同様に保持パッドを作製した後、ミシン針を用いて保持面上から細孔（直径０．４ｍｍ、間隔３ｍｍ、深さ０．８ｍｍ）を形成した。 Comparative Example 3
After producing the holding pad in the same manner as in Comparative Example 2, pores (diameter 0.4 mm, interval 3 mm, depth 0.8 mm) were formed from the holding surface using a sewing needle.
〔比較例４〕
　比較例２と同様に樹脂シートを作製した後、保持面側もバフ処理を行い、保持面に連続気泡に由来する気孔を形成したこと以外は、比較例１と同様に樹脂シートを作製して保持パッドを得た。 Comparative Example 4
After the resin sheet is produced in the same manner as in Comparative Example 2, the holding surface side is also subjected to buffing, and a resin sheet is produced in the same manner as in Comparative Example 1 except that pores derived from open cells are formed in the holding surface. I got a holding pad.
〔エタノールの浸透速度〕
　保持パッドについて、エタノールの接触角を次のように測定した。接触角計として固液界面解析装置（協和界面科学社製、商品名「ＤｒｏｐＭａｓｔｅｒ５００」）を用い、温度２０℃、湿度６０％の条件の下、注射針からエタノール（濃度：９９％）１滴（５μＬ）を保持パッドの保持面に滴下した。そして、滴下直後の接触角をＣ０、２０秒後の接触角をＣ２０とし、下記式（１）にてエタノールの浸透速度を算出した。なお、滴下から２０秒経過しないうちに保持面にエタノールが完全に浸透した比較例３～４については、完全に浸透する直前であるｔ秒後の接触角をＣｔとし、（Ｃ０－Ｃｔ）／ｔの式によって、参考値を算出した（表中*１をつけて示す。）。また、上記試験は密閉系で行った。
　浸透速度＝（Ｃ０－Ｃ２０）／２０　　　・・・　（１） [Permeation rate of ethanol]
The contact angle of ethanol was measured as follows for the holding pad. Using a solid-liquid interface analyzer (trade name "DropMaster 500" manufactured by Kyowa Interface Science Co., Ltd.) as a contact angle meter, 1 drop (concentration: 99%) of ethanol (concentration: 99%) under the conditions of temperature 20 ° C and humidity 60%. 5 μL) was dropped onto the holding surface of the holding pad. Then, the contact angle immediately after dropping was C 0 , and the contact angle after 20 seconds was C 20, and the permeation rate of ethanol was calculated by the following equation (1). In addition, in Comparative Examples 3 to 4 in which ethanol completely penetrated to the holding surface within 20 seconds after the dripping, the contact angle after t seconds which is immediately before penetration completely is represented by Ct (C 0 -Ct). The reference value was calculated according to the formula of / t (indicated by * 1 in the table). The above test was conducted in a closed system.
Penetration rate = (C 0 -C 20) / 20 ··· (1)
　なお、図３に、エタノールの浸透速度の測定方法を表す模式図を示す。また、図４に、実施例２～３と比較例１の時間ごとのエタノールの接触角の変化を示すグラフを示す。 In addition, the schematic diagram showing the measuring method of the permeation rate of ethanol is shown in FIG. Further, FIG. 4 is a graph showing the change of the contact angle of ethanol with respect to time in Examples 2 to 3 and Comparative Example 1.
〔水の接触角〕
　保持パッドについて、水の接触角を次のように測定した。接触角計として固液界面解析装置（協和界面科学社製、商品名「ＤｒｏｐＭａｓｔｅｒ５００」）を用い、温度２０℃、湿度６０％の条件の下、注射針から水滴１滴（１μＬ）を保持パッドの保持面に滴下し、滴下直後の接触角を測定した。なお、保持面をバフした比較例４については、水の滴下と同時に保持パッド内に浸透し、水が保持面上に付着しなかったため、接触角の測定が出来なかった。 [Water contact angle]
The contact angle of water was measured as follows for the holding pad. Using a solid-liquid interface analyzer (trade name "DropMaster 500" manufactured by Kyowa Interface Science Co., Ltd.) as a contact angle meter, hold 1 drop (1 μL) of water droplets from an injection needle under the conditions of temperature 20 ° C and humidity 60% It dripped on the holding surface, and measured the contact angle immediately after dripping. In Comparative Example 4 in which the holding surface was buffed, it permeated into the holding pad simultaneously with the dropping of water, and water did not adhere on the holding surface, so that the contact angle could not be measured.
〔平均微細孔径、及び、１ｃｍ２あたりの微細孔面積〕
　平均微細孔径（μｍ）及び１ｃｍ２あたりの微細孔面積（μｍ２）の測定は、走査型電子顕微鏡（日本電子株式会社製、ＪＳＭ－５５００ＬＶ）で約１００μｍ四方の範囲を１０００倍に拡大し９カ所観察した。この画像を画像処理ソフト（Ｉｍａｇｅ　Ａｎａｌｙｚｅｒ　Ｖ２０ＬＡＢ　Ｖｅｒ．１．３、ニコン製）により二値化処理して微細孔個数（気泡個数）を確認し、各々の微細孔（気泡）の面積から面積円相当径及びその平均値を平均微細孔径として算出した。そして、微細孔の面積の割合から、１ｃｍ２あたりの微細孔面積を求めた。なお、気泡径のカットオフ値（下限）を設定しなかった。また、比較例１、３では微細孔が確認されなかった。なお、保持面に細孔を形成させた比較例３および保持面にバフ処理を施した比較例４については、微細孔は確認されなかったものの、細孔およびバフ処理に由来する開口が確認された。確認された開口の平均径および１ｃｍ２あたりの面積を参考値として算出した（表中＊２をつけて示す。） [Average fine pore size and micropore area per 1 cm 2 ]
The average fine pore size (μm) and the micropore area per 1 cm 2 (μm 2 ) were measured by enlarging the range of about 100 μm by 1000 times with a scanning electron microscope (JSM-5500 LV manufactured by JEOL Ltd.) 9 I observed it. This image is binarized using image processing software (Image Analyzer V20LAB Ver.1.3, manufactured by Nikon), the number of micropores (number of bubbles) is confirmed, and the area of each micropore (bubble) is equivalent to the area circle The diameter and its average value were calculated as the average fine pore diameter. Then, from the ratio of the area of the micropores, the micropore area per 1 cm 2 was determined. In addition, the cutoff value (lower limit) of the bubble diameter was not set. Further, in Comparative Examples 1 and 3, no micropores were observed. Although micropores were not confirmed in Comparative Example 3 in which pores were formed in the holding surface and Comparative Example 4 in which the holding surface was subjected to buffing, openings derived from the pores and buffing were confirmed. The The average diameter of the identified openings and the area per 1 cm 2 were calculated as reference values (indicated by * 2 in the table).
〔吸着力〕
　１００ｍｍ角試料に加工した保持パッドの保持面に霧吹きで水を吹き付け、付着した水を拭き取らずに６０ｍｍφ（厚さ約１ｍｍ）ガラスを試料に押しつけて吸着させた。次に、ガラスの上から１０ｋｇの重りを乗せ１分間静止した。重りを乗せたまま、ガラスに取り付けられたワイヤーを速度１００ｍｍ／ｍｉｎで、引張万能試験機（「テンシロン」、Ａ＆Ｄ社製、ＲＴＣ－１２１０Ａ）により垂直方向に引っ張り、荷重ピーク値を測定した。さらに、この荷重ピーク値の測定を５回繰り返し、計６回の荷重ピーク値の平均を吸着力とした。
（評価基準）
　○：吸着力が５ｋｇｆ以上２５ｋｇｆ以下
　×：吸着力が５ｋｇｆ未満又は２５ｋｇｆ超過 [Adhesive force]
Water was sprayed by spraying onto the holding surface of the holding pad processed into a 100 mm square sample, and a glass of 60 mm diameter (about 1 mm in thickness) was pressed against the sample and absorbed without wiping off the attached water. Next, a 10 kg weight was placed on the glass and rested for 1 minute. With the weight placed, the wire attached to the glass was pulled in the vertical direction at a speed of 100 mm / min with a universal tensile tester (“Tensilon”, manufactured by A & D, RTC-1210A), and the load peak value was measured. Furthermore, the measurement of the load peak value was repeated five times, and the average of the load peak values of six times in total was taken as the adsorption force.
(Evaluation criteria)
○: Adsorption force is 5 kgf or more and 25 kgf or less ×: Adsorption force is less than 5 kgf or more than 25 kgf
〔剥離性〕
　１００ｍｍ角試料に加工した保持パッドの保持面に霧吹きで水を吹き付け、付着した水を拭き取らずに６０ｍｍφ（厚さ約０．５ｍｍ）ガラスを試料に押しつけて吸着させた。次に、ガラスを保持面に対して２度斜め上方向の角度に速度１０ｍｍ／ｍｉｎで、引張万能試験機（「テンシロン」、Ａ＆Ｄ社製、ＲＴＣ－１２１０Ａ）により引張、保持面からガラスを剥離させた。測定は１０枚のガラスに対して行い、以下の評価基準に従って評価を行った。
（評価基準）
　○：１枚も割れが確認できなかった。
　×：１枚以上で割れが確認された。 [Peelability]
Water was sprayed by spraying onto the holding surface of the holding pad processed into a 100 mm square sample, and a glass of 60 mm diameter (about 0.5 mm in thickness) was pressed against the sample and absorbed without wiping off the attached water. Next, the glass is pulled at an angle of 2 degrees obliquely upward with respect to the holding surface at a speed of 10 mm / min with a tensile universal testing machine (“Tensilon”, A & D, RTC-1210A), and the glass is peeled off from the holding surface I did. The measurement was performed on 10 sheets of glass, and the evaluation was performed according to the following evaluation criteria.
(Evaluation criteria)
○: No cracks were confirmed.
X: A crack was confirmed with one or more sheets.
　なお、図５に、実施例２～３と比較例２の保持面の表面の顕微鏡写真を示す。 Note that FIG. 5 shows a micrograph of the surface of the holding surface of Examples 2 to 3 and Comparative Example 2.
Figure JPOXMLDOC01-appb-T000001
  　 
Ｃ０　　　　　　：エタノールを滴下した直後の保持面に対するエタノールの接触角
Ｃ２０　　　　　：エタノールの滴下から２０秒後の保持面に対するエタノールの接触角
（Ｃ０－Ｃ２０）／２０：エタノールの浸透速度（度／秒）
Ｗ０　　　　　　：保持面に水を滴下した直後の保持面に対する水の接触角
＊１　　　　　　：（Ｃ０－Ｃｔ）／ｔの式によって求めた参考値
＊２　　　　　　：細孔およびバフ処理由来の開口の平均径および面積
Figure JPOXMLDOC01-appb-T000001
C 0 : Contact angle of ethanol to holding surface immediately after dropping ethanol C 20 : Contact angle of ethanol to holding surface 20 seconds after dropping of ethanol (C 0 -C 20 ) / 20: permeation rate of ethanol (degree / Second)
W 0 : Contact angle of water with respect to the holding surface immediately after dropping water on the holding surface * 1: Reference value determined by the formula of (C 0 -Ct) / t * 2: Average of openings from pores and buffing Diameter and area
　エタノールの浸透速度が１．０～２．０度／秒である実施例１～３は吸着力が良好であり、剥離性も良好であった。また、エタノールの浸透速度が１．０未満であった比較例２は、吸着力が高すぎて、基板を剥離する際に割れが生じる場合があった。さらに、エタノールの浸透が速すぎて浸透速度が測定できなかった比較例３～４は、実施例１～３よりも吸着力が低く、剥離性に問題はなかったものの、研磨中の被研磨物の横ずれなどの問題が懸念された。 In Examples 1 to 3 in which the permeation rate of ethanol is 1.0 to 2.0 degrees / second, the adsorptivity was good and the removability was also good. In addition, in Comparative Example 2 in which the permeation rate of ethanol was less than 1.0, the adsorptive power was too high, and there were cases in which cracking occurred when the substrate was peeled off. Furthermore, Comparative Examples 3 to 4 in which the permeation rate of ethanol could not be measured because the permeation of ethanol was too fast were lower in adsorptive power than Examples 1 to 3 and although there was no problem in peelability, There was concern about problems such as
　本実施形態の保持パッドは、研磨加工分野の被研磨物の保持パッドとして産業上の利用可能性を有する。 The holding pad of the present embodiment has industrial applicability as a holding pad of an object to be polished in the field of polishing processing.

Claims (13)

  1. 　被研磨物を保持するための保持面を有する樹脂シートを備える保持パッドであって、
    　下記式（１）で表されるエタノールの前記保持面への浸透速度が、１．０～２．０度／秒である、
    　保持パッド。
    　浸透速度＝（Ｃ０－Ｃ２０）／２０　　　・・・　（１）
    　Ｃ０：前記保持面にエタノールを滴下した直後の前記保持面に対する前記エタノールの接触角
    　Ｃ２０：前記エタノールの滴下から２０秒後の前記保持面に対する前記エタノールの前記接触角     A holding pad comprising a resin sheet having a holding surface for holding an object to be polished, the holding pad comprising:
    The permeation rate of ethanol to the holding surface represented by the following formula (1) is 1.0 to 2.0 degrees / second.
    Holding pad.
    Penetration rate = (C 0 -C 20) / 20 ··· (1)
    C 0 : contact angle of the ethanol with respect to the holding surface immediately after dropping ethanol onto the holding surface C 20 : the contact angle of the ethanol with respect to the holding surface 20 seconds after the dropping of the ethanol
  2. 　前記保持面に水を滴下し、前記水の滴下直後の前記保持面に対する前記水の接触角Ｗ０が、１００～１５０度である、
    　請求項１に記載の保持パッド。     Water is dropped on the holding surface, and a contact angle W 0 of the water with respect to the holding surface immediately after the dropping of the water is 100 to 150 degrees.
    The holding pad according to claim 1.
  3. 　前記保持面に形成された微細孔の平均微細孔径が、０．１～５．０μｍである、
    　請求項１又は２に記載の保持パッド。     The average micropore diameter of the micropores formed in the holding surface is 0.1 to 5.0 μm,
    The holding pad according to claim 1 or 2.
  4. 　前記保持面に形成された微細孔の微細孔面積が、保持面１ｃｍ２当たり、５．０×１０４～５．０×１０６μｍ２である、
    　請求項１～３のいずれか１項に記載の保持パッド。     The micropore area of the micropores formed in the holding surface is 5.0 × 10 4 to 5.0 × 10 6 μm 2 per 1 cm 2 of the holding surface.
    The holding pad according to any one of claims 1 to 3.
  5. 　前記樹脂シートをＮ，Ｎ－ジメチルホルムアミドで溶解し、得られた溶液を乾燥させて得られる無発泡樹脂シートの破断強度が、３０ＭＰａ以上である、
    　請求項１～４のいずれか１項に記載の保持パッド。     The breaking strength of the non-foamed resin sheet obtained by dissolving the resin sheet with N, N-dimethylformamide and drying the obtained solution is 30 MPa or more.
    The holding pad according to any one of claims 1 to 4.
  6. 　前記樹脂シートを構成する樹脂の１００％モジュラスが、３．０～１０ＭＰａである、
    　請求項１～５のいずれか１項に記載の保持パッド。     The 100% modulus of the resin constituting the resin sheet is 3.0 to 10 MPa,
    The holding pad according to any one of claims 1 to 5.
  7. 　前記樹脂シートが、ポリウレタン系樹脂を含有する、
    　請求項１～６のいずれか１項に記載の保持パッド。     The resin sheet contains a polyurethane resin,
    The holding pad according to any one of claims 1 to 6.
  8. 　前記樹脂シートが、ポリウレタン樹脂シートを延伸したものである、
    　請求項１～７のいずれか１項に記載の保持パッド。     The resin sheet is obtained by stretching a polyurethane resin sheet,
    The holding pad according to any one of claims 1 to 7.
  9. 　前記樹脂シートが、撥水剤を含有する、
    　請求項１～８のいずれか１項に記載の保持パッド。     The resin sheet contains a water repellent,
    A holding pad according to any one of the preceding claims.
  10. 　前記撥水剤が、炭素数が６～８のパーフルオロアルキル基を有するフッ素系撥水剤を含む、
    　請求項９に記載の保持パッド。     The water repellent includes a fluorine-based water repellent having a C 6-8 perfluoroalkyl group.
    The holding pad according to claim 9.
  11. 　前記撥水剤の含有量が、前記樹脂シートの総量に対して、０．５～５．０質量％である、
    　請求項９又は１０に記載の保持パッド。     The content of the water repellent agent is 0.5 to 5.0% by mass with respect to the total amount of the resin sheet.
    A holding pad according to claim 9 or 10.
  12. 　樹脂を溶媒中に混合溶解して樹脂溶液を調製する溶液調製工程と、
    　前記樹脂溶液の塗膜を形成する塗膜形成工程と、
    　前記塗膜を、前記樹脂の貧溶媒である凝固液に浸漬して、樹脂シートを作製する浸漬工程と、
    　前記樹脂シートを延伸して、該樹脂シートの表面に微細孔を形成する孔形成工程と、を有する、
    　保持パッドの製造方法。     A solution preparing step of preparing a resin solution by mixing and dissolving the resin in a solvent;
    A coating film forming step of forming a coating film of the resin solution;
    An immersing step of immersing the coating film in a coagulating solution which is a poor solvent for the resin to prepare a resin sheet;
    Forming a fine hole on the surface of the resin sheet by stretching the resin sheet;
    Method of manufacturing holding pad.
  13. 　前記樹脂が、ポリウレタン系樹脂を含む、
    　請求項１２に記載の保持パッドの製造方法。     The resin includes a polyurethane resin,
    A method of manufacturing a holding pad according to claim 12.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7474087B2 (en) 2020-03-19 2024-04-24 富士紡ホールディングス株式会社 Holding pad, manufacturing method thereof, and manufacturing method of polished product

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008168380A (en) * 2007-01-11 2008-07-24 Fujibo Holdings Inc Holding pad
JP2011011304A (en) * 2009-07-03 2011-01-20 Nhk Spring Co Ltd Polishing and holding pad, and method of manufacturing the same
JP2012071399A (en) * 2010-09-29 2012-04-12 Fujibo Holdings Inc Holding material
JP2014079878A (en) * 2012-09-28 2014-05-08 Fujibo Holdings Inc Polishing pad
JP2016039180A (en) * 2014-08-05 2016-03-22 信越半導体株式会社 Method for evaluating polishing cloth
JP2016055385A (en) * 2014-09-10 2016-04-21 丸石産業株式会社 Holding pad

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59189285A (en) * 1983-04-11 1984-10-26 日本鉱業株式会社 Indirect heating type rotary furnace
JP2004154920A (en) 2002-11-08 2004-06-03 Central Glass Co Ltd Suction pad for suction-holding and grinding glass substrate
JP4997859B2 (en) * 2006-07-21 2012-08-08 信越半導体株式会社 Backing pad, workpiece polishing apparatus and workpiece polishing method
JP5292818B2 (en) * 2008-01-11 2013-09-18 ダイキン工業株式会社 Polymerizable fluorine-containing monomer, fluorine-containing polymer and resist pattern forming method
JP5587576B2 (en) * 2009-09-03 2014-09-10 富士紡ホールディングス株式会社 Holding pad
CN102630327B (en) * 2009-12-28 2014-07-16 东丽株式会社 Conductive laminated body and touch panel using the same
JP5428924B2 (en) * 2010-02-16 2014-02-26 東レ株式会社 Conductive laminate and touch panel using the same
JP4996767B1 (en) 2010-11-12 2012-08-08 株式会社Ｆｉｌｗｅｌ Manufacturing method of holding material for single-side polishing
JP2013094929A (en) * 2011-11-04 2013-05-20 Nhk Spring Co Ltd Backing material
JP5912770B2 (en) * 2012-03-30 2016-04-27 富士紡ホールディングス株式会社 Holding pad
JP6127692B2 (en) * 2013-04-26 2017-05-17 日産自動車株式会社 Membrane electrode assembly manufacturing apparatus and holding member used for manufacturing membrane electrode assembly
WO2015046203A1 (en) * 2013-09-30 2015-04-02 富士紡ホールディングス株式会社 Holding pad
EP3489290B1 (en) 2016-07-25 2022-10-05 Teijin Limited Composite membrane
CN106926116B (en) * 2017-01-23 2018-07-13 安徽禾臣新材料有限公司 STN glass polishing absorption layers
CN106985061A (en) * 2017-03-21 2017-07-28 安徽禾臣新材料有限公司 A kind of absorption layer for being applied to essence polishing

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008168380A (en) * 2007-01-11 2008-07-24 Fujibo Holdings Inc Holding pad
JP2011011304A (en) * 2009-07-03 2011-01-20 Nhk Spring Co Ltd Polishing and holding pad, and method of manufacturing the same
JP2012071399A (en) * 2010-09-29 2012-04-12 Fujibo Holdings Inc Holding material
JP2014079878A (en) * 2012-09-28 2014-05-08 Fujibo Holdings Inc Polishing pad
JP2016039180A (en) * 2014-08-05 2016-03-22 信越半導体株式会社 Method for evaluating polishing cloth
JP2016055385A (en) * 2014-09-10 2016-04-21 丸石産業株式会社 Holding pad

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7474087B2 (en) 2020-03-19 2024-04-24 富士紡ホールディングス株式会社 Holding pad, manufacturing method thereof, and manufacturing method of polished product

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