WO2019072204A1 - 触控基板及其制作方法、显示装置 - Google Patents

触控基板及其制作方法、显示装置 Download PDF

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Publication number
WO2019072204A1
WO2019072204A1 PCT/CN2018/109782 CN2018109782W WO2019072204A1 WO 2019072204 A1 WO2019072204 A1 WO 2019072204A1 CN 2018109782 W CN2018109782 W CN 2018109782W WO 2019072204 A1 WO2019072204 A1 WO 2019072204A1
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WO
WIPO (PCT)
Prior art keywords
touch
substrate
layer
metal
metal layer
Prior art date
Application number
PCT/CN2018/109782
Other languages
English (en)
French (fr)
Inventor
王静
吴玲艳
谢涛峰
谢晓冬
何敏
李冬
曾琴
张卫
郑启涛
韩骁
吴启迪
李亚英
朱顺成
Original Assignee
京东方科技集团股份有限公司
合肥鑫晟光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 合肥鑫晟光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US16/339,944 priority Critical patent/US11573666B2/en
Publication of WO2019072204A1 publication Critical patent/WO2019072204A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material

Definitions

  • the present disclosure relates to the field of touch display technologies, and in particular, to a touch substrate, a method for fabricating the same, and a display device.
  • touch screens can be roughly divided into four types: resistive, capacitive, infrared, and acoustic.
  • resistive capacitive touch screen has become the mainstream and future development trend in the touch screen market.
  • capacitive touch screen has become the mainstream and future development trend in the touch screen market.
  • the capacitive touch screen includes a touch electrode and a touch trace.
  • the touch electrodes are disposed on the array substrate or the color film substrate, and the touch traces are distributed around the touch screen, and each touch electrode needs to be touched. Lines are connected.
  • the touch traces in the capacitive touch screen of the related art occupy a large area and cannot meet the design requirements of the narrow bezel product.
  • an embodiment of the present disclosure provides a touch substrate including: a substrate and a touch trace disposed on the substrate; wherein the touch trace includes a plurality of cutout patterns.
  • the touch trace includes a metal mesh structure and a plurality of holes formed between the metal mesh structures; the plurality of holes form the hollow pattern.
  • the manufacturing material of the trace includes: metal.
  • the touch trace includes: a first metal layer
  • the first metal layer includes a plurality of hollow patterns.
  • the touch trace includes: a first metal layer, a transparent conductive layer, and a second metal layer;
  • the first metal layer and the second metal layer comprise a plurality of hollow patterns
  • the first metal layer is disposed on the substrate; the transparent conductive layer and the second metal layer are sequentially disposed on a side of the first metal layer away from the substrate.
  • the touch substrate further includes: an insulating layer and a touch layer; the insulating layer is disposed on a side of the touch trace away from the substrate; the touch layer is disposed on the insulating layer And connected to the touch trace through an insulating layer via.
  • the hollow pattern comprises any one or more of a triangle, a quadrangle, a hexagon, a circle or an ellipse.
  • the first metal layer and the second metal layer have a line width of 4 micrometers to 6 micrometers.
  • the material of the transparent conductive layer is indium tin oxide.
  • the material of the insulating layer is a negative photoresist
  • the material of the touch layer is indium tin oxide
  • an embodiment of the present disclosure further provides a display device including the above touch substrate.
  • an embodiment of the present disclosure further provides a method for fabricating a touch substrate, including:
  • a touch trace having a plurality of hollow patterns is formed on the substrate.
  • the forming a touch trace having a plurality of hollow patterns on the substrate includes:
  • a first metal layer including a hollow pattern composed of a plurality of traces is formed by a patterning process.
  • the forming a touch trace having a plurality of metal line formed hollow patterns on the substrate includes:
  • a first metal layer including a hollow pattern formed by a plurality of traces by a patterning process
  • a second metal layer including a hollow pattern composed of a plurality of traces is formed by a patterning process.
  • the method further includes:
  • the insulating layer is formed by an etching process.
  • the method further includes:
  • a via hole is formed on the insulating layer.
  • the method further includes:
  • the touch layer is formed by a patterning process.
  • FIG. 1 is a schematic structural diagram of a touch substrate according to some embodiments of the present disclosure
  • FIG. 2 is another schematic structural diagram of a touch substrate provided by some embodiments of the present disclosure.
  • FIG. 3 is a schematic structural diagram of a touch substrate provided by some embodiments of the present disclosure.
  • FIG. 4 is another schematic structural diagram of a touch substrate according to some embodiments of the present disclosure.
  • FIG. 5 is a flowchart of a method for fabricating a touch substrate according to some embodiments of the present disclosure
  • 6A is a schematic diagram 1 of a method for fabricating a touch substrate according to some embodiments of the present disclosure
  • 6B is a second schematic diagram of a method for fabricating a touch substrate according to some embodiments of the present disclosure
  • 6C is a third schematic diagram of a method for fabricating a touch substrate according to some embodiments of the present disclosure.
  • FIG. 7A is a first schematic diagram of a method for fabricating a touch substrate according to some embodiments of the present disclosure.
  • FIG. 7B is a second schematic diagram of a method for fabricating a touch substrate according to some embodiments of the present disclosure.
  • FIG. 7C is a third schematic diagram of a method for fabricating a touch substrate according to some embodiments of the present disclosure.
  • FIG. 7D is a schematic diagram 4 of a method for fabricating a touch substrate according to some embodiments of the present disclosure.
  • the touch screen in the related art generally includes: a touch area and a frame area, wherein the touch area is provided with a plurality of touch electrodes, and the frame area disposed around the touch screen is disposed to be connected to the input end of the touch electrode.
  • the frame area is 1.1mm in total, including: touch trace 0.6mm, peripheral ground distance 0.2mm, and cover 0.3mm.
  • the cover plate is used to prevent leakage of the touch trace, which causes visual touch traces to be visible.
  • the touch traces in the related art generally adopt strip-shaped solid metal traces, but the line width of the touch traces cannot be extremely narrow due to the precision requirements of the related devices.
  • the width of a single touch trace is 20 micrometers to 30 micrometers, which results in a large area of multiple touch traces distributed around the touch screen.
  • the touch screen in the related art must be provided with a cover to solve the visual effect.
  • the touch line is visible, and the touch screen in the related art cannot meet the design requirements of the narrow frame product.
  • the embodiment of the present disclosure provides a touch substrate, a manufacturing method thereof, and a display device.
  • FIG. 1 is a schematic structural diagram of a touch substrate provided by some embodiments of the present disclosure.
  • a touch substrate provided by the embodiment of the present disclosure includes a substrate 10 and a touch trace disposed on the substrate 10 .
  • the touch trace includes a hollow pattern formed by a plurality of metal lines.
  • the substrate 10 may be a flexible substrate, that is, the material of the substrate used is a flexible material, such as polyimide, and the substrate 10 may also be made of glass, plastic, or the like, which is not limited in the present disclosure.
  • the touch trace includes: a first metal layer 21 .
  • the first metal layer 21 includes a hollow pattern 210 formed of a plurality of metal lines.
  • the material of the first metal layer 21 may be a metal such as copper, iron, aluminum, or molybdenum, which may make the touch trace have good conductivity, which is not limited in the disclosure.
  • the first metal layer 21 has a line width of 4 micrometers to 6 micrometers.
  • the hollow pattern 210 includes any one or more of a triangle, a quadrangle, a hexagon, a circle, or an ellipse, that is, each of the hollow patterns on the touch trace may be all the same or all different.
  • the disclosure may be partially the same, and the disclosure is not limited thereto.
  • FIG. 1 is an example in which the same hollow pattern of the touch trace is taken as an example.
  • the touch substrate includes: a touch area and a frame area, wherein the touch line is disposed in the frame area, the touch area does not include a metal trace layer, and the touch trace is formed only in the frame area, thereby avoiding metal The problem of shadowing.
  • the touch electrodes are connected to the flexible printed circuit board through the touch traces.
  • each of the hollow patterns in the touch line is arranged along the extending direction of the touch line.
  • the arrangement may include: sequentially or misaligned. It should be noted that each hollow pattern is spaced, two phases. The spacing between the adjacent hollow patterns may be limited according to specific conditions, and the patterns of the hollow patterns sequentially disposed along the extending direction of the touch lines may be the same or different. In some embodiments, the patterns of the hollow patterns sequentially disposed along the extending direction of the touch traces are the same, which facilitates the preparation of the touch traces.
  • the touch substrate provided by the embodiment of the present disclosure includes: a substrate and a touch trace disposed on the substrate; wherein the touch trace includes: a hollow pattern formed by a plurality of metal lines, and the touch in the technical solution of the embodiment of the present disclosure
  • the control trace includes a hollow pattern formed by a plurality of metal lines, so that the width of the touch trace is small, and the occupied area of the touch trace is reduced, even if the leakage is small, the human eye can hardly distinguish, and the visual touch trace is solved.
  • the visible problem makes it unnecessary to set a cover on the touch screen to prevent leakage of the touch line, thereby realizing the design requirement of the narrow frame of the touch screen.
  • FIG. 2 is another schematic structural diagram of a touch substrate provided by some embodiments of the present disclosure.
  • the touch substrate further includes: an insulating layer 30 and a touch layer 40 .
  • the insulating layer 30 is disposed on a side of the touch trace away from the substrate 10; the touch layer 40 is disposed on the insulating layer 30 and connected to the touch trace through the via 31 in the insulating layer 30.
  • the material of the insulating layer 30 is an organic OC material, and the OC material may be a negative photoresist.
  • the material of the touch layer 40 is indium tin oxide.
  • the touch lines distributed around the display screen can be visually invisible, and can also implement the touch function, and further, the display is achieved.
  • the screen has no border effect on the visual and touch, which satisfies the product design requirements of the narrow bezel.
  • FIG. 3 is a schematic structural diagram of a touch substrate according to some embodiments of the present disclosure.
  • the touch substrate provided by the embodiment of the present disclosure includes: a substrate 10 and a touch trace disposed on the substrate 10 .
  • the touch trace includes a hollow pattern formed by a plurality of metal lines.
  • the substrate 10 may be a flexible substrate, that is, the material of the substrate used is a flexible material, such as polyimide, and the substrate 10 may also be made of glass, plastic or the like, which is not limited in the disclosure.
  • the touch trace includes: a first metal layer 21, a transparent conductive layer 22, and a second metal layer 23.
  • the first metal layer 21 and the second metal layer 23 include a hollow pattern formed by a plurality of metal lines; the transparent conductive layer 22 and the second metal layer 23 are sequentially disposed on a side of the first metal layer 21 away from the substrate 10.
  • the first metal layer 21 and the second metal layer 23 are disposed on both sides of the transparent conductive layer 22, that is, the transparent conductive layer 22 is sandwiched between the first metal layer 21 and the second metal layer. Between 23 .
  • the material of the first metal layer 21 may be metals such as copper, iron, aluminum, and molybdenum
  • the material of the second metal layer 23 may be metals such as copper, iron, aluminum, and molybdenum. It is to be understood that the first metal The materials of the layer 21 and the second metal layer 23 may be the same or different, and the present disclosure does not limit this.
  • the touch line in this embodiment includes the first metal layer and the second metal layer.
  • the arrangement can make the touch line have good conductivity, which is not limited in the disclosure.
  • the first metal layer 21 has a line width of 4 micrometers to 6 micrometers
  • the second metal layer 23 has a line width of 4 micrometers to 6 micrometers. It should be understood that the line width of the first metal layer 21 and the line width of the second metal layer 23 may be the same or different, and the disclosure is not limited thereto.
  • the material of the transparent conductive layer 22 is indium tin oxide.
  • the touch trace of the three-layer structure of the first metal layer, the transparent conductive layer and the second metal layer can improve the problem that the resistance of the touch trace is increased due to the thinning of the touch trace.
  • the hollow pattern may include any one or more of a triangle, a quadrangle, a hexagon, a circle, or an ellipse, that is, each of the hollow patterns on the touch trace may be all the same or all different.
  • the disclosure may be partially the same, and the disclosure is not limited thereto.
  • FIG. 3 is an example in which the same hollow pattern of the touch trace is taken as an example.
  • the touch substrate includes: a touch area and a frame area, wherein the touch line is disposed in the frame area, the touch area does not include a metal trace layer, and the touch trace is formed only in the frame area, thereby avoiding metal The problem of shadowing.
  • the touch electrodes are connected to the flexible printed circuit board through the touch traces.
  • each of the hollow patterns in the touch line is arranged along the extending direction of the touch line.
  • the arrangement may include: sequentially or misaligned. It should be noted that each hollow pattern is spaced, two phases. The spacing between the adjacent hollow patterns may be limited according to specific conditions, and the patterns of the hollow patterns sequentially disposed along the extending direction of the touch lines may be the same or different. In some embodiments, the patterns of the hollow patterns sequentially disposed along the extending direction of the touch traces are the same, which facilitates the preparation of the touch traces.
  • the touch substrate provided by the embodiment of the present disclosure includes: a substrate and a touch trace disposed on the substrate; wherein the touch trace includes: a hollow pattern formed by a plurality of metal lines, and the touch in the technical solution of the embodiment of the present disclosure
  • the control trace includes a hollow pattern formed by a plurality of metal lines, so that the width of the touch trace is small, and the occupied area of the touch trace is reduced, even if the leakage is small, the human eye can hardly distinguish, and the visual touch trace is solved.
  • the visible problem makes it unnecessary to set a cover on the touch screen to prevent leakage of the touch line, thereby realizing the design requirement of the narrow frame of the touch screen.
  • FIG. 4 is another schematic structural diagram of a touch substrate provided by some embodiments of the present disclosure. As shown in FIG. 4 , the touch substrate further includes an insulating layer 30 and a touch layer 40 .
  • the insulating layer 30 is disposed on a side of the touch trace away from the substrate 10; the touch layer 40 is disposed on the insulating layer 30 and connected to the touch trace through the via 31 on the insulating layer 30.
  • the material of the insulating layer 30 is an organic OC material, and the OC material may be a negative photoresist.
  • the material of the touch layer 40 is indium tin oxide.
  • the touch lines distributed around the display screen can be visually invisible, and can also implement the touch function, and further, the display is achieved.
  • the screen has no border effect on the visual and touch, which satisfies the product design requirements of the narrow bezel.
  • FIG. 5 is a flowchart of a method for fabricating a touch substrate according to some embodiments of the present disclosure. As shown in FIG. 5 , the method for fabricating the touch substrate specifically includes the following steps:
  • Step 100 providing a substrate.
  • the substrate may be a flexible substrate, that is, the material of the substrate used is a flexible material, such as polyimide, and the substrate may also be a material such as glass, plastic, etc., which is not limited in the disclosure.
  • Step 200 forming a touch trace having a hollow pattern formed by a plurality of metal lines on the substrate.
  • the step 200 specifically includes: depositing a first metal thin film on the substrate; forming a first metal layer including a hollow pattern formed by the plurality of metal lines by a patterning process.
  • the material of the first metal film may be a metal such as copper, iron, aluminum or molybdenum, which can make the touch trace have good conductivity, which is not limited in the disclosure.
  • the first metal thin film is deposited by a chemical vapor deposition (CVD) process, an evaporation process, or a sputtering process.
  • CVD chemical vapor deposition
  • evaporation process evaporation process
  • sputtering process evaporation process
  • the first metal layer has a line width of from 4 microns to 6 microns.
  • the hollow pattern includes: one or more of a triangle, a quadrangle, a hexagon, a circle, or an ellipse, that is, each of the hollow patterns on the touch trace may be all the same or may be all different. It may also be partially identical, and the disclosure does not limit this.
  • the patterning process includes: photoresist coating, exposure, development, etching, and lift-off. It should be understood that the patterning process uses the prior art to form a mask for the touch trace. That is, the fabrication method provided by the embodiment of the present disclosure does not increase the number of masks, that is, does not increase the fabrication. The complexity of the process.
  • each of the hollow patterns in the touch line is arranged along the extending direction of the touch line.
  • the arrangement may include: sequentially or misaligned. It should be noted that each hollow pattern is spaced, two phases. The spacing between the adjacent hollow patterns may be limited according to specific conditions, and the patterns of the hollow patterns sequentially disposed along the extending direction of the touch lines may be the same or different. In an embodiment, the patterns of the hollow patterns sequentially disposed along the extending direction of the touch traces are the same, which facilitates the preparation of the touch traces.
  • the method for fabricating a touch substrate includes: providing a substrate, depositing a touch trace having a plurality of metal lines formed on the substrate, and performing touch control in the technical solution of the embodiment of the present disclosure
  • the line includes a hollow pattern formed by a plurality of metal lines, so that the width of the touch line is small, and the occupied area of the touch line is reduced, and even if the leak is external, the human eye can hardly distinguish, and the visual touch line is visible.
  • the problem is that no cover plate is needed on the touch screen to prevent leakage of the touch line, and the design requirement of the narrow frame of the touch screen is realized.
  • the method further includes: coating the insulating film on the touch trace; forming an insulating layer by an etching process.
  • the material of the insulating layer is an organic OC material, and the OC material may be a negative photoresist.
  • the method further includes: forming a via hole on the insulating layer.
  • the method further comprises: depositing a second transparent conductive film on the insulating layer; forming the touch layer by a patterning process.
  • the material of the second transparent conductive film is indium tin oxide.
  • the touch lines distributed around the display screen can be visually invisible, and can also implement the touch function, and further, the display is achieved.
  • the screen has no border effect on the visual and touch, which satisfies the product design requirements of the narrow bezel.
  • a method for fabricating a touch substrate provided by some embodiments of the present disclosure is further specifically described below with reference to FIGS. 6A-6C.
  • the patterning process includes: photoresist coating, exposure, development, etching, stripping and the like.
  • Step 301 providing a substrate 10 and depositing a first metal film 210 on the substrate 10, as shown in FIG. 6A.
  • the first metal thin film may be deposited by a CVD process, an evaporation process, or a sputtering process.
  • the substrate 10 may be a flexible substrate, that is, the material of the substrate used is a flexible material, such as polyimide, and the substrate may also be a material such as glass or plastic.
  • the material of the first metal thin film 210 may be a metal such as copper, iron, aluminum, or molybdenum.
  • Step 302 The first metal film 210 is processed by a patterning process to form a first metal layer 21 having a hollow pattern, as shown in FIG. 6B.
  • the first metal layer 21 has a line width of 4 micrometers to 6 micrometers.
  • Step 303 coating an insulating film on the first metal layer 21, forming an insulating layer 30 by etching, and forming a via 31 on the insulating layer 30, as shown in FIG. 6C.
  • the material of the insulating film is an organic OC material, and the OC material may be a negative photoresist.
  • Step 304 depositing a second transparent conductive film on the insulating layer 30, and forming the touch layer 40 by a patterning process, as shown in FIG.
  • the second transparent conductive film may be deposited by a chemical vapor deposition (CVD) process, an evaporation process, or a sputtering process.
  • CVD chemical vapor deposition
  • evaporation process evaporation process
  • sputtering process evaporation process
  • the material of the second transparent conductive film is indium tin oxide.
  • the embodiment of the present disclosure provides a flowchart of a method for fabricating a touch substrate.
  • the method for fabricating the touch substrate specifically includes the following steps:
  • Step 100 providing a substrate.
  • the substrate may be a flexible substrate, that is, the material of the substrate used is a flexible material, such as polyimide, and the substrate may also be a material such as glass, plastic, etc., which is not limited in the disclosure.
  • Step 200 forming a touch trace having a hollow pattern formed by a plurality of metal lines on the substrate.
  • the step 200 specifically includes: depositing a first metal thin film on the substrate; forming a first metal layer including a hollow pattern formed by the plurality of metal lines by a patterning process; depositing the first transparent conductive film on the first metal layer; The patterning process forms a transparent conductive layer; depositing a second metal film on the transparent conductive layer; and forming a second metal layer including a hollow pattern formed by a plurality of metal lines by a patterning process.
  • the material of the first metal film may be metals such as copper, iron, aluminum, and molybdenum
  • the material of the second metal film may be metals such as copper, iron, aluminum, and molybdenum. It is to be understood that the first metal film and The material of the second metal film may be the same or different, and the present disclosure does not limit this.
  • the first metal thin film, the first transparent conductive film, and the second metal thin film may be deposited by a chemical vapor deposition (CVD) process, an evaporation process, or a sputtering process.
  • CVD chemical vapor deposition
  • evaporation process evaporation process
  • sputtering process evaporation process
  • the first metal layer has a line width of 4 micrometers to 6 micrometers
  • the second metal layer has a line width of 4 micrometers to 6 micrometers. It should be understood that the line width of the first metal layer and the line width of the second metal layer may be the same or different, and the disclosure does not limit this.
  • the material of the first transparent conductive film is indium tin oxide.
  • the touch trace of the three-layer structure of the first metal layer, the transparent conductive layer and the second metal layer is used to improve the resistance of the touch trace due to the thinning of the touch trace.
  • the hollow pattern includes: one or more of a triangle, a quadrangle, a hexagon, a circle, or an ellipse, that is, each of the hollow patterns on the touch trace may be all the same or may be all different. It may also be partially identical, and the disclosure does not limit this.
  • the patterning process includes: photoresist coating, exposure, development, etching, and lift-off. It should be understood that the patterning process uses the prior art to form a mask for the touch trace. That is, the fabrication method provided by the embodiment of the present disclosure does not increase the number of masks, that is, does not increase the fabrication. The complexity of the process.
  • each of the hollow patterns in the touch line is arranged along the extending direction of the touch line.
  • the arrangement may include: sequentially or misaligned. It should be noted that each hollow pattern is spaced, two phases. The spacing between the adjacent hollow patterns may be limited according to specific conditions, and the patterns of the hollow patterns sequentially disposed along the extending direction of the touch lines may be the same or different. In an embodiment, the patterns of the hollow patterns sequentially disposed along the extending direction of the touch traces are the same, which facilitates the preparation of the touch traces.
  • the method for fabricating a touch substrate includes: providing a substrate, depositing a touch trace having a plurality of metal lines formed on the substrate, and performing touch control in the technical solution of the embodiment of the present disclosure
  • the line includes a hollow pattern formed by a plurality of metal lines, so that the width of the touch line is small, and the occupied area of the touch line is reduced, and even if the leak is external, the human eye can hardly distinguish, and the visual touch line is visible.
  • the problem is that no cover plate is needed on the touch screen to prevent leakage of the touch line, and the design requirement of the narrow frame of the touch screen is realized.
  • the method further includes: coating the insulating film on the touch trace; forming an insulating layer by an etching process.
  • the material of the insulating layer is an organic OC material, and the OC material may be a negative photoresist.
  • the method further includes: forming a via hole on the insulating layer.
  • the method further comprises: depositing a second transparent conductive film on the insulating layer; forming the touch layer by a patterning process.
  • the material of the second transparent conductive film is indium tin oxide.
  • the touch lines distributed around the display screen can be visually invisible, and can also implement the touch function, and further, the display is achieved.
  • the screen has no border effect on the visual and touch, which satisfies the product design requirements of the narrow bezel.
  • a method for fabricating a touch substrate provided by some embodiments of the present disclosure is further specifically described below with reference to FIGS. 7A-7D.
  • the patterning process includes: photoresist coating, exposure, development, etching, stripping and the like.
  • Step 401 providing a substrate 10, and forming a first metal layer 21 having a hollow pattern on the substrate 10.
  • the step 401 is the same as the step 301 and the step 302 provided in the embodiment shown in FIG. 5, and details are not described herein again.
  • Step 402 depositing a first transparent conductive film 220 on the first metal layer 21 and covering the entire substrate 10, as shown in FIG. 7A.
  • the first transparent conductive film may be deposited by a CVD process, an evaporation process, or a sputtering process.
  • the material of the first transparent conductive film is indium tin oxide.
  • Step 403 processing the first transparent conductive film 220 by a patterning process to form a transparent conductive layer 22, as shown in FIG. 7B.
  • Step 404 depositing a second metal film on the transparent conductive layer 22, and forming a second metal layer 23 by a patterning process, as shown in FIG. 7C.
  • the material of the second metal film may be a metal such as copper, iron, aluminum, or molybdenum. It is to be understood that the materials of the first metal film and the second metal film may be the same or different, and the disclosure does not Any restrictions.
  • the second metal layer has a line width of from 4 microns to 6 microns. It should be understood that the line width of the first metal layer and the line width of the second metal layer may be the same or different, and the disclosure does not limit this.
  • Step 405 coating an insulating film on the second metal layer 23, forming an insulating layer 30 by etching, and forming a via 31 on the insulating layer 30, as shown in FIG. 7D.
  • the material of the insulating film is an organic OC material, and the OC material may be a negative photoresist.
  • Step 406 depositing a second transparent conductive film on the insulating layer 30, and forming the touch layer 40 by a patterning process, as shown in FIG.
  • the second transparent conductive film is deposited by a chemical vapor deposition (CVD) process, an evaporation process, or a sputtering process.
  • CVD chemical vapor deposition
  • evaporation process evaporation process
  • sputtering process evaporation process
  • the material of the second transparent conductive film is indium tin oxide.
  • Embodiments of the present disclosure provide a display device.
  • the display device includes a touch substrate.
  • the touch substrate is the touch substrate provided in the embodiment shown in FIG. 1 and the embodiment shown in FIG. 5 , and the implementation principle and implementation effect thereof are similar, and details are not described herein again.
  • the display device may be any product or component having a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, and the like.
  • a display function such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, and the like.
  • installation In the description of the embodiments of the present disclosure, it should be noted that the terms “installation”, “connected”, and “connected” are to be understood broadly, and may be, for example, a fixed connection or a Removable connection, or integral connection; may be mechanical connection or electrical connection; may be directly connected, or may be indirectly connected through an intermediate medium, and may be internal communication between the two elements.
  • the specific meanings of the above terms in the present disclosure can be understood in the specific circumstances by those skilled in the art.

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Abstract

一种触控基板及其制作方法、显示装置，该触控基板包括：基底（10）和设置在基底（10）上的触控走线；其中，触控走线包括多个金属线形成的镂空图案（210）。

Description

触控基板及其制作方法、显示装置
相关申请的交叉引用
本申请主张在2017年10月13日在中国提交的中国专利申请号No.201710956647.5的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及触控显示技术领域，具体涉及一种触控基板及其制作方法、显示装置。
背景技术
随着显示技术的飞速发展，触摸屏应用越来越广泛，依照感应方式的不同，触摸屏大致可以分为电阻式、电容式、红外线式、声波式四类。其中，电容式触摸屏已成为触摸屏市场上的主流和未来发展的趋势。
目前，电容式触摸屏包括触控电极和触控走线，其中，触控电极设置在阵列基板或彩膜基板上，触控走线分布在触摸屏四周，每个触控电极均需与触控走线相连。然而，相关技术中的电容式触摸屏中的触控走线占用了较大区域，不能满足窄边框产品的设计要求。
发明内容
在一个方面，本公开实施例提供了一种触控基板，包括：基底和设置在所述基底上的触控走线；其中，所述触控走线包括多个镂空图案。
可选地，所述触控走线包括金属网结构和形成在金属网结构之间的多个孔；所述多个孔形成所述镂空图案。
可选地，所述走线的制作材料包括：金属。
可选地，所述触控走线包括：第一金属层；
所述第一金属层包括多个镂空图案。
可选地，所述触控走线包括：第一金属层、透明导电层和第二金属层；
所述第一金属层和所述第二金属层包括多个镂空图案；
所述第一金属层设置在所述基底上；所述透明导电层和所述第二金属层依次设置在所述第一金属层远离所述基底的一侧。
可选地，所述触控基板还包括：绝缘层和触控层；所述绝缘层设置在所述触控走线远离所述基底的一侧；所述触控层设置在所述绝缘层上，并通过绝缘层过孔与所述触控走线连接。
可选地，所述镂空图案包括：三角形、四边形、六边形、圆形或椭圆形中任意一种或多种。
可选地，所述第一金属层和所述第二金属层的线宽为4微米-6微米。
可选地，所述透明导电层的材料为氧化铟锡。
可选地，所述绝缘层的材料为负性光刻胶，所述触控层的材料为氧化铟锡。
在另一方面，本公开实施例还提供一种显示装置，包括上述触控基板。
在又一方面，本公开实施例还提供一种触控基板的制作方法，包括：
提供一基底；
在基底上形成具有多个镂空图案的触控走线。
可选地，所述在基底上形成具有多个镂空图案的触控走线，具体包括：
在基底上沉积第一金属薄膜；
通过构图工艺形成包括多个走线构成的镂空图案的第一金属层。
可选地，所述在基底上形成具有多个金属线形成的镂空图案的触控走线，具体包括：
在基底上沉积第一金属薄膜；
通过构图工艺形成包括多个走线构成的镂空图案的第一金属层；
在第一金属层上沉积第一透明导电薄膜；
通过构图工艺形成透明导电层；
在透明导电层上沉积第二金属薄膜；
通过构图工艺，形成包括多个走线构成的镂空图案的第二金属层。
可选地，所述在基底上形成具有多个金属线形成的镂空图案的触控走线之后，所述方法还包括：
在所述触控走线上涂覆绝缘薄膜；
通过刻蚀处理形成绝缘层。
可选地，所述通过刻蚀处理形成绝缘层之后，所述方法还包括：
在绝缘层上形成过孔。
可选地，所述在绝缘层上形成过孔之后，所述方法还包括：
在绝缘层上沉积第二透明导电薄膜；
通过构图工艺形成触控层。
附图说明
附图用来提供对本公开技术方案的进一步理解，并且构成说明书的一部分，与本申请的实施例一起用于解释本公开的技术方案，并不构成对本公开技术方案的限制。
图1为本公开一些实施例提供的触控基板的结构示意图；
图2为本公开一些实施例提供的触控基板的另一结构示意图；
图3为本公开一些实施例提供的触控基板的结构示意图；
图4为本公开一些实施例提供的触控基板的另一结构示意图；
图5为本公开一些实施例提供的触控基板的制作方法的流程图；
图6A为本公开一些实施例提供的触控基板的制作方法的示意图一；
图6B为本公开一些实施例提供的触控基板的制作方法的示意图二；
图6C为本公开一些实施例提供的触控基板的制作方法的示意图三；
图7A为本公开一些实施例提供的触控基板的制作方法的示意图一；
图7B为本公开一些实施例提供的触控基板的制作方法的示意图二；
图7C为本公开一些实施例提供的触控基板的制作方法的示意图三；
图7D为本公开一些实施例提供的触控基板的制作方法的示意图四。
具体实施方式
为使本公开的目的、技术方案和优点更加清楚明白，下文中将结合附图对本公开的实施例进行详细说明。需要说明的是，在不冲突的情况下，本申请中的实施例及实施例中的特征可以相互任意组合。
除非另做定义，此处使用的技术术语或者科学术语应当为本公开所述领 域内具有一般技能的人士所理解的通常意义。本公开专利申请书名数以及权利要求书中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。同样，“一个”或者“一”等类似词语也不表示数量限制，而是表示存在至少一个。
目前，相关技术中的触摸屏一般包括：触控区域和边框区域，其中，触控区域中设置有多个触控电极，设置在触摸屏四周的边框区域中设置有与触控电极的输入端连接的多条触控走线，每个触控电极均要与触控走线相连。
以5.5寸触摸屏为例，说明触摸屏的边框区域的分布。边框区域共1.1mm，具体包括：触控走线0.6mm、外围地线距边距离0.2mm和盖板0.3mm。其中，盖板为了防止触控走线外漏，造成视觉上触控走线可见问题。
经本申请的发明人研究发现，相关技术中的触控走线一般采用条状实心金属走线，但因相关设备的精度需求，无法将触控走线的线宽做到极窄。一般来说，单条触控走线宽度为20微米-30微米，这就导致分布在触摸屏四周的多条触控走线需占用较大区域，相关技术中的触摸屏必须设置盖板以解决视觉上触控走线可见问题，进而使得相关技术中的触摸屏无法满足窄边框产品的设计需求。
为解决由于触控走线可见导致的相关技术中触摸屏无法满足窄边框产品的设计需求的技术问题，本公开实施例提供了一种触控基板及其制作方法、显示装置。
图1为本公开一些实施例提供的触控基板的结构示意图，如图1所示，本公开实施例提供的触控基板，包括：基底10和设置在基底10上的触控走线。触控走线包括多个金属线形成的镂空图案。
可选地，基底10可以为柔性基底，也即所采用的基底的材料为柔性材料，例如聚酰亚胺等，基底10也可以玻璃、塑料等材料，本公开对此不作任何限定。
可选地，触控走线包括：第一金属层21。第一金属层21包括多个金属线形成的镂空图案210。
可选地，第一金属层21的材料可以是铜、铁、铝和钼等金属，可以使得触控走线具有良好的导电性，本公开对此不作任何限定。
可选地，第一金属层21的线宽为4微米-6微米。
可选地，镂空图案210包括：三角形、四边形、六边形、圆形或椭圆形中任意一种或多种，也即触控走线上的各个镂空图案可以全部相同，也可以是全部不同，也可以是部分相同，本公开对此不作任何限定，图1是以触控走线的部分镂空图案的相同为例进行说明的。
具体的，触控基板包括：触控区域和边框区域，其中，触控走线设置在边框区域，触控区域不包括金属走线层，仅在边框区域形成触控走线，从而避免了金属消影的问题。需要说明的是，触控电极通过触控走线连接至柔性印刷电路板上。
具体的，触控走线中的各个镂空图案沿触控走线的延伸方向排列，其中，排列方式可以包括：依次排列或者错位排列，需要说明的是，各个镂空图案是间隔设置的，两相邻的镂空图案之间间距根据具体情况可以限定，且沿触控走线的延伸方向依次设置的镂空图案的图形可以相同，也可以不同。在一些实施例中，沿触控走线的延伸方向依次设置的镂空图案的图形相同，可以方便触控走线的制备。
本公开实施例提供的触控基板包括：基底和设置在基底上的触控走线；其中，触控走线包括：多个金属线形成的镂空图案，本公开实施例的技术方案中的触控走线包括多个金属线形成的镂空图案，使得触控走线的宽度较小，减小了触控走线占用区域，即使外漏，人眼几乎无法分辨，解决视觉上触控走线可见的问题，使得在触控屏上不需设置盖板来防止触控走线外漏，实现了触控屏的窄边框的设计要求。
可选地，图2为本公开一些实施例提供的触控基板的另一结构示意图，如图2所示，该触控基板还包括：绝缘层30和触控层40。
具体的，绝缘层30设置在触控走线远离基底10的一侧；触控层40设置在绝缘层30上，并通过绝缘层30中的过孔31与触控走线连接。
可选地，绝缘层30的材料为有机OC材料，OC材料可以为负性光刻胶。
可选地，触控层40的材料为氧化铟锡。
本公开实施例通过在触控走线上增加绝缘层和触控层，能够实现分布在显示屏四周的触控走线不仅视觉不可见，而且还能够实现触控功能，进一步 地，达到了显示屏在视觉上和触控上无边框的效果，满足了窄边框的产品设计需求。
图3为本公开一些实施例提供的触控基板的结构示意图，如图3所示，本公开实施例提供的触控基板，包括：基底10和设置在基底10上的触控走线。触控走线包括多个金属线形成的镂空图案。
其中，基底10可以为柔性基底，也即所采用的基底的材料为柔性材料，例如聚酰亚胺等，基底10也可以玻璃、塑料等材料，本公开对此不作任何限定。
可选地，触控走线包括：第一金属层21、透明导电层22和第二金属层23。
第一金属层21和第二金属层23包括多个金属线形成的镂空图案；透明导电层22和第二金属层23依次设置在第一金属层21远离基底10的一侧。在图3所示的实施例中，第一金属层21和第二金属层23设置在透明导电层22的两侧，也即透明导电层22夹设在第一金属层21和第二金属层23之间。
可选地，第一金属层21的材料可以是铜、铁、铝和钼等金属，第二金属层23的材料可以是铜、铁、铝和钼等金属，需要了解的是，第一金属层21和第二金属层23的材料可以相同，也可以不同，本公开对此不作任何限定。
本实施例中的触控走线包括第一金属层和第二金属层，这样布置可以使得触控走线具有良好的导电性，本公开对此不作任何限定。
可选地，第一金属层21的线宽为4微米-6微米，第二金属层23的线宽为4微米-6微米。需要了解的是，第一金属层21的线宽和第二金属层23的线宽可以相同，也可以不同，本公开对此不作任何限定。
可选地，透明导电层22的材料为氧化铟锡。
本公开实施例采用第一金属层、透明导电层和第二金属层的三层结构的触控走线，能够改善因触控走线变细带来触控走线阻值升高的问题。
可选地，镂空图案可以包括：三角形、四边形、六边形、圆形或椭圆形中任意一种或多种，也即触控走线上的各个镂空图案可以全部相同，也可以是全部不同，也可以是部分相同，本公开对此不作任何限定，图3是以触控走线的部分镂空图案的相同为例进行说明的。
具体的，触控基板包括：触控区域和边框区域，其中，触控走线设置在边框区域，触控区域不包括金属走线层，仅在边框区域形成触控走线，从而避免了金属消影的问题。需要说明的是，触控电极通过触控走线连接至柔性印刷电路板上。
具体的，触控走线中的各个镂空图案沿触控走线的延伸方向排列，其中，排列方式可以包括：依次排列或者错位排列，需要说明的是，各个镂空图案是间隔设置的，两相邻的镂空图案之间间距根据具体情况可以限定，且沿触控走线的延伸方向依次设置的镂空图案的图形可以相同，也可以不同。在一些实施例中，沿触控走线的延伸方向依次设置的镂空图案的图形相同，可以方便触控走线的制备。
本公开实施例提供的触控基板包括：基底和设置在基底上的触控走线；其中，触控走线包括：多个金属线形成的镂空图案，本公开实施例的技术方案中的触控走线包括多个金属线形成的镂空图案，使得触控走线的宽度较小，减小了触控走线占用区域，即使外漏，人眼几乎无法分辨，解决视觉上触控走线可见的问题，使得在触控屏上不需设置盖板来防止触控走线外漏，实现了触控屏的窄边框的设计要求。
可选地，图4为本公开一些实施例提供的触控基板的另一结构示意图，如图4所示，该触控基板还包括：绝缘层30和触控层40。
具体的，绝缘层30设置在触控走线远离基底10的一侧；触控层40设置在绝缘层30上，并通过绝缘层30上的过孔31与触控走线连接。
可选地，绝缘层30的材料为有机OC材料，OC材料可以为负性光刻胶。
可选地，触控层40的材料为氧化铟锡。
本公开实施例通过在触控走线上增加绝缘层和触控层，能够实现分布在显示屏四周的触控走线不仅视觉不可见，而且还能够实现触控功能，进一步地，达到了显示屏在视觉上和触控上无边框的效果，满足了窄边框的产品设计需求。
基于图1所示实施例的发明构思，图5为本公开一些实施例提供的触控基板的制作方法的流程图，如图5所示，该触控基板的制作方法具体包括以下步骤：
步骤100、提供一基底。
可选地，基底可以为柔性基底，也即所采用的基底的材料为柔性材料，例如聚酰亚胺等，基底也可以玻璃、塑料等材料，本公开对此不作任何限定。
步骤200、在基底上形成具有多个金属线形成的镂空图案的触控走线。
具体的，步骤200具体包括：在基底上沉积第一金属薄膜；通过构图工艺形成包括多个金属线形成的镂空图案的第一金属层。
可选地，第一金属薄膜的材料可以是铜、铁、铝和钼等金属，可以使得触控走线具有良好的导电性，本公开对此不作任何限定。
具体的，采用化学气相沉积(Chemical Vapor Deposition，简称CVD)工艺、蒸镀工艺或者溅射工艺沉积第一金属薄膜。
可选地，第一金属层的线宽为4微米-6微米。
可选地，镂空图案包括：三角形、四边形、六边形、圆形或椭圆形中任意一种或多种，也即触控走线上的各个镂空图案可以全部相同，也可以是全部不同，也可以是部分相同，本公开对此不作任何限定。
具体的，构图工艺包括：光刻胶涂覆、曝光、显影、刻蚀和剥离。需要了解的是，构图工艺采用的是现有技术形成触控走线的掩膜板，也就是说，本公开实施例提供的制作方法，并未增加掩膜板数量，也即并未增加制作工艺的复杂度。
具体的，触控走线中的各个镂空图案沿触控走线的延伸方向排列，其中，排列方式可以包括：依次排列或者错位排列，需要说明的是，各个镂空图案是间隔设置的，两相邻的镂空图案之间间距根据具体情况可以限定，且沿触控走线的延伸方向依次设置的镂空图案的图形可以相同，也可以不同。在一实施例中，沿触控走线的延伸方向依次设置的镂空图案的图形相同，可以方便触控走线的制备。
本公开实施例提供的触控基板的制作方法，包括：提供一基底，在基底上沉积具有多个金属线形成的镂空图案的触控走线，本公开实施例的技术方案中的触控走线包括多个金属线形成的镂空图案，使得触控走线的宽度较小，减小了触控走线占用区域，即使外漏，人眼几乎无法分辨，解决视觉上触控走线可见的问题，使得在触控屏上不需设置盖板来防止触控走线外漏，实现 了触控屏的窄边框的设计要求。
可选地，本公开实施例提供的触控基板的制作方法，在步骤200之后，该方法还包括：触控走线上涂覆绝缘薄膜；通过刻蚀处理形成绝缘层。
可选地，绝缘层的材料为有机OC材料，OC材料可以为负性光刻胶。
可选地，在通过刻蚀处理形成绝缘层之后，该方法还包括：在绝缘层上形成过孔。
可选地，在绝缘层上形成过孔之后，该方法还包括：在绝缘层上沉积第二透明导电薄膜；通过构图工艺形成触控层。
可选地，第二透明导电薄膜的材料为氧化铟锡。
本公开实施例通过在触控走线上增加绝缘层和触控层，能够实现分布在显示屏四周的触控走线不仅视觉不可见，而且还能够实现触控功能，进一步地，达到了显示屏在视觉上和触控上无边框的效果，满足了窄边框的产品设计需求。
下面结合图6A-图6C，进一步地具体描述本公开一些实施例提供的触控基板的制作方法。其中，构图工艺包括：光刻胶涂覆、曝光、显影、刻蚀、剥离等工艺步骤。
步骤301、提供一基底10，并在基底10上沉积第一金属薄膜210，具体如图6A所示。
具体的，可以采用CVD工艺、蒸镀工艺或者溅射工艺沉积第一金属薄膜。
其中，基底10可以为柔性基底，也即所采用的基底的材料为柔性材料，例如聚酰亚胺等，基底也可以玻璃、塑料等材料。
可选地，第一金属薄膜210的材料可以是铜、铁、铝和钼等金属。
步骤302、通过构图工艺对第一金属薄膜210进行处理，形成具有镂空图案的第一金属层21，具体如图6B所示。
可选地，第一金属层21的线宽为4微米-6微米。
步骤303、在第一金属层21上涂覆绝缘薄膜，通过刻蚀处理形成绝缘层30，并在绝缘层30上形成过孔31，具体如图6C所示。
可选地，绝缘薄膜的材料为有机OC材料，OC材料可以为负性光刻胶。
步骤304、在绝缘层30上沉积第二透明导电薄膜，通过构图工艺形成触 控层40，具体如图2所示。
具体的，可以采用化学气相沉积(Chemical Vapor Deposition，简称CVD)工艺、蒸镀工艺或者溅射工艺沉积第二透明导电薄膜。
可选地，第二透明导电薄膜的材料为氧化铟锡。
基于图3所示实施例的发明构思，本公开实施例提供一种触控基板的制作方法的流程图，该触控基板的制作方法具体包括以下步骤：
步骤100、提供一基底。
可选地，基底可以为柔性基底，也即所采用的基底的材料为柔性材料，例如聚酰亚胺等，基底也可以玻璃、塑料等材料，本公开对此不作任何限定。
步骤200、在基底上形成具有多个金属线形成的镂空图案的触控走线。
具体的，步骤200具体包括：在基底上沉积第一金属薄膜；通过构图工艺形成包括多个金属线形成的镂空图案的第一金属层；在第一金属层上沉积第一透明导电薄膜；通过构图工艺形成透明导电层；在透明导电层上沉积第二金属薄膜；通过构图工艺，形成包括多个金属线形成的镂空图案的第二金属层。
可选地，第一金属薄膜的材料可以是铜、铁、铝和钼等金属，第二金属薄膜的材料可以是铜、铁、铝和钼等金属，需要了解的是，第一金属薄膜和第二金属薄膜的材料可以相同，也可以不同，本公开对此不作任何限定。
具体的，可以采用化学气相沉积(Chemical Vapor Deposition，简称CVD)工艺、蒸镀工艺或者溅射工艺沉积第一金属薄膜、第一透明导电薄膜和第二金属薄膜。
可选地，第一金属层的线宽为4微米-6微米，第二金属层的线宽为4微米-6微米。需要了解的是，第一金属层的线宽和第二金属层的线宽可以相同，也可以不同，本公开对此不作任何限定。
可选地，第一透明导电薄膜的材料为氧化铟锡。
本公开实施例采用第一金属层、透明导电层和第二金属层的三层结构的触控走线，能够改善因触控走线变细带来触控走线阻值升高问题。
可选地，镂空图案包括：三角形、四边形、六边形、圆形或椭圆形中任意一种或多种，也即触控走线上的各个镂空图案可以全部相同，也可以是全 部不同，也可以是部分相同，本公开对此不作任何限定。
具体的，构图工艺包括：光刻胶涂覆、曝光、显影、刻蚀和剥离。需要了解的是，构图工艺采用的是现有技术形成触控走线的掩膜板，也就是说，本公开实施例提供的制作方法，并未增加掩膜板数量，也即并未增加制作工艺的复杂度。
具体的，触控走线中的各个镂空图案沿触控走线的延伸方向排列，其中，排列方式可以包括：依次排列或者错位排列，需要说明的是，各个镂空图案是间隔设置的，两相邻的镂空图案之间间距根据具体情况可以限定，且沿触控走线的延伸方向依次设置的镂空图案的图形可以相同，也可以不同。在一实施例中，沿触控走线的延伸方向依次设置的镂空图案的图形相同，可以方便触控走线的制备。
本公开实施例提供的触控基板的制作方法，包括：提供一基底，在基底上沉积具有多个金属线形成的镂空图案的触控走线，本公开实施例的技术方案中的触控走线包括多个金属线形成的镂空图案，使得触控走线的宽度较小，减小了触控走线占用区域，即使外漏，人眼几乎无法分辨，解决视觉上触控走线可见的问题，使得在触控屏上不需设置盖板来防止触控走线外漏，实现了触控屏的窄边框的设计要求。
可选地，本公开实施例提供的触控基板的制作方法，在步骤200之后，该方法还包括：触控走线上涂覆绝缘薄膜；通过刻蚀处理形成绝缘层。
可选地，绝缘层的材料为有机OC材料，OC材料可以为负性光刻胶。
可选地，在通过刻蚀处理形成绝缘层之后，该方法还包括：在绝缘层上形成过孔。
可选地，在绝缘层上形成过孔之后，该方法还包括：在绝缘层上沉积第二透明导电薄膜；通过构图工艺形成触控层。
可选地，第二透明导电薄膜的材料为氧化铟锡。
本公开实施例通过在触控走线上增加绝缘层和触控层，能够实现分布在显示屏四周的触控走线不仅视觉不可见，而且还能够实现触控功能，进一步地，达到了显示屏在视觉上和触控上无边框的效果，满足了窄边框的产品设计需求。
下面结合图7A-图7D，进一步地具体描述本公开一些实施例提供的触控基板的制作方法。其中，构图工艺包括：光刻胶涂覆、曝光、显影、刻蚀、剥离等工艺步骤。
步骤401、提供一基底10，并在基底10上形成包括具有镂空图案的第一金属层21。
具体的，步骤401与图5所示实施例中提供的步骤301和步骤302相同，在此不再赘述。
步骤402、在第一金属层21上沉积第一透明导电薄膜220，并覆盖整个基底10，具体如图7A所示。
具体的，可以采用CVD工艺、蒸镀工艺或者溅射工艺沉积第一透明导电薄膜。
可选地，第一透明导电薄膜的材料为氧化铟锡。
步骤403、通过构图工艺对第一透明导电薄膜220进行处理形成透明导电层22，具体如图7B所示。
步骤404、在透明导电层22上沉积第二金属薄膜，通过构图工艺形成第二金属层23，具体如图7C所示。
可选地，第二金属薄膜的材料可以是铜、铁、铝和钼等金属，需要了解的是，第一金属薄膜和第二金属薄膜的材料可以相同，也可以不同，本公开对此不作任何限定。
可选地，第二金属层的线宽为4微米-6微米。需要了解的是，第一金属层的线宽和第二金属层的线宽可以相同，也可以不同，本公开对此不作任何限定。
步骤405、在第二金属层23上涂覆绝缘薄膜，通过刻蚀处理形成绝缘层30，并在绝缘层30上形成过孔31，具体如图7D所示。
可选地，绝缘薄膜的材料为有机OC材料，OC材料可以为负性光刻胶。
步骤406、在绝缘层30上沉积第二透明导电薄膜，通过构图工艺形成触控层40，具体如图4所示。
具体的，采用化学气相沉积(Chemical Vapor Deposition，简称CVD)工艺、蒸镀工艺或者溅射工艺沉积第二透明导电薄膜。
可选地，第二透明导电薄膜的材料为氧化铟锡。
本公开实施例提供了一种显示装置。该显示装置包括触控基板。
其中，触控基板为图1所示实施例和图5所示实施例中提供的触控基板，其实现原理和实现效果类似，在此不再赘述。
具体的，显示装置可以为：手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。
在本公开实施例的描述中，需要理解的是，术语“中部”、“上”、“下”、“前”、“后”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本公开和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本公开的限制。
在本公开实施例的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本公开中的具体含义。
虽然本公开所揭露的实施方式如上，但所述的内容仅为便于理解本公开而采用的实施方式，并非用以限定本公开。任何本公开所属领域内的技术人员，在不脱离本公开所揭露的精神和范围的前提下，可以在实施的形式及细节上进行任何的修改与变化，但本公开的专利保护范围，仍须以所附的权利要求书所界定的范围为准。

Claims (17)

  1. 一种触控基板，包括：基底和设置在所述基底上的至少一条触控走线；
    其中，所述触控走线包括多个镂空图案。
  2. 根据权利要求1所述的触控基板，其中，所述触控走线包括金属网结构和形成在金属网结构之间的多个孔；所述多个孔形成所述镂空图案。
  3. 根据权利要求2所述的触控基板，其中，所述走线的制作材料包括：金属。
  4. 根据权利要求1所述的触控基板，其中，所述触控走线包括：第一金属层；
    所述第一金属层包括多个镂空图案。
  5. 根据权利要求1所述的触控基板，其中，所述触控走线包括：第一金属层、透明导电层和第二金属层；
    所述第一金属层和所述第二金属层包括多个镂空图案；
    所述第一金属层设置在所述基底上；所述透明导电层和所述第二金属层依次设置在所述第一金属层远离所述基底的一侧。
  6. 根据权利要求1-5任一项所述的触控基板，还包括：绝缘层和触控层；
    所述绝缘层设置在所述触控走线远离所述基底的一侧；
    所述触控层设置在所述绝缘层上，并通过所述绝缘层中的过孔与所述触控走线连接触控走线。
  7. 根据权利要求1-5任一项所述的触控基板，其中，所述镂空图案包括：三角形、四边形、六边形、圆形或椭圆形中任意一种或多种。
  8. 根据权利要求5所述的触控基板，其中，所述第一金属层和所述第二金属层的线宽为4微米-6微米。
  9. 根据权利要求5所述的触控基板，其中，所述透明导电层的材料为氧化铟锡。
  10. 根据权利要求6所述的触控基板，其中，所述绝缘层的材料为负性光刻胶，所述触控层的材料为氧化铟锡。
  11. 一种显示装置，包括如权利要求1-10任一所述的触控基板。
  12. 一种触控基板的制作方法，包括：
    提供一基底；
    在基底上形成具有多个镂空图案的触控走线。
  13. 根据权利要求12所述的方法，其中，所述在基底上形成具有多个镂空图案的触控走线，具体包括：
    在基底上沉积第一金属薄膜；
    通过构图工艺形成包括多个走线构成的镂空图案的第一金属层。
  14. 根据权利要求12所述的方法，其中，所述在基底上形成具有多个镂空图案的触控走线，具体包括：
    在基底上沉积第一金属薄膜；
    通过构图工艺形成包括多个走线构成的镂空图案的第一金属层；
    在第一金属层上沉积第一透明导电薄膜；
    通过构图工艺形成透明导电层；
    在透明导电层上沉积第二金属薄膜；
    通过构图工艺，形成包括多个走线构成的镂空图案的第二金属层。
  15. 根据权利要求12-14任一项所述的方法，其中，所述在基底上形成具有多个金属线形成的镂空图案的触控走线之后，所述方法还包括：
    在所述触控走线上涂覆绝缘薄膜；
    通过刻蚀处理形成绝缘层。
  16. 根据权利要求15所述的方法，其中，所述通过刻蚀处理形成绝缘层之后，所述方法还包括：
    在绝缘层上形成过孔。
  17. 根据权利要求16所述的方法，其中，所述在绝缘层上形成过孔之后，所述方法还包括：
    在绝缘层上沉积第二透明导电薄膜；
    通过构图工艺形成触控层。
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