CN108899110A - 导电层叠结构及其制备方法、显示面板 - Google Patents
导电层叠结构及其制备方法、显示面板 Download PDFInfo
- Publication number
- CN108899110A CN108899110A CN201810704602.3A CN201810704602A CN108899110A CN 108899110 A CN108899110 A CN 108899110A CN 201810704602 A CN201810704602 A CN 201810704602A CN 108899110 A CN108899110 A CN 108899110A
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- Prior art keywords
- layer
- opening
- nano metal
- metal line
- adhesion promoting
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K19/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/026—Nanotubes or nanowires
Abstract
Description
Claims (10)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810704602.3A CN108899110A (zh) | 2018-06-30 | 2018-06-30 | 导电层叠结构及其制备方法、显示面板 |
KR1020207008648A KR102302705B1 (ko) | 2018-06-30 | 2018-12-03 | 도전성 적층 구조, 그 제조 방법, 디스플레이 패널 |
PCT/CN2018/119005 WO2020000903A1 (zh) | 2018-06-30 | 2018-12-03 | 导电层叠结构及其制备方法、显示面板 |
JP2020514493A JP6868156B2 (ja) | 2018-06-30 | 2018-12-03 | 導電積層構造およびその製造方法、表示パネル |
US16/718,216 US11510323B2 (en) | 2018-06-30 | 2019-12-18 | Conductive laminated structure, a manufacturing method thereof, and a display panel |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810704602.3A CN108899110A (zh) | 2018-06-30 | 2018-06-30 | 导电层叠结构及其制备方法、显示面板 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN108899110A true CN108899110A (zh) | 2018-11-27 |
Family
ID=64347685
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810704602.3A Pending CN108899110A (zh) | 2018-06-30 | 2018-06-30 | 导电层叠结构及其制备方法、显示面板 |
Country Status (5)
Country | Link |
---|---|
US (1) | US11510323B2 (zh) |
JP (1) | JP6868156B2 (zh) |
KR (1) | KR102302705B1 (zh) |
CN (1) | CN108899110A (zh) |
WO (1) | WO2020000903A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020000903A1 (zh) * | 2018-06-30 | 2020-01-02 | 云谷(固安)科技有限公司 | 导电层叠结构及其制备方法、显示面板 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130056876A1 (en) * | 2010-05-07 | 2013-03-07 | Thomas HARVEY | Composite electrode and method of manufacture thereof |
CN106575181A (zh) * | 2014-08-14 | 2017-04-19 | Lg伊诺特有限公司 | 触摸窗 |
CN107622990A (zh) * | 2017-10-13 | 2018-01-23 | 京东方科技集团股份有限公司 | 一种触控基板及其制作方法、显示装置 |
CN107943355A (zh) * | 2017-09-29 | 2018-04-20 | 友达光电股份有限公司 | 触控装置 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005074347A1 (ja) * | 2004-01-30 | 2005-08-11 | Dai Nippon Printing Co., Ltd. | 電磁波シールドフィルム、及びその製造方法 |
KR101415589B1 (ko) * | 2012-03-23 | 2014-07-04 | 엘지이노텍 주식회사 | 데코 인쇄 필름 및 터치 패널 |
CN103105970B (zh) | 2013-02-06 | 2014-09-17 | 南昌欧菲光科技有限公司 | 触摸屏感应模组及包含该触摸屏感应模组的显示器 |
US9268446B2 (en) | 2013-02-06 | 2016-02-23 | Nanchang O-Film Tech. Co., Ltd. | Monitor, touchscreen sensing module thereof, and method for manufacturing the touchscreen sensing module |
CN103294271A (zh) | 2013-05-30 | 2013-09-11 | 南昌欧菲光科技有限公司 | 触摸屏导电膜及其制作方法 |
EP3125086A4 (en) * | 2014-03-25 | 2017-10-25 | Toppan Printing Co., Ltd. | Transparent conductive laminated body and touch panel provided with transparent conductive laminated body |
CN104020888A (zh) * | 2014-05-30 | 2014-09-03 | 南昌欧菲光科技有限公司 | 触摸屏 |
CN105183246B (zh) * | 2014-06-12 | 2018-09-28 | 宸鸿科技(厦门)有限公司 | 电容式触控面板 |
CN105224150B (zh) * | 2014-06-12 | 2019-03-01 | 宸鸿科技(厦门)有限公司 | 触控面板 |
CN105204695B (zh) | 2014-06-12 | 2018-08-21 | 宸鸿科技(厦门)有限公司 | 纳米银线导电层叠结构及电容式触控面板 |
KR102522012B1 (ko) * | 2015-12-23 | 2023-04-13 | 삼성전자주식회사 | 전도성 소자 및 이를 포함하는 전자 소자 |
CN207397244U (zh) * | 2017-09-22 | 2018-05-22 | 昆山国显光电有限公司 | 电连接结构及应用其的触控屏、显示装置 |
CN108899110A (zh) * | 2018-06-30 | 2018-11-27 | 云谷(固安)科技有限公司 | 导电层叠结构及其制备方法、显示面板 |
-
2018
- 2018-06-30 CN CN201810704602.3A patent/CN108899110A/zh active Pending
- 2018-12-03 KR KR1020207008648A patent/KR102302705B1/ko active IP Right Grant
- 2018-12-03 WO PCT/CN2018/119005 patent/WO2020000903A1/zh active Application Filing
- 2018-12-03 JP JP2020514493A patent/JP6868156B2/ja active Active
-
2019
- 2019-12-18 US US16/718,216 patent/US11510323B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130056876A1 (en) * | 2010-05-07 | 2013-03-07 | Thomas HARVEY | Composite electrode and method of manufacture thereof |
CN106575181A (zh) * | 2014-08-14 | 2017-04-19 | Lg伊诺特有限公司 | 触摸窗 |
CN107943355A (zh) * | 2017-09-29 | 2018-04-20 | 友达光电股份有限公司 | 触控装置 |
CN107622990A (zh) * | 2017-10-13 | 2018-01-23 | 京东方科技集团股份有限公司 | 一种触控基板及其制作方法、显示装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020000903A1 (zh) * | 2018-06-30 | 2020-01-02 | 云谷(固安)科技有限公司 | 导电层叠结构及其制备方法、显示面板 |
US11510323B2 (en) | 2018-06-30 | 2022-11-22 | Yungu (Gu'an) Technology Co., Ltd. | Conductive laminated structure, a manufacturing method thereof, and a display panel |
Also Published As
Publication number | Publication date |
---|---|
KR102302705B1 (ko) | 2021-09-15 |
WO2020000903A1 (zh) | 2020-01-02 |
KR20200046071A (ko) | 2020-05-06 |
US11510323B2 (en) | 2022-11-22 |
US20200128679A1 (en) | 2020-04-23 |
JP2020533751A (ja) | 2020-11-19 |
JP6868156B2 (ja) | 2021-05-12 |
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PB01 | Publication | ||
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SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20181127 Assignee: Bazhou Yungu Electronic Technology Co., Ltd.|Kunshan Institute of technology new flat panel display technology center Co., Ltd.|Kunshan Guoxian photoelectric Co., Ltd Assignor: The valley (Guan) Technology Co. Ltd. Contract record no.: X2019990000155 Denomination of invention: Conductive laminated structure and preparation method thereof as well as display panel License type: Common License Record date: 20191030 |
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EE01 | Entry into force of recordation of patent licensing contract | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181127 |
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RJ01 | Rejection of invention patent application after publication |