WO2019069656A1 - Film antiadhésif multicouche, procédé destiné à la production d'un film antiadhésif multicouche et procédé destiné à la production d'un circuit imprimé souple - Google Patents

Film antiadhésif multicouche, procédé destiné à la production d'un film antiadhésif multicouche et procédé destiné à la production d'un circuit imprimé souple Download PDF

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Publication number
WO2019069656A1
WO2019069656A1 PCT/JP2018/034049 JP2018034049W WO2019069656A1 WO 2019069656 A1 WO2019069656 A1 WO 2019069656A1 JP 2018034049 W JP2018034049 W JP 2018034049W WO 2019069656 A1 WO2019069656 A1 WO 2019069656A1
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Prior art keywords
layer
multilayer
release film
intermediate layer
release
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PCT/JP2018/034049
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English (en)
Japanese (ja)
Inventor
高久 加藤
智 海老原
亮生 大竹
陽介 清水
島村　浩
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日本メクトロン株式会社
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Priority to CN201880004372.8A priority Critical patent/CN109952199A/zh
Publication of WO2019069656A1 publication Critical patent/WO2019069656A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Definitions

  • the present disclosure relates to a multilayer release film, a method of manufacturing a multilayer release film, and a method of manufacturing a flexible printed circuit.
  • this circuit pattern is covered with a cover film through an adhesive.
  • coating with a cover film is performed, for example, by heat press bonding a laminate film and a flexible printed substrate.
  • a release film is used to protect the cover film or to remove air between the adhesive of the cover film and the substrate.
  • a TPX or PP film is used as the release film.
  • a multi-layered release film having a cushion layer is required.
  • Patent Documents 1 and 2 describe a multi-layered release film formed by coextrusion.
  • Patent No. 5180826 gazette Patent No. 5438367
  • the release film used can not be used repeatedly, for example, due to deformation due to thermocompression bonding and step marks due to the surface shape of the substrate. Therefore, the used release film is usually discarded.
  • the release film is becoming expensive due to the multi-layering for providing the cushioning layer and the high functionalization for securing the releasability.
  • the present disclosure aims to solve the problems as described above. That is, it is an object of the present invention to provide a multilayer release film which can be peeled off after thermocompression bonding of a cover film, and a part of which can be recycled, and a method of manufacturing the multilayer release film.
  • the manufacturing method of the flexible printed circuit which has high mold release property with respect to a cover film using such a multilayer release film, and can suppress generation
  • the multilayer release film of the present embodiment includes a support layer, an intermediate layer, and a release layer.
  • the support layer, the intermediate layer, and the release layer are laminated in this order.
  • the support layer has a thickness of 75 ⁇ m or more.
  • measurement of the adhesion between the support layer and the intermediate layer when the 50 mm wide multilayer release film is measured by a peel strength tester under conditions of a peel angle of 170 ° and a speed of 2.5 mm / sec. The value is 5 to 25 g / 50 mm.
  • the present embodiment it is possible to provide a multilayer release film which is peelable after thermocompression bonding of the cover film and can be partially recycled.
  • FIG. 1 is a schematic view showing the layer structure of a multilayer release film.
  • FIG. 2 is a schematic view showing the layer structure of a multilayer release film.
  • the support layer, the intermediate layer, and the release layer are laminated in this order.
  • the support layer has a thickness of 75 ⁇ m or more.
  • measurement of the adhesion between the support layer and the intermediate layer when the multilayer release film having a width of 50 mm is measured by a peel strength tester under conditions of a peel angle of 170 ° and a speed of 2.5 mm / sec. The value is 5 to 25 g / 50 mm.
  • the adhesion is preferably 5 to 14 g / 50 mm.
  • peeling between the support layer and the intermediate layer is easy after thermocompression bonding of the cover film. Therefore, it is advantageous to their recycling, especially to the repeated use of the support layer.
  • the peeling at the time of the work hardly occurs, the workability is not affected. There exists a possibility that each layer may peel at the time of the work of the thermocompression bonding of a cover film as peeling force is less than 5 g / 50 mm.
  • the adhesion between the mold release layer and the intermediate layer when the multilayer mold release film of the present disclosure of 50 mm width is measured by a peel strength tester under conditions of a peel angle of 170 ° and a speed of 2.5 mm / sec.
  • the measured value of is preferably 5 to 25 g / 50 mm, more preferably 5 to 14 g / 50 mm.
  • coextrusion or the like is generally used as a method for producing a multilayer release film so that each layer does not separate at the time of thermocompression bonding, in consideration of the workability at the time of thermocompression bonding of a cover film.
  • the layers are heat-sealed, and the adhesion is likely to be very high. Therefore, the laminated body of the above adhesion was difficult to obtain.
  • middle layer, and the release layer is mentioned. The method for producing a suitable multilayer release film will be described later.
  • the adhesion can be controlled by, for example, temperature and pressure at the time of heat lamination.
  • a conceptual view of a multilayer release film in which a support layer, an intermediate layer, and a release layer are laminated is shown in FIG.
  • the support layer, the intermediate layer, and the release layer are laminated without an adhesive.
  • the adhesion can be measured by the following method.
  • PFT-50S peel strength tester
  • the sample is set such that peeling starts from the 50 mm width side of the cut sample.
  • the intermediate layer side is fixed and the support layer is peeled off.
  • the intermediate layer side is fixed and the release layer is peeled off.
  • the lower limit is not particularly limited.
  • the depth of the unevenness is preferably 0% or more.
  • the dimensional change rate in the width direction of the support layer before and after the lamination test is preferably less than 1%.
  • the lower limit is not particularly limited.
  • the depth of the unevenness is preferably 0% or more.
  • the method of measuring the shape transfer rate and dimensional change rate is as follows.
  • a cover film (a 12.5- ⁇ m-thick polyimide film coated with an epoxy-based adhesive) is formed on a substrate (made of polyimide) that has a circuit pattern (copper foil) with a width of 250 mm and a length of 300 mm and a step difference of 0.035 mm. Be stacked.
  • a multilayer release film to be measured is laminated thereon.
  • a laminate is obtained.
  • the obtained laminate was preheated for 10 seconds at a pressure of 10 MPa in a laminating apparatus.
  • the laminated laminate is obtained by pressing at the same pressure for 50 seconds at a lower temperature of -10 ° C.
  • the preheating temperature is the same as the heating and pressurizing temperature.
  • the depth of the unevenness of shape transfer derived from the step shape of the substrate is measured by a laser microscope (LEXTOLS-4000 manufactured by Olympus Corporation).
  • the ratio of the obtained measured value to the level difference of the substrate is defined as the ratio (%) of shape transfer.
  • the arithmetic mean of 10 measured values is adopted.
  • the length of the width direction of the support layer in the laminated body after lamination is measured by a ruler.
  • the ratio of the variation of the length to the length in the width direction of the support layer before lamination (
  • the arithmetic mean of 10 measured values is adopted. In the following examples, it was judged that the rate of shape transfer was less than 10%. The proportion of shape transfer of 10% or more was determined to be x. Moreover, it was determined that the dimensional change rate is less than 1%.
  • a plurality of (for example, 2 to 6, preferably 2 to 4) intermediate layers and release layers are alternately stacked on the support layer.
  • FIG. 2 shows an example in which three intermediate layers 2 and release layers 1 are alternately stacked on the support layer 3.
  • the materials of the plurality of release layers may be all the same or may be different from each other.
  • the materials of the plurality of intermediate layers may be all the same or may be different from each other.
  • the release layer In the multilayer release film, the release layer is in contact with the cover film. Moreover, the mold release layer exhibits the mold release property with respect to a cover film, after thermocompression bonding of a cover film.
  • the thickness of the release layer is preferably 25 to 50 ⁇ m, more preferably 25 to 40 ⁇ m. When the thickness is 25 ⁇ m or more, generation of wrinkles in the cover film can be suppressed at the time of thermocompression bonding of the cover film.
  • the material of the release layer is not particularly limited. The following materials can be used.
  • Examples of materials that can be used as above include aromatic polyesters such as polyethylene terephthalate, polybutylene terephthalate (PBT), polyethylene naphthalate, and polybutylene naphthalate; polytetrafluoroethylene, tetrafluoroethylene-hexafluoropropylene copolymer And fluorine-based resins such as polyvinyl fluoride; polymethylpentene (TPX), polypropylene (PP) (including biaxially oriented polypropylene (OPP) and non-axially oriented polypropylene (CPP)), and polyethylene (PE) [high density Olefin resins such as polyethylene (HDPE), low density polyethylene (LDPE), linear low density polyethylene (LLDPE), etc .; polystyrene (PS); polyvinyl chloride (PVC).
  • aromatic polyesters such as polyethylene terephthalate, polybutylene terephthalate (PBT), polyethylene naphthalate, and polybut
  • materials selected from polybutylene terephthalate (PBT), polymethylpentene (TPX), polypropylene (PP) and high density polyethylene (HDPE) are preferable. These materials can be used alone. Alternatively, a plurality of selected materials may be mixed and used.
  • the release layer is preferably a single layer.
  • the release layer preferably has crystallinity. Having crystallinity means that a clear melting point can be confirmed by differential scanning calorimetry.
  • the melting point Tm1 of the release layer is preferably high enough not to melt at the time of lamination, from the viewpoint of workability at the time of producing the multilayer release film and appropriate releasability at the time of thermocompression bonding of the cover film.
  • the melting point Tm1 is equal to or higher than the temperature assumed as the temperature during lamination, preferably 130 ° C. or higher, more preferably 150 ° C. or higher, and still more preferably 180 ° C. or higher.
  • the upper limit is not particularly limited.
  • the melting point Tm1 is preferably 240 ° C. or less, more preferably 230 ° C. or less, still more preferably 220 ° C. or less.
  • the melting point Tm can be measured by differential scanning calorimetry (DSC) according to JIS K 7121 under conditions of a temperature rising rate of 10 ° C./min and a measurement temperature range of 25 to 250 ° C. The temperature at the top of the melting peak is taken as the melting point Tm.
  • the thickness of the intermediate layer is preferably 35 to 90 ⁇ m, more preferably 40 to 80 ⁇ m.
  • the thickness of the intermediate layer in the above range is preferable from the viewpoint of air bleeding between the substrate and the cover film.
  • the material of the intermediate layer is not particularly limited.
  • the following materials can be used. That is, for example, polypropylene (PP) [including biaxially oriented polypropylene (OPP), non-axially oriented polypropylene (CPP)], polyethylene (PE) [high density polyethylene (HDPE), low density polyethylene (LDPE), linear] Low density polyethylene (including LLDPE), polyvinyl chloride (PVC), or acrylic elastomer can be used.
  • the melting point Tm2 of the intermediate layer is, for example, equal to or lower than the temperature assumed as the temperature during lamination, preferably 180 ° C. or lower, more preferably 160 ° C. or lower, and still more preferably 150 ° C. or lower.
  • the lower limit is not particularly limited.
  • the melting point Tm2 is preferably 100 ° C. or more, more preferably 110 ° C. or more.
  • the difference (Tm1-Tm2 (° C.)) between the melting point Tm1 of the release layer and the melting point Tm2 of the intermediate layer is preferably 20 ° C. or more.
  • the upper limit of this temperature difference is not particularly limited. However, preferably, this temperature difference is 120 ° C. or less.
  • the thickness of the support layer is 75 ⁇ m or more. Thereby, the shape change of the support layer by thermocompression bonding of a cover film and transfer of the unevenness
  • the thickness of the support layer is preferably 80 ⁇ m or more, more preferably 90 ⁇ m or more.
  • the upper limit is not particularly limited.
  • the thickness of the support layer is preferably 150 ⁇ m or less, more preferably 125 ⁇ m or less.
  • the material of the support layer is not particularly limited. For example, as the material of the support layer, the same material as the above-mentioned release layer can be used.
  • the melting point of the support layer is high enough not to melt during lamination.
  • the melting point of the support layer is equal to or higher than the temperature assumed for laminating, preferably 130 ° C. or higher, more preferably 150 ° C. or higher, and still more preferably 180 ° C. or higher.
  • the upper limit is not particularly limited.
  • the melting point of the support layer is preferably 300 ° C. or less, more preferably 270 ° C. or less, and still more preferably 250 ° C. or less.
  • the method for producing the multilayer release film is not particularly limited.
  • known methods can be used.
  • the preferred manufacturing method is the thermal lamination method.
  • a thermocompression bonding laminated structure is obtained by the thermal lamination method. That is, preferably, the method for producing a multilayer release film comprises the steps of laminating a support layer, an intermediate layer, and a release layer in this order to obtain a laminate, and thermally laminating the obtained laminate. Including.
  • a support layer, an intermediate layer, and a release layer are laminated in this order (preferably without an adhesive) to form a laminate.
  • no adhesive is used in view of the ease of peeling of each layer after thermocompression bonding of the cover film, and easy recycling.
  • a plurality of (for example, 2 to 6, preferably 2 to 4) intermediate layers and release layers may be alternately stacked on the support layer.
  • a multilayer release film can be obtained by heat laminating the obtained laminate.
  • a well-known laminating apparatus can be used for heat lamination.
  • the thermal lamination is preferably performed by a continuous conveyance operation called a so-called roll-to-roll method.
  • the temperature at the time of heat lamination can be suitably set according to the material to be used.
  • the temperature is not particularly limited. However, this temperature is preferably 100 to 180 ° C. Further, it is preferable that the temperature is equal to or higher than the melting point of the intermediate layer, and the lower one of the melting points of the release layer and the support layer.
  • a more preferable temperature is the melting point of the intermediate layer + 10 ° C. or more, and the lower one of the melting points of the release layer and the support layer -10 ° C.
  • the melting point of the intermediate layer is preferably the lowest among the melting points of the support layer, the intermediate layer, and the release layer.
  • the pressure in the thermal lamination is preferably 300 to 600 kpa from the viewpoint of obtaining a suitable adhesion.
  • each layer has a transfer speed of 0.5 m / min. It is laminated by the above-mentioned roll heat laminator.
  • the multilayer release film thus obtained can be suitably used for thermocompression bonding, such as for laminating a printed circuit board.
  • it can use as a release film at the time of thermocompression-bonding a flexible printed circuit board and a cover film.
  • It can use for various printed circuit boards, such as a single-sided flexible printed circuit board or a double-sided flexible printed circuit board.
  • the multilayer release film is preferably used in the following method for producing a flexible printed circuit.
  • the manufacturing method of the flexible printed circuit board of this indication includes the process of laminating a substrate, a cover film, and a multilayer release film in this order, and the process of thermocompression-bonding a substrate and a cover film.
  • the multilayer release film is a multilayer release film in which the support layer, the intermediate layer, and the release layer described above are laminated in this order.
  • the temperature of the thermocompression bonding is not less than the melting point + 5 ° C. of the intermediate layer and the melting point of the release layer -5 ° C. or less.
  • the cushioning property of the intermediate layer works well when the temperature of thermocompression bonding is equal to or higher than the melting point + 5 ° C. of the intermediate layer. Therefore, air can be suppressed between the substrate and the cover film. Therefore, good embedding is possible.
  • the temperature is preferably the melting point of the intermediate layer + 10 ° C or higher.
  • the temperature of thermocompression bonding is a melting point of ⁇ 5 ° C. or less of the release layer, the releasability becomes good.
  • the temperature is preferably not more than the melting point -10 ° C of the release layer.
  • the temperature for thermocompression bonding is usually in the range of about 110 to 190 ° C.
  • the temperature of the laminate and the temperature of the thermocompression bonding are the set temperatures of the apparatus used.
  • a widely used substrate can be used as the substrate.
  • a substrate obtained by bonding a circuit pattern of copper foil to a base film such as polyimide can be used.
  • a widely used cover film can be used.
  • polyimide coated with an adhesive such as an epoxy adhesive can be used.
  • a known apparatus such as a laminating apparatus can be used for the thermocompression bonding of the cover film.
  • the pressure at the time of thermocompression bonding is preferably 8 to 12 MPa.
  • pressurization is performed for 40 to 180 seconds at the specific temperature.
  • the lamination temperature at the time of the measurement of the shape transfer in an Example, and a dimensional-change rate was performed at the cover lamination temperature of Table 1.
  • a flat plate thermal laminating apparatus was used as the laminating apparatus.
  • the cover film and the substrate were laminated by the laminating apparatus.
  • the obtained laminate and the multilayer release film were integrated by pressure heating. During pressure heating, the multilayer film and the laminate were laminated such that the release layer of the multilayer release film was in contact with the cover film of the laminate including the cover film and the substrate.
  • the temperature of the heating-pressing in the case of lamination of a cover film was set to the cover lamination temperature of Table 1.
  • the preheating temperature was set to the same as the heating and pressurizing temperature.
  • ⁇ Crinkle of cover film> A cover film including a 12.5 ⁇ m-thick polyimide film coated with an epoxy-based adhesive on a substrate (made of polyimide) having a circuit pattern (copper foil) 250 mm wide ⁇ 300 mm long and having a step difference of 0.035 mm It was stacked. Furthermore, after laminating
  • the temperature of heat and pressure during lamination was set to the cover laminate temperature described in Table 1.
  • the preheating temperature was set to the same as the heating and pressurizing temperature. It was judged as ⁇ if no air was admitted. It was judged as ⁇ if air was found in one place in the seat. It was judged as x if two or more air inclusions were recognized in the seat.
  • Example 1 The following materials were used for each layer.
  • Support layer 100 ⁇ m thick polybutylene terephthalate (PBT) melt mass flow rate (MFR) 4.3 melting point 220 ° C.
  • Intermediate layer 40 ⁇ m thick low density polyethylene (LDPE) MFR 1.0 melting point 110 ° C.
  • Release layer 25 ⁇ m thick polypropylene (PP) MFR 0.35 Melting point 160 ° C.
  • the support layer, the intermediate layer, and the release layer were laminated in this order, and film formation was performed using a roll thermal laminator.
  • the laminate had a temperature of 170 ° C., a pressure of 500 kpa, and a conveyance speed of 1.0 m / min.
  • melt mass flow rate was performed based on the test method of the melt mass flow rate (MFR) of JISK 7210: 1999 plastic-thermoplastics, and the melt volume flow rate (MVR).
  • MFR melt mass flow rate
  • Example 2 to 12 Comparative Examples 1 to 5, Reference Examples 1 to 4
  • Examples 2 to 12, Comparative Examples 1 to 5, and Reference Examples 1 to 5 were carried out in the same manner and under the same conditions as in Example 1 except that the film forming temperature at the time of laminating was changed as shown in Table 1.
  • a multilayer release film of 4 was obtained.
  • the evaluation results are shown in Table 1.
  • Comparative Example 1 the multilayer release film was peeled off during the cover laminating operation. Therefore, it was not possible to evaluate the printed circuit board.
  • Comparative Examples 2 and 3 since the dimensional change rate was large, the support layer could not be reused.
  • Comparative Examples 4 and 5 the commercially available release film described in Table 1 was used. These are films produced by extrusion. This release film had high adhesion. Therefore, each layer could not be peeled off.
  • the numerical value described in the material section is the melting point Tm (° C.).
  • each layer is as follows.
  • (Release layer) Polybutylene terephthalate (PBT) MFR 4.3, melting point 220 ° C
  • High density polyethylene (HDPE) MFR 0.35, melting point 130 ° C 20 ⁇ m thick polypropylene (PP) polyolefin film made by Hokuetsu Kasei Kogyo 40 ⁇ m thick polypropylene (PP) polyolefin film made by Hokuetsu Kasei (intermediate layer) Polypropylene film made of polypropylene (PP) Hokuetsu Kasei Co., Ltd.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

Le but de la présente invention est de fournir un film antiadhésif multicouche qui peut être pelé après la liaison par thermocompression d'un film de couverture et dont une partie peut être recyclée. L'invention concerne un film antiadhésif multicouche, comprenant une couche de support, une couche intermédiaire et une couche antiadhésive, la couche de support, la couche intermédiaire et la couche antiadhésive étant empilées dans cet ordre ; la couche de support possédant une épaisseur d'au moins 75 µm ; et une valeur mesurée d'adhérence entre la couche de support et la couche intermédiaire, telle qu'obtenue lorsque le film antiadhésif multicouche doté d'une largeur de 50 mm est testé à l'aide d'un dispositif de test de résistance au pelage dans des conditions d'un angle de pelage de 170° et d'un taux de pelage de 2,5 mm/sec, étant de 5 à 25 g/50 mm.
PCT/JP2018/034049 2017-10-03 2018-09-13 Film antiadhésif multicouche, procédé destiné à la production d'un film antiadhésif multicouche et procédé destiné à la production d'un circuit imprimé souple WO2019069656A1 (fr)

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CN201880004372.8A CN109952199A (zh) 2017-10-03 2018-09-13 多层脱模膜，多层脱模膜的制造方法，柔性印刷基板的制造方法

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JP2017-193560 2017-10-03
JP2017193560A JP6917265B2 (ja) 2017-10-03 2017-10-03 多層離型フィルム及び多層離型フィルムの製造方法、並びに該多層離型フィルムを用いたフレキシブルプリント基板の製造方法

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CN111065214B (zh) * 2019-12-17 2023-02-07 深圳市新宇腾跃电子有限公司 线路板覆盖膜贴合工艺
KR102252387B1 (ko) * 2020-07-29 2021-05-14 이호돈 거푸집 박리필름
JP6977848B1 (ja) * 2020-11-02 2021-12-08 住友ベークライト株式会社 離型フィルムおよび成型品の製造方法
CN114258207B (zh) * 2021-11-19 2023-10-13 深圳市景旺电子股份有限公司 覆盖膜制作方法、覆盖膜及其贴合方法

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JP2002273831A (ja) * 2001-03-21 2002-09-25 Toray Ind Inc 離型用積層フィルム及びそれを用いた離型フィルム
JP2003276140A (ja) * 2002-03-25 2003-09-30 Sumitomo Bakelite Co Ltd 離型多層フィルム及びカバーレイ成形方法
JP2004017610A (ja) * 2002-06-20 2004-01-22 Toray Ind Inc 離型フィルム
JP2004142305A (ja) * 2002-10-25 2004-05-20 Asahi Glass Co Ltd 積層フィルム
JP2014121830A (ja) * 2012-12-21 2014-07-03 Sumitomo Bakelite Co Ltd 離型フィルム
JP2014208427A (ja) * 2013-03-29 2014-11-06 日本メクトロン株式会社 離型フィルム及びフレキシブルプリント基板

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