WO2019065728A1 - Chambre à vapeur - Google Patents

Chambre à vapeur Download PDF

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Publication number
WO2019065728A1
WO2019065728A1 PCT/JP2018/035670 JP2018035670W WO2019065728A1 WO 2019065728 A1 WO2019065728 A1 WO 2019065728A1 JP 2018035670 W JP2018035670 W JP 2018035670W WO 2019065728 A1 WO2019065728 A1 WO 2019065728A1
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WO
WIPO (PCT)
Prior art keywords
vapor chamber
pillar
wick
mesh
sheet
Prior art date
Application number
PCT/JP2018/035670
Other languages
English (en)
Japanese (ja)
Inventor
拓生 若岡
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to CN201880022396.6A priority Critical patent/CN110476032B/zh
Publication of WO2019065728A1 publication Critical patent/WO2019065728A1/fr
Priority to US16/565,931 priority patent/US11231235B2/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures

Definitions

  • the present invention relates to a vapor chamber.
  • the vapor chamber has a structure in which a working medium and a wick for transporting the working medium by capillary force are enclosed in the inside of a housing.
  • the working medium absorbs the heat from the heat generating element in the evaporation section that absorbs the heat from the heat generating element, evaporates in the vapor chamber, moves to the condensation section, is cooled, and returns to the liquid phase.
  • the working medium returned to the liquid phase is again moved to the heat generating element side (evaporator) by the capillary force of the wick and cools the heat generating element.
  • a vapor chamber for example, a vapor chamber comprising a sheet-like container, a wick enclosed in the container, and a working medium enclosed in the container is known (Patent Document 1). .
  • the vapor chamber as described above can be incorporated into various electronic devices. At this time, other parts may be arranged around the vapor chamber. If there are other parts around the vapor chamber, it is necessary to form the penetration 102 or notch 103 in the vapor chamber 101 to avoid interference with the parts around the vapor chamber (Fig. 18 and FIG. 19). However, in the vapor chamber in which the penetrating portion or the notched portion is formed, the penetrating portion or the notched portion causes a narrow portion in which the cross-sectional area of the inner space is reduced. If such a narrow portion occurs, the flow of the working medium is inhibited, and the heat transfer capability of the vapor chamber is reduced.
  • an object of the present invention is to provide a vapor chamber having a high heat transfer capacity.
  • the present inventors have provided a space in which each of the liquid working medium and the gas working medium moves, and in particular, by enhancing the ability to transport the liquid working medium, It was noticed that the heat transfer capacity of the vapor chamber could be enhanced. And, in order to enhance the ability to transport the working medium of liquid, it has been found that it is effective to arrange the wick as wide as possible and further to increase the thickness thereof, resulting in the present invention.
  • a first pillar disposed in an internal space of the housing to support the housing from the inside; A working medium enclosed in the internal space of the housing; And a wick disposed in the interior space of the housing; One main surface of the wick has a portion supported by the first pillar and separated from the housing; The thickness of the wick may be partially different to provide a vapor chamber.
  • an electronic device comprising the vapor chamber of the present invention.
  • the heat transport capacity of the vapor chamber can be enhanced by adjusting the thickness of the wick of the vapor chamber depending on the place.
  • FIG. 1 is a plan view of a vapor chamber 1a according to an embodiment of the present invention.
  • FIG. 2 is a cross-sectional view of the vapor chamber 1a shown in FIG.
  • FIG. 3 is a cross-sectional view of the vapor chamber 1b according to another embodiment of the present invention taken along the line AA.
  • FIG. 4 is a plan view of a vapor chamber 1c according to another embodiment of the present invention.
  • FIG. 5 is a cross-sectional view of the vapor chamber 1c shown in FIG.
  • FIG. 6 is a plan view of a vapor chamber 1d according to another embodiment of the present invention.
  • FIG. 7 is a cross-sectional view of the vapor chamber 1 d shown in FIG. FIG.
  • FIG. 8 is a plan view of a vapor chamber 1e according to another embodiment of the present invention.
  • FIG. 9 is a cross-sectional view of the vapor chamber 1e shown in FIG.
  • FIG. 10 is a cross-sectional view of the vapor chamber 1e shown in FIG.
  • FIG. 11 is a plan view of a vapor chamber 1f according to another embodiment of the present invention.
  • FIG. 12 is a cross-sectional view of the vapor chamber 1f shown in FIG.
  • FIG. 13 is a cross-sectional view of the vapor chamber 1f shown in FIG.
  • FIG. 14 is a plan view of a vapor chamber 1g according to another embodiment of the present invention.
  • FIG. 15 is a cross-sectional view of the vapor chamber 1g shown in FIG.
  • FIG. 16 (a) and 16 (b) are cross-sectional views of the vapor chamber 1g shown in FIG. 14 taken along the line BB.
  • FIG. 17 is a partial cross-sectional view for showing a wick structure of a vapor chamber in another embodiment of the present invention.
  • FIG. 18 is a plan view showing an aspect of a conventional vapor chamber.
  • FIG. 19 is a plan view showing another aspect of the conventional vapor chamber.
  • FIG. 1 A plan view of a vapor chamber 1a according to the embodiment shown below is shown in FIG. 1, and a sectional view taken along the line AA in FIG.
  • the vapor chamber 1 a has a housing 4 composed of opposing first and second sheets 2 and 3 to which outer edges are joined.
  • a wick 6 is disposed in the internal space 5 of the housing 4.
  • the first sheet 2 and the second sheet 3 are provided between the first sheet 2 and the wick 6 to support the first sheet 2 and the second sheet 3 from the inside in order to secure the internal space 5 in the housing 4.
  • a pillar 9 is provided.
  • a second pillar 10 is provided between the second sheet 3 and the wick 6. The first sheet 2 and the second sheet 3 approach each other in the area outside the area where the first pillars 9 are provided, contact at the outer edge, and are joined and sealed.
  • first sheet 2 and the second sheet 3 typically start to approach each other from the end of the first pillar 9 closest to the edge of the sheet, and at the junction 11 located at the outer edge of the sheet, Bonded and sealed.
  • the vapor chamber 1 a has a working medium (not shown) enclosed in the internal space 5 of the housing 4.
  • the wick 6 is composed of two first meshes 7 and second meshes 8.
  • the two first meshes 7 and the second mesh 8 have different sizes in plan view.
  • the first mesh 7 is larger than the second mesh 8.
  • the first mesh 7 and the second mesh 8 overlap to form the wick 6, but since the first mesh 7 and the second mesh 8 are different in size, the thickness of the wick 6 is partially different. That is, the wick 6 is formed of only the first mesh 7 in the portion along the joint portion 11 which is the outer edge portion of the housing 4, and is relatively thin, and in the inner portion, the first mesh 7. And the second mesh 8 are relatively thick.
  • the first mesh 7 can be arranged in a wider area, since the thin part composed only of the first mesh 7 can be arranged closer to the outer edge.
  • the ability to transport the working medium of the liquid by the capillary force of the wick 6 is also obtained near the outer edge.
  • the thick section composed of both the first mesh 7 and the second mesh 8 has a large cross-sectional area of the wick 6, a larger capillary force can be obtained and the ability to transport the working medium of liquid is large.
  • the wick 6 is supported by the first pillar 9 and is separated from the first sheet 2 in most part. The space between the first sheet 2 and the wick 6 can function as a vapor passage through which the gas working medium moves. This has the ability to transport more gaseous working medium. With such a configuration, the vapor chamber 1a has an excellent heat transport capability as a whole.
  • the thickness of the wick is partially different as described above, and the thickness can be changed according to the installation location of the wick. it can. For example, by increasing the thickness of the wick, the cross-sectional area of the wick is increased, or by decreasing the thickness of the wick, the wick is disposed to a portion where the thickness of the internal space 5 is thin, and the installation area is expanded. By doing this, it is possible to further increase the transport capacity of the working medium of the liquid.
  • At least a portion of one of the main surfaces of the wick (the surface on the first sheet side, that is, the upper surface in FIG. 2) has a portion supported by the first pillar and separated from the housing, so that the passage of the gas working medium is As a result, the transport capacity of the working medium of gas can be further increased.
  • the vapor chamber 1a of the present invention can have a high heat transfer amount as a whole since it can increase the transport ability of either liquid or gas working medium.
  • the vapor chamber 1a is planar as a whole. That is, the housing 4 is planar as a whole.
  • planar includes plate-like and sheet-like shapes, and the shape having a length and a width considerably larger than the height (thickness), for example, the length and the width are 10 times the thickness
  • the above means a shape that is preferably 100 times or more.
  • the size of the vapor chamber 1a that is, the size of the housing 4 is not particularly limited.
  • the length (represented by L in FIG. 1) and the width (represented by W in FIG. 1) of the vapor chamber 1a can be appropriately set according to the application to be used, and for example, 5 mm or more and 500 mm or less, 20 mm or more It may be 300 mm or less or 50 mm or more and 200 mm or less.
  • the materials constituting the first sheet 2 and the second sheet 3 are not particularly limited as long as they have properties suitable for use as a vapor chamber, such as thermal conductivity, strength, flexibility, flexibility and the like. .
  • the material constituting the first sheet 2 and the second sheet 3 is preferably a metal, for example, copper, nickel, aluminum, magnesium, titanium, iron or an alloy containing them as a main component, and particularly preferably It may be copper.
  • the materials constituting the first sheet 2 and the second sheet 3 may be the same or different, but are preferably the same.
  • the thickness of the first sheet 2 and the second sheet 3 is not particularly limited, but may preferably be 10 ⁇ m or more and 200 ⁇ m or less, more preferably 30 ⁇ m or more and 100 ⁇ m or less, and preferably 40 ⁇ m or more and 60 ⁇ m or less.
  • the thickness of the first sheet 2 and the second sheet 3 may be the same or different. Further, the thickness of each of the first sheet 2 and the second sheet 3 may be the same throughout, or may be partially thin. In the present embodiment, the thicknesses of the first sheet 2 and the second sheet 3 are preferably the same. Also, each sheet thickness of the first sheet 2 and the second sheet 3 is preferably the same throughout.
  • the first sheet 2 and the second sheet 3 are joined to each other at their outer edge portions.
  • the method of such bonding is not particularly limited, but for example, laser welding, resistance welding, diffusion bonding, brazing, TIG welding (tungsten-inert gas welding), ultrasonic bonding or resin sealing can be used, and preferably Laser welding, resistance welding or brazing can be used.
  • a first pillar 9 is provided between the first sheet 2 and the second sheet 3.
  • a plurality of first pillars 9 are provided on the main surface on the inner space 5 side of the first sheet 2.
  • the first pillar 9 supports the first sheet 2 and the second sheet 3 from the inside so that the distance between the first sheet 2 and the second sheet 3 is a predetermined distance. That is, the first pillars 9 function as pillars supporting the first sheet 2 and the second sheet 3 of the vapor chamber.
  • a second pillar 10 is provided between the first sheet 2 and the second sheet 3.
  • the second sheet 3 has a plurality of second pillars 10 on the main surface on the inner space 5 side.
  • the working medium can be held between the second pillars, making it easy to increase the amount of working medium in the vapor chamber of the present invention. .
  • the heat transport capacity of the vapor chamber is improved by increasing the amount of working medium.
  • the second pillar refers to a portion relatively higher in height than the periphery, and in addition to a portion protruding from the main surface, for example, a columnar portion, a recess formed on the main surface, for example, a groove Including the part where height is high.
  • the second pillar 10 is not an essential component and may not exist. Further, the second pillars 10 need not be formed only on the second sheet 3, and may be formed on either one or both of the first sheet 2 and the second sheet 3.
  • the height of the first pillar 9 is larger than the height of the second pillar 10.
  • the height of the first pillar 9 is preferably 1.5 times or more and 100 times or less, more preferably 2 times or more and 50 times or less, more preferably 3 times the height of the second pillar 10. It may be twice or more and 20 times or less, still more preferably 3 times or more and 10 times or less.
  • the shape of the first pillar 9 is not particularly limited as long as it can support the first sheet 2 and the second sheet 3, but is preferably columnar, for example, cylindrical, prismatic, truncated cone, truncated pyramid It may be shape etc.
  • the material for forming the first pillar 9 is not particularly limited, but is, for example, a metal, for example, copper, nickel, aluminum, magnesium, titanium, iron, or an alloy containing them as a main component, and particularly preferably copper. It can be. In a preferred embodiment, the material forming the first pillar 9 is the same material as one or both of the first sheet 2 and the second sheet 3.
  • the height of the first pillar 9 can be appropriately set according to the desired thickness of the vapor chamber, and is preferably 50 ⁇ m to 500 ⁇ m, more preferably 100 ⁇ m to 400 ⁇ m, further preferably 100 ⁇ m to 200 ⁇ m, for example It is 125 micrometers or more and 150 micrometers or less.
  • the height of the first pillar refers to the height in the thickness direction of the vapor chamber.
  • the heights of the first pillars 9 may be the same or different in one vapor chamber.
  • the height of the first pillar 9 in one region may be different from the height of the first pillar 9 in another region.
  • the thickness of the vapor chamber can be partially changed.
  • the thickness of the first pillar 9 is not particularly limited as long as it gives strength to suppress deformation of the casing of the vapor chamber.
  • the equivalent circle diameter of the cross section perpendicular to the height direction of the first pillar 9 is And 100 ⁇ m to 2000 ⁇ m, preferably 300 ⁇ m to 1000 ⁇ m.
  • the deformation of the casing of the vapor chamber can be further suppressed by increasing the equivalent circle diameter of the first pillar. Further, by reducing the equivalent circle diameter of the first pillar, it is possible to secure a wider space for the vapor of the working medium to move.
  • the arrangement of the first pillars 9 is not particularly limited, but is preferably arranged uniformly in a predetermined region, more preferably equally over the whole, for example, in a lattice point so that the distance between the first pillars 9 is constant. Be done. By evenly arranging the first pillars, uniform strength can be ensured throughout the vapor chamber.
  • the number and spacing of the first pillars 9 are not particularly limited, but preferably 0.125 or more and 0.5 or less per 1 mm 2 of the area of the main surface of one sheet defining the internal space of the vapor chamber. Preferably, they may be 0.2 or more and 0.3 or less.
  • the first pillar 9 may be integrally formed with the first sheet 2 or the second sheet 3 and manufactured separately from the first sheet 2 or the second sheet 3 and then fixed at a predetermined position. You may
  • the height of the second pillar 10 is not particularly limited, but may be preferably 1 ⁇ m to 100 ⁇ m, more preferably 5 ⁇ m to 50 ⁇ m, and still more preferably 15 ⁇ m to 30 ⁇ m.
  • the height of the second pillar is higher, the holding amount of the working medium can be further increased.
  • the height of the second pillar lower, it is possible to secure a wider space (space on the first pillar side) for the vapor of the working medium to move. Therefore, the heat transport capacity of the vapor chamber can be adjusted by adjusting the height of the second pillar.
  • the distance between the second pillars 10 is not particularly limited, but may be preferably 1 ⁇ m to 500 ⁇ m, more preferably 5 ⁇ m to 300 ⁇ m, and still more preferably 15 ⁇ m to 150 ⁇ m.
  • the capillary force can be further increased by reducing the distance between the second pillars.
  • the transmittance can be further increased by increasing the distance between the second pillars.
  • the shape of the second pillar 10 is not particularly limited, but may be a cylindrical shape, a prismatic shape, a truncated cone shape, a truncated pyramid shape, or the like. Further, the shape of the second pillar 10 may be a wall shape, that is, a shape in which a groove is formed between the adjacent second pillars 10.
  • the second pillar 10 may be integrally formed with the first sheet 2 or the second sheet 3 and manufactured separately from the first sheet 2 or the second sheet 3 and then fixed at a predetermined position. You may
  • the wick 6 is composed of two meshes, ie, a first mesh 7 and a second mesh 8.
  • mesh means a sheet having a mesh structure.
  • network structure means a structure in which a plurality of points are connected by a plurality of line segments.
  • the network structure may be a fiber structure.
  • the fiber structure is a structure constituted by a plurality of fibers, and includes, for example, a structure in which fibers are woven, a structure in which fibers are irregularly entangled, and the like.
  • the first mesh 7 and the second mesh 8 have a structure in which warps and wefts are woven. There are no particular limitations on the diameter of the warp and weft.
  • meshing directions are not particularly limited, and may be the same or different.
  • the present invention is not limited to this, and a plurality of meshes, for example, three, four, five or more meshes may be used.
  • the thickness of the first mesh 7 and the second mesh 8 is not particularly limited, but may be, for example, 5 ⁇ m to 200 ⁇ m, preferably 10 ⁇ m to 80 ⁇ m, and more preferably 30 ⁇ m to 50 ⁇ m.
  • the wick is not particularly limited as long as it has a structure in which the thickness is partially different and the working medium can be moved by capillary force.
  • the wick may be a wick having a known structure used in conventional vapor chambers.
  • the wick may be a wick having a fine structure having asperities such as pores, grooves, or protrusions.
  • the size and shape of the wick 6 are not particularly limited, for example, it is preferable to have a size and shape which can be continuously installed from the evaporation portion to the condensation portion inside the housing.
  • the thin portion of the wick be sized and shaped so as to be present near the outer edge of the housing.
  • the thickness of the wick 6 is not particularly limited, but may be, for example, in the range of 5 ⁇ m to 400 ⁇ m, preferably 10 ⁇ m to 150 ⁇ m, and more preferably 30 ⁇ m to 100 ⁇ m.
  • the working medium is not particularly limited as long as it can cause a gas-liquid phase change under the environment in the housing, and, for example, water, alcohols, chlorofluorocarbons, etc. can be used.
  • the working medium is an aqueous compound, preferably water.
  • FIG. 1b An AA cross-sectional view of the vapor chamber 1b of the present embodiment is shown in FIG.
  • the vapor chamber 1b has the same structure as the vapor chamber 1a except that the second pillar 10 is not present. That is, a plan view of the vapor chamber 1b is as shown in FIG.
  • the vapor chamber 1b of the present embodiment does not have the second pillar. That is, the wick 6 is in direct contact with the second sheet 3.
  • the thickness of the vapor chamber 1b can be reduced by the height of the second pillar since the second pillar does not exist.
  • the internal space 5, particularly the space between the wick 6 and the first sheet 2 can be largely secured, and the vapor passage becomes large. Transport volume can be further increased.
  • FIG. 4 A plan view of the vapor chamber 1c of the present embodiment is shown in FIG. 4, and a sectional view taken along the line AA in FIG.
  • the second mesh is biased to one side of the housing 4 (biased to the right in the drawing).
  • a portion of the first pillar 9 contacts and supports the second mesh 8 in a region where the first mesh 7 and the second mesh 8 overlap.
  • the other portion of the first pillar 9 is provided in the area where the second mesh 8 does not exist, and directly contacts the first mesh 7 to support the first mesh 7.
  • the thickness of the vapor chamber 1 c is also reduced by the thickness of the second mesh 8.
  • the configuration other than these is the same as the vapor chamber 1 a in the vapor chamber 1 c of the present embodiment.
  • the vapor chamber 1c Since the vapor chamber 1c has a thin portion, interference with other parts is suppressed when the vapor chamber 1c is mounted on an electronic device. Moreover, in the part in which two sheets of the 1st mesh 7 and the 2nd mesh 8 overlap, the transport capability of the working medium of a liquid is securable. Therefore, the vapor chamber 1c of the present embodiment has an advantage of being less susceptible to interference of other components in mounting on an electronic device or the like while securing a high heat transport capability.
  • FIG. 6 A plan view of the vapor chamber 1d according to the present embodiment is shown in FIG. 6, and a sectional view taken along the line AA in FIG.
  • the vapor chamber 1d has the same structure as the vapor chamber 1c except for the arrangement of the first mesh 7 and the second mesh 8 around the outer edge.
  • the first mesh 7 is separated from the outer edge, and the second mesh 8 on the first mesh 7 is the first mesh. It extends beyond the edge of 7 to near the outer edge. That is, the second mesh 8 extends to a portion closer to the outer edge than the first mesh 7. Where the first mesh 7 exceeds the edge of the first mesh 7 a space 16 may be formed. The height of the space 16 is equal to the thickness of the first mesh 7.
  • the space 16 is a relatively narrow space, capillary force can be generated. Thus, the space 16 may have the ability to transport a working medium of liquid. Further, since the vapor chamber 1d has a thin portion in the same manner as the vapor chamber 1c, interference with other parts is suppressed when the vapor chamber 1d is mounted on an electronic device. Therefore, the vapor chamber 1d of the present embodiment has an advantage of being less susceptible to interference of other components in mounting on an electronic device or the like while securing a high heat transport capability.
  • the wick 6 is composed of two meshes, but the present invention is not limited to this, and may be composed of a plurality of meshes, for example, three or more meshes. In this case, if the upper layer mesh of the plurality of meshes extends closer to the outer edge than the lower layer mesh, the above effect can be obtained.
  • Embodiment 5 A plan view of the vapor chamber 1e according to the present embodiment is shown in FIG. 8, a sectional view taken along the line AA is shown in FIG. 9, and a sectional view taken along the line BB in FIG.
  • the vapor chamber 1e is U-shaped in plan view.
  • the internal space 5 of the vapor chamber 1e is similarly U-shaped in plan view. That is, the internal space of the vapor chamber 1 e in the present embodiment has the narrow portion 17 and the wide portions 18 located at both ends in plan view.
  • the “narrowed portion” of the internal space means that cross sections parallel to each other in the internal space are acquired in the same direction (typically in the length (L in FIG. 8) or width (W in FIG. 8) direction) In this case, it means a portion of the inner space having a relatively small cross-sectional area.
  • the area indicated by reference numeral 17 is compared with the other area (referred to as “large area”) 18. , Cross section is small. Therefore, this area 17 is a narrow portion.
  • the narrow portion is not particularly limited as long as it is a portion having a smaller cross-sectional area compared to the large portion as described above, but the cross-sectional area of the narrow portion is preferably 90% or less of the cross-sectional area of the large portion More preferably, it may be 70% or less, more preferably 50% or less, such as 40% or less, 30% or less, or 20% or less.
  • the wick 6 is formed of two meshes (ie, the first mesh 7 and the second mesh 8) overlapped.
  • the thickness of the wick 6 is large.
  • the narrowing portion 17 has a small cross-sectional area as compared with the wide portion 18, so that pressure loss of capillary force occurs in the transport of the working medium in the length (L) direction.
  • the pressure loss of capillary force in the narrow portion is compensated by securing the thickness, and the working medium Transport ability can be enhanced. Therefore, according to the present embodiment, high heat transport capability can be secured even when the narrow portion is present.
  • the overlapping portion of the first mesh 7 and the second mesh 8 is not limited to only the narrow portion 17, and a portion may extend to the large portion 18 as illustrated.
  • Embodiment 6 A plan view of the vapor chamber 1f of the present embodiment is shown in FIG. 11, a sectional view taken along the line AA, and FIG. 12 is a sectional view taken along the line AA.
  • the vapor chamber 1 f does not have a second pillar in the narrow portion 17. Further, in the wide portion 18, the wick 6 is configured by the first mesh 7. The vapor chamber 1 f is the same as the vapor chamber 1 e except for the configuration described above.
  • the vapor chamber 1 f has excellent heat transport capability despite having the narrow portion 17.
  • FIG. 14 A plan view of the vapor chamber 1g of the present embodiment is shown in FIG. 14, a sectional view taken on line AA in FIG. 15 is shown in FIG. 15, and a sectional view taken on line BB in FIG.
  • the vapor chamber 1g is the same as the vapor chamber 1f except for the narrowing portion 17.
  • the narrow portion 17 does not have the first pillar and the second pillar.
  • the second pillar 10 is present in the narrow portion 17 but the first pillar is not present.
  • the first mesh 7 and the second mesh 8 are arranged in an overlapping manner, the second mesh 8 is in contact with the first sheet 2, and the first mesh 7 is shown in FIG.
  • the housing 4 is supported in contact with the second sheet 3 in the embodiment shown in Fig. 16 or in contact with the second pillar 10 in the embodiment shown in Fig. 16 (b). Thereby, the internal space 5 of the narrow portion 17 is formed.
  • the narrow portion 17 uses a stack of the first mesh 7 and the second mesh 8 as the wick 6, the pressure loss of capillary force in the narrow portion can be compensated to enhance the transport capacity of the working medium. .
  • the first pillar does not exist, the wick 6 can support the casing and secure the internal space 5 as well.
  • the thickness of the case can be reduced by the height of the first pillar, or if the thickness of the case is not reduced, the thickness of the wick Can be increased.
  • the vapor chamber 1 h is characterized by the wick 6.
  • the wick 6 in the present embodiment is composed of two first meshes 7 and second meshes 8.
  • the first mesh 7 and the second mesh 8 have a structure in which warp and weft are woven.
  • the first mesh 7 and the second mesh 8 have flat upper surfaces (surfaces on the first sheet 2 side).
  • “flat” does not mean perfect flatness, but as shown in FIG. 17, it means that the warp and weft constituting the upper surface of the mesh are crushed.
  • the top surface of the mesh is flat, the top surface has a surface roughness (Ra) of 10 ⁇ m or less.
  • the wire diameter of the said warp yarn and weft is not specifically limited.
  • the mesh directions of the two meshes may be the same or different.
  • the present invention is not limited to the above vapor chambers 1a to 1h, and design changes can be made without departing from the scope of the present invention.
  • the planar shape of the vapor chamber of the present invention (that is, the planar shape of the housing 4) is rectangular or U-shaped, but is not limited thereto.
  • the planar shape of the vapor chamber may be a polygon such as a triangle or a rectangle, a circle, an ellipse, or a combination thereof.
  • the planar shape of the vapor chamber of the present invention may have a through hole inside.
  • the planar shape of the vapor chamber of the present invention may be a shape according to the intended application, the shape of the incorporation site of the vapor chamber, and other parts present in the vicinity.
  • portion where the thickness of the wick is large is not limited to the above embodiment, and may be any portion.
  • a first pillar disposed in an internal space of the housing to support the housing from the inside; A working medium enclosed in the internal space of the housing; And a wick disposed in the interior space of the housing; One main surface of the wick has a portion supported by the first pillar and separated from the housing; The thickness of the wick is partially different, a vapor chamber.
  • the wick is a plurality of meshes, and in at least a part of the wick, the plurality of meshes are overlapped.
  • the vapor chamber according to aspect 2 wherein the plurality of meshes are two meshes. 4.
  • the housing has two opposing sheets sealed at the outer edge, The wick of the portion along the outer edge is a single mesh, The vapor chamber according to aspect 2 or 3. 5.
  • Aspect 7 The vapor chamber according to any one of aspects 1 to 6, wherein the internal space has a narrow portion. 8.
  • the internal space has a narrow portion, The region other than the narrow portion includes the first pillar and the second pillar, The narrow portion has only the first pillar among the first pillar and the second pillar, The vapor chamber according to aspect 6.
  • the internal space has a narrow portion, The vapor chamber according to aspect 6, wherein the narrow portion has only the second pillar among the first pillar and the second pillar. 10.
  • Aspect 11 The vapor chamber according to any one of aspects 7 to 9, wherein the thickness of the wick is large in the narrow portion.
  • the vapor chamber according to any one of aspects 1 to 10 wherein the vapor chamber has a small thickness in at least a part of the thin portion of the wick.
  • the vapor chamber according to aspect 2 wherein the vapor layer side of the mesh is flat.
  • An electronic apparatus comprising the vapor chamber according to any one of aspects 1 to 12.
  • the vapor chamber of the present invention can be suitably used for electronic devices having various internal shapes.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • General Induction Heating (AREA)
  • Electroluminescent Light Sources (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

La présente invention concerne une chambre à vapeur comprenant : une enveloppe ; des premiers montants disposés dans un espace interne de l'enveloppe de façon à soutenir l'enveloppe à partir de l'intérieur ; un agent actif isolé à l'intérieur de l'espace interne de l'enveloppe ; et une mèche disposée dans l'espace interne de l'enveloppe. Une surface primaire de la mèche comporte une partie soutenue par les premiers montants et espacée de l'enveloppe, et la mèche présente des épaisseurs partiellement différentes.
PCT/JP2018/035670 2017-09-29 2018-09-26 Chambre à vapeur WO2019065728A1 (fr)

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US16/565,931 US11231235B2 (en) 2017-09-29 2019-09-10 Vapor chamber

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JP2017-190724 2017-09-29

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JP2022041299A (ja) * 2020-08-31 2022-03-11 尼得科超▲しゅう▼科技股▲ふん▼有限公司 熱伝導部材
JP2022041300A (ja) * 2020-08-31 2022-03-11 尼得科超▲しゅう▼科技股▲ふん▼有限公司 熱伝導部材
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US11231235B2 (en) 2022-01-25
JP2021036175A (ja) 2021-03-04
CN110476032A (zh) 2019-11-19
CN110476032B (zh) 2021-08-06

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