WO2019062178A1 - 触控面板、其制作方法及显示装置 - Google Patents

触控面板、其制作方法及显示装置 Download PDF

Info

Publication number
WO2019062178A1
WO2019062178A1 PCT/CN2018/089064 CN2018089064W WO2019062178A1 WO 2019062178 A1 WO2019062178 A1 WO 2019062178A1 CN 2018089064 W CN2018089064 W CN 2018089064W WO 2019062178 A1 WO2019062178 A1 WO 2019062178A1
Authority
WO
WIPO (PCT)
Prior art keywords
lead portion
touch
cathode
touch electrode
touch panel
Prior art date
Application number
PCT/CN2018/089064
Other languages
English (en)
French (fr)
Inventor
杨盛际
董学
陈小川
玄明花
王磊
卢鹏程
肖丽
刘冬妮
于静
Original Assignee
京东方科技集团股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US16/301,894 priority Critical patent/US10797118B2/en
Priority to EP18793156.3A priority patent/EP3690619B1/en
Priority to JP2018559286A priority patent/JP7267744B2/ja
Publication of WO2019062178A1 publication Critical patent/WO2019062178A1/zh

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/82—Cathodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8052—Cathodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Definitions

  • the present disclosure relates to the field of display technologies, and in particular, to a touch panel, a method of fabricating the same, and a display device.
  • OLED Organic Light Emitting Diode
  • the touch technology has also been rapidly developed, and its compatibility with the display panel process has become more and more popular among the public.
  • the OLED touch panel is generally fabricated by directly applying a multilayer touch structure to the package structure. Implement touch function. However, this not only increases the difficulty of the process, but also increases the production cost. Moreover, even with a film bonding method, it is difficult to meet the requirements of bonding.
  • each of the cathodes corresponds to at least one of the touch electrode traces
  • the spacer comprises a first support pillar and a second support pillar which are sequentially stacked on the base substrate;
  • Each of the touch electrode traces includes a first lead portion and a second lead portion; wherein the first lead portion is electrically connected to the corresponding cathode, and the second lead portion is used to be the first lead The lead portion is electrically connected to a corresponding pin on the touch chip;
  • the first lead portion covers at least a surface of the first support pillar adjacent to the cathode of the corresponding connection facing the cathode.
  • the first lead portion completely covers the surface of the first support column, and the first support columns covered by different first lead portions are different.
  • one of the cathodes corresponds to one of the touch electrode traces.
  • one of the cathodes corresponds to two touch electrode traces.
  • the orthographic projection of the cathode on the substrate substrate overlaps with the orthographic projection of the adjacent first pillar on the substrate substrate. region.
  • an orthogonal projection of the second support pillar on the base substrate and an orthogonal projection of the cathode on the base substrate do not overlap.
  • the touch panel provided by the embodiment of the present invention further includes: a first insulating layer between the first support pillar and the second lead portion;
  • the first insulating layer has a plurality of via holes corresponding to the touch electrode traces in one-to-one correspondence;
  • the second lead portion of the touch electrode trace is electrically connected to the first lead portion through the via.
  • the touch panel provided by the embodiment of the present invention further includes: a plurality of gate lines;
  • Each of the second lead portions is made of the same material as the gate line.
  • the touch panel provided by the embodiment of the present invention further includes: multiple data lines;
  • Each of the second lead portions is made of the same material as the data line.
  • the material of the first support pillar comprises a positive photoresist
  • the material of the second support pillar comprises a negative photoresist
  • the embodiment of the invention further provides a display device, which comprises the touch panel provided by the embodiment of the invention.
  • the embodiment of the invention further provides a method for manufacturing a touch panel, which comprises:
  • each strip The touch electrode trace includes a first lead portion and a second lead portion, the first lead portion covering at least a surface of the first support pillar adjacent to the cathode to be connected facing the cathode, the second lead The portion is configured to electrically connect the first lead portion to a corresponding pin on the touch chip;
  • a cathode layer on the base substrate on which the spacer and the touch electrode trace are formed; wherein the cathode layer is separated by the spacer into a plurality of cathodes arranged in a matrix, each of which The cathode corresponds to at least one of the touch electrode traces, and is electrically connected to the corresponding first lead portion of the touch electrode trace.
  • forming a plurality of spacers and a plurality of touch electrode traces on the substrate specifically including:
  • Forming a cathode layer on the substrate formed with the spacer and the touch electrode trace specifically comprising:
  • a cathode layer is formed on the base substrate after the second support post is chamfered.
  • the forming the second support column is chamfered, and specifically includes:
  • the formed second support column is chamfered by a laser process.
  • the forming the second support column is chamfered, and specifically includes:
  • the formed second support column is chamfered by an ashing process.
  • the method further includes:
  • FIG. 1 is a schematic diagram of a touch structure in the related art
  • 2a is a schematic diagram of a touch structure of a single-layer touch electrode in the related art
  • 2b is a schematic diagram of distribution of touch electrodes in the related art
  • 3a to 3c are schematic top plan views of a touch panel according to an embodiment of the present disclosure.
  • FIG. 4a is a cross-sectional structural view of the touch panel shown in FIG. 3a along the AA' direction;
  • 4b is a cross-sectional structural view of the touch panel shown in FIG. 3b along the AA' direction;
  • 4c is a cross-sectional structural view of the touch panel shown in FIG. 3c along the AA' direction;
  • FIG. 5 is a schematic diagram of distribution of cathode and touch electrode traces according to an embodiment of the present disclosure
  • FIG. 6 is a flowchart of a method for fabricating a touch panel according to an embodiment of the present disclosure
  • FIG. 7 is a flowchart of a specific manufacturing method of a touch panel according to an embodiment of the present disclosure.
  • FIG. 8 is a schematic diagram of a manufacturing process of a touch panel according to an embodiment of the present disclosure.
  • the OLED touch panel may include a light emitting structure O, a package structure E (for example, a package film or a package cover), and a multilayer touch structure T disposed on a side of the package structure E facing away from the light emitting structure O.
  • the material of the touch structure T is indium tin oxide (ITO). Due to the poor bending property of the ITO, the bonding process of the touch structure T and the touch chip TIC is difficult.
  • ITO indium tin oxide
  • the multi-layer touch structure T not only the thickness of the panel but also the manufacturing cost is increased. In addition, even with the method of film bonding, it is difficult to meet the requirements of bonding.
  • the cathode Y in the light-emitting structure O is generally located at the uppermost portion of the entire functional layer, and the cathode Y is patterned to form the touch electrode y0 and the touch by way of dividing and multiplexing the cathode Y.
  • Line m as shown in Figure 2b.
  • the touch traces m are distributed on the film layer where the cathode Y is located, and are connected to the underlying metal traces n through the vias g in the peripheral region of the display panel.
  • the method of implementing touch using a single-layer touch electrode is achievable for a small-sized touch panel.
  • the number of touch electrodes is also increased, as shown in FIG. 2b, so that the area BB occupied by the touch trace m forms a touch dead zone, and the width of the touch dead zone is directly It is determined by the number of touch electrodes.
  • the size of the touch electrodes Y is not completely the same due to the presence of the touch traces m, and thus the touch uniformity is also affected.
  • the embodiments of the present disclosure provide a touch panel, a manufacturing method thereof, and a display device, which are used to improve the touch uniformity of the touch panel, thereby improving touch precision.
  • the touch panel provided by the embodiment of the present disclosure may include: a base substrate 100 and a substrate substrate 100, as shown in FIG. 3a to FIG. 4c (the second support pillars P2 are not shown in FIG. 3a to FIG. 3c). a plurality of touch electrode traces L on the side, a plurality of cathodes Y arranged in a matrix on the side of the base substrate 100 provided with the touch electrode traces L, and a plurality of gaps located between the cathodes Y Spacer. Each cathode Y corresponds to at least one touch electrode trace L.
  • the spacer may include: a first support pillar P1 and a second support pillar P2 which are sequentially stacked on the substrate base 100, that is, the first support pillar P1 is located above the base substrate 100, and the second support pillar P2 is located at the first Above the support column P1.
  • each of the touch electrode traces L includes a first lead portion L1 and a second lead portion L2; wherein the first lead portion L1 is electrically connected to the corresponding cathode Y, and the second lead portion L2 is used to connect the first lead portion L1 is electrically connected to a corresponding pin on the touch chip (not shown in FIG. 3a to FIG. 4c); and the first lead portion L1 covers at least the first support post P1 adjacent to the corresponding connected cathode Y facing the cathode Y s surface.
  • the multiplexed cathode is a touch electrode
  • the cathode of the matrix is electrically connected to the touch chip through the touch electrode trace to realize the touch function.
  • the first lead portion of the touch electrode trace covers at least a surface of the first support pillar adjacent to the cathode of the corresponding connection facing the cathode, that is, the first lead portion extends on the first support pillar so that the cathode can be
  • the first lead portion is directly electrically connected.
  • the consistent cathode is a touch electrode, which avoids the problem of poor touch uniformity due to the size of the touch electrodes.
  • the first lead portion L1 may be covered with the first support post P1 adjacent to the corresponding connected cathode Y.
  • the surface of the cathode Y may be covered.
  • the first lead portion L1 may be completely covered on the surface of the first support post P1, and in order to avoid short circuit of the different first lead portions L1, the first difference may be made.
  • the first support post P1 covered by the lead portion L1 is different.
  • the spacer is disposed at the gap of the cathode Y such that there is a gap between the spacer and the cathode Y
  • the first lead portion L1 is required Electrically connected to the corresponding cathode Y, so that the gap between the first support post P1 and the cathode Y can be filled by the material of the first lead portion L1, and the gap between the first support post P1 and the other cathode Y is not
  • the material of the first lead portion L1 is completely filled so that a gap is provided between the first lead portion L1 and the other cathodes Y, thereby preventing the first lead portion L1 from being short-circuited with the other cathodes Y.
  • the number of touch electrode traces corresponding to a part of the cathodes may be different.
  • some cathodes may be routed to one touch electrode, and the remaining cathodes may correspond to two touch electrode traces.
  • a portion of the cathodes may be routed to the three touch electrodes, and the remaining portions of the cathodes correspond to the two touch electrode traces, which are not limited herein.
  • the number of touch electrode traces corresponding to each cathode can be the same.
  • one cathode Y can be associated with one touch electrode trace L. This minimizes the set of touch electrode traces L.
  • one cathode Y may be corresponding to the two touch electrode traces L. In this way, when one touch electrode trace L is damaged, another touch electrode trace L is used to transmit a signal.
  • the material of the first support pillar may include a positive photoresist
  • the material of the second support pillar includes a negative photoresist
  • the first support pillar and the second support pillar are respectively formed by using positive and negative photoresists, so that the first support pillar and the second support pillar form a mutually symmetrical pattern.
  • the material of the first support pillar may include a negative photoresist
  • the material of the second support pillar may include a positive photoresist, which is not limited herein.
  • the cross-sectional shape of the first support pillar P1 may include an isosceles trapezoid, so that the cross-sectional shape of the second support pillar may be It is an inverted isosceles trapezoid, and the two bottom corners of the inverted isosceles trapezoid are cut off so that the cathode formed later can be electrically connected to the first lead portion L1 covering the surface of the first support post P1.
  • the cross-sectional shape of the first support column may also include other achievable graphics, which is not limited herein.
  • the front projection of the second support pillar P2 on the base substrate 100 and the cathode Y may be on the base substrate 100.
  • the orthographic projection has no overlap region, so that when the cathode Y is prepared by the process, the second support post P2 can be prevented from obscuring the side surface of the first support post P1, thereby preventing the formed cathode from contacting the side surface of the first support post. Further, it is also possible to make the orthographic projection of the second support pillar P2 in the same spacer in the substrate substrate 100 within the orthographic projection of the first support pillar P1 in the base substrate 100.
  • the orthogonal projection of the cathode Y on the base substrate 100 has an overlapping area with the orthographic projection of the adjacent first support post P1 on the base substrate 100. This ensures that the cathode Y can extend to the side surface of the first support post P1 so as to be in direct contact with the first lead portion L1 covering the side surface of the first support post P1.
  • the touch panel may further include: a first between the first support pillar P1 and the second lead portion L2.
  • An insulating layer 110 wherein the first insulating layer 100 may have a plurality of vias 120 corresponding to the touch electrode traces L; and the second lead portions L2 and the first lead portions of the touch electrode traces L L1 is electrically connected through vias 120.
  • the material filled in the via hole 120 is the material of the first lead portion L1, that is, when the first lead portion L1 is prepared by the process, the first lead portion L1 is completely filled with the via hole 120 to make the first lead
  • the portion L1 is electrically connected to the second lead portion L2.
  • the materials of the first lead portion and the second lead portion in the touch electrode trace may include Ti, Al, and Ti stacked. Such a combination of metal materials can reduce the influence of the impedance of the touch electrode trace on the touch performance.
  • the second lead portion of the touch electrode trace and the first lead portion may be other metal materials that meet the design requirements, which are not limited herein.
  • the anode 130 may be disposed between the first insulating layer 110 and the cathode Y and located at the anode 130 and A light-emitting functional layer 140 between the cathodes Y.
  • the light emitting function layer 140 may include an electroluminescent layer.
  • the light-emitting function layer 140 may further include a hole injection layer, a hole transport layer, an electron injection layer, an electron transport layer, and the like, which are not limited herein.
  • the touch panel is further provided with a gate line for transmitting a gate scan signal, a data line for transmitting a data signal, and a thin film transistor, that is, an active layer, a gate insulating layer, a gate layer, and an interlayer dielectric layer are disposed.
  • the touch panel further includes: a multi-layer, a drain layer, a planarization layer, and an interlayer insulating layer between the anodes. a grid line; wherein each of the second lead portions and the gate line can be made of the same material.
  • the gate lines are generally disposed in the same layer as the gate layer. Therefore, the first insulating layer may include: an interlayer dielectric layer, a planarization layer, and an inter-anode insulating layer. Moreover, the structure and function of each of the above film layers may be substantially the same as those in the related art, and will not be described in detail herein.
  • the touch panel further includes: a plurality of data lines; wherein each of the second lead portions and the data line can be made of the same material. Therefore, it is not necessary to add an additional process for preparing each of the second lead portions, and only the pattern of each of the second lead portions and the respective data lines can be formed by one patterning process, thereby simplifying the preparation process, saving production cost, and improving production efficiency.
  • the first insulating layer at this time may include: a planarization layer and an inter-anode insulating layer.
  • the first insulating layer may also be an additional insulating layer, and the first insulating layer may be located between the anode insulating layer and the first layer. Between the support columns.
  • the setting of the first insulating layer needs to be determined according to the actual application environment, which is not limited herein.
  • the embodiment of the present disclosure further provides a display device, including the above touch panel provided by the embodiment of the present disclosure.
  • the principle of the display device is similar to that of the touch panel.
  • the display device provided by the embodiment of the present disclosure may be any product or component having a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, and the like.
  • a display function such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, and the like.
  • Other indispensable components of the display device are understood by those skilled in the art, and are not described herein, nor should they be construed as limiting the disclosure.
  • the embodiment of the present disclosure further provides a method for manufacturing a touch panel, as shown in FIG. 6 , which may include:
  • the spacer includes a first support pillar and a second support pillar which are sequentially stacked on the base substrate; each of the touch electrode traces includes a first lead portion and a second lead portion, and the first lead portion covers at least a first support pillar adjacent to the connected cathode faces the surface of the cathode, and a second lead portion is used for electrically connecting the first lead portion to a corresponding pin on the touch chip;
  • the cathode layer is separated by a spacer into a plurality of cathodes arranged in a matrix, each cathode corresponding to at least one touch electrode trace, and electrically connected to the first lead portion of the corresponding touch electrode trace.
  • a spacer, a cathode, and a touch electrode trace including a first support pillar and a second support pillar are formed on the base substrate, and the multiplexed cathode is a touch electrode, and the touch is performed.
  • the control electrode traces electrically connect the cathodes arranged in a matrix with the touch chip to implement the touch function.
  • the first lead portion of the touch electrode trace covers at least a surface of the first support pillar adjacent to the cathode to be connected facing the cathode, so that the cathode can be directly electrically connected to the first lead portion, and the second lead portion can be
  • the first lead portion is electrically connected to the touch chip, so that the touch function can be realized, and the touch control layer can be prevented from being touched by the touch line disposed on the same layer of the touch layer.
  • the present disclosure multiplexes a plurality of cathodes of the same size arranged in a matrix as touch electrodes, thereby avoiding the problem of poor touch uniformity due to different sizes of touch electrodes.
  • step S601 may specifically include:
  • Forming a cathode layer on the base substrate on which the spacer and the touch electrode trace are formed may specifically include:
  • a cathode layer is formed on the base substrate after the second support post is chamfered.
  • the method further includes:
  • a patterning process is performed on the formed first insulating layer to form via holes corresponding to the touch electrode traces.
  • the electroluminescent layer can be formed by an evaporation process.
  • the method further includes forming an active layer, a gate insulating layer, a gate layer, an interlayer dielectric layer, a source/drain layer, a planarization layer, and between the anodes.
  • the manufacturing process of the film layer such as the insulating layer between the anodes is the same as that of the related art, and will not be described in detail herein.
  • the method for manufacturing the touch panel shown in FIG. 4b provided by the embodiment of the present disclosure may include the following steps:
  • a pattern of each of the second lead portions L2 is formed on the base substrate 100 by one patterning process; as shown in Fig. 8a.
  • a pattern of the first insulating layer 110 having the via holes 120 is formed on the base substrate 100 by one patterning process; as shown in Fig. 8b.
  • a pattern of each of the first support pillars P1 is formed on the base substrate 100 by using a patterning process and using a positive photoresist; as shown in Fig. 8c.
  • a pattern covering the first lead portion L1 of the first support post P1 is formed on the base substrate 100 by one patterning process; as shown in Fig. 8d. Further, the first lead portion L1 is electrically connected to the corresponding second lead portion L2 through the via 120.
  • a pattern of each of the second support columns P2 disposed opposite to the first support post P1 is formed on the base substrate 100 by using a patterning process and using a negative photoresist; as shown in FIG. 8e.
  • the first support pillar and the second support pillar are respectively formed by using positive and negative photoresists, so that the first support pillar and the second support pillar form a mutually symmetrical pattern, wherein, as shown in FIG. 8 e, the first support
  • the cross-sectional shape of the column P1 may be an isosceles trapezoid such that the cross-sectional pattern of the second supporting P2 is also an inverted isosceles trapezoid.
  • the formed second support post P2 is chamfered; as shown in Fig. 8f.
  • the formed second support column may be chamfered by a laser process or an ashing process.
  • the two bottom corners of the inverted isosceles trapezoid are cut off so that the cathode deposited later can be electrically connected to the first lead portion covering the surface of the first support post.
  • a cathode layer including a cathode Y is formed on the base substrate 100 after the second support post P2 is chamfered; as shown in Fig. 4b.
  • the patterning process may include only a photolithography process, or may include a photolithography process and an etching step, and may also include printing, inkjet, and the like.
  • a process of forming a predetermined pattern; a photolithography process refers to a process of forming a pattern using a photoresist, a mask, an exposure machine, or the like including a process of film formation, exposure, development, and the like.
  • the corresponding patterning process can be selected in accordance with the structure formed in the present disclosure.
  • the multiplexed cathode is a touch electrode
  • the cathode of the matrix is electrically connected to the touch chip through the touch electrode trace to realize the touch function.
  • the first lead portion of the touch electrode trace covers at least a surface of the first support pillar adjacent to the cathode of the corresponding connection facing the cathode, that is, the first lead portion extends on the first support pillar so that the cathode can be
  • the first lead portion is directly electrically connected.
  • the consistent cathode is a touch electrode, which avoids the problem of poor touch uniformity due to the size of the touch electrodes.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Position Input By Displaying (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

本公开公开了触控面板、其制作方法及显示装置，包括：衬底基板、位于衬底基板上的多条触控电极走线、呈矩阵排列的多个阴极，位于各阴极之间的间隙处的多个隔垫物，每个阴极对应至少一条触控电极走线，且隔垫物包括依次层叠设置于衬底基板的第一支撑柱和第二支撑柱；每条触控电极走线包括第一引线部和第二引线部；其中，第一引线部与对应的阴极电连接，第二引线部用于将第一引线部与触控芯片上对应的管脚电连接；第一引线部至少覆盖对应连接的阴极所相邻的第一支撑柱面向阴极的表面。

Description

触控面板、其制作方法及显示装置
本申请要求在2017年09月27日提交中国专利局、申请号为201710892282.4、公开名称为“一种触控面板、其制作方法及显示装置”的中国专利申请的优先权，其全部内容以引入的方式并入本申请中。
技术领域
本公开涉及显示技术领域，尤其涉及触控面板、其制作方法及显示装置。
背景技术
随着显示技术的进步，有机发光二极管(Organic Light Emitting Diode，OLED)显示面板，因其具有更快的反应速度，更高的对比度以及更广大的视角，以越来越多的应用于市场中。同时，触控技术也得到迅速发展，其可以与显示面板工艺兼容的特点，越来越受到大众的青睐，目前，OLED触摸面板一般是通过将多层的触控结构直接制作在封装结构上以实现触控功能的。然而，这样既增加了工艺制作难度，也增加了制作成本。并且，即使是采用膜贴合的方式也很难满足邦定(Bonding)的要求。
发明内容
本公开实施例提供的触控面板，其中，包括：
衬底基板；
多条触控电极走线；
多个阴极，呈矩阵排列，且每个所述阴极对应至少一条所述触控电极走线；
多个隔垫物，位于各所述阴极之间的间隙处，且所述隔垫物包括依次层叠设置于所述衬底基板的第一支撑柱和第二支撑柱；
每条所述触控电极走线包括第一引线部和第二引线部；其中，所述第一 引线部与对应的所述阴极电连接，所述第二引线部用于将所述第一引线部与触控芯片上对应的管脚电连接；
所述第一引线部至少覆盖对应连接的阴极所相邻的第一支撑柱面向所述阴极的表面。
可选地，在本发明实施例提供的触控面板中，所述第一引线部完全覆盖所述第一支撑柱的表面，不同第一引线部覆盖的第一支撑柱不同。
可选地，在本发明实施例提供的触控面板中，一个所述阴极对应一条所述触控电极走线。
可选地，在本发明实施例提供的触控面板中，一个所述阴极对应两条所述触控电极走线。
可选地，在本发明实施例提供的触控面板中，所述阴极在所述衬底基板的正投影与相邻的所述第一支撑柱在所述衬底基板的正投影具有交叠区域。
可选地，在本发明实施例提供的触控面板中，所述第二支撑柱在所述衬底基板的正投影与所述阴极在所述衬底基板的正投影无交叠区域。
可选地，在本发明实施例提供的触控面板中，还包括：位于所述第一支撑柱与所述第二引线部之间的第一绝缘层；
所述第一绝缘层具有多个与所述触控电极走线一一对应的过孔；
所述触控电极走线的第二引线部与第一引线部通过所述过孔电连接。
可选地，在本发明实施例提供的触控面板中，还包括：多条栅线；
各所述第二引线部与所述栅线同层同材质。
可选地，在本发明实施例提供的触控面板中，还包括：多条数据线；
各所述第二引线部与所述数据线同层同材质。
可选地，在本发明实施例提供的触控面板中，所述第一支撑柱的材料包括正性光刻胶，所述第二支撑柱的材料包括负性光刻胶。
相应地，本发明实施例还提了显示装置，其中，包括本发明实施例提供的触控面板。
相应地，本发明实施例还提供了触控面板的制作方法，其中，包括：
在衬底基板上形成多个隔垫物以及多条触控电极走线；其中，所述隔垫物包括依次层叠设置于所述衬底基板的第一支撑柱和第二支撑柱；每条所述触控电极走线包括第一引线部和第二引线部，所述第一引线部至少覆盖将要连接的阴极所相邻的第一支撑柱面向所述阴极的表面，所述第二引线部用于将所述第一引线部与触控芯片上对应的管脚电连接；
在形成有所述隔垫物和所述触控电极走线的衬底基板上形成阴极层；其中，所述阴极层由所述隔垫物分隔为呈矩阵排列的多个阴极，每个所述阴极对应至少一条所述触控电极走线，且与对应的所述触控电极走线的第一引线部电连接。
可选地，在本发明实施例提供的制作方法中，在衬底基板上形成多个隔垫物以及多条触控电极走线，具体包括：
在所述衬底基板上形成各第二引线部；
在形成有所述第二引线部的衬底基板上形成各所述隔垫物的第一支撑柱；
在形成有所述第一支撑柱的衬底基板上形成第一引线部；
在形成有所述第一引线部的衬底基板上形成与所述第一支撑柱相对设置的各所述隔垫物的第二支撑柱；
对形成的所述第二支撑柱进行削角；
所述在形成有所述隔垫物和所述触控电极走线的衬底基板上形成阴极层，具体包括：
在进行所述第二支撑柱削角后的衬底基板上形成阴极层。
可选地，在本发明实施例提供的制作方法中，对形成的所述第二支撑柱进行削角，具体包括：
采用激光工艺对形成的所述第二支撑柱进行削角。
可选地，在本发明实施例提供的制作方法中，对形成的所述第二支撑柱进行削角，具体包括：
采用灰化工艺对形成的所述第二支撑柱进行削角。
可选地，在本发明实施例提供的制作方法中，在所述衬底基板上形成各所述触控电极走线的第二引线部之后，且在形成有所述第二引线部的衬底基板上形成各所述隔垫物的第一支撑柱之前，还包括：
在所述衬底基板上形成第一绝缘层；
对形成的所述第一绝缘层进行构图工艺，形成与各所述触控电极走线一一对应的过孔。
附图说明
图1为相关技术中的触控结构示意图；
图2a为相关技术中单层触控电极触控结构示意图；
图2b为相关技术中触控电极分布示意图；
图3a至图3c分别为本公开实施例提供的触控面板的俯视结构示意图；
图4a为图3a所示的触控面板沿AA’方向的剖视结构示意图；
图4b为图3b所示的触控面板沿AA’方向的剖视结构示意图；
图4c为图3c所示的触控面板沿AA’方向的剖视结构示意图；
图5为本公开实施例提供的阴极和触控电极走线的分布示意图；
图6为本公开实施例提供的触控面板的制作方法流程图；
图7为本公开实施例提供的触控面板的具体制作方法流程图；
图8a至图8f分别为本公开实施例提供的触控面板的制作过程示意图。
具体实施方式
如图1所示，OLED触摸面板一般可以包括：发光结构O，封装结构E(例如封装薄膜或封装盖板)，设置于封装结构E背离发光结构O一侧的多层触控结构T。一般触控结构T的材料为氧化铟锡(ITO)，由于ITO弯折性不佳，导致实现触控结构T与触控芯片TIC的邦定(Bonding)工艺难度较大。并且，通过额外设置多层触控结构T不仅增加了面板厚度也增加了制作成本。另外，即使是采用膜贴合的方式也很难满足邦定的要求。
为了降低面板厚度、降低制作工艺和成本，可以采用单层触控电极以实现触控的方式，尤其是对于手机类的显示产品而言(4inch及以上)，更需要轻薄化。如图2a所示，发光结构O中的阴极Y一般位于整个功能层的最上方，通过使阴极Y进行分割复用的方式，将阴极Y进行图案化处理以形成触控电极y0和触控走线m，如图2b所示。由于触控走线m分布在阴极Y所在膜层，且通过显示面板周边区域中的过孔g与下方的金属走线n连接。这种采用单层触控电极实现触控的方式对于小尺寸的触控面板是可以实现的。但是当触控面板的尺寸增加后，触控电极的个数也会增加，如图2b所示，这样会使触控走线m占用的区域BB形成触控盲区，该触控盲区的宽度直接由触控电极的数量决定。并且，由于触控走线m的存在使得触控电极Y的大小也不完全相同，从而也会影响触控均一性。
因此，本公开实施例提供了触控面板、其制作方法及显示装置，用以提高触控面板的触控均一性，从而提高触控精度。
为了使本公开的目的，技术方案和优点更加清楚，下面结合附图，对本公开实施例提供的触控面板、其制作方法及显示装置的具体实施方式进行详细地说明。应当理解，下面所描述的优选实施例仅用于说明和解释本公开，并不用于限定本公开。并且在不冲突的情况下，本公开中的实施例及实施例中的特征可以相互组合。
结合图3a至图4c(图3a至图3c中未将第二支撑柱P2示出)所示，本公开实施例提供的触控面板，可以包括：衬底基板100、位于衬底基板100一侧的多条触控电极走线L、位于衬底基板100设置有触控电极走线L一侧的且呈矩阵排列的多个阴极Y，以及位于各阴极Y之间的间隙处的多个隔垫物。其中，每个阴极Y对应至少一条触控电极走线L。隔垫物可以包括：依次层叠设置于衬底基100上的第一支撑柱P1和第二支撑柱P2，即第一支撑柱P1位于衬底基板100之上，第二支撑柱P2位于第一支撑柱P1之上。
并且，每条触控电极走线L包括第一引线部L1和第二引线部L2；其中，第一引线部L1与对应的阴极Y电连接，第二引线部L2用于将第一引线部L1 与触控芯片(图3a至图4c未示出)上对应的管脚电连接；并且，第一引线部L1至少覆盖对应连接的阴极Y所相邻的第一支撑柱P1面向该阴极Y的表面。
本公开实施例提供的上述触控面板，复用阴极为触控电极，通过触控电极走线将呈矩阵分布的阴极与触控芯片电连接以实现触控功能。其中，触控电极走线的第一引线部至少覆盖对应连接的阴极所相邻的第一支撑柱面向该阴极的表面，即第一引线部在第一支撑柱上延伸，以使得阴极可以与第一引线部直接电连接，在触控面板设置有触控芯片后，可以通过第二引线部将第一引线部与触控芯片电连接，从而可以实现触控功能。与图2a与图2b所示的触控电极通过位于自身周边同层设置的触控走线实现触控功能相比，可以避免出现触控盲区，同时本公开复用呈矩阵排列的多个大小一致的阴极为触控电极，避免由于触控电极大小不一导致的触控均一性较差的问题。
在具体实施时，在本公开实施例提供的上述触控面板中，如图3a与图3c所示，可以使第一引线部L1覆盖对应连接的阴极Y所相邻的第一支撑柱P1面向该阴极Y的表面。或者，为了进一步实现电连接，如图3b所示，也可以使第一引线部L1完全覆盖第一支撑柱P1的表面，并且，为了避免不同第一引线部L1短路，还可以使不同第一引线部L1覆盖的第一支撑柱P1不同。并且，由于隔垫物设置于阴极Y的间隙处，使得隔垫物与阴极Y之间具有间隙，在第一引线部L1完全覆盖第一支撑柱P1的表面时，由于第一引线部L1需要与对应的阴极Y电连接，因此此时第一支撑柱P1与该阴极Y之间的间隙可以被第一引线部L1的材料填充，而第一支撑柱P1与其他阴极Y之间的间隙不被第一引线部L1的材料完全填充，以使第一引线部L1与其他阴极Y之间设置有间隙，从而避免第一引线部L1与其他阴极Y短路。
在具体实施时，在本公开实施例提供的上述触控面板中，可以使部分阴极对应的触控电极走线的条数不同。例如，可以使部分阴极对应一条触控电极走线，其余部分阴极对应两条触控电极走线。或者，可以使部分阴极对应三条触控电极走线，其余部分阴极对应两条触控电极走线，在此不作限定。
为了使触控电极走线设置均一，在具体实施时，在本公开实施例提供的 上述触控面板中，可以使各个阴极对应的触控电极走线的条数相同。例如，如图3c以及图5所示，可以使一个阴极Y对应一条触控电极走线L。这样可以使设置的触控电极走线L最少。或者，如图3a与图3b所示，可以使一个阴极Y对应两条触控电极走线L。这样可以在一条触控电极走线L损坏时，采用另一条触控电极走线L传输信号。
在具体实施时，在本公开实施例提供的上述触控面板中，第一支撑柱的材料可以包括正性光刻胶，第二支撑柱的材料包括负性光刻胶。具体地，采用正、负光刻胶分别制作第一支撑柱和第二支撑柱，可以使得第一支撑柱和第二支撑柱形成互相对称的图形。当然，还可以使第一支撑柱的材料包括负性光刻胶，第二支撑柱的材料可以包括正性光刻胶，在此不作限定。
在具体实施时，在本公开实施例提供的上述触控面板中，如图4a至图4c所示，第一支撑柱P1的截面图形可以包括等腰梯形，这样第二支撑柱的截面图形可以为倒置的等腰梯形，并且将倒置的等腰梯形的两个底角削掉，以便后期形成的阴极可以与覆盖于第一支撑柱P1表面的第一引线部L1电连接。当然，在实际应用中，还可以使第一支撑柱的截面图形包括其他可以实现的图形，在此不作限定。
在具体实施时，在本公开实施例提供的上述触控面板中，如图4a至图4c所示，可以使第二支撑柱P2在衬底基板100的正投影与阴极Y在衬底基板100的正投影无交叠区域，这样在工艺制备阴极Y时，可以避免第二支撑柱P2遮挡第一支撑柱P1的侧表面，从而避免妨碍形成的阴极接触第一支撑柱的侧表面。进一步地，还可以使同一隔垫物中的第二支撑柱P2在衬底基板100的正投影位于第一支撑柱P1在衬底基板100的正投影内。
进一步地，为了使阴极可以接触到第一支撑柱侧表面上的第一引线部，在具体实施时，在本公开实施例提供的上述触控面板中，如图3a至图4c所示，可以使阴极Y在衬底基板100的正投影与相邻的第一支撑柱P1在衬底基板100的正投影具有交叠区域。这样可以保证阴极Y可以延伸到第一支撑柱P1的侧表面，从而与覆盖于该第一支撑柱P1侧表面的第一引线部L1直接接触。
在具体实施时，在本公开实施例提供的上述触控面板中，如图4a至图4c所示，触控面板还可以包括：位于第一支撑柱P1与第二引线部L2之间的第一绝缘层110；其中，该第一绝缘层100可以具有多个与触控电极走线L一一对应的过孔120；并且触控电极走线L的第二引线部L2与第一引线部L1通过过孔120电连接。具体地，过孔120中填充的材料为第一引线部L1的材料，即在工艺制备第一引线部L1时，通过使第一引线部L1的材料完全填充过孔120，以使第一引线部L1与第二引线部L2电连接。
在具体实施时，在本公开实施例提供的上述触控面板中，触控电极走线中的第一引线部和第二引线部的材料可以包括层叠设置的Ti、Al、Ti。这样的金属材料组合可以降低触控电极走线的阻抗对触控性能的影响。当然触控电极走线的第二引线部与第一引线部还可以为层叠设置的其他满足设计需求的金属材料，在此不做限定。
在具体实施时，在本公开实施例提供的上述触控面板中，如图4a至图4c所示，还可以包括：位于第一绝缘层110与阴极Y之间的阳极130以及位于阳极130和阴极Y之间的发光功能层140。其中，发光功能层140可以包括电致发光层。当然，发光功能层140还可以包括空穴注入层、空穴传输层、电子注入层以及电子传输层等，在此不作限定。
一般触控面板中还设置有用于传输栅极扫描信号的栅线、用于传输数据信号的数据线，以及薄膜晶体管，即设置有有源层、栅绝缘层、栅极层、层间介质层、源漏极层、平坦化层、位于阳极之间的阳极间绝缘层等膜层，因此，在具体实施时，在本公开实施例提供的上述触控面板中，触控面板还包括：多条栅线；其中可以使各第二引线部与栅线同层同材质。这样不需要增加额外的制备各第二引线部的工艺，只需要通过一次构图工艺即可形成各第二引线部和各栅线的图形，从而能够简化制备工艺，节省生产成本，提高生产效率。一般栅线通常与栅极层同层同材质设置，因此，第一绝缘层可以包括：层间介质层、平坦化层以及阳极间绝缘层。并且，上述各膜层的结构与功能可以与相关技术中的基本相同，在此不做详述。
在具体实施时，在本公开实施例提供的上述触控面板中，触控面板还包括：多条数据线；其中，可以使各第二引线部与数据线同层同材质。这样不需要增加额外的制备各第二引线部的工艺，只需要通过一次构图工艺即可形成各第二引线部和各数据线的图形，从而能够简化制备工艺，节省生产成本，提高生产效率。此时第一绝缘层可以包括：平坦化层以及阳极间绝缘层。
当然，在具体实施时，在本公开实施例提供的上述触控面板中，第一绝缘层也可以为额外设置的一层绝缘层，此时第一绝缘层可以位于阳极间绝缘层与第一支撑柱之间。当然，在实际应用中，第一绝缘层的设置需要根据实际应用环境来设计确定，在此不作限定。
基于同一公开构思，本公开实施例还提供了显示装置，包括本公开实施例提供的上述触控面板。由于该显示装置解决问题的原理与触控面板相似，因此该显示装置的实施可以参见上述触控面板的实施，重复之处不再赘述。
在具体实施时，本公开实施例提供的显示装置可以为：手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。对于该显示装置的其它必不可少的组成部分均为本领域的普通技术人员应该理解具有的，在此不做赘述，也不应作为对本公开的限制。
基于同一公开构思，本公开实施例还提供了触控面板的制作方法，如图6所示，可以包括：
S601、在衬底基板上形成多个隔垫物以及多条触控电极走线。
其中，隔垫物包括依次层叠设置于衬底基板上的第一支撑柱和第二支撑柱；每条触控电极走线包括第一引线部和第二引线部，第一引线部至少覆盖将要连接的阴极所相邻的第一支撑柱面向阴极的表面，第二引线部用于将第一引线部与触控芯片上对应的管脚电连接；
S602、在形成有隔垫物和触控电极走线的衬底基板上形成阴极层；
其中，阴极层由隔垫物分隔为呈矩阵排列的多个阴极，每个阴极对应至少一条触控电极走线，且与对应的触控电极走线的第一引线部电连接。
本公开实施例提供的上述制作方法中，在衬底基板上形成包括第一支撑 柱和第二支撑柱的隔垫物、阴极以及触控电极走线，复用阴极为触控电极，通过触控电极走线将呈矩阵分布的阴极与触控芯片电连接以实现触控功能。其中，触控电极走线的第一引线部至少覆盖将要连接的阴极所相邻的第一支撑柱面向阴极的表面，使得阴极可以与第一引线部直接电连接，而第二引线部可以将第一引线部与触控芯片电连接，从而可以实现触控功能，与使触控电极通过位于自身周边同层设置的触控走线实现触控功能相比，可以避免出现触控盲区，同时本公开复用呈矩阵排列的多个大小一致的阴极为触控电极，避免由于触控电极大小不一导致的触控均一性较差的问题。
在具体实施时，在本公开实施例提供的上述制作方法中，如图7所示，步骤S601可以具体包括：
S701、在衬底基板上形成各触控电极走线的第二引线部。
S702、在形成有第二引线部的衬底基板上形成各隔垫物的第一支撑柱。
S703、在形成有第一支撑柱的衬底基板上形成第一引线部。
S704、在形成有第一引线部的衬底基板上形成与第一支撑柱相对设置的各隔垫物的第二支撑柱。
S705、对形成的第二支撑柱进行削角。
在形成有隔垫物和触控电极走线的衬底基板上形成阴极层，具体可以包括：
在进行第二支撑柱削角后的衬底基板上形成阴极层。
其中，在形成第二引线部之后，在形成第一支撑柱之前，还可以包括：
在衬底基板上形成第一绝缘层；
对形成的第一绝缘层进行构图工艺，形成与各触控电极走线一一对应的过孔。
并且，在对第二支撑柱削角之前还包括形成发光功能层。其中，可以采用蒸镀工艺形成电致发光层。
在具体实施时，在本公开实施例提供的上述制作方法中，还包括形成有源层、栅绝缘层、栅极层、层间介质层、源漏极层、平坦化层、位于阳极之 间的阳极间绝缘层等膜层的的制作过程，其各功能膜层的制作方法与相关技术相同，在此不做详述。
下面以形成图4b所示的触控面板为例，对本公开实施例提供的上述制作方法进行说明，但读者应知，其具体制备过程不局限于此。
本公开实施例提供的制作图4b所示的触控面板的制作方法，可以包括如下步骤：
(1)采用一次构图工艺，在衬底基板100上形成各第二引线部L2的图形；如图8a所示。
(2)采用一次构图工艺，在衬底基板100上形成具有过孔120的第一绝缘层110的图形；如图8b所示。
(3)采用一次构图工艺，并采用正性光刻胶，在衬底基板100上形成各第一支撑柱P1的图形；如图8c所示。
(4)采用一次构图工艺，在衬底基板100上形成覆盖第一支撑柱P1的第一引线部L1的图形；如图8d所示。并且，第一引线部L1通过过孔120与对应的第二引线部L2电连接。
(5)采用一次构图工艺，并采用负性光刻胶，在衬底基板100上形成与第一支撑柱P1相对设置的各第二支撑柱P2的图形；如图8e所示。
具体地，采用正、负光刻胶分别制作第一支撑柱和第二支撑柱，可以使得第一支撑柱和第二支撑柱形成互相对称的图形，其中，如图8e所示，第一支撑柱P1的截面图形可以为等腰梯形，从而使第二支撑住P2的截面图形也为倒置的等腰梯形。
(6)对形成的第二支撑柱P2进行削角；如图8f所示。
具体地，可以采用激光工艺或灰化工艺对形成的第二支撑柱进行削角。即将倒置的等腰梯形的两个底角削掉，以便后期沉积的阴极可以与覆盖于第一支撑柱表面的第一引线部电连接。
(7)采用一次构图工艺，在进行第二支撑柱P2削角后的衬底基板100上形成包括阴极Y的阴极层；如图4b所示。
需要说明的是，在本公开实施例提供的上述制作方法中，构图工艺可只包括光刻工艺，或，可以包括光刻工艺以及刻蚀步骤，同时还可以包括打印、喷墨等其他用于形成预定图形的工艺；光刻工艺是指包括成膜、曝光、显影等工艺过程的利用光刻胶、掩模板、曝光机等形成图形的工艺。在具体实施时，可根据本公开中所形成的结构选择相应的构图工艺。
本公开实施例提供的触控面板、其制作方法及显示装置，复用阴极为触控电极，通过触控电极走线将呈矩阵分布的阴极与触控芯片电连接以实现触控功能。其中，触控电极走线的第一引线部至少覆盖对应连接的阴极所相邻的第一支撑柱面向该阴极的表面，即第一引线部在第一支撑柱上延伸，以使得阴极可以与第一引线部直接电连接，在触控面板设置有触控芯片后，可以通过第二引线部将第一引线部与触控芯片电连接，从而可以实现触控功能。与图2a与图2b所示的触控电极通过位于自身周边同层设置的触控走线实现触控功能相比，可以避免出现触控盲区，同时本公开复用呈矩阵排列的多个大小一致的阴极为触控电极，避免由于触控电极大小不一导致的触控均一性较差的问题。
显然，本领域的技术人员可以对本公开进行各种改动和变型而不脱离本公开的精神和范围。这样，倘若本公开的这些修改和变型属于本公开权利要求及其等同技术的范围之内，则本公开也意图包含这些改动和变型在内。

Claims (16)

  1. 一种触控面板，其中，包括：
    衬底基板；
    多条触控电极走线；
    多个阴极，呈矩阵排列，且每个所述阴极对应至少一条所述触控电极走线；
    多个隔垫物，位于各所述阴极之间的间隙处，且所述隔垫物包括依次层叠设置于所述衬底基板的第一支撑柱和第二支撑柱；
    每条所述触控电极走线包括第一引线部和第二引线部；其中，所述第一引线部与对应的所述阴极电连接，所述第二引线部用于将所述第一引线部与触控芯片上对应的管脚电连接；
    所述第一引线部至少覆盖对应连接的阴极所相邻的第一支撑柱面向所述阴极的表面。
  2. 如权利要求1所述的触控面板，其中，所述第一引线部完全覆盖所述第一支撑柱的表面，不同第一引线部覆盖的第一支撑柱不同。
  3. 如权利要求2所述的触控面板，其中，一个所述阴极对应一条所述触控电极走线。
  4. 如权利要求2所述的触控面板，其中，一个所述阴极对应两条所述触控电极走线。
  5. 如权利要求1所述的触控面板，其中，所述阴极在所述衬底基板的正投影与相邻的所述第一支撑柱在所述衬底基板的正投影具有交叠区域。
  6. 如权利要求5所述的触控面板，其中，所述第二支撑柱在所述衬底基板的正投影与所述阴极在所述衬底基板的正投影无交叠区域。
  7. 如权利要求1-6任一项所述的触控面板，其中，还包括：位于所述第一支撑柱与所述第二引线部之间的第一绝缘层；
    所述第一绝缘层具有多个与所述触控电极走线一一对应的过孔；
    所述触控电极走线的第二引线部与第一引线部通过所述过孔电连接。
  8. 如权利要求7所述的触控面板，其中，还包括：多条栅线；
    各所述第二引线部与所述栅线同层同材质。
  9. 如权利要求7所述的触控面板，其中，还包括：多条数据线；
    各所述第二引线部与所述数据线同层同材质。
  10. 如权利要求1-6任一项所述的触控面板，其中，所述第一支撑柱的材料包括正性光刻胶，所述第二支撑柱的材料包括负性光刻胶。
  11. 一种显示装置，其中，包括如权利要求1-10任一项所述的触控面板。
  12. 一种触控面板的制作方法，其中，包括：
    在衬底基板上形成多个隔垫物以及多条触控电极走线；其中，所述隔垫物包括依次层叠设置于所述衬底基板的第一支撑柱和第二支撑柱；每条所述触控电极走线包括第一引线部和第二引线部，所述第一引线部至少覆盖将要连接的阴极所相邻的第一支撑柱面向所述阴极的表面，所述第二引线部用于将所述第一引线部与触控芯片上对应的管脚电连接；
    在形成有所述隔垫物和所述触控电极走线的衬底基板上形成阴极层；其中，所述阴极层由所述隔垫物分隔为呈矩阵排列的多个阴极，每个所述阴极对应至少一条所述触控电极走线，且与对应的所述触控电极走线的第一引线部电连接。
  13. 如权利要求12所述的制作方法，其中，在衬底基板上形成多个隔垫物以及多条触控电极走线，具体包括：
    在所述衬底基板上形成各第二引线部；
    在形成有所述第二引线部的衬底基板上形成各所述隔垫物的第一支撑柱；
    在形成有所述第一支撑柱的衬底基板上形成第一引线部；
    在形成有所述第一引线部的衬底基板上形成与所述第一支撑柱相对设置的各所述隔垫物的第二支撑柱；
    对形成的所述第二支撑柱进行削角；
    所述在形成有所述隔垫物和所述触控电极走线的衬底基板上形成阴极层，具体包括：
    在进行所述第二支撑柱削角后的衬底基板上形成阴极层。
  14. 如权利要求13所述的制作方法，其中，对形成的所述第二支撑柱进行削角，具体包括：
    采用激光工艺对形成的所述第二支撑柱进行削角。
  15. 如权利要求13所述的制作方法，其中，对形成的所述第二支撑柱进行削角，具体包括：
    采用灰化工艺对形成的所述第二支撑柱进行削角。
  16. 如权利要求13-15任一项所述的制作方法，其中，在所述衬底基板上形成各所述触控电极走线的第二引线部之后，且在形成有所述第二引线部的衬底基板上形成各所述隔垫物的第一支撑柱之前，还包括：
    在所述衬底基板上形成第一绝缘层；
    对形成的所述第一绝缘层进行构图工艺，形成与各所述触控电极走线一一对应的过孔。
PCT/CN2018/089064 2017-09-27 2018-05-30 触控面板、其制作方法及显示装置 WO2019062178A1 (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US16/301,894 US10797118B2 (en) 2017-09-27 2018-05-30 Touch panel, method for fabricating the same and display device
EP18793156.3A EP3690619B1 (en) 2017-09-27 2018-05-30 Touch panel, manufacturing method thereof and display device
JP2018559286A JP7267744B2 (ja) 2017-09-27 2018-05-30 タッチパネル、その製造方法及び表示装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201710892282.4 2017-09-27
CN201710892282.4A CN109558025B (zh) 2017-09-27 2017-09-27 一种触控面板、其制作方法及显示装置

Publications (1)

Publication Number Publication Date
WO2019062178A1 true WO2019062178A1 (zh) 2019-04-04

Family

ID=65863991

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2018/089064 WO2019062178A1 (zh) 2017-09-27 2018-05-30 触控面板、其制作方法及显示装置

Country Status (5)

Country Link
US (1) US10797118B2 (zh)
EP (1) EP3690619B1 (zh)
JP (1) JP7267744B2 (zh)
CN (1) CN109558025B (zh)
WO (1) WO2019062178A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200116561A (ko) * 2019-04-01 2020-10-13 삼성디스플레이 주식회사 압력 센서를 갖는 터치 감지 유닛과 그를 포함하는 표시 장치
CN110888553B (zh) * 2019-11-28 2023-10-27 京东方科技集团股份有限公司 触控显示面板
CN112711347B (zh) * 2020-12-28 2023-03-24 武汉华星光电半导体显示技术有限公司 显示面板及显示装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140313438A1 (en) * 2013-04-19 2014-10-23 Samsung Display Co., Ltd. Touch screen display device
CN104750284A (zh) * 2013-12-27 2015-07-01 昆山工研院新型平板显示技术中心有限公司 一种触控显示装置及其制备方法
CN104850268A (zh) * 2015-06-10 2015-08-19 京东方科技集团股份有限公司 一种触控显示面板、触控显示装置及制作方法
CN106775039A (zh) * 2015-11-20 2017-05-31 京东方科技集团股份有限公司 一种内嵌式触摸屏、其制作方法及显示装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011233512A (ja) 2010-04-07 2011-11-17 Sumitomo Chemical Co Ltd 発光装置
WO2013063445A2 (en) * 2011-10-28 2013-05-02 President And Fellows Of Harvard College Capacitive, paper-based accelerometers and touch sensors
US8987008B2 (en) * 2013-08-20 2015-03-24 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated circuit layout and method with double patterning
CN103676358B (zh) * 2013-12-17 2017-02-22 京东方科技集团股份有限公司 显示基板及其制作方法、触摸屏和显示装置
CN104252276B (zh) * 2014-06-30 2018-04-27 上海天马有机发光显示技术有限公司 一种触控显示装置及其制造方法
CN104795425A (zh) * 2015-03-30 2015-07-22 京东方科技集团股份有限公司 有机发光二极管触控显示屏及其制作方法
KR101679977B1 (ko) 2015-05-29 2016-11-28 엘지디스플레이 주식회사 자기 정전용량식 터치 센서 일체형 표시장치와 그 제조방법
CN104898888B (zh) 2015-06-23 2017-09-19 京东方科技集团股份有限公司 一种内嵌式触摸显示屏、其驱动方法及显示装置
CN105428389B (zh) * 2015-11-30 2018-12-18 上海天马有机发光显示技术有限公司 一种有机发光显示装置及制造方法
CN107844209B (zh) * 2016-09-21 2020-05-12 群创光电股份有限公司 触控显示装置
CN106502466B (zh) * 2016-10-28 2020-04-14 上海天马有机发光显示技术有限公司 一种触控装置、电子设备以及制作方法
CN106951125B (zh) * 2017-03-30 2019-09-13 上海天马微电子有限公司 一种触控显示面板及触控显示装置
CN107168574A (zh) * 2017-05-10 2017-09-15 京东方科技集团股份有限公司 一种oled触控显示面板、触控显示装置
CN107123621A (zh) * 2017-05-10 2017-09-01 京东方科技集团股份有限公司 一种oled触控显示面板及其制作方法、触控显示装置
CN107203296B (zh) * 2017-05-25 2020-12-25 上海天马微电子有限公司 一种显示面板及其制造方法、显示装置
CN207148805U (zh) * 2017-09-27 2018-03-27 京东方科技集团股份有限公司 一种触控面板及显示装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140313438A1 (en) * 2013-04-19 2014-10-23 Samsung Display Co., Ltd. Touch screen display device
CN104750284A (zh) * 2013-12-27 2015-07-01 昆山工研院新型平板显示技术中心有限公司 一种触控显示装置及其制备方法
CN104850268A (zh) * 2015-06-10 2015-08-19 京东方科技集团股份有限公司 一种触控显示面板、触控显示装置及制作方法
CN106775039A (zh) * 2015-11-20 2017-05-31 京东方科技集团股份有限公司 一种内嵌式触摸屏、其制作方法及显示装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP3690619A4 *

Also Published As

Publication number Publication date
US20190267431A1 (en) 2019-08-29
JP7267744B2 (ja) 2023-05-02
CN109558025B (zh) 2024-04-02
JP2020535490A (ja) 2020-12-03
CN109558025A (zh) 2019-04-02
EP3690619A1 (en) 2020-08-05
EP3690619A4 (en) 2021-07-21
US10797118B2 (en) 2020-10-06
EP3690619B1 (en) 2024-04-24

Similar Documents

Publication Publication Date Title
US10978545B2 (en) Display substrate and manufacturing thereof, and display device
WO2018205651A1 (zh) Oled触控显示面板及其制作方法、触控显示装置
US10534461B2 (en) In-cell touch substrate and method for driving the same, display panel
WO2018176740A1 (zh) 柔性显示面板、显示装置及柔性显示面板的制作方法
WO2016150078A1 (zh) 一种阵列基板、显示面板及显示装置
WO2020020244A1 (zh) 显示面板及其制造方法、显示装置
WO2020206977A1 (zh) 显示面板及其制备方法和半导体结构
WO2022033086A1 (zh) 阵列基板及显示装置
US20200111844A1 (en) Display panel, method for fabricating the same, and display device
TWI303136B (en) Method for manufacturing electro-optic element
EP3989288A1 (en) Array substrate, display panel and display apparatus
WO2019242600A1 (zh) 有机电致发光显示面板、其制作方法及显示装置
US11016624B2 (en) Touch display panel and manufacturing method thereof, display device
JP5908955B2 (ja) タッチスクリーン及びその製造方法
WO2019062178A1 (zh) 触控面板、其制作方法及显示装置
WO2022213582A1 (zh) 显示面板和显示装置
WO2021023107A1 (zh) 显示基板及其制作方法、显示装置
US11158689B2 (en) Electroluminescent display panel, manufacturing method thereof and display device
US11385732B2 (en) Array substrate, manufacturing method thereof, touch display panel and touch display device
WO2020244502A1 (zh) 一种触控显示基板及其制作方法、触控显示装置
WO2019237498A1 (zh) 一种有源矩阵有机发光二极管显示器及其制作方法
TW201944375A (zh) 顯示裝置及其製造方法
US11233115B2 (en) Display panel and manufacturing method thereof, and display device
WO2019206023A1 (zh) 一种显示面板、其制作方法及显示装置
WO2019134458A1 (zh) 触控结构及制备方法、触控基板、显示基板

Legal Events

Date Code Title Description
ENP Entry into the national phase

Ref document number: 2018559286

Country of ref document: JP

Kind code of ref document: A

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18793156

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 2018793156

Country of ref document: EP

Effective date: 20200428