WO2019044977A1 - Composition de résine, préimprégné, stratifié revêtu d'une feuille métallique, feuille de résine et carte de circuit imprimé - Google Patents

Composition de résine, préimprégné, stratifié revêtu d'une feuille métallique, feuille de résine et carte de circuit imprimé Download PDF

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Publication number
WO2019044977A1
WO2019044977A1 PCT/JP2018/032130 JP2018032130W WO2019044977A1 WO 2019044977 A1 WO2019044977 A1 WO 2019044977A1 JP 2018032130 W JP2018032130 W JP 2018032130W WO 2019044977 A1 WO2019044977 A1 WO 2019044977A1
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Prior art keywords
resin
group
resin composition
bis
epoxy resin
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PCT/JP2018/032130
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English (en)
Japanese (ja)
Inventor
源希 杉山
将太 古賀
健太郎 高野
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三菱瓦斯化学株式会社
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Application filed by 三菱瓦斯化学株式会社 filed Critical 三菱瓦斯化学株式会社
Priority to CN201880045679.2A priority Critical patent/CN110869409B/zh
Priority to JP2018564443A priority patent/JP6504533B1/ja
Priority to KR1020197017668A priority patent/KR102090439B1/ko
Publication of WO2019044977A1 publication Critical patent/WO2019044977A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4028—Isocyanates; Thioisocyanates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/245—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using natural fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/07—Parts immersed or impregnated in a matrix
    • B32B2305/076—Prepregs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Definitions

  • the present invention relates to a resin composition, a prepreg, a metal foil-clad laminate, a resin sheet and a printed wiring board.
  • cyanate ester compounds are known as printed wiring board materials excellent in heat resistance and electrical characteristics, and in recent years, resin compositions in which an epoxy resin, a bismaleimide compound, etc. are used in combination with a cyanate ester compound are semiconductors It is widely used in high-performance printed wiring board materials for plastic packages and so on.
  • Patent Documents 1 and 2 propose a resin composition comprising a cyanate ester compound and an epoxy resin, which is excellent in properties such as adhesion, low water absorption, hygroscopic heat resistance, insulation reliability and the like.
  • the thermosetting resin composition which is excellent in heat resistance and a flame retardance and contains a cyanate ester compound and an epoxy resin is proposed.
  • Patent Documents 1 and 2 have good physical properties in terms of adhesion, low water absorption, hygroscopic heat resistance, and insulation reliability, they are still improved from the viewpoint of heat resistance. There is room. Furthermore, the resin composition described in Patent Document 3, which is considered to be excellent in heat resistance, still has room for improvement.
  • the present invention has been made in view of the above problems, and an object thereof is to provide a resin composition, a prepreg, a metal foil-clad laminate, a resin sheet, and a printed wiring board which exhibit excellent heat resistance. Do.
  • [3] 1 type selected from the group consisting of an epoxy resin other than the epoxy resin (A) represented by the above formula (1), a maleimide compound, a phenol resin, an oxetane resin, a benzoxazine compound, and a compound having a polymerizable unsaturated group
  • the resin composition as described in [1] or [2] which further contains the above.
  • [5] The resin composition according to [4], wherein the content of the filler (C) is 50 to 1600 parts by mass with respect to 100 parts by mass of the resin solid content.
  • a substrate The resin composition according to any one of [1] to [5], which is impregnated or applied to the substrate.
  • a resin sheet comprising the resin composition according to any one of [1] to [5].
  • An insulating layer A conductor layer formed on the surface of the insulating layer; Have A printed wiring board, wherein the insulating layer comprises the resin composition according to any one of [1] to [5].
  • the present invention it is possible to provide a resin composition, a prepreg, a metal foil-clad laminate, a resin sheet, and a printed wiring board, which exhibit excellent heat resistance.
  • the present embodiment a mode for carrying out the present invention (hereinafter referred to as "the present embodiment") will be described in detail, the present invention is not limited to this, and various modifications can be made within the scope of the present invention. Is possible.
  • the resin composition of the present embodiment has a repeating unit represented by the following formula (1), and an epoxy resin (A) having a Z average molecular weight of 1400 or more and 3000 or less, and a cyanate ester compound (B) And. Since it is comprised in this way, the resin composition of this embodiment can express the outstanding heat resistance.
  • X 1 represents an alkylene group having 1 to 3 carbon atoms or an alkenylene group
  • R 1 each independently represents a hydrogen atom or an alkyl group or an alkenyl group having 1 to 3 carbon atoms.
  • Epoxy resin (A) The epoxy resin (A) in this embodiment has a repeating unit represented by the said Formula (1).
  • X 1 in the formula (1) represents an alkylene group having 1 to 3 carbon atoms or an alkenylene group, preferably a methylene group.
  • Each R 1 in Formula (1) independently represents a hydrogen atom or an alkyl or alkenyl group having 1 to 3 carbon atoms, preferably a hydrogen atom.
  • the number of repeating units represented by the formula (1) is an integer of 1 or more, preferably 1 or more and 5 or less, and more preferably 2 or more and 4 or less from the viewpoint of heat resistance and moldability.
  • epoxy resin (A) may be only one epoxy resin having one repeating unit number. And may be a mixture of two or more epoxy resins having different numbers of repeating units. When the epoxy resin (A) is a mixture of two or more types of epoxy resins having different numbers of repeating units, the epoxy resin (A) may contain an epoxy resin having a number of repeating units of 1, but the number of repeating units is 2 or more The Z average molecular weight of the epoxy resin (A) is 1400 or more and 3000 or less by containing the epoxy resin of
  • the repeating unit represented by the above formula (1) is preferably a repeating unit represented by the following formula (1-1).
  • one end of the terminal of the repeating structure represented by the above formula (1) is a hydrogen atom, and the other is a group represented by the following formula (1-2) Is preferred.
  • each R 1 independently represents a hydrogen atom or an alkyl or alkenyl group having 1 to 3 carbon atoms.
  • the epoxy resin (A) in the present embodiment is not limited to the following, but may include, for example, an epoxy resin represented by the following formula (1-3), and more specifically, for example, The epoxy resin represented by -4) can be included.
  • X 1 represents an alkylene or alkenylene group having 1 to 3 carbon atoms
  • R 1 each independently represents a hydrogen atom, or an alkyl or alkenyl group having 1 to 3 carbon atoms
  • one of the groups is a hydrogen atom, and the other is a group represented by the above formula (1-2).
  • the Z average molecular weight of the epoxy resin (A) in the present embodiment is 1400 or more and 3000 or less, preferably 1500 or more and 2500 or less, and more preferably 1600 or more and 2000 or less from the viewpoint of heat resistance and moldability.
  • the content of the epoxy resin (A) in the present embodiment can be appropriately set according to the desired characteristics, and is not particularly limited, but from the viewpoint of making heat resistance better, 100 parts by mass of resin solid content
  • the amount is preferably 1 to 90 parts by mass, more preferably 30 to 70 parts by mass, and still more preferably 40 to 60 parts by mass.
  • resin solid content refers to components excluding the solvent and the filler in the resin composition of the present embodiment, unless otherwise noted, and “100 parts by mass of resin solid content”
  • S means that the total of components excluding the solvent and the filler in the resin composition of the present embodiment is 100 parts by mass.
  • the epoxy resin (A) can also be obtained as a commercial product, and examples thereof include, but are not limited to, “EPICLON EXA-4710H-70M” manufactured by DIC Corporation and the like.
  • the cyanate ester compound (B) is not particularly limited as long as it is a compound having an aromatic moiety substituted by at least one cyanato group (cyanate group) in the molecule.
  • the resin composition using the cyanate ester compound (B) has excellent properties of glass transition temperature, low thermal expansion, plating adhesion and the like when it is a cured product.
  • Examples of the cyanate ester compound (B) include, but are not limited to, those represented by the following formula (2).
  • Ar 1 represents a benzene ring, a naphthalene ring or a single bond of two benzene rings. When there are two or more, they may be the same or different.
  • Ra each independently represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an aryl group having 6 to 12 carbon atoms, an alkoxyl group having 1 to 4 carbon atoms, an alkyl group having 1 to 6 carbon atoms, and 6 to 12 carbon atoms A group to which an aryl group is bonded is shown.
  • the aromatic ring in Ra may have a substituent, and the substituent in Ar 1 and Ra can be selected at any position.
  • p represents the number of cyanato groups bonded to Ar 1 and each is independently an integer of 1 to 3.
  • q represents the number of Ra to bind to Ar 1, when Ar 1 is 4-p, naphthalene ring when the benzene ring when those 6-p, 2 one benzene ring is a single bond is 8-p .
  • t represents an average repeat number and is an integer of 0 to 50, and the other cyanate ester compound may be a mixture of compounds different in t.
  • a divalent organic group having 1 to 50 carbon atoms a hydrogen atom may be substituted with a hetero atom
  • Organic group eg, -NRN- (wherein R represents an organic group)
  • carbonyl group -CO-
  • -SO 2- sulfonyl
  • the alkyl group at Ra in the above formula (2) may have any of a linear or branched chain structure and a cyclic structure (for example, a cycloalkyl group and the like). Further, even if the hydrogen atom in the alkyl group in Formula (2) and the aryl group in Ra is substituted by a halogen atom such as a fluorine atom or chlorine atom, an alkoxyl group such as a methoxy group or a phenoxy group, or a cyano group Good.
  • a halogen atom such as a fluorine atom or chlorine atom
  • alkyl group examples include, but are not limited to, methyl group, ethyl group, propyl group, isopropyl group, n-butyl group, isobutyl group, tert-butyl group, n-pentyl group, 1-ethylpropyl group, Examples include 2,2-dimethylpropyl group, cyclopentyl group, hexyl group, cyclohexyl group, and trifluoromethyl group.
  • aryl group examples include, but are not limited to, phenyl group, xylyl group, mesityl group, naphthyl group, phenoxyphenyl group, ethylphenyl group, o-, m- or p-fluorophenyl group, dichlorophenyl group, dicyano A phenyl group, a trifluorophenyl group, a methoxyphenyl group, an o-, m- or p-tolyl group and the like can be mentioned.
  • alkoxyl group examples include, but are not limited to, a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, an n-butoxy group, an isobutoxy group, and a tert-butoxy group.
  • divalent organic group having 1 to 50 carbon atoms in X in the above formula (2) include, but are not limited to, methylene group, ethylene group, trimethylene group, cyclopentylene group, cyclohexylene group, trimethyl.
  • Examples thereof include a cyclohexylene group, a biphenylyl methylene group, a dimethyl methylene-phenylene-dimethyl methylene group, a fluorenediyl group, and a phthalide diyl group.
  • the hydrogen atom in the divalent organic group may be substituted by a halogen atom such as a fluorine atom or a chlorine atom, an alkoxyl group such as a methoxy group or a phenoxy group, a cyano group or the like.
  • Examples of the divalent organic group having 1 to 10 nitrogen atoms as X in the above-mentioned formula (2) include, but are not limited to, an imino group, a polyimide group and the like.
  • Ar 2 represents a benzenetetrayl group, a naphthalenetetrayl group or a biphenyltetrayl group, and when u is 2 or more, they may be identical to or different from each other.
  • Rb and Rc , Rf and Rg each independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an aryl group having 6 to 12 carbon atoms, an trifluoromethyl group, or an aryl group having at least one phenolic hydroxy group
  • Each of Rd and Re is independently selected from any one of a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an aryl group having 6 to 12 carbon atoms, an alkoxyl group having 1 to 4 carbon atoms, or a hydroxy group
  • U is an integer of 0 to 5)
  • Ar 3 represents a benzenetetrayl group, a naphthalenetetrayl group or a biphenyltetrayl group, and when v is 2 or more, they may be the same or different from each other.
  • Ri and Rj Each independently represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an aryl group having 6 to 12 carbon atoms, a benzyl group, an alkoxyl group having 1 to 4 carbon atoms, a hydroxy group, a trifluoromethyl group or a cyanato group And at least one substituted aryl group, wherein v represents an integer of 0 to 5, but the cyanate ester compound may be a mixture of compounds different in v).
  • R k independently represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.
  • two carbon atoms shown in Formula (3) or two oxygen atoms shown in Formula (4) are 1,4 Benzenetetrayl group bonded to the position or 1, 3 position
  • the above two carbon atoms or two oxygen atoms are 4, 4 ', 2, 4', 2, 2 ', 2, 3' And the biphenyltetrayl group bonded to the 3,3'-position or the 3,4'-position
  • the above two carbon atoms or two oxygen atoms are 2,6, 1,5,1,6 And a naphthalenetetrayl group bonded to the 1, 8, 1, 3, 1, 4, or 2,7 position.
  • the alkyl group and aryl group in Rb, Rc, Rd, Re, Rf and Rg in Formula (3), and Ri and Rj in Formula (4) have the same meanings as the alkyl group and aryl group in Ra in the above Formula (2) It is.
  • cyanato-substituted aromatic compounds represented by the above formula (2) include, but are not limited to, cyanatobenzene, 1-cyanato-2-, 1-cyanato-3-, or 1-cyanato-4 -Methylbenzene, 1-cyanato-2-, 1-cyanato-3-, or 1-cyanato-4-methoxybenzene, 1-cyanato-2,3-, 1-cyanato-2,4-, 1-cyanato- 2,5-, 1-Cyanato-2,6-, 1-Cyanato-3,4- or 1-Cyanato-3,5-dimethylbenzene, Cyanatoethylbenzene, Cyanatobutylbenzene, Cyanatooctylbenzene, Cyanato Nonylbenzene, 2- (4-cyanaphenyl) -2-phenylpropane (cyanate of 4- ⁇ -cumylphenol), 1-cyanato-4-cyclohexylbenzene, 1-cyana -4-vinylbenzen
  • phenol novolac resin and cresol novolac resin phenol, alkyl substituted phenol or halogen substituted phenol by a known method
  • Formaldehyde compounds such as formalin and paraformaldehyde are reacted in an acidic solution
  • trisphenol novolak resin reaction of hydroxybenzaldehyde and phenol in the presence of an acidic catalyst
  • fluorene novolac resin fluorenone compound
  • 9,9-bis (hydroxyaryl) fluorenes in the presence of an acidic catalyst phenolaralkyl resin, cresolaralkyl resin, naphtholaralkyl resin and biphenylaralkyl resin (known methods)
  • Ar 4 - (CH 2 Y ) 2 More, Ar 4 - (CH 2 Y ) 2 (.
  • Ar 4 represents a phenyl group
  • Y represents a halogen atom and the same in this paragraph.
  • cyanate ester compounds (B) can be used singly or in combination of two or more.
  • phenol novolac type cyanate ester compounds naphthol aralkyl type cyanate ester compounds, biphenylaralkyl type cyanate ester compounds, naphthylene ether type cyanate ester compounds, xylene resin type cyanate ester compounds, adamantane skeleton type cyanate ester Compounds are preferred, and naphthol aralkyl type cyanate ester compounds are particularly preferred.
  • naphthol aralkyl type cyanate ester examples include naphthol aralkyl type cyanate ester represented by the formula (5). By using such naphthol aralkyl type cyanate ester, a cured product having a lower thermal expansion coefficient tends to be obtained.
  • each R 6 independently represents a hydrogen atom or a methyl group, preferably a hydrogen atom, and in the formula, n 2 represents an integer of 1 or more, the upper limit of n 2 The value is usually 10, preferably 6.
  • the content of the cyanate ester compound (B) can be appropriately set according to the desired characteristics, and is not particularly limited, but from the viewpoint of obtaining a cured product having a lower thermal expansion coefficient, 100 parts by mass of resin solid content
  • the amount is preferably 1 to 90 parts by mass, more preferably 30 to 70 parts by mass, and still more preferably 40 to 60 parts by mass.
  • the resin composition of the present embodiment preferably further contains a filler (C) from the viewpoints of thermal expansion characteristics, dimensional stability, flame retardancy, thermal conductivity, dielectric characteristics, and the like.
  • a filler (C) A well-known thing can be used suitably as a filler (C), The kind is not specifically limited.
  • fillers generally used in laminate applications can be suitably used as the filler (C).
  • the filler (C) include natural silica, fused silica, synthetic silica, amorphous silica, silica such as aerosil and hollow silica, white carbon, titanium white, oxide such as zinc oxide, magnesium oxide and zirconium oxide , Boron nitride, agglomerated boron nitride, silicon nitride, aluminum nitride, barium sulfate, aluminum hydroxide, aluminum hydroxide heat-treated product (Aluminum hydroxide is heat-treated to reduce part of water of crystallization), boehmite, water Metal hydrates such as magnesium oxide, molybdenum compounds such as molybdenum oxide and zinc molybdate, zinc borate, zinc stannate, alumina, clay, kaolin, talc, calcined clay, calcined kaolin, calcined talc, mica, E-glass , A-glass, NE-glass, C-glass, L-glass
  • rubber powders such as styrene type, butadiene type and acrylic type, core shell type rubber powder, and organic fillers such as silicone resin powder, silicone rubber powder, silicone composite powder, and the like can be mentioned.
  • these fillers may be used alone or in combination of two or more. Among these, one or more selected from the group consisting of silica, aluminum hydroxide, boehmite, magnesium oxide and magnesium hydroxide are preferable. The use of these fillers tends to further improve the properties such as thermal expansion properties, dimensional stability and flame retardancy of the resin composition.
  • the content of the filler (C) in the resin composition of the present embodiment can be appropriately set according to the desired characteristics, and is not particularly limited, but from the viewpoint of the moldability of the resin composition, the resin solid content is When it is 100 parts by mass, it is preferably 50 to 1600 parts by mass, more preferably 50 to 750 parts by mass, still more preferably 50 to 300 parts by mass, and particularly preferably 50 to 200 parts by mass .
  • the filler (C) when the filler (C) is contained in the resin composition, it is preferable to use a silane coupling agent or a wetting and dispersing agent in combination.
  • a silane coupling agent what is generally used for the surface treatment of an inorganic substance can be used suitably, The kind in particular is not limited.
  • silane coupling agent examples include, but are not limited to, aminosilanes such as, but not limited to, ⁇ -aminopropyltriethoxysilane, N- ⁇ - (aminoethyl) - ⁇ -aminopropyltrimethoxysilane, ⁇ -glycid Epoxysilanes such as xylpropyltrimethoxysilane, ⁇ - (3,4-epoxycyclohexyl) ethyltrimethoxysilane, vinylsilanes such as ⁇ -methacryloxypropyltrimethoxysilane, vinyl-tri ( ⁇ -methoxyethoxy) silane, N Cationic silane systems, such as - ⁇ - (N-vinylbenzylaminoethyl) - ⁇ -aminopropyltrimethoxysilane hydrochloride, as well as phenylsilane systems.
  • aminosilanes such as, but not limited to,
  • the silane coupling agent can be used singly or in combination of two or more.
  • a wetting and dispersing agent what is generally used for paints can be used suitably, The kind in particular is not limited.
  • a copolymer-based wetting and dispersing agent is preferably used, and may be a commercially available product. Specific examples of commercially available products include, but are not limited to, Disperbyk-110, 111, 161, 180, BYK-W 996, BYK-W 9010, BYK-W 903, BYK-W 940, etc., manufactured by Big Chemie Japan Ltd. Be The wetting and dispersing agents can be used alone or in combination of two or more.
  • an epoxy resin other than the epoxy resin (A) represented by the above formula (1) (hereinafter referred to as “other epoxy resin”) within the range where the desired characteristics are not impaired.
  • a maleimide compound, a phenol resin, an oxetane resin, a benzoxazine compound, a compound having a polymerizable unsaturated group, and the like By using these in combination, desired properties such as flame retardancy and low dielectric property of a cured product obtained by curing the resin composition tend to be improved.
  • epoxy resin As another epoxy resin, if it is not what is represented by Formula (1) and it is an epoxy resin which has 2 or more epoxy groups in 1 molecule, a well-known thing can be used suitably and the kind Is not particularly limited. Specifically, bisphenol A epoxy resin, bisphenol E epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, phenol novolac epoxy resin, bisphenol A novolac epoxy resin, glycidyl ester epoxy resin, aralkyl novolac Epoxy resin, biphenylaralkyl epoxy resin, naphthalene ether epoxy resin, cresol novolak epoxy resin, polyfunctional phenol epoxy resin, naphthalene epoxy resin, anthracene epoxy resin, naphthalene skeleton modified novolak epoxy resin, phenolaralkyl Type epoxy resin, naphthol aralkyl type epoxy resin, dicyclopentadiene type epoxy resin, biphenyl type epoxy resin, alicyclic type Carboxy resin, a polyol type
  • epoxy resins biphenylaralkyl type epoxy resins, naphthylene ether type epoxy resins, polyfunctional phenol type epoxy resins, and naphthalene type epoxy resins are preferable in view of flame retardancy and heat resistance. These epoxy resins can be used singly or in combination of two or more.
  • maleimide compound As the maleimide compound, generally known compounds can be used as long as they are compounds having one or more maleimide groups in one molecule. For example, 4,4-diphenylmethanebismaleimide, phenylmethanemaleimide, m-phenylenebismaleimide, 2,2-bis (4- (4-maleimidophenoxy) -phenyl) propane, 3,3-dimethyl-5,5-diethyl -4,4-Diphenylmethane bismaleimide, 4-methyl-1,3-phenylenebismaleimide, 1,6-bismaleimide- (2,2,4-trimethyl) hexane, 4,4-diphenylether bismaleimide, 4,4 -Diphenylsulfone bismaleimide, 1,3-bis (3-maleimidophenoxy) benzene, 1,3-bis (4-maleimidophenoxy) benzene, polyphenylmethane maleimide, novolac maleimide,
  • phenol resin As the phenol resin, generally known phenol resins can be used as long as they have two or more hydroxy groups in one molecule. Specific examples thereof include bisphenol A type phenol resin, bisphenol E type phenol resin, bisphenol F type phenol resin, bisphenol S type phenol resin, phenol novolac resin, bisphenol A novolac type phenol resin, glycidyl ester type phenol resin, aralkyl novolac type Phenol resin, biphenylaralkyl type phenol resin, cresol novolac type phenol resin, polyfunctional phenol resin, naphthol resin, naphthol novolak resin, polyfunctional naphthol resin, anthracene type phenol resin, naphthalene skeleton modified novolac type phenol resin, phenolaralkyl type phenol resin Naphthol aralkyl type phenol resin, dicyclopentadiene type phenol resin, biphenyl type phenol resin Nord resins, alicyclic phenolic
  • phenol resins biphenylaralkyl type phenol resins, naphtholaralkyl type phenol resins, phosphorus-containing phenol resins, and hydroxyl group-containing silicone resins are preferable in view of flame retardancy. These phenol resins can be used singly or in combination of two or more.
  • oxetane resin As the oxetane resin, those generally known can be used. For example, alkyl oxetanes such as oxetane, 2-methyl oxetane, 2,2-dimethyl oxetane, 3-methyl oxetane, 3, 3-dimethyl oxetane, 3-methyl 3-methoxymethyl oxetane, 3, 3-di (trifluoro) Methyl) perfluoxetane, 2-chloromethyl oxetane, 3,3-bis (chloromethyl) oxetane, biphenyl type oxetane, OXT-101 (trade name of Toho Gosei Co., Ltd.), OXT-121 (trade name of Toho Gosei Co., Ltd.), etc. Although it may be mentioned, it is not particularly limited. These oxetane resins can be used alone or in combination of
  • benzoxazine compound As the benzoxazine compound, generally known compounds can be used as long as they are compounds having two or more dihydrobenzoxazine rings in one molecule.
  • bisphenol A type benzoxazine BA-BXZ (trade name of Konishi Chemical) bisphenol F type benzooxazine BF-BXZ (trade name of Konishi Chemical), bisphenol S type benzooxazine BS-BXZ (trade name of Konishi Chemical), P Examples thereof include -d-type benzoxazine (trade name of Shikoku Kasei Kogyo Co., Ltd.) and F-a type benzoxazine (trade name of Shikoku Kasei Kogyo Co., Ltd.) and the like, but not limited thereto. These benzoxazine compounds can be used alone or in combination of two or more.
  • Compound having a polymerizable unsaturated group As compounds having a polymerizable unsaturated group, generally known compounds can be used. For example, vinyl compounds such as ethylene, propylene, styrene, divinylbenzene and divinylbiphenyl, methyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, polypropylene glycol di (meth) acrylate, (Meth) acrylates of monohydric or polyhydric alcohols such as trimethylolpropane di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate, bisphenol Epoxy (meth) acrylates such as A-type epoxy (meth) acrylate, bisphenol F-type epoxy (meth) acrylate
  • the resin composition of this embodiment may contain the hardening accelerator for adjusting a hardening speed suitably, as needed.
  • this hardening accelerator what is generally used as hardening accelerators, such as a cyanate ester compound and an epoxy resin, can be used suitably, The kind is not specifically limited.
  • the curing accelerator include zinc octylate, zinc naphthenate, cobalt naphthenate, copper naphthenate, iron acetylacetonate, nickel octylate, organic acid salts such as manganese octylate, phenol, xylenol, cresol, resorcinol, catechol Phenols such as octylphenol and nonylphenol, alcohols such as 1-butanol and 2-ethylhexanol, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 1-cyanoethyl-2-phenylimidazole, Imidazoles such as 1-cyanoethyl-2-ethyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole and the like; Derivatives such as adduct
  • the curing accelerator can be used singly or in combination of two or more.
  • the amount of the curing accelerator used can be appropriately adjusted in consideration of the degree of curing of the resin, the viscosity of the resin composition, and the like, and is not particularly limited.
  • the amount of the curing accelerator used may be 0.005 to 10 parts by mass with respect to 100 parts by mass of the resin solid content in the resin composition.
  • various polymer compounds such as other thermosetting resins, thermoplastic resins and their oligomers, elastomers, and flame retardant compounds as long as the desired properties are not impaired. And various additives etc. can be used in combination. These are not particularly limited as long as they are generally used.
  • Specific examples of flame retardant compounds include, but are not limited to: bromine compounds such as 4,4'-dibromobiphenyl, phosphate esters, melamine phosphates, phosphorus-containing epoxy resins, nitrogen compounds such as melamine and benzoguanamine, oxazines Examples thereof include ring-containing compounds and silicone compounds.
  • additives although it is not limited to the following, for example, an ultraviolet light absorber, an antioxidant, a photopolymerization initiator, a fluorescent whitening agent, a photosensitizer, a dye, a pigment, a thickener, a flow control agent Lubricants, antifoaming agents, dispersants, leveling agents, brighteners, polymerization inhibitors and the like. These can be used singly or in combination of two or more, as desired.
  • the resin composition of this embodiment can contain the organic solvent as needed.
  • the resin composition of the present embodiment can be used as an aspect (solution or varnish) in which at least part, preferably all, of the various resin components described above are dissolved or compatible with the organic solvent.
  • known solvents can be appropriately used so long as at least a part, preferably all of the various resin components described above can be dissolved or compatible, and the type thereof is not particularly limited. .
  • organic solvent examples include ketones such as acetone, methyl ethyl ketone and methyl isobutyl ketone, cellosolve solvents such as propylene glycol monomethyl ether and propylene glycol monomethyl ether acetate, ethyl lactate, methyl acetate, ethyl acetate, butyl acetate and isoamyl acetate And ester solvents such as methyl methoxypropionate and methyl hydroxyisobutyrate; polar solvents such as amides such as dimethylacetamide and dimethylformamide; and nonpolar solvents such as aromatic hydrocarbons such as toluene and xylene. These can be used singly or in combination of two or more.
  • ketones such as acetone, methyl ethyl ketone and methyl isobutyl ketone
  • cellosolve solvents such as propylene glycol monomethyl ether and propylene glycol monomethyl ether acetate,
  • the resin composition of the present embodiment can be prepared according to a conventional method, and the epoxy resin (A) and cyanate ester compound (B) represented by the formula (1), and the other optional components described above are uniformly made
  • the preparation method is not particularly limited as long as the resin composition to be contained can be obtained.
  • the resin composition of the present embodiment can be easily prepared by sequentially blending the epoxy resin (A) represented by the formula (1) and the cyanate ester compound (B) in a solvent and sufficiently stirring. it can.
  • the well-known process for dissolving or disperse
  • the dispersibility with respect to the resin composition is enhanced by performing the stirring and dispersing treatment using a stirring tank provided with a stirrer having an appropriate stirring ability.
  • the above-mentioned stirring, mixing, and kneading processing can be appropriately performed using, for example, a device intended for mixing such as a ball mill and a bead mill, or a known device such as a mixing device of revolution and rotation type.
  • the resin composition of this embodiment is not limited to the following, For example, it can be used as a constituent material of a prepreg, a metal foil tension laminated board, a printed wiring board, a resin sheet, and a semiconductor package.
  • a prepreg can be obtained by impregnating or coating a base material with a solution in which the resin composition of the present embodiment is dissolved in a solvent, and drying.
  • a film obtained by dissolving the resin composition of the present embodiment in a solvent is applied to the plastic film and dried using the peelable plastic film as a substrate to obtain a build-up film or dry film solder resist. be able to.
  • the solvent can be dried by drying at a temperature of 20 ° C. to 150 ° C. for 1 to 90 minutes.
  • the resin composition of this embodiment can also be used in the unhardened state which dried the solvent, and can also be used in the state of semi-hardening (B stage formation) as needed.
  • the prepreg of the present embodiment has a substrate and the above-described resin composition impregnated or coated on the substrate.
  • the method for producing the prepreg of the present embodiment is not particularly limited as long as it is a method of producing a prepreg by combining the resin composition of the present embodiment and a substrate. Specifically, after impregnating or applying the resin composition of the present embodiment to a substrate, the resin composition is semi-cured by a method such as drying in a dryer at 120 to 220 ° C. for about 2 to 15 minutes.
  • the prepreg of the embodiment can be manufactured.
  • the adhesion amount of the resin composition to the substrate that is, the content of the resin composition (including the filler (C)) with respect to the total amount of the semi-cured prepreg is in the range of 20 to 99% by mass. Is preferred.
  • a base material used when manufacturing the prepreg of this embodiment the well-known thing used for various printed wiring board materials may be used.
  • a substrate for example, glass fibers such as E glass, D glass, L glass, S glass, T glass, Q glass, UN glass, NE glass, spherical glass, inorganic fibers other than glass such as quartz, Examples thereof include organic fibers such as polyimide, polyamide and polyester, and woven fabrics such as liquid crystal polyester, but are not particularly limited thereto.
  • woven fabrics, non-woven fabrics, rovings, chopped strand mats, surfacing mats and the like are known, and any of these may be used.
  • a base material can be used individually by 1 type or in combination of 2 or more types as appropriate.
  • woven fabrics in particular, woven fabrics which have been subjected to super-opening treatment and filling treatment are preferable from the viewpoint of dimensional stability.
  • a glass woven fabric surface-treated with a silane coupling agent such as epoxysilane treatment or aminosilane treatment is preferable from the viewpoint of moisture absorption heat resistance.
  • a liquid crystal polyester woven fabric is preferable from the viewpoint of electrical characteristics.
  • the thickness of the substrate is not particularly limited, but in the case of laminated plate applications, the range of 0.01 to 0.2 mm is preferable.
  • the metal foil-clad laminate of this embodiment has the above-described prepreg on which at least one or more sheets are laminated, and a metal foil disposed on one side or both sides of the prepreg.
  • a metal foil such as copper or aluminum is disposed on one side or both sides of one of the above-described prepregs or a laminate of a plurality of prepregs, and then laminated and molded. be able to.
  • the metal foil used here is not particularly limited as long as it is used for a printed wiring board material, but a copper foil such as a rolled copper foil and an electrolytic copper foil is preferable.
  • the thickness of the metal foil is not particularly limited, but is preferably 2 to 70 ⁇ m, and more preferably 3 to 35 ⁇ m.
  • a method used at the time of producing a laminate for a general printed wiring board and a multilayer board can be adopted.
  • laminate molding is performed under conditions of temperature 180 to 350 ° C., heating time 100 to 300 minutes, and surface pressure 20 to 100 kg / cm 2
  • a multilayer board can also be produced by laminating and molding the above-mentioned prepreg and a wiring board for the inner layer prepared separately.
  • a multilayer board for example, copper foils of 35 ⁇ m are disposed on both sides of one of the prepregs described above, and laminated under the above conditions, an inner layer circuit is formed, and the circuit is blackened. Forming an inner layer circuit board. Further, the inner layer circuit board and the above-mentioned prepreg are alternately arranged one by one, and a copper foil is further arranged as the outermost layer, and laminated and formed preferably under vacuum under the above conditions. Thus, a multilayer board can be produced.
  • the metal foil-clad laminate of this embodiment can be suitably used as a printed wiring board by further forming a pattern.
  • the printed wiring board can be manufactured according to a conventional method, and the manufacturing method is not particularly limited.
  • the manufacturing method is not particularly limited.
  • an example of the manufacturing method of a printed wiring board is shown.
  • the metal foil-clad laminate described above is prepared.
  • the surface of the metal foil-clad laminate is subjected to etching to form an inner circuit, whereby an inner substrate is produced. If necessary, the inner layer circuit surface of the inner layer substrate is subjected to a surface treatment to increase the adhesive strength, and then, the required number of the above-described prepregs is superimposed on the inner layer circuit surface.
  • a metal foil for the outer layer circuit is laminated on the outer side, and heat and pressure are integrally molded.
  • a multilayer laminate is produced in which an insulating layer made of a cured product of a base material and a thermosetting resin composition is formed between the inner layer circuit and the metal foil for the outer layer circuit.
  • a plated metal film is formed on the wall surfaces of the holes so that the inner layer circuit and the outer layer circuit metal foil are conducted.
  • the printed wiring board is manufactured by etching the metal foil for the outer layer circuit to form the outer layer circuit.
  • the printed wiring board obtained in the above-mentioned production example has an insulating layer and a conductor layer formed on the surface of the insulating layer, and the insulating layer contains the resin composition of the present embodiment described above. That is, the prepreg (the base material and the resin composition of the present embodiment impregnated or coated with the same) of the present embodiment described above, the layer of the resin composition of the metal foil-clad laminate of the present embodiment described above (the present embodiment The layer consisting of the resin composition of (1) is comprised from the insulating layer containing the resin composition of this embodiment.
  • the resin sheet of the present embodiment not only refers to a resin sheet (laminated sheet) including a support and a layer of the above resin composition disposed on the surface of the support, but also removing the support from the laminated sheet Only the resin composition layer (single-layer sheet) also corresponds to the resin sheet of the present embodiment. That is, the resin sheet of this embodiment has the resin composition of this embodiment.
  • the above laminated sheet can be obtained by applying a solution obtained by dissolving the above resin composition in a solvent on a support and drying.
  • the support used herein is not particularly limited.
  • a polyethylene film, a polypropylene film, a polycarbonate film, a polyethylene terephthalate film, an ethylene tetrafluoroethylene copolymer film, and a surface of these films are coated with a release agent.
  • An organic film substrate such as a mold release film and a polyimide film, a conductor foil such as copper foil and aluminum foil, a glass plate, a SUS plate, and a plate-like inorganic film such as FRP.
  • a coating method for example, a solution obtained by dissolving the above resin composition in a solvent is coated on a support by a bar coater, a die coater, a doctor blade, a baker applicator or the like to obtain a support and a resin composition layer.
  • a method of producing a laminated sheet in which Moreover, a single layer sheet can also be obtained by peeling or etching a support body from the resin sheet obtained by drying after application
  • a solution obtained by dissolving or dissolving the resin composition of the present embodiment in a solvent is supplied into a mold having a sheet-like cavity and dried to form a sheet, thereby forming a support.
  • a single layer sheet can also be obtained without using
  • the drying conditions for removing the solvent are not particularly limited, but it is preferable to dry at a temperature of 20 ° C. to 200 ° C. for 1 to 90 minutes.
  • the temperature is 20 ° C. or more, the remaining of the solvent in the resin composition can be further prevented, and when the temperature is 200 ° C. or less, the progress of curing of the resin composition can be suppressed.
  • the thickness of the resin layer in the resin sheet or single layer sheet of this embodiment can be adjusted with the density
  • Solution 1 was poured over 30 minutes while maintaining the liquid temperature -2 to -0.5 ° C. while stirring and 1205.9 g of water. After completion of 1 injection of solution, after stirring for 30 minutes at the same temperature, 10 minutes of a solution (solution 2) in which 65 g (0.64 mol) of triethylamine (0.5 mol per 1 hydroxyl group) is dissolved in dichloromethane I poured it over.
  • Example 1 50 parts by mass of SNCN obtained by Synthesis Example 1, 50 parts by mass of an epoxy resin having a repeating unit represented by the following formula (1-1) ("EPICLON EXA-4710H-70M” manufactured by DIC Corporation), fused silica 100 parts by mass of SC2050 MB (Admatex Co., Ltd.) and 0.05 parts by mass of zinc octylate (Nippon Kagaku Sangyo Co., Ltd.) were mixed to obtain a varnish. The varnish was diluted with methyl ethyl ketone, impregnated and applied to an E glass woven fabric having a thickness of 0.1 mm, and dried by heating at 165 ° C.
  • (1-1) EPICLON EXA-4710H-70M
  • SC2050 MB Admatex Co., Ltd.
  • zinc octylate Nippon Kagaku Sangyo Co., Ltd.
  • EPICLON EXA-4710H-70M was previously subjected to molecular weight measurement described later, and its Z average molecular weight was specified as 1810.
  • Example 1 a biphenyl aralkyl type epoxy resin (NC-3000-FH, Nippon Kayaku Co., Ltd.) represented by the following formula (6) instead of using 50 parts by mass of the epoxy resin represented by the formula (1)
  • a prepreg having a resin content of 50% by mass was obtained in the same manner as in Example 1 except that 50 parts by mass was used and 0.11 part by mass of zinc octylate was used.
  • a metal foil-clad laminate having a thickness of 0.8 mm and 0.4 mm was obtained.
  • the evaluation results of the obtained metal foil-clad laminate are shown in Table 1.
  • n represents an integer of 0 to 15.
  • Example 2 In Example 1, instead of using 50 parts by mass of the epoxy resin represented by the formula (1), a naphthalene type epoxy resin represented by the following formula (7) (“EPICLON HP-4710” manufactured by DIC Corporation) A prepreg having a resin content of 50% by mass was obtained in the same manner as in Example 1 except that 50 parts by mass and 0.10 parts by mass of zinc octylate were used. In addition, EPICLON HP-4710 was previously subjected to molecular weight measurement described later, and its Z average molecular weight was specified as 1330. Furthermore, in the same manner as in Example 1, a metal foil-clad laminate having a thickness of 0.8 mm and 0.4 mm was obtained. The evaluation results of the obtained metal foil-clad laminate are shown in Table 1.
  • the present application relates to a Japanese patent application filed to the Japanese Patent Office on August 31, 2017 (Japanese Patent Application No. 2017-167497) and a Japanese patent application filed to the Japanese Patent Office on November 1, 2017 ( No. 2017-211967), the contents of which are incorporated herein by reference.
  • the resin composition of the present invention has industrial applicability as a material such as a prepreg, a metal foil-clad laminate, a laminated resin sheet, a resin sheet, a printed wiring board and the like.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

L'invention concerne une composition de résine qui contient : (A) une résine époxyde qui possède un motif répétitif représenté par la formule (1), tout en ayant une masse moléculaire moyenne de centrifugation située dans la plage allant de 1 400 à 3 000 (inclus) ; et (B) un composé d'ester de cyanate. (Dans la formule (1), X1 représente un groupe alkylène possédant de 1 à 3 atomes de carbone ou un groupe alcénylène ; et chaque R1 } représente indépendamment un atome d'hydrogène, un groupe alkyle possédant de 1 à 3 atomes de carbone, ou un groupe alcényle).
PCT/JP2018/032130 2017-08-31 2018-08-30 Composition de résine, préimprégné, stratifié revêtu d'une feuille métallique, feuille de résine et carte de circuit imprimé WO2019044977A1 (fr)

Priority Applications (3)

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CN201880045679.2A CN110869409B (zh) 2017-08-31 2018-08-30 树脂组合物、预浸料、覆金属箔层叠板、树脂片和印刷电路板
JP2018564443A JP6504533B1 (ja) 2017-08-31 2018-08-30 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板
KR1020197017668A KR102090439B1 (ko) 2017-08-31 2018-08-30 수지 조성물, 프리프레그, 금속박 피복 적층판, 수지 시트 및 프린트 배선판

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