WO2019041472A1 - 显示面板及显示设备 - Google Patents

显示面板及显示设备 Download PDF

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Publication number
WO2019041472A1
WO2019041472A1 PCT/CN2017/106649 CN2017106649W WO2019041472A1 WO 2019041472 A1 WO2019041472 A1 WO 2019041472A1 CN 2017106649 W CN2017106649 W CN 2017106649W WO 2019041472 A1 WO2019041472 A1 WO 2019041472A1
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WO
WIPO (PCT)
Prior art keywords
flexible circuit
circuit board
display
edge
area
Prior art date
Application number
PCT/CN2017/106649
Other languages
English (en)
French (fr)
Inventor
崔磊
Original Assignee
武汉华星光电半导体显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Priority to US16/079,343 priority Critical patent/US20210097900A1/en
Publication of WO2019041472A1 publication Critical patent/WO2019041472A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Definitions

  • the present application relates to the field of display technologies, and in particular, to a display panel and a display device.
  • AMOLEDs active-matrix organic light emitting diodes
  • other displays have begun to enter the consumer market, and are popular with the public.
  • AMOLEDs active-matrix organic light emitting diodes
  • touch functions have become an indispensable part of people's lives.
  • the display screen with an external touch panel is the most common way to integrate touch functions into the display device.
  • the touch panel is attached to the surface of the display panel, and a flexible printed circuit (FPC) drawn from the edge of the touch panel is connected to the flexible circuit board drawn from the edge of the array substrate through the connector.
  • FPC flexible printed circuit
  • the touch panel and the array substrate are electrically connected to the main board together. Due to the large thickness of the connector, the overall thickness of the display device is affected, the connector cannot be bent, and the overlapping portions and connectors of the two flexible circuit boards affect the bending effect of the flexible circuit board, which is disadvantageous for the space arrangement and display inside the display device. Small size design of the device.
  • the technical problem to be solved by the present application is to provide a display panel and a display device for solving the problem that the connector affects the overall thickness of the display device in the prior art, affecting the bending effect of the flexible circuit board, and is disadvantageous for the space arrangement inside the display device and A problem with the small size design of the display device.
  • the present application provides a display panel including an array substrate, a light emitting layer, a touch panel, a first flexible circuit board, and a second flexible circuit board.
  • the array substrate includes a display area and a bit.
  • the light emitting layer is stacked on the display area, the first flexible circuit board is overlapped to the edge binding area, and the touch panel is stacked.
  • the second flexible circuit board is flexibly connected between the touch panel and the edge binding area, and the edge binding area is firstly disposed on a side of the light emitting layer facing away from the array substrate.
  • a conductive lead, the second flexible circuit board being electrically connected to the first flexible circuit board through the first conductive lead.
  • the display panel further includes a touch chip, the touch chip is fixed on the first flexible circuit board, and the touch chip is electrically connected to the first flexible circuit board and the second flexible circuit board. Connecting the touch panel.
  • the first flexible circuit board includes a fixed end and a carrying portion that are interconnected, the fixed end is overlapped to the edge binding area, and the carrying portion is located outside the array substrate, and the carrying The part carries the touch chip.
  • the display panel further includes a display driving chip, the display driving chip is located in the edge binding region, and a vertical projection of the second flexible circuit board on the array substrate covers the display driving chip.
  • connection between the second flexible circuit board and the edge bonding area forms a second flexible circuit board binding area
  • the board bonding area is staggered.
  • the display panel further includes a cover plate, and the cover plate is disposed on a side of the touch panel facing away from the light-emitting layer, and the cover plate forms a touch in a region covered by a vertical projection of the touch panel.
  • An end region of the touch area is provided with an edge region, and the second flexible circuit board is overlapped to the edge region.
  • the edge binding region is further provided with a second conductive lead
  • the display driving chip is electrically connected to the first flexible circuit board through the second conductive lead, the first conductive lead and the second conductive lead
  • the conductive leads are staggered.
  • the display panel further includes an optical adhesive layer, and the touch panel is fixedly connected to the light emitting layer by the optical adhesive layer.
  • the first flexible circuit board is fixedly connected to the edge binding region by an anisotropic conductive film
  • the second flexible circuit board is fixedly connected to the edge bonding region by an anisotropic conductive film.
  • the present application further provides a display device including a main board and a display panel, the display panel including an array substrate, a light emitting layer, a touch panel, a first flexible circuit board, and a second flexible circuit board, the array substrate
  • the display area and the edge binding area located at one end edge of the display area, the illuminating Layers are stacked on the display area, the first flexible circuit board is overlapped with the edge bonding area, and the touch panel is stacked on a side of the light emitting layer facing away from the array substrate,
  • the second flexible circuit board is flexibly connected between the touch panel and the edge binding area, the edge binding area is provided with a first conductive lead, and the second flexible circuit board passes the first conductive
  • a lead wire is electrically connected to the first flexible circuit board, and the display panel is electrically connected to the main board through the first flexible circuit board.
  • the display panel further includes a touch chip, the touch chip is fixed on the first flexible circuit board, and the touch chip is electrically connected to the first flexible circuit board and the second flexible circuit board. Connecting the touch panel.
  • the first flexible circuit board includes a fixed end and a carrying portion that are interconnected, the fixed end is overlapped to the edge binding area, and the carrying portion is located outside the array substrate, and the carrying The part carries the touch chip.
  • the display panel further includes a display driving chip, the display driving chip is located in the edge binding region, and a vertical projection of the second flexible circuit board on the array substrate covers the display driving chip.
  • connection between the second flexible circuit board and the edge bonding area forms a second flexible circuit board binding area
  • the board bonding area is staggered.
  • the display panel further includes a cover plate, and the cover plate is disposed on a side of the touch panel facing away from the light-emitting layer, and the cover plate forms a touch in a region covered by a vertical projection of the touch panel.
  • An end region of the touch area is provided with an edge region, and the second flexible circuit board is overlapped to the edge region.
  • the edge binding region is further provided with a second conductive lead
  • the display driving chip is electrically connected to the first flexible circuit board through the second conductive lead, the first conductive lead and the second conductive lead
  • the conductive leads are staggered.
  • the display panel further includes an optical adhesive layer, and the touch panel is fixedly connected to the light emitting layer by the optical adhesive layer.
  • the first flexible circuit board is fixedly connected to the edge binding region by an anisotropic conductive film
  • the second flexible circuit board is fixedly connected to the edge bonding region by an anisotropic conductive film.
  • the second flexible circuit board is electrically connected to the first flexible circuit board through the first conductive lead on the edge bonding region, thereby electrically connecting the touch panel to the first flexible circuit board to finally Electrically connected to the main board, the first flexible circuit board and the second flexible circuit board are connected without a connector, without increasing the overall thickness of the display device, the first flexible circuit board and the second flexible circuit board have no overlapping portion, and the second flexible circuit board does not affect
  • the bending effect of the first flexible circuit board, and the device without connectors affect the bending effect of the first flexible circuit board, which is beneficial to the space arrangement inside the display device and the small-scale design of the display device, thereby improving the user experience.
  • FIG. 1 is a side view of a display panel according to an embodiment of the present application.
  • FIG. 2 is a top view of a display panel according to an embodiment of the present application.
  • FIG. 3 is a partially enlarged schematic view of an array substrate of a display panel according to an embodiment of the present application.
  • FIG. 4 is a schematic diagram of connection between a display panel and a main board according to an embodiment of the present application.
  • FIG. 5 is a schematic diagram of a display device according to an embodiment of the present application.
  • the display panel 700 provided by the embodiment of the present invention integrates a display function and a touch function.
  • the display panel 700 includes an array substrate 12 , a light emitting layer 14 , and a touch panel 15 .
  • the array substrate 12 controls the light-emitting layer 14 to emit light
  • the touch panel 15 is externally mounted on the display panel 700.
  • the luminescent layer 14 is an organic light emitting diode (OLED), and the organic light emitting diode has self-luminous, wide viewing angle, almost infinite contrast, low power consumption, and high reaction.
  • the touch panel 15 is a transparent panel.
  • the image displayed on the illuminating layer 14 can be displayed on the touch panel 15 .
  • the touch panel 15 is a capacitive touch panel 15 , and the touch panel 15 implements a touch function through the driving electrodes and the sensing electrodes.
  • the touch electrode and the sensing electrode are patterned indium tin oxide (ITO) films, and the indium tin oxide film has good conductivity and high light transmittance, and has little influence on the image displayed by the light emitting layer 14. .
  • ITO indium tin oxide
  • the array substrate 12 controls the light-emitting effect of the light-emitting layer 14 by controlling each pixel unit, that is, controls the content of the display image.
  • the array substrate 12 is provided with an array of Thin Film Transistors (TFTs).
  • TFTs Thin Film Transistors
  • the thin film transistor is a Low Temperature Poly-silicon (LTPS) thin film transistor, and the low temperature polysilicon thin film transistor has Ultra-thin, light weight, low power consumption, with organic light-emitting diodes can provide more vivid colors and clearer images.
  • LTPS Low Temperature Poly-silicon
  • the display panel 700 further includes a first flexible circuit board 22 and a second flexible circuit board 24, the first flexible circuit board 22 and the second flexible circuit board 24 being bendable due to their own flexibility, and the first flexible circuit board 22 or the first flexible circuit board 22 or The electronic devices connected at both ends of the second flexible circuit board 24 are electrically connected.
  • the electronic device bound between the two ends of the first flexible circuit board 22 or the second flexible circuit board 24 may also be electrically connected to An electronic device connected to both ends of the first flexible circuit board 22 or the second flexible circuit board 24.
  • the array substrate 12 includes a display area 122 and an edge binding area 124 at an edge of the display area 122.
  • the light emitting layer 14 is stacked on the display area 122, and the light emitting layer 14 covers the display area 122.
  • the substrate 12 controls the light-emitting layer 14 to display an image, that is, the display area 122 is used to display an image.
  • the edge bonding region 124 is located at one end of the array substrate 12 in the longitudinal direction, the edge bonding region 124 is opaque, and the edge bonding region 124 is provided with a plurality of patterned conductive leads.
  • the conductive leads are lasers.
  • a silver paste line formed by etching or chemically etching a silver paste layer.
  • the first flexible circuit board 22 is overlapped to the edge bonding area 124. Specifically, one end of the first flexible circuit board 22 is bound to the edge binding area 124, and the other end is bound to the main board 60 of the display device. Thereby, the array substrate 12 is electrically connected to the main board 60. Further, in order to save space, the first flexible circuit board 22 is bent and connected to the array substrate 12 and the main board 60. Referring to FIG. 4, in one embodiment, the main board 60 is placed on the side of the array substrate 12 facing away from the luminescent layer 14. The first flexible circuit board 22 is bent 180 degrees.
  • the touch panel 15 is disposed on the side of the light-emitting layer 14 facing away from the array substrate 12 .
  • the touch panel 15 is fixed to the light-emitting layer 14 by an optically transparent adhesive (OCA) 16 .
  • OCA optically transparent adhesive
  • the light transmittance of the optical adhesive 16 is high, and the light of the display image emitted by the light-emitting layer 14 is damaged. Less consumption.
  • the second flexible circuit board 24 is flexibly connected between the touch panel 15 and the edge bonding area 124.
  • the edge bonding area 124 is provided with a first conductive lead 32, and the second flexible circuit board 24 is first.
  • the conductive leads 32 are electrically connected to the first flexible circuit board 22.
  • one end of the second flexible circuit board 24 is bound to the edge of the touch panel 15 , and the other end is bound to the edge binding area 124 of the array substrate 12 , thereby electrically connecting the touch panel 15 and the array substrate 12 .
  • both ends of the second flexible circuit board 24 are connected to the touch panel 15 or the edge bonding region 124 through an anisotropic conductive film 40 (ACF), and the anisotropic conductive film 40
  • ACF anisotropic conductive film 40
  • the second flexible circuit board 24 can be tightly fixedly coupled to the edge bonding area 124 or the touch panel 15 , and the second flexible circuit board 24 can be electrically connected to the array substrate 12 and the touch panel 15 .
  • the second flexible circuit board 24 is electrically connected to the second flexible circuit board 24 through the first conductive lead 32. Since the second flexible circuit board 24 is electrically connected to the main board 60, the touch panel 15 sequentially passes through the second flexible circuit.
  • the board 24, the first conductive lead 32 and the first flexible circuit board 22 are electrically connected to the main board 60.
  • the first conductive lead 32 is a silver glue line formed by patterning a silver glue layer by laser etching or chemical etching, silver glue.
  • the line impedance is small and easy to produce. It can be understood that the illuminating layer 14 and the array substrate 12 for implementing the display function are electrically connected to the main board 60 through the first flexible circuit board 22, and the touch panel 15 for implementing the touch function also passes through the first flexible circuit board 22. It is electrically connected to the main board 60, so that the main board 60 can control the display function and the touch function of the display device.
  • the second flexible circuit board 24 is electrically connected to the first flexible circuit board 22 through the first conductive lead 32 on the edge bonding region 124, thereby electrically connecting the touch panel 15 to the first flexible circuit board 22 for final electrical connection to the main board.
  • the first flexible circuit board 22 and the second flexible circuit board 24 do not need to be connected by a connector, without increasing the overall thickness of the display device, the first flexible circuit board 22 and the second flexible circuit board 24 have no overlapping portion, and the second flexible circuit board 24
  • the bending effect of the first flexible circuit board 22 is not affected, and the device without connectors or the like affects the bending effect of the first flexible circuit board 22, which is advantageous for the space arrangement inside the display device and the small-sized design of the display device, thereby improving the user.
  • the device without connectors or the like affects the bending effect of the first flexible circuit board 22 which is advantageous for the space arrangement inside the display device and the small-sized design of the display device, thereby improving the user.
  • Experience is bending effect of the first flexible circuit board 22 through the
  • the display panel 700 further includes a touch chip 52.
  • the touch chip 52 is fixed on the first flexible circuit board 22.
  • the touch chip 52 is electrically connected through the first flexible circuit board 22 and the second flexible circuit board 24.
  • Control panel 15. the touch chip 52 is configured to process the touch signal transmitted by the touch panel 15 to the touch chip 52.
  • the touch chip 52 is located on the first flexible circuit board 22 and electrically connected to the first flexible circuit board 22 .
  • the touch chip 52 is electrically connected to the edge bonding area 124 of the array substrate 12 through the first flexible circuit board 22 . Thereby, the first conductive lead 32 and the second flexible circuit board 24 are electrically connected to the touch panel 15 in sequence.
  • the touch chip 52 is electrically connected to the touch panel 15 to form a complete touch function.
  • the touch chip 52 is disposed on the first flexible circuit board 22, and does not affect the bending of the second flexible circuit board 24, thereby reducing the second
  • the size of the flexible circuit board 24 is such that the second flexible circuit board 24 is flexibly bent and connected between the touch panel 15 and the edge bonding area 124 with a minimum length without considering the touch chip 52 to the second flexible circuit board 24 .
  • the size effect is beneficial to reduce the space occupied by the second flexible circuit board 24 in the display device, and to facilitate the space design inside the display device.
  • the first flexible circuit board 22 includes a fixed end 222 and a carrying portion 224 which are integrally connected to each other.
  • the fixed end 222 is overlapped to the edge binding area 124.
  • the carrying portion 224 is located outside the array substrate 12, and the carrying portion 224 The touch chip 52 is carried.
  • the fixed end 222 of the first flexible circuit board 22 is connected to the edge bonding region 124 through the anisotropic conductive film 40, and the anisotropic conductive film 40 can bond the first flexible circuit board 22 to the edge.
  • the regions 124 are tightly fixedly coupled together and are capable of conducting the first flexible circuit board 22 with the array substrate 12.
  • the carrying portion 224 does not occupy the space of the edge binding area 124.
  • the touch chip 52 carried on the carrying portion 224 does not occupy the space of the edge carrying area. Further, the carrying portion 224 can be bent and carried. The portion 224 is bound to the main board 60 after being bent, and the space occupied by the display unit 224 after being bent is small, which is favorable for the spatial arrangement and small volume development of the display device.
  • the touch chip 52 does not occupy the space of the edge binding area 124, does not affect the size of the edge binding area 124, and is advantageous for reducing the frame of the display device, which is advantageous for the narrow bezel design; the touch chip 52 carries and bends the carrying portion. 224, which facilitates the spatial arrangement inside the display device and reduces the size of the display device.
  • the display panel 700 further includes a display driving chip 54.
  • the display driving chip 54 is located at the edge bonding area 124.
  • the vertical projection of the second flexible circuit board 24 on the array substrate 12 covers the display driving chip 54.
  • the display driving chip 54 electrically connects the array substrate 12 and the light emitting layer 14 for controlling the light emitting layer 14 to emit light to control the display panel 700 to display the content of the image.
  • the vertical projection of the second flexible circuit board 24 on the array substrate 12 covers the display driving chip 54, that is, the display driving chip 54 is located at the connection point of the second flexible circuit board 24 and the edge bonding area 124, and the second flexible circuit board 24 and the touch.
  • the display driving chip 54 is located between the connection point of the second flexible circuit board 24 and the edge bonding area 124 and the edge of the display area 122, and the display chip does not have an additional edge.
  • the size of the binding area 124 is advantageous for reducing the border of the display device, which is advantageous for the narrow bezel design.
  • the second flexible circuit board 24 and the edge bonding area 124 are connected to form a second flexibility.
  • the board bonding area 240, the connection between the display driver chip 54 and the edge bonding area 124 is offset from the second flexible circuit board bonding area 240.
  • the connection between the display driver chip 54 and the edge bonding region 124 is a chip bonding region 540, and the display driving chip 54 is fixed and electrically connected in the chip bonding region by soldering or anisotropic conductive film 40 bonding.
  • the edge bonding region 124 is further provided with a second conductive lead 34.
  • the display driving chip 54 is electrically connected to the first flexible circuit board 22 through the second conductive lead 34, and the first conductive lead 32 and the second conductive lead 34 are connected. Staggered.
  • the second conductive lead 34 is a silver paste line formed by patterning a silver paste layer by laser etching or chemical etching, and the silver paste line has small impedance and is easy to produce.
  • the first conductive lead 32 is used for electrically connecting the first flexible circuit board 22 and the second flexible circuit board 24, thereby electrically connecting the touch panel 15 with the touch chip 52 and the main board 60, and the second conductive lead 34 is used for electrical connection.
  • the display driving chip 54 and the first flexible circuit board 22 are electrically connected to the display driving chip 54 and the main board 60.
  • the first conductive lead 32 and the second conductive lead 34 are staggered to avoid mutual display signals and touch signals. Interference, affecting display and touch functions.
  • the display panel 700 further includes a cover plate 17 disposed on the side of the touch panel 15 facing away from the light-emitting layer 14 , and the cover plate 17 forms a touch area 154 in a region covered by the vertical projection of the touch panel 15 .
  • One end of the touch area 154 is provided with an edge area 152, and the second flexible circuit board 24 is overlapped to the edge area 152.
  • the cover 17 functions to protect the touch panel 15 , and the user's finger directly contacts the cover 17 to avoid direct contact with the touch panel 15 and damage the touch panel 15 .
  • the cover plate 17 is a polarizer structure for filtering the light emitted by the luminescent layer 14 to obtain image light having the same polarization direction.
  • the edge region 152 is not covered by the cover plate 17, and a binding point is provided on the surface of the edge region 152, and one end of the second flexible circuit board 24 is bound to the binding point of the edge region 152, thereby being connected to
  • the touch panel 15 is between the array substrate 12 and the array substrate 12 .
  • This connection method is simple and easy to implement.
  • the edge region 152 and the edge bonding region 124 are located on the same side of the display panel 700, reducing the distance of the edge region 152 domain edge bonding region 124, thereby minimizing the size of the second flexible circuit board 24. It is beneficial to the space arrangement inside the display device and the small size design of the display device to improve the user experience.
  • the second flexible circuit board 24 is electrically connected to the first flexible circuit board 22 through the first conductive lead 32 on the edge bonding region 124, thereby electrically connecting the touch panel 15 to the first flexible circuit board 22 for final electrical connection to the main board. 60.
  • the first flexible circuit board 22 and the second flexible circuit board 24 are connected without a connector, and the display is not added.
  • the overall thickness of the device, the first flexible circuit board 22 and the second flexible circuit board 24 have no overlapping portion, and the second flexible circuit board 24 does not affect the bending effect of the first flexible circuit board 22, and devices such as connectors do not affect the first flexibility.
  • the bending effect of the circuit board 22 is beneficial to the space arrangement inside the display device and the small-scale design of the display device, thereby improving the user experience.
  • the display device further includes a thin film encapsulation layer 18 and a substrate layer 19, and the thin film encapsulation layer 18 is disposed between the touch panel 15 and the light emitting layer 14.
  • the thin film encapsulation layer 18 functions to protect the light emitting layer 14.
  • the thin film encapsulation layer 18 is bonded to the touch panel 15 through the optical adhesive 16 .
  • the substrate layer 19 is located on the side of the array facing away from the light-emitting layer 14.
  • the substrate layer 19 is a polyimide layer (Polyimide, PI).
  • the display device 900 includes a main board 60 and a display panel 700 provided by the embodiment of the present application.
  • the display panel 700 is electrically connected to the main board 60 through the first flexible circuit board 22 .
  • the display device 900 further includes a housing 70 that houses the display panel 700 and the main board 60 with the display surface of the display panel 700 facing outward, and the housing 70 protects the display panel 700 and the main board 60.
  • the second flexible circuit board 24 is electrically connected to the first flexible circuit board 22 through the first conductive lead 32 on the edge bonding region 124, thereby electrically connecting the touch panel 15 to the first flexible circuit board 22 for final electrical connection to the main board. 60.
  • the first flexible circuit board 22 and the second flexible circuit board 24 do not need to be connected by a connector, and do not increase the overall thickness of the display device 900.
  • the first flexible circuit board 22 and the second flexible circuit board 24 have no overlapping portion, and the second flexible circuit board 24 does not affect the bending effect of the first flexible circuit board 22, and the device without connectors affects the bending effect of the first flexible circuit board 22, and facilitates the spatial arrangement inside the display device 900 and the small-scale design of the display device 900. To improve the user experience.

Abstract

一种显示面板(700)，包括阵列基板(12)、发光层(14)、触控面板(15)、第一柔性电路板(22)及第二柔性电路板(24)，阵列基板(12)包括显示区(122)及位于显示区(122)一端边缘的边缘绑定区(124)，发光层(14)层叠设置于显示区(122)上，第一柔性电路板(22)搭接至边缘绑定区(124)，触控面板(15)层叠设置于发光层(14)背离阵列基板(12)的一侧，第二柔性电路板(24)柔性连接于触控面板(15)与边缘绑定区(124)之间，边缘绑定区(124)上设有第一导电引线(32)，第二柔性电路板(24)通过第一导电引线(32)电连接至第一柔性电路板(22)。进一步公布了一种显示设备(900)。第二柔性电路板(24)不影响第一柔性电路板(22)的弯折效果，且无连接器等器件影响第一柔性电路板(22)的弯折效果，提高用户体验。

Description

显示面板及显示设备
本申请要求于2017年9月4日提交中国专利局、申请号为2017107860981、申请名称为“显示面板及显示设备”的中国专利申请的优先权，上述在先申请的内容以引入的方式并入本文本中。
技术领域
本申请涉及显示技术领域，尤其是涉及一种显示面板及显示设备。
背景技术
随着显示技术的进步，显示技术不断的创新发展，例如有源矩阵有机发光二极体显示器(Active-matrix organic light emitting diode，AMOLED)等显示器开始大量进入消费市场，受到大众的亲赖。随着显示设备的功能多样化，具有触控功能的显示设备也成为了人们生活中不可缺少的一部分。目前，显示屏幕搭载外挂式触控面板是最常见的将触控功能集成到显示设备上的方式。
现有技术中，触控面板贴合在显示面板的表面，从触控面板的边缘引出的柔性电路板(Flexible Printed Circuit，FPC)通过连接器与从阵列基板的边缘引出的柔性电路板连接，从而将触控面板和阵列基板一起电连接至主板。由于连接器厚度较大，影响显示设备整体厚度，连接器不可弯折，两个柔性电路板的重叠部分和连接器影响了柔性电路板的弯折效果，不利于显示设备内部的空间布置及显示设备的小尺寸化设计。
申请内容
本申请要解决的技术问题是提供一种显示面板及显示设备，用以解决现有技术中连接器影响显示设备整体厚度，影响柔性电路板的弯折效果，不利于显示设备内部的空间布置及显示设备的小尺寸化设计的问题。
为解决上述技术问题，本申请提供一种显示面板，包括阵列基板、发光层、触控面板、第一柔性电路板及第二柔性电路板，所述阵列基板包括显示区及位 于所述显示区一端边缘的边缘绑定区，所述发光层层叠设置于所述显示区上，所述第一柔性电路板搭接至所述边缘绑定区，所述触控面板层叠设置于所述发光层背离所述阵列基板的一侧，所述第二柔性电路板柔性连接于所述触控面板与所述边缘绑定区之间，所述边缘绑定区上设有第一导电引线，所述第二柔性电路板通过所述第一导电引线电连接至所述第一柔性电路板。
其中，所述显示面板还包括触控芯片，所述触控芯片固定于所述第一柔性电路板上，所述触控芯片通过所述第一柔性电路板及所述第二柔性电路板电连接所述触控面板。
其中，所述第一柔性电路板包括互连为一体的固定端和承载部，所述固定端搭接至所述边缘绑定区，所述承载部位于所述阵列基板之外，所述承载部承载所述触控芯片。
其中，所述显示面板还包括显示驱动芯片，所述显示驱动芯片位于所述边缘绑定区，所述第二柔性电路板在所述阵列基板的垂直投影覆盖所述显示驱动芯片。
其中，所述第二柔性电路板与所述边缘绑定区的连接处形成第二柔性电路板绑定区，所述显示驱动芯片与所述边缘绑定区的连接处与所述第二柔性电路板绑定区错开。
其中，所述显示面板还包括盖板，所述盖板层叠设置于所述触控面板背离所述发光层一侧，所述盖板在所述触控面板的垂直投影覆盖的区域形成触控区，所述触控区的一端设有边缘区，所述第二柔性电路板搭接至所述边缘区。
其中，所述边缘绑定区还设有第二导电引线，所述显示驱动芯片通过所述第二导电引线电连接至所述第一柔性电路板，所述第一导电引线与所述第二导电引线错开。
其中，所述显示面板还包括光学胶层，所述触控面板通过所述光学胶层与所述发光层固定连接。
其中，所述第一柔性电路板通过异方性导电胶膜固定连接所述边缘绑定区，所述第二柔性电路板通过异方性导电胶膜固定连接所述边缘绑定区。
本申请还提供一种显示设备，所述显示设备包括主板和显示面板，所述显示面板包括阵列基板、发光层、触控面板、第一柔性电路板及第二柔性电路板，所述阵列基板包括显示区及位于所述显示区一端边缘的边缘绑定区，所述发光 层层叠设置于所述显示区上，所述第一柔性电路板搭接至所述边缘绑定区，所述触控面板层叠设置于所述发光层背离所述阵列基板的一侧，所述第二柔性电路板柔性连接于所述触控面板与所述边缘绑定区之间，所述边缘绑定区上设有第一导电引线，所述第二柔性电路板通过所述第一导电引线电连接至所述第一柔性电路板，所述显示面板通过所述第一柔性电路板电连接至所述主板。
其中，所述显示面板还包括触控芯片，所述触控芯片固定于所述第一柔性电路板上，所述触控芯片通过所述第一柔性电路板及所述第二柔性电路板电连接所述触控面板。
其中，所述第一柔性电路板包括互连为一体的固定端和承载部，所述固定端搭接至所述边缘绑定区，所述承载部位于所述阵列基板之外，所述承载部承载所述触控芯片。
其中，所述显示面板还包括显示驱动芯片，所述显示驱动芯片位于所述边缘绑定区，所述第二柔性电路板在所述阵列基板的垂直投影覆盖所述显示驱动芯片。
其中，所述第二柔性电路板与所述边缘绑定区的连接处形成第二柔性电路板绑定区，所述显示驱动芯片与所述边缘绑定区的连接处与所述第二柔性电路板绑定区错开。
其中，所述显示面板还包括盖板，所述盖板层叠设置于所述触控面板背离所述发光层一侧，所述盖板在所述触控面板的垂直投影覆盖的区域形成触控区，所述触控区的一端设有边缘区，所述第二柔性电路板搭接至所述边缘区。
其中，所述边缘绑定区还设有第二导电引线，所述显示驱动芯片通过所述第二导电引线电连接至所述第一柔性电路板，所述第一导电引线与所述第二导电引线错开。
其中，所述显示面板还包括光学胶层，所述触控面板通过所述光学胶层与所述发光层固定连接。
其中，所述第一柔性电路板通过异方性导电胶膜固定连接所述边缘绑定区，所述第二柔性电路板通过异方性导电胶膜固定连接所述边缘绑定区。
本申请的有益效果如下：第二柔性电路板通过边缘绑定区上的第一导电引线电连接至第一柔性电路板，从而使触控面板电连接至第一柔性电路板以最终 电连接至主板，第一柔性电路板与第二柔性电路板无需连接器连接，不增加显示设备整体厚度，第一柔性电路板与第二柔性电路板无重叠部分，第二柔性电路板不影响第一柔性电路板的弯折效果，且无连接器等器件影响第一柔性电路板的弯折效果，有利于显示设备内部的空间布置及显示设备的小尺寸化设计，提高用户体验。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的显示面板的侧视图。
图2为本申请实施例提供的显示面板的俯视图。
图3为本申请实施例提供的显示面板的阵列基板的部分放大示意图。
图4为本申请实施例提供的显示面板与主板的连接示意图。
图5为本申请实施例提供的显示设备的示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
请一并参阅图1、图2及图3，本申请实施例提供的显示面板700集成了显示功能与触控功能，具体的，显示面板700包括阵列基板12、发光层14及触控面板15，阵列基板12控制发光层14发光，触控面板15以外挂式的形式集成在显示面板700上。一种实施方式中，发光层14为有机发光二极体(organic light emitting diode，OLED)，有机发光二极体具有自发光、广视角、几乎无穷高的对比度、较低耗电、极高反应速度等优点，并且OLED具有一定的柔性，即可弯折，从而可以用于制作柔性显示设备。本实施例中，触控面板15为透明面板， 发光层14显示的图像可以穿过触控面板15显示，一种实施方式中，触控面板15为电容式触控面板15，触控面板15通过层叠设置的驱动电极与感应电极实现触控功能，进一步的，触控电极和感应电极均为图案化的氧化铟锡(Indium tin oxide，ITO)薄膜，氧化铟锡薄膜导电性好，光透过率高，对发光层14显示图像的影响小。本实施例中，阵列基板12通过控制各像素单元从而控制发光层14的发光效果，即控制显示图像的内容。一种实施方式中，阵列基板12设有阵列排布的薄膜晶体管(Thin Film Transistor，TFT)，具体的，薄膜晶体管为低温多晶硅(Low Temperature Poly-silicon，LTPS)薄膜晶体管，低温多晶硅薄膜晶体管具有超薄、重量轻、低耗电的特点，搭配有机发光二极体可以提供更艳丽的色彩和更清晰的影像。
显示面板700还包括第一柔性电路板22和第二柔性电路板24，第一柔性电路板22和第二柔性电路板24由于自身的柔性可以弯折，并且可以将第一柔性电路板22或第二柔性电路板24两端连接的电子器件电连接，一种实施方式中，绑定于第一柔性电路板22或第二柔性电路板24的两端之间的电子器件也可以电连接至第一柔性电路板22或第二柔性电路板24两端连接的电子器件。
本实施例中，阵列基板12包括显示区122及位于显示区122一端边缘的边缘绑定区124，具体的，发光层14层叠设置于显示区122上，并且发光层14覆盖显示区122，阵列基板12控制发光层14显示图像，即显示区122用于显示图像。本实施例中，边缘绑定区124位于阵列基板12的长度方向一端，边缘绑定区124不透明，并且边缘绑定区124设有多个图案化形成的导电引线，具体的，导电引线为激光蚀刻或化学蚀刻银胶层形成的银胶线。本实施例中，第一柔性电路板22搭接至边缘绑定区124，具体的，第一柔性电路板22的一端绑定在边缘绑定区124，另一端绑定在显示设备的主板60，从而将阵列基板12与主板60电连接。进一步的，为了节省空间，第一柔性电路板22经过弯折后连接阵列基板12与主板60，结合图4，一种实施方式中，主板60放置于阵列基板12背离发光层14的一侧，第一柔性电路板22弯折180度。
本实施例中，触控面板15层叠设置于发光层14背离阵列基板12的一侧，一种实施方式中，触控面板15通过光学胶16(Optically Clear Adhesive，OCA)与发光层14固定，光学胶16的透光率高，发光层14发出的显示图像的光线的损 耗较小。
结合后图3，第二柔性电路板24柔性连接于触控面板15与边缘绑定区124之间，边缘绑定区124上设有第一导电引线32，第二柔性电路板24通过第一导电引线32电连接至第一柔性电路板22。具体的，第二柔性电路板24的一端绑定在触控面板15的边缘，另一端绑定在阵列基板12的边缘绑定区124，从而将触控面板15与阵列基板12电连接。一种实施方式中，第二柔性电路板24的两端均通过异方性导电胶膜40(Anisotropic Conductive Film，ACF)连接触控面板15或边缘绑定区124，异方性导电胶膜40可以将第二柔性电路板24与边缘绑定区124或触控面板15紧密的固定连接在一起，并且能够使第二柔性电路板24与阵列基板12及触控面板15导通。本实施例中，第二柔性电路板24通过第一导电引线32电连接至第二柔性电路板24，由于第二柔性电路板24电连接至主板60，触控面板15依次经过第二柔性电路板24、第一导电引线32及第一柔性电路板22电连接至主板60，具体的，第一导电引线32为激光蚀刻或化学蚀刻等方法图案化银胶层形成的银胶线，银胶线阻抗小，且易于生产。可以理解的是，用于实现显示功能的发光层14和阵列基板12通过第一柔性电路板22电连接至主板60，用于实现触控功能的触控面板15亦通过第一柔性电路板22电连接至主板60，从而使主板60可以对显示设备的显示功能和触控功能进行控制。
第二柔性电路板24通过边缘绑定区124上的第一导电引线32电连接至第一柔性电路板22，从而使触控面板15电连接至第一柔性电路板22以最终电连接至主板60，第一柔性电路板22与第二柔性电路板24无需连接器连接，不增加显示设备整体厚度，第一柔性电路板22与第二柔性电路板24无重叠部分，第二柔性电路板24不影响第一柔性电路板22的弯折效果，且无连接器等器件影响第一柔性电路板22的弯折效果，有利于显示设备内部的空间布置及显示设备的小尺寸化设计，提高用户体验。
本实施例中，显示面板700还包括触控芯片52，触控芯片52固定于第一柔性电路板22上，触控芯片52通过第一柔性电路板22及第二柔性电路板24电连接触控面板15。具体的，触控芯片52用于处理触控面板15传递至触控芯片52的触控信号。触控芯片52位于第一柔性电路板22上，并且与第一柔性电路板22电连接，触控芯片52通过第一柔性电路板22电连接至阵列基板12的边缘绑定区124， 从而依次通过第一导电引线32和第二柔性电路板24电连接至触控面板15。触控芯片52与触控面板15电连接形成完整的触控功能，触控芯片52设置于第一柔性电路板22上，不影响第二柔性电路板24的弯折，从而可以减小第二柔性电路板24的尺寸，使第二柔性电路板24灵活弯折后以最小的长度连接于触控面板15和边缘绑定区124之间而无需考虑触控芯片52对第二柔性电路板24的尺寸影响，有利于减小第二柔性电路板24在显示设备内占用的空间，方便显示设备内部的空间设计。
本实施例中，第一柔性电路板22包括互连为一体的固定端222和承载部224，固定端222搭接至边缘绑定区124，承载部224位于阵列基板12之外，承载部224承载触控芯片52。一种实施方式中，第一柔性电路板22的固定端222通过异方性导电胶膜40连接边缘绑定区124，异方性导电胶膜40可以将第一柔性电路板22与边缘绑定区124紧密的固定连接在一起，并且能够使第一柔性电路板22与阵列基板12导通。本实施例中，承载部224不占用边缘绑定区124的空间，故承载于承载部224上的触控芯片52也不占用边缘承载区的空间，进一步的，承载部224可弯折，承载部224经过弯折后绑定于主板60上，承载部224弯折后在显示设备中占用的空间较小，有利于显示设备的空间布置与小体积化发展。触控芯片52不占据边缘绑定区124的空间，不影响边缘绑定区124的尺寸，有利于减小显示设备的边框，利于窄边框设计；触控芯片52承载与可弯折的承载部224，有利于显示设备内部的空间布置，降低显示设备的尺寸。
本实施例中，显示面板700还包括显示驱动芯片54，显示驱动芯片54位于边缘绑定区124，第二柔性电路板24在阵列基板12的垂直投影覆盖显示驱动芯片54。具体的，显示驱动芯片54电连接阵列基板12及发光层14，用于控制发光层14发光从而控制显示面板700显示图像的内容。第二柔性电路板24在阵列基板12的垂直投影覆盖显示驱动芯片54，即显示驱动芯片54位于第二柔性电路板24与边缘绑定区124的连接点和第二柔性电路板24与触控面板15的连接点的水平位置之间，也可以理解为显示驱动芯片54位于第二柔性电路板24与边缘绑定区124的连接点和显示区122的边缘之间，显示芯片不额外增加边缘绑定区124的尺寸，有利于减小显示设备的边框，利于窄边框设计。
本实施例中，第二柔性电路板24与边缘绑定区124的连接处形成第二柔性 电路板绑定区240，显示驱动芯片54与边缘绑定区124的连接处与第二柔性电路板绑定区240错开。具体的，显示驱动芯片54与边缘绑定区124的连接处为芯片绑定区540，显示驱动芯片54通过焊接或异方性导电胶膜40贴合的方法固定并电连接在芯片绑定区540，芯片绑定区540与第二柔性电路板绑定区240错开，以防止第二柔性电路板24与显示驱动芯片54连通，避免显示信号与触控信号相互干扰，影响显示功能与触控功能。本实施例中，边缘绑定区124还设有第二导电引线34，显示驱动芯片54通过第二导电引线34电连接至第一柔性电路板22，第一导电引线32与第二导电引线34错开。一种实施方式中，第二导电引线34为激光蚀刻或化学蚀刻等方法图案化银胶层形成的银胶线，银胶线阻抗小，且易于生产。第一导电引线32用于电连接第一柔性电路板22与第二柔性电路板24，从而实现触控面板15与触控芯片52及主板60的电连接，第二导电引线34用于电连接显示驱动芯片54与第一柔性电路板22，从而实现发光层14与显示驱动芯片54及主板60的电连接，第一导电引线32与第二导电引线34错开，避免显示信号与触控信号相互干扰，影响显示功能与触控功能。
本实施例中，显示面板700还包括盖板17，盖板17层叠设置于触控面板15背离发光层14一侧，盖板17在触控面板15的垂直投影覆盖的区域形成触控区154，触控区154的一端设有边缘区152，第二柔性电路板24搭接至边缘区152。具体的，盖板17起到保护触控面板15的作用，用户的手指直接接触盖板17，避免直接接触触控面板15而损坏触控面板15。一种实施方式中，盖板17为偏光片结构，用于筛选发光层14发射出的光线，以得到偏振方向一致的图像光线。本实施例中，边缘区152未被盖板17覆盖，并且在边缘区152表面设有绑定点，第二柔性电路板24的一端绑定在边缘区152的绑定点上，从而连接于触控面板15与阵列基板12之间。该连接方式简单易实现。一种实施方式中，边缘区152与边缘绑定区124位于显示面板700的同一侧，减小了边缘区152域边缘绑定区124的距离，从而最小化第二柔性电路板24的尺寸，有利于显示设备内部的空间布置及显示设备的小尺寸化设计，提高用户体验。
第二柔性电路板24通过边缘绑定区124上的第一导电引线32电连接至第一柔性电路板22，从而使触控面板15电连接至第一柔性电路板22以最终电连接至主板60，第一柔性电路板22与第二柔性电路板24无需连接器连接，不增加显示 设备整体厚度，第一柔性电路板22与第二柔性电路板24无重叠部分，第二柔性电路板24不影响第一柔性电路板22的弯折效果，且无连接器等器件影响第一柔性电路板22的弯折效果，有利于显示设备内部的空间布置及显示设备的小尺寸化设计，提高用户体验。
本实施例中，显示设备还包括薄膜封装层18和基板层19，薄膜封装层18位于触控面板15与发光层14之间，薄膜封装层18起到保护发光层14的作用，具体的，薄膜封装层18通过光学胶16贴合触控面板15。基板层19位于阵列背离发光层14的一侧，一种实施方式中，基板层19为聚酰亚胺层(Polyimide，PI)。
结合后图5，本申请实施例还提供一种显示设备900，显示设备900包括主板60和本申请实施例提供的显示面板700，显示面板700通过第一柔性电路板22电连接至主板60。一种实施方式中，显示设备900还包括壳体70，壳体70容纳显示面板700与主板60，并使显示面板700的显示面朝外，壳体70保护显示面板700与主板60。
第二柔性电路板24通过边缘绑定区124上的第一导电引线32电连接至第一柔性电路板22，从而使触控面板15电连接至第一柔性电路板22以最终电连接至主板60，第一柔性电路板22与第二柔性电路板24无需连接器连接，不增加显示设备900整体厚度，第一柔性电路板22与第二柔性电路板24无重叠部分，第二柔性电路板24不影响第一柔性电路板22的弯折效果，且无连接器等器件影响第一柔性电路板22的弯折效果，有利于显示设备900内部的空间布置及显示设备900的小尺寸化设计，提高用户体验。
以上所揭露的仅为本申请几种较佳实施例而已，当然不能以此来限定本申请之权利范围，本领域普通技术人员可以理解实现上述实施例的全部或部分流程，并依本申请权利要求所作的等同变化，仍属于申请所涵盖的范围。

Claims (18)

  1. 一种显示面板，其中，包括阵列基板、发光层、触控面板、第一柔性电路板及第二柔性电路板，所述阵列基板包括显示区及位于所述显示区一端边缘的边缘绑定区，所述发光层层叠设置于所述显示区上，所述第一柔性电路板搭接至所述边缘绑定区，所述触控面板层叠设置于所述发光层背离所述阵列基板的一侧，所述第二柔性电路板柔性连接于所述触控面板与所述边缘绑定区之间，所述边缘绑定区上设有第一导电引线，所述第二柔性电路板通过所述第一导电引线电连接至所述第一柔性电路板。
  2. 根据权利要求1所述的显示面板，其中，所述显示面板还包括触控芯片，所述触控芯片固定于所述第一柔性电路板上，所述触控芯片通过所述第一柔性电路板及所述第二柔性电路板电连接所述触控面板。
  3. 根据权利要求2所述的显示面板，其中，所述第一柔性电路板包括互连为一体的固定端和承载部，所述固定端搭接至所述边缘绑定区，所述承载部位于所述阵列基板之外，所述承载部承载所述触控芯片。
  4. 根据权利要求3所述的显示面板，其中，所述显示面板还包括显示驱动芯片，所述显示驱动芯片位于所述边缘绑定区，所述第二柔性电路板在所述阵列基板的垂直投影覆盖所述显示驱动芯片。
  5. 根据权利要求4所述的显示面板，其中，所述第二柔性电路板与所述边缘绑定区的连接处形成第二柔性电路板绑定区，所述显示驱动芯片与所述边缘绑定区的连接处与所述第二柔性电路板绑定区错开。
  6. 根据权利要求5所述的显示面板，其中，所述显示面板还包括盖板，所述盖板层叠设置于所述触控面板背离所述发光层一侧，所述盖板在所述触控面板的垂直投影覆盖的区域形成触控区，所述触控区的一端设有边缘区，所述第二柔性电路板搭接至所述边缘区。
  7. 根据权利要求4所述的显示面板，其中，所述边缘绑定区还设有第二导电引线，所述显示驱动芯片通过所述第二导电引线电连接至所述第一柔性电路板，所述第一导电引线与所述第二导电引线错开。
  8. 根据权利要求1所述的显示面板，其中，所述显示面板还包括光学胶层， 所述触控面板通过所述光学胶层与所述发光层固定连接。
  9. 根据权利要求8所述的显示面板，其中，所述第一柔性电路板通过异方性导电胶膜固定连接所述边缘绑定区，所述第二柔性电路板通过异方性导电胶膜固定连接所述边缘绑定区。
  10. 一种显示设备，其中，所述显示设备包括主板和显示面板，所述显示面板包括阵列基板、发光层、触控面板、第一柔性电路板及第二柔性电路板，所述阵列基板包括显示区及位于所述显示区一端边缘的边缘绑定区，所述发光层层叠设置于所述显示区上，所述第一柔性电路板搭接至所述边缘绑定区，所述触控面板层叠设置于所述发光层背离所述阵列基板的一侧，所述第二柔性电路板柔性连接于所述触控面板与所述边缘绑定区之间，所述边缘绑定区上设有第一导电引线，所述第二柔性电路板通过所述第一导电引线电连接至所述第一柔性电路板，所述显示面板通过所述第一柔性电路板电连接至所述主板。
  11. 根据权利要求10所述的显示设备，其中，所述显示面板还包括触控芯片，所述触控芯片固定于所述第一柔性电路板上，所述触控芯片通过所述第一柔性电路板及所述第二柔性电路板电连接所述触控面板。
  12. 根据权利要求11所述的显示设备，其中，所述第一柔性电路板包括互连为一体的固定端和承载部，所述固定端搭接至所述边缘绑定区，所述承载部位于所述阵列基板之外，所述承载部承载所述触控芯片。
  13. 根据权利要求12所述的显示设备，其中，所述显示面板还包括显示驱动芯片，所述显示驱动芯片位于所述边缘绑定区，所述第二柔性电路板在所述阵列基板的垂直投影覆盖所述显示驱动芯片。
  14. 根据权利要求13所述的显示设备，其中，所述第二柔性电路板与所述边缘绑定区的连接处形成第二柔性电路板绑定区，所述显示驱动芯片与所述边缘绑定区的连接处与所述第二柔性电路板绑定区错开。
  15. 根据权利要求14所述的显示设备，其中，所述显示面板还包括盖板，所述盖板层叠设置于所述触控面板背离所述发光层一侧，所述盖板在所述触控面板的垂直投影覆盖的区域形成触控区，所述触控区的一端设有边缘区，所述第二柔性电路板搭接至所述边缘区。
  16. 根据权利要求13所述的显示设备，其中，所述边缘绑定区还设有第二 导电引线，所述显示驱动芯片通过所述第二导电引线电连接至所述第一柔性电路板，所述第一导电引线与所述第二导电引线错开。
  17. 根据权利要求10所述的显示设备，其中，所述显示面板还包括光学胶层，所述触控面板通过所述光学胶层与所述发光层固定连接。
  18. 根据权利要求17所述的显示设备，其中，所述第一柔性电路板通过异方性导电胶膜固定连接所述边缘绑定区，所述第二柔性电路板通过异方性导电胶膜固定连接所述边缘绑定区。
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