201145126 六、發明說明： 【發明所屬之技術領域】 本發明為一種觸控面板之製造方法，可以提升電容式觸控面板 製程良率’以及減少投射電容式觸控面板之製造程序和減少貼合 步驟。 【先前技術】 目前電容式觸控面板已經廣泛使用於各種電子產品之 上，使用上僅需以手指輕壓觸控面板即可閱讀資訊或輸入資訊， 可取代傳統電子裝置上的按鍵和鍵盤，為人類帶來便利性生活。 # 然而目鈾電容觸控技術可分為兩種，一種為表面電容式觸控技術 (Surface Capacitive)，另一種為投射電容式觸控技術(Pr〇jected Capacitive) 〇 電容式觸控技術是透過手指接觸觸控螢幕造成靜電場改變進201145126 VI. Description of the Invention: [Technical Field] The present invention is a method for manufacturing a touch panel, which can improve the process yield of the capacitive touch panel and reduce the manufacturing process and reduce the fit of the projected capacitive touch panel. step. [Prior Art] At present, capacitive touch panels have been widely used on various electronic products. In order to read information or input information by simply pressing the touch panel with a finger, it can replace the buttons and keyboard on the conventional electronic device. Bring convenience to human life. # However, the uranium capacitive touch technology can be divided into two types, one is the surface capacitive touch technology (Surface Capacitive), and the other is the projected capacitive touch technology (Pr〇jected Capacitive). Touching the touch screen with your finger causes the electrostatic field to change
^貞測’其巾單闕控電容式技術，就是表面f容摘控技術。 表面電容式技術架構較為單純，只需―面ITQ t巧層不雜殊感測通道設計，生產難度及成本都可降低i 作架構上’糸統會在ΙΊΌ層產生-個均勻電場 觸 :出現電容充電效應，面板上的透明電極=妾= 合，進而產生電容變化’控制n只要量測4 需進行校準工作，也得克服難解的面以=生=’但 尺寸手持設備設計。 寸過大，並不適合小 投射式電谷觸控面板為透過兩展 列，以建立均勻電場。使得人體在接"=直^ IT〇陣 電容之外，也會造成ΧΥ軸交會處J = 形成 有财用性高、漂移現象較表面式電容小等優點^且^ 201145126 電容式支援多點觸控技術將成為未來主流趨勢。 如第1圖和第2a圖所示’投射電容式觸控面板結構為將分別 鍍有X軸方向透明導電電極2G2之透明基板測和鐘有y軸方向 透明導電電極212透明基板21G以黏接層22G對貼而成，然後將 貼合好之感測結構以黏接層240黏貼於硬質透明基板260上，形 成filmMilm/硬質透明純之堆疊結構，其中硬質透明基板· 為成形強化玻璃、PC或PMMA，作為觸控面板外層之c〇ver比旧。 Film/film/硬質透明基板之結構複雜，製作上需要使用到兩層黏 貼層220、240，以及多道黏貼及對位手續，使得產品良率偏低。 並且投射電容式觸控面板之結構包含了兩層透明基板·、21〇、 兩層黏貼層22G、240以及硬質透明基板⑽，使得整 增加’不但造成透光度降低，也不符目前電子裝置尺寸輕^^ 之發展趨勢。 ,f i 2b圖所示，投射電容式觸控面板結構可將具有 明導電電極212製作於硬質透明基板26〇之上 為成形強化_。細湖_貼具有χ 260 電極202之透明基板2〇〇和具有y軸方向透明導電 質透明基板 26G ’ 形成 film/glass 之結構。 以及周邊線路280 a寺會面臨技術瓶頸。於硬質 ° 成X軸方向透明導電電極202之後要製作周】線上形 路與X軸方向透明導電電極^ 201145126 ^觸硬當 == 導^形的公差將使得透明 、/1遭線路280不易對位，而造成良率偏低。 和貼續Λ前仍需要人工對位以及貼合，因此多次對位^ 贞 ’ 其 巾 巾 巾 巾 巾 巾 巾 巾 巾 巾 巾 巾 巾 巾 巾 其 其The surface capacitive technology architecture is relatively simple, and only the “face ITQ t layer” does not have a different sensing channel design. The production difficulty and cost can be reduced. The architecture will be generated in the ΙΊΌ layer - a uniform electric field touch: Capacitor charging effect, the transparent electrode on the panel = 妾 = combined, and then the capacitance change 'control n as long as the measurement 4 needs to be calibrated, it also has to overcome the intractable surface to = raw = 'but the size of the handheld device design. The inch is too large for a small projected electric valley touch panel to pass through two exhibitions to create a uniform electric field. In addition to the body's connection, the body will also cause the advantages of high reliability, drift phenomenon and surface capacitance. ^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^ Touch technology will become the mainstream trend in the future. As shown in FIG. 1 and FIG. 2a, the projected capacitive touch panel structure is such that the transparent substrate measuring the transparent conductive electrode 2G2 coated with the X-axis direction and the transparent conductive electrode 212 of the transparent conductive electrode 212 are bonded to the y-axis direction. The layer 22G is pasted, and then the bonded sensing structure is adhered to the rigid transparent substrate 260 by the adhesive layer 240 to form a film Milm/hard transparent pure stack structure, wherein the hard transparent substrate is formed tempered glass, PC Or PMMA, as the outer layer of the touch panel c〇ver than the old. The structure of the Film/film/hard transparent substrate is complicated. Two layers of adhesive layers 220 and 240 are required for the production, and multiple adhesive and alignment procedures are required to make the product yield low. The structure of the projected capacitive touch panel comprises two transparent substrates, 21 〇, two adhesive layers 22G, 240 and a rigid transparent substrate (10), so that the overall increase not only reduces the transmittance, but also does not meet the current electronic device size. Light ^^ development trend. As shown in the figure f 2 2b, the projected capacitive touch panel structure can have the conductive conductive electrode 212 formed on the rigid transparent substrate 26A as a form strengthening_. The fine lake _ is attached to the transparent substrate 2 电极 of the 260 electrode 202 and the transparent conductive substrate 26G ′ having the y-axis direction to form a film/glass structure. And the surrounding line 280 a temple will face technical bottlenecks. After the hard conductive phase is formed into the X-axis direction, the conductive electrode 202 is to be fabricated. The on-line shape and the X-axis direction transparent conductive electrode ^ 201145126 ^The hard touch == The tolerance of the guide will make the transparent, /1 line 280 difficult to Bit, resulting in low yield. And the need for manual alignment and fit before the continuation, so multiple alignments
下將使付傳統多次人工對位貼合之製程穩定度遭受極大ί驗切 【發明内容】 觸 控面明容式. 有====括，提 :ί: ίί3:ί面分別具有邊緣，邊緣位於上表面ΐϊί Ϊ 表面，包括基材之上表面和下 有金以 上端子綠踗知ΤΓ㈣7 &第—感測串列、上端子線路和下端子绫政， 複數第二感測串列和;复連苎軟性電路板’其中 子線路分別連接複數第-i測心線路和 及移除位於複數第-感_】和複數第二_串歹；屬列層以 201145126 ,、為達成上述之目的，本發明之觸控面板的製造方法包括，於 ，，複數制結構於上表面和下表面之後更包括形録著層於複 數感測結構之上，鎌裁城蓋有黏著層於複減測結構之上之 可饒式透明基材，形成複數片狀感測基材。 為^^上狀目的’本發明之馳面板的製紗法包括，形成 ΪΪΞΐ測基材之後更包括以黏著層黏著硬質透明基板於每一 片狀感測基材。 ίϊΐϊΐ目的’本發明之觸控面板的製造方法包括，於 構於上表面和下表面之後更包括：形成黏著層於 吉勒;形成抗干擾層於黏著層之上；以及裁切覆蓋 於複數感測結構之上之可繞式透明基材，形 成複後的製=法包括，形 -片狀感測紐。 。括黏耆層黏著硬f透明基板於每 護層於複數_結構之上。表面之錢包卿姐明絕緣保 提 201145126 =則；形成複數感測結構於可饒式透明基材之上表面 成導電層於上表面和下表面；形成金屬層於透明導 曰之上，圖案化金屬層，於上表面和下表面之邊緣 ’ 端子線路和下端子線路；以及圖案化透明導電層，於上 ^面，形成複數第-感勝串列和複數第二感測串列，^ 苐一感測串列和複數第二感測串列相互交錯，上 路和下端子線路峨接複 數感測^構之上，紐裁城蓋有轉層於複數_ 、 可饒式透明基材，形成複數片狀感測基材。"、 為達成上述之目的，本發明之觸控面板的製造方 紐讀找細料雜輕紐縣板於每 為達成上述之目的，本發明之觸控面板的製造方 形成複數感測結構於上表面和下表面之後更包括： ； 形成黏著層於複數感測結構之上； 形成抗干擾層於黏著層之上；以及 裁切覆蓋有黏著層和抗干擾層於複數感測 明基材，形成複數片狀感測基材。 稱之上之了^式透 為達成上述之目的》本發明之觸批而技杂丨、& i 成複數片狀感測基材之後更包括以黏|層黏著石二透;5於： -片狀感測基材。 以負边明基板於母 法包括，於 為達成上述之目的’本發明之觸控面板的製造方 201145126 形成複數感測結構於上表面和下表^ ^ 護層於複數制結構之上。i mu胁麟明絕緣保 =成^述之目的，本發明之觸控面板的製造方法包括，更 ^基$ f 數感測結構之可饒式透明基材，形成複數片狀感 成複ίΐίίΐΐΐ':本發明之觸控面板的製造方法包括，形 錢包姆著硬f翻基板於每-片狀感 供可12:=上===製造方法包括，提 二，上表面和下表面分別具有邊緣:邊緣 ί於觀域面和下絲，包括：軸透明導電 择、协h本以义，圖案化位於上表面和下表面之透明導電 ^於上絲和下絲分卿成複數 導 第一感測串列和複數第二感:串 =金屬！於透明導電層之上；以及圖案化金屬層，形“子 ，路和下端子線輕邊緣咖連接紐電路板，上端 端j線路分別連接複數第—感測串列與複數第二感列 黏著層於複數感測結構之上。 心' 丨，形成 為達成上述之目的，本發明之觸控面板的製造方 構ΐ上表面和下表面之後更包括形成黏著層於複 數感測、，Ό構之上，紐裁切覆蓋雜著層 可饒式透材，形成複數片狀感測基材。 構之上之 為達成上述之目的’本购之觸控面板的製造方 複數片狀感·材之後更包括以㈣層黏著㈣透明基^於每^ 201145126 片狀感測基材。 ,、、:，，、達成上述之目的，本發明之觸控面板的製造方法包括，於 形成複數感測結構於上表面和下表面之後更包括： 形成黏著層於複數感測結構之上； 形成抗干擾層於黏著層之上；以及 裁切覆蓋有黏著層和抗干擾層於複數麵結構之上之可餘式透 明基材，形成複數片狀感測基材。 為達奴上述之目的，本發明之觸控面板的製造方法包括，形 鲁成複數片狀感測基材之後更包括以黏著層黏著硬質透明基板 一片狀感測基材。 ，於 緣保 ，為達成上述之目的，本發明之觸控面板的製造方法包括 形成複數感測結構於上表面和下表面之後更包括形成透明絕 護層於複數感測結構之上。 為達成上述之目的，本發明之觸控面板的製造方法包括，形 成抗反射層於透明絕緣保護層之上。 /The following will make the process stability of traditional multiple manual alignments suffer greatly. [Summary] The touch surface is clear. There are ==== brackets, mention: ί: ίί3: ί faces have edges respectively The edge is located on the upper surface ΐϊί Ϊ surface, including the upper surface of the substrate and the lower terminal with gold or more. (4) 7 & the first sensing series, the upper terminal line and the lower terminal, the second sensing series And; 苎 苎 苎 苎 ' 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中The method for manufacturing the touch panel of the present invention includes, after the plurality of structures are formed on the upper surface and the lower surface, further comprising recording the layer on the plurality of sensing structures, and the embossed city cover has an adhesive layer on the complex The retractable transparent substrate on the structure is reduced to form a plurality of sheet-shaped sensing substrates. The method of making a panel of the present invention includes forming a test substrate and further comprising adhering a hard transparent substrate to each of the sheet-like sensing substrates with an adhesive layer. The method for manufacturing the touch panel of the present invention includes, after being configured on the upper surface and the lower surface, further comprising: forming an adhesive layer on Giller; forming an anti-interference layer on the adhesive layer; and cutting to cover the plurality of senses The wraparound transparent substrate on the structure is formed, and the formed method includes a shape-sheet sensing button. . The adhesive layer is adhered to the hard f transparent substrate on each of the layers above the complex structure. Surface wallet Qingjie Ming insulation Baotou 201145126 = then; forming a complex sensing structure on the surface of the transparent transparent substrate into a conductive layer on the upper surface and the lower surface; forming a metal layer on the transparent guide, patterned a metal layer on the edges of the upper and lower surfaces' terminal line and lower terminal line; and a patterned transparent conductive layer on the upper surface to form a plurality of first-sense series and a plurality of second sensing series, ^ 苐A sensing series and a plurality of second sensing series are interlaced, and the upper and lower terminal lines are connected to the plurality of sensing structures, and the new layer of the city cover has a layer of _, a transparent transparent substrate, forming A plurality of sheet-like sensing substrates. ", in order to achieve the above purpose, the manufacturing method of the touch panel of the present invention reads the fine material and the material of the New Zealand plate. For each of the above purposes, the manufacturing of the touch panel of the present invention forms a complex sensing structure. After the upper surface and the lower surface, the method further comprises: forming an adhesive layer on the plurality of sensing structures; forming an anti-interference layer on the adhesive layer; and cutting the adhesive layer and the anti-interference layer on the plurality of sensing substrates; A plurality of sheet-like sensing substrates are formed. The above-mentioned purpose is to achieve the above-mentioned purpose. The invention of the invention is a trick, and the i-shaped multi-slice sensing substrate further comprises a sticky layer of adhesive; - Sheet sensing substrate. In the method of manufacturing the touch panel of the present invention for the above-mentioned purpose, the manufacturing method of the touch panel of the present invention 201145126 forms a complex sensing structure on the upper surface and the lower surface of the protective layer on the complex structure. i mu 麟 明 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘': The manufacturing method of the touch panel of the present invention comprises: forming a wallet with a hard f-turning substrate in a per-sheet-like sense 12:==== manufacturing method includes, mentioning, the upper surface and the lower surface respectively have Edge: edge ί on the viewing surface and the lower wire, including: axis transparent conductive selection, co-h, meaning transparent, transparent on the upper surface and the lower surface. Sensing the serial and plural second sense: string = metal! Above the transparent conductive layer; and the patterned metal layer, the shape "sub, road and lower terminal line light edge coffee connection circuit board, the upper end j line is connected to the plural number - the sensing series and the plural second sense The layer is formed on the complex sensing structure. The core is formed to achieve the above purpose, and the manufacturing of the touch panel of the present invention further comprises forming an adhesive layer on the upper surface and the lower surface, and forming the adhesive layer. On the top, the new layer cuts the hybrid layer to form a plurality of sheet-shaped sensing substrates. The above-mentioned purpose is to achieve the above-mentioned purpose. Then, the method further comprises the steps of: (4) transparently bonding the substrate to the substrate, and the method for manufacturing the touch panel of the present invention comprises: forming a complex sensing After the upper surface and the lower surface, the structure further comprises: forming an adhesive layer on the plurality of sensing structures; forming an anti-interference layer on the adhesive layer; and cutting the adhesive layer and the anti-interference layer on the plurality of surface structures Residual transparent base Forming a plurality of sheet-shaped sensing substrates. For the purpose of the above, the method for manufacturing the touch panel of the present invention comprises: forming a plurality of sheet-shaped sensing substrates and further comprising adhering a hard transparent substrate with an adhesive layer. In order to achieve the above object, the manufacturing method of the touch panel of the present invention comprises forming a plurality of sensing structures on the upper surface and the lower surface, and further comprising forming a transparent insulating layer on the plurality of sensing layers. Above the structure, in order to achieve the above object, the method of manufacturing the touch panel of the present invention comprises forming an anti-reflection layer on the transparent insulating protective layer.
為達从上述之目的，本發明之觸控面板的製造方法包括，更 ^裁切具有減❹彳轉之可饒式翻紐，形紐數片狀 測某。 w 為達成上述之目的’本發明之觸控面板的製造方法包括， ，數片狀感測基材之後更包括黏著硬質透明基板於每—片狀 基材之上。 【實施方式】 本發明為-種觸控面板的製造方法，該方法可以減少投射 201145126 電容式觸控面板之製造程序和減少貼合步驟。In order to achieve the above object, the manufacturing method of the touch panel of the present invention includes, for example, cutting a rollable button having a reduced turn and a shape of a number of plates. In order to achieve the above object, the manufacturing method of the touch panel of the present invention includes, after the plurality of sheet-shaped sensing substrates, further comprising adhering a hard transparent substrate to each of the sheet-like substrates. [Embodiment] The present invention is a method for manufacturing a touch panel, which can reduce the manufacturing process of the projection 201145126 capacitive touch panel and reduce the bonding step.
如第3a圖至第3e圖所示，俜A 面板的製造方法之示意圖。如第明之；^施例所提供觸控 ，具有上表面301和下^2提供可饒式透明基材 對設置，上矣而if面302上表面301和下表面302相 分別位於上==2 有邊緣舶，邊緣3⑽ 為可饒曲之材質所構成，。可饒式透明基材300 一，也可為上述材質之多^复1^^式破璃、醜、PC或PI之 籲*多層之透明堆疊、，述材質之上亦可形成 反射層。然後形成複數❹^士椹=曰之透明堆疊結構例如可為抗 上表面30】和下^102 示)於可鏡式透明基材之 形成透明導電層310於可構3〇之形成方法包括： 面3〇2，其中透明導電層了3f〇t月基^上表面則和下表 銦、氧化鋅、氧化銦鋅、摻雜有. :為銦錫乳化物、氧化 化錫中之-或魏合物。再形、以及摻雜有銻之氧 上’其中金屬層320之結構可於透明導電層31〇之 • ί電其中導電金屬層之材質可者:層 1呂、銅、轉導電金屬或導電合全。1呂合金、金、 ，如^目層__之堆疊結構或^结構， 質而堆疊之多層導電金屬層合金之-種或多種材 沉積(p狗錢轉動目相 :上表面301和下第表‘：【金道黃光製程，將位 膜光阻。祕進行糊步驟θ ，胃可為液,¾光阻或乾 味除未文光阻層330保護之金 ^ Γ C 1 201145126 屬層320和透明導電層31〇，以及去除圖案化光阻層33〇，而形成 具有金屬層320於其上之複數第一感測串列311、具有金屬層32〇 於其上之複數第二感測串列312、上端子線路321和下端^線路 322。再移除位於複數第一感測串列311和複數第二感測串列μ〕 •^之金屬層32G ’如第3e ffi所示為由上表面向下俯視之俯視圖。As shown in Figures 3a to 3e, a schematic diagram of the manufacturing method of the 俜A panel. As shown in the above; the touch provided by the embodiment has an upper surface 301 and a lower surface 2 to provide a transparent transparent substrate pair arrangement, and the upper surface 301 and the lower surface 302 of the if surface 302 are respectively located on the top == 2 There are edge ships, and the edge 3 (10) is made of a material that can be made. The transparent transparent substrate 300 can also be a transparent stack of multiple layers of the above materials, such as multiple layers, ugly, PC or PI, and a reflective layer can also be formed on the material. Then, a transparent stacking structure of a plurality of ❹ 椹 椹 曰 曰 例如 例如 例如 例如 例如 例如 例如 例如 于 于 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可Surface 3〇2, in which the transparent conductive layer is 3f〇t month base ^ upper surface and the following table indium, zinc oxide, indium zinc oxide, doped with: indium tin emulsion, tin oxide - or Wei Compound. Reshaped, and doped with yttrium on the 'the structure of the metal layer 320 can be in the transparent conductive layer 31 电 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 层 层 层 层 层 层 层 层 层 层 层 层 层 层 层all. 1Lu alloy, gold, such as stacking structure or ^ structure of the layer __, stacked and multilayered conductive metal layer alloy - seed or a variety of material deposition (p dog money rotating the eye: upper surface 301 and next Table ': [Jindao Huangguang process, will be the film photoresist. Secret paste step θ, stomach can be liquid, 3⁄4 photoresist or dry taste except the unprotected photoresist layer 330 protection of gold ^ Γ C 1 201145126 genus 320 and the transparent conductive layer 31〇, and removing the patterned photoresist layer 33〇, forming a plurality of first sensing series 311 having the metal layer 320 thereon, and a plurality of second senses having the metal layer 32 thereon The serial array 312, the upper terminal line 321 and the lower terminal line 322 are removed. The metal layer 32G' located in the plurality of first sensing series 311 and the plurality of second sensing series μ] is removed as shown in FIG. 3e ffi A top view that is viewed from the upper surface down.
數第-感測串列311位於上表面3〇1之上，複數第二感測 串列312位於下表面之上，每一第一感測串列311沿一第一方向 D1延伸，複數第二感測串列312沿一第二方向D2延伸。複數 -^則串，311和複數第二感測㈣312相互交錯。上端子線路 和下端子線路332分別位於上表面301和下表面3〇2之邊缘 。上端子線路331和下端子線路332供連接軟性電路板（益圖 不），並且上端子線路331電性連接複數第一感測串列311， 子線路332電性連接複數第二感測串列312。 第3f圖係沿第3e圖之剖線a—a’所緣示之剖面圖。如第％ 圖:广上述製程步驟所形成複數感測結構30於可饒 列311與複數第二感測㈣312相互交錯排列me 350於上表㈣或下表面3〇2之複數感測結構％ =成== f ί上表面301和下表面302之複數感測結構30 t f此只把例為黏者層350形成於上表面301矛口下表面302 之複數感測結構30之上，如第3g圖所示。其中黏著層之 膠、水膠或光學夥。接著如第^圖所示， H H _ 36G可黏貼於位於上表面· ίο 貼於位於下表面302之下的黏著層 ” _更貝透月基板360之材質可為破璃、強化破 膠’用以保護感麵構。所形成之觸控面板結_較於先前技術 201145126 抝;且=====， 光製程中因為成形強化玻璃之公差造成 =減夕頁 ^第4a ^示’係為本發明之—實_所提供觸控面板的 iStrr形成複數感測結構40於饒式透明基材40〇之 3面4〇和下表面402後，再形成透明絕緣保護層490覆^ 數感測結構4G之上’以及不具有感測結構4Q之可 400之上’僅於端子線路與紐電路板電 土 無透明絕緣紐層覆蓋。透魏緣保護層 =ΓΓ2)、有機絕緣材質、無機絕緣材質或光阻，光阻例夂 ，，、、n阻或細光阻’對雜止_結叙水氣人侵 =相當優異。接著再形成抗反射層491於透明絕緣保護層· 之上，抗反射層491之材質例如可為Ti 透明材質。抗反射層491可為Ti〇2層、s === 式透於可饒 有黏著層450之抗干擾層44〇於位於下 < $括形成具 40，以黏著層450覆蓋位於 〇、 ，複數感測結構 (趣)。抗干擾層44。之材f可為透 磁干擾 化物、氧化銦、氧化鋅、氧化銦鋅、二為= 201145126 雜有銻之氧化錫中之一或其混合物。接著將具有覆蓋有透明絕緣 保護層49G、抗干擾層440和黏著層450之複數感測結構4〇之可 饒式透明基板400裁切，形成複數片狀感測基材(無圖示）。再將每 一片狀感測基材以位於上表面401之黏著層450黏著於硬質透明 基板。其中硬質透明基板之材質可為玻璃、強化玻璃或硬質塑膠， 用以保護感測結構。 、/ 本發明之-實關所提供觸控面板的製造方法，The number-sensing series 311 is located above the upper surface 3〇1, and the plurality of second sensing series 312 are located above the lower surface, and each of the first sensing series 311 extends along a first direction D1, the plurality of The second sensing series 312 extends in a second direction D2. The complex -^ then string, 311 and the complex second sense (four) 312 are interleaved. The upper terminal line and the lower terminal line 332 are located at the edges of the upper surface 301 and the lower surface 3〇, respectively. The upper terminal line 331 and the lower terminal line 332 are connected to the flexible circuit board (Yutu), and the upper terminal line 331 is electrically connected to the plurality of first sensing series 311, and the sub-line 332 is electrically connected to the plurality of second sensing series. 312. Fig. 3f is a cross-sectional view taken along line a-a' of Fig. 3e. As shown in the %th figure: the complex sensing structure 30 formed by the above process steps is interleaved with the plurality of second sensing (four) 312, and the complex sensing structure of the upper surface (4) or the lower surface 3〇2 is % = The complex sensing structure 30 tf of the upper surface 301 and the lower surface 302 is formed on the plurality of sensing structures 30 of the lower surface 302 of the upper surface 301, such as the 3g. The figure shows. Among them, glue, glue or optics of the adhesive layer. Then, as shown in FIG. 2, HH _ 36G can be adhered to the adhesive layer located on the upper surface and ί affixed under the lower surface 302 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The touch panel is formed according to the prior art 201145126 且; and =====, due to the tolerance of the formed tempered glass in the optical process = 减 页 page ^ 4a ^ show ' The iStrr of the touch panel provided by the present invention forms a complex sensing structure 40, and then forms a transparent insulating protective layer 490 over the surface of the Rao transparent substrate 40. Above the structure 4G 'and above the 400 without the sensing structure 4Q', only the terminal line and the circuit board of the circuit board are covered with no transparent insulating layer. The transparent edge protection layer = ΓΓ 2), organic insulating material, inorganic insulation Material or photoresist, photoresist example,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, The material of the anti-reflection layer 491 can be, for example, a Ti transparent material. The anti-reflection layer 491 can be a Ti 2 layer, s === The anti-interference layer 44 of the adhesive layer 450 is placed at the bottom of the lower layer < $ 形成形成40, with the adhesive layer 450 covering the 〇, , and the complex sensing structure (interest). The anti-interference layer 44 The material f may be one of magnetic permeability interference, indium oxide, zinc oxide, indium zinc oxide, or the like, or a mixture thereof, which is covered with a transparent insulating protective layer 49G. The interference sensing layer 440 and the plurality of sensing structures 4 of the adhesive layer 450 are cut to form a plurality of sheet sensing substrates (not shown). Each of the sheet sensing substrates is located The adhesive layer 450 of the upper surface 401 is adhered to the rigid transparent substrate. The material of the hard transparent substrate may be glass, tempered glass or hard plastic to protect the sensing structure. Production method,
^測，構於可饒式明基材之後，裁切具有複數制結構之可 透明基材’形成複數片狀感測基材，接著黏著 = =黏者層，其材質可為壓克力膠、 黏耆層可先形成於硬質透明基板之上或者可饒式透明^材⑽上膠 ㈣ίί明之-實_ 觸控面板賴造方法，包括：餘 i Sf材矣具有上表面和下表面，上表面和下表面相對:: 側。可饒式透明基材為可饒曲之材質戶^ 面和下表面- 可饒式透縣狀材_如可為ΡΕΝ ==捲峰袞筒狀。 PMMA、PC或ρ丨之一，也可為 ，T、PES、可饒式破璃、 質之上亦可形成有多層之透明堆复合f料’而前述材 其混合物。形成金屬層於透明導 1有錄之氧化錫t之-或 之材質可為鋼合金、銘合】S層f電金屬層。射導電金屬層 導電合金。多層導電金屬層之，‘ “、銅、銷等導電金屬或 叠結構，或者可為選自銅合金I銘、可為鉬層/紹層/鉬層之堆 U金、銀、紹、銅、鎖等After measuring the substrate, the transparent substrate having a plurality of structures is cut to form a plurality of sheet-shaped sensing substrates, followed by adhesion = = adhesive layer, which is made of acrylic glue, The adhesive layer may be formed on the hard transparent substrate or may be coated on the transparent transparent material (10). (4) ί ί - - - - - - - - - - - - - - - - - - - - - - - - - - - - Opposite the lower surface:: Side. The retractable transparent substrate is a material that can be used for the rubbing of the surface and the lower surface - the material of the county can be _ 如 如 = = = 卷 衮 = == One of PMMA, PC or ρ丨 may also be a mixture of T, PES, and granules, and a plurality of transparent composite composite materials may be formed thereon. The material forming the metal layer in the transparent guide 1 may be a steel alloy or a metal layer of the S layer. Conductive metal layer Conductive alloy. Multi-layer conductive metal layer, '", copper, pin, etc. conductive metal or stacked structure, or may be selected from the group consisting of copper alloy I, may be molybdenum layer / layer / molybdenum layer U gold, silver, Shao, copper, Lock, etc.
SJ 14 201145126 —種或多種材質而堆4之多層導電金屬層 ―積氣化學氣相沉積 筮-π、ΒΙ+、表面和下表面分別形成複數第—碭測串尹丨釦；^叙 層表itir之邊緣分別形月ΐΐ r感測=子_線：= 第:=與複數 感錯之上^^ 以黏著層黏著材。《及 基板之材f可為_、触_或硬f 月 饒式實有m提/m面板的製造方法，包括：提供可 可饒式透明基材為可饒曲材暂、士表面和下表面-側。 =透明基材之材_如可為_、=’^;^曲=袞筒狀。可 :c或Ρί之-，也可為上述材質之多層麵、 和二=;式透明基材= 導電層之材質，例如可為銦錫氧化物、下ΐ面，其中透明 辞、摻雜有銘之氧化鋅、以及推雜 ，、乳化鋅、氧化銦 ΐ透:圖案化位於:ί面 相互交錯。再形成金屬二复5日，4:=和;=二感測串列 可為至少-層導電金屬層，或者多層i電金屬層·: 15 201145126 層之材質可為銅合金、is合金、金、銀、紹、銅、錮 ί 構，例如可為鉬層_/鉬層之 堆宜、洁構，或者可為選自銅合金、鋁合金、金、 等導電金屬或導電合金之-種或多種材f而堆疊之多層 層結構。導電金屬層多為使用物理氣相沉積(PVD)或是 積(CVD) ’沉積速率快且製程穩定。以及圖案化該金屬層，开= 端子線路和下端子線路於邊緣以供連接軟性電路板，上^“2 ΐϊ!ί明基板於每一片狀感測基材。其中硬質透明基J反之:ΐ 可為玻璃、強化玻璃或硬質塑勝，用以保護感測結構。 、 雖然本發明已以實施例揭露如上，然其並非用 明。任^熟習此技藝者’在謂離本發明之精神和範上 ^作些許之更動與潤飾，因此本發明之保護範 二 範圍所界定者為準。 曱明專利 【圖式簡單說明】 =1圖、第2a®和2b®所示為習知之投射f容式 ^ 3a圖至第5b圖為本發明之—實施例之觸控面板之^ Ϊ3示ii發明之一實施例之觸控面板之俯視圖 ί f =不ft明之一實施例之觸控面板之仰視圖 發明之—實施例之觸控面板之剖面圖 ί Λ明之一實施例之觸控面板之俯視圖 ⑼==二板：面圖 第釣圖所不為本發明之—實施例之觸控面板之 第4a圖和第4b圖所示為本發明之一實施例之觸控面:反之剖面 201145126SJ 14 201145126—Multilayer conductive metal layer of one or more materials and stack 4—gas chemical vapor deposition 筮-π, ΒΙ+, surface and lower surface respectively form a complex number—砀 串 串 丨 ; ; ;; The edge is shaped like a crescent. r Sensing = sub_line: = No.: = and the complex number is above the ^^ to adhere the layer. "The substrate material f can be _, touch _ or hard f 饶 式 实 实 实 实 m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m . = material of transparent substrate _ can be _, = '^; ^ 曲 = 衮 cylindrical shape. Can be: c or Ρί -, can also be the multi-layer of the above materials, and two =; transparent substrate = material of the conductive layer, for example, can be indium tin oxide, squat surface, which is transparent, doped with Ming Zinc oxide, and push-mix, emulsified zinc, indium oxide immersion: the pattern is located at: ί face interlaced. The metal is further formed for 5 days, 4:= and; = 2 sense series can be at least - layer of conductive metal layer, or multilayer i-metal layer · 15 201145126 The material of the layer can be copper alloy, is alloy, gold , silver, sho, copper, 锢, for example, may be a molybdenum layer _ / molybdenum layer stack, clean, or may be selected from copper alloys, aluminum alloys, gold, and other conductive metals or conductive alloys or A multi-layer structure in which a plurality of materials f are stacked. Most of the conductive metal layers use physical vapor deposition (PVD) or product (CVD). The deposition rate is fast and the process is stable. And patterning the metal layer, the open = terminal line and the lower terminal line are at the edge for connecting the flexible circuit board, and the upper substrate is on each of the sheet sensing substrates. The hard transparent base J is opposite: ΐ may be glass, tempered glass or hard plastic to protect the sensing structure. Although the invention has been disclosed above by way of example, it is not intended to be exhaustive. And Fan Shang ^ make some changes and refinements, so the scope of the protection scope of the present invention is defined. 曱明专利 [Simple diagram description] =1 diagram, 2a® and 2b® show the conventional projection f </ RTI> </ RTI> </ RTI> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> FIG. 1 is a cross-sectional view of a touch panel of an embodiment. FIG. 9 is a top view of a touch panel according to an embodiment. (9)==two-board: the top view is not the touch panel of the present invention. 4a and 4b are diagrams showing an embodiment of the present invention Face: the contrary sectional 201,145,126
【主要元件符號說明】 D1 第一方向 ’ D2 第二方向 30、40 感測結構 300、 400可饒式透明基材 301、 401 上表面 302、 402 下表面 303 邊緣 310透明導電層 320金屬層 321 上端子線路 322下端子線路 330光阻層 350、450黏著層 360硬質透明基板 311 複數第一感測串列 312 複數第二感測串列 370複數片狀感測基材 440抗干擾層 490透明絕緣保護層 491 抗反射層[Main component symbol description] D1 First direction 'D2 Second direction 30, 40 Sensing structure 300, 400 Reproducible transparent substrate 301, 401 Upper surface 302, 402 Lower surface 303 Edge 310 Transparent conductive layer 320 Metal layer 321 Upper terminal line 322 lower terminal line 330 photoresist layer 350, 450 adhesive layer 360 rigid transparent substrate 311 plural first sensing series 312 plural second sensing series 370 plural sheet sensing substrate 440 anti-interference layer 490 transparent Insulation protection layer 491 anti-reflection layer