TWI459269B - Manufacturing method of touch panel - Google Patents
Manufacturing method of touch panel Download PDFInfo
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- TWI459269B TWI459269B TW100119924A TW100119924A TWI459269B TW I459269 B TWI459269 B TW I459269B TW 100119924 A TW100119924 A TW 100119924A TW 100119924 A TW100119924 A TW 100119924A TW I459269 B TWI459269 B TW I459269B
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本發明為一種觸控面板結構及其製造方法,用以改良傳統電容式觸控面板複雜的製程,且可以提升電容式觸控面板製程良率,以及減少投射電容式觸控面板之製造程序。The invention relates to a touch panel structure and a manufacturing method thereof, which are used for improving the complicated process of the conventional capacitive touch panel, and can improve the process yield of the capacitive touch panel and reduce the manufacturing process of the projected capacitive touch panel.
按,目前坊間之觸控面板(Touch Panel)的觸控輸入方式,包括有電阻式、電容式、光學式、電磁感應式、音波感應式等;其中,電阻式及電容式是藉由使用者以手指或感應筆對面板表面進行觸碰,而於受觸碰位置的面板內部產生電壓及電流的變化,據以偵測出面板表面接受觸碰的位置,以達到觸控輸入的目的。According to the current touch panel input mode, including resistive, capacitive, optical, electromagnetic induction, sonic induction, etc.; Touching the surface of the panel with a finger or a sensor pen, and generating a change in voltage and current inside the panel subjected to the touched position, thereby detecting the position at which the panel surface is touched to achieve the purpose of touch input.
且知,為了要偵測出使用者以手指或感應筆觸碰於觸控板上之位置,業者研發出各種不同之電容式觸碰感測結構。例如單層架橋式觸控結構,其中架橋導線係為金屬材質製成,為了避免影響外觀品質,會在架橋導線表面覆蓋一抗反射膜層以降低金屬之反射效果,通常是將製程中之光阻保留於架橋導線表面,但需要多一個步驟將金屬金手指供接FPC處之光阻去除。一般製程方式是光阻形成架橋圖案後進行蝕刻,產生架橋,再去光阻。然後再形成一層光阻,經過曝光顯影,形成圖案化光阻,在架橋導線上留下光阻,上述製程為繁複。Moreover, in order to detect that the user touches the position on the touch panel with a finger or a sensor pen, the manufacturer has developed various capacitive touch sensing structures. For example, a single-layer bridge type touch structure, wherein the bridge wire is made of metal material, in order to avoid affecting the appearance quality, an anti-reflection film layer is covered on the surface of the bridge wire to reduce the reflection effect of the metal, usually the light in the process The resistance remains on the surface of the bridge wire, but an additional step is required to remove the photoresist from the metal finger to the FPC. The general process is to form a bridge pattern after the photoresist is formed, to create a bridge, and then to remove the photoresist. Then, a layer of photoresist is formed, and after exposure and development, a patterned photoresist is formed to leave a photoresist on the bridge wire, and the above process is complicated.
本發明之目的在於提供一種觸控面板之製造方法,用以提升電容式觸控面板製程良率,以及減少投射電容式觸控面板之製造程序。An object of the present invention is to provide a method for manufacturing a touch panel, which improves the process yield of the capacitive touch panel and reduces the manufacturing process of the projected capacitive touch panel.
為達成上述之目的,本發明之觸控面板的製造方法,包括:提供透明基材。形成透明導電層於透明基材之上。形成第一金屬層於透明導電層之上。圖案化第一金屬層和透明導電層,形成具有第一金屬層於其上之複數個第一感測串列、複數個第二感測墊、端子線路和複數接點,複數第一感測串列分別具有複數第一感測墊和複數第一橋接線,複數第一感測墊以陣列方式排列,複數第一橋接線於第一方向電性連接相鄰之每一第一感測墊,複數第二感測墊以陣列方式排列,複數第二感測墊與複數第一感測墊相互交錯,各接點透過端子線路分別與複數第一感測串列和複數第二感測墊連接。去除位於複數第一感測串列和複數第二感測墊上之第一金屬層。形成絕緣層於第一金屬層和透明導電層之上。圖案化絕緣層,形成複數個絕緣墊。形成第二金屬層於絕緣層之上。形成圖案化光阻層於第二金屬層之上。蝕刻第二金屬層,形成具有光阻層於其上之複數第二橋接線,和曝露出複數接點,其中複數第二橋接線與複數第一感測串列分別由複數絕緣墊電性絕緣,且複數第二橋接線與於第二方向相鄰之複數第二感測墊電性連接形成複數第二感測串列,複數接點透過端子線路分別與複數第一感測串列和複數第二感測串列連接,複數接點供連接軟性電路板。To achieve the above object, a method of manufacturing a touch panel of the present invention includes: providing a transparent substrate. A transparent conductive layer is formed over the transparent substrate. A first metal layer is formed over the transparent conductive layer. Patterning the first metal layer and the transparent conductive layer to form a plurality of first sensing series, a plurality of second sensing pads, terminal lines and a plurality of contacts having the first metal layer thereon, the plurality of first sensing The serial array has a plurality of first sensing pads and a plurality of first bridge wires, the plurality of first sensing pads are arranged in an array manner, and the plurality of first bridge wires are electrically connected to each of the adjacent first sensing pads in the first direction The plurality of second sensing pads are arranged in an array manner, and the plurality of second sensing pads and the plurality of first sensing pads are interlaced, and each of the contacts is respectively connected to the plurality of first sensing series and the plurality of second sensing pads through the terminal lines connection. The first metal layer on the plurality of first sensing series and the plurality of second sensing pads is removed. An insulating layer is formed over the first metal layer and the transparent conductive layer. The insulating layer is patterned to form a plurality of insulating pads. A second metal layer is formed over the insulating layer. A patterned photoresist layer is formed over the second metal layer. Etching the second metal layer to form a plurality of second bridge lines having the photoresist layer thereon, and exposing the plurality of contacts, wherein the plurality of second bridge lines and the plurality of first sensing series are electrically insulated by the plurality of insulating pads And the plurality of second bridge wires are electrically connected with the plurality of second sensing pads adjacent to the second direction to form a plurality of second sensing series, and the plurality of contacts are respectively transmitted through the terminal lines and the plurality of first sensing series and the plurality The second sensing is connected in series, and the plurality of contacts are connected to the flexible circuit board.
為達成上述之目的,本發明之觸控面板的製造方法,其中第一金屬層和第二金屬層材質相異,並利用選擇性蝕刻將複數接點之第一金屬層上之第二金屬層移除;亦或者,可搭配使用不同蝕刻液進行選擇性蝕刻;再者,第一金屬層亦可為多層疊構,且於第一金屬層表面形成第二金屬層前使用離子束表面改質,再形成第二金屬層。In order to achieve the above object, a method for manufacturing a touch panel of the present invention, wherein the first metal layer and the second metal layer are made of different materials, and the second metal layer on the first metal layer of the plurality of contacts is selectively etched. Alternatively, or may be selectively etched using different etching solutions; further, the first metal layer may also be multi-layered, and the ion beam surface is modified before the second metal layer is formed on the surface of the first metal layer. And forming a second metal layer.
為達成上述之目的,本發明之觸控面板的製造方法,其中第二金屬層之厚度較第一金屬層為薄,並利用選擇性蝕刻將複數接點之第一金屬層上之第二金屬層移除。In order to achieve the above object, a method for manufacturing a touch panel of the present invention, wherein a thickness of the second metal layer is thinner than that of the first metal layer, and selectively etching the second metal on the first metal layer of the plurality of contacts Layer removal.
為達成上述之目的,本發明之觸控面板的製造方法,其中第一金屬層和第二金屬層為至少一層導電金屬層。To achieve the above object, a method of manufacturing a touch panel of the present invention, wherein the first metal layer and the second metal layer are at least one conductive metal layer.
為達成上述之目的,本發明之觸控面板的製造方法,其中第一金屬層和第二金屬層可以為銅合金、鋁合金、金、銀、鋁、銅、鉬等導電金屬或導電合金。To achieve the above object, the method for manufacturing a touch panel of the present invention, wherein the first metal layer and the second metal layer may be a conductive metal or a conductive alloy such as a copper alloy, an aluminum alloy, gold, silver, aluminum, copper, or molybdenum.
為達成上述之目的,本發明之觸控面板的製造方法,其中更包括於形成第二金屬層前使用離子束表面改質。In order to achieve the above object, the method for manufacturing a touch panel of the present invention further comprises using an ion beam surface modification before forming the second metal layer.
為達成上述之目的,本發明之觸控面板的製造方法,其中第一金屬層可為多層疊構,其中最上層為銅合金或鉬。In order to achieve the above object, a method of manufacturing a touch panel of the present invention, wherein the first metal layer may have a multi-layer structure, wherein the uppermost layer is a copper alloy or molybdenum.
為達成上述之目的,本發明之觸控面板的製造方法,其中第二金屬層為純銅。To achieve the above object, a method of manufacturing a touch panel of the present invention, wherein the second metal layer is pure copper.
為達成上述之目的,本發明之觸控面板的製造方法,其中透明基材可為可繞捲式透明基材、透明基板、玻璃、或塑膠。To achieve the above object, a method of manufacturing a touch panel of the present invention, wherein the transparent substrate can be a rollable transparent substrate, a transparent substrate, glass, or plastic.
為達成上述之目的,本發明之觸控面板的製造方法,其中圖案化絕緣層,更包括形成絕緣層於端子線路之上。To achieve the above object, a method of fabricating a touch panel of the present invention, wherein patterning the insulating layer further comprises forming an insulating layer over the terminal line.
為達成上述之目的,本發明之觸控面板的製造方法,其中圖案化絕緣層,更包括形成絕緣層於複數接點之上,且絕緣層覆蓋保護每一接點之周圍,露出每一接點部分之中心。To achieve the above object, the method for manufacturing a touch panel of the present invention, wherein the patterned insulating layer further comprises forming an insulating layer over the plurality of contacts, and the insulating layer covers the periphery of each contact to expose each connection. The center of the point section.
為達成上述之目的,本發明之觸控面板的製造方法,其中圖案化透明導電層包括:形成圖案化光阻層於透明導電層之上;蝕刻透明導電層,形成複數個第一感測串列和複數個第二感測墊;以及去除該圖案化光阻層。To achieve the above object, the method for manufacturing a touch panel of the present invention, wherein the patterning the transparent conductive layer comprises: forming a patterned photoresist layer on the transparent conductive layer; etching the transparent conductive layer to form a plurality of first sensing strings a column and a plurality of second sensing pads; and removing the patterned photoresist layer.
為達成上述之目的,本發明之觸控面板的製造方法,更包括:於圖案化導電層之後形成黏著層於感測結構之上,然後裁切覆蓋有黏著層於複數感測結構之上之可撓捲式透明基材,形成複數片狀感測基材;以及以黏著層黏著每一片狀感測基材於硬質透明基板。In order to achieve the above object, the method for manufacturing the touch panel of the present invention further comprises: forming an adhesive layer on the sensing structure after patterning the conductive layer, and then cutting the adhesive layer on the plurality of sensing structures; The flexible roll-type transparent substrate forms a plurality of sheet-shaped sensing substrates; and each of the sheet-shaped sensing substrates is adhered to the rigid transparent substrate by an adhesive layer.
為達成上述之目的,本發明之觸控面板的製造方法,更包括形成形成黏著層於可撓捲式透明基材之下表面;然後裁切覆蓋有黏著層於下表面之下之可撓捲式透明基材,形成複數片狀感測基材;以及黏著層黏著每一片狀感測基材於硬質透明基板。In order to achieve the above object, the manufacturing method of the touch panel of the present invention further comprises forming an adhesive layer on the lower surface of the flexible roll transparent substrate; and then cutting the flexible roll covered with the adhesive layer below the lower surface. a transparent substrate forming a plurality of sheet-shaped sensing substrates; and an adhesive layer adhering each of the sheet-shaped sensing substrates to the rigid transparent substrate.
為達成上述之目的,本發明之觸控面板的製造方法,更包括形成透明導電層於可撓捲式透明基材之下表面。To achieve the above object, the method for manufacturing a touch panel of the present invention further comprises forming a transparent conductive layer on a lower surface of the flexible roll transparent substrate.
為達成上述之目的,本發明之觸控面板的製造方法,更包括:形成透明絕緣保護層於感測結構之上。To achieve the above object, the method for manufacturing a touch panel of the present invention further comprises: forming a transparent insulating protective layer on the sensing structure.
為達成上述之目的,本發明之觸控面板的製造方法,更包括:形成抗干擾層於可撓捲式透明基材之下。To achieve the above object, the method for manufacturing a touch panel of the present invention further comprises: forming an anti-interference layer under the flexible roll transparent substrate.
為達成上述之目的,本發明之觸控面板的製造方法,更包括:形成抗干擾層於可撓捲式透明基材和透明導電層之間。To achieve the above object, the method for manufacturing a touch panel of the present invention further comprises: forming an anti-interference layer between the flexible roll transparent substrate and the transparent conductive layer.
請參考第1a圖至第1l圖,為本發明之一實施例所提供觸控面板之製造方法。如第1a圖所示,提供透明基材100,可為可繞捲式透明基材、透明基板、玻璃、或塑膠。其中透明基材100具有上表面101和邊緣103,邊緣103位於上表面101之一側。透明基材100為可撓曲之材質所構成,可以捲曲成滾筒狀。可撓捲式透明基材100之材質例如可為PEN、PET、PES、可撓式玻璃、PMMA、PC或PI之一,也可為上述材質之多層複合材料,而前述材質之上亦可形成有多層之透明堆疊結構之基材,多層之透明堆疊結構例如可為抗反射層。形成透明導電層110於上表面101,透明導電層110之材質例如可為銦錫氧化物、氧化銦、氧化鋅、氧化銦鋅、摻雜有鋁之氧化鋅、以及摻雜有銻之氧化錫中之一或其混合物。接著形成至少一第一金屬層120於透明導電層110之上,第一金屬層120之結構可為至少一層導電金屬層,或者多層導電金屬層。其中導電金屬層之材質可為銅合金、鋁合金、金、銀、鋁、銅、鉬等導電金屬或導電合金。多層導電金屬層之結構,例如可為鉬層/鋁層/鉬層之堆疊結構,或者可為選自銅合金、鋁合金、金、銀、鋁、銅、鉬等導電金屬或導電合金之一種或多種材質而堆疊之多層導電金屬層結構。導電金屬層多為使用物理氣相沉積(PVD)或是化學氣相沉積(CVD),沉積速率快且製程穩定。Please refer to FIGS. 1a to 11l, which illustrate a method of manufacturing a touch panel according to an embodiment of the present invention. As shown in Figure 1a, a transparent substrate 100 is provided which may be a rollable transparent substrate, a transparent substrate, glass, or plastic. The transparent substrate 100 has an upper surface 101 and an edge 103, and the edge 103 is located on one side of the upper surface 101. The transparent substrate 100 is made of a flexible material and can be curled into a roll shape. The material of the flexible roll type transparent substrate 100 may be, for example, one of PEN, PET, PES, flexible glass, PMMA, PC or PI, or may be a multilayer composite material of the above materials, and the above materials may also be formed. A substrate having a plurality of transparent stacked structures, the multilayer transparent stack structure may be, for example, an anti-reflective layer. Forming the transparent conductive layer 110 on the upper surface 101, the material of the transparent conductive layer 110 may be, for example, indium tin oxide, indium oxide, zinc oxide, indium zinc oxide, zinc oxide doped with aluminum, and tin oxide doped with antimony. One of them or a mixture thereof. Then, at least one first metal layer 120 is formed on the transparent conductive layer 110. The first metal layer 120 may be at least one conductive metal layer or a plurality of conductive metal layers. The material of the conductive metal layer may be a conductive metal or a conductive alloy such as a copper alloy, an aluminum alloy, gold, silver, aluminum, copper or molybdenum. The structure of the multi-layer conductive metal layer may be, for example, a stacked structure of a molybdenum layer/aluminum layer/molybdenum layer, or may be a conductive metal or a conductive alloy selected from the group consisting of copper alloy, aluminum alloy, gold, silver, aluminum, copper, molybdenum, and the like. A multi-layer conductive metal layer structure stacked with a plurality of materials. Most of the conductive metal layers use physical vapor deposition (PVD) or chemical vapor deposition (CVD), and the deposition rate is fast and the process is stable.
形成感測結構10於透明基材100之上表面101,如第1b圖及第1e圖所示,包括:進行第一道黃光製程,圖案化該第一金屬層120和透明導電層110,其中第一道黃光製程包括形成圖案化光阻層(具有複數光阻結構11)於第一金屬層120之上,其中光阻層之材質可為液態光阻或乾膜光阻。然後進行蝕刻步驟,蝕刻去除未受光阻結構11保護之第一金屬層120和透明導電層110,以及去除該圖案化光阻層,形成具有第一金屬層120於其上之複數個第一感測串列111、複數個第二感測墊1121、端子線路121和複數接點122,複數第一感測串列111分別具有複數第一感測墊1111和複數第一橋接線1112,複數第一感測墊1111以陣列方式排列,複數第一橋接線1112於第一方向D1電性連接相鄰之複數第一感測墊1111,複數第二感測墊1121以陣列方式排列,複數第二感測墊1121與複數第一感測墊1111相互交錯且相互包圍,端子線路121和該些接點122形成於邊緣103,各接點122透過端子線路121分別與複數第一感測串列111與複數第二感測墊1121電性連接。Forming the sensing structure 10 on the upper surface 101 of the transparent substrate 100, as shown in FIG. 1b and FIG. 1e, including: performing a first yellow light process, patterning the first metal layer 120 and the transparent conductive layer 110, The first yellow light process includes forming a patterned photoresist layer (having a plurality of photoresist structures 11) on the first metal layer 120. The material of the photoresist layer may be a liquid photoresist or a dry film photoresist. Then performing an etching step of etching away the first metal layer 120 and the transparent conductive layer 110 not protected by the photoresist structure 11, and removing the patterned photoresist layer to form a plurality of first senses having the first metal layer 120 thereon The measurement serial array 111, the plurality of second sensing pads 1121, the terminal lines 121 and the plurality of contacts 122, the plurality of first sensing series 111 respectively have a plurality of first sensing pads 1111 and a plurality of first bridge wires 1112, plural A plurality of sensing pads 1111 are arranged in an array. The plurality of first bridge wires 1112 are electrically connected to the adjacent plurality of first sensing pads 1111 in the first direction D1, and the plurality of second sensing pads 1121 are arranged in an array manner. The sensing pad 1121 and the plurality of first sensing pads 1111 are interlaced and surrounded by each other. The terminal lines 121 and the contacts 122 are formed on the edge 103. The contacts 122 are respectively transmitted through the terminal lines 121 and the plurality of first sensing series 111. The plurality of second sensing pads 1121 are electrically connected.
接著進行第二道黃光製程,去除位於複數第一感測串列111和複數第二感測墊1121上之第一金屬層120,而使端子線路121和複數接點122上仍保有第一金屬層120。Then, a second yellow light process is performed to remove the first metal layer 120 on the plurality of first sensing series 111 and the plurality of second sensing pads 1121, so that the terminal line 121 and the plurality of contacts 122 still have the first Metal layer 120.
接著如第1f圖所示,形成絕緣層130,均勻覆蓋於第一金屬層120和透明導電層110之上。進行第三道黃光製程,將絕緣層曝光顯影,圖案化絕緣層130,如第1g圖及第1h圖所示,形成複數絕緣墊131,該些絕緣墊131分別位於該些第一橋接線1112之上。Next, as shown in FIG. 1f, an insulating layer 130 is formed to uniformly cover the first metal layer 120 and the transparent conductive layer 110. Performing a third yellow light process, exposing and developing the insulating layer, and patterning the insulating layer 130. As shown in FIG. 1g and FIG. 1h, a plurality of insulating pads 131 are formed, and the insulating pads 131 are respectively located on the first bridge wires. Above 1112.
接著如第1i圖所示,形成至少一第二金屬層140於絕緣層130之上。進行第四道黃光製程,如第1j圖至第11圖所示,先形成圖案化光阻層於第二金屬層之上,其中圖案化光阻層可為黑矩陣(BM),或不反光之材質。第二金屬層140相對於複數絕緣墊131上方分別覆蓋有光阻結構11;以及蝕刻第二金屬層140,去除位於複數第一感測墊1111、複數第二感測墊1121、端子線路121和複數接點122上之第二金屬層140,形成具有光阻層之光阻結構11於其上之複數第二橋接141,並曝露出複數接點122,其中複數第二橋接線141與複數第一感測串列111分別由複數絕緣墊131電性絕緣,且第二橋接線141與於第二方向D2相鄰之複數第二感測墊1121電性連接形成複數第二感測串列112,各接點122透過端子線路121分別與複數第一感測串列111與複數第二感測串列112連接,複數接點供熱壓軟性電路板,用以形成感測結構與軟性電路板電性連接(圖未示)。Next, as shown in FIG. 1i, at least one second metal layer 140 is formed over the insulating layer 130. Performing a fourth yellow light process, as shown in FIGS. 1j to 11 , forming a patterned photoresist layer on the second metal layer, wherein the patterned photoresist layer may be a black matrix (BM), or Reflective material. The second metal layer 140 is respectively covered with the photoresist structure 11 above the plurality of insulating pads 131; and the second metal layer 140 is etched to remove the plurality of first sensing pads 1111, the plurality of second sensing pads 1121, the terminal lines 121, and The second metal layer 140 on the plurality of contacts 122 forms a plurality of second bridges 141 on the photoresist structure 11 having the photoresist layer, and exposes a plurality of contacts 122, wherein the plurality of second bridge lines 141 and the plurality of The plurality of sensing pads 131 are electrically insulated from the plurality of insulating pads 131, and the second bridge wires 141 are electrically connected to the plurality of second sensing pads 1121 adjacent to the second direction D2 to form a plurality of second sensing series 112. Each of the contacts 122 is connected to the plurality of first sensing series 111 and the plurality of second sensing series 112 through the terminal line 121, and the plurality of contacts are provided with a heat-pressing flexible circuit board for forming the sensing structure and the flexible circuit board. Electrical connection (not shown).
本發明之另一實施例,如上所述之觸控面板之製造方法,更包括:複數第二橋接線141之結構可為至少一層導電金屬層,或者多層導電金屬層。其中導電金屬層之材質可為銅合金、鋁合金、金、銀、鋁、銅、鉬等導電金屬或導電合金。多層導電金屬層之結構,例如可為鉬層/鋁層/鉬層之堆疊結構,或者可為選自銅合金、鋁合金、金、銀、鋁、銅、鉬等導電金屬或導電合金之一種或多種材質而堆疊之多層導電金屬層結構。導電金屬層多為使用物理氣相沉積(PVD)或是化學氣相沉積(CVD),沉積速率快且製程穩定。或者複數第二橋接線141之結構可為銦錫氧化物、氧化銦、氧化鋅、氧化銦鋅、摻雜有鋁之氧化鋅、以及摻雜有銻之氧化錫中之一或其混合物;而上述所使用之光阻層可為液態光阻或是乾膜光阻。In another embodiment of the present invention, the method for manufacturing the touch panel as described above further includes: the structure of the plurality of second bridge wires 141 may be at least one layer of conductive metal or a plurality of layers of conductive metal. The material of the conductive metal layer may be a conductive metal or a conductive alloy such as a copper alloy, an aluminum alloy, gold, silver, aluminum, copper or molybdenum. The structure of the multi-layer conductive metal layer may be, for example, a stacked structure of a molybdenum layer/aluminum layer/molybdenum layer, or may be a conductive metal or a conductive alloy selected from the group consisting of copper alloy, aluminum alloy, gold, silver, aluminum, copper, molybdenum, and the like. A multi-layer conductive metal layer structure stacked with a plurality of materials. Most of the conductive metal layers use physical vapor deposition (PVD) or chemical vapor deposition (CVD), and the deposition rate is fast and the process is stable. Or the structure of the plurality of second bridge wires 141 may be one of indium tin oxide, indium oxide, zinc oxide, indium zinc oxide, zinc oxide doped with aluminum, and tin oxide doped with antimony; or a mixture thereof; The photoresist layer used above may be a liquid photoresist or a dry film photoresist.
本發明之再一實施例,如上所述之觸控面板之製造方法,其中,第一金屬層120和第二金屬層140為選用相異之材質,並利用選擇性蝕刻將複數接點121之第一金屬層120上之第二金屬層140移除,僅留下複數接點121,使得複數接點121之間不導通。例如第一金屬層可為多層,其中最上面一層可為銅合金,而第二金屬層可為純銅,此時可選擇不同蝕刻液進行選擇性蝕刻。例如,本製程所形成之第一金屬層可為多層疊構,其中最上層為銅合金,且於形成第二金屬層前使用離子束進行表面改質,再形成第二金屬層,其中第二金屬層可為純銅、銅合金、鋁合金、金、銀、鋁、鉬等導電金屬或導電合金,以純銅為佳。再一實施例中,本製程形成第一金屬層可為多層疊構,其中最上層為鉬,且於形成第二金屬層前使用離子束進行表面改質,再形成第二金屬層,其中第二金屬層可為純銅、銅合金、鋁合金、金、銀、鋁、鉬等導電金屬或導電合金,以純銅為佳。或者第二金屬層140之厚度較第一金屬層120為薄,例如第一金屬層厚度:第二金屬層厚度為3:1,再利用選擇性蝕刻將複數接點之第一金屬層120上之第二金屬層140移除,僅留下複數接點121,使得複數接點121之間不導通。亦或者,可搭配使用不同蝕刻液進行選擇性蝕刻。According to still another embodiment of the present invention, in the manufacturing method of the touch panel as described above, the first metal layer 120 and the second metal layer 140 are made of different materials, and the plurality of contacts 121 are selectively etched. The second metal layer 140 on the first metal layer 120 is removed leaving only a plurality of contacts 121 such that the plurality of contacts 121 are not conductive. For example, the first metal layer may be a plurality of layers, wherein the uppermost layer may be a copper alloy, and the second metal layer may be pure copper, in which case different etching solutions may be selected for selective etching. For example, the first metal layer formed by the process may be a multi-layer structure, wherein the uppermost layer is a copper alloy, and an ion beam is used for surface modification before forming the second metal layer, and then a second metal layer is formed, wherein the second layer The metal layer may be a conductive metal or a conductive alloy of pure copper, copper alloy, aluminum alloy, gold, silver, aluminum, molybdenum, etc., preferably pure copper. In another embodiment, the first metal layer formed in the process may be a multi-layer structure, wherein the uppermost layer is molybdenum, and the surface is modified by using an ion beam before forming the second metal layer, and then the second metal layer is formed, wherein The two metal layers may be pure copper, copper alloy, aluminum alloy, gold, silver, aluminum, molybdenum or the like conductive metal or conductive alloy, preferably pure copper. Or the thickness of the second metal layer 140 is thinner than the first metal layer 120, for example, the thickness of the first metal layer: the thickness of the second metal layer is 3:1, and then the plurality of contacts are connected to the first metal layer 120 by selective etching. The second metal layer 140 is removed, leaving only a plurality of contacts 121 such that the plurality of contacts 121 are not conductive. Alternatively, it can be selectively etched using different etching solutions.
本發明之又一實施例,如上所述之觸控面板之製造方法,其中,其中更包括於形成第二金屬層前使用離子束表面改質。離子束表面改質可提升絕緣層與第二金屬層之附著力,以及提升透明導電層與第二金屬層之附著力。According to still another embodiment of the present invention, a method of manufacturing a touch panel as described above, further comprising: using an ion beam surface modification before forming the second metal layer. The surface modification of the ion beam can enhance the adhesion of the insulating layer to the second metal layer and enhance the adhesion of the transparent conductive layer to the second metal layer.
本發明之另一實施例,如上所述之觸控面板之製造方法,其中圖案化絕緣層130,更包括形成絕緣層於端子線路121之上,如第2a圖所示,該圖案化絕緣層之絕緣墊131則覆蓋並保護端子線路121。當進行第二金屬層蝕刻時,端子線路121的細線路將受到保護,而保留下來。According to another embodiment of the present invention, a method of manufacturing a touch panel as described above, wherein the patterned insulating layer 130 further comprises forming an insulating layer over the terminal line 121, as shown in FIG. 2a, the patterned insulating layer The insulating pad 131 covers and protects the terminal line 121. When the second metal layer is etched, the thin lines of the terminal lines 121 will be protected while remaining.
本發明之另一實施例,如上所述之觸控面板之製造方法,其中圖案化絕緣層13,更包括形成絕緣層於端子線路121和複數接點122之上,如第2b圖所示,且該圖案化絕緣層之絕緣墊131覆蓋保護每一接點122之周圍,形成一開口1221,露出每一接點122部分之中心。由於絕緣層保護住複數接點的周圍,可在進行第二金屬層蝕刻時避免複數接點周圍收到損傷。而且複數接點露出的中心可供軟性電路板熱壓連接用。According to another embodiment of the present invention, a method of manufacturing a touch panel as described above, wherein the patterned insulating layer 13 further comprises forming an insulating layer over the terminal line 121 and the plurality of contacts 122, as shown in FIG. 2b. The insulating pad 131 of the patterned insulating layer covers the periphery of each of the contacts 122 to form an opening 1221 exposing the center of each of the contacts 122. Since the insulating layer protects the periphery of the plurality of contacts, damage to the periphery of the plurality of contacts can be avoided during the etching of the second metal layer. Moreover, the center exposed by the plurality of contacts can be used for the thermal compression connection of the flexible circuit board.
上述製程步驟形成複數感測結構10於可撓捲式透明基材100之上表面101之後,接著形成黏著層150於複數感測結構10之上,如第3a圖所示,然後裁切覆蓋有黏著層150於複數感測結構10之上之透明基材100,如第3b圖所示,形成複數片狀感測基材170。然後將每一片狀感測基材170以黏著層150黏貼於硬質透明基板160,如第3c圖所示。The above process steps form the complex sensing structure 10 on the upper surface 101 of the flexible roll transparent substrate 100, and then form an adhesive layer 150 on the plurality of sensing structures 10, as shown in FIG. 3a, and then cut and covered. The transparent substrate 100 having the adhesive layer 150 on the plurality of sensing structures 10 forms a plurality of sheet-shaped sensing substrates 170 as shown in FIG. 3b. Each of the sheet-like sensing substrates 170 is then adhered to the rigid transparent substrate 160 with an adhesive layer 150 as shown in FIG. 3c.
本發明之另一實施例所提供如上述之觸控面板之製造方法,包括形成另一透明導電層於可撓捲式透明基材之下表面,用以防止觸控面板之受到電磁干擾(EMI),且另一透明導電層之設置可於上述製程步驟任一時候完成,並不以此為限制。Another embodiment of the present invention provides a method for manufacturing a touch panel as described above, comprising forming another transparent conductive layer on a lower surface of the flexible roll transparent substrate to prevent electromagnetic interference (EMI) of the touch panel. And the setting of another transparent conductive layer can be completed at any time in the above process steps, and is not limited thereto.
本發明之另一實施例所提供如上述之觸控面板之製造方法,包括形成一透明絕緣保護層覆蓋複數感測結構之上,以及不具有感測結構之可撓式透明基板之上,僅於端子線路以及接點與軟性電路板電性連接的區域(無圖示)無 透明絕緣保護層覆蓋。該透明絕緣保護層之材質可為二氧化矽(SiO2)、有機絕緣材質、無機絕緣材質或光阻,光阻例如可為液態光阻或乾膜光阻,對於防止感測結構之水氣入侵或氧化的保護相當優異。Another embodiment of the present invention provides a method of fabricating a touch panel as described above, comprising forming a transparent insulating protective layer overlying a plurality of sensing structures and a flexible transparent substrate having no sensing structure, only In the area where the terminal line and the contact are electrically connected to the flexible circuit board (not shown) Covered with a transparent insulating cover. The transparent insulating protective layer may be made of cerium oxide (SiO2), an organic insulating material, an inorganic insulating material or a photoresist. The photoresist may be, for example, a liquid photoresist or a dry film photoresist, to prevent moisture intrusion of the sensing structure. Or the protection of oxidation is quite excellent.
本發明之另一實施例所提供如上述之觸控面板之製造方法,包括形成抗干擾層於可撓捲式透明基材之下表面。或者形成抗干擾層於上表面,形成透明絕緣層於抗干擾層之上。以及形成複數感測結構於透明絕緣層之上。抗干擾層可用以防止觸控面板之受到電磁干擾(EMI)。抗干擾層之材質可為銦錫氧化物、氧化銦、氧化鋅、氧化銦鋅、摻雜有鋁之氧化鋅、以及摻雜有銻之氧化錫中之一或其混合物。Another embodiment of the present invention provides a method of fabricating a touch panel as described above, comprising forming an interference-resistant layer on a lower surface of the flexible roll-type transparent substrate. Or forming an anti-interference layer on the upper surface to form a transparent insulating layer on the anti-interference layer. And forming a complex sensing structure over the transparent insulating layer. The anti-interference layer can be used to protect the touch panel from electromagnetic interference (EMI). The material of the anti-interference layer may be one of indium tin oxide, indium oxide, zinc oxide, indium zinc oxide, zinc oxide doped with aluminum, and tin oxide doped with antimony or a mixture thereof.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明。任何熟習此技藝者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之保護範圍當視申請專利範圍所界定者為準。Although the present invention has been disclosed above by way of example, it is not intended to limit the invention. The scope of the present invention is defined by the scope of the claims, and the scope of the invention is intended to be limited by the scope of the invention.
D1...第一方向D1. . . First direction
D2...第二方向D2. . . Second direction
100...透明基材100. . . Transparent substrate
10...感測結構10. . . Sensing structure
11...光阻結構11. . . Photoresist structure
101...上表面101. . . Upper surface
103...邊緣103. . . edge
110...透明導電層110. . . Transparent conductive layer
111...第一感測串列111. . . First sensing series
1111...第一感測墊1111. . . First sensing pad
1112...第一橋接線1112. . . First bridge wiring
112...第二感測串列112. . . Second sensing series
1121...第二感測墊1121. . . Second sensing pad
120...第一金屬層120. . . First metal layer
121...端子線路121. . . Terminal line
122...接點122. . . contact
1221...開口1221. . . Opening
130...絕緣層130. . . Insulation
131...絕緣墊131. . . Insulation pad
140...第二金屬層140. . . Second metal layer
141...第二橋接線141. . . Second bridge wiring
150...黏著層150. . . Adhesive layer
160...硬質透明基板160. . . Hard transparent substrate
170...片狀感測基材170. . . Sheet sensing substrate
第1a圖至第1l圖所示為本發明一實施例中觸控面板之製造方法之示意圖。1a to 11l are schematic views showing a method of manufacturing a touch panel according to an embodiment of the present invention.
第2a圖至第2b所示為本發明另一實施例中觸控面板之製造方法之示意圖。2a to 2b are schematic views showing a method of manufacturing a touch panel according to another embodiment of the present invention.
第3a圖至第3c所示為本發明再一實施例中觸控面板之製造方法之示意圖。3a to 3c are schematic views showing a method of manufacturing a touch panel according to still another embodiment of the present invention.
100‧‧‧可撓捲式透明基材100‧‧‧Flexible roll transparent substrate
11‧‧‧光阻結構11‧‧‧Light-resistance structure
1112‧‧‧第一橋接線1112‧‧‧First bridge wiring
1121‧‧‧第二感測墊1121‧‧‧Second sensing pad
121‧‧‧端子線路121‧‧‧Terminal lines
122‧‧‧接點122‧‧‧Contacts
131‧‧‧絕緣墊131‧‧‧Insulation mat
141‧‧‧第二橋接線141‧‧‧Second bridge wiring
Claims (10)
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JP2011076155A (en) * | 2009-09-29 | 2011-04-14 | Seiko Epson Corp | Touch panel, method of manufacturing the same, electro-optical device, and electronic apparatus |
TW201118454A (en) * | 2009-11-17 | 2011-06-01 | Cando Corp | Touch panel structure and method of forming the same |
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CN101976146A (en) * | 2010-10-12 | 2011-02-16 | 友达光电股份有限公司 | Method for manufacturing touch panel |
Also Published As
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TW201250557A (en) | 2012-12-16 |
CN102819367B (en) | 2015-05-13 |
CN102819367A (en) | 2012-12-12 |
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