JP2011076155A - Touch panel, method of manufacturing the same, electro-optical device, and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a touch panel having more highly accurate sensing sensitivity (sensor position accuracy) in which any pattern is not visualized. <P>SOLUTION: A method is provided for manufacturing a touch panel which is formed on one surface of a substrate, and includes a plurality of first electrode films and a plurality of second electrode films extended in directions crossing each other. The method includes: a second bridge wiring film formation step of forming a second bridge wiring film which is at least partially passing via an insulating film, and electrically connecting the adjacent second island-shaped electrode parts; an initial wiring film formation step of forming an initial wiring film; and a via section wiring film formation step of forming a wiring film which is electrically connecting the adjacent initial wiring films, and passing via on the insulating film. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a touch panel, a touch panel manufacturing method, an electro-optical device, and an electronic apparatus.

  A capacitive touch screen has a capacitance formed between the electrodes of the panel by bringing a finger or the like close to a predetermined position of the panel on which the electrodes are formed, and a current for charging the capacitance thus formed. By detecting, a predetermined position is detected. For example, the following are disclosed as capacitive touch screens.

  The X electrode and the Y electrode intersecting each other are formed on the front surface and the back surface of the sensor substrate, respectively, and by a change in electric current due to a change in electric field lines from the X electrode to the Y electrode by a finger approaching from the X electrode side The position is detected (see Patent Document 1).

  A plurality of electrodes that are arranged to face each other through an insulating layer and intersect each other are provided, and position detection is performed by detecting a current changed by an operator's finger approaching the electrodes (see Patent Document 2).

JP-A-9-305289 Japanese Patent Laid-Open No. 10-63403

  However, in the touch panel in the above-described prior art, it is difficult to reduce the thickness because electrodes and the like are arranged so as to intersect the XY direction through an insulating layer. In addition, when an electrode or the like is formed on the substrate, the electrode film or the like is formed by repeating a sputtering method, a photolithography method, an etching method, or the like a plurality of times, resulting in an increase in manufacturing cost. . Therefore, it is conceivable to form an electrode film or the like on one surface of the substrate by using a printing method or the like. However, in order to maintain and enhance the sensing sensitivity, the electrodes extending in the XY direction should be arranged more closely. For this reason, the electrode insulating layer where the conductive film formed between the electrode films intersects covers the electrode part, resulting in a decrease in sensing sensitivity (sensor position accuracy). It was. Furthermore, if the pattern of the portion where the conductive films formed between the electrode films intersect is not densely arranged, there is a problem that the pattern is visually recognized by the user.

  The present invention can be realized as the following forms or application examples so as to solve at least one of the above-described problems.

  Application Example 1 A touch panel manufacturing method according to this application example is formed on one surface of a substrate and has a plurality of first electrode films and a plurality of second electrode films extending in directions intersecting each other. A first electrode film that forms a plurality of first island-shaped electrode portions and a first bridge wiring film that electrically connects the adjacent first island-shaped electrode portions with an interval in the first direction. A forming step, a second island-shaped electrode portion forming step for forming a plurality of second island-shaped electrode portions at intervals in a second direction intersecting the first direction, and at least a part of the first bridge wiring film An insulating film forming step of forming an insulating film covering the second portion, and a second bridge wiring film for electrically connecting the adjacent second island-shaped electrode portions at least partially via the insulating film. A bridge wiring film forming step, wherein the second bridge wiring The film forming step electrically connects at least the initial wiring film forming step for forming the initial wiring film from the peripheral edge of the insulating film to the second island-shaped electrode portion, and the adjacent initial wiring film, And a via portion wiring film forming step of forming a wiring film via the insulating film.

  According to the touch panel manufacturing method of this application example, the second bridge at the corner where the rising portion with respect to the substrate surface forming the outer shape of the insulating film at the peripheral portion of the insulating film and the surface portion constituting the thickness of the insulating film intersect. It is possible to prevent disconnection of the wiring film and insufficient film thickness. Therefore, it is possible to reliably prevent poor conduction due to disconnection of the second bridge wiring film or insufficient film thickness. Furthermore, since the initial wiring film forming step and the via wiring layer forming step can be repeated a plurality of times, the second bridge wiring film can be formed thickly by repeating the process, and the wiring film width can be increased accordingly. Even if it is small (narrow), the second bridge wiring film can be formed without impairing the conduction performance.

  Application Example 2 In the touch panel manufacturing method according to the application example described above, a surface treatment process is performed between the first electrode film formation process and the insulating film formation process to perform a liquid repellent treatment on the surface of the substrate. It is characterized by.

  Application Example 3 In the touch panel manufacturing method according to the application example described above, a surface treatment agent containing a silane compound is used in the surface treatment step.

  Application Example 4 In the touch panel manufacturing method according to the application example described above, in the surface treatment step, a surface treatment agent containing hexamethyldisilazane is used.

  According to the touch panel manufacturing method of the application example described above, the insulating film forming surface is subjected to the liquid repellency treatment, so that wetting and spreading of the insulating film is suppressed. As a result, it is possible to selectively form an insulating film only in a portion that needs to be insulated from the first bridge wiring film. Accordingly, it is possible to prevent the insulating film from being formed by wetting and spreading in the vicinity of the first bridge wiring film in the first island-shaped electrode portion and the second island-shaped electrode portion that are formed close to each other. In other words, it is possible to prevent the detection accuracy (sensitivity) of the finger position detected by the first island-shaped electrode portion and the second island-shaped electrode portion from being partially covered with an extra insulating film, thereby insulating the user. It is also possible to prevent the film pattern from being seen.

  For the liquid repellency treatment, it is preferable to treat with a surface treatment agent containing a silane compound having good binding properties to the glass and acrylic resin of the base material and having excellent liquid repellency. Among the silane compounds, the liquid repellency performance can be controlled by the treatment time when the vapor phase treatment is performed as one of the treatment methods, and also after the treatment or by UV irradiation. Since liquid property is controllable, it is still more preferable to contain hexamethyldisilazane.

  Application Example 5 In the touch panel manufacturing method according to the application example described above, in the initial wiring film formation step and the via portion wiring film formation step, a functional liquid containing the material of the second bridge wiring film is discharged as droplets. Then, the application step of applying the functional liquid on the formation range of the second bridge wiring film, and solidifying the functional liquid applied at least in the transit wiring film formation step, the second bridge wiring film And a solidifying step to be formed.

  According to the touch panel manufacturing method of the application example described above, the functional liquid can be efficiently applied to a desired position. As a result, even if the insulating film is formed to the minimum necessary size on the substrate by liquid repellent treatment, the second bridge wiring film having a precise and high-definition pattern shape is formed on the insulating film. can do.

  Application Example 6 A touch panel according to this application example is a touch panel that is formed on one surface of a substrate and includes a plurality of first electrode films and a plurality of second electrode films extending in directions intersecting each other. The one-electrode film includes a plurality of first island-shaped electrode portions formed at intervals in the first direction and a first bridge wiring film that electrically connects the adjacent first island-shaped electrode portions. The second electrode film electrically connects a plurality of second island electrode portions formed at intervals in a second direction intersecting the first direction and the adjacent second island electrode portions. And a second bridge wiring film having a via portion passing through the insulating film formed on the first bridge wiring film, and the insulating film of the adjacent first island-shaped electrode portion It is characterized by being the same as or narrower than the interval.

  According to the touch panel described above, since the insulating film is formed at least on the first island electrode portion without overlapping, the finger position detection accuracy (sensitivity) by the island electrode can be maximized. In addition, the pattern of the insulating film is not visually recognized by the user. Similarly, it is still preferable that the insulating film is formed without overlapping in the second island-shaped electrode portion.

  Application Example 7 An electro-optical device including the touch panel according to the application example described above.

  According to the application example described above, an electro-optical device including a highly reliable touch panel can be provided. In this case, the electro-optical device corresponds to, for example, a liquid crystal display, a plasma display, an organic EL display, an FED (field emission display), or the like.

  Application Example 8 Electronic equipment including the above-described electro-optical device.

  According to the application example described above, it is possible to provide an electronic apparatus equipped with a highly reliable electro-optical device. In this case, examples of the electronic device include a color filter, a plasma display, an organic EL display, a television set equipped with an FED (field emission display), a personal computer, a portable electronic device, and other various electronic products. .

The top view which shows the structure of the touch panel in embodiment. The some enlarged plan view of the touch panel in an embodiment. Sectional drawing which shows the structure of the touch panel in embodiment. The flowchart which shows the manufacturing method of the touch panel in embodiment. The flowchart which shows the manufacturing method of a part of touch panel in embodiment. The perspective view which shows the structure of a droplet discharge apparatus. FIG. 3 is a schematic diagram illustrating a configuration of an ejection head. Process drawing which shows the manufacturing method of the touchscreen in embodiment. Process drawing which shows the manufacturing method of the touchscreen in embodiment. The fragmentary top view which shows the manufacturing method of the touch panel in embodiment is shown. Process drawing which shows the one part manufacturing method of the touchscreen in embodiment. FIG. 6 is a plan view and a cross-sectional view illustrating a configuration of a liquid crystal display device as an electro-optical device. The perspective view which shows the structure of the personal computer as an electronic device.

Embodiments according to the present invention will be described below with reference to the drawings.
(Embodiment)
[Configuration of touch panel]
A configuration of the touch panel according to the present embodiment will be described. FIG. 1 is a plan view schematically showing the entire touch panel, and FIG. 2 is a partially enlarged view of an electrode portion in FIG. FIG. 3 is a cross-sectional view taken along the line AA ′ in FIG.

  As shown in FIG. 1, the touch panel 100 includes a substrate 1, an input area 2 (area surrounded by a two-dot chain line), and a lead wiring 3. The substrate 1 is formed in a rectangular shape in plan view, and a transparent material such as glass or acrylic resin is used as the material.

  The input area 2 is an area for detecting finger position information input to the touch panel 100. In the input region 2, a plurality of X electrode films 10 as first electrode films and a plurality of Y electrode films 20 as second electrode films are disposed. With respect to the XY axis direction illustrated in FIG. 1, the X electrode film 10 extends along the X axis direction as the first direction, and a plurality of X electrode films 10 are arranged at intervals in the Y axis direction. The Y electrode films 20 extend along the Y-axis direction as the second direction, and a plurality of Y electrode films 20 are arranged at intervals in the X-axis direction.

  As shown in FIGS. 1 and 2, the X electrode film 10 electrically connects a plurality of first island electrode portions 12 arranged in the X axis direction and the first island electrode portions 12 adjacent in the X axis direction. And a first bridge wiring film 11 to be connected to each other. The first island-like electrode portion 12 is formed in a rectangular shape in plan view, and is wired so that one diagonal line is along the X axis. The Y electrode film 20 includes a plurality of second island-shaped electrode portions 22 arranged in the Y-axis direction, and a second bridge wiring film 21 that connects the second island-shaped electrode portions 22 adjacent in the Y-axis direction. ing. The second island-like electrode portion 22 is formed in a rectangular shape in plan view, and is wired so that one diagonal line is along the Y axis.

  The first island-shaped electrode portions 12 and the second island-shaped electrode portions 22 are alternately arranged (checkered arrangement) in the X-axis direction and the Y-axis direction. The X electrode film 10 in which the first island electrode portions 12 are connected by the first bridge wiring film 11 and the Y electrode film 20 in which the second island electrode portions 22 are connected by the second bridge wiring film 21 are input. The regions 2 are arranged in a matrix in plan view. At this time, the first bridge wiring film 11 and the second bridge wiring film 21 intersect at the intersection K.

  As a material constituting the X electrode film 10 and the Y electrode film 20, a light-transmitting resistor such as ITO (indium tin oxide), IZO (indium zinc oxide; registered trademark), ZnO, polythiophene, polyaniline, or the like is used. Can be adopted.

  The routing wiring 3 is connected to the X electrode film 10 and the Y electrode film 20, and is connected to a driving unit and an electric signal conversion / calculation unit (both not shown) provided in the touch panel 100 or in an external device. ing.

  As shown in FIG. 2, the second bridge wiring film 21 and the first bridge wiring film 11 are electrically insulated by interposing an insulating film 30 formed on the first bridge wiring film 11. Yes.

  The film width W1 of the insulating film 30 is formed in the range of the interval W2 between the adjacent first island-shaped electrode portions 12. That is, since the end portion of the insulating film 30 does not cover the vicinity of the connecting portion of the first bridge wiring film 11 of the first island electrode portion 12, the position detection accuracy is determined from the operating principle of the touch panel 100 described later. It is possible to increase to (theoretical value).

  Further, the formation length L1 of the insulating film 30 in the Y-axis direction is preferably formed within the range of the interval L2 between the adjacent second island-shaped electrode portions 22.

  This can reduce the formation range of the insulating film 30 at the intersection K, reduce the parasitic capacitance at the intersection K in the position detection operation of the touch panel 100, and improve the position detection accuracy. It is also possible to prevent the pattern of the insulating film 30 from being seen.

  Next, the configuration of the touch panel 100 in a cross-sectional view will be described. FIG. 3 shows a cross section taken along the line A-A 'of FIG. As shown in FIG. 3, a first island electrode portion 12 (not shown), a second island electrode portion 22, and a first bridge wiring film 11 are provided on a functional surface 1 a as one surface of the substrate 1. Yes. An insulating film 30 is formed on the first bridge wiring film 11.

  A second bridge wiring film 21 that connects a part of the adjacent second island-shaped electrode portions 22 via the insulating film 30 is formed, and the adjacent second island-shaped electrode portions 22 are electrically connected. . Further, the routing wiring 3 is disposed on the functional surface 1 a of the substrate 1. The routing wiring 3 includes a first layer 3a disposed on the functional surface 1a and a second layer 3b stacked on the first layer 3a. A wiring protective film 4 that covers the routing wiring 3 is formed.

  A planarizing film 5 is formed so as to cover the above electrode film and wiring film. A protective substrate 7 is disposed on the planarizing film 5 with an adhesive layer 6 interposed therebetween. A shield layer 8 is provided on the back surface 1 b of the substrate 1.

  The insulating film 30 insulates the first bridge wiring film 11 and the second bridge wiring film 21 that intersect three-dimensionally. The insulating film 30 can be formed by applying polysiloxane, acrylic resin, acrylic monomer, and the like using, for example, a printing method and drying and solidifying it. When formed using polysiloxane, the insulating film 30 is an inorganic insulating film made of silicon oxide. On the other hand, when an acrylic resin and an acrylic monomer are employed, the insulating film 30 is an organic insulating film made of a resin material. Here, an ink in which JSR NN525E and EDM (diethylene glycol ethyl methyl ether) are mixed at a ratio of 4: 1 (weight ratio) is used.

  As a constituent material of the insulating film 30, it is preferable to employ a material having a relative dielectric constant of 4.0 or less, desirably 3.5 or less. Thereby, the parasitic capacitance at the intersection of the first and second bridge wiring films 11 and 21 can be reduced, and the position detection performance of the touch panel can be maintained. The constituent material of the insulating film 30 is preferably a material having a refractive index of 2.0 or less, preferably 1.7 or less. Thereby, the refractive index difference with the board | substrate 1, X electrode film 10, and Y electrode film 20 can be made small, and it can prevent that the pattern of the insulating film 30 is visible to a user.

  The first layer 3a of the routing wiring 3 is obtained by extending the X electrode film 10 or the Y electrode film 20 to a region outside the input region 2, and a resistor such as ITO, IZO (registered trademark), polythiophene, or polyaniline. Is formed by. The second layer 3b is laminated on the first layer 3a and reduces the wiring resistance of the lead wiring 3. The second layer 3b is made of an organic compound, nanoparticle, nanowire, or the like containing one or more kinds of metals such as Au, Ag, Al, Cu, and Pd, and carbon (nanocarbon such as graphite and carbon nanotube). Can be used. The constituent material of the 2nd layer 3b will not be specifically limited if sheet resistance can be made smaller than the 1st layer 3a.

  Similar to the insulating film 30, the wiring protective film 4 covering the lead wiring 3 can be formed by a printing method using polysiloxane, acrylic resin, acrylic monomer, or the like as a forming material. Therefore, the wiring protective film 4 can be formed at the same time in the process of forming the insulating film 30.

  The planarizing film 5 is formed so as to cover at least the input region 2 of the functional surface 1 a of the substrate 1, and the unevenness of the functional surface 1 a due to the X electrode film 10 and the Y electrode film 20 is planarized. As shown in the figure, the planarizing film 5 is preferably formed so as to cover substantially the entire functional surface 1a (excluding the external connection terminal portion). Since the functional surface 1a side of the substrate 1 is planarized by the planarizing film 5, the substrate 1 and the protective substrate 7 can be bonded uniformly over almost the entire surface. Further, as the constituent material of the planarizing film 5, it is preferable to use a material having a refractive index of 2.0 or less, desirably 1.7 or less. Thereby, the difference in refractive index from the substrate 1, the X electrode film 10, and the Y electrode film 20 can be reduced, and the wiring pattern of the X electrode film 10 and the Y electrode film 20 can be made difficult to see.

  The protective substrate 7 is a transparent substrate such as glass or plastic. Or when the touch panel 100 of this embodiment is arrange | positioned in front of display apparatuses, such as a liquid crystal panel and an organic electroluminescent panel, as the protective substrate 7, the optical element board | substrate (a polarizing plate and position) used as a part of display apparatus. A phase difference plate or the like can also be used.

  The shield layer 8 is formed by depositing a transparent conductive material such as ITO or IZO (registered trademark) on the back surface 1 b of the substrate 1. Or it is good also as a structure which prepared the film in which the transparent conductive film used as a shield layer was formed, and adhere | attached this film on the back surface 1b of the board | substrate 1. FIG. By providing the shield layer 8, the electric field is blocked on the back surface 1 b side of the substrate 1. Thereby, it is possible to prevent the electric field of the touch panel 100 from acting on the display device or the like, or the electric field of an external device such as the display device from acting on the touch panel 100.

  In the present embodiment, the shield layer 8 is formed on the back surface 1 b of the substrate 1. However, for example, the shield layer 8 can be formed on the functional surface 1 a side of the substrate 1. In this case, the shield layer 8 is formed on the functional surface 1 a of the substrate 1, and an insulating film covering the shield layer 8 is formed. In this way, since the shield layer 8, the X electrode film 10, the Y electrode film 20, the routing wiring 3 and the like are formed on one side of the substrate 1, the manufacturing process can be prevented from becoming complicated, and the productivity is excellent. Touch panel.

  Here, the operation principle of the touch panel 100 will be briefly described. First, a predetermined potential is supplied to the X electrode film 10 and the Y electrode film 20 from the driving unit (not shown) through the routing wiring 3. For example, a ground potential (ground potential) is input to the shield layer 8.

  When a finger is brought close to the input region 2 from the protective substrate 7 side in the state where the potential is supplied as described above, the finger brought close to the protective substrate 7 and the X electrode film 10 and the Y electrode film 20 in the vicinity of the approach position. A parasitic capacitance is formed between each of the two. Then, in the X electrode film 10 and the Y electrode film 20 in which the parasitic capacitance is formed, a temporary potential drop is caused in order to charge the parasitic capacitance.

  The drive unit senses the potential of each electrode, and immediately detects the X electrode film 10 and the Y electrode film 20 in which the above-described potential drop has occurred. Then, the position information of the finger in the input area 2 is detected by analyzing the detected electrode position by the electric signal conversion / calculation unit. Specifically, the Y coordinate in the input region 2 at the position where the finger approaches is detected by the X electrode film 10 extending in the X axis direction, and the input region 2 is detected by the Y electrode film 20 extending in the Y axis direction. The X coordinate at is detected.

[Manufacturing method of touch panel]
Next, the manufacturing method of a touch panel is demonstrated. FIG. 4 is a flowchart showing a method for manufacturing a touch panel.

The manufacturing process of the touch panel of this embodiment has the process shown in FIG.
(S10) An electrode film forming step of forming the first and second island-like electrode portions 12 and 22, the first bridge wiring film 11, and the first layer 3a of the routing wiring 3 on the functional surface 1a of the substrate 1.
(S20) Auxiliary wiring film forming step of laminating the second layer 3b on the first layer 3a of the routing wiring 3.
(S30) A surface treatment step for repelling at least the range of the intersection K.
(S40) An insulating film forming step in which the insulating film 30 is formed on the first bridge wiring film 11 and the wiring protective film 4 is formed so as to cover the lead wiring 3.
(S50) A second bridge wiring film forming step of forming the second bridge wiring film 21 that connects the adjacent second island electrode parts 22 via the insulating film 30.
(S60) A flattening film forming step (protective film forming step) for forming the flattening film 5 for flattening the functional surface 1a side of the substrate 1.
(S70) A protective substrate bonding step (adhesive layer forming step) in which the protective substrate 7 is bonded to the planarizing film 5 via the adhesive layer 6.
(S80) A shield layer forming step (conductive film forming step) for forming the shield layer 8 on the back surface 1b of the substrate 1.

  FIG. 5 is a flowchart for explaining the second bridge wiring film forming step (S50), which is a part of the touch panel manufacturing method, in more detail.

As shown in FIG. 5, the second bridge wiring film forming step (S50) includes the following steps.
(S50a) A surface treatment step of surface-treating the surface of the substrate 1 and the second island-like electrode portion 22.
(S50b) An initial wiring film coating step of discharging and coating as a functional liquid containing the material of the second bridge wiring film to the formation range of the second bridge wiring film 21 at the outer edge portion of the insulating film 30.
(S50c) A via wiring film coating step of discharging and applying a functional liquid containing the material of the second bridge wiring film 21 onto the insulating film 30 and the second island-shaped electrode portion 22.
(S50d) A solidifying step of drying the functional liquid applied in S50b and S50c to form the second bridge wiring film 21.

  Since the manufacturing process of the touch panel 100 of this embodiment has the process of forming into a film by the droplet discharge method which is a kind of printing method as mentioned above, a droplet discharge apparatus is demonstrated here.

  FIG. 6 is a perspective view showing a schematic configuration of the droplet discharge device IJ. The droplet discharge device IJ includes a droplet discharge head 1001, a Y-axis direction drive shaft 1004, an X-axis direction guide shaft 1005, a control device CONT, a stage 1007, a cleaning mechanism 1008, a base 1009, and a heater. 1015. As an apparatus for ejecting functional liquid as droplets, an electromechanical conversion type droplet ejecting apparatus using a piezoelectric element (piezoelectric element) is used.

  The stage 1007 supports the workpiece W on which the functional liquid is applied and disposed by the droplet discharge device IJ, and includes a fixing mechanism (not shown) that fixes the workpiece W to a reference position.

  The droplet discharge head 1001 is a multi-nozzle type droplet discharge head including a plurality of discharge nozzles, and the longitudinal direction and the Y-axis direction are made to coincide. The plurality of discharge nozzles are provided on the lower surface of the droplet discharge head 1001 at regular intervals. The functional liquid is discharged from the discharge nozzle of the droplet discharge head 1001 to the workpiece W supported by the stage 1007.

  A Y-axis direction drive motor 1002 is connected to the Y-axis direction drive shaft 1004. The Y-axis direction drive motor 1002 is composed of a stepping motor or the like, and rotates the Y-axis direction drive shaft 1004 when a drive signal in the Y-axis direction is supplied from the control device CONT. When the Y-axis direction drive shaft 1004 rotates, the droplet discharge head 1001 moves in the Y-axis direction.

  The X-axis direction guide shaft 1005 is fixed so as not to move with respect to the base 1009. The stage 1007 includes an X-axis direction drive motor 1003. The X-axis direction drive motor 1003 is a stepping motor or the like, and moves the stage 1007 in the X-axis direction when a drive signal in the X-axis direction is supplied from the control device CONT.

  The control device CONT supplies a droplet discharge control voltage to the droplet discharge head 1001. Further, a drive pulse signal for controlling the movement of the droplet discharge head 1001 in the Y-axis direction is supplied to the Y-axis direction drive motor 1002, and a drive pulse signal for controlling the movement of the stage 1007 in the X-axis direction is supplied to the X-axis direction drive motor 1003. Supply.

  The cleaning mechanism 1008 is for cleaning the droplet discharge head 1001. The cleaning mechanism 1008 is provided with an X-axis direction drive motor (not shown). By driving the drive motor in the X-axis direction, the cleaning mechanism 1008 moves along the X-axis direction guide shaft 1005. The movement of the cleaning mechanism 1008 is also controlled by the control device CONT.

  Here, the heater 1015 is means for heat-treating the workpiece W by lamp annealing, and performs evaporation and drying of the solvent contained in the functional liquid disposed on the workpiece W. The heater 1015 is also turned on and off by the control device CONT.

  The droplet discharge device IJ is arranged in the Y-axis direction on the lower surface of the droplet discharge head 1001 with respect to the workpiece W while relatively scanning the droplet discharge head 1001 and the stage 1007 that supports the workpiece W. Droplets are ejected from a plurality of ejection nozzles.

  FIG. 7 is a diagram for explaining the principle of discharging the functional liquid by the piezo method. In FIG. 7, a piezo element 1022 is installed adjacent to a liquid chamber 1021 that contains a functional liquid. The functional liquid is supplied to the liquid chamber 1021 via a liquid material supply system 1023 including a material tank that stores the functional liquid. The piezo element 1022 is connected to a drive circuit 1024, and a voltage is applied to the piezo element 1022 via the drive circuit 1024 to deform the piezo element 1022, whereby the liquid chamber 1021 is deformed and functions from the discharge nozzle 1025. The liquid is discharged as droplets D. In this case, the amount of distortion of the piezo element 1022 is controlled by changing the value of the applied voltage. Further, the strain rate of the piezo element 1022 is controlled by changing the frequency of the applied voltage. Since the functional liquid by the piezo method does not apply heat to the material, it has an advantage of hardly affecting the composition of the material.

  A method for manufacturing the touch panel 100 using the above-described droplet discharge device will be described. 8 and 9 are diagrams showing a manufacturing process of the touch panel 100. FIG. These process drawings show the process of forming the structure shown in FIG. 2 (intersection K of the second bridge wiring film 21 and the routing wiring 3).

  First, the electrode film forming step S10 will be described. In the electrode film forming step S10, for example, a plurality of first island-like electrode portions 12 are formed at intervals in the first direction (X-axis direction) on the substrate 1 by using a photolithography method, and adjacent first An X electrode film 10 is formed by forming the first bridge wiring film 11 that electrically connects the island-shaped electrode portions 12 (first electrode film forming step). Further, a plurality of second island-shaped electrode portions 22 are formed on the substrate 1 at intervals in the second direction (Y-axis direction) (second island-shaped electrode portion forming step). Then, the first layer 3 a of the routing wiring 3 extending from the first island-shaped electrode portion 12 and the second island-shaped electrode portion 22 is formed. The first island-shaped electrode portion 12, the first bridge wiring film 11, the second island-shaped electrode portion 22, and the first layer 3a are made of ITO (indium tin oxide) or IZO (indium zinc oxide; registered trademark), A light-transmitting resistor such as ZnO, polythiophene, or polyaniline can be used.

  In the electrode film forming step S10 of the present embodiment, the photolithography method is used. However, the first island electrode portion 12, the first bridge wiring film 11, the second island shape are used by using the droplet discharge device IJ. The electrode part 22 and the first layer 3a may be formed. For example, each pattern shape is formed by ejecting functional liquid containing oxide ceramics such as ITO particles or IZO particles, or conductive liquid such as polythiophene or polyaniline as droplets and applying the functional liquid onto the substrate 1. After that, the applied functional liquid may be solidified.

  Next, the process proceeds to the auxiliary wiring film forming step S20. In the auxiliary wiring film forming step S20, the droplet of the functional liquid containing the constituent material of the second layer 3b of the routing wiring 3 is discharged and arranged on the first layer 3a by the droplet discharge device IJ. As the functional liquid for forming the second layer 3b, for example, a functional liquid containing silver particles can be used. Thereafter, the discharged droplets are dried. As a result, as shown in FIG. 8B, a low resistance second layer 3b is formed on the first layer 3a, and a two-layer lead-out wiring 3 is formed on the substrate 1 outside the input region 2. The

  The functional liquid for forming the second layer 3b of the routing wiring 3 includes, for example, a functional liquid containing silver particles, a functional liquid containing metal particles such as Au, Al, Cu, and Pd, graphite, and carbon nanotubes. A functional fluid can be used. Metal particles and carbon particles are dispersed in the functional liquid in the form of nanoparticles or nanowires. When the second layer 3b is a metal film, a functional liquid containing an organometallic compound may be used.

  Next, it transfers to surface treatment process S30. The surface treatment step S30 is a lyophobic treatment step for making the functional liquid lyophobic at least in the region of the intersection K where the first bridge wiring film 11 and the second bridge wiring film 21 intersect on the surface of the substrate 1. And a lyophilic process step for lyophilicizing a portion where the film 30 is formed.

In the liquid repellent treatment process, it is preferable to use a treatment liquid containing a silane compound. For example, using a silane compound such as fluorinated alkylsilane (FAS), hexamethyldisilazane (HMDS), trimethylmethoxysilane (CH ₃ Si (OCH ₃ ) ₃ ), trimethylchlorosilane ((CH ₃ ) ₃ SiCl), etc. Then, the region of the intersection K is made liquid repellent by vapor phase growth.

  When hexamethyldisilazane (HMDS) is used as the liquid repellent treatment, it is possible to easily control the liquid repellent performance (contact angle size) by controlling the gas phase treatment time (exposure time). is there. Furthermore, lyophilicity can be imparted (reducing the contact angle) by performing light irradiation, for example, laser irradiation or UV irradiation, on the treated surface. Therefore, it is more preferable to use hexamethyldisilazane (HMDS) as the liquid repellent treatment liquid in that appropriate liquid repellency and lyophilicity can be imparted on the substrate 1 by the material of the insulating film 30 described later. . In the present embodiment, the gas diffusion method is used as the HMDS treatment. In addition, for example, nitrogen gas is blown into a bottle storing liquid HMDS and bubbled to generate HMDS vapor. You may use the bubbling method sprayed on a base material.

  Further, the range of the liquid repellent treatment may be performed over the entire surface of the substrate 1 other than the intersection K, for example. In this case, it is preferable that the joint portion of the second island-shaped electrode portion 22 to be described later with the second bridge wiring film 21 is lyophilic. However, in the surface treatment step S30, even if the joint portion of the second island-shaped electrode portion 22 with the second bridge wiring film 21 is not lyophilic, the surface treatment step in the second bridge wiring film forming step S50 described later ( In S50a), it can be lyophilic.

Next, in the lyophilic process step, for example, the surface of the portion of the substrate 1 where the insulating film 30 is formed is selectively irradiated with light to make it lyophilic. The light irradiation may be laser irradiation. By modifying the surface of the portion of the substrate 1 where the insulating film 30 is formed by light irradiation, the light irradiated portion is made lyophilic. Further, as the irradiation light, for example, an Nb: YAG laser (1.064 μm) or a CO ₂ laser (10.6 μm) can be used. Further, as a method for lyophilic treatment of a lyophobic region made of FAS or the like, a method of covering a region other than the lyophilic region with a mask and irradiating with UV (ultraviolet light) can also be employed.

  This liquid repellency treatment is performed in a step of forming an insulating film 30 to be described later, in order to form the insulating film 30 in the minimum necessary range, so that the functional liquid of the droplet discharge device including the material of the insulating film is subjected to surface tension. This is done to prevent it from spreading too much. Therefore, the surface treatment step S30 may be omitted if the functional surface 1a of the substrate 1 has liquid repellency and a desired liquid repellency can be obtained.

  Next, in the surface treatment step S30, with respect to the intersection K, the part where the insulating film 30 is formed is lyophilic, the other part is provided with lyophobic property, and the part is provided with lyophilicity Then, the insulating film 30 is formed (insulating film forming step: S40). The insulating film 30 is formed by applying a functional liquid containing an insulating component so as to cover at least a part of the first bridge wiring film 11 as shown in FIG. Thereafter, the applied functional liquid is heated and dried and solidified to form the insulating film 30.

At this time, since the liquid repellent treatment is performed on portions other than the portion where the insulating film 30 is formed at the intersection K, the discharged functional liquid has a large contact angle θ at the liquid repellent treatment portion. As a result, the insulating film 30 can be prevented from being wetted and formed to the first island-shaped electrode portion 12. As shown in FIG. 10A, the insulating film 30 is preferably formed in the range of the interval W2 between the adjacent first island-like electrode portions 12 on which the first bridge wiring film 11 is formed. More preferably,
W1≈W2 (W1 ≦ W2)
Thus, the reliability of insulation between the first bridge wiring film 11 and the second bridge wiring film 21 can be improved.

  Further, it is preferable that the wiring film width W3 of the second bridge wiring film 21 formed in the second bridge wiring film forming step (S50), which will be described later, be formed wider, in order to ensure conductivity. However, it is more preferable that the insulating film 30 is formed so that W1≈W2 can be achieved, so that the width W3 of the second bridge wiring film 21 can be maximized.

Further, as shown in FIG. 10 (b), between the end portions (L1) of the second island-shaped electrode portion 22,
L1 <L2
It is preferable to be formed so that As a result, a connection portion between the second bridge wiring film 21 and the second island electrode portion 22 can be formed at the end of the second island electrode portion 22. Therefore, the Y electrode film 20 can be formed without impairing the detection sensitivity of the Y electrode film 20.

  Subsequently, as shown in FIG. 8C, droplets are selectively arranged and applied also to the region on the lead wiring 3. Thereafter, the applied functional liquid is heated and dried and solidified to form the wiring protective film 4 that covers the routing wiring 3. As the functional liquid for the insulating film, for example, a functional liquid containing polysiloxane, a functional liquid containing acrylic resin, or an acrylic monomer can be used.

  Next, the process proceeds to the second bridge wiring film forming step (S50). In the second bridge wiring film step (S50), as shown in FIG. 8D, the second bridge wiring film 21 that connects the adjacent second island-shaped electrode portions 22 via the insulating film 30 is formed. To do. The second island-shaped electrode portion 22 is electrically connected by the second bridge wiring film 21 to form the Y electrode film 20.

  As shown in FIG. 5, the second bridge wiring film forming step S50 includes a surface treatment step (S50a), an initial wiring film coating step (S50b), a via portion wiring film coating step (S50c), and a solidifying step (S50d). . The surface treatment step S50a of the second bridge wiring film formation step S50 includes a liquid repellent treatment step for repelling the surfaces of the substrate 1 and the insulating film 30 with respect to the functional liquid, and a crossing portion of the surface of the insulating film 30 and the substrate 1. A lyophilic treatment step of lyophilicizing the functional liquid with the formation portion of the second bridge wiring film 21 in K and the surface of the joining portion of the second bridge wiring film 21 of the second island-shaped electrode portion 22. .

In the liquid repellent treatment step, the treatment can be performed by the same method as in the surface treatment step S30 described above. For example, using a silane compound such as fluorinated alkylsilane (FAS), hexamethyldisilazane (HMDS), trimethylmethoxysilane (CH ₃ Si (OCH ₃ ) ₃ ), trimethylchlorosilane ((CH ₃ ) ₃ SiCl), The surface of the substrate 1 and the surface of the insulating film 30 are made liquid repellent by a gas diffusion method.

  Next, in the lyophilic process step, at least the surface of the insulating film 30 and the formation range of the second bridge wiring film 21 on the upper surface of the substrate 1 and the joint portion of the second island-shaped electrode portion 22 with the second bridge wiring film 21 are formed. Selectively lyophilic. The lyophilic process is performed, for example, by selectively irradiating a portion to be lyophilic. Alternatively, laser irradiation is performed as light irradiation. The surface of the irradiated part is modified by light irradiation or laser irradiation to make it lyophilic.

As the irradiation light, for example, an Nb: YAG laser (1.064 μm) or a CO ₂ laser (10.6 μm) can be used. Further, as a method for lyophilic treatment of a lyophobic region made of FAS or the like, a method of covering a region other than the lyophilic region with a mask and irradiating with UV (ultraviolet light) can be employed.

  The liquid repellency treatment in the surface treatment step S50a is performed in the initial wiring film application step S50b and the intermediate portion wiring film application step S50c for the liquid repellency treatment portion formed by the liquid repellency treatment in the surface treatment step S30 described above. In particular, when no inconvenience or the like occurs, the surface may be excluded from the liquid-repellent treatment portion in the surface treatment step S50a.

  Next, the initial wiring film coating step S50b will be described. FIG. 11A is a partial enlarged cross-sectional view schematically showing a state in which an initial wiring film which is a part of the second bridge wiring film 21 is formed by the initial wiring film coating step (S50b).

  The initial wiring film is an initial wiring film (A) 21a formed along the outer peripheral portion 30a of the insulating film 30 and an initial wiring formed on the upper surface 30b of the insulating film 30 as a part of the second bridge wiring film 21. Film (B) 21b.

  The initial wiring film (A) 21a and the initial wiring film (B) 21b are used to drop functional liquid droplets containing the material of the second bridge wiring film 21 at predetermined positions in the same process using the droplet discharge device IJ. It is discharged and applied to form. As the functional liquid, a functional liquid containing ITO particles, IZO (registered trademark) or ZnO particles, a conductive polymer such as polythiophene or polyaniline, a derivative thereof, or a monomer thereof can be used.

  In the initial wiring film application step S50b, the liquid is formed along the wiring direction of the second bridge wiring film 21 from the end of the second island-shaped electrode part 22 toward the end of the other second island-shaped electrode part 22 adjacent thereto. While moving the droplet discharge head 1001, a predetermined amount of liquid droplets of the functional liquid are discharged to the arrangement portion. At this time, the liquid droplet of the functional liquid cannot stay in the corner portion 30 c formed by the outer peripheral portion 30 a of the insulating film 30 in the wiring direction of the second bridge wiring film 21 and the upper surface 30 b of the insulating film 30. The functional liquid is applied along the outer peripheral portion 30a in the wiring direction.

  Thus, in the initial wiring film coating step (S50b), the initial wiring film (A) 21a formed along the outer peripheral portion 30a of the insulating film 30 and the upper surface 30b of the insulating film 30 as a part of the second bridge wiring film 21. The initial wiring film (B) 21b formed in (1) is formed. In this state, the wiring film is disconnected at the corner portion 30c of the insulating film 30, and the wiring film does not function as a conductive film. In this embodiment, the initial wiring film (A) 21a and the initial wiring film (B) 21b are in a so-called disconnection state that is independent from each other. However, the initial wiring film (A) 21a and the initial wiring film (B) 21b may be connected to each other depending on manufacturing conditions. However, even in such a case, the initial wiring film may be insufficient in film thickness or film width in the corner portion 30c of the insulating film 30, and the second wiring film forming step described later can be performed to perform the second process. A bridge wiring film 21 is formed.

  In the initial wiring film application step (S50b), the droplet discharge method is such that when the droplet contacts the outer peripheral portion 30a in the wiring direction of the second bridge wiring film 21 of the insulating film 30, the initial wiring film (A) 21a It is surely formed, and the later-described via wiring film 21c is more easily formed. Further, the initial wiring film (A) 21a is formed by changing the droplet discharge interval (pitch) between the initial wiring film (A) 21a and the initial wiring film (B) 21b on the insulating film 30. In consideration of increasing the amount of applied liquid droplets and the flow of the functional liquid during drying of the initial wiring film (B) 21b, the droplet discharge interval (pitch) is partially expanded to obtain an initial wiring film ( B) It is also preferable to form the via wiring film 21c by partially reducing the coating amount of the droplets for forming 21b.

  Note that the initial wiring film (B) 21b formed on the upper surface 30b of the insulating film 30 does not have to be formed in the initial wiring film coating step (S50b) when discharging the functional liquid droplets. It can also be formed in a via portion wiring film coating step (S50c) described later.

  Next, the process proceeds to the transit wiring film coating step (S50c). As shown in FIG. 11B, the intermediate wiring film coating step (S50c) is formed by the initial wiring film (A) 21a and the initial wiring film (B) 21b obtained in the initial wiring film coating step (S50b). A functional liquid is further applied to the substrate 1 thus formed to form a via wiring film 21c.

  Also in the via portion wiring film coating step (S50c), as in the initial wiring film coating step (S50b), from the end portion of the second island-shaped electrode portion 22 to the end portion of the other second island-shaped electrode portion 22 adjacent thereto. Then, a predetermined amount of functional liquid droplets are ejected onto the placement portion while moving the droplet ejection head 1001 along the wiring direction of the second bridge wiring film 21 or in a direction perpendicular to the wiring direction. At this time, in consideration of the flow of the functional liquid when the via wiring film 21c is dried, the droplet discharge interval (pitch) is partially widened, and the application amount of the droplet for forming the via wiring film 21c is partially increased. It is also preferable to form the via portion wiring film 21c.

  At this time, in the corner portion 30c portion of the insulating film 30, the functional liquid is applied without any interruption by applying the functional liquid on the basis of the initial wiring film (A) 21a formed in advance. Is applied to form. Accordingly, it is possible to form the second bridge wiring film 21 in which conductivity is ensured.

  The via portion wiring film coating step (S50c) can be performed twice or more. For example, as described above, in the initial wiring film coating step (S50b), a wiring film is not formed on the insulating film 30, and in the via portion wiring film coating step (S50c), two or more functional liquids are applied. You can also. Alternatively, it is possible to increase the cross-sectional area of the second bridge wiring film 21 by performing the via wiring film coating step (S50c) twice or more in order to improve the conduction performance.

  The surface treatment step (S50a) described above makes the formation range of the second bridge wiring film 21 lyophilic, and the outside of the formation range of the second bridge wiring film 21 is lyophobic, so that the discharged functional liquid Has a large contact angle θ at the liquid repellent portion. As a result, the functional liquid for forming the second bridge wiring film 21 is prevented from spreading out from the formation range of the insulating film 30, and an electrical short circuit with the first bridge wiring film 11 is prevented. The film width can be narrowed.

  After the functional liquid is applied as described above, the process proceeds to the solidification step (S50d). In the solidifying step (S50d), the applied functional liquid is heated and dried and solidified to form the second bridge wiring film 21.

  By forming the second bridge wiring film 21, the second bridge wiring film 21 having a narrow line width is formed on the insulating film 30 whose width is reduced with respect to the wiring direction of the second bridge wiring film 21. In addition, the initial wiring film (B) 21b and the via wiring film 21c are laminated on the insulating film, so that the wiring cross-sectional area of the conductive portion can be secured, and the predetermined electrical conductivity can be secured. Can do. Accordingly, it is possible to reduce the interval between adjacent island-shaped electrode portions, and it is possible to reduce the size of the touch panel, and to increase the electrode density if the size is the same, thereby realizing a touch panel with higher sensitivity. .

  Next, the process proceeds to the planarization film forming step S60. In the planarization film forming step S60, as shown in FIG. 9A, the planarization film 5 made of an insulating material is formed on almost the entire functional surface 1a for the purpose of planarizing the functional surface 1a of the substrate 1. The planarizing film 5 can be formed using a functional liquid similar to the functional liquid for forming the insulating film 30 used in the insulating film forming step S40. However, since the purpose is to planarize the surface of the substrate 1, a resin is used. It is preferable to use a material.

  Next, the process proceeds to the protective substrate bonding step S70. In the protective substrate bonding step S <b> 70, as shown in FIG. 9B, an adhesive layer 6 containing an adhesive is disposed between the protective substrate 7 and the planarization film 5 separately prepared, and the protective layer 6 is protected via the adhesive layer 6. The substrate 7 and the planarizing film 5 are bonded together. The protective substrate 7 may be an optical element substrate such as a polarizing plate or a retardation plate, in addition to a transparent substrate made of glass, plastic, or the like. As an adhesive constituting the adhesive layer 6, a transparent resin material or the like can be used.

  Next, the process proceeds to shield layer forming step S80. In the shield layer forming step S80, as shown in FIG. 9C, the shield layer 8 made of a conductive film is formed on the back surface 1b of the substrate 1 (surface opposite to the functional surface 1a). The shield layer 8 can be formed using a known film formation method such as a vacuum film formation method, a screen printing method, an offset method, or a droplet discharge method. For example, when the shield layer 8 is formed using a printing method such as a droplet discharge method, a functional liquid containing ITO particles or the like used in the electrode film forming step S10 and the second bridge wiring film forming step S50 is used. be able to. In addition to the method of forming the shield layer 8 by film formation on the substrate 1, a film having a conductive film formed on one surface or both surfaces is separately prepared and the film is bonded to the back surface 1b of the substrate 1. The conductive film on the film may be used as the shield layer 8.

  In this embodiment, the shield layer 8 is implemented at the end of the touch panel manufacturing process, but the shield layer 8 can be formed at an arbitrary timing. For example, the substrate 1 on which the shield layer 8 is formed in advance can be used for the electrode film forming step S10 and subsequent steps. Moreover, you may arrange | position a shield layer formation process between the arbitrary processes from electrode film formation process S10 to protective substrate joining process S70.

  In the present embodiment, the shield layer 8 is formed on the back surface 1 b of the substrate 1, but the shield layer 8 may be formed on the functional surface 1 a side of the substrate 1. In this case, prior to the electrode film forming step S10, a step of forming the shield layer 8 and a step of forming the insulating film 30 are performed. Also in this case, the shield layer 8 can be formed by the same method as in the shield layer forming step S80. Further, the formation process of the insulating film 30 can be the same as the insulating film formation process S40, for example.

(Configuration of electro-optical device)
Next, the configuration of the electro-optical device will be described. In the present embodiment, a configuration of a liquid crystal display device including the above-described touch panel applied to an electro-optical device will be described. 12A and 12B show the configuration of the liquid crystal display device. FIG. 12A is a plan view, and FIG. 12B is a cross-sectional view taken along line HH ′ in the plan view of FIG.

  As shown in FIG. 12A, the liquid crystal display device 500 includes an element substrate 410, a counter substrate 420, and an image display region 410a. The element substrate 410 is a rectangular substrate having a wider plane area than the counter substrate 420. The counter substrate 420 is an image display side in the liquid crystal display device 500, and is a transparent substrate formed of glass, acrylic resin, or the like. The counter substrate 420 is bonded to the central portion of the element substrate 410 through a sealing material 452. The image display area 410 a is a planar area of the counter substrate 420 and is an inner area of a peripheral parting line 453 provided along the inner periphery of the sealing material 452.

  In the periphery of the counter substrate 420 in the element substrate 410, the data line driving circuit 401, the scanning line driving circuit 404, the connection terminal 402 connected to the data line driving circuit 401 and the scanning line driving circuit 404, and the counter substrate 420. A wiring 405 for connecting the scanning line driving circuits 404 arranged to face each other is disposed.

  Next, a cross section of the liquid crystal display device 500 will be described. A pixel electrode 409, an alignment film 418, and the like are stacked on the surface of the element substrate 410 on the liquid crystal layer 450 side. A light shielding film (black matrix) 423, a color filter 422, a common electrode 425, an alignment film 429, and the like are stacked on the surface of the counter substrate 420 on the liquid crystal layer 450 side. A liquid crystal layer 450 is sandwiched between the element substrate 410 and the counter substrate 420. The touch panel 100 of the present invention is disposed on the outer surface (opposite side of the liquid crystal layer 450) of the counter substrate 420 with the adhesive layer 101 interposed therebetween.

(Configuration of electronic equipment)
Next, the configuration of the electronic device will be described. In the present embodiment, a configuration of a mobile personal computer that is a mobile personal computer as an electronic device and includes the above-described touch panel or a liquid crystal display device including a touch panel will be described. FIG. 13 is a perspective view showing a configuration of a mobile personal computer. A mobile personal computer 1100 includes a display portion 1101 and a main body portion 1103 having a keyboard 1102. A mobile personal computer 1100 includes the liquid crystal display device 500 of the above embodiment in a display unit 1101. According to the mobile personal computer 1100 having such a configuration, since the touch panel of the present invention is used for the display unit, an electronic device with reduced manufacturing costs can be obtained.

  In addition, said electronic device is an example of the electronic device of this invention, Comprising: The technical scope of this invention is not limited. For example, the touch panel according to the present invention can be suitably used for a display unit such as a mobile phone, a portable audio device, or a PDA (Personal Digital Assistant).

  As described above, the preferred embodiments according to the present invention have been described with reference to the accompanying drawings, but the present invention is not limited to the examples. Various shapes, combinations, and the like of the constituent members shown in the above-described examples are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

  (Modification) In the configuration of the touch panel 100 of the above-described embodiment, the X electrode film 10 as the first electrode film and the Y electrode film 20 as the second electrode film are used as the first bridge wiring film 11 of the X electrode film 10. Although the insulating film 30 is formed on the insulating film 30 and the second bridge wiring film 21 is formed on the insulating film 30, the present invention is not limited to this. For example, the Y electrode film 20 is used as the first electrode film, the X electrode film 10 is used as the second electrode film, the second bridge wiring film 21 of the Y electrode film 20 is formed on the substrate 1, and the second bridge wiring film 21 is formed. An insulating film 30 may be provided thereon, the first bridge wiring film 11 may be formed on the insulating film 30, and the X electrode film 10 and the Y electrode film 20 may cross each other. Even in this case, by applying the configuration and manufacturing method of the second bridge wiring film 21 described in the above embodiment to the configuration and manufacturing method of the first bridge wiring film 11 described above, the same as described above. The effect of can be obtained.

  DESCRIPTION OF SYMBOLS 10 ... X electrode film, 11 ... 1st bridge wiring film, 12 ... 1st island-like electrode part, 20 ... Y electrode film, 21 ... 2nd bridge wiring film, 22 ... 2nd island-like electrode part, 30 ... Insulating film .

Claims (8)

A method for manufacturing a touch panel having a plurality of first electrode films and a plurality of second electrode films formed on one surface of a substrate and extending in directions intersecting each other,
A first electrode film forming step of forming a plurality of first island electrode portions spaced in the first direction and a first bridge wiring film that electrically connects the adjacent first island electrode portions;
A second island-shaped electrode part forming step of forming a plurality of second island-shaped electrode parts at intervals in a second direction intersecting the first direction;
An insulating film forming step of forming an insulating film covering at least a part of the first bridge wiring film;
A second bridge wiring film forming step of forming a second bridge wiring film that electrically connects the adjacent second island-like electrode portions via at least a portion of the insulating film;
The second bridge wiring film forming step includes
An initial wiring film forming step of forming an initial wiring film from at least a peripheral edge of the insulating film to the second island-shaped electrode portion;
A method of manufacturing a touch panel, comprising: a step of forming an interconnect wiring film forming step of electrically connecting adjacent initial wiring films and forming a wiring film passing over the insulating film. In the manufacturing method of the touch panel according to claim 1,
A method for manufacturing a touch panel, comprising: a surface treatment step of performing a liquid repellency treatment on the surface of the substrate between the first electrode film formation step and the insulating film formation step. In the manufacturing method of the touch panel according to claim 2,
In the surface treatment process, a surface treatment agent containing a silane compound is used. In the manufacturing method of the touch panel according to claim 3,
In the surface treatment step, a surface treatment agent containing hexamethyldisilazane is used. In the manufacturing method of the touch panel according to any one of claims 1 to 4,
In the initial wiring film forming step and the intermediate part wiring film forming step,
An application step of discharging the functional liquid containing the material of the second bridge wiring film as droplets and applying the functional liquid on a formation range of the second bridge wiring film;
Solidifying the functional liquid applied in at least the intermediate part wiring film forming step to form the second bridge wiring film,
A manufacturing method of a touch panel characterized by the above. A touch panel having a plurality of first electrode films and a plurality of second electrode films formed on one surface of a substrate and extending in directions intersecting each other,
The first electrode film includes:
A plurality of first island-shaped electrode portions formed at intervals in the first direction;
A first bridge wiring film that electrically connects the adjacent first island-shaped electrode portions,
The second electrode film is
A plurality of second island-shaped electrode portions formed at intervals in a second direction intersecting the first direction;
A second bridge wiring film that electrically connects adjacent second island-shaped electrode portions and has a via portion that passes through an insulating film formed on the first bridge wiring film;
The insulating film is the same as or narrower than the interval between the adjacent first island-shaped electrode portions,
A touch panel characterized by that.   An electro-optical device comprising the touch panel according to claim 6.   An electronic apparatus comprising the electro-optical device according to claim 7.

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