JP2012069049A - Electrode substrate and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electrode substrate where a connection conductive layer which connects adjacent electrode layers to each other is formed to a fine width dimension, and a method of manufacturing the same.SOLUTION: A liquid resin 25 is supplied in dots by an ink jet system to an electrode formation surface 11a of a substrate, and dots to which the liquid resin is supplied are made different in density with places. When the supplied liquid resin is fused, swell parts 21a, 21a and a hollow part 22a between them are formed by the viscosity and surface tension of the liquid resin. Before shapes of the swell parts 21a, 21a and hollow part 22a disappear, the liquid resin 25a is irradiated with UV and cured to form weirs and a groove between them, and the connection conductive layer which connects electrode layers is formed in the groove part.

Description

  The present invention relates to an electrode substrate in which an electrode layer is formed on a surface used for a detection device that detects a change in capacitance, a detection device of another type, or a display device. The present invention relates to an electrode substrate having a structure in which a second electrode layer is provided between electrode layers, and the first electrodes are connected across the second electrode layer, and a manufacturing method thereof.

  Conventional electrode substrates used in detection devices and display devices have a structure in which the electrode layer pattern is formed separately on the front and back surfaces of the substrate, or a structure in which an insulating layer is interposed between the patterns of the plurality of electrode layers. there were. Recently, in order to reduce the thickness of the device, an electrode substrate having a plurality of types of electrode layer patterns formed on one surface of one substrate has been used. This electrode substrate employs a structure in which adjacent electrode layers are connected by a connection electrode layer with another electrode layer sandwiched between adjacent electrode layers.

  If the width dimension of the connection electrode layer is too large, there is a problem that the capacitance between the connection electrode layer and the other electrode layer positioned below the connection electrode layer increases. Therefore, it is necessary to form the connection electrode layer while controlling the pattern shape. In particular, the translucent electrode substrate used in the detection device provided in front of the display device and the display device itself is easily visible when the width of the connection conductive layer becomes too large to be controlled. Problem arises.

  Patent Documents 1 and 2 below disclose an electrode substrate used in a capacitance type detection device.

  In the electrode substrate described in Patent Document 1, a plurality of Y electrode layers extending in the Y direction and a plurality of X electrode layers arranged between the Y electrode layers are formed on one surface of the light-transmitting substrate. Yes. The Y electrode layer and the X electrode layer are covered with a negative resist insulating film, and a contact hole is formed in the insulating film to expose the X electrode layer. An ITO conductive film is formed on the insulating film, the ITO is separated by etching, and a connection conductive layer for connecting adjacent X electrodes is formed by a part of the ITO.

  In the electrode substrate described in Patent Document 2, a plurality of X electrode layers and a plurality of Y electrode layers arranged between the X electrode layers are formed on one surface of the light-transmitting substrate, and the X electrode layer These narrow portions are covered with an interlayer insulating film. An ITO transparent electrode layer is formed on the interlayer insulating layer, and the ITO is etched to form a connection conductive layer connecting adjacent Y electrode layers.

JP 2009-265748 A JP 2008-310550 A

  The electrode substrates described in Patent Documents 1 and 2 employ a photolithographic mask formation process and an ITO etching process in order to form a connection conductive layer that connects adjacent electrode layers. In these steps, since the pattern shape of the connection conductive layer is easily controlled, a connection conductive layer having a thin pattern shape that is difficult to see and difficult to form a large capacity can be formed.

  However, since the number of steps of the photolithography process and the etching process increases, the manufacturing cost of the electrode substrate increases. In addition, since the heating process is increased, the material to be used is limited, and the substrate material is also limited to glass or the like, so that a synthetic resin substrate or the like cannot be used.

  SUMMARY OF THE INVENTION The present invention solves the above-described conventional problems, and an object thereof is to provide an electrode substrate that can be formed with a simple structure and a connection conductive layer with its width dimension restricted.

  Another object of the present invention is to provide a method of manufacturing an electrode substrate that can form a connection conductive layer with its width dimension controlled without performing a photolithography process or an etching process.

The present invention provides a conductive connection for connecting a plurality of first electrode layers, a second electrode layer positioned between adjacent first electrode layers, and adjacent first electrode layers to a surface of a substrate. In an electrode substrate provided with a layer,
An insulating layer that covers the second electrode layer is provided, and a weir body that is opposed to the insulating layer at an interval is integrally formed, and the connection conductive layer has a width between two facing weir bodies. It is characterized in that the dimensions are regulated.

  In the electrode substrate of the present invention, a weir body is formed in an insulating layer provided on the surface of the substrate, and a connection conductive layer whose width dimension is regulated by this weir body is formed. Since the connection conductive layer is formed with a narrow width by controlling the width dimension, the capacitance between the connection conductive layer and the electrode layer therebelow can be reduced, and deterioration of electrical characteristics can be prevented.

  In the present invention, the substrate, the first electrode layer and the second electrode layer, and the insulating layer can be configured to be translucent.

  In the translucent electrode substrate, since the connection conductive layer is formed with its width dimension regulated to be thin, the presence of the connection conductive layer is not noticeable visually. Therefore, when used in combination with a display device or used as an electrode substrate constituting the display device, the connection conductive layer can be prevented from obstructing display.

  For example, in the present invention, the directions orthogonal to each other are defined as a first direction and a second direction, and a plurality of second electrode layers extend in the second direction with an interval in the first direction. The first electrode layers are connected in the first direction by the connection conductive layer, and the columns of the first electrode layers connected by the connection conductive layer are spaced in the second direction. Multiple rows are provided.

  The present invention can be configured such that the insulating layer is partially formed between adjacent first electrode layers.

  In the present invention, the insulating layer is formed to have a size covering both the first electrode layer and the second electrode layer, and the weir body is partially formed in the insulating layer. In addition, it is preferable that a hole for connecting the connection conductive layer to the first electrode layer is formed.

  In the above configuration, since the first electrode layer and the second electrode layer are covered and protected by the insulating layer, the first electrode layer and the second electrode layer are hardly deteriorated. Even when the electrode substrate is bonded to the translucent panel via the pressure-sensitive adhesive layer, it is possible to protect the surfaces of the first electrode layer and the second electrode layer from directly contacting the pressure-sensitive adhesive. Become.

  For example, the electrode substrate of the present invention can constitute a detection device that detects a change in capacitance when a finger approaches the electrode layer.

The electrode substrate manufacturing method of the present invention uses a substrate provided with a plurality of first electrode layers and a second electrode layer positioned between adjacent first electrode layers,
A liquid resin that covers the second electrode layer is supplied to form a raised portion of the liquid resin that is opposed to each other with a gap between the adjacent first electrode layers. Before the part is eliminated, the liquid resin is cured to integrally form an insulating layer covering the second electrode layer and a weir body facing each other with a gap therebetween,
A conductive material is supplied onto the insulating layer to form a connection conductive layer with a width dimension regulated between the weir bodies, and both end portions of the connection conductive layer are connected to each of the adjacent first electrode layers. It is characterized by connecting.

  The electrode substrate manufacturing method of the present invention can form a weir body by supplying a liquid resin having a predetermined viscosity to the surface of the substrate by changing the supply amount depending on the location. It is possible to regulate the width of the layer. In this manufacturing method, the photolithography process and the etching process are unnecessary, or the number of times can be reduced, so that the number of steps can be reduced and the cost can be reduced. Moreover, since there are few heating processes, it is also possible to use a synthetic resin substrate.

  According to the present invention, it is possible to spray the liquid resin on the surface of the substrate little by little, and to form the swelled portion by varying the spray amount depending on the location.

  In the present invention, the substrate, the first electrode layer and the second electrode layer, and the liquid resin are preferably translucent.

  In the present invention, the insulating layer can be partially formed by supplying a liquid resin between adjacent first electrode layers.

  The present invention also provides a liquid resin on the first electrode layer and the second electrode layer to form an insulating layer having an area covering both the first electrode layer and the second electrode layer. It is possible to partially form the weir body in the insulating layer and to form a hole for connecting the connection conductive layer to the first electrode layer.

  In the electrode substrate of the present invention, an insulating layer that covers the second electrode layer is formed on the substrate, and the width dimension of the connection electrode layer is regulated by a weir body provided on the insulating layer. For this reason, the connection electrode layer can be made narrow, electrical characteristics can be prevented from deteriorating, and the connection conductive layer is difficult to see when forming a translucent electrode substrate.

  The method for manufacturing an electrode substrate according to the present invention makes it possible to form a connection conductive layer with a regulated width dimension by a simple process in which the amount of liquid resin supplied to the surface of the substrate varies depending on the location. In addition, the number of processes is small and the cost is low, and the selection range of materials can be expanded by reducing the heating process.

Sectional drawing of the detection apparatus using the electrode substrate of embodiment of this invention, The partial top view of the electrode formation surface of the electrode substrate of embodiment of this invention, FIG. 2 is an enlarged plan view showing a part of FIG. FIG. 4 is an enlarged cross-sectional view taken along line IV-IV in FIG. The cross-sectional enlarged view of the VV line of FIG. Explanatory drawing explaining the process of forming the insulating layer shown in FIG. Explanatory drawing explaining the process of forming an insulating layer in sectional drawing of the VII-VII line of FIG. FIG. 4 is an enlarged cross-sectional view corresponding to FIG. 4 showing an electrode substrate according to a second embodiment of the present invention; FIG. 5 is an enlarged cross-sectional view corresponding to FIG. 5 showing an electrode substrate according to a second embodiment of the present invention; Operation explanatory diagram of the detection device using the electrode substrate of the embodiment of the present invention,

  A capacitance type detection device 1 shown in FIG. 1 has an electrode substrate 10 according to an embodiment of the present invention. The electrode substrate 10 includes a substrate 11 formed of a light-transmitting synthetic resin film such as PET (polyethylene terephthalate), and the electrode forming surface 11a of the substrate 11 is placed on the operation panel via the adhesive layer 2. 3 is joined to the back surface 3a. The pressure-sensitive adhesive layer 2 is formed of a light-transmitting pressure-sensitive adhesive such as acrylic. The operation panel 3 is formed of a translucent synthetic resin plate such as polycarbonate or a translucent glass plate.

  In this specification, translucency means that the total light transmittance is 60% or more, preferably 80% or more.

  A detection device 1 shown in FIG. 1 is disposed in front of a self-luminous display device such as a liquid crystal display device having a backlight, and the display content of the display device can be visually observed through the detection device 1. It has become.

  In the detection device 1, the front surface of the operation panel 3 is the operation surface 3b. As shown in FIG. 10, when a person's finger, which is a conductor having a substantially ground potential, touches the operation surface 3b, a change in capacitance formed between the electrode layer provided on the electrode substrate 10 and the finger. Is detected.

  FIG. 2 shows an electrode forming surface 11 a of the substrate 11 constituting the electrode substrate 10. In the electrode substrate 10, the X direction is the first direction and the Y direction is the second direction among the X direction and the Y direction orthogonal to each other in a plane parallel to the electrode formation surface 11 a.

  As shown in FIG. 2, a plurality of second electrode layers 14 are formed on the electrode formation surface 11a. Each of the second electrode layers 14 extends continuously in the Y direction (second direction), and is formed at a certain interval in the X direction (first direction). Each of the second electrode layers 14 includes a rectangular main detection unit 14a disposed at a constant interval in the Y direction and a width detail 14b that connects the main detection units 14a continuously and integrally formed. Yes.

  A plurality of first electrode layers 13 are formed on the electrode forming surface 11 a of the substrate 11. The first electrode layer 13 has a rectangular shape, and all the first electrode layers 13 are formed independently of each other. The rectangular shape and area of the first electrode layer 13 are the same as those of the main detection unit 14 a of the second electrode layer 14. Each first electrode layer 13 is located between the second electrode layers 14 adjacent to each other in the X direction, and the first electrode layer 13 is disposed in a region surrounded by the main detection unit 14a. ing.

  The first electrode layer 13 and the second electrode layer 14 are made of a light-transmitting conductive material such as ITO. A composite material in which a conductive material layer layer such as ITO is formed on the entire surface of a substrate 11 such as a PET film is used, and the conductive material layer is etched so that the first electrode layer 13 and the second electrode are etched. Layer 14 is formed. That is, the first electrode layer 13 and the second electrode layer 14 are formed of the same material and the same film thickness on one surface of the substrate 11.

  As shown in FIG. 3, a plurality of insulating layers 20 are formed on the electrode forming surface 11 a of the substrate 11. The insulating layer 20 is a light-transmitting organic insulating material (synthetic resin material) and is partially formed on the electrode forming surface 11a.

  As shown in FIGS. 3, 4, and 5, the insulating layer 20 has an elongated shape in which the length dimension in the X direction is larger than the width dimension W <b> 2 in the Y direction. The insulating layer 20 includes the surfaces of the opposed end portions 13a and 13a of the adjacent first electrode layer 13 and the surface of the width detail 14b of the second electrode layer 14, and the surface of the substrate 11 where the electrode layer is not present. It is formed over.

  As shown in FIG. 5, weir bodies 21, 21 are integrally formed on the top (upper part) of the insulating layer 20 with an interval in the Y direction. The weir bodies 21 and 21 are formed by raising a part of the insulating material forming the insulating layer 20, and a groove portion 22 is formed between the opposing weir bodies 21 and the weir bodies 21. The two weir bodies 21 and 21 and the groove portion 22 extend in the Y direction and are formed to the end portions 20 a and 20 a on the X side of the insulating layer 20. Alternatively, the two weir bodies 21 and 21 and the groove portion 22 are formed up to the vicinity of the end portions 20a and 20a.

  A connection conductive layer 15 is formed in the groove 22 of the insulating layer 20. The connection conductive layer 15 is formed with the width dimension W <b> 1 in the Y direction regulated by the weir bodies 21 and 21. The connection conductive layer 15 is elongated along the groove portion 22 in the Y direction, and the respective end portions 15a and 15a extend in the Y direction from the end portions 20a and 20a of the insulating layer 20. End portions 15 a and 15 a of the conductive layer 15 are respectively joined to the surface of the first electrode layer 13.

  By the connection conductive layer 15, the first electrode layers 13 adjacent in the X direction are electrically connected. However, since the insulating layer 20 is formed under the connection conductive layer 15, the width detail 14b of the second electrode layer 14 and the connection conductive layer 15 are insulated.

  As shown in FIG. 5, the connection conductive layer 15 is formed by the weir bodies 21 and 21 formed in the insulating layer 20 so that the width dimension W1 in the Y direction is regulated. In addition, the width W1 is formed with high accuracy. Since the connection conductive layer 15 is thin, even if the connection conductive layer 15 is formed of a non-translucent material such as silver, it is difficult to see from the front, and the connection conductive layer 15 is installed in front of the self-luminous display device. Sometimes it is difficult to obscure the visual contents of the display.

  Further, since the width dimension W1 of the connection conductive layer 15 can be made minute, the facing area between the connection conductive layer 15 and the width detail 14b of the second electrode layer 14 is small, and the capacitance between the two is small. . Therefore, when detecting a change in capacitance when a finger approaches the first electrode layer 13 and the second electrode layer 14, the effect of the opposing portion of the width detail 14 b and the connection conductive layer 15 on the resolution is affected. Can be very small.

  The width dimension W1 of the connection conductive layer 15 is less than 100 μm and 30 μm or more, for example, 50 μm. Even if the connection conductive layer 15 is formed of a non-light-transmitting material such as silver, it is difficult to recognize with human eyes if the width dimension is less than 100 μm. The width dimension W2 of the insulating layer 20 is twice to three times the width dimension W1 of the connection conductive layer 15. The height dimension H of the insulating layer 20 is 5 μm or less. Incidentally, the thickness dimension T of the first electrode layer 13 and the second electrode layer 14 made of ITO is about 20 nm.

  All the first electrode layers 13 in a row arranged in the X direction are all connected by a connection conductive layer 15 and are electrically connected to each other. Rows of first electrode layers 13 connected in the X direction are arranged at intervals in the Y direction. Each second electrode layer 14 extending continuously in the Y direction is used as a Y detection electrode, and each column of the first electrode layers 13 connected in the X direction by the connection conductive layer 15 is used as an X detection electrode. used.

  In the drive detection circuit provided in the detection device 1, a delay circuit composed of a capacitor and a resistor in which each X detection electrode is one electrode, and a capacitor and a resistance in which each Y detection electrode is one electrode. There are provided a plurality of delay circuits each composed of a counter. In this delay circuit, the delay time of the rise of the output voltage changes due to the change in the capacitance of the capacitor.

  In the drive detection circuit, pulsed voltages are sequentially applied to a plurality of delay circuits including the X detection electrodes, and pulsed voltages are sequentially applied to the plurality of delay circuits including the Y detection electrodes at different timings. Is done.

  As shown in FIG. 10, when a human hand touches the operation surface 3 b of the operation panel 3 of the detection device 1, the first electrode layer 13 that is an X detection electrode and the second electrode layer 14 that is a Y detection electrode. One of the main detection units 14a faces the finger. At this time, the capacitance of the capacitor formed between the detection electrode and the finger increases, and the delay time of the output voltage of the delay circuit including the detection electrode increases.

  The drive detection circuit detects the coordinate position where the finger is in contact from the timing of which X detection electrode or Y detection electrode is applied with the voltage and the measured value of the delay time.

Next, a method for manufacturing the electrode substrate 10 will be described with reference to FIGS.
A composite material in which a conductive material layer such as ITO is formed on the entire surface of a substrate 11 such as a PET film is used, and the conductive material layer is etched so that the pattern of the first electrode layer 13 and the second electrode layer 13 are etched. A pattern of the electrode layer 14 is formed.

  Thereafter, a liquid resin is partially supplied to the electrode forming surface 11a of the substrate 11 by an ink jet method, and the liquid resin is cured by UV irradiation or the like, whereby the insulating layer 20 is formed.

  In the inkjet method, a liquid resin containing a UV curable acrylic resin is sprayed in a dot-like manner on the electrode forming surface 11a of the substrate 11 from the ejection holes opened in the inkjet head. The position where the molten resin is sprayed and the supply amount of the liquid resin can be freely set by changing the dot pattern of inkjet printing.

  As shown in FIG. 6 and FIG. 7A, in the region of the width dimension Wa located on both sides in the Y direction across the center line O of the region where the insulating layer 20 is formed, the liquid resin 25 is discharged and sprayed. Increase the density. Further, the dot density is lowered in the region of the width dimension Wb where the center line O is located. The dot density may be changed in two steps between the region of the width dimension Wa and the region of the width dimension Wb, or the dot density is changed in multiple steps to increase the dot density in the region of the width dimension Wa. The dot density may be gradually lowered from the center toward the center line O.

  The dot density can be freely set by adjusting the relative speed between the inkjet head and the substrate 11. If the relative speed between the inkjet head and the substrate 11 is decreased, the dot density for supplying the liquid resin 25 can be increased. If the conductor speed is increased, the dot density is lowered.

  FIG. 7A schematically shows a state immediately after the liquid resin 25 is supplied in the form of dots on the electrode forming surface 11 a of the substrate 11. The liquid resin 25 supplied to the electrode forming surface 11a is gradually fused due to the wettability of the surface of the electrode layer. However, since the dot density is high in the width dimension Wa portion, FIG. As shown, the fused liquid resin layer 25a is formed with swelled portions 21a on both sides of the centerline O, and a recessed portion 22a is formed on the centerline O portion. As shown in FIG. 7B, UV is irradiated and the liquid resin layer 25a is cured in a state where the swelled portion 21a and the recessed portion 22a remain in the liquid resin layer 25a, and FIGS. As shown, the insulating layer 20 having the dam bodies 21 and 21 and the groove 22 is formed.

  In order for the liquid resin 25 supplied in the form of dots by inkjet printing to fuse and form an uneven portion on the surface as shown in FIG. 7B, the surface tension of the liquid resin 25 is 20 to 20%. The range is preferably 28 mN / m. Further, the liquid resin 25 can be ejected by an inkjet head, and the viscosity of the liquid resin 25 is preferably in the range of 8 to 12 mPa · s at 45 ° C. in order to form the uneven shape shown in FIG. 7B after ejection. .

  In ink jet printing, the dots of the liquid resin 25 can be patterned with high density and high precision by maintaining the relative position between the ink jet head and the substrate 11 with high precision. Therefore, the distance between the weirs 21 and 21 on the completed insulating layer 20, that is, the width dimension of the groove 22 can be set with high accuracy.

  After the insulating layer 20 is formed, the connection conductive layer 15 is formed in the groove 22. The connection conductive layer 15 is also formed by an inkjet method.

  The conductive liquid material used in the inkjet method is composed of silver nanoparticles and a solvent. With an ink jet head, a conductive liquid material is applied so as to form a linear pattern from above the groove 22 to above the first electrode layers 13 on both sides. Then, the connection conductive layer 15 is formed by evaporating the solvent and heating at a temperature of 150 ° C. or lower to sinter the silver nanoparticles. Since the conductive liquid material supplied by the ink jet method has fluidity, it tends to spread when supplied to the surface of the substrate. However, as shown in FIG. 5, since the conductive liquid material supplied to the groove 22 is restricted from spreading by the weir bodies 21, 21, the width W1 of the connection conductive layer 15 after sintering is restricted. It becomes narrow. Further, since the distance between the weir bodies 21 and 21 is determined with high accuracy, the width W1 of the connection conductive layer 15 can be as fine as about 50 μm, and the error is extremely small.

  8 and 9 show an electrode substrate 110 according to the second embodiment of the present invention. 8 corresponds to the cross-sectional view of FIG. 4, and FIG. 9 corresponds to the cross-sectional view of FIG.

  In this electrode substrate 110, the liquid resin 25 is supplied to the entire area of the electrode formation surface 11a of the substrate 11 on which the first electrode layer 13 and the second electrode layer 14 having the same pattern as in FIG. The The liquid resin 25 is supplied to the surfaces of the first electrode layer 13 and the second electrode layer 14 at a uniform dot density, and the entire area of the first electrode layer 13 and the second electrode layer 14 is covered with the liquid resin. Is called. The dot density of the liquid resin 25 is lowered at the center line O (see FIG. 6) where the connection conductive layer 15 is formed. As a result, a depression is formed in the center line O, and a swell is formed on both sides thereof. In the place where the end portions 15a and 15a of the connection conductive layer 15 are formed, the liquid resin 25 is not supplied and the opposed end portions 13a and 13a of the first electrode layers 13 and 13 are exposed.

  When the liquid resin 25 is UV cured after the liquid resin 25 is supplied, an insulating layer 120 covering the first electrode layer 13 and the second electrode layer 14 is formed as shown in FIGS. A groove 122 is formed in a portion of the center line O crossing the width detail 14b of the second electrode layer 14, and weir bodies 121, 121 are formed on both sides thereof. Further, as shown in FIG. 8, holes 123 and 123 where the resin layer does not exist are formed on the opposed end portions 13a and 13a of the first electrode layers 13 and 13, respectively.

  A conductive liquid material is supplied from the groove 122 to the holes 123 and 123 by an ink jet method, and sintered to form the connection conductive layer 15.

  In addition, the dot density of the liquid resin 25 supplied to the portion where the weir bodies 121 and 121 are formed is made denser than the number of dots on the surfaces of the first electrode layer 13 and the second electrode layer 14, so that the insulating layer The weir bodies 121 and 121 that lift from 120 may be formed.

  In the insulating substrate 110 shown in FIGS. 8 and 9, the first electrode layer 13 and the second electrode layer 14 are covered with the insulating layer 120. Therefore, as shown in FIG. 1, when the detection device 1 is configured by joining the operation panel 3 with the pressure-sensitive adhesive layer 2, the pressure-sensitive adhesive layer 2 and the electrode layer are not in direct contact with each other. The pressure-sensitive adhesive easily absorbs moisture, but the surface of the electrode substrate 10 is covered with the cured resin insulating layer 120, so that moisture hardly adheres to the first electrode layer 13 and the second electrode layer 14. It is easy to prevent the deterioration.

  In the above embodiment, the connection conductive layer 15 is formed of a non-translucent material such as silver. However, the connection conductive layer 15 may be formed of a translucent material such as ITO.

  The place to which the present invention is applied is not limited to the detection area of the detection device that detects the change in the capacitance as in the above-described embodiment, but the wiring pattern on the side part outside the detection area of the capacitance is not drawn. In the rotating region, a connection conductive layer may be used to connect adjacent electrodes across other electrode layers.

  Further, in various display devices such as a liquid crystal display device, the present invention can be implemented for connection between electrode layers in the display area, and further, the present invention can be implemented in a wiring pattern routing area outside the display area. Can do.

DESCRIPTION OF SYMBOLS 1 Detection apparatus 2 Adhesive 3 Operation panel 3b Operation surface 10 Electrode board 11 Board | substrate 11a Electrode formation surface 13 1st electrode layer 14 2nd electrode layer 14a Main detection part 14b Width details 15 Connection conductive layer 20 Insulation layer 21 Weir body 21a Swelling portion 22 Groove portion 22a Depression portion 25 Liquid resin 110 Electrode substrate 120 Insulating layer 121 Weir body 122 Groove portion 123 Hole

Claims (11)

Provided on the surface of the substrate are a plurality of first electrode layers, a second electrode layer located between the adjacent first electrode layers, and a connection conductive layer connecting the adjacent first electrode layers. In the obtained electrode substrate,
An insulating layer that covers the second electrode layer is provided, and a weir body that is opposed to the insulating layer at an interval is integrally formed, and the connection conductive layer has a width between two facing weir bodies. An electrode substrate characterized in that the dimensions are regulated.   The electrode substrate according to claim 1, wherein the substrate, the first electrode layer and the second electrode layer, and the insulating layer are translucent.   The directions orthogonal to each other are defined as a first direction and a second direction, and the plurality of second electrode layers extend in the second direction with an interval in the first direction, and the plurality of first electrode layers Are connected in the first direction by the connection conductive layer, and a plurality of columns of the first electrode layers connected by the connection conductive layer are provided at intervals in the second direction. The electrode substrate according to claim 1 or 2.   The electrode substrate according to claim 1, wherein the insulating layer is partially formed between adjacent first electrode layers.   The insulating layer is formed so as to cover both the first electrode layer and the second electrode layer, and the weir body is partially formed in the insulating layer, and the connection conductive layer The electrode substrate according to any one of claims 1 to 3, wherein a hole for connecting the first electrode layer to the first electrode layer is formed.   The electrode substrate according to claim 1, wherein a change in capacitance when a finger approaches the electrode layer is detected. Using a substrate provided with a plurality of first electrode layers and a second electrode layer located between adjacent first electrode layers,
A liquid resin that covers the second electrode layer is supplied to form a raised portion of the liquid resin that is opposed to each other with a gap between the adjacent first electrode layers. Before the part is eliminated, the liquid resin is cured to integrally form an insulating layer covering the second electrode layer and a weir body facing each other with a gap therebetween,
A conductive material is supplied onto the insulating layer to form a connection conductive layer with a width dimension regulated between the weir bodies, and both end portions of the connection conductive layer are connected to each of the adjacent first electrode layers. A method for manufacturing an electrode substrate, comprising: connecting.   8. The method of manufacturing an electrode substrate according to claim 7, wherein the swelled portion is formed by spraying liquid resin on the surface of the substrate little by little, and varying the spray amount depending on the location.   The method for manufacturing an electrode substrate according to claim 7 or 8, wherein the substrate, the first electrode layer and the second electrode layer, and the liquid resin are translucent.   The method for manufacturing an electrode substrate according to claim 7, wherein a liquid resin is supplied between adjacent first electrode layers to partially form the insulating layer.   A liquid resin is supplied onto the first electrode layer and the second electrode layer to form an insulating layer having an area that covers both the first electrode layer and the second electrode layer. The method for manufacturing an electrode substrate according to claim 7, wherein the weir body is partially formed and a hole for connecting the connection conductive layer to the first electrode layer is formed.

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