KR20120031896A - Electrode substrate and mehtod for manufacturing thereof - Google Patents

Abstract

PURPOSE: An electrode substrate and a manufacturing method thereof are provided to prevent the deterioration of electrical characteristic by making the width of a connection electrode layer be thin. CONSTITUTION: An insulating layer(20) covers a second electrode layer. A weir(21) is formed on the insulating layer. A connection insulating layer is formed between two weirs. A substrate, first and second electrode layers, and the insulating layer are composed of transparent material. The second electrode layers are extended to a second direction. A first electrode layer(13) is connected by the connection insulating layer.

Description

Electrode substrate and its manufacturing method {ELECTRODE SUBSTRATE AND MEHTOD FOR MANUFACTURING THEREOF}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrode substrate on which an electrode layer is formed on a surface used for a detection device for detecting a change in capacitance, another type of detection device, a display device, or the like. It relates to an electrode substrate having a structure in which an electrode layer is formed and the first electrodes are connected over the second electrode layer, and a method of manufacturing the same.

The conventional electrode substrate used for the detection device and the display device has a structure in which the pattern of the electrode layer is divided into both front and back sides of the substrate, or a structure in which an insulating layer is interposed between the patterns of the plurality of electrode layers. In recent years, in order to realize thinning of an apparatus, the electrode substrate which provided the pattern of the several kind of electrode layer in the one surface of one board | substrate is used. This electrode substrate has a structure in which electrodes adjacent to each other are connected to the connecting electrode layer in a state where another electrode layer is interposed between the adjacent electrode layers.

If the width of the connecting electrode layer is too large, there is a problem such that the capacitance between the electrode layer and the other electrode layer positioned beneath becomes large. Therefore, the connection electrode layer needs to be formed by controlling the pattern shape. In particular, when the transmissive electrode substrate used in the detection device formed in front of the display device or the display device itself is large without being able to control the width dimension of the connection conductive layer, there is a problem that the pattern of the connection conductive layer becomes visible to the naked eye. do.

In the following patent documents 1 and 2, the electrode substrate used for a capacitive detection apparatus is disclosed.

As for the electrode substrate of patent document 1, the some Y electrode layer extended in a Y direction and the some X electrode layer arrange | positioned between the Y electrode layer are formed in one surface of a translucent board | substrate. The Y electrode layer and the X electrode layer are covered with an insulating film of a negative resist, and a contact hole through which the X electrode layer is exposed is formed in the insulating film. A conductive film of ITO is formed on the insulating film, the ITO is separated by etching, and a connection conductive layer is formed to connect X electrodes adjacent to each other by a part of the ITO.

As for the electrode substrate of patent document 2, the some X electrode layer and the some Y electrode layer arrange | positioned between the X electrode layer are formed in one surface of a translucent board | substrate, and the narrow part of the X electrode layer is covered with the interlayer insulation film. . The transparent electrode layer of ITO is formed on an interlayer insulation layer, ITO is etched, and the connection conductive layer which connects adjacent Y electrode layers is formed.

Japanese Unexamined Patent Publication No. 2009-265748 Japanese Laid-Open Patent Publication No. 2008-310550

The electrode substrates of patent documents 1 and 2 employ | adopt the mask formation process by photolithography and the process of etching ITO in order to form the connection conductive layer which connects adjacent electrode layers mutually. Since these processes are easy to control the pattern shape of a connection conductive layer, it is difficult to see with the naked eye and can form the connection pattern layer of a fine pattern shape in which a large capacitance is hard to be formed.

However, the photolithography step and the etching step increase the number of steps, which increases the manufacturing cost of the electrode substrate. Moreover, since a heating process increases, the material used is limited, the material of a board | substrate is also limited to glass, etc., and a synthetic resin board | substrate etc. cannot be used.

This invention solves the said conventional subject, Comprising: It aims at providing the electrode substrate which can form a connection conductive layer by regulating the width dimension with a simple structure.

Moreover, an object of this invention is to provide the manufacturing method of the electrode substrate which can form the connection conductive layer by controlling the width dimension, without performing a photolithography process or an etching process.

The present invention provides an electrode substrate having a plurality of first electrode layers, a second electrode layer positioned between adjacent first electrode layers, and a connection conductive layer connecting adjacent first electrode layers to a surface of the substrate. ,

The insulating layer which covers a 2nd electrode layer is formed, The weir which opposes at intervals is integrally formed in the said insulating layer, The said connection conductive layer is formed by restricting the width dimension between the two weirs which oppose. It is characterized by.

In the electrode substrate of this invention, weir is formed in the insulating layer formed in the surface of the board | substrate, and the connection conductive layer whose width dimension was regulated by this weir is formed. Since the connection conductive layer is formed to have a width in which the width dimension is controlled, the capacitance between the connection conductive layer and the electrode layer below it can be reduced, and the deterioration of electrical characteristics can be prevented.

The present invention can be configured such that the substrate, the first electrode layer and the second electrode layer, and the insulating layer are translucent.

In the translucent electrode substrate, since the width dimension is narrowly regulated and formed, the presence of a connection conductive layer becomes invisible to the naked eye. Therefore, when used in combination with a display apparatus or when used as an electrode substrate which comprises a display apparatus, it can prevent that a connection conductive layer interferes with a display.

For example, in the present invention, a direction perpendicular to each other is defined as a first direction and a second direction, and each of the plurality of second electrode layers extends in the second direction at intervals in the first direction, and the plurality of first The electrode layers are connected in the first direction by the connection conductive layer, and a plurality of rows of the first electrode layers connected by the connection conductive layer are formed at intervals in the second direction.

The present invention can be configured such that the insulating layer is partially formed between adjacent first electrode layers.

Moreover, in this invention, the said insulating layer is formed in the area | region which covers both a 1st electrode layer and a 2nd electrode layer, The said weir is partially formed in this insulating layer, and the said connection conductive layer is made into 1st. It is preferable that the hole connected to the electrode layer is formed.

In the above configuration, since the first electrode layer and the second electrode layer are covered with the insulating layer and protected, the first electrode layer and the second electrode layer are hardly deteriorated. Even when the electrode substrate is bonded through the light transmissive panel and the pressure-sensitive adhesive layer, the surfaces of the first electrode layer and the second electrode layer can be protected from directly contacting the pressure-sensitive adhesive.

For example, the electrode substrate of this invention can comprise the detection apparatus which detects the change of the capacitance when a finger approaches the said electrode layer.

The manufacturing method of the electrode substrate of this invention uses the board | substrate with which the 2nd electrode layer located between the some 1st electrode layer and the 1st electrode layer which adjoins mutually is used,

The liquid resin is supplied to cover the second electrode layer to form ridges of the liquid resin facing each other at intervals between adjacent first electrode layers, and the liquid resin is dissolved before the ridges are resolved according to the viscosity of the liquid resin. Curing to integrally form an insulating layer covering the second electrode layer and opposing weirs at intervals,

A conductive material is supplied on the insulating layer to form a connection conductive layer with a width dimension between the weirs, and both ends of the connection conductive layer are connected to each of the first electrode layers adjacent to each other. It is.

In the manufacturing method of the electrode substrate of this invention, when supplying the liquid resin of predetermined viscosity to the surface of a board | substrate, weir can be formed by changing the supply quantity according to a place, and this weir can regulate the width of a connection conductive layer. Can be. In this manufacturing method, the photolithography step and the etching step are unnecessary, or the number of times thereof can be reduced, so that man-hours can be reduced and costs can be reduced. Moreover, since there are few heating processes, a synthetic resin substrate can also be used.

According to the present invention, a small amount of liquid resin is sprayed onto the surface of the substrate, and the bulge portion can be formed by varying the spray amount depending on the place.

In this invention, it is preferable that the said board | substrate, a 1st electrode layer, a 2nd electrode layer, and liquid resin are translucent.

According to the present invention, the insulating layer can be partially formed by supplying a liquid resin between adjacent first electrode layers.

The present invention also provides an insulating layer having an area covering both the first electrode layer and the second electrode layer by supplying a liquid resin on the first electrode layer and the second electrode layer, and partially forming the weir on the insulating layer. Together, a hole for connecting the connection conductive layer to the first electrode layer can be formed.

In the electrode substrate of this invention, the insulating layer which covers a 2nd electrode layer is formed in a board | substrate, and the width dimension of a connection electrode layer is regulated by the weir formed in this insulating layer. Therefore, the connection electrode layer can be made wider, the deterioration of the electrical characteristics can be prevented, and when the light transmissive electrode substrate is constituted, the connection conductive layer becomes difficult to see with the naked eye.

The electrode substrate manufacturing method of the present invention can form a connection conductive layer whose width dimension is regulated in a simple step of varying the supply amount of the liquid resin supplied to the surface of the substrate from place to place. In addition, the number of steps is small, the cost is low, and the number of steps can be widened by reducing the heating step.

BRIEF DESCRIPTION OF THE DRAWINGS It is sectional drawing of the detection apparatus using the electrode substrate of embodiment of this invention.
2 is a partial plan view of the electrode formation surface of the electrode substrate of the embodiment of the present invention.
3 is an enlarged plan view of a part of FIG. 2.
4 is an enlarged cross-sectional view of the IV-IV line of FIG. 3.
5 is an enlarged cross-sectional view of the VV line of FIG. 3.
It is explanatory drawing explaining the process of forming the insulating layer shown in FIG. 3 with a top view.
It is explanatory drawing explaining the process of forming an insulating layer in sectional drawing of the VII-VII line | wire of FIG.
FIG. 8 is an enlarged cross-sectional view corresponding to FIG. 4 showing an electrode substrate according to the second embodiment of the present invention. FIG.
FIG. 9 is an enlarged cross-sectional view corresponding to FIG. 5 showing an electrode substrate according to a second embodiment of the present invention. FIG.
10 is an operation explanatory diagram of a detection device using the electrode substrate of the embodiment of the present invention.

The capacitive detection apparatus 1 shown in FIG. 1 has the electrode substrate 10 of embodiment of this invention. The electrode substrate 10 has a substrate 11 formed of a translucent synthetic resin film such as PET (polyethylene terephthalate), and the electrode formation surface 11a of the substrate 11 is operated via the pressure-sensitive adhesive layer 2. It is joined to the back surface 3a of the panel 3. The pressure-sensitive adhesive layer 2 is formed of a light-transmissive pressure-sensitive adhesive such as acrylic. The operation panel 3 is formed of a translucent synthetic resin plate such as polycarbonate, a translucent glass plate, or the like.

In the present specification, the light transmittance means that the total light transmittance is 60% or more, preferably 80% or more.

The detection device 1 shown in FIG. 1 is disposed in front of a self-luminous display device such as a liquid crystal display device having a backlight, and can penetrate the detection device 1 so that the display contents of the display device can be visually seen. It is.

As for the detection apparatus 1, the front surface of the operation panel 3 is the operation surface 3b. As shown in FIG. 10, when a human finger which is a conductor of almost ground potential touches the operating surface 3b, the change of the capacitance formed between the electrode layer formed in the electrode substrate 10 and the finger is detected.

2 has shown the electrode formation surface 11a of the board | substrate 11 which comprises the electrode substrate 10. As shown in FIG. In the electrode substrate 10, the X direction in the X direction and the Y direction orthogonal to each other in a plane parallel to the electrode formation surface 11 a is the first direction, and the Y direction is the second direction.

As shown in FIG. 2, the some 2nd electrode layer 14 is formed in the electrode formation surface 11a. Each second electrode layer 14 extends continuously in the Y direction (second direction), and is formed at regular intervals in the X direction (first direction). Each of the second electrode layers 14 has a rectangular main detector portion 14a arranged at regular intervals in the Y direction and a narrow portion 14b for connecting the main detector portions 14a in series. It is formed.

A plurality of first electrode layers 13 are formed on the electrode formation surface 11a of the substrate 11. The first electrode layer 13 is rectangular in shape, and all the first electrode layers 13 are formed independently of each other. The shape and the area of the rectangular shape of the first electrode layer 13 are the same as the main detection portion 14a of the second electrode layer 14. Each 1st electrode layer 13 is located between 2nd electrode layers 14 and 14 which adjoin each other in an X direction, and the 1st electrode layer 13 is arrange | positioned in the area | region enclosed by the main detection part 14a.

The first electrode layer 13 and the second electrode layer 14 are formed of a light-transmissive conductive material such as ITO. A composite material having a conductive material layer such as ITO formed on the entire surface of one side of a substrate 11 such as a PET film is used, and the first electrode layer 13 and the second electrode layer 14 are formed by etching the conductive material layer. That is, the 1st electrode layer 13 and the 2nd electrode layer 14 are formed in the same film thickness on the one surface of the board | substrate 11 with the same material.

As shown in FIG. 3, the some insulating layer 20 is formed in the electrode formation surface 11a of the board | substrate 11. As shown in FIG. The insulating layer 20 is a translucent organic insulating material (synthetic resin material), and is partially formed on the electrode formation surface 11a.

As shown to FIG. 3, FIG. 4, and FIG. 5, the insulating layer 20 is an elongate shape in which the length dimension of a X direction is larger than the width dimension W2 of a Y direction. The insulating layer 20 is formed of the surface of the opposing end portions 13a and 13a of the adjacent first electrode layer 13 and the surface of the narrow portion 14b of the second electrode layer 14 and the portion where the electrode layer does not exist. It is formed over the surface of the board | substrate 11.

As shown in FIG. 5, weirs 21 and 21 are integrally formed on the top (upper side) of the insulating layer 20 at intervals in the Y direction. A part of the insulating material which forms the insulating layer 20 is raised and formed in the weir 21, 21, and the groove part 22 is formed between the opposing weir 21 and the weir 21. As shown in FIG. The two weirs 21 and 21 and the groove part 22 extend in the Y direction, and are formed to the edge part 20a, 20a of the X side of the insulating layer 20. As shown in FIG. Or the two weirs 21 and 21 and the groove part 22 are formed to the vicinity of the said edge part 20a, 20a.

The connection conductive layer 15 is formed in the groove part 22 of the insulating layer 20. The connection conductive layer 15 is formed by restricting the width dimension W1 in the Y direction by the weirs 21 and 21. The connection conductive layer 15 extends along the groove part 22 toward a Y direction, and each edge part 15a, 15a is Y-direction rather than the edge part 20a, 20a of the insulating layer 20. As shown in FIG. It extends and the edge part 15a, 15a of the connection conductive layer 15 is joined to the surface of the 1st electrode layer 13, respectively.

By the connection conductive layer 15, the first electrode layers 13 adjacent to each other in the X direction are electrically connected to each other. However, since the insulating layer 20 is formed under the connection conductive layer 15, the narrow part 14b and the connection conductive layer 15 of the 2nd electrode layer 14 are insulated.

As shown in FIG. 5, since the width dimension W1 of the Y direction is regulated and formed by the weir 21, 21 formed in the insulating layer 20, the connection conductive layer 15 is formed. ) Is narrow in width, and the width dimension W1 is controlled to be formed with high precision. Since the connection conductive layer 15 is thinly formed, even when the connection conductive layer 15 is formed of a non-translucent material such as silver, it becomes difficult to see with the naked eye from the front, and when the connection conductive layer 15 is provided in front of the self-luminous display device, It is difficult to see the display with the naked eye.

Moreover, since the width dimension W1 of the connection conductive layer 15 can be made fine, the opposing area of the connection conductive layer 15 and the narrow part 14b of the 2nd electrode layer 14 becomes small, The capacity of is not enough. Therefore, when the change of the capacitance when a finger approaches the first electrode layer 13 and the second electrode layer 14, the effect of the opposing portion of the narrow portion 14b and the connection conductive layer 15 on the resolution Can be made very small.

The width dimension W1 of the connection conductive layer 15 is less than 100 µm and 30 µm or more, for example, 50 µm. Even if the connection conductive layer 15 is formed of a non-translucent material such as silver, it is difficult to recognize the human eye if the width dimension is less than 100 µm. The width dimension W2 of the insulating layer 20 is twice the width dimension W1 of the connection conductive layer 15? Three times. The height dimension H of the insulating layer 20 is 5 μm or less. In addition, the thickness dimension T of the 1st electrode layer 13 and the 2nd electrode layer 14 formed from ITO is about 20 nm.

The first row of first electrode layers 13 arranged in the X-direction are all connected by the connection conductive layer 15 and are connected to each other. Rows of the first electrode layers 13 connected in the X direction are arranged at intervals in the Y direction. Each second electrode layer 14 extending continuously in the Y direction is used as the Y detection electrode, and each column of the first electrode layer 13 connected in the X direction in the connection conductive layer 15 is used as the X detection electrode. Used.

In the drive detection circuit formed in the detection device 1, a delay circuit composed of a capacitor and a resistor in which each X detection electrode is one electrode, and a delay circuit composed of a capacitor and a resistor in which each Y detection electrode is one electrode. A plurality of are formed, respectively. In this delay circuit, the delay time of the rise of the output voltage changes in accordance with the change in the capacitance of the capacitor.

In the drive detection circuit, pulse-shaped voltages are sequentially applied to the plurality of delay circuits including the X detection electrodes, and pulse-shaped voltages are sequentially applied to the plurality of delay circuits containing the Y detection electrodes at different timings. .

As shown in FIG. 10, when a human hand touches the operation surface 3b of the operation panel 3 of the detection apparatus 1, the 1st electrode layer 13 which is an X detection electrode, and the 2nd electrode layer which is a Y detection electrode. One of the main detection parts 14a of 14 faces a finger. At this time, the capacitance of the capacitor formed between the detection electrode and the finger becomes large, and the delay time of the output voltage of the delay circuit including the detection electrode becomes long.

The drive detection circuit detects the coordinate position where the finger is in contact with the timing of which X detection electrode or which Y detection electrode a voltage is applied and the measured value of the delay time.

Next, the manufacturing method of the said electrode substrate 10 is demonstrated with reference to FIG. 6 and FIG.

A composite material in which a conductive material layer such as ITO is formed on the entire surface of one side of a substrate 11 such as a PET film is used, and the conductive material layer is etched to form a pattern of the first electrode layer 13 and a pattern of the second electrode layer 14. Is formed.

Thereafter, the liquid resin is partially supplied to the electrode formation surface 11a of the substrate 11 by the inkjet method, and the liquid resin is cured by UV irradiation or the like to form the insulating layer 20.

In the inkjet system, liquid resin containing UV-curable acrylic resin is injected into the dot formation in small amounts on the electrode formation surface 11a of the substrate 11 from the discharge holes formed in the inkjet head. The position to spray molten resin and the supply amount of liquid resin can be set freely by changing the dot pattern of inkjet printing.

As shown to FIG. 6 and FIG. 7 (A), in the area | region of the width dimension Wa located in the both sides of a Y direction across the center line O of the area | region which forms the insulating layer 20, liquid resin ( 25) to increase the dot density ejected by ejecting. In addition, the dot density is lowered in the region of the width dimension Wb where the center line O is located. In the region of the width dimension Wa and the region of the width dimension Wb, the dot density may be changed in two stages, and the dot density is changed in multiple stages to increase the dot density in the region of the width dimension Wa, from the region The dot density may be gradually lowered toward the center line O.

Dot density can be set freely by adjusting the relative speed of the inkjet head and the board | substrate 11, and when the relative speed of the inkjet head and the board | substrate 11 is slowed down, the dot density which supplies the liquid resin 25 can be raised. If the conductor speed is increased, the dot density is lowered.

FIG. 7A schematically illustrates a state immediately after the liquid resin 25 is supplied in a dot shape to the electrode formation surface 11a of the substrate 11. The liquid resin 25 supplied to the electrode formation surface 11a gradually fuses due to the wettability of the surface of the electrode layer, but since the portion of the width dimension Wa increases in the dot density, as shown in FIG. 7B. As for the fused liquid resin layer 25a, the ridge 21a is formed in the both sides of the center line O, and the recessed part 22a is formed in the part of the center line O. As shown to FIG. 7 (B), UV is irradiated and the liquid resin layer 25a hardens | cures in the state which the ridge 21a and the recessed part 22a remain in the liquid resin layer 25a, and FIG. And the insulating layer 20 which has the weir 21, 21 and the groove part 22 is formed as shown in FIG.

In the inkjet printing, the liquid resin 25 supplied in a dot shape is fused, and as shown in FIG. 7B, in order to form the uneven portion on the surface, the surface tension of the liquid resin 25 is 20? It is preferable that it is the range of 28 mN / m. Moreover, in order to be able to discharge from an inkjet head and to form the uneven | corrugated shape shown in FIG. 7 (B) after discharge, the viscosity of the liquid resin 25 is 8-8 at 45 degreeC. It is preferable that it is the range of 12 mPa * s.

In the inkjet printing, the dots of the liquid resin 25 can be patterned with high density and high accuracy by maintaining the relative positions of the inkjet head and the substrate 11 with high precision. Therefore, the space | interval of the weir 21, 21 on the completed insulating layer 20, ie, the width dimension of the groove part 22, can be set with high precision.

After the insulating layer 20 is formed, the connection conductive layer 15 is formed in the groove portion 22. The connection conductive layer 15 is also formed by the inkjet method.

The electroconductive liquid material used by the inkjet system consists of nanoparticles of silver and a solvent. In the inkjet head, a conductive liquid material is applied so as to form a linear pattern from the groove portion 22 to the first electrode layer 13 on both sides. Thereafter, the solvent is evaporated, heated at a temperature of 150 ° C. or lower, and the connection conductive layer 15 is formed by sintering the silver nanoparticles. Since the conductive liquid material supplied by the inkjet method has fluidity, it will spread when it is supplied to the surface of a board | substrate. However, as shown in FIG. 5, since the spread of the conductive liquid material supplied to the groove portion 22 is controlled by the weirs 21 and 21, the connection conductive layer 15 after sintering has a width dimension W1. Is regulated, making the width narrower. In addition, since the spacing dimension of the weirs 21 and 21 is determined with good precision, the width dimension W1 of the connection conductive layer 15 can be made into a fine thing about 50 micrometers, and the error is also very small. do.

8 and 9 show an electrode substrate 110 of a second embodiment of the present invention. 8 corresponds to the cross-sectional view of FIG. 4, and FIG. 9 corresponds to the cross-sectional view of FIG. 5.

The electrode substrate 110 is liquid-liquid in an inkjet manner over the entire electrode formation surface 11a of the substrate 11 on which the first electrode layer 13 and the second electrode layer 14 of the same pattern as in FIG. 2 are formed. Resin 25 is supplied. Liquid resin 25 is supplied to the surface of the 1st electrode layer 13 and the 2nd electrode layer 14 with uniform dot density, and the whole area | region of the 1st electrode layer 13 and the 2nd electrode layer 14 is covered with the liquid resin. All. In the part of the centerline O (refer FIG. 6) in which the connection conductive layer 15 is formed, the dot density of the liquid resin 25 is reduced. As a result, the recessed part is formed in the part of center line O, and the raised part is formed in the both sides. In the place where the edge part 15a, 15a of the connection conductive layer 15 is formed, the opposing edge part 13a, 13a of the 1st electrode layers 13 and 13 is exposed, without supplying the liquid resin 25. FIG.

After the liquid resin 25 is supplied, when the liquid resin is UV cured, the insulating layer 120 covering the first electrode layer 13 and the second electrode layer 14 is formed as shown in FIGS. 8 and 9. The groove part 122 is formed in the part of the center line O which traverses the narrow part 14b of the 2nd electrode layer 14, and the weir 121, 121 is formed in the both sides. Moreover, as shown in FIG. 8, the hole 123, 123 in which the resin layer does not exist is formed in the opposing edge part 13a, 13a of the 1st electrode layers 13 and 13. As shown in FIG.

The conductive liquid material is supplied and sintered from the groove portion 122 to the holes 123 and 123 by the inkjet method to form the connection conductive layer 15.

In addition, the dot density of the liquid resin 25 supplied to the portion where the weirs 121 and 121 are formed is made denser than the number of dots on the surfaces of the first electrode layer 13 and the second electrode layer 14, and the insulating layer You may form the weirs 121 and 121 which rise from the 120.

In the insulating substrate 110 shown in FIGS. 8 and 9, the first electrode layer 13 and the second electrode layer 14 are covered with the insulating layer 120. Therefore, as shown in FIG. 1, when the adhesive layer 2 is bonded to the operation panel 3 and the detection device 1 is constituted, the adhesive layer 2 and the electrode layer do not directly contact each other. Although the adhesive is easy to absorb moisture, since the surface of the electrode substrate 10 is covered with the insulating layer 120 of the cured resin, it is difficult for moisture to adhere to the first electrode layer 13 and the second electrode layer 14. , Its easy to prevent deterioration.

In addition, in the said embodiment, although the connection conductive layer 15 was formed with non-translucent material, such as silver, the connection conductive layer 15 may be formed with a translucent material, such as ITO.

The place to which the present invention is applied is not limited to the detection area of the detection device that detects the change in capacitance as in the above embodiment, and is connected to the conductive layer in the circumferential area of the wiring pattern of the side part deviated from the detection area of the capacitance. The adjacent electrodes may be connected to each other over the other electrode layer by using.

Moreover, in various display apparatuses, such as a liquid crystal display device, this invention can be implemented for the connection of the electrode layers of a display area, and this invention can be implemented for the winding area | region of the wiring pattern which deviated from the display area.

1 detection device
2 adhesive
3 operation panel
3b operating surface
10 electrode substrate
11 boards
11a electrode formation surface
13 first electrode layer
14 second electrode layer
14a State Department
14b narrow section
15 connection conductive layer
20 insulation layers
21 weir
21a ridge
22 groove
22a recess
25 liquid resin
110 electrode substrate
120 insulation layer
121 weir
122 groove
123 holes

Claims (16)

An electrode substrate having a plurality of first electrode layers, a second electrode layer positioned between adjacent first electrode layers, and a connection conductive layer connecting adjacent first electrode layers to each other on a surface of the substrate,
The insulating layer which covers a 2nd electrode layer is formed, The weir which opposes at intervals is integrally formed in the said insulating layer, The said connection conductive layer is formed by restricting the width dimension between the two weirs which oppose. An electrode substrate, characterized in that. The method of claim 1,
And said substrate, said first electrode layer and said second electrode layer, and said insulating layer are translucent. The method according to claim 1 or 2,
The directions orthogonal to each other are the first direction and the second direction, and each of the plurality of second electrode layers extends in the second direction at intervals in the first direction, and the plurality of first electrode layers are formed by the connection conductive layer. The electrode substrate which is connected toward a 1st direction, and the column of the 1st electrode layer connected by the said connection conductive layer is formed in multiple rows at intervals in a 2nd direction. The method according to claim 1 or 2,
The said insulating layer is an electrode substrate partially formed between the 1st electrode layers which adjoin mutually. The method according to claim 1 or 2,
The said insulating layer is formed in the area which covers both a 1st electrode layer and a 2nd electrode layer, The said weir is partially formed in this insulating layer, and the hole which connects the said connection conductive layer to a 1st electrode layer is provided. The formed electrode substrate. The method according to claim 1 or 2,
The electrode substrate which detects the change of the capacitance when a finger approaches the electrode layer. The capacitive detection device according to claim 1 or 2, wherein the operation panel is bonded to the electrode substrate via an adhesive layer. Using a substrate having a plurality of first electrode layers and a second electrode layer positioned between adjacent first electrode layers,
Supplying the liquid resin covering the second electrode layer, forming a ridge of the liquid resin facing each other at intervals between the adjacent first electrode layer, and before the ridge is resolved according to the viscosity of the liquid resin, the liquid resin Curing to integrally form an insulating layer covering the second electrode layer and opposing weirs at intervals,
A conductive material is supplied on the insulating layer to form a connection conductive layer with a width dimension between the weirs, and both ends of the connection conductive layer are connected to each of the first electrode layers adjacent to each other. The manufacturing method of an electrode substrate. The method of claim 8,
A method of manufacturing an electrode substrate, in which a small amount of liquid resin is sprayed on the surface of the substrate, and the amount of the spray is varied depending on the place to form the ridge. The method according to claim 8 or 9,
The said board | substrate, a 1st electrode layer, a 2nd electrode layer, and liquid resin are the manufacturing methods of the electrode substrate which are translucent. The method according to claim 8 or 9,
A method of producing an electrode substrate, wherein the liquid resin is supplied between neighboring first electrode layers to partially form the insulating layer. The method of claim 10,
A method of producing an electrode substrate, wherein the liquid resin is supplied between neighboring first electrode layers to partially form the insulating layer. The method according to claim 8 or 9,
The liquid resin is supplied onto the first electrode layer and the second electrode layer to form an insulating layer having an area covering both the first electrode layer and the second electrode layer, and the weir is partially formed on the insulating layer, and the connection is made. The manufacturing method of the electrode substrate which forms the hole which connects a conductive layer to a 1st electrode layer. The method of claim 10,
The liquid resin is supplied onto the first electrode layer and the second electrode layer to form an insulating layer having an area covering both the first electrode layer and the second electrode layer, and the weir is partially formed on the insulating layer, and the connection is made. The manufacturing method of the electrode substrate which forms the hole which connects a conductive layer to a 1st electrode layer. The manufacturing method of the capacitive detection device of Claim 8 or 9 which bonded the operation panel to the said electrode substrate through the adhesive layer. The manufacturing method of the capacitive detection device of Claim 10 which bonded the operation panel to the said electrode substrate through the adhesive layer.

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