201118454 六、發明說明： [發明所屬之技術領域】 本發明係關於一種觸控面板及其形成方法，尤指一種整合圖案 化介電層結構設計之觸控面板以及形成方法。 【先前技術】 在現今各式消費性電子產品的市場中，個人數位助理 (PDA )、行動電話（m〇bile Phone )、筆記型電腦（noteb〇〇k ) 及平板電腦（tablet PC)等可攜式電子產品皆已廣泛的使用 觸控式面板（touch panel)作為其資料溝通的界面工具，觸 控式面板已經一躍成為關鍵的零組件之一。此外，由於目前 電子產συ的设計皆以輕、薄、短、小為方向，如何將觸控式 面板之製做成本降低、厚度薄型化，便成為目前工業界努力 的方向。 由於電容式觸控面板的性能穩定、靈敏度佳且耐用，故 電容式觸控面板的為目前觸控式面板之主流技術，其中又以 投射電容式觸控面板最具有發展潛力，可精確地偵測觸碰位 置並實現多點觸控功能。投射電容式觸控面板具有位於不同 平面且行列交錯的ΙΤ〇 (氧化銦錫）導線，使每一行列交錯 201118454 點形成-電容節點，當人體碰觸或接近一 値會產生變化，因此只要债測 ’、 即黑時，電容 4縮⑽W導電容値變化，便可得 知觸娅位置。請參考第i圖，第i圖 器10結構示意圖，如第i圖所示，習°谷式觸控顯7^ 10包含一平面顯示器U、一二2知電容式觸控顯示器 贴復層12、一下導雷岸n、一 基板14、一上導電層15、一里框； θ …、框層16、一覆蓋 黏接層19。其中，下導電層13、基板14以及上導電層Μ 組成-感測層18’且點接層19負責接合覆蓋鏡_上導電 層⑴此外，貼覆層12係作為黏貼平面顯示器^與感測層 18之黏著層’而黑框層16係具有遮蔽感測層 線（圖未示）之功效。 詳、”來β $知電谷式觸控顯示器！ G可再搭配類比數 位轉換器（圖未示）輕接於電容式觸控顯示器⑺之感測層 18以及選擇性搭配—微控制器（圖未示）。也就是說，習知 利用類比數位轉換器來偵測感測層18中各導線的電容値變 化’藉由微控制H循賴每—導線輸出—充放電控制訊號， 對導線上的電容進^充放電，並將類比的電容充放電訊號轉 換為數位訊號’輪出至微控制器’以達到對電容式觸控顯示 器10進行偵測動作。 値得注意的是，習知電容式觸控顯示器10製作時通常 係先將平面顯示器ii、貼覆層12、感測層18以及覆蓋鏡 201118454 進行堆疊整合，因而使習知電容式觸控顯开:器10具多層複 雜結構設計，導致整體製作上需要經過多道製作程序，且亦 不符目前電子裝置尺寸輕薄短小之發展趨勢。因此，由於習 知電容式觸控顯示器10具有結構複雜、整體厚度過厚、重 里過重，以及製程複雜等缺點。有鑑於此，如何使電容式觸 控顯示器之結構與製程簡化無疑是突破電容式觸控顯示器 發展瓶頸之重要關鍵。 【發明内容】 本發明目的之一在於提供一種觸控面板及其形成方法，並藉由 圖案化介電層結構設計來簡化觸控面板内之介電層製作。 為達上述目的，本發明提供一種觸控面板。其中，觸控面板包 含一基板、一圖案化遮光層以及一感測層。基板定義有一觸控區以 及一周邊電路區設置於觸控區之外圍。圖案化遮光層設置於周邊電 路區之表面。感測層設置於觸控區之表面以及圖案化遮光層上。 為達上述目的，本發明提供一種觸控面板之形成方法。觸控面 板开y成方法包含至少下列步驟。提供一基板。於周邊電路區之表 面形成-圖案化遮光層。於觸控區之表面以及圖案化遮光層上形成 一感測層。其中，基板定義有一觸控區以及一周邊電路區設置於觸 控區之外圍。 201118454 控硫與形射法具有結構簡單、製卿b，以及厚 ^專專優點’域由本發明卿化介電層與雜結構之特殊設 整合製造絕緣層，不僅可同時減少全面性絕緣層與基板 七士制$外亦直接精簡多道製作程序。本發明將感測層以鑲板 式製作於由基板與圖案化介電層所圍繞出之凹槽内，可改盖傳統 觸控面板之Μ結獅魏況，藉以制目前可攜式電找置輕薄 短小的發展目標。 【實施方式】 一」月參考第2圖。第2圖為本發明觸控面板之—較佳實施例剖面 示意圖。如第2圖所示，本發明觸控面板包含一基板2〇、一圖案化 2光層22、-圖案化介電層24，以及一感測層％。其中，基板加 定義有-觸控區23以及-周邊電路區21設置於觸控區23之外圍， #圖案化遮光層22設置於周邊電路區21之表面，使得翻案化遮光 層22遮蔽的基板2〇區域得以隱藏各式傳送訊號的金屬線路而為一 周邊電路區21，而未被圖案化遮光層22所遮蔽的區域則得以成為 -觸控區23。俊得注意’圖案化介電層24係設置於圖案化遮光層 22與感測層26之間，且係覆蓋於圖案化遮光層22的上表面办與 鄰近觸控區23的側表面挪，用以隔離圖案化遮光層Μ與感測層 26 ’而突出之®魏遮光層22與®魏介電層Μ的堆4結構又與 基板20共同定義出一凹槽28。在本實施例中，本發明之感測層沉 201118454 3又置於觸控區23之表面與凹槽28 上，因此，藉由設置位置的不同， 26a與第二部份26b。 内亦同時設置於圖案化遮光層22 感剛層26又可區分為第一部份 入Γ卿控面板各轉之空騎聽，請再配 ^ 為本發明觸控面板之—較佳實施例之上 =圖。如第3嘗标，侧26之第—雜加具有呈陣列排列 、複數個感測单疋25，而感測層26之第二部份挪之左右兩側則 可具有複數條連接引線36，連接引線36分布於周邊電路區η内並 被圖案化遮光層22所遮蔽，分別負責串接第一部份加在乂.方向 與Υ方向之各感測單元25的電導通，且用以提供與可撓式電路板 (圖未不）或喊處理單元（圖未示）树連接的端點，故可進一 步偵測由X方向與γ額之交錯位置之訊號改變以構成二維感測架 構。在本實施例中’觸控面板之一較佳實施例可於感測層％之一側 可再e又置平面顯示II (圖未示），^平面顯示器具有—顯示區（圖 未示）以及周邊區（圖未示），而使顯示區對應到感測層之第 邻伤26a與觸控區23,且周邊區對應到感測層26之第二部份2你 與周邊電賴21。在本實施射，基板2G可採關如是透明玻璃 基板或透明轉基鱗之刺基板，而賴化遮光層Μ可具有氧化 絡與鉻金屬材質，或亦可糊無電解電麟技術或樹脂型黑色油墨 來形成碳黑等顏色，但並不加以侷限。有鑑於圖案化遮光層22可以 是導電或不導電之遮光材料，故且當某些產品之圖案化遮光層22 為不導電之遮光材料時，圖案化介電層24便成為選擇性設置之組 201118454 件0 現以採用電容絲職式之制層26結構為例來做說明。請參 考第2圖至第4圖，本發明可以第2圖之觸控面板基準，再結合第 4圖所繪示具部份電容式感_26⑽架構之觸控面板第一實施例 不意圖來實施，而第4圖係為第3圖的第—部份細與第二部份挪 於X方向交界處空間分佈之局部放大圖。如第4圖所示感^層26 另包含有複數個圖案化電極層3〇設置於基板2〇之表面、複數條連 接引線36以及-傾層38。其中，瞧_層3㈣置於基板如 包^触沿—[^向（亦稱X方向）排狀第一導電 ^ 3〇a、複數組沿一第二方向（亦稱γ方向）排列之第二導電圖 案Ob以及複數個第-連接元件連接部（圖未示）。在本實施例中， :同-組之各第-導電圖案服係透過其間之各第—連接元件連 接部與各相鄰之第-導電圖案30a彼此電性連接，而各組之第 電圖案30b與各組之第一導電圖案3〇a係錯位設置且彼此電性絕 緣。又’感測層26亦包含複數個絕緣層32可至 ，件連接部之部份，且同時也包含複數個第二連接二 垃使得錄同-組之各第二導電圖案勘係透過各第二連接 橋接林34可與各相鄰之第二導電圖案胍彼此電性連接。另一方 面’複數條物丨線36乃設置於__層22之上，並分別可 電連接圖案化電極層3〇，在本實施例中値得說明的是，各連接引線 線線分支施。本實施例乃可藉由三條連接引 ' a、連接引線36來使訊號處理單元（圖未示）與第一部份 201118454 恤之線路構成二維感測架構。此外，在感測層26夕卜部有一保護層 38覆蓋圖案化電極層30、連接引線36及圖案化遮光層22以進行^ 護，同時保護層38具有-平坦之頂表面地。需特別留意，在本實 施例中，絕緣層32與圖案化介電層％實質上具有相同組成與厚度。 可進-步說_是’魏於上顧案化介電層24具有電性隔絕 作用，故圖案化介電層24可作為連接引線36與圖案化遮光層22 間之電性闕層，_，_化遮光層22可_導電或不導電之里 色材料。在本實施例中，第一導電圖案施、第二導電圖案通、第 -連接兀件部、第二連接树橋接元件34與連接引線％包含氧化 銦錫（Indium Tin 0xide，IT0)、二氧化錫（Tm Di〇xide，Sn〇2)材料， 也可以疋金屬材料。惟需制注意，在本實施例中，第—導電圖案 30a、第一導電圖案3〇b、第一連接元件部、第二連接元件橋接元件 Μ與連接引、線36可以由同一種材料組成。然而，亦可為第一導電 圖案30a、第二導電圖案施 '第一連接元件部、第二連接元件橋接 元件34由同-種材料組成，而連接引線36為另一不同材料組成， 在此未加以侷限。 在本實施例中，保護層38之材料可使用二氧化矽（si〇2)、氮 化夕（S^4)或廢克力樹脂（acryiicresin)等而未加以限定。在此， 品特別強調的疋，本發明實施例圖示主要在繪示各元件結構之空間 刀佈情形，但各元件之外觀形狀可依設計為任意變化型式。上述第 4圖僅針對第2、3圖第一部份26a與第二部份26b交界處於第一方 201118454 向（亦稱x方向）之局部放大圖來加以說明，而第二部份挪於第 方向（亦稱Y方向）之原理可參酌第二方向之說明來同樣實施， 在此不多贊述。 …請參考第5圖’第5 _示具部份電容式感測層26内部架構之 第實域不息圖，招較於第一實施例，第二實施例之圖案化電極 層3〇具變化處即為亦可部份覆蓋於圖案化介電層24上，且連接引 #線36與各連接引線分支施再以堆疊方式覆蓋於圖案化電極㈣ ”圖案化"電層24上。最後，感測層26另具有—保護層％設置於 圖案化電極層3G、第二連接元件橋接元件34、圖案化介電層， 2及絕緣層32上用轉護内部元件，且本實施例之賴層％具有 -平坦之頂表面38a而可直接作為觸控面板之外表面，用以裝載平 面顯示器。 另方面明再參考第6圖’第6圖所緣示部份電容式感測層 • 26内部架構之觸控面板第三實施例之示意圖，第三實施例與第一實 施例不同處在於第三實施例於感測層26可具有至少一連接引線 36’且連接引線36可覆蓋於基板20之表面與圖案化遮光層22上， 隨後才形成圖案化介電層24，並使圖案化介電層24覆蓋於連接引 線36與各連接弓丨線36上形成電連接。於第三實施例中，圖案化遮 光層22較佳需採用不導電之黑色材料，以避免圖案化遮光層22對 於連接引線36上傳遞之電訊號發生干擾’其它相同元件部份不在此 贅述。 ί S1 11 201118454 請再參考第7圖至第8圖’第7圖至第8圖綠示具電容式感測 層26之觸控面板第-實施例沿第4圖从，剖面線之形成方法示音 圖。如第7圖所示，首先’提供-透明之基板2()，基板定義有一觸 控區23以及-周邊電路區21設置於觸控區23之外圍，而基板⑽ 可選用透明玻璃基板或透明塑膠基板，接著於基板2〇之周邊電路區 2!表面形成-圖案化遮光層22，關於圖案化遮光層22製作技術上，201118454 VI. Description of the Invention: [Technical Field] The present invention relates to a touch panel and a method of forming the same, and more particularly to a touch panel and a method for forming a patterned dielectric layer structure. [Prior Art] In today's market of various consumer electronic products, personal digital assistants (PDAs), mobile phones (m〇bile phones), notebook computers (noteb〇〇k) and tablet PCs (tablet PCs) can be used. Portable electronic products have widely used touch panels as an interface tool for data communication, and touch panels have become one of the key components. In addition, since the current design of electronic products is in the direction of light, thin, short, and small, how to reduce the cost of manufacturing touch panels and thinner thickness has become the direction of the industry. Capacitive touch panels are the mainstream technology of touch panels, and capacitive touch panels have the most potential for development. Measure the touch position and implement multi-touch function. The projected capacitive touch panel has tantalum (indium tin oxide) wires that are staggered in different planes and rows, so that each row and column is staggered at 201118454 points to form a capacitor node. When the human body touches or approaches, it will change, so as long as the debt When measuring ', that is, black, the capacitance of the capacitor 4 is reduced by (10)W, and the position of the contact point can be known. Please refer to the i-th figure, the structure diagram of the i-th diagram 10, as shown in the i-th figure, the Xi-gu touch display 7^10 includes a flat-panel display U, one or two known capacitive touch display overlay layer 12 Next, the guiding bank n, a substrate 14, an upper conductive layer 15, a inner frame; θ ..., the frame layer 16, a cover adhesive layer 19. Wherein, the lower conductive layer 13, the substrate 14 and the upper conductive layer 组成 constitute the sensing layer 18' and the dotted layer 19 is responsible for bonding the cover mirror_upper conductive layer (1). In addition, the overlay layer 12 serves as an adhesive flat display and sensing The adhesive layer ' of the layer 18' and the black frame layer 16 have the effect of shielding the sensing layer lines (not shown). Detailed, "to β $ know the electric valley touch display! G can be used with the analog digital converter (not shown) lightly connected to the capacitive touch display (7) of the sensing layer 18 and optional matching - microcontroller ( The figure is not shown. That is to say, it is customary to use an analog-to-digital converter to detect the capacitance change of each wire in the sensing layer 18 'by micro-control H to follow each wire output-charge and discharge control signal, The capacitor on the line is charged and discharged, and the analog capacitor charge and discharge signal is converted into a digital signal 'round to the microcontroller' to detect the capacitive touch display 10. It is noted that the conventional The capacitive touch display 10 is usually formed by stacking the flat display ii, the overlay layer 12, the sensing layer 18, and the cover mirror 201118454, thereby making the conventional capacitive touch display: the device has a multi-layer complex structure. The design leads to a multi-pass production process for the overall production, and it does not meet the current trend of the size, size and shortness of the electronic device. Therefore, the conventional capacitive touch display 10 has a complicated structure and a whole thickness. In view of the above, how to make the structure and process of the capacitive touch display simplified is an important key to break through the bottleneck of the development of the capacitive touch display. SUMMARY OF THE INVENTION One is to provide a touch panel and a method for forming the same, and to simplify the fabrication of a dielectric layer in the touch panel by designing a dielectric layer structure. To achieve the above object, the present invention provides a touch panel. The control panel comprises a substrate, a patterned light shielding layer and a sensing layer. The substrate defines a touch area and a peripheral circuit area disposed on the periphery of the touch area. The patterned light shielding layer is disposed on the surface of the peripheral circuit area. The layer is disposed on the surface of the touch area and the patterned light shielding layer. To achieve the above objective, the present invention provides a method for forming a touch panel. The touch panel opening method includes at least the following steps: providing a substrate. Forming a light-shielding layer on the surface of the region, forming a sensing layer on the surface of the touch region and the patterned light-shielding layer. The board defines a touch area and a peripheral circuit area disposed on the periphery of the touch area. 201118454 The sulfur control and the shaped method have the advantages of simple structure, fine b, and thick ^ special advantage 'domain by the invention. The special structure of the hetero structure is integrated to manufacture the insulating layer, which not only can reduce the comprehensive insulating layer and the substrate, but also directly and streamline the multi-channel production process. The invention has the sensing layer plated on the substrate and the patterned layer. In the groove surrounded by the electric layer, the traditional touch panel can be changed to the lion's condition, so that the current portable electric power can be found in a light and short development goal. [Embodiment] One month reference figure 2 . Figure 2 is a cross-sectional view showing a preferred embodiment of the touch panel of the present invention. As shown in FIG. 2, the touch panel of the present invention comprises a substrate 2, a patterned 2 light layer 22, a patterned dielectric layer 24, and a sensing layer %. The substrate is defined with a touch area 23 and a peripheral circuit area 21 disposed on the periphery of the touch area 23, and the #patterned light shielding layer 22 is disposed on the surface of the peripheral circuit area 21, so that the substrate covered by the refracting light shielding layer 22 is shielded. The 2 〇 area is capable of concealing the metal lines of the various transmission signals as a peripheral circuit area 21, and the area not covered by the patterned light shielding layer 22 becomes the touch area 23. It is noted that the patterned dielectric layer 24 is disposed between the patterned light-shielding layer 22 and the sensing layer 26, and covers the upper surface of the patterned light-shielding layer 22 and the side surface of the adjacent touch-control area 23, The stack 4 structure, which is used to isolate the patterned light-shielding layer Μ from the sensing layer 26' and protrudes from the EI-shi layer 22 and the wei-wei layer 又, together with the substrate 20 defines a recess 28. In the present embodiment, the sensing layer sink 201118454 3 of the present invention is placed on the surface of the touch area 23 and the recess 28, and thus, by the difference in the arrangement position, 26a and the second portion 26b. Also disposed in the patterned light-shielding layer 22, the sensible layer 26 can be further divided into the first part of the Γ 控 控 control panel, and then the matching is the touch panel of the present invention - the preferred embodiment Above = map. As for the third taste, the first side of the side 26 has a plurality of sensing units 25 arranged in an array, and the second part of the sensing layer 26 has a plurality of connecting leads 36 on the left and right sides. The connecting leads 36 are distributed in the peripheral circuit region η and are shielded by the patterned light shielding layer 22, and are respectively responsible for electrically connecting the first portions of the sensing units 25 applied in the 方向. direction and the Υ direction, and are provided for providing The end point of the connection with the flexible circuit board (not shown) or the processing unit (not shown), so that the signal change of the interlaced position of the X direction and the γ amount can be further detected to form a two-dimensional sensing architecture. . In the present embodiment, a preferred embodiment of the touch panel can be placed on one side of the sensing layer % and can be placed on the flat display II (not shown). The ^ flat display has a display area (not shown). And the surrounding area (not shown), and the display area corresponds to the adjacent injury 26a and the touch area 23 of the sensing layer, and the peripheral area corresponds to the second part of the sensing layer 26 . In the present embodiment, the substrate 2G can be used as a slab substrate such as a transparent glass substrate or a transparent basal scale, and the ray ray layer 具有 can have an oxidized complex and a chrome metal material, or can be paste-free electroless lining technology or resin type. Black inks form colors such as carbon black, but are not limited. In view of the fact that the patterned light-shielding layer 22 can be a conductive or non-conductive light-shielding material, and when the patterned light-shielding layer 22 of some products is a non-conductive light-shielding material, the patterned dielectric layer 24 becomes an optional set. 201118454 piece 0 is now described by taking the structure of the layer 26 of the capacitor wire type as an example. Please refer to FIG. 2 to FIG. 4 , the touch panel reference of FIG. 2 , and the first embodiment of the touch panel with a partial capacitive sense _26 (10) structure is not intended to be combined with FIG. 4 . The fourth figure is a partial enlarged view of the spatial distribution of the first part of the third figure and the second part of the intersection of the second part. As shown in Fig. 4, the sensing layer 26 further includes a plurality of patterned electrode layers 3, which are disposed on the surface of the substrate 2, a plurality of connecting leads 36, and a pour layer 38. Wherein, the layer _ layer 3 (four) is placed on the substrate such as the package contact edge - [^ direction (also known as the X direction) row of the first conductive ^ 3 〇 a, the complex array arranged along a second direction (also known as the γ direction) a second conductive pattern Ob and a plurality of first-connecting element connecting portions (not shown). In this embodiment, each of the first conductive patterns of the same group is electrically connected to each of the adjacent first conductive patterns 30a through the first connecting element connecting portions therebetween, and the first electrical patterns of the respective groups The first conductive patterns 3a of the respective groups of 30b are misaligned and electrically insulated from each other. In addition, the sensing layer 26 also includes a plurality of insulating layers 32, which are part of the connecting portion of the device, and also includes a plurality of second connecting electrodes, so that the second conductive patterns of the recorded-group are transmitted through the first The two connection bridges 34 can be electrically connected to each other adjacent second conductive patterns 。. On the other hand, the plurality of strips 36 are disposed on the layer 22 and electrically connected to the patterned electrode layer 3, respectively. In the present embodiment, the connecting leads are branched. . In this embodiment, the signal processing unit (not shown) and the first part of the 201118454 shirt form a two-dimensional sensing architecture by means of three connection terminals a and a connection lead 36. In addition, a protective layer 38 covers the patterned electrode layer 30, the connection leads 36, and the patterned light-shielding layer 22 at the outer portion of the sensing layer 26 for protection, while the protective layer 38 has a flat top surface. It is to be noted that in the present embodiment, the insulating layer 32 has substantially the same composition and thickness as the patterned dielectric layer %. It can be further advanced that the conductive dielectric layer 24 can serve as an electrical barrier between the connection lead 36 and the patterned light-shielding layer _ The opaque layer 22 can be a conductive or non-conductive green material. In this embodiment, the first conductive pattern, the second conductive pattern, the first connecting member, the second connecting tree bridge member 34, and the connecting lead % comprise indium tin oxide (IT0), dioxide Tin (Tm Di〇xide, Sn〇2) material, can also be used as a metal material. It should be noted that in this embodiment, the first conductive pattern 30a, the first conductive pattern 3〇b, the first connecting element portion, the second connecting element bridging element Μ and the connecting lead, the line 36 may be composed of the same material. . However, the first conductive element 30a, the second conductive pattern, the first connecting element portion, and the second connecting element bridging element 34 may be composed of the same material, and the connecting lead 36 is composed of another different material. Not limited. In the present embodiment, the material of the protective layer 38 may be cerium oxide (si〇2), nitriding sulphide (S^4) or acryiicresin or the like without being limited. Here, the embossing of the embodiment of the present invention is mainly illustrated in the case of the space knives of the respective component structures, but the appearance of each component can be arbitrarily changed according to the design. The above fourth figure is only for the partial enlarged view of the first side 2618 and the second part 26b of the second and third figures in the first side 201118454 (also referred to as the x direction), and the second part is moved to The principle of the first direction (also known as the Y direction) can be implemented in the same way as the description of the second direction, and is not mentioned here. ...refer to FIG. 5 '5th _ shows the real-field non-dimensional map of the internal structure of the partial capacitive sensing layer 26, which is compared with the first embodiment, the patterned electrode layer 3 of the second embodiment The change portion may also partially cover the patterned dielectric layer 24, and the connection lead wire 36 and the respective connection lead branches are stacked on the patterned electrode (4) "patterned" electric layer 24. Finally, the sensing layer 26 has a protective layer % disposed on the patterned electrode layer 3G, the second connecting element bridging element 34, the patterned dielectric layer 2, and the insulating layer 32 for transferring the internal components, and the embodiment The layer % has a flat top surface 38a and can be directly used as the outer surface of the touch panel for loading the flat display. The other part of the capacitive sensing layer is also referred to in FIG. The schematic diagram of the third embodiment of the touch panel of the internal structure, the third embodiment is different from the first embodiment in that the third embodiment can have at least one connecting lead 36' and the connecting lead 36 can be covered in the sensing layer 26. On the surface of the substrate 20 and the patterned light shielding layer 22, The patterned dielectric layer 24 is patterned, and the patterned dielectric layer 24 is overlaid on the connecting leads 36 to form electrical connections with the respective connecting arch wires 36. In the third embodiment, the patterned light shielding layer 22 preferably needs to be used. Conductive black material to avoid interference of the patterned light-shielding layer 22 with the electrical signals transmitted on the connecting leads 36. Other similar components will not be described herein. ί S1 11 201118454 Please refer to FIG. 7 to FIG. 8 '7 Figure 8 to Figure 8 shows a touch panel of the touch panel of the capacitive sensing layer 26 of the present invention. The method of forming the hatching is shown in Fig. 4. As shown in Fig. 7, firstly, 'provide-transparent The substrate 2() has a touch area 23 and a peripheral circuit area 21 disposed on the periphery of the touch area 23, and the substrate (10) may be a transparent glass substrate or a transparent plastic substrate, and then the peripheral circuit area 2 of the substrate 2 Surface formation - patterned light shielding layer 22, with respect to the patterned light shielding layer 22,
Mm (Lithography and Etching ，例如於基板20上濺鍍具有氧化鉻與絡金屬之低反射雙層 膜，而此低反射雙層膜可藉由塗佈光阻後，接續使用光罩來依序完 成曝光、顯影等步驟，進而以银刻完成圖案化遮光層22之製作。此 外’圖案化遮光層22亦可使用油墨或光阻材料來形成圖案化遮光層 2仁並不加以飼限。在此需特別強調，由於接著需於觸控區幻 之表面以及圖案化遮光層22上形成一圖案化介電層24與一感測層 26’從空_絲看，_化介電層％位於圖案化遮光層μ與感 曰26之間且感測層26係部份覆蓋於圖案化介電層μ上與基板 f之表面。但由於感測層_尚還包含各子元件圖案化電極層30、 、、色緣層32、第二連接元件橋接元件％以及保護層％之細部形成步 7故以下會將感測層26各子元件接續圖案化遮光層^完成後依 ;頃序加以說明。接著’形成複數個圖案化電極層30於基板20之表 日而後再於圖案化遮光層22上形成一圖案化介電層24以及同 時於圖案化電極層3G上軸複數個絕緣層Μ，且至少覆蓋住各第 連接元件連接部之部份，以致於絕緣層％與圖案化介電層3〇實 12 201118454 質上具有相同組成與厚度。在本實施例中，圖案化電極層30可分為 形成複數組沿一第一方向排列之第一導電圖案30&與複數組沿一第 二方向排列之第二導電圖案3〇b以及複數個第一連接元件連接部 30c且形狀可依設計加以調整，故可為任意形狀。 本觸控面板形成方法特別之處即在於形成第一導電圖案3〇a、 第二導電圖案30b、第一連接元件連接部3〇c以及第二連接元件橋 鲁接το件34所建構出的跨接結構之設計，位於同一組之各第一導電圖 案30a係透過其間之各第一連接元件連接部3〇c與各相鄰之第一導 電圖案30a彼此電性連接，而各組之第二導電圖案3〇b與各組之第 一導電圖案3〇a係因彼此錯位設置彼此電性絕緣。隨後，於絕緣層 32上形成一第二連接元件橋接元件34以及至少一連接引線36，較 佳為於圖案化遮光層22之上形成複數條連接引線％，且等連接引 線36分別電連接圖案化電極層3〇,而各連接引線％包含至少一連 鲁接引線为支36a。而複數個絕緣層32至少覆蓋住各第一連接元件連 接部30c之部份。此外，複數個第二連接元件橋接元件％負責使得 位於同組之各第二導電圖案3〇b係透過各第二連接元件橋接元件 =與各相鄰之第二導電圖案通彼此電性連接。在此需特別說明的 *、、邑緣層32位於橋接第二方向（亦稱γ方向）第二導電圖案娜 之第二連接元件橋接元件34下方可具有可防止第二方向（亦稱Y 方向）之第一導電圖案3〇b與第一方向（亦稱X方向）之第一導電 圖案30a發生短路的魏4外，在材料使用方面，第—導電圖案 a第一導電圖$3Qb、第—連接树部、第二連接元件橋接元件 13 201118454 34與連接引線36包含氧化銦錫（Indium Tin 〇xide，IT〇)、二氧化 錫（TinDioxide，Sn〇2)材料，也可以是金屬材料。惟需特別注意， 在本實施例中，第-導電圖案施、第二導電圖案郷、第—連接元 件部、第二連接元件橋接元件34與連接引線36可以由同—種材料 組成。然而’亦可為第一導電圖案池、第二導電圖案3〇b、第一連 接7L件部H接元件橋接元件34由同_種材料組成而連接引 線36為另一不同材料組成，在此未加以侷限。 在本實施例中，圖案化介電層24與絕緣層32係利用同一製程 來同時形成，而採用之製财法較佳係包含黃光微影製程，然而電 ^ ^ ^ ^ (Plasma-Enhanced Chemical VaporMm (Lithography and Etching, for example, sputtering a low-reflection double-layer film having chromium oxide and a complex metal on the substrate 20, and the low-reflection double-layer film can be sequentially processed by using a photomask after coating the photoresist. In the steps of exposure, development, etc., the patterned light-shielding layer 22 is further formed by silver engraving. Further, the patterned light-shielding layer 22 may also use an ink or a photoresist material to form the patterned light-shielding layer 2 without being fed. In particular, it is necessary to form a patterned dielectric layer 24 and a sensing layer 26' on the surface of the touch area and the patterned light-shielding layer 22, and the dielectric layer is located in the pattern. Between the light shielding layer μ and the sensing layer 26 and the sensing layer 26 partially covering the surface of the patterned dielectric layer μ and the substrate f. However, since the sensing layer _ still includes the sub-element patterned electrode layer 30 Then, the color edge layer 32, the second connecting element bridging element %, and the protective layer % are formed in step 7. Therefore, the sub-elements of the sensing layer 26 are successively patterned and the light-shielding layer is completed. Then forming a plurality of patterned electrode layers 30 on the substrate 20 Then, a patterned dielectric layer 24 is formed on the patterned light-shielding layer 22 and a plurality of insulating layers are formed on the patterned electrode layer 3G at the same time, and at least the portions of the connecting portions of the first connecting elements are covered. The insulating layer % has the same composition and thickness as the patterned dielectric layer 3 18 12 201118454. In this embodiment, the patterned electrode layer 30 can be divided into a first conductive layer formed by forming a complex array along a first direction. The pattern 30 & and the second array of the second conductive pattern 3 〇 b arranged in a second direction and the plurality of first connecting element connecting portions 30 c and the shape can be adjusted according to the design, so that the shape can be any shape. What is special is that the design of the jumper structure formed by the first conductive pattern 3〇a, the second conductive pattern 30b, the first connecting element connecting portion 3〇c and the second connecting element bridge τ ο member 34 is formed. Each of the first conductive patterns 30a of the same group is electrically connected to each of the adjacent first conductive patterns 30a through the first connecting element connecting portions 3〇c therebetween, and the second conductive patterns 3〇b of the respective groups With each group The first conductive patterns 3〇a are electrically insulated from each other by being dislocated from each other. Subsequently, a second connecting element bridging element 34 and at least one connecting lead 36 are formed on the insulating layer 32, preferably for patterning the light shielding layer 22. A plurality of connection leads % are formed on the upper portion, and the connection leads 36 are electrically connected to the patterned electrode layers 3, respectively, and each of the connection leads % includes at least one of the connected leads 36a. The plurality of insulating layers 32 cover at least the first Connecting a portion of the component connecting portion 30c. Further, the plurality of second connecting member bridging members % are responsible for causing the second conductive patterns 3〇b located in the same group to pass through the second connecting members to bridge the components = with each adjacent The two conductive patterns are electrically connected to each other. *, the edge layer 32 is located below the second connecting element bridging element 34 of the second conductive pattern in the second direction of the bridge (also referred to as the gamma direction), and has a second direction (also referred to as the Y direction). The first conductive pattern 3〇b is short-circuited with the first conductive pattern 30a in the first direction (also referred to as the X direction), and in the use of the material, the first conductive pattern a first conductive pattern $3Qb, —Connecting Tree Section, Second Connecting Element Bridging Element 13 The 201118454 34 and the connecting lead 36 comprise an indium tin oxide (IT), a tin dioxide (Sin Dioxide, Sn 2 ) material, or a metal material. It is to be noted that in this embodiment, the first conductive pattern, the second conductive pattern 郷, the first connecting element portion, the second connecting member bridging member 34, and the connecting lead 36 may be composed of the same material. However, the first conductive pattern cell, the second conductive pattern 3〇b, the first connection 7L piece H, and the element bridge element 34 are composed of the same material and the connection lead 36 is composed of another different material. Not limited. In this embodiment, the patterned dielectric layer 24 and the insulating layer 32 are simultaneously formed by the same process, and the method of using the financial method preferably includes a yellow lithography process, but the ^ ^ ^ ^ (Plasma-Enhanced Chemical Vapor)
Deposition, PECVD) > ( Physical Vapor Deposition, PVD)、射頻磁控賤鍍沉積製程⑽娜狀論Sputtering Dep〇siti〇n) 或蒸鑛》儿積製粒（Evaporation D印osition)等方法亦可選用而未加以 偈限。以黃光微影製程為例，f先先形成一絕緣材料層（圖未示）， 接著於絕緣材·表φ進行光阻塗佈形成—光阻層⑽未示）。隨後 順序進行軟烤（SGftbake)㈣與湘影像光罩（shadQwmask)對 光阻層曝光。緊接著再湘—顯影步驟則彡成—覆蓋光阻圖案層（圖 未示）。接著利用一蝕刻步騾以去除部份絕緣材料層並形成一圖案化 介電層24與一絕緣層32。最後，去除圖案化介電層24與絕緣層32 上之覆蓋光阻圖案層以暴露出圖案化介電層24與絕緣層32。惟需 注意，用於製作圖案化介電層24與絕緣層32之材料較佳係選用環 氧樹脂（epoxyresins)或壓克力（acrylic)材料例如是聚甲基丙烯 201118454 酸甲酯（Polymethylmethacrylate，PMMA)或有機玻璃，但亦可選用 -氧切（SiQ2)、1化梦（Si3N4)或氮化銘（AIN)，在此未加以 侷限。 如第8圖所示’最後，形成一保護廣％，使保護層％位於圖 案化電極層30、第二連接元件橋接元件34、圖案化介電層24與絕 緣層32上，且保護層38具有一平坦之頂表面撕。又，製作保護 _層使用之材料包含二氧化石夕（Si〇2)、氮化石夕（蝴4)或壓克力樹 脂（acrylicresin)等。在本發明製程上，除了採用於形成圖案化電 極層30時直接同時完成第…二導電圖案30a、30b的方式外，亦 可選擇性於形成圖案化電極層3〇時僅先形成χ方向上之第一導電 圖案30a γ方向上之第一導電圖案施可於後續升》成第二連接 元件橋接元件34時再-起形成。舉例來說，基板2()上可先形成具 有氧化銦錫（lndium Tin 0xide，IT〇 )材質之第一導電圖案3加，接 著於絕緣層32形成後再直接完成具氧化銦錫材質之第二連接元件 •橋接元件34與第二導電圖案3〇b。 另一方面，請再參考第9圖至第10圖，第9圖至第1〇圖繪示 具電容式感測層26之觸控面板第三實施例沿第6圖BB，剖面線之形 成方法不意圖。如第9圖所示，形成第三實施例與形成第一實施例 不同處在於第三實施例之形成方法亦即在形成圖案化介電層24、絕 緣層32之步驟前就先形成至少一連接引線36，且連接引線36可覆 蓋於基板20表面、圖案化遮光層22與圖案化電極層30上。如第 1 15 201118454 10;圖所不接著依序形絲緣層％ '第二連接元件橋接元件Μ與 保護層38，然、而圖案化介電層24可選擇性於形成絕緣層32時同時 形成。在此需特別強調，於第三實施例形程步驟中，由於連接引線 36與連接引線分支36a需負責電峨傳送，故在本實施例中，圖幸 化遮光層22較佳需採用不導電之黑色材料，明確來說，由於連制 線36與連接引線分支加與_化遮光層22之間乃電性絕緣，因 關案化介電層24在第三實施射係為選擇性實施步驟而可加以 痛略’其它相同元件之形錄驟如同第Μ圖崎示而不在此贊述。 练上所述，本發明觸控面板與形成方法具有結構簡單、製程 薄等優點，且藉由本發明新穎圖案化介電層與跨接結 構之特K ’再配合整合製造絕騎，不僅可_減少全面性絕 緣層與基板之製作數量外’亦直接精簡多道製作程序。本判將 測層以鑲財絲作於凹_纽善傳_麵板料可避免之多 堆疊狀況。簡言之，本發明利朗時整合製作感測層中之絕 ί層與圖魏介騎，直顧少製作介電狀製作，也確實符合目 則可攜式電子裝置輕薄短λ!、的發展目標。Deposition, PECVD) > (Physical Vapor Deposition, PVD), RF magnetron plating deposition process (10) Sputtering Dep〇siti〇n) or steaming ore "Evaporation D osition" Optional and not limited. Taking the yellow light lithography process as an example, f first forms an insulating material layer (not shown), and then photoresist coating is formed on the insulating material table φ - the photoresist layer (10) is not shown. Subsequently, the SGftbake (four) and the shadQwmask are sequentially exposed to the photoresist layer. Immediately afterwards, the development process is carried out to cover the photoresist pattern layer (not shown). An etch step is then used to remove a portion of the insulating material layer and form a patterned dielectric layer 24 and an insulating layer 32. Finally, the patterned photoresist layer on the patterned dielectric layer 24 and the insulating layer 32 is removed to expose the patterned dielectric layer 24 and the insulating layer 32. It should be noted that the material used for the patterned dielectric layer 24 and the insulating layer 32 is preferably epoxy resin or acrylic material such as polymethyl methacrylate 201118454. PMMA) or plexiglass, but may also be used - oxygen cut (SiQ2), 1 dream (Si3N4) or nitride (AIN), which is not limited here. As shown in FIG. 8 , finally, a % of protection is formed, so that the protective layer % is located on the patterned electrode layer 30 , the second connecting element bridging element 34 , the patterned dielectric layer 24 and the insulating layer 32 , and the protective layer 38 Has a flat top surface tear. Further, the material used for the protective layer _ layer includes cerium oxide (Si〇2), cerium nitride (butterfly 4), or acrylic resin. In the process of the present invention, in addition to the manner in which the second conductive patterns 30a and 30b are directly formed simultaneously when the patterned electrode layer 30 is formed, it is also possible to selectively form the patterned electrode layer 3 先 only in the χ direction. The first conductive pattern in the γ direction of the first conductive pattern 30a can be formed again when the second connecting element bridging element 34 is subsequently formed. For example, the first conductive pattern 3 with an indium tin oxide (IT) material may be formed on the substrate 2 (), and then the indium tin oxide material is directly formed after the insulating layer 32 is formed. Two connecting elements • bridging element 34 and second conductive pattern 3〇b. On the other hand, please refer to FIG. 9 to FIG. 10 again. FIG. 9 to FIG. 1 show the third embodiment of the touch panel with the capacitive sensing layer 26 along the BB of FIG. The method is not intended. As shown in FIG. 9, the third embodiment is different from the first embodiment in that the third embodiment is formed by forming at least one of the steps of forming the patterned dielectric layer 24 and the insulating layer 32. The lead wires 36 are connected, and the connection leads 36 may cover the surface of the substrate 20, the patterned light shielding layer 22, and the patterned electrode layer 30. For example, the first 15 201118454 10; the figure is not followed by the wire edge layer % 'the second connecting element bridging element Μ and the protective layer 38, however, the patterned dielectric layer 24 can be selectively formed while forming the insulating layer 32 form. It should be particularly emphasized that in the third embodiment, the connection lead 36 and the connection lead branch 36a are responsible for the electrical transfer. Therefore, in this embodiment, the light-shielding layer 22 is preferably non-conductive. The black material, in particular, is electrically insulated between the connecting wire 36 and the connecting lead branching and the _ shielding layer 22, since the cleaning dielectric layer 24 is selectively implemented in the third embodiment. However, it can be said that the description of the other identical components is similar to that of the third figure and is not mentioned here. As described above, the touch panel and the forming method of the present invention have the advantages of simple structure, thin process, and the like, and the unique patterned dielectric layer of the present invention and the special structure of the jumper structure are integrated and manufactured, which is not only _ Reducing the total number of insulation layers and substrates produced is also a direct streamlined multi-channel production process. This judgment will be used to make the measurement layer in the concave _ New Zealand _ panel material can avoid the stacking situation. In short, the present invention integrates the fabrication of the sensible layer in the sensing layer with the Wei Wei riding, and directly produces the dielectric-like production, which is also in line with the development of the portable electronic device. aims.
-：：：^ 【圖式簡單說明】 16 201118454 第1圖為習知觸控面板示意圖。 第2圖為本發賴控面板之—較佳實細剖面示意圖。 第3圖為本發明觸控面板之一較佳實施例之上透視圖。 第4圖繪示觸控面板第一實施例局部示意圖。 第5 _示觸控面板第二實施例局部示意圖。 第6圖緣示觸控面板第三實施例局部示意圖。 第7圖至第8圖繪示觸控面板第一實施例沿从’剖面線之形成方法 I 示意圖。 / / 第=圖至第10圖繪示種觸控面板第三實施例沿BB，剖面線之形成方 法示意圖。 【主要元件符號說明】 10 習知電容式觸控_示 11 平面顯示器 器 12 貼覆層 13 第一導電層 14 絕緣層 15 第二導電層 16 黑框層 17 覆蓋鏡 18 感測層 19 黏接層 20 基板 21 周邊電路區 22 圖案化遮光層 22a 上表面 22b 側表面 23 觸控區 24 圖案化介電層 25 感測單元 17 201118454 26 感測層 26a 26b 第二部份 28 30 圖案化電極層 30a 30b 第二導電圖案 30c 32 絕緣層 34 36 連接引線 36a 38 保護層 38a 第一部份 凹槽 第一導電圖案 第一連接元件連接部 第二連接元件橋接元件 連接引線分支 頂表面 18-:::^ [Simple description of the diagram] 16 201118454 Figure 1 is a schematic diagram of a conventional touch panel. Figure 2 is a schematic cross-sectional view of a preferred control panel of the present invention. Figure 3 is a perspective view of a preferred embodiment of the touch panel of the present invention. FIG. 4 is a partial schematic view showing the first embodiment of the touch panel. The fifth embodiment shows a partial schematic view of the second embodiment of the touch panel. FIG. 6 is a partial schematic view showing a third embodiment of the touch panel. 7 to 8 are schematic views showing a method 1 for forming a first embodiment of the touch panel along the 'section line. / / Fig. 10 to Fig. 10 are diagrams showing a method of forming a section line along the BB of the third embodiment of the touch panel. [Main component symbol description] 10 conventional capacitive touch display 11 display panel display 12 overlay layer 13 first conductive layer 14 insulating layer 15 second conductive layer 16 black frame layer 17 cover mirror 18 sensing layer 19 bonding Layer 20 substrate 21 peripheral circuit region 22 patterned light shielding layer 22a upper surface 22b side surface 23 touch region 24 patterned dielectric layer 25 sensing unit 17 201118454 26 sensing layer 26a 26b second portion 28 30 patterned electrode layer 30a 30b second conductive pattern 30c 32 insulating layer 34 36 connecting lead 36a 38 protective layer 38a first partial recess first conductive pattern first connecting element connecting portion second connecting element bridging element connecting lead branch top surface 18