TW201312402A - Touch panel - Google Patents
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Abstract
Description
本發明是有關於一種觸控面板，且特別是有關於一種窄邊框(slim boarder)的觸控面板。The present invention relates to a touch panel, and more particularly to a touch panel of a slim board.
近年來觸控技術被廣泛地應用在各式多媒體電子產品中，特別是隨身的移動式產品，如手機、電子書、平板電腦等。使用觸控技術作為輸入之手段可有效取代現有之鍵盤或滑鼠的輸入方法。除了便利性之外，更由於操作的直覺性，觸控的輸入方式技術已成為極受歡迎的人機介面與多媒體互動方式。In recent years, touch technology has been widely used in various multimedia electronic products, especially mobile products such as mobile phones, e-books, and tablet computers. The use of touch technology as an input method can effectively replace the input method of the existing keyboard or mouse. In addition to convenience, and because of the intuitive operation, touch input technology has become a very popular human-machine interface and multimedia interaction.
一般而言，觸控面板主要可分為電阻式與電容式。以電容式觸控面板為例，習知的電容式觸控面板包括基板、觸控感測層以及與觸控感測層電性連接之扇出(fan-out)走線。基板具有位於觸控區以及環繞此觸控區之周邊線路區。觸控感測層位於基板之觸控區上。扇出走線構位於基板之周邊線路區上。扇出走線之材質多為不透光材質，使用者易透過透明之基板察覺到此扇出走線的存在。因此，在習知的電容式觸控面板中，多在扇出走線所在之周邊線路區與扇出走線之間配置不透光的遮光層，以遮蔽扇出走線。然而，為了操作上的便利，位於觸控面板下側之遮光層多具有透光之感測鈕(sensor key)。為確保此透光感測鈕可正常作動以及扇出走線不會被使用者察覺，透光感測鈕設置的位置需與扇出走線的位置錯開。如此一來，觸控面板下側之遮光層的寬度便會變寬，而有損電容式觸控面板之外觀及觸控區可配置的範圍。承上述，如何減少扇出走線分布之面積，進而減少遮光層(周邊線路區)之寬度，實為研發者所亟欲達成的目標之一。In general, touch panels are mainly classified into resistive and capacitive. Taking a capacitive touch panel as an example, a conventional capacitive touch panel includes a substrate, a touch sensing layer, and a fan-out trace electrically connected to the touch sensing layer. The substrate has a peripheral line area located in the touch area and surrounding the touch area. The touch sensing layer is located on the touch area of the substrate. The fanout trace is located on the peripheral line area of the substrate. The material of the fan-out line is mostly opaque material, and the user can easily perceive the presence of the fan-out line through the transparent substrate. Therefore, in the conventional capacitive touch panel, an opaque light shielding layer is disposed between the peripheral line region where the fanout trace is located and the fanout trace to shield the fanout trace. However, for the convenience of operation, the light shielding layer located on the lower side of the touch panel has a light transmissive sensor key. In order to ensure that the light-sensing sensor can be operated normally and the fan-out line is not perceived by the user, the position of the light-transmitting sensor button needs to be shifted from the position of the fan-out line. As a result, the width of the light shielding layer on the lower side of the touch panel is widened, which impairs the appearance of the capacitive touch panel and the configurable range of the touch area. In view of the above, how to reduce the area of the fan-out trace distribution and thus reduce the width of the light-shielding layer (peripheral line area) is one of the goals that the developer is eager to achieve.
本發明提供一種觸控面板，其具有窄周邊線路區寬度。The present invention provides a touch panel having a narrow peripheral line region width.
本發明提供一種觸控面板，其包括基板、觸控感測層及扇出線路結構。觸控感測層及扇出線路結構配置於基板上。扇出線路結構包括多條第一扇出導線、圖案化介電層、多條第二扇出導線及多個第三接墊。第一扇出導線位於基板上且與觸控感測層電性連接。各第一扇出導線在未與觸控感測層連接的一端具有第一接墊。圖案化介電層配置於基板上，以覆蓋第一扇出導線並暴露出第一接墊。第二扇出導線位於圖案化介電層上且與觸控感測層電性連接。各第二扇出導線在未與觸控感測層連接的一端具有第二接墊。第二接墊與第一接墊不重疊。第三接墊覆蓋於第一接墊上並與第一接墊電性連接。The invention provides a touch panel comprising a substrate, a touch sensing layer and a fan-out line structure. The touch sensing layer and the fan-out line structure are disposed on the substrate. The fan-out line structure includes a plurality of first fan-out wires, a patterned dielectric layer, a plurality of second fan-out wires, and a plurality of third pads. The first fan-out wire is located on the substrate and is electrically connected to the touch sensing layer. Each of the first fan-out wires has a first pad at an end that is not connected to the touch sensing layer. The patterned dielectric layer is disposed on the substrate to cover the first fan-out wire and expose the first pad. The second fan-out wire is located on the patterned dielectric layer and electrically connected to the touch sensing layer. Each of the second fan-out wires has a second pad at an end that is not connected to the touch sensing layer. The second pad does not overlap the first pad. The third pad covers the first pad and is electrically connected to the first pad.
在本發明的一實施例中，前述之觸控感測層包括第一圖案化導電層、圖案化絕緣層以及第二圖案化導電層。第一圖案化導電層配置於基板上。第一圖案化導電層包括多個彼此電性絕緣的第一感測串列。圖案化絕緣層覆蓋部分之第一圖案化導電層。第二圖案化導電層配置於基板與圖案化絕緣層上。第一圖案化導電層與第二圖案化導電層彼此電性絕緣。第二圖案化導電層包括多個彼此電性絕緣的第二感測串列。圖案化絕緣層位於第一感測串列與第二感測串列的交錯處。In an embodiment of the invention, the touch sensing layer includes a first patterned conductive layer, a patterned insulating layer, and a second patterned conductive layer. The first patterned conductive layer is disposed on the substrate. The first patterned conductive layer includes a plurality of first sensing series electrically insulated from each other. The patterned insulating layer covers a portion of the first patterned conductive layer. The second patterned conductive layer is disposed on the substrate and the patterned insulating layer. The first patterned conductive layer and the second patterned conductive layer are electrically insulated from each other. The second patterned conductive layer includes a plurality of second sensing series electrically isolated from each other. The patterned insulating layer is located at the intersection of the first sensing series and the second sensing series.
在本發明的一實施例中，前述之觸控感測層包括圖案化導電層、圖案化絕緣層以及多個橋接線路。圖案化導電層配置於基板上。圖案化導電層包括多個彼此電性絕緣的第一感測串列以及多個彼此分離的感測墊。圖案化絕緣層覆蓋部分之圖案化導電層。橋接線路配置於部分之圖案化導電層與圖案化絕緣層上。各橋接線路分別連接於二相鄰之感測墊之間。In an embodiment of the invention, the touch sensing layer includes a patterned conductive layer, a patterned insulating layer, and a plurality of bridge lines. The patterned conductive layer is disposed on the substrate. The patterned conductive layer includes a plurality of first sensing series electrically isolated from each other and a plurality of sensing pads separated from each other. The patterned insulating layer covers a portion of the patterned conductive layer. The bridge line is disposed on a portion of the patterned conductive layer and the patterned insulating layer. Each of the bridge lines is connected between two adjacent sensing pads.
在本發明的一實施例中，前述之圖案化絕緣層之材質與圖案化介電層之材質實質上相同，而橋接線路與第一扇出導線之材質實質上相同。In an embodiment of the invention, the material of the patterned insulating layer is substantially the same as the material of the patterned dielectric layer, and the bridge line is substantially the same as the material of the first fan-out wire.
在本發明的一實施例中，前述之圖案化絕緣層之材質與圖案化介電層之材質包括低介電常數(low-K constant)材料。In an embodiment of the invention, the material of the patterned insulating layer and the material of the patterned dielectric layer comprise a low-k constant material.
在本發明的一實施例中，前述之第一接墊與第二接墊係彼此交替排列。In an embodiment of the invention, the first pad and the second pad are alternately arranged with each other.
在本發明的一實施例中，前述之第一接墊係區分為多群，而第二接墊係區分為多群，且第一接墊所構成之群與第二接墊所構成之群係彼此交替排列。In an embodiment of the present invention, the first pad is divided into a plurality of groups, and the second pads are divided into a plurality of groups, and the group formed by the first pads and the second pads are grouped. The lines are alternately arranged.
在本發明的一實施例中，前述之扇出線路結構可進一步包括多個第四接墊。第四接墊與第一接墊不重疊，且第二接墊覆蓋於第四接墊上。In an embodiment of the invention, the fan-out line structure may further include a plurality of fourth pads. The fourth pad does not overlap the first pad, and the second pad covers the fourth pad.
在本發明的一實施例中，前述之觸控面板可進一步包括蓋板。蓋板具有遮光層。觸控感測層與扇出線路結構位於基板與蓋板之間，且扇出線路結構位於遮光層與基板之間。In an embodiment of the invention, the touch panel may further include a cover. The cover has a light shielding layer. The touch sensing layer and the fan-out line structure are located between the substrate and the cover, and the fan-out line structure is located between the light shielding layer and the substrate.
在本發明的一實施例中，前述之觸控面板可進一步包括遮光層，其中遮光層位於基板與扇出線路結構之間。In an embodiment of the invention, the touch panel may further include a light shielding layer, wherein the light shielding layer is located between the substrate and the fan-out line structure.
在本發明的一實施例中，前述之第一扇出線路與第二扇出線路係部分重疊且彼此電性絕緣。In an embodiment of the invention, the first fan-out line and the second fan-out line are partially overlapped and electrically insulated from each other.
基於上述，本發明之觸控面板藉由在第一扇出線路與第二扇出線路間配置圖案化介電層，而使第一扇出線路與第二扇出線路之間的距離可有效縮減，進而達到窄化周邊線路區寬度之目的。Based on the above, the touch panel of the present invention can effectively set the distance between the first fan-out line and the second fan-out line by arranging the patterned dielectric layer between the first fan-out line and the second fan-out line. Reduced, and thus narrowed the width of the peripheral line area.
為讓本發明之上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。The above described features and advantages of the present invention will be more apparent from the following description.
圖1A至圖1F為本發明第一實施例之觸控面板製造流程的上視示意圖。圖2A至圖2F為對應圖1A至圖1F之剖線AA’、BB’、CC’所繪之觸控面板製造流程的剖面示意圖。以下將搭配圖1A至圖1F、圖2A至圖2F說明本實施例之觸控面板的製造流程及其結構。1A to 1F are schematic top views of a manufacturing process of a touch panel according to a first embodiment of the present invention. 2A to 2F are schematic cross-sectional views showing a manufacturing process of the touch panel corresponding to the cross-sectional lines AA', BB', and CC' of Figs. 1A to 1F. The manufacturing process and structure of the touch panel of this embodiment will be described below with reference to FIGS. 1A to 1F and FIGS. 2A to 2F.
請參照圖1A及圖2A，首先，提供基板102。在本實施例中，基板102之材質可為玻璃、石英、有機聚合物或是其它可適用的材料。接著，可選擇性地在基板102上形成遮光層104。遮光層104可定義出觸控區R1以及周邊線路區R2。詳言之，周邊線路區R2可為遮光層104所在之區域，而觸控區R1可為被遮光層104所曝露出之區域。在本實施例中，遮光層104可覆蓋於基板102之四周，周邊線路區R2可為遮光層104所在之環形區域，而觸控區R1可為被遮光層104環繞及曝露之矩形區域。本實施例之遮光層104例如為黑色樹脂。然而，本發明並不限定遮光層104之外形及材質，遮光層104之外形及材質皆可視實際的設計需求作適當之變化。Referring to FIG. 1A and FIG. 2A, first, a substrate 102 is provided. In this embodiment, the material of the substrate 102 may be glass, quartz, organic polymer or other applicable materials. Next, the light shielding layer 104 can be selectively formed on the substrate 102. The light shielding layer 104 can define the touch area R1 and the peripheral line area R2. In detail, the peripheral line region R2 may be the region where the light shielding layer 104 is located, and the touch region R1 may be the region exposed by the light shielding layer 104. In this embodiment, the light shielding layer 104 can cover the periphery of the substrate 102, the peripheral circuit region R2 can be the annular region where the light shielding layer 104 is located, and the touch region R1 can be a rectangular region surrounded and exposed by the light shielding layer 104. The light shielding layer 104 of this embodiment is, for example, a black resin. However, the present invention does not limit the shape and material of the light shielding layer 104. The shape and material of the light shielding layer 104 can be appropriately changed according to actual design requirements.
請參照圖1B及圖2B，接著，在基板102上形成第一圖案化導電層106。第一圖案化導電層106配置於基板102上，且包括多個彼此電性絕緣的第一感測串列106a。在本實施例中，第一感測串列106a可沿著x方向延伸，且包括彼此交替排列並互相連接之多個第一感測墊106b以及多個第一橋接線路106c。本實施例之第一圖案化導電層106例如為透明導電層，透明導電層之材質包括銦錫氧化物、銦鋅氧化物、鋁錫氧化物、鋁鋅氧化物、銦鍺鋅氧化物、或其它合適的氧化物。但本發明不以此為限，在其他實施例中，第一圖案化導電層106亦可為金屬層，金屬層之材質包括金、銀、銅、鋁、鉬。值得一提的是，位於觸控區R1之金屬層可較薄，且第一感測墊106b可設計為網狀，以增加觸控區R1的透光率(transmittance)，而位於周邊線路區R2之部份的第一橋接線106c則可為較厚之金屬層，以降低第一感測串列106a整體阻值，進而使觸控面板之感測功能佳。Referring to FIG. 1B and FIG. 2B, a first patterned conductive layer 106 is formed on the substrate 102. The first patterned conductive layer 106 is disposed on the substrate 102 and includes a plurality of first sensing series 106a electrically insulated from each other. In the present embodiment, the first sensing series 106a may extend along the x direction and include a plurality of first sensing pads 106b and a plurality of first bridging lines 106c alternately arranged and interconnected with each other. The first patterned conductive layer 106 of the embodiment is, for example, a transparent conductive layer, and the material of the transparent conductive layer includes indium tin oxide, indium zinc oxide, aluminum tin oxide, aluminum zinc oxide, indium antimony zinc oxide, or Other suitable oxides. However, the present invention is not limited thereto. In other embodiments, the first patterned conductive layer 106 may also be a metal layer, and the material of the metal layer includes gold, silver, copper, aluminum, and molybdenum. It is worth mentioning that the metal layer located in the touch area R1 can be thin, and the first sensing pad 106b can be designed as a mesh to increase the transmittance of the touch area R1, and is located in the peripheral line area. The first bridge wire 106c of the portion of R2 can be a thick metal layer to reduce the overall resistance of the first sensing series 106a, thereby making the sensing function of the touch panel better.
請參照圖1C及圖2C，接著，在基板102上形成多條第一扇出導線108。部份之第一扇出導線108與部份之第一感測串列106a電性連接，而另一部份之第一扇出導線108則待與欲形成之部分的第二感測串列(圖1C及圖2C中未繪示)電性連接。各第一扇出導線108在未與第一感測串列106a連接或未欲與第二感測串列連接之一端具有第一接墊108a。第一扇出導線108之材質以具良好導電性之材質為佳，例如金屬材料(金、銀、銅、鋁、鉬)、合金等。值得注意的是，在本實施例中，第一圖案化導電層106形成在先而第一扇出導線108形成在後。但本發明並不限定第一圖案化導電層106與第一扇出導線108形成的順序，在其他實施例中，亦可先形成第一扇出導線108後，再形成第一圖案化導電層106。Referring to FIG. 1C and FIG. 2C, a plurality of first fan-out wires 108 are formed on the substrate 102. A portion of the first fan-out wire 108 is electrically connected to a portion of the first sensing series 106a, and another portion of the first fan-out wire 108 is to be connected to the second sensing series of the portion to be formed. (not shown in FIG. 1C and FIG. 2C) electrical connection. Each of the first fan-out wires 108 has a first pad 108a at one end that is not connected to the first sensing series 106a or that is not intended to be connected to the second sensing series. The material of the first fan-out wire 108 is preferably a material having good conductivity, such as a metal material (gold, silver, copper, aluminum, molybdenum), an alloy, or the like. It should be noted that in the present embodiment, the first patterned conductive layer 106 is formed first and the first fan-out wire 108 is formed later. However, the present invention does not limit the order in which the first patterned conductive layer 106 and the first fan-out wire 108 are formed. In other embodiments, the first fan-out wire 108 may be formed first, and then the first patterned conductive layer may be formed. 106.
請參照圖1D及圖2D，接著，在基板102上同時形成圖案化介電層110a以及圖案化絕緣層110b。圖案化介電層110a覆蓋第一扇出導線108並曝露出第一接墊108a。圖案化絕緣層110b覆蓋部分之第一圖案化導電層106，且配置於第一感測串列106a欲與第二感測串列(圖1D及圖2D中未繪示)交錯處(即第一橋接線路106c所在之處)。在本實施例中，由於圖案化介電層110a與圖案化絕緣層110b可同時形成，因此圖案化介電層110a與圖案化絕緣層110b之材質可相同。圖案化介電層110a與圖案化絕緣層110b之材質以低介電常數(low-K constant)材料為佳，低介電常數材料例如為氧化矽、氮化矽、氮氧化矽等。Referring to FIG. 1D and FIG. 2D, a patterned dielectric layer 110a and a patterned insulating layer 110b are simultaneously formed on the substrate 102. The patterned dielectric layer 110a covers the first fan-out wire 108 and exposes the first pad 108a. The patterned insulating layer 110b covers a portion of the first patterned conductive layer 106, and is disposed at the intersection of the first sensing series 106a and the second sensing series (not shown in FIG. 1D and FIG. 2D) (ie, Where a bridge line 106c is located). In this embodiment, since the patterned dielectric layer 110a and the patterned insulating layer 110b can be simultaneously formed, the material of the patterned dielectric layer 110a and the patterned insulating layer 110b can be the same. The material of the patterned dielectric layer 110a and the patterned insulating layer 110b is preferably a low-k constant material, and the low dielectric constant material is, for example, hafnium oxide, tantalum nitride, hafnium oxynitride or the like.
請參照圖1E及圖2E，接著，在基板102與圖案化絕緣層110b上形成第二圖案化導電層112。第二圖案化導電層112與第一圖案化導電層106彼此電性絕緣且包括多個彼此電性絕緣的第二感測串列112a。第一感測串列106a與第二感測串列112a在圖案化絕緣層110b處交錯。在本實施例中，第二感測串列112a可沿著y方向延伸。部份之第二感測串列112a與部分之第一扇出導線108電性連接，而另一部份之第二感測串列112a則待與欲形成之部分的第二扇出導線(圖1E及圖2E中未繪示)電性連接。在另一實施例中，全部的第二感測串列112a可都與第一扇出導線108電性連接，本發明並不加以限定。Referring to FIG. 1E and FIG. 2E, a second patterned conductive layer 112 is formed on the substrate 102 and the patterned insulating layer 110b. The second patterned conductive layer 112 and the first patterned conductive layer 106 are electrically insulated from each other and include a plurality of second sensing series 112a electrically insulated from each other. The first sensing series 106a and the second sensing series 112a are staggered at the patterned insulating layer 110b. In this embodiment, the second sensing series 112a may extend along the y direction. A portion of the second sensing series 112a is electrically coupled to a portion of the first fan-out wire 108, and another portion of the second sensing series 112a is to be associated with a second fan-out wire of the portion to be formed ( Electrical connections are not shown in FIG. 1E and FIG. 2E. In another embodiment, all of the second sensing series 112a can be electrically connected to the first fan-out wire 108, which is not limited in the present invention.
請參照圖1F及圖2F，接著，在圖案化介電層110a上形成多條第二扇出導線114。部份之第二扇出導線114與部份之第一感測串列106a電性連接，而另一部份之第二扇出導線114則與部份之第二感測串列112a電性連接。類似地，在本實施例中，第二圖案化導電層112形成在先而第二扇出導線114形成在後。但本發明並不限定第二圖案化導電層112與第二扇出導線114形成的順序，在其他實施例中，亦可先形成第二扇出導線114後，再形成第二圖案化導電層112。Referring to FIG. 1F and FIG. 2F, a plurality of second fan-out wires 114 are formed on the patterned dielectric layer 110a. A portion of the second fan-out wire 114 is electrically connected to a portion of the first sensing series 106a, and another portion of the second fan-out wire 114 is electrically connected to a portion of the second sensing series 112a. connection. Similarly, in the present embodiment, the second patterned conductive layer 112 is formed before the second fan-out wire 114 is formed. However, the present invention does not limit the order in which the second patterned conductive layer 112 and the second fan-out wire 114 are formed. In other embodiments, the second fan-out wire 114 may be formed first, and then the second patterned conductive layer may be formed. 112.
本實施例之各第二扇出導線114在未與第一感測串列106a或第二感測串列112a連接的一端具有第二接墊114a，且第二接墊114a與第一接墊108a不重疊。在本實施例中，第一接墊108a與第二接墊114a係彼此交替排列。然而，本發明不限於此，第一接墊108a與第二接墊114a間的配置方式可有多種變化。圖3之(a)、(b)、(c)示出多種第一接墊108a與第二接墊114a的配置方式，請參照圖3，本實施例之第一接墊108a可區分為多群K1，而第二接墊114a係可區分為多群K2，且第一接墊108a所構成之群K1與第二接墊114a所構成之群K2係彼此交替排列，其中一群K1可包括n個第一接墊108a，而一群K2可包括m個第二接墊114a，n、m為大於或等於2之任意正整數，且n與m可相等或不相等。舉例而言，如圖3之(a)所示，一群K1中可包括2個第一接墊108a，一群K2中可包括2個第二接墊114a，群K1與群K2可彼此交替排列。如圖3之(b)所示，一群K1中可包括3個第一接墊108a，一群K2中可包括3個第二接墊114a，群K1與群K2可彼此交替排列。如圖3之(c)所示，一群K1中可包括2個第一接墊108a，一群K2中可包括3個第二接墊114a，群K1與群K2可彼此交替排列。Each of the second fan-out wires 114 of the embodiment has a second pad 114a at one end not connected to the first sensing series 106a or the second sensing series 112a, and the second pad 114a and the first pad 108a does not overlap. In this embodiment, the first pads 108a and the second pads 114a are alternately arranged with each other. However, the present invention is not limited thereto, and the arrangement between the first pads 108a and the second pads 114a may be variously changed. 3(a), (b), and (c) show the arrangement of the plurality of first pads 108a and the second pads 114a. Referring to FIG. 3, the first pads 108a of the present embodiment can be divided into multiple The group K1, and the second pad 114a can be divided into a plurality of groups K2, and the group K1 composed of the first pad 108a and the group K2 composed of the second pads 114a are alternately arranged with each other, wherein a group K1 can include n The first pads 108a, and the group K2 may include m second pads 114a, n, m being any positive integer greater than or equal to 2, and n and m may be equal or unequal. For example, as shown in FIG. 3(a), a group of K1 may include two first pads 108a, and one group K2 may include two second pads 114a, and the groups K1 and K2 may be alternately arranged with each other. As shown in FIG. 3(b), a group of K1 may include three first pads 108a, and one group K2 may include three second pads 114a, and the groups K1 and K2 may be alternately arranged with each other. As shown in FIG. 3(c), a group of K1 may include two first pads 108a, and a group of K2 may include three second pads 114a, and the groups K1 and K2 may be alternately arranged with each other.
請再參照圖1F及圖2F，值得一提的是，由於本實施例之第一扇出導線108與第二扇出導線114間配置有圖案化介電層110a，因此第一扇出導線108與第二扇出導線114可部分重疊且彼此電性絕緣。如此一來，周邊線路區R2在x方向上之寬度D1以及在y方向上之寬度D2便可明顯的縮小，進而實現窄邊框之觸控面板100。然而，本發明不限於此，在其他實施例中，第一扇出導線108與第二扇出導線114亦可不重疊，但由於第一扇出導線108與第二扇出導線114間配置有使兩者電性絕緣之圖案化介電層110a，因此第一扇出導線108與第二扇出導線114間之距離可設計地較短甚至部份重疊，而仍可達到縮減周邊線路區R2寬度之功效。Referring to FIG. 1F and FIG. 2F again, it is worth mentioning that, since the patterned fan layer 110a is disposed between the first fan-out wire 108 and the second fan-out wire 114 of the embodiment, the first fan-out wire 108 is disposed. The second fan-out wires 114 may partially overlap and be electrically insulated from each other. As a result, the width D1 of the peripheral line region R2 in the x direction and the width D2 in the y direction can be significantly reduced, thereby realizing the touch panel 100 of the narrow frame. However, the present invention is not limited thereto. In other embodiments, the first fan-out wire 108 and the second fan-out wire 114 may not overlap, but the first fan-out wire 108 and the second fan-out wire 114 are disposed between each other. The electrically insulating patterned dielectric layer 110a, so that the distance between the first fan-out wire 108 and the second fan-out wire 114 can be designed to be shorter or even partially overlapped, and the width of the peripheral line region R2 can still be reduced. The effect.
此外，在形成第二扇出導線114以及第二接墊114a時，可同時形成多個第三接墊114b，且第三接墊114b覆蓋於第一接墊108a上並與第一接墊108a電性連接。換言之，即使第一扇出導線108(以及第一接墊108a)與第二扇出導線114(以及接墊114a)使用之材質不同，位於觸控面板100最外層之所有接墊(即第二接墊114a與第三接墊114b)的材質仍可相同。如此一來，當用以驅動觸控面板100之驅動晶片(未繪示)欲透過觸控面板100最外層之接墊與第一圖案化導電層106以及第二圖案化導電層112電性連接時，由於觸控面板100最外層之所有接墊的材質均相同，因此驅動晶片與接墊接合狀況(bonding condition)較易掌握，進而使得本實施例之觸控面板100的感測功能及信賴性(reliability)佳。抑或是當第二接墊114a下有圖案化介電層110a之擬接墊時(未繪示)，在第一接墊108a上覆蓋第三接墊114b也可以使兩者高度差異縮小，使驅動晶片與接墊接合狀況較佳。In addition, when the second fan-out wire 114 and the second pad 114a are formed, a plurality of third pads 114b may be simultaneously formed, and the third pad 114b covers the first pad 108a and the first pad 108a. Electrical connection. In other words, even if the first fan-out wire 108 (and the first pad 108a) and the second fan-out wire 114 (and the pad 114a) are made of different materials, all the pads on the outermost layer of the touch panel 100 (ie, the second The material of the pad 114a and the third pad 114b) may still be the same. As a result, a driving chip (not shown) for driving the touch panel 100 is electrically connected to the first patterned conductive layer 106 and the second patterned conductive layer 112 through the pads of the outermost layer of the touch panel 100. Since all the pads of the outermost layer of the touch panel 100 are made of the same material, the bonding condition of the driving chip and the pad is relatively easy to grasp, and the sensing function and the reliability of the touch panel 100 of the embodiment are improved. Good reliability. Or when the second pad 114a has a patterned pad of the patterned dielectric layer 110a (not shown), covering the third pad 114b on the first pad 108a can also reduce the height difference between the two pads. The driving wafer is bonded to the pad in a better condition.
上述之第一圖案化導電層106、圖案化絕緣層110b以及第二圖案化導電層112構成本實施例之觸控感測層。上述之第一扇出導線108、圖案化介電層110a以及第二扇出導線114構成本實施例之扇出線路結構。然而，本發明之觸控感測層以及扇出線路結構的形式不限於上述，本發明之觸控感測層以及扇出線路結構的形式可具有多種變化。此外，本實施例之遮光層104可位於基板102與扇出線路結構之間。然而，本發明之遮光層104亦可位於其他位置。以下藉由第二實施例舉出本發明之觸控感測層、扇出線路結構以及遮光層之其中一種變化的樣態。The first patterned conductive layer 106, the patterned insulating layer 110b and the second patterned conductive layer 112 constitute the touch sensing layer of the embodiment. The first fan-out wire 108, the patterned dielectric layer 110a, and the second fan-out wire 114 constitute the fan-out line structure of the embodiment. However, the form of the touch sensing layer and the fan-out line structure of the present invention is not limited to the above, and the forms of the touch sensing layer and the fan-out line structure of the present invention may have various variations. In addition, the light shielding layer 104 of the present embodiment may be located between the substrate 102 and the fan-out line structure. However, the light shielding layer 104 of the present invention may also be located at other locations. Hereinafter, a variation of one of the touch sensing layer, the fan-out line structure, and the light shielding layer of the present invention is exemplified by the second embodiment.
圖4A至圖4D為本發明第二實施例之觸控面板製造流程的上視示意圖。圖5A至圖5D為對應圖4A至圖4D之剖線aa’、bb’、cc’所繪之觸控面板製造流程的剖面示意圖。以下將搭配圖4A至圖4D、圖5A至圖5D說明本實施例之觸控面板的製造流程及其結構。4A to 4D are schematic top views of a manufacturing process of a touch panel according to a second embodiment of the present invention. 5A to 5D are schematic cross-sectional views showing a manufacturing process of the touch panel corresponding to the cross-sectional lines aa', bb', and cc' of Figs. 4A to 4D. The manufacturing process and structure of the touch panel of the present embodiment will be described below with reference to FIGS. 4A to 4D and FIGS. 5A to 5D.
請參照圖4A及圖5A，首先，提供基板202。接著，在基板202上同時形成多條第一扇出導線204a以及多個第四接墊204b。各第一扇出導線204a在未欲與觸控感測層(未繪示)連接的一端具有第一接墊204c。第四接墊204b與第一接墊204c不重疊。在本實施例中，第一接墊204c與第四接墊204b係彼此交替排列。然而，本發明不限於此，接墊204c與接墊204b間的配置方式可有多種變化，其中可行之配置方式類似圖3之接墊108a與接墊114a的配置方式，於此便不再重述。Referring to FIG. 4A and FIG. 5A, first, a substrate 202 is provided. Next, a plurality of first fan-out wires 204a and a plurality of fourth pads 204b are simultaneously formed on the substrate 202. Each of the first fan-out wires 204a has a first pad 204c at an end that is not intended to be connected to the touch sensing layer (not shown). The fourth pad 204b does not overlap with the first pad 204c. In this embodiment, the first pads 204c and the fourth pads 204b are alternately arranged with each other. However, the present invention is not limited thereto, and the configuration manner between the pad 204c and the pad 204b may be variously changed. The possible configuration is similar to the configuration of the pad 108a and the pad 114a of FIG. Said.
請參照圖4B及圖5B，接著，在基板202上形成圖案化導電層206。圖案化導電層206配置於基板202上，且包括多個彼此電性絕緣的第一感測串列206a以及多個彼此分離的感測墊206b。在本實施例中，部分之第一扇出導線204a與部分之第一感測串列206a電性連接，而另一部分之第一扇出導線204a則與部分之感測墊206b電性連接。值得注意的是，在本實施例中，第一扇出導線204a形成在先而圖案化導電層206形成在後。但本發明並不限定第一扇出導線204a與圖案化導電層206形成的順序，在其他實施例中，亦可先形成圖案化導電層206後，再形成第一扇出導線204a。Referring to FIG. 4B and FIG. 5B, a patterned conductive layer 206 is formed on the substrate 202. The patterned conductive layer 206 is disposed on the substrate 202 and includes a plurality of first sensing series 206a electrically insulated from each other and a plurality of sensing pads 206b separated from each other. In this embodiment, a portion of the first fan-out wire 204a is electrically connected to a portion of the first sensing series 206a, and another portion of the first fan-out wire 204a is electrically coupled to a portion of the sensing pad 206b. It should be noted that in the present embodiment, the first fan-out wire 204a is formed before the patterned conductive layer 206 is formed. However, the present invention does not limit the order in which the first fan-out wires 204a and the patterned conductive layer 206 are formed. In other embodiments, the first fan-out wires 204a may be formed after the patterned conductive layer 206 is formed.
請參照圖4C及圖5C，接著，在基板202上同時形成圖案化介電層208a以及圖案化絕緣層208b。圖案化介電層208a覆蓋第一扇出導線204a並曝露出第四接墊204b以及第一接墊204c。圖案化絕緣層208b覆蓋部分之圖案化導電層206，且配置於第一感測串列206a與欲形成之橋接線路(圖4C及圖5C中未繪示)交錯處。在本實施例中，由於圖案化介電層208a與圖案化絕緣層208b可同時形成，因此圖案化介電層208a與圖案化絕緣層208b之材質可相同。圖案化介電層208a與圖案化絕緣層208b之材質以低介電常數(low-K constant)材料為佳，低介電常數材料例如為氧化矽、氮化矽、氮氧化矽等。Referring to FIG. 4C and FIG. 5C, a patterned dielectric layer 208a and a patterned insulating layer 208b are simultaneously formed on the substrate 202. The patterned dielectric layer 208a covers the first fan-out wire 204a and exposes the fourth pad 204b and the first pad 204c. The patterned insulating layer 208b covers a portion of the patterned conductive layer 206 and is disposed at the intersection of the first sensing series 206a and the bridge lines to be formed (not shown in FIGS. 4C and 5C). In this embodiment, since the patterned dielectric layer 208a and the patterned insulating layer 208b can be simultaneously formed, the material of the patterned dielectric layer 208a and the patterned insulating layer 208b can be the same. The material of the patterned dielectric layer 208a and the patterned insulating layer 208b is preferably a low-k constant material, and the low dielectric constant material is, for example, hafnium oxide, tantalum nitride, hafnium oxynitride or the like.
請參照圖4D及圖5D，接著，在基板202上同時形成多條第二扇出導線210a、多個橋接線路210b、多個第二接墊210d以及多個第三接墊210c，與此便初步完成本實施例之觸控面板200。第二扇出導線210a位於圖案化介電層208a上。部分之第二扇出導線210a與部分之第一感測串列206a電性連接，而另一部分之第二扇出導線210a則與部分之感測墊206b電性連接。橋接線路210b配置於部分之圖案化導電層206與圖案化絕緣層208b上。各橋接線路210b分別連接於二相鄰之感測墊206b之間。多個橋接線路210b與其相連接之感測墊206b形成多條第二感測串列S2，而部分之第二扇出導線210a透過感測墊206b與第二感測串列S2電性連接。Referring to FIG. 4D and FIG. 5D, a plurality of second fan-out wires 210a, a plurality of bridge lines 210b, a plurality of second pads 210d, and a plurality of third pads 210c are simultaneously formed on the substrate 202. The touch panel 200 of the present embodiment is initially completed. The second fan-out wire 210a is located on the patterned dielectric layer 208a. A portion of the second fan-out wire 210a is electrically connected to a portion of the first sensing series 206a, and another portion of the second fan-out wire 210a is electrically coupled to a portion of the sensing pad 206b. The bridge line 210b is disposed on a portion of the patterned conductive layer 206 and the patterned insulating layer 208b. Each of the bridge lines 210b is connected between two adjacent sensing pads 206b. The plurality of bridge lines 210b and the sensing pads 206b connected thereto form a plurality of second sensing series S2, and a portion of the second fan-out wires 210a are electrically connected to the second sensing series S2 through the sensing pads 206b.
各第二扇出導線210a在未與第一感測串列206a或感測墊206b連接的一端具有第二接墊210d。第三接墊210c與第四接墊204b不重疊且覆蓋於第一接墊204c上並與第一接墊204c電性連接。第二接墊210d與第一接墊204c、第三接墊210c不重疊且覆蓋於第四接墊204b上，但第二接墊210d與第四接墊204b不必然電性連接。請同時參照圖5D及圖2F，由於本實施例之觸控面板200最外層之接墊210c、210d是位於同一水平面上(繪於圖5D右側)，因此相較於第一實施例最外層之接墊114a、114b(繪於圖2F右側)，本實施例之觸控面板200最外層之接墊210c、210d可更良好的與驅動晶片接合，進而使得本實施例之觸控面板200的感測功能及信賴性(reliability)優良。Each of the second fan-out wires 210a has a second pad 210d at an end that is not connected to the first sensing series 206a or the sensing pads 206b. The third pad 210c and the fourth pad 204b do not overlap and cover the first pad 204c and are electrically connected to the first pad 204c. The second pad 210d does not overlap with the first pad 204c and the third pad 210c and covers the fourth pad 204b, but the second pad 210d and the fourth pad 204b are not necessarily electrically connected. Referring to FIG. 5D and FIG. 2F, the pads 210c and 210d of the outermost layer of the touch panel 200 of the present embodiment are located on the same horizontal plane (shown on the right side of FIG. 5D), and thus are compared with the outermost layer of the first embodiment. The pads 114a, 114b (shown on the right side of FIG. 2F), the pads 210c, 210d of the outermost layer of the touch panel 200 of the present embodiment can be better bonded to the driving wafer, thereby making the touch panel 200 of the embodiment more The measurement function and reliability are excellent.
圖6為本發明第二實施例之觸控面板200之剖面示意圖。請參照圖6，本實施例之觸控面板200可進一步包括蓋板212。在本實施例中，蓋板212可具有遮光層212a，而觸控感測層(包括圖案化導電層206、圖案化絕緣層208b以及橋接線路210b)與扇出線路結構(包括第一扇出導線204a、第二扇出導線210a、第四接墊204b、第一接墊204c、第三接墊210c以及第二接墊210d)位於基板202與蓋板212之間，且扇出線路結構位於遮光層212a於基板202之間。本實施例之蓋板212可對觸控感測層形成保護作用，遮光層212a可遮蔽扇出線路結構，進而使本實施例之觸控面板200更加地耐用與美觀。FIG. 6 is a cross-sectional view of a touch panel 200 according to a second embodiment of the present invention. Referring to FIG. 6 , the touch panel 200 of the embodiment may further include a cover 212 . In this embodiment, the cover 212 may have a light shielding layer 212a, and the touch sensing layer (including the patterned conductive layer 206, the patterned insulating layer 208b and the bridge line 210b) and the fan-out line structure (including the first fan-out) The wire 204a, the second fan-out wire 210a, the fourth pad 204b, the first pad 204c, the third pad 210c, and the second pad 210d) are located between the substrate 202 and the cover 212, and the fan-out line structure is located. The light shielding layer 212a is between the substrates 202. The cover plate 212 of the embodiment can protect the touch sensing layer, and the light shielding layer 212a can shield the fan-out circuit structure, thereby making the touch panel 200 of the embodiment more durable and beautiful.
上述實施例中，在觸控感測層及扇出線路結構上更可覆蓋一層或多層有機或無機透明且絕緣之圖案化保護層，可增加對環境與外力的耐受性。In the above embodiments, one or more layers of organic or inorganic transparent and insulating patterned protective layer may be covered on the touch sensing layer and the fan-out line structure to increase the tolerance to the environment and external forces.
综上所述，本發明一實施例之觸控面板藉由圖案化介電層可使第一扇出導線與第二扇出導線部分重疊且彼此電性絕緣。如此一來，第一扇出導線與第二扇出導線所在之周邊線路區的寬度便可有效縮小，進而使本發明一實施例之觸控面板在整體尺寸固定下觸控區之面積可變大且外型亦更加地美觀。此外，在本發明一實施例之觸控面板中，觸控面板最外層之接墊的材質可相同，而使驅動晶片與觸控面板最外層之接墊間的接合狀況較易掌握，進而使得觸控面板的感測功能及信賴性佳。In summary, the touch panel of the embodiment of the present invention partially overlaps and electrically insulates the first fan-out wire from the second fan-out wire by patterning the dielectric layer. In this way, the width of the peripheral line region where the first fan-out wire and the second fan-out wire are located can be effectively reduced, and the touch panel of the embodiment of the present invention has a variable area of the touch area. Large and beautiful. In addition, in the touch panel of the embodiment of the present invention, the material of the outermost layer of the touch panel can be the same, and the bonding between the driving chip and the outermost layer of the touch panel is relatively easy to grasp. The sensing function and reliability of the touch panel are good.
另外，在本發明另一實施例之觸控面板中，觸控面板最外層之接墊可位於同一水平面上，而使得觸控面板最外層之接墊可更良好的與驅動晶片接合，進而使得觸控面板的感測功能及信賴性更加地優良。In addition, in the touch panel of another embodiment of the present invention, the pads of the outermost layer of the touch panel can be located on the same horizontal surface, so that the pads of the outermost layer of the touch panel can be better bonded to the driving wafer, thereby The sensing function and reliability of the touch panel are more excellent.
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作些許之更動與潤飾，故本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.
100、200．．．觸控面板100, 200. . . Touch panel
102、202．．．基板102, 202. . . Substrate
104、212a．．．遮光層104, 212a. . . Shading layer
106、112、206．．．圖案化導電層106, 112, 206. . . Patterned conductive layer
106a、112a、206a、S2．．．感測串列106a, 112a, 206a, S2. . . Sensing string
106b、206b．．．感測墊106b, 206b. . . Sensing pad
106c、210b．．．橋接線路106c, 210b. . . Bridge line
108、114、204a、210a．．．扇出導線108, 114, 204a, 210a. . . Fan-out wire
108a、204c．．．第一接墊108a, 204c. . . First pad
114a、210d．．．第二接墊114a, 210d. . . Second pad
114b、210c．．．第三接墊114b, 210c. . . Third pad
204b．．．第四接墊204b. . . Fourth pad
110a、208a．．．圖案化介電層110a, 208a. . . Patterned dielectric layer
110b、208b．．．圖案化絕緣層110b, 208b. . . Patterned insulation
212．．．蓋板212. . . Cover
D1、D2．．．寬度D1, D2. . . width
K1、K2．．．群K1, K2. . . group
R1．．．觸控區R1. . . Touch area
R2．．．周邊線路區R2. . . Peripheral area
x、y．．．方向x, y. . . direction
圖1A至圖1F為本發明第一實施例之觸控面板製造流程的上視示意圖。1A to 1F are schematic top views of a manufacturing process of a touch panel according to a first embodiment of the present invention.
圖2A至圖2F為對應圖1A至圖1F之剖線AA’、BB’、CC’所繪之觸控面板製造流程的剖面示意圖。2A to 2F are schematic cross-sectional views showing a manufacturing process of the touch panel corresponding to the cross-sectional lines AA', BB', and CC' of Figs. 1A to 1F.
圖3示出多種接墊間的配置方式。Figure 3 illustrates the arrangement of the various pads.
圖4A至圖4D為本發明第二實施例之觸控面板製造流程的上視示意圖。4A to 4D are schematic top views of a manufacturing process of a touch panel according to a second embodiment of the present invention.
圖5A至圖5D為對應圖4A至圖4D之剖線aa’、bb’、cc’所繪之觸控面板製造流程的剖面示意圖。5A to 5D are schematic cross-sectional views showing a manufacturing process of the touch panel corresponding to the cross-sectional lines aa', bb', and cc' of Figs. 4A to 4D.
圖6為本發明第二實施例之觸控面板200之剖面示意圖。FIG. 6 is a cross-sectional view of a touch panel 200 according to a second embodiment of the present invention.
100．．．觸控面板100. . . Touch panel
102．．．基板102. . . Substrate
104．．．遮光層104. . . Shading layer
106．．．圖案化導電層106. . . Patterned conductive layer
106c．．．橋接線路106c. . . Bridge line
108、114．．．扇出導線108, 114. . . Fan-out wire
108a．．．第一接墊108a. . . First pad
114a．．．第二接墊114a. . . Second pad
114b．．．第三接墊114b. . . Third pad
110a．．．圖案化介電層110a. . . Patterned dielectric layer
Claims (13)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100132137A TWI539336B (en) | 2011-09-06 | 2011-09-06 | Touch panel |
| CN201110343213.0A CN102436324B (en) | 2011-09-06 | 2011-10-27 | Touch panel |
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| Application Number | Priority Date | Filing Date | Title |
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| TW100132137A TWI539336B (en) | 2011-09-06 | 2011-09-06 | Touch panel |
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| TW201312402A true TW201312402A (en) | 2013-03-16 |
| TWI539336B TWI539336B (en) | 2016-06-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN (1) | CN102436324B (en) |
| TW (1) | TWI539336B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9158343B2 (en) | 2013-05-20 | 2015-10-13 | Au Optronics Corporation | Touch panel and method of fabricating the same |
| TWI510985B (en) * | 2013-06-19 | 2015-12-01 | Interface Optoelectronic Shenzhen Co Ltd | Touch screen module |
| TWI635424B (en) * | 2017-09-01 | 2018-09-11 | 大陸商業成科技（成都）有限公司 | Touch panel |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9354738B2 (en) * | 2013-02-07 | 2016-05-31 | Htc Corporation | Touch panel assembly and electronic apparatus |
| CN104238784B (en) * | 2013-06-08 | 2018-03-02 | 宸鸿科技(厦门)有限公司 | Contact panel |
| TWI603236B (en) | 2014-02-19 | 2017-10-21 | 友達光電股份有限公司 | Touch panel, touch display panel and touch signal sensing method |
| CN104898901B (en) * | 2014-03-05 | 2017-10-13 | 纬创资通股份有限公司 | Bonding pad structure and contact panel |
| TW201537399A (en) * | 2014-03-19 | 2015-10-01 | Wintek Corp | Touch panel and touch display module |
| CN105137633B (en) * | 2015-07-29 | 2018-04-20 | 武汉华星光电技术有限公司 | Display panel and thin-film transistor array base-plate |
| KR102075065B1 (en) * | 2017-02-16 | 2020-02-07 | 동우 화인켐 주식회사 | Touch sensor and method of manufacturing the same |
| CN108062183B (en) * | 2018-01-03 | 2021-11-05 | 京东方科技集团股份有限公司 | Touch substrate, preparation method thereof and touch panel |
| CN109508122A (en) * | 2018-12-29 | 2019-03-22 | 业成科技（成都）有限公司 | Touch device |
| CN109917962B (en) * | 2019-03-05 | 2022-04-15 | 业成科技（成都）有限公司 | Touch panel |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101359265B (en) * | 2008-09-10 | 2012-07-04 | 友达光电股份有限公司 | Touching control panel, display and method for making the touching control panel |
| CN101930326B (en) * | 2009-06-18 | 2012-04-11 | 宸鸿科技(厦门)有限公司 | Manufacture method of capacitor-type touch sensing board and structure thereof |
| TWI408441B (en) * | 2009-12-09 | 2013-09-11 | Au Optronics Corp | Touch display panel and touch substrate |
-
2011
- 2011-09-06 TW TW100132137A patent/TWI539336B/en not_active IP Right Cessation
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9158343B2 (en) | 2013-05-20 | 2015-10-13 | Au Optronics Corporation | Touch panel and method of fabricating the same |
| TWI627564B (en) * | 2013-05-20 | 2018-06-21 | 友達光電股份有限公司 | Touch panel and method of fabricating the same |
| TWI510985B (en) * | 2013-06-19 | 2015-12-01 | Interface Optoelectronic Shenzhen Co Ltd | Touch screen module |
| TWI635424B (en) * | 2017-09-01 | 2018-09-11 | 大陸商業成科技（成都）有限公司 | Touch panel |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102436324A (en) | 2012-05-02 |
| TWI539336B (en) | 2016-06-21 |
| CN102436324B (en) | 2014-06-04 |
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