CN101930326B - Manufacture method of capacitor-type touch sensing board and structure thereof - Google Patents
Manufacture method of capacitor-type touch sensing board and structure thereof Download PDFInfo
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- CN101930326B CN101930326B CN2009101490933A CN200910149093A CN101930326B CN 101930326 B CN101930326 B CN 101930326B CN 2009101490933 A CN2009101490933 A CN 2009101490933A CN 200910149093 A CN200910149093 A CN 200910149093A CN 101930326 B CN101930326 B CN 101930326B
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- electrically conducting
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- conducting transparent
- touch sensing
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Abstract
The invention relates to a manufacture method of a capacitor-type touch sensing board and a structure thereof. The method comprises the following steps of: coating a transparent conductive layer on a substrate, etching the transparent conductive layer to keep a transparent conductive pattern of a transparent conductive module and an extension section corresponding to the transparent conductive pattern; coating an insulation layer on the transparent conductive pattern and the extension section, etching the insulation layer according to the designs of the transparent conductive pattern and the extension section to keep an insulation area on the transparent conductive pattern and the extension section; and coating a conductive layer and then etching the conductive layer according to the designs of the transparent conductive pattern and the extension section to keep a plurality of conductive circuits. The invention can solve the problem of impedances by utilizing the process method and has simple manufacture process so as to be more practical.
Description
Technical field
The present invention relates to a kind of capacitor-type touch sensing board, particularly relate to a kind of manufacturing approach and structure thereof that can reduce the capacitor-type touch sensing board of impedance.
Background technology
Basically; General capacitor-type touch sensing board can utilize the transparent conducting coating etching on the base material to produce different electrically conducting transparent modules; Form the transparency electrode insulated from each other of directions X and Y direction, when the user to point or during the conductive body contact induction plate of other ground connection, the X axle and the electrode on the Y direction that touch will produce the electric capacity difference respectively; System will judge the position of finger on tablet according to the X axle of this variation and the electrode on the Y direction.
Figure 1A is the synoptic diagram of the conducting wire wire structures of conventional condenser touch sensing board 10A.As shown in Figure 1, be the structure of the capacitor-type touch sensing board of monolateral lead-in wire, conducting wire 102A is that the end from the X axle of electrically conducting transparent module 104A and Y direction electrode extracts, and does analysis so that telecommunication signal is sent to chip (not shown).This conventional condenser touch sensing board 10A utilizes three road technologies to accomplish the making of the middle electrically conducting transparent module 104A and the opaque conductive path 102A of periphery; The making of the electrically conducting transparent figure of the electrically conducting transparent module 104A in the middle of wherein first road is accomplished; In the localities making one insulation course of second road for insulating at above-mentioned conductive pattern, and the 3rd road is the opaque conductive path 102A that processes the conducting wire between the electrically conducting transparent module and draw electrically conducting transparent modular telecommunications number.The characteristics of conventional condenser touch sensing board are that the technology and the pattern of touch sensing board is simpler; The connection gasket zone is less; Flexible circuit board (Flexible Print Circuit, FPC) circuit is simple, but when the size of panel greatly the time; Have the too big problem of impedance, influence the sensitivity and the scan speed of touch sensing board.
Figure 1B is the conducting wire wire structures of another conventional condenser touch sensing board 10B.Shown in Figure 1B; This conventional condenser touch sensing board 10B is the capacitor-type touch sensing board of bilateral lead-in wire; Conducting wire 102B is all drawn at X axle and Y direction top electrode two ends at electrically conducting transparent module 104B; In regular turn all conducting wire 102B are guided on the same position on the base material then, be coupled through weld pad (bondingpad) and flexible circuit board (FPC), the conducting wire 102B of each bar electrically conducting transparent module 104B can do the coupling of telecommunications on flexible circuit board (FPC).The conducting wire of bilateral pin configuration like this increases, and can make the zone of weld pad become big, and the making of FPC also can be relatively complicated.
Fig. 1 C is the capacitor-type touch sensing board of another bilateral lead-in wire.Shown in Fig. 1 C, this capacitor-type touch sensing board 10C needs four road technologies just can accomplish the making of this tablet 10C.First step is accomplished the technology of the electrically conducting transparent figure 102C of electrically conducting transparent module; Second step make the electrically conducting transparent module-external first road conducting wire 108C (such as thick line among Fig. 1 C drafting); Third step in position that electrically conducting transparent figure 102C need insulate and the position that need insulate of above-mentioned conducting wire 108C lay insulation course 106C, completely cut off the signal interference between the two-layer conducting wire; The 4th step is accomplished the conducting wire of electrically conducting transparent inside modules and the technology of outside second road conducting wire 104C, shown in Fig. 1 D.Step by technology can learn that the technology of the capacitor-type touch sensing board of Fig. 1 C is complicated, and the production cycle is longer, and cost also can be higher.
Therefore according to above-mentioned conventional condenser touch sensing board, the capacitor-type touch sensing board that exists a kind of demand to design bilateral lead-in wire can improve the excessive problem of impedance, and its connection gasket zone is less, and the circuit of flexible circuit board (FPC) is simpler, makes simple.
This shows that above-mentioned existing capacitor-type touch sensing board obviously still has inconvenience and defective, and demands urgently further improving in product structure, manufacturing approach and use.In order to solve the problem of above-mentioned existence; Relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly; But do not see always that for a long time suitable design is developed completion; And common product and method do not have appropriate structure and method to address the above problem, and this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found a kind of manufacturing approach and structure thereof of new capacitor-type touch sensing board, real one of the current important research and development problem that belongs to, also becoming the current industry utmost point needs improved target.
Because the defective that above-mentioned existing capacitor-type touch sensing board exists; The inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge; And cooperate the utilization of scientific principle, actively study innovation, in the hope of founding a kind of manufacturing approach and structure thereof of new capacitor-type touch sensing board; Can improve general existing capacitor-type touch sensing board, make it have more practicality.Through constantly research, design, and, found out the present invention of true tool practical value finally through after studying sample and improvement repeatedly.
Summary of the invention
Fundamental purpose of the present invention is, overcomes the defective that existing capacitor-type touch sensing board exists, and a kind of new capacitor-type touch sensing board is provided, and technical matters to be solved is to improve the problem of its impedance, is very suitable for practicality.
Another object of the present invention is to; Overcome the defective of the manufacturing approach existence of existing capacitor-type touch sensing board; And a kind of manufacturing approach of new capacitor-type touch sensing board is provided; Technical matters to be solved is to make it by utilizing this process can improve the problem of impedance, and its manufacturing process is simple, thereby is suitable for practicality more.
The object of the invention and solve its technical matters and adopt following technical scheme to realize.The manufacturing approach of a kind of capacitor-type touch sensing board that proposes according to the present invention, it may further comprise the steps: coating one transparency conducting layer on a base material, this transparency conducting layer of etching is to keep an electrically conducting transparent figure and many extensions of section of an electrically conducting transparent module; Coating one insulation course on said electrically conducting transparent figure and extension of section, according to the design of above-mentioned electrically conducting transparent figure and extension of section, this insulation course of etching is to keep a plurality of insulation layers on said electrically conducting transparent figure and those extensions of section; And on electrically conducting transparent figure after the last step completion and extension of section, be coated with a conductive layer again; Then according to this conductive layer of design etched of above-mentioned electrically conducting transparent figure and extension of section to keep many conducting wires, this conducting wire couples the identical directions X electrode of this electrically conducting transparent module and the electrode of identical Y direction respectively.
The object of the invention and solve its technical matters and also can adopt following technical measures further to realize.
The signal that the manufacturing approach of aforesaid capacitor-type touch sensing board, this insulation layer on the wherein said extension of section are used to insulate between this extension of section and this conducting wire disturbs.
The manufacturing approach of aforesaid capacitor-type touch sensing board, (Indium Tim Oxide ITO) forms wherein said transparency conducting layer by tin indium oxide.
The manufacturing approach of aforesaid capacitor-type touch sensing board, wherein said extension of section are the end extensions from the X axle of this electrically conducting transparent figure and Y direction.
The object of the invention and solve its technical matters and also adopt following technical scheme to realize.According to a kind of capacitor-type touch sensing board that the present invention proposes, it comprises: an electrically conducting transparent module comprises an electrically conducting transparent figure and many extensions of section at least, and those extensions of section are the end extensions from the X axle of this electrically conducting transparent figure and Y direction; A plurality of insulation layers, described insulation layer are disposed on those extensions of section; And draw many conducting wires of said electrically conducting transparent modular telecommunications number accordingly with said extension of section and insulation layer, and described conducting wire couples the directions X electrode of this electrically conducting transparent module and the electrode of Y direction.
The object of the invention and solve its technical matters and also can adopt following technical measures further to realize.
Aforesaid capacitor-type touch sensing board, wherein said electrically conducting transparent figure and those extensions of section are to be made up of coating and etching mode.
The signal that aforesaid capacitor-type touch sensing board, wherein said insulation layer are used to insulate between this extension of section and this conducting wire disturbs.
Aforesaid capacitor-type touch sensing board, wherein said electrically conducting transparent figure are that (Indium Tim Oxide ITO) forms by tin indium oxide.
The present invention compared with prior art has tangible advantage and beneficial effect.Know by above; For achieving the above object; The invention provides a kind of manufacturing approach of capacitor-type touch sensing board; Its method is included on the base material and is coated with transparency conducting layer, the etching transparency conducting layer with the electrically conducting transparent figure that keeps the electrically conducting transparent module and with the corresponding extension of section of electrically conducting transparent figure; Coating one insulation course on electrically conducting transparent figure and extension of section, according to the design of above-mentioned electrically conducting transparent figure and extension of section, etching isolation layer is to keep insulation layer on said electrically conducting transparent figure and those extensions of section; And be coated with a conductive layer, then according to this conductive layer of design etched of electrically conducting transparent figure and extension of section to keep many conducting wires.
According to above-mentioned purpose; The present invention proposes a kind of capacitor-type touch sensing board; It mainly comprises electrically conducting transparent module with electrically conducting transparent figure and many extensions of section, be arranged on a plurality of insulation layers on the said extension of section and draw many conducting wires of electrically conducting transparent modular telecommunications number accordingly with said extension of section and insulation layer, and those conducting wires couple the identical directions X electrode of this electrically conducting transparent module and the electrode of identical Y direction respectively.
By technique scheme; The manufacturing approach of capacitor-type touch sensing board of the present invention and structure thereof have advantage and beneficial effect at least: the present invention is by utilizing this process can improve the problem of impedance; And its manufacturing process is simple, thereby is suitable for practicality more.
In sum; The invention relates to a kind of manufacturing approach and structure thereof of capacitor-type touch sensing board; This method is included on the base material and is coated with transparency conducting layer, the etching transparency conducting layer with the electrically conducting transparent figure that keeps the electrically conducting transparent module and with the corresponding extension of section of electrically conducting transparent figure; Coating one insulation course on electrically conducting transparent figure and extension of section, according to the design of above-mentioned electrically conducting transparent figure and extension of section, etching isolation layer is to keep insulation layer on said electrically conducting transparent figure and those extensions of section; And be coated with a conductive layer, then according to this conductive layer of design etched of electrically conducting transparent figure and extension of section to keep many conducting wires.
The present invention has obvious improvement technically, and has tangible good effect, really is the new design of a novelty, progress, practicality.
Above-mentioned explanation only is the general introduction of technical scheme of the present invention; Understand technological means of the present invention in order can more to know; And can implement according to the content of instructions, and for let of the present invention above-mentioned with other purposes, feature and advantage can be more obviously understandable, below special act preferred embodiment; And conjunction with figs., specify as follows.
Description of drawings
Figure 1A-Fig. 1 C is the synoptic diagram of traditional capacitor-type touch sensing board.
Fig. 1 D is the making process flow diagram of traditional capacitor-type touch sensing board of Fig. 1 C.
Fig. 2 is electrically conducting transparent figure and the synoptic diagram of extension of section of the electrically conducting transparent module of capacitor-type touch sensing board of the present invention.
Fig. 3 is provided with the synoptic diagram of insulation layer on electrically conducting transparent figure and extension of section for Fig. 2.
Fig. 4 is the synoptic diagram of the conducting wire of capacitor-type touch sensing board of the present invention.
Fig. 5 is the one-piece construction synoptic diagram of touch sensing board of the present invention.
Fig. 6 is the process chart of touch sensing board of the present invention.
10A: capacitor-type touch sensing board
102A: conducting wire
104A: electrically conducting transparent module
10B: capacitor-type touch sensing board
104B: electrically conducting transparent module
102B: conducting wire
10C: capacitor-type touch sensing board
102C: electrically conducting transparent figure
104C: conducting wire, second road
106C: insulation course
108C: conducting wire, first road
2022: the electrically conducting transparent figure
2024: extension of section
204: insulation layer
206: the conducting wire
50: touch sensing board
502: the electrically conducting transparent module
5022: the electrically conducting transparent figure
5024: extension of section
504: the conducting wire
506: insulation layer
602: step
604: step
606: step
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention; Below in conjunction with accompanying drawing and preferred embodiment; To manufacturing approach and its embodiment of structure, structure, manufacturing approach, step, characteristic and the effect thereof of the capacitor-type touch sensing board that proposes according to the present invention, specify as after.
Relevant aforementioned and other technology contents, characteristics and effect of the present invention can clearly appear in the following detailed description that cooperates with reference to graphic preferred embodiment.Explanation for ease, in following embodiment, components identical is represented with identical numbering.
Some embodiments of the present invention will be described in detail as follows.Yet except following description, the present invention can also be widely implements at other embodiment, and scope of the present invention do not receive the qualification of embodiment, its with after claim be as the criterion.Moreover for clearer description being provided and being more readily understood the present invention, graphic interior each several part is not drawn according to its relative size, and some size is compared with other scale dependents and is exaggerated; Incoherent detail section is not drawn fully yet, in the hope of graphic succinct.
Fig. 2 shows the electrically conducting transparent figure of capacitor-type touch sensing board and the synoptic diagram of extension of section.Electrically conducting transparent figure 2022 is on base material, to be coated with transparent conducting coating earlier with the technology of extension of section 2024; The etching transparent conducting coating is to form this electrically conducting transparent figure 2022 then; In etched process, reserve extension of section 2024 simultaneously; Can accomplish electrically conducting transparent figure shown in Figure 2 2022 and extension of section 2024, and electrically conducting transparent figure 2022 is the part of electrically conducting transparent module with extension of section 2024.The transparent membrane (for example tin indium oxide (ITO) film) that this electrically conducting transparent figure 2022 and extension of section 2024 optional usefulness have the good conductive characteristic is as material.As shown in Figure 2, be that with traditional electrically conducting transparent module difference electrically conducting transparent figure 2022 of the present invention is extending many extensions of section 2024 along the X axle of electrically conducting transparent figure and an end of Y direction.
Fig. 3 is presented at the synoptic diagram that insulation layer is set on electrically conducting transparent figure and the extension of section of electrically conducting transparent module.Capacitor-type touch sensing board of the present invention; The technology of this step is; Be coated with insulation course at electrically conducting transparent figure 2022 with on extension of section 2024, and this insulation course of etching keeps a plurality of insulation layers 204 on 2022 (not shown) of electrically conducting transparent figure and extension of section 2024.Insulation layer between the electrically conducting transparent figure is that the signal that is used between isolated X axle and the Y direction electrode disturbs, and the insulation layer on the extension of section 2024 is that the signal that is used between isolated extension of section 2024 and conducting wire (not shown) disturbs.Yet in different embodiment, according to the different circuits design, the insulation layer 204 that is kept at extension of section 2024 can have different configurations, does not limit at this.
Fig. 4 shows the conducting wire of capacitor-type touch sensing board of the present invention.In this processing step, on the structure of step process, whole layer is coated with one deck conductive layer again, stays predetermined conducting wire 206 with etched mode then on having accomplished.As shown in Figure 4, conducting wire 206 is not crossed over each other, so technology is to accomplish with the conducting wire technology between the electrically conducting transparent figure of electrically conducting transparent module.
Fig. 5 shows the synoptic diagram of touch sensing board of the present invention.Many the conducting wires 504 that as shown in Figure 5, this touch sensing board 50 mainly comprises electrically conducting transparent module with electrically conducting transparent figure 5022 and extension of section 5024, be arranged on a plurality of insulation layers 506 on the extension of section 5024 and draw electrically conducting transparent modular telecommunications number.Electrically conducting transparent figure 5022 is the part of electrically conducting transparent module 502 with extension of section 5024; And electrically conducting transparent figure 5022 mainly is on base material, to be coated with the layer of transparent conductive coating earlier with extension of section 5024, and the transparent conducting coating etching forms electrically conducting transparent figure 5022 and extension of section 5024 thus then.And a plurality of insulation layers 506 are distributed on many extensions of section 5024.The purpose of many conducting wires 504 is that the lotus root for the directions X of realizing electrically conducting transparent module 502 and Y direction two end electrodes connects.Compared to traditional touch sensing board, do not increasing under the processing step advantage such as touch sensing board of the present invention can have the problem of improving impedance, and connection gasket is less, and flexible circuit board (FPC) circuit is simpler.
Fig. 6 shows the process chart of touch sensing board of the present invention.As shown in Figure 6, the technology of touch sensing board of the present invention comprises the following step.In step 602, on base material, be coated with the layer of transparent conductive coating, this transparent conducting coating of etching is made required electrically conducting transparent figure and the extension of section of touch sensing board then.In step 604, coating one layer insulating on electrically conducting transparent figure and extension of section utilizes etched mode that required insulation layer is retained on electrically conducting transparent figure and many extensions of section then equally.In step 606, be provided with in the last step on the shaped structures of electrically conducting transparent figure and extension of section of insulation layer and be coated with one deck conductive layer again, then according to the design of electrically conducting transparent figure and many extensions of section, etch the conducting wire that all need.Accomplish the technological process of touch sensing board of the present invention.
The above only is preferred embodiment of the present invention, is not the present invention is done any pro forma restriction; Though the present invention discloses as above with preferred embodiment; Yet be not in order to limiting the present invention, anyly be familiar with the professional and technical personnel, in not breaking away from technical scheme scope of the present invention; When the method for above-mentioned announcement capable of using and technology contents are made a little change or be modified to the equivalent embodiment of equivalent variations; In every case be the content that does not break away from technical scheme of the present invention, to any simple modification, equivalent variations and modification that above embodiment did, all still belong in the scope of technical scheme of the present invention according to technical spirit of the present invention.
Claims (8)
1. the manufacturing approach of a capacitor-type touch sensing board is characterized in that it may further comprise the steps:
Coating one transparency conducting layer on a base material, this transparency conducting layer of etching is to keep an electrically conducting transparent figure and many extensions of section of an electrically conducting transparent module;
Coating one insulation course on said electrically conducting transparent figure and extension of section, according to the design of above-mentioned electrically conducting transparent figure and extension of section, this insulation course of etching is to keep a plurality of insulation layers on said electrically conducting transparent figure and those extensions of section; And
On electrically conducting transparent figure after the last step completion and extension of section, be coated with a conductive layer again; Then according to this conductive layer of design etched of above-mentioned electrically conducting transparent figure and extension of section to keep many conducting wires, this conducting wire couples the identical directions X electrode of this electrically conducting transparent module and the electrode of identical Y direction respectively.
2. the manufacturing approach of capacitor-type touch sensing board according to claim 1 is characterized in that the signal that this insulation layer on the wherein said extension of section is used to insulate between this extension of section and this conducting wire disturbs.
3. the manufacturing approach of capacitor-type touch sensing board according to claim 1 is characterized in that wherein said transparency conducting layer is made up of tin indium oxide.
4. the manufacturing approach of capacitor-type touch sensing board according to claim 1 is characterized in that wherein said extension of section is to extend from the X axle of this electrically conducting transparent figure and an end of Y direction.
5. capacitor-type touch sensing board is characterized in that it comprises:
One electrically conducting transparent module comprises an electrically conducting transparent figure and many extensions of section at least, and those extensions of section are the end extensions from the X axle of this electrically conducting transparent figure and Y direction;
A plurality of insulation layers, described insulation layer are disposed on those extensions of section; And
Draw many conducting wires of said electrically conducting transparent modular telecommunications number accordingly with said extension of section and insulation layer, and described conducting wire couples the identical directions X electrode of this electrically conducting transparent module and the electrode of identical Y direction respectively.
6. capacitor-type touch sensing board according to claim 5 is characterized in that wherein said electrically conducting transparent figure and those extensions of section are to be made up of coating and etching mode.
7. capacitor-type touch sensing board according to claim 5 is characterized in that the signal that wherein said insulation layer is used to insulate between this extension of section and this conducting wire disturbs.
8. capacitor-type touch sensing board according to claim 5 is characterized in that wherein said electrically conducting transparent figure is made up of tin indium oxide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN2009101490933A CN101930326B (en) | 2009-06-18 | 2009-06-18 | Manufacture method of capacitor-type touch sensing board and structure thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101490933A CN101930326B (en) | 2009-06-18 | 2009-06-18 | Manufacture method of capacitor-type touch sensing board and structure thereof |
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| CN101930326A CN101930326A (en) | 2010-12-29 |
| CN101930326B true CN101930326B (en) | 2012-04-11 |
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| CN2009101490933A Expired - Fee Related CN101930326B (en) | 2009-06-18 | 2009-06-18 | Manufacture method of capacitor-type touch sensing board and structure thereof |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI404996B (en) * | 2010-12-31 | 2013-08-11 | Au Optronics Corp | Method of manufacturing a touch panel and touch panel |
| TWI539336B (en) * | 2011-09-06 | 2016-06-21 | 友達光電股份有限公司 | Touch panel |
| CN103002664A (en) * | 2011-09-18 | 2013-03-27 | 宝宸（厦门）光学科技有限公司 | Touch screen and manufacturing method of conducting circuits |
| CN103049143A (en) * | 2011-10-13 | 2013-04-17 | 佳晶光电（厦门）有限公司 | Capacitive touch panel and manufacture method thereof |
| TWI461983B (en) * | 2012-07-05 | 2014-11-21 | Au Optronics Corp | Touch panel and touch display panel |
| CN102929463A (en) * | 2012-11-08 | 2013-02-13 | 深圳市长江力伟股份有限公司 | Capacitive touch screen capable of slowing down light interference effectively |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201166842Y (en) * | 2008-03-26 | 2008-12-17 | 南京华睿川电子科技有限公司 | Interior surface capacitance touch screen capable of multi-point touch control |
| CN101344831A (en) * | 2008-08-27 | 2009-01-14 | 南亚塑胶工业股份有限公司 | Condenser type touching control panel reducing line impedence by FPC |
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2009
- 2009-06-18 CN CN2009101490933A patent/CN101930326B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201166842Y (en) * | 2008-03-26 | 2008-12-17 | 南京华睿川电子科技有限公司 | Interior surface capacitance touch screen capable of multi-point touch control |
| CN101344831A (en) * | 2008-08-27 | 2009-01-14 | 南亚塑胶工业股份有限公司 | Condenser type touching control panel reducing line impedence by FPC |
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