TWI485596B - Touch panel and manufacturing method - Google Patents

Description

Touch structure and manufacturing method thereof

The present invention provides a touch structure, and provides a touch structure having a reduced touch structure and a thickness of a liquid crystal display device, improved touch sensitivity, reduced manufacturing cost, and improved module fabrication yield, and a manufacturing method thereof.

In today's market for consumer electronics products, portable electronic products such as personal digital assistants (PDAs), mobile phones, notebooks, and tablet PCs have been widely used. The touch panel is used as an interface tool for data communication. In addition, since the design of electronic products is currently in the direction of light, thin, short and small, there is not enough space on the product to accommodate traditional input devices such as keyboards and mice, especially in the demand for tablet PCs that are designed with humanity in mind. Under the touch structure has become one of the key components. In addition to the multi-level menu design requirements, the touch-sensitive structure can also have the functions of a keyboard, a mouse, etc., and a humanized operation mode such as handwriting input, especially integrating the input and output in the same interface (screen). The traits are beyond the reach of other traditional input devices. A touch display device is further provided, and a touch structure is disposed on the display device, so that the touch structure provides a touchable area according to the display image of the display device, and the touch display device is used for the user to touch according to the touch object displayed on the screen. operating.

The structure design of the traditional projected capacitive touch panel is usually G/F/F junction Structure (reinforced glass / film / film), the upper and lower electrodes are placed on a 2-layer substrate, and a reinforced glass protective substrate (Cover Lens) is placed thereon. This multilayer stack structure will lead to an increase in the overall thickness of the touch panel. And causing the optical effect to deteriorate, affecting the appearance of the touch display device.

In view of the problems existing in the prior art, the present invention provides a touch structure and a manufacturing method thereof, which have the advantages of thin device, superior touch sensitivity, low manufacturing cost, and high module fabrication yield.

In order to achieve the above object, a touch structure of the present invention includes: a first polarizer having a lower electrode, and a protective substrate having an upper electrode, the protective substrate being disposed on the first polarizer, and the upper electrode and the lower electrode being staggered .

In order to achieve the above object, a touch structure of the present invention, wherein a lower electrode is disposed on a lower surface of the first polarizing plate.

In order to achieve the above object, a touch structure of the present invention, wherein a lower electrode is disposed on an upper surface of the first polarizing plate.

To achieve the above object, a touch structure of the present invention, wherein the upper electrode has a plurality of upper sensing traces and a plurality of upper terminal lines, wherein the plurality of upper sensing traces and the plurality of upper terminal lines are connected to each other. The lower electrode has a plurality of lower sensing traces and a plurality of lower terminal lines, wherein the plurality of lower sensing traces and the plurality of lower terminal lines are connected to each other. The plurality of sense traces and the plurality of sense traces are staggered, and the plurality of upper terminal lines and the plurality of lower terminal lines are connected to a control wafer.

In order to achieve the above object, a touch structure of the present invention further includes: the display unit is disposed under the first polarizing plate, and the second polarizing plate is disposed under the display unit.

To achieve the above object, the manufacture of a touch structure of the present invention The method comprises: providing a first polarizing plate to form a lower electrode on the first polarizing plate. A protective substrate is provided, an upper electrode is formed on the lower surface of the protective substrate, and the first polarizing plate and the protective substrate are pasted, and the lower electrode and the upper electrode are alternately disposed.

In order to achieve the above object, a method for manufacturing a touch structure according to the present invention comprises: providing a first polarizing plate to a roll, forming a lower electrode on the first polarizing plate, and providing a protective substrate on the roll to form an upper electrode; The lower surface of the substrate is protected, and the first polarizer and the protective substrate are adhered so that the lower electrode and the upper electrode are alternately arranged.

In order to achieve the above object, a method for manufacturing a touch structure according to the present invention, wherein the method of forming a lower electrode comprises: sequentially forming a transparent conductive layer and a metal layer on the first polarizing plate. The transparent conductive layer and the metal layer are patterned to form a plurality of lower sensing traces and a plurality of lower terminal lines having a metal layer on the transparent conductive layer to remove metal layers on the plurality of sensing traces.

To achieve the above object, a method of fabricating a touch structure according to the present invention, wherein the method of forming a lower electrode comprises: forming a transparent conductive layer on the first polarizing plate. The transparent conductive layer is patterned to form a plurality of lower sensing traces and a plurality of lower terminal lines, and the printed metal layer is over the plurality of lower terminal lines.

To achieve the above object, a method for manufacturing a touch structure of the present invention further includes cutting the first polarizing plate and the protective substrate.

In order to achieve the above object, a method for manufacturing a touch structure of the present invention further includes: providing a display unit, disposing the display unit under the first polarizing plate, and providing a second polarizing plate, and disposing the second polarizing plate on the display unit under.

100,200,300,400‧‧‧protective substrate

110,210,310,410‧‧‧first polarizer

120,220,320,420‧‧‧second polarizer

130,230,330,430‧‧‧ upper electrode

131,231,331,431‧‧‧multiple sensing traces

132,232,332,432‧‧‧multiple upper terminal lines

140,240,340,440‧‧‧ lower electrode

141,241,341,441‧‧‧Multiple sensing traces

142,242,341,441‧‧‧multiple terminal lines

150, 250, 350, 450‧‧‧ display unit

160,260,360,460‧‧‧hard coating

170,370‧‧‧Adhesive layer

101,201,301,401‧‧‧metal layer

102,202,302,402‧‧‧Transparent conductive layer

1a to 1b are schematic views showing the structure of a touch structure according to an embodiment of the present invention.

2a to 2g are schematic views showing a manufacturing method of a touch structure according to an embodiment of the present invention.

3a to 3b are schematic views showing the structure of a touch structure according to an embodiment of the present invention.

4a to 4g are schematic views showing a manufacturing method of a touch structure according to an embodiment of the present invention.

Please refer to FIGS. 1a to 1b for a schematic structural view of a touch structure according to an embodiment of the present invention. First, the touch structure of the present invention includes: the lower surface of the first polarizing plate 110 has a lower electrode 140, wherein the main structure of the first polarizing plate 110 is, for example, a PET protective film, a PSA pressure sensitive adhesive, and a TAC triacetate fiber. , PVA polyvinyl alcohol and PET release film, etc., but not limited to this. And the upper surface of the protective substrate 100 has an upper electrode 130, wherein the material of the protective substrate 100 can be, for example, a polyester polymer, a polyfluorene polymer, glass, polymethyl methacrylate, polycarbonate or polyimine. However, it is not limited to this. The upper surface of the protective substrate 100 further has a hard coat layer 160. The material of the hard coat layer 160 may be, for example, SiO 2 or a resin polymer, but is not limited thereto. The hard coat layer 160 has scratch resistance and can protect the touch panel. The protective substrate 100 is disposed on the first polarizing plate 110, and the protective substrate 100 and the first polarizing plate 110 are adhered to each other by the adhesive layer 170. The material of the adhesive layer 170 can be, for example, optical glue or water glue. Limited. Then, the upper electrode 130 and the lower electrode 140 are alternately arranged to form a touch structure, wherein the upper electrode 130 has a plurality of upper sensing traces 131 and a plurality of upper terminals 132 connected to each other, and the lower electrode 140 has a plurality of lower sensing traces 141 and a plurality The lower terminal lines 142 are connected to each other, and the plurality of upper terminal lines 132 and the plurality of lower terminal lines 142 are connected to a control wafer (not shown). Wherein the plurality of sensing traces 131 may be arranged in the first direction array Columns, the plurality of sensing traces 141 may be arranged in an array along the second direction, but are not limited thereby. The display unit 150 is disposed under the first polarizing plate 110, and the second polarizing plate 120 is disposed under the display unit 150. The display unit 150 can be, for example, a liquid crystal display (LCD), an organic light emitting diode display (OLED display), an electrophoretic display (EPD), or a plasma display panel. Or E-paper display, etc., but not limited to this. In addition, a backlight module (not shown) is further disposed under the second polarizing plate 120, and the backlight module can provide a display light source.

Please refer to FIGS. 2a to 2g for a schematic diagram of a manufacturing method of a touch structure according to an embodiment of the present invention. First, the first polarizing plate 210 is provided, and the transparent conductive layer 202 and the metal layer 201 are sequentially formed on the lower surface of the first polarizing plate 210, wherein the transparent conductive layer 202 can be, for example, a metal oxide, a nano silver wire or a nano conductive. The metal or metal oxide may be, for example, indium tin oxide (ITO), indium zinc oxide (IZO), cadmium tin oxide (CTO), aluminum zinc oxide (AZO). ), indium tin zinc oxide (ITZO), zinc oxide, cadmium oxide, hafnium oxide (HfO), indium gallium zinc oxide (InGaZnO) Indium gallium zinc magnesium oxide (InGaZnMgO), indium gallium magnesium oxide (InGaMgO) or indium gallium aluminum oxide (InGaAlO), etc.). The metal layer 201 can be, for example, at least one layer of conductive metal or a plurality of layers of conductive metal. The material may be a conductive metal or a conductive alloy such as a copper alloy, an aluminum alloy, gold, silver, aluminum, copper or molybdenum. The structure of the multi-layer conductive metal layer may be, for example, a stacked structure of a molybdenum layer/aluminum layer/molybdenum layer, or may be a conductive metal or a conductive alloy selected from the group consisting of copper alloy, aluminum alloy, gold, silver, aluminum, copper, molybdenum, and the like. Multi-layered stack of multiple materials Electrical metal layer structure. The method of forming the transparent conductive layer 202 and the metal layer 201 may be, for example, sputtering, vapor deposition, vacuum ion plating, electroplating, physical vapor deposition (PVD), chemical vapor deposition (CVD), or the like. Then, the first yellow light process is performed to pattern the transparent conductive layer 202 and the metal layer 201. The first yellow light process includes forming a patterned photoresist layer (not shown) over the metal layer 201, and the photoresist layer. The material can be liquid photoresist or dry film photoresist. Then etching the metal layer 201 and the transparent conductive layer 202, and removing the patterned photoresist layer, forming a plurality of sensing traces 241 and a plurality of lower terminal lines 242 having the metal layer 201 thereon, followed by a second yellow light The process removes the metal layer 201 under the plurality of sensing traces 241. The plurality of lower sensing traces 241 and the plurality of lower terminal lines 242 are connected to each other to form a lower electrode 240, and the plurality of lower terminal lines 242 are connected to a control wafer (not shown).

Then, the protective substrate 200 is provided, and the transparent conductive layer 202 and the metal layer 201 are sequentially formed on the lower surface of the protective substrate 200. The transparent conductive layer 202 may be, for example, a metal oxide, a nano silver wire or a nano conductive metal, a metal oxide. For example, it may be indium tin oxide (ITO), indium zinc oxide (IZO), cadmium tin oxide (CTO), aluminum zinc oxide (AZO), indium zinc oxide. Indium tin zinc oxide (ITZO), zinc oxide, cadmium oxide, hafnium oxide (HfO), indium gallium zinc oxide (InGaZnO), indium gallium zinc oxide Indium gallium zinc magnesium oxide (InGaZnMgO), indium gallium magnesium oxide (InGaMgO) or indium gallium aluminum oxide (InGaAlO). The metal layer 201 can be, for example, at least one layer of conductive metal or a plurality of layers of conductive metal. The material may be a conductive metal or a conductive alloy such as a copper alloy, an aluminum alloy, gold, silver, aluminum, copper or molybdenum. The structure of the multi-layer conductive metal layer may be, for example, a stacked structure of a molybdenum layer/aluminum layer/molybdenum layer, or may be a conductive metal or a conductive alloy selected from copper alloy, aluminum alloy, gold, silver, aluminum, copper, molybdenum or the like. A multilayer conductive metal layer structure stacked with one or more materials. The method of forming the transparent conductive layer 202 and the metal layer 201 may be, for example, sputtering, vapor deposition, vacuum ion plating, electroplating, physical vapor deposition (PVD), chemical vapor deposition (CVD), or the like. Then, the first yellow light process is performed to pattern the transparent conductive layer 202 and the metal layer 201. The first yellow light process includes forming a patterned photoresist layer (not shown) over the metal layer 201, and the photoresist layer. The material can be liquid photoresist or dry film photoresist. Then etching the metal layer 201 and the transparent conductive layer 202, and removing the patterned photoresist layer, forming a plurality of upper sensing traces 231 and a plurality of upper terminal lines 232 having the metal layer 201 thereon, followed by a second yellow light The process removes the metal layer 201 under the plurality of sensing traces 231. The plurality of upper sensing traces 231 and the plurality of upper terminal lines 232 are connected to each other to form an upper electrode 230, and the plurality of upper terminal lines 232 are connected to a control wafer (not shown). Then, the protective substrate 200 having the upper electrode 230 is adhered to the first polarizing plate 210 having the lower electrode 240 by an adhesive layer (not shown), and the upper electrode 230 and the lower electrode 240 are alternately arranged to form a touch. The structure is configured, wherein the touch structure is disposed on the display unit 250, and the second polarizer 220 is disposed under the display unit 250.

In the above embodiments (not shown), the method further includes cutting the first polarizing plate and the protective substrate which are adhered to each other to form a plurality of sheet-shaped sensing substrates by using a knife cutting or a laser cutting method. The sheet-like sensing substrate is pasted on the display unit, and the second polarizing plate is disposed under the display unit. In addition, under the second polarizing plate, a backlight module (not shown) is further included, and the backlight module can provide a display light source.

In another embodiment (not shown), the method for manufacturing a touch structure as described above, wherein the method of forming the lower electrode may also form a transparent conductive layer on the lower surface of the first polarizing plate, and first patterning A transparent conductive layer forms a plurality of lower sensing traces, followed by printing a plurality of terminal lines.

Please refer to FIGS. 3a to 3b for an embodiment of the present invention. Schematic diagram of the touch structure. First, the touch structure of the present invention includes: the upper surface of the first polarizing plate 310 has a lower electrode 340, wherein the main structure of the first polarizing plate 310 is, for example, a PET protective film, a PSA pressure sensitive adhesive, and a TAC triacetate fiber. , PVA polyvinyl alcohol and PET release film, etc., but not limited to this. And the lower surface of the protective substrate 300 has an upper electrode 330, wherein the material of the protective substrate 300 can be, for example, a polyester polymer, a polyfluorene polymer, glass, polymethyl methacrylate, polycarbonate or polyimine. However, it is not limited to this. The protective substrate 300 is disposed on the first polarizing plate 310, and the protective substrate 300 and the first polarizing plate 310 are adhered to each other by the adhesive layer 370. The material of the adhesive layer 370 can be, for example, optical glue or water glue. Limited. The upper surface of the protective substrate 300 further has a hard coating layer 360. The material of the hard coating layer 360 may be, for example, SiO 2 or a resin polymer, but is not limited thereto. The hard coat layer 360 is scratch resistant and can protect the touch panel. The upper electrode 330 and the lower electrode 340 are alternately arranged to form a touch structure, wherein the upper electrode 330 has a plurality of upper sensing traces 331 and a plurality of upper terminals 332 are connected to each other, and the lower electrode 340 has a plurality of lower sensing traces 341 and a plurality of The terminal lines 342 are connected to each other, and the plurality of upper terminal lines 332 and the plurality of lower terminal lines 342 are connected to a control wafer (not shown). The display unit 350 is disposed under the first polarizing plate 310, and the second polarizing plate 320 is disposed under the display unit 350. The display unit 350 can be, for example, a liquid crystal display (LCD), an organic light emitting diode display (OLED display), an electrophoretic display (EPD), or a plasma display panel. Or E-paper display, etc., but not limited to this. In addition, a backlight module (not shown) is further disposed under the second polarizing plate 320, and the backlight module can provide a display light source.

Please refer to FIGS. 4a to 4g for a schematic diagram of a manufacturing method of a touch structure according to an embodiment of the present invention. First, a first polarizing plate 410 is provided, The transparent conductive layer 402 and the metal layer 401 are sequentially formed on the upper surface of a polarizing plate 410. The transparent conductive layer 402 may be, for example, a metal oxide, a nano silver wire or a nano conductive metal, and the metal oxide may be, for example, indium tin oxide. (indium tin oxide, ITO), indium zinc oxide (IZO), cadmium tin oxide (CTO), aluminum zinc oxide (AZO), indium tin zinc oxide , ITZO), zinc oxide, cadmium oxide, hafnium oxide (HfO), indium gallium zinc oxide (InGaZnO), indium gallium zinc magnesium (indium gallium zinc magnesium) Oxide, InGaZnMgO), indium gallium magnesium oxide (InGaMgO) or indium gallium aluminum oxide (InGaAlO). The metal layer 401 can be, for example, at least one layer of a conductive metal or a plurality of layers of a conductive metal. The material may be a conductive metal or a conductive alloy such as a copper alloy, an aluminum alloy, gold, silver, aluminum, copper or molybdenum. The structure of the multi-layer conductive metal layer may be, for example, a stacked structure of a molybdenum layer/aluminum layer/molybdenum layer, or may be a conductive metal or a conductive alloy selected from the group consisting of copper alloy, aluminum alloy, gold, silver, aluminum, copper, molybdenum, and the like. A multi-layer conductive metal layer structure stacked with a plurality of materials. The method of forming the transparent conductive layer 402 and the metal layer 401 can be, for example, sputtering, evaporation, vacuum ion plating, electroplating, physical vapor deposition (PVD), chemical vapor deposition (CVD), or the like. Then, the first yellow light process is performed to pattern the transparent conductive layer 402 and the metal layer 401, wherein the first yellow light process comprises forming a patterned photoresist layer (not shown) on the metal layer 401, and the photoresist layer The material can be liquid photoresist or dry film photoresist. Then, an etching step is performed, etching the transparent conductive layer 402 and the metal layer 401 not protected by the photoresist layer, and removing the patterned photoresist layer to form a plurality of sensing traces 441 and a plurality of lower terminals having the metal layer 401 thereon. Line 442, followed by a second yellow light process, removes the metal layer 401 on the plurality of sensing traces 441. The plurality of lower sensing traces 441 and the plurality of lower terminal lines 442 are connected to each other to form a lower electrode 440, and the plurality of lower terminal lines 442 are connected to a control wafer (not shown).

Next, a protective substrate 400 is provided, and a transparent conductive layer 402 and a metal layer 401 are sequentially formed on the lower surface of the protective substrate 400, wherein the transparent conductive layer 402 can be, for example, a metal oxide, a nano silver wire or a nano conductive metal, and the metal oxide The material may be, for example, indium tin oxide (ITO), indium zinc oxide (IZO), cadmium tin oxide (CTO), aluminum zinc oxide (AZO), indium oxide. Indium tin zinc oxide (ITZO), zinc oxide, cadmium oxide, hafnium oxide (HfO), indium gallium zinc oxide (InGaZnO), indium gallium oxide Indium gallium zinc magnesium oxide (InGaZnMgO), indium gallium magnesium oxide (InGaMgO) or indium gallium aluminum oxide (InGaAlO). The metal layer 401 can be, for example, at least one layer of a conductive metal or a plurality of layers of a conductive metal. The material may be a conductive metal or a conductive alloy such as a copper alloy, an aluminum alloy, gold, silver, aluminum, copper or molybdenum. The structure of the multi-layer conductive metal layer may be, for example, a stacked structure of a molybdenum layer/aluminum layer/molybdenum layer, or may be a conductive metal or a conductive alloy selected from the group consisting of copper alloy, aluminum alloy, gold, silver, aluminum, copper, molybdenum, and the like. A multi-layer conductive metal layer structure stacked with a plurality of materials. The method of forming the transparent conductive layer 402 and the metal layer 401 can be, for example, sputtering, evaporation, vacuum ion plating, electroplating, physical vapor deposition (PVD), chemical vapor deposition (CVD), or the like. Then, the first yellow light process is performed to pattern the transparent conductive layer 402 and the metal layer 401, wherein the first yellow light process comprises forming a patterned photoresist layer (not shown) on the metal layer 401, and the photoresist layer The material can be liquid photoresist or dry film photoresist. Then performing an etching step of etching away the transparent conductive layer 402 and the metal layer 401 not protected by the photoresist layer, and removing the patterned photoresist layer to form a plurality of upper sensing traces 431 and a plurality of upper terminals having the metal layer 401 thereon Line 432, followed by a second yellow light process, removes the metal layer 401 under the plurality of sense traces 431. The plurality of upper sensing traces 441 and the plurality of upper terminal lines 442 are connected to each other to form an upper electrode 440, and a plurality of lower terminal lines 442 For connection to a control chip (not shown). Then, the protective substrate 400 having the upper electrode 430 is adhered to the first polarizing plate 410 having the lower electrode 440 by an adhesive layer, and the upper electrode 430 and the lower electrode 440 are alternately arranged to form a touch structure. The first polarizing plate 410 and the protective substrate 400 are disposed on the display unit 450, and the second polarizing plate 420 is disposed on the display. Below unit 450. In addition, a backlight module (not shown) is further disposed under the second polarizing plate 420, and the backlight module can provide a display light source.

In another embodiment (not shown), the method for manufacturing a touch structure as described above, wherein the method of forming the lower electrode may also form a transparent conductive layer on the upper surface of the first polarizing plate, first performing the first The yellow light process patterns the transparent conductive layer to form a plurality of lower sensing traces, followed by printing a plurality of terminal lines.

In still another embodiment (not shown), the method of forming the lower electrode is to provide a flexible first polarizer roll on a roll to roll, on the upper surface of the first polarizer or The lower surface sequentially forms a transparent conductive layer and a metal layer, wherein the transparent conductive layer and the metal layer are formed by, for example, roll-to-roll sputtering, roll-to-roll evaporation, roll-to-roll vacuum ion plating, roll-to-roll plating, and roll Volume physical vapor deposition (PVD), roll-to-roll chemical vapor deposition (CVD) and the like. Then, a roll-to-roll first yellow light process is performed, and the transparent conductive layer and the metal layer of the first polarizing plate coil are patterned to form a plurality of sensing traces and a plurality of lower terminal lines having the metal layer thereon. Next, a roll-to-roll second yellow light process is performed to remove the metal layer on the sensing traces under the plurality to form the lower electrode. Then, referring to the method for forming the lower electrode as described above, the method of forming the upper electrode is to provide a flexible protective substrate roll for the roll-to-roll, and sequentially form a transparent conductive layer and a metal layer on the surface of the protective substrate roll. The method for forming the transparent conductive layer and the metal layer can be, for example, roll-to-roll sputtering, roll-to-roll evaporation, roll-to-roll vacuum ion plating, roll-to-roll plating, roll-to-roll physical vapor deposition (PVD), and roll pair. Volume chemistry Vapor deposition (CVD) and the like. Then, a roll-to-roll first yellow light process is performed, and the transparent conductive layer and the metal layer of the substrate roll are patterned to form a plurality of upper sensing traces and a plurality of upper terminal lines having the metal layer thereon, and then roll For the second yellow light process of the roll, the metal layer on the plurality of sensing traces is removed to form the upper electrode. Then, the roll-to-roll provides an adhesive layer, and the roll-to-roll adheres the upper electrode roll and the lower electrode roll, so that the upper electrode and the lower electrode are alternately arranged to form a touch structure roll. The sheet-shaped touch sensing substrate is then formed by roll-to-roll die cutting or laser cutting. The upper electrode has a plurality of upper sensing traces and a plurality of upper terminal lines connected to each other, the lower electrode has a plurality of lower sensing traces and a plurality of lower terminal lines are connected to each other, and the plurality of upper terminal lines and the plurality of lower terminal lines are connected to a control chip. . Fully automated production using the roll-to-roll process, it features features such as streamlined process, increased productivity, reduced manpower and improved product yield.

In one embodiment, the method of forming the chip-shaped touch sensing substrate may further form the protective substrate roll and the first polarizer roll by forming the upper electrode and the lower electrode by the roll-to-roll yellow process described above. First, the protective substrate roll and the first polarizer roll are cut by a roll-to-roll die cutting or laser cutting to form a sheet-shaped upper electrode and a lower electrode, and an adhesive layer is provided between the upper electrode and the lower electrode. , using the alignment press to perform the alignment.

The invention has the advantages of thinner device, superior touch sensitivity, low manufacturing cost and high production yield. Although the present invention has been disclosed above by way of example, it is not intended to limit the invention. The scope of the present invention is defined by the scope of the claims, and the scope of the invention is intended to be limited by the scope of the invention.

100‧‧‧protective substrate

110‧‧‧First polarizer

120‧‧‧Second polarizer

131‧‧‧Multiple sensing traces

132‧‧‧Multiple terminal lines

141‧‧‧Multiple sensing traces

142‧‧‧Multiple terminal lines

150‧‧‧ display unit

160‧‧‧hard coating

170‧‧‧Adhesive layer

Claims (11)

A touch structure comprising: a first polarizer having a lower electrode; and a protective substrate having an upper electrode disposed on the first polarizer, the upper electrode being interleaved with the lower electrode Settings. The touch structure of claim 1, wherein the lower electrode is disposed on a lower surface of the first polarizer. The touch structure of claim 1, wherein the lower electrode is disposed on an upper surface of the first polarizing plate. The touch structure of claim 1, wherein the upper electrode has a plurality of upper sensing traces and a plurality of upper terminal lines, wherein the upper sensing traces and the upper terminal lines are connected to each other; the lower portion The electrode has a plurality of lower sensing traces and a plurality of lower terminal lines, wherein the lower sensing traces and the lower terminal lines are connected to each other; the upper sensing traces and the lower sensing traces are alternately arranged, The upper terminal lines and the lower terminal lines are connected to a control wafer. The touch structure of claim 1, further comprising: a display unit disposed under the first polarizer; and a second polarizer disposed under the display unit. A method for manufacturing a touch structure, comprising: providing a first polarizing plate to form a lower electrode on the first polarizing plate; providing a protective substrate to form an upper electrode on a lower surface of the protective substrate; and pasting the first a polarizing plate and the protective substrate, and the lower electrode and the upper electrode are alternately arranged. A method for manufacturing a touch structure, comprising: providing a first polarizing plate for winding a roll, forming a lower electrode on the first polarizing plate; providing a protective substrate on the roll to form an upper electrode under the protective substrate Surface; The first polarizing plate and the protective substrate are pasted such that the lower electrode and the upper electrode are alternately disposed. The method of manufacturing the touch structure of claim 6 or 7, wherein the method of forming the lower electrode comprises: sequentially forming a transparent conductive layer and a metal layer on the first polarizing plate; and patterning The transparent conductive layer and the metal layer form a plurality of lower sensing traces and a plurality of lower terminal lines having the metal layer on the transparent conductive layer; and removing the metal layer on the lower sensing traces. The method for manufacturing a touch structure according to claim 6 or 7, wherein the method of forming the lower electrode comprises: forming a transparent conductive layer on the first polarizing plate; patterning the transparent conductive layer to form The plurality of sensing traces and the plurality of lower terminal lines are printed; a metal layer is printed over the lower terminal lines. The method for manufacturing a touch structure according to claim 6 or 7, further comprising cutting the first polarizing plate and the protective substrate. The method of manufacturing the touch structure of claim 10, further comprising: providing a display unit, the display unit is disposed under the first polarizing plate; and providing a second polarizing plate, the second is disposed The polarizing plate is below the display unit.