WO2020107708A1 - 一种 oled 显示器 - Google Patents

一种 oled 显示器 Download PDF

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Publication number
WO2020107708A1
WO2020107708A1 PCT/CN2019/074322 CN2019074322W WO2020107708A1 WO 2020107708 A1 WO2020107708 A1 WO 2020107708A1 CN 2019074322 W CN2019074322 W CN 2019074322W WO 2020107708 A1 WO2020107708 A1 WO 2020107708A1
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WO
WIPO (PCT)
Prior art keywords
layer
substrate
connection end
oled display
encapsulation
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PCT/CN2019/074322
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English (en)
French (fr)
Inventor
唐岳军
李雪云
Original Assignee
武汉华星光电技术有限公司
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Application filed by 武汉华星光电技术有限公司 filed Critical 武汉华星光电技术有限公司
Priority to US16/348,153 priority Critical patent/US20200227676A1/en
Publication of WO2020107708A1 publication Critical patent/WO2020107708A1/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED

Definitions

  • the invention relates to the technical field of semiconductor display, in particular to an OLED display.
  • OLED Organic Light-Emitting Diode
  • OLED Organic Light-Emitting Diode
  • OLED displays Unlike Liquid Crystal Display (LCD) devices, OLED displays have self-luminous characteristics and do not use a separate light source, so they can be manufactured thinner and lighter than display devices that use a single light source, and are relatively easy to realize flexible and foldable The displayed characteristics.
  • LCD Liquid Crystal Display
  • An embodiment of the present invention provides an OLED display in which signal traces and bonding terminals are provided on the outer surface of the encapsulation layer, so that the OLED display has sufficient surface space, and low-resistance traces can be provided, while being provided on at least one side of the substrate
  • the bending extension area transmits the display signal nearby, which reduces the attenuation, delay and unevenness of the transmitted signal, and is conducive to the narrow border of the display.
  • the present application provides an OLED display
  • the OLED display includes:
  • the substrate including at least one substrate connection end;
  • an encapsulation layer covering the light-emitting layer at least one encapsulation connection end is provided on the encapsulation layer, and the encapsulation layer connection end is corresponding to the substrate connection end;
  • a signal trace and a binding terminal are provided on the surface of the packaging layer, and a bending extension area is provided on at least one side of the substrate, the bending extension area is bent to the surface of the packaging layer and the corresponding substrate connecting end and the packaging layer are bent
  • the connection ends are electrically connected, and the connection ends of the encapsulation layer and the substrate are connected to the binding terminals through the signal traces to transmit display signals;
  • the setting width of the bending extension area is greater than a preset width, and the connection end of the encapsulation layer is provided at the surface position of the encapsulation layer projected in the display area;
  • the binding terminal is disposed at an intermediate position outside the packaging layer.
  • the encapsulation layer is a cover plate encapsulation.
  • cover plate of the encapsulation layer and the substrate seal the light-emitting layer with encapsulant.
  • the encapsulation layer is a thin film encapsulation.
  • the binding terminal is set at a target position, and the target position is closer to the connection end of the packaging layer relative to the end of the packaging layer.
  • connection end of the encapsulation layer is provided at a position of the encapsulation layer frame corresponding to the connection end of the substrate.
  • the surface of the encapsulation layer further includes a protective layer.
  • the protective layer is a single-layer inorganic layer.
  • the present application provides an OLED display, the OLED display includes:
  • the substrate including at least one substrate connection end;
  • an encapsulation layer covering the light-emitting layer at least one encapsulation connection end is provided on the encapsulation layer, and the encapsulation layer connection end is corresponding to the substrate connection end;
  • a signal trace and a binding terminal are provided on the surface of the packaging layer, and a bending extension area is provided on at least one side of the substrate, the bending extension area is bent to the surface of the packaging layer and the corresponding substrate connecting end and the packaging layer are bent
  • the connection terminal is electrically connected, and the connection terminal of the packaging layer and the connection terminal of the substrate are connected to the binding terminal through the signal trace to transmit a display signal.
  • the encapsulation layer is a cover plate encapsulation.
  • cover plate of the encapsulation layer and the substrate seal the light-emitting layer with encapsulant.
  • the encapsulation layer is a thin film encapsulation.
  • a single-layer or multi-layer film encapsulation layer is formed on the surface of the light-emitting layer, and the bonding terminal is formed on the surface of the film encapsulation layer.
  • the binding terminal is set at a target position, and the target position is closer to the connection end of the packaging layer relative to the end of the packaging layer.
  • binding terminal is provided at an intermediate position outside the packaging layer.
  • connection end of the encapsulation layer is provided at a position of the encapsulation layer frame corresponding to the connection end of the substrate.
  • the setting width of the bending extension area is greater than a preset width, and the connection end of the encapsulation layer is provided at the surface position of the encapsulation layer projected in the display area.
  • the bending extension area includes a first bending extension area and a second bending extension area
  • the packaging layer connection end includes a first packaging layer connection end and a second packaging layer connection end
  • the substrate connection end Including a first substrate connection end and a second substrate connection end
  • the first bending extension area is bent to the surface of the packaging layer so that the first packaging layer connection end is electrically connected to the first substrate connection end
  • the second bending extension area is bent to the surface of the encapsulation layer so that the connection end of the second encapsulation layer is electrically connected to the connection end of the second substrate.
  • the surface of the encapsulation layer further includes a protective layer.
  • the protective layer is a single-layer inorganic layer.
  • an OLED display includes a substrate; a light-emitting layer formed on the substrate; and an encapsulation layer covering the light-emitting layer; signal traces and bonding terminals are provided on the surface of the encapsulation layer, and bent extensions are provided on at least one side of the substrate Area, the bending extension area is bent to the surface of the encapsulation layer and electrically connects the corresponding substrate connection end and the encapsulation layer connection end, and the encapsulation layer connection end and the substrate connection end are connected to the binding terminal through the signal trace for transmission Display signal.
  • the signal wiring and the bonding terminal are arranged on the outer surface of the encapsulation layer, so that the OLED display has sufficient surface space, and a low-resistance wiring can be provided, and at the same time, by providing a bending extension area on at least one side of the substrate Transmitting the display signal reduces the attenuation, delay and unevenness of the transmitted signal, and helps narrow the display frame.
  • FIG. 1 is a schematic diagram of the back structure of multiple embodiments of an OLED display provided by an embodiment of the present invention
  • FIG. 2 is a schematic diagram of the back structure of an embodiment of an OLED display provided by an embodiment of the present invention.
  • FIG. 3 is a schematic view of a state in which the bending extension area is unfolded in an embodiment of an OLED display when the encapsulation layer is a cover plate encapsulation;
  • FIG. 4 is a schematic diagram of the state structure of the bent extension area of the OLED display in the embodiment shown in FIG. 3;
  • FIG. 5 is a schematic diagram of a state in which the bending extension area is expanded in another embodiment of the OLED display when the encapsulation layer is a cover plate encapsulation;
  • FIG. 6 is a schematic diagram of the state structure of the bent extension area of the OLED display in the embodiment shown in FIG. 5;
  • FIG. 7 is a schematic view of a state in which the bending extension area is unfolded in an embodiment of an OLED display when the encapsulation layer is a thin-film encapsulation;
  • FIG. 8 is a schematic diagram of the state structure of the bent extension area of the OLED display in the embodiment shown in FIG. 7.
  • first and second are used for description purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated.
  • features defined as “first” and “second” may explicitly or implicitly include one or more of the features.
  • the meaning of “plurality” is two or more, unless otherwise specifically limited.
  • the OLED display is a display made using organic electroluminescent diodes. Due to the self-luminous organic electro-active photodiode, it does not require backlight, high contrast, thin thickness, wide viewing angle, fast response speed, can be used in flexible panels, wide temperature range, simple structure and manufacturing process, etc. , Is considered to be the next generation of flat panel display emerging application technology.
  • an embodiment of the present invention provides an OLED display including: a substrate; a light-emitting layer formed on the substrate; and an encapsulation layer covering the light-emitting layer; in the encapsulation layer Signal traces and binding terminals are provided on the surface, and a bending extension area is provided on at least one side of the substrate, the bending extension area is bent to the surface of the packaging layer and electrically connects the corresponding substrate connection end to the packaging layer connection end, The connection terminal of the encapsulation layer and the connection terminal of the substrate are connected to the binding terminal through the signal wiring to transmit the display signal.
  • FIGS. 1-8 it is a schematic structural diagram of an embodiment of an OLED display according to an embodiment of the present invention.
  • the OLED display includes:
  • the substrate 201 includes at least one substrate connection end
  • a signal trace 204 and a binding terminal 205 are provided on the surface of the packaging layer 203, and a bending extension region 206 is provided on at least one side of the substrate 201.
  • the bending extension region is bent to the surface of the packaging layer and connects the corresponding substrate
  • the terminal is electrically connected to the connection terminal of the encapsulation layer, and the connection terminal of the encapsulation layer and the substrate connection terminal are connected to the binding terminal through the signal wiring to transmit the display signal.
  • the number of the bending extension regions may be consistent with the connection end of the encapsulation layer and the connection end of the substrate, and the connection end of the encapsulation layer and the connection end of the substrate correspond to each substrate connection end
  • a corresponding connection end of the encapsulation layer is correspondingly provided, and is provided at a corresponding position of a bending extension area, so that the connection end of the encapsulation layer and the connection end of the substrate are electrically connected when the bending extension area is bent to the surface of the encapsulation layer.
  • the OLED display includes a substrate, a light-emitting layer formed on the substrate, and a packaging layer covering the light-emitting layer.
  • Signal traces and bonding terminals are provided on the surface of the packaging layer, and bent extensions are provided on at least one side of the substrate Area, the bending extension area is bent to the surface of the encapsulation layer and electrically connects the corresponding substrate connection end and the encapsulation layer connection end, and the encapsulation layer connection end and the substrate connection end are connected to the binding terminal through the signal trace for transmission Display signal.
  • the signal wiring and the bonding terminal are arranged on the outer surface of the encapsulation layer, so that the OLED display has sufficient surface space, and a low-resistance wiring can be arranged, and at the same time, the bending extension area is provided on at least one side of the substrate. Transmitting the display signal reduces the attenuation, delay and unevenness of the transmitted signal, and helps narrow the display frame.
  • a bending extension area 206 is provided on at least one side of the substrate 201.
  • FIG. 1 it is a schematic view of the back structure of a plurality of embodiments of an OLED display provided by an embodiment of the present invention.
  • the bending extension area 206 provided on at least one side of the substrate 201 may be, for example, the bending extension area 206 provided on the upper and lower ends of the substrate 201, the bending extension area 206 provided on the left and right ends, or the upper and lower ends
  • the bending extension area 206, and the bending extension area 206 are provided on the upper, lower, and left ends, and so on. It can be understood that, in the embodiment of the present invention, the bending extension area 206 may be provided on all four sides of the base. The examples are not specific.
  • bending extension regions 206 are provided on two or more sides of the base 201, one or two or even more binding terminals may be provided, as shown in FIG. 2, bending extension regions 206 are provided for the left and lower sides of the base 201, Two binding terminals 205 are provided. When there are two adjacent edges provided with a bending extension area 206, at least one side of the substrate 201 is shaped-cut or edged.
  • the bending extension region 206 includes a first bending extension region and a second bending extension region
  • the packaging layer connection end includes a first packaging layer connection end 2031 and a second encapsulation layer connection end 2032
  • the substrate connection end includes a first substrate connection end 2011 and a second substrate connection end 2012
  • the first bending extension area is bent to the surface of the encapsulation layer such that the first An encapsulation layer connection end 2031 is electrically connected to the first substrate connection end 2011, and the second bending extension area is bent to the surface of the encapsulation layer so that the second encapsulation layer connection end 2032 and the second Substrate connection end 2012 electrical connection
  • the packaging layer 203 has multiple packaging methods, for example, it may be a cover plate package or a film package.
  • the packaging layer 203 is a cover plate package
  • the cover plate of the packaging layer 203 and the substrate 201 can seal the light emitting layer with encapsulant.
  • FIG. 3 and FIG. 4 respectively, when the packaging layer 203 is a cover plate package, the state of the OLED display bending extension area 206 is unfolded and bent, and the outer surface of the packaging layer 203 is bound to the terminal 205 in FIG. 1. And the signal trace 204 and other parts of the configuration information.
  • the cover plate of the encapsulation layer 203 and the substrate 201 seal the light-emitting layer with encapsulant.
  • the outer surface of the encapsulation layer 203 is provided with signal traces 204 and binding terminals 205.
  • a bending extension area 206 is reserved.
  • the bending extension area 206 is provided with a substrate connection end, and the corresponding position of the encapsulation layer frame part is provided with an encapsulation layer connection end.
  • the bending extension area 206 of the substrate 201 is bent and its base connection end is connected to the corresponding The connection ends of the encapsulation layer are electrically connected.
  • encapsulating glue but not limited to, anisotropic conductive film (ACF), NCF glue, etc. may be used.
  • connection terminal on the surface of the encapsulation layer 203 is electrically connected to the binding terminal 205.
  • the signal trace 204 and the bonding terminal 205 are provided on the outer surface of the encapsulation layer, there is sufficient surface space, and a low-resistance trace can be provided, thereby reducing the attenuation, delay, and unevenness of the transmitted signal to enhance the OLED display Picture taste.
  • connection end of the packaging layer, the signal trace 204 on the packaging layer 203, and the bonding terminal 205 may be formed on the surface of the display packaging layer after the packaging process is completed. It may also be formed on the surface of the cover plate of the encapsulation layer 203 before the packaging process is started, which is not limited herein.
  • the schematic diagram of the state structure of the expanded and folded state of another bent OLED display embodiment (some structures in the figure are not shown, for example Binding terminal)
  • the bending extension area 206 of the substrate 201 is provided with a sufficient width (that is, the bending extension area 206 may have a larger preset width than the above embodiment)
  • the connection end of the packaging layer may be Set at the surface of the packaging layer 203 projected in the display area
  • the width of the bending extension area 206 is set to be greater than the preset width.
  • there is more space to bend the substrate which is more conducive to electrically connecting the connection terminal of the substrate and the connection terminal of the packaging layer.
  • the encapsulation layer 203 is a thin-film encapsulation, as shown in FIGS. 7 and 8, it is a schematic diagram of a state where the OLED display bending extension area 206 is unfolded and bent, and at this time, a single layer or multiple layers of material may be formed on the surface of the light emitting layer 202
  • the thin film encapsulation layer, the binding terminal 205 is formed on the surface of the thin film encapsulation layer.
  • the binding terminal 205 is set at a target position, and the target position is closer to the connection end of the packaging layer relative to the end of the packaging layer. It can be understood that, in some other embodiments of the present invention, other methods may also be used, for example, the binding terminal 205 may be disposed at an intermediate position outside the packaging layer 203. Further, the connection end of the encapsulation layer is provided at the position of the border of the encapsulation layer 203 corresponding to the connection end of the substrate.
  • the bending extension region 206 of the substrate 201 may further include each driving circuit (such as an ESD circuit and/or a gate driving circuit, etc.), wherein each driving circuit may also be partially/or entirely located on the surface of the packaging layer, which is beneficial to reduce The frame width of the small display, for example, each driving circuit is located between the connection end of the packaging layer and the bonding terminal.
  • each driving circuit such as an ESD circuit and/or a gate driving circuit, etc.
  • each driving circuit may also be partially/or entirely located on the surface of the packaging layer, which is beneficial to reduce The frame width of the small display, for example, each driving circuit is located between the connection end of the packaging layer and the bonding terminal.
  • a protective layer may be further included outside the encapsulation layer connection terminals, signal traces, and bonding terminals on the surface of the encapsulation layer 203, which may be a single-layer inorganic layer , Such as SiNx, SiOx, etc., can also be a single-layer organic layer, such as polyimide (PI), polycarbonate (PC), polyethersulfone (PES), polyethylene terephthalate (PET ) And other materials, or a multilayer stack structure of an inorganic layer and an organic layer.
  • the protective layer may cover structures such as signal traces, exposing the connection end of the encapsulation layer and the bonding terminal 205.
  • the substrate material is preferably a flexible material, such as polyimide (PI), polycarbonate (PC), polyethersulfone (PES), Polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyarylate (PAR) Or glass fiber reinforced plastic (FRP) and other polymer materials.
  • PI polyimide
  • PC polycarbonate
  • PES polyethersulfone
  • PET Polyethylene terephthalate
  • PEN polyethylene naphthalate
  • PAR polyarylate
  • FRP glass fiber reinforced plastic
  • the substrate may be a double layer structure of a first substrate/a second substrate
  • the first substrate may be a material such as glass or transparent metal
  • the second substrate may be a flexible material
  • the second substrate is disposed on the first substrate
  • the light-emitting layer is formed on the second substrate, and a bending extension area is formed on the second substrate, such as the first bending extension area and the second bending extension area described above.

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  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

本发明实施例公开了一种OLED显示器。该OLED显示器包括基底、发光层以及封装层；在封装层表面设置信号走线和绑定端子，在基底至少一边上设置弯折延伸区域。本发明实施例中将信号走线和绑定端子设置在封装层外部表面，使得OLED显示器具有的足够的表面空间，减小了传输信号的衰减、延迟和不均，并有利于显示器窄边框化。

Description

一种OLED显示器 技术领域
本发明涉及半导体显示技术领域，具体涉及一种OLED显示器。
 背景技术
有机发光二极管(Organic Light-Emitting Diode，OLED)显示装置 由于具有薄、轻、宽视角、主动发光、发光颜色连续可调、成本低、响应速度快、能耗小、工作温度范围宽、生产工艺简单、发光效率高及可柔性显示等优点，已经成为平板显示领域中一种非常重要的显示技术。
与液晶显示器（Liquid Crystal Display ，LCD）设备不同，OLED显示器具有自发光特性，并且不采用单独的光源,因此可以被制造的比采用单独光源的显示设备薄和轻，相对容易实现柔性、可折叠显示的特性。
 技术问题
然而在大型OLED显示器中，显示信号从绑定端传输至显示器各部位时，由于显示面积较大，存在传输信号的衰减/延迟/不均等导致的画面品味下降。
 技术解决方案
本发明实施例提供一种OLED显示器，将信号走线和绑定端子设置在封装层外部表面，使得OLED显示器具有的足够的表面空间，可以设置低电阻走线，同时通过在基底至少一边上设置弯折延伸区域就近传输显示信号，减小了传输信号的衰减、延迟和不均，并有利于显示器窄边框化。
为解决上述问题，第一方面，本申请提供一种OLED显示器，所述OLED显示器包括：
基底，包括至少一个基底连接端；
形成在所述基底上的发光层；
以及覆盖于所述发光层上的封装层，所述封装层上设置至少一个封装连接端，所述封装层连接端与所述基底连接端对应设置；
在所述封装层表面设置信号走线和绑定端子，在所述基底至少一边上设置弯折延伸区域，所述弯折延伸区域弯折至封装层表面并使对应的基底连接端与封装层连接端电性连接，所述封装层连接端和所述基底连接端通过所述信号走线与所述绑定端子连接以传输显示信号；
所述弯折延伸区域设置宽度大于预设宽度，所述封装层连接端设置在显示区域投影的所述封装层表面位置；
所述绑定端子设置于所述封装层外部中间位置。
进一步的，所述封装层为盖板封装。
进一步的，所述封装层的盖板与所述基底通过封装胶将发光层密封。
进一步的，所述封装层为薄膜封装。
进一步的，所述绑定端子设置于目标位置，所述目标位置相对于所述封装层端部更接近所述封装层连接端。
进一步的，所述封装层连接端设置在所述基底连接端对应的封装层边框位置。
进一步的，所述封装层表面还包括保护层。
进一步的，所述保护层为单层的无机层。
第二方面，本申请提供一种OLED显示器，所述OLED显示器包括：
基底，包括至少一个基底连接端；
形成在所述基底上的发光层；
以及覆盖于所述发光层上的封装层，所述封装层上设置至少一个封装连接端，所述封装层连接端与所述基底连接端对应设置；
在所述封装层表面设置信号走线和绑定端子，在所述基底至少一边上设置弯折延伸区域，所述弯折延伸区域弯折至封装层表面并使对应的基底连接端与封装层连接端电性连接，所述封装层连接端和所述基底连接端通过所述信号走线与所述绑定端子连接以传输显示信号。
进一步的，所述封装层为盖板封装。
进一步的，所述封装层的盖板与所述基底通过封装胶将发光层密封。
进一步的，所述封装层为薄膜封装。
进一步的，所述发光层表面形成单层或者多层材料的薄膜封装层，所述绑定端子形成于所述薄膜封装层表面。
进一步的，所述绑定端子设置于目标位置，所述目标位置相对于所述封装层端部更接近所述封装层连接端。
进一步的，所述绑定端子设置于所述封装层外部中间位置。
进一步的，所述封装层连接端设置在所述基底连接端对应的封装层边框位置。
进一步的，所述弯折延伸区域设置宽度大于预设宽度，所述封装层连接端设置在显示区域投影的所述封装层表面位置。
进一步的，所述弯折延伸区域包括第一弯折延伸区域和第二弯折延伸区域，所述封装层连接端包括第一封装层连接端和第二封装层连接端，所述基底连接端包括第一基底连接端和第二基底连接端，所述第一弯折延伸区域弯折至所述封装层表面使得所述第一封装层连接端与所述第一基底连接端电性连接，所述第二弯折延伸区域弯折至所述封装层表面使得所述第二封装层连接端与所述第二基底连接端电性连接。
进一步的，所述封装层表面还包括保护层。
进一步的，所述保护层为单层的无机层。
 有益效果
本发明实施例中OLED显示器包括基底；形成在基底上的发光层；以及覆盖于发光层上的封装层；在封装层表面设置信号走线和绑定端子，在基底至少一边上设置弯折延伸区域，该弯折延伸区域弯折至封装层表面并使对应的基底连接端与封装层连接端电性连接，封装层连接端和基底连接端通过所述信号走线与绑定端子连接以传输显示信号。本发明实施例中将信号走线和绑定端子设置在封装层外部表面，使得OLED显示器具有的足够的表面空间，可以设置低电阻走线，同时通过在基底至少一边上设置弯折延伸区域就近传输显示信号，减小了传输信号的衰减、延迟和不均，并有利于显示器窄边框化。
 附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本发明实施例提供OLED显示器的多个实施例的背面结构示意图；
图2是本发明实施例提供OLED显示器的一个实施例的背面结构示意图；
图3是当封装层为盖板封装时，一个OLED显示器实施例中弯折延伸区域展开的状态结构示意图；
图4是图3所示实施例中OLED显示器弯折延伸区域弯折的状态结构示意图；
图5是当封装层为盖板封装时，另一个OLED显示器实施例中弯折延伸区域展开的状态结构示意图；
图6是图5所示实施例中OLED显示器弯折延伸区域弯折的状态结构示意图；
图7是当封装层为薄膜封装时，一个OLED显示器实施例中弯折延伸区域展开的状态结构示意图；
图8是图7所示实施例中OLED显示器弯折延伸区域弯折的状态结构示意图。
 本发明的实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
在本发明的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本发明的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
OLED显示器是利用有机电自发光二极管制成的显示器。由于同时具备自发光有机电激发光二极管，不需背光源、对比度高、厚度薄、视角广、反应速度快、可用于挠曲性面板、使用温度范围广、构造及制程较简单等优异之特性，被认为是下一代的平面显示器新兴应用技术。
目前在大型OLED显示器中，显示信号从绑定端传输至显示器各部位时，由于显示面积较大，存在传输信号的衰减/延迟/不均等导致的画面品味下降。
基于此，本发明实施例中提供过一种OLED显示器，所述OLED显示器包括：基底；形成在所述基底上的发光层；以及覆盖于所述发光层上的封装层；在所述封装层表面设置信号走线和绑定端子，在所述基底至少一边上设置弯折延伸区域，该弯折延伸区域弯折至封装层表面并使对应的基底连接端与封装层连接端电性连接，封装层连接端和基底连接端通过所述信号走线与绑定端子连接以传输显示信号。
如图1~图8所示，为本发明实施例中OLED显示器的一个实施例的结构示意图，该OLED显示器包括：
基底201，包括至少一个基底连接端；
形成在所述基底201上的发光层202；
以及覆盖于所述发光层202上的封装层203，所述封装层上设置至少一个封装连接端，所述封装层连接端与所述基底连接端对应设置；
在所述封装层203表面设置信号走线204和绑定端子205，在所述基底201至少一边上设置弯折延伸区域206，该弯折延伸区域弯折至封装层表面并使对应的基底连接端与封装层连接端电性连接，封装层连接端和基底连接端通过所述信号走线与绑定端子连接以传输显示信号。
其中，所述弯折延伸区域的个数可以与所述封装层连接端与所述基底连接端一致，所述封装层连接端与所述基底连接端对应设置指的是，每个基底连接端对应设置一个对应的封装层连接端，且设置在一个弯折延伸区域的对应位置，以使得弯折延伸区域弯折至所述封装层表面时封装层连接端与基底连接端电性连接。
本发明实施例中OLED显示器包括基底，形成在基底上的发光层，以及覆盖于发光层上的封装层，在封装层表面设置信号走线和绑定端子，在基底至少一边上设置弯折延伸区域，该弯折延伸区域弯折至封装层表面并使对应的基底连接端与封装层连接端电性连接，封装层连接端和基底连接端通过所述信号走线与绑定端子连接以传输显示信号。本发明实施例中将信号走线和绑定端子设置在封装层外部表面，使得OLED显示器具有的足够的表面空间，可以设置低电阻走线，同时通过在基底至少一边上设置弯折延伸区域就近传输显示信号，减小了传输信号的衰减、延迟和不均，并有利于显示器窄边框化。
本发明实施例中，在所述基底201至少一边上设置弯折延伸区域206，如图1所示，为本发明实施例提供OLED显示器的多个实施例的背面结构示意图，图1中分别示出了基底中一边（图1中左上角图）、两边（图1中右上角和左下角图）和三边（图1中右下角图）设置弯折延伸区域206的情况，具体的，在所述基底201至少一边上设置弯折延伸区域206可以是例如在基底201上边、下边两端设置弯折延伸区域206，左边、右边两端设置弯折延伸区域206，或者上边、左边两端设置弯折延伸区域206，以及上边、下边和左边三端设置弯折延伸区域206等，依次类推，可以理解的是，本发明实施例中还可以是基底四条边均设置弯折延伸区域206，此处不具体一一举例说明。
当基底201两条或者以上的边设置弯折延伸区域206时，绑定端子可以为一个或者两个，甚至多个，如图2所示，为基底201左边和下边设置弯折延伸区域206，绑定端子205设置为2个。当具有两相邻边缘设置有弯折延伸区域206时，所述基底201至少一条边进行了异形切割或者进行了磨边处理。
如图3~图8所示，本发明实施例中，所述弯折延伸区域206包括第一弯折延伸区域和第二弯折延伸区域，所述封装层连接端包括第一封装层连接端2031和第二封装层连接端2032，所述基底连接端包括第一基底连接端2011和第二基底连接端2012，所述第一弯折延伸区域弯折至所述封装层表面使得所述第一封装层连接端2031与所述第一基底连接端2011电性连接，所述第二弯折延伸区域弯折至所述封装层表面使得所述第二封装层连接端2032与所述第二基底连接端2012电性连接
本发明实施例中，封装层203有多种封装方式，例如可以为盖板封装，也可以是薄膜封装，当封装层203为盖板封装时，所述封装层203的盖板与所述基底201可以通过封装胶将发光层密封。如图3、图4所示，分别为当封装层203为盖板封装时， OLED显示器弯折延伸区域206展开和弯折的状态示意图，图1中示意了封装层203外表面绑定端子205和信号走线204等结构的部分设置信息。其中，封装层203的盖板与基底201通过封装胶将发光层密封，在封装层203外表面设置有信号走线204和绑定端子205，在基底201切割时预留弯折延伸区域206，弯折延伸区域206设置有基底连接端，对应位置封装层边框部位设置有封装层连接端，当完成封装工艺后，将基底201的弯折延伸区域206弯折并将其基底连接端与对应的封装层连接端电性连接。具体的，盖板与所述基底201通过封装胶连接时，可以采用但不限于与异方性导电胶膜(Anisotropic Conductive Film，ACF)、NCF胶材等。封装层203表面的连接端与绑定端子205电性连接。此时，由于信号走线204和绑定端子205设置在封装层外部表面，具有足够的表面空间，可以设置低电阻走线，从而减小传输信号的衰减、延迟和不均等，以提升OLED显示器画面品味。
另外，本发明实施例中，封装层连接端、封装层203上的信号走线204和绑定端子205可以在封装工艺完成后在显示器封装层表面形成。也可以在封装工艺开始前，在封装层203的盖板表面先形成，此处不作限定。
如图5、图6所示，分别为当封装层203为盖板封装时，另一个OLED显示器实施例中弯折延伸区域展开和弯折的状态结构示意图（图中部分结构未示出，例如绑定端子），当基底201的弯折延伸区域206设置有足够宽度时（即所述弯折延伸区域206设置相比上述实施例可以具有更大的预设宽度），即封装层连接端可以设置在显示区域投影的封装层203表面位置，该弯折延伸区域206设置宽度大于预设宽度，此时有更大空间弯折基底，更利于将基底连接端与封装层连接端电性相连。
当封装层203为薄膜封装时，如图7、图8所示，分别为OLED显示器弯折延伸区域206展开和弯折的状态示意图，此时，发光层202表面可以形成单层或者多层材料的薄膜封装层，该绑定端子205形成于所述薄膜封装层表面。
在本发明一些实施例中，该绑定端子205设置于目标位置，所述目标位置相对于所述封装层端部更接近所述封装层连接端。可以理解的是，在本发明另一些实施例中，还可以是其他方式，例如，所述绑定端子205可以设置于所述封装层203外部中间位置。进一步的，所述封装层连接端设置在所述基底连接端对应的封装层203边框位置。
作为优选，基底201的弯折延伸区域206还可以包含各驱动电路（例如ESD电路和/或栅极驱动电路等），其中各驱动电路还可以部分的/或者全部位于封装层表面，有利于减小显示器的边框宽度，例如各驱动电路位于封装层连接端与绑定端子之间。
相比上述实施例，在本发明一些实施例中，在封装层203表面的封装层连接端、信号走线、绑定端子外部还可以进一步包含保护层，该保护层可以为单层的无机层，例如SiNx、SiOx等，也可以为单层的有机层，例如聚酰亚胺(PI)、聚碳酸酯(PC)、聚醚砜(PES)、聚对苯二甲酸乙二醇酯 (PET)等材料，或者为无机层与有机层的多层堆叠结构。进一步的，该保护层可以覆盖信号走线等结构，外露出封装层连接端和绑定端子205。
需要说明的是，为了便于基底201上的弯折延伸区域206的弯折，基底材料优选为柔性材料，例如聚酰亚胺(PI)、聚碳酸酯(PC)、聚醚砜(PES)、聚对苯二甲酸乙二醇酯 (PET)、聚萘二甲酸乙二醇酯(PEN)、多芳基化合物(PAR) 或玻璃纤维增强塑料(FRP) 等聚合物材料形成。在一些实施例中，基底可以为第一基底/第二基底的双层结构，第一基底可以为玻璃或透明金属等材料，第二基底可以为柔性材料，第二基底设置在第一基底上，发光层形成在第二基底上，第二基底上形成弯折延伸区域，例如上述的第一弯折延伸区域和第二弯折延伸区域。
在上述实施例中，对各个实施例的描述都各有侧重，某个实施例中没有详述的部分，可以参见上文针对OLED显示器的详细描述，此处不再赘述。
以上各个操作的具体实施可参见前面的实施例，在此不再赘述。
以上对本发明实施例所提供的一种OLED显示器进行了详细介绍，本文中应用了具体个例对本发明的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本发明的方法及其核心思想；同时，对于本领域的技术人员，依据本发明的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本发明的限制。

Claims (20)

  1. 一种OLED显示器，其中，所述OLED显示器包括：
    基底，包括至少一个基底连接端；
    形成在所述基底上的发光层；
    以及覆盖于所述发光层上的封装层，所述封装层上设置至少一个封装连接端，所述封装层连接端与所述基底连接端对应设置；
    在所述封装层表面设置信号走线和绑定端子，在所述基底至少一边上设置弯折延伸区域，所述弯折延伸区域弯折至封装层表面并使对应的基底连接端与封装层连接端电性连接，所述封装层连接端和所述基底连接端通过所述信号走线与所述绑定端子连接以传输显示信号；
    所述弯折延伸区域设置宽度大于预设宽度，所述封装层连接端设置在显示区域投影的所述封装层表面位置；
    所述绑定端子设置于所述封装层外部中间位置。
  2. 根据权利要求1所述的OLED显示器，其中，所述封装层为盖板封装。
  3. 根据权利要求2所述的OLED显示器，其中，所述封装层的盖板与所述基底通过封装胶将发光层密封。
  4. 根据权利要求3所述的OLED显示器，其中，所述封装层为薄膜封装。
  5. 根据权利要求1所述的OLED显示器，其中，所述绑定端子设置于目标位置，所述目标位置相对于所述封装层端部更接近所述封装层连接端。
  6. 根据权利要求1所述的OLED显示器，其中，所述封装层连接端设置在所述基底连接端对应的封装层边框位置。
  7. 根据权利要求1所述的OLED显示器，其中，所述封装层表面还包括保护层。
  8. 根据权利要求6所述的OLED显示器，其中，所述保护层为单层的无机层。
  9. 一种OLED显示器，其中，所述OLED显示器包括：
    基底，包括至少一个基底连接端；
    形成在所述基底上的发光层；
    以及覆盖于所述发光层上的封装层，所述封装层上设置至少一个封装连接端，所述封装层连接端与所述基底连接端对应设置；
    在所述封装层表面设置信号走线和绑定端子，在所述基底至少一边上设置弯折延伸区域，所述弯折延伸区域弯折至封装层表面并使对应的基底连接端与封装层连接端电性连接，所述封装层连接端和所述基底连接端通过所述信号走线与所述绑定端子连接以传输显示信号。
  10. 根据权利要求9所述的OLED显示器，其中，所述封装层为盖板封装。
  11. 根据权利要求10所述的OLED显示器，其中，所述封装层的盖板与所述基底通过封装胶将发光层密封。
  12. 根据权利要求11所述的OLED显示器，其中，所述封装层为薄膜封装。
  13. 根据权利要求12所述的OLED显示器，其中，所述发光层表面形成单层或者多层材料的薄膜封装层，所述绑定端子形成于所述薄膜封装层表面。
  14. 根据权利要求9所述的OLED显示器，其中，所述绑定端子设置于目标位置，所述目标位置相对于所述封装层端部更接近所述封装层连接端。
  15. 根据权利要求9所述的OLED显示器，其中，所述绑定端子设置于所述封装层外部中间位置。
  16. 根据权利要求9所述的OLED显示器，其中，所述封装层连接端设置在所述基底连接端对应的封装层边框位置。
  17. 根据权利要求9所述的OLED显示器，其中，所述弯折延伸区域设置宽度大于预设宽度，所述封装层连接端设置在显示区域投影的所述封装层表面位置。
  18. 根据权利要求9所述的OLED显示器，其中，所述弯折延伸区域包括第一弯折延伸区域和第二弯折延伸区域，所述封装层连接端包括第一封装层连接端和第二封装层连接端，所述基底连接端包括第一基底连接端和第二基底连接端，所述第一弯折延伸区域弯折至所述封装层表面使得所述第一封装层连接端与所述第一基底连接端电性连接，所述第二弯折延伸区域弯折至所述封装层表面使得所述第二封装层连接端与所述第二基底连接端电性连接。
  19. 根据权利要求9所述的OLED显示器，其中，所述封装层表面还包括保护层。
  20. 根据权利要求19所述的OLED显示器，其中，所述保护层为单层的无机层。
PCT/CN2019/074322 2018-11-30 2019-02-01 一种 oled 显示器 WO2020107708A1 (zh)

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CN105938685A (zh) * 2015-03-06 2016-09-14 三星显示有限公司 显示设备
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JP2018081151A (ja) * 2016-11-14 2018-05-24 日本精機株式会社 Ｃｏｇ型パネル及び有機ｅｌパネル
CN108257508A (zh) * 2016-12-28 2018-07-06 乐金显示有限公司 柔性显示装置及其制造方法

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US20180033840A1 (en) * 2016-08-01 2018-02-01 Japan Display Inc. Display device and method of manufacturing the same
JP2018081151A (ja) * 2016-11-14 2018-05-24 日本精機株式会社 Ｃｏｇ型パネル及び有機ｅｌパネル
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