WO2019031555A1 - Film de connexion, procédé de production pour carte de circuit imprimé blindée, et carte de circuit imprimé blindée - Google Patents

Film de connexion, procédé de production pour carte de circuit imprimé blindée, et carte de circuit imprimé blindée Download PDF

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Publication number
WO2019031555A1
WO2019031555A1 PCT/JP2018/029803 JP2018029803W WO2019031555A1 WO 2019031555 A1 WO2019031555 A1 WO 2019031555A1 JP 2018029803 W JP2018029803 W JP 2018029803W WO 2019031555 A1 WO2019031555 A1 WO 2019031555A1
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WO
WIPO (PCT)
Prior art keywords
film
shield
connection
wiring board
printed wiring
Prior art date
Application number
PCT/JP2018/029803
Other languages
English (en)
Japanese (ja)
Inventor
裕介 春名
志朗 山内
晃司 高見
浩輔 角
Original Assignee
タツタ電線株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by タツタ電線株式会社 filed Critical タツタ電線株式会社
Priority to CN201880051684.4A priority Critical patent/CN110959316B/zh
Priority to KR1020207006593A priority patent/KR102422104B1/ko
Priority to JP2019535704A priority patent/JP6946437B2/ja
Publication of WO2019031555A1 publication Critical patent/WO2019031555A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure

Definitions

  • the present invention relates to a connection film, a method of manufacturing a shield printed wiring board, and a shield printed wiring board.
  • an electromagnetic wave shielding film is attached to a printed wiring board such as a flexible printed wiring board (FPC) to shield electromagnetic waves from the outside.
  • a printed wiring board such as a flexible printed wiring board (FPC)
  • FIG. 16 is a cross-sectional view schematically showing an example of a conventional shield printed wiring board. That is, as shown in FIG. 16, a base film 551 comprising a base film 551, a printed circuit 552 including a ground circuit 552a disposed on the base film 551, and a cover film 553 covering the printed circuit 552; A shield printed wiring board 501 comprising: an adhesive layer 561 including 530; a shield layer 562 laminated to the adhesive layer 561; and a shield film 560 comprising an insulation protection layer 563 laminated to the shield layer 562 A shield print in which a shield film 560 is attached to a base film 550 so that an opening is formed in the cover lay 553 immediately above the ground circuit 552a and the adhesive layer 561 is connected to the ground circuit 552a through the opening.
  • Wiring board 501 has been proposed. Document 1 and Patent Document 2).
  • the adhesive layer of the shield film contains a conductive filler
  • the relative dielectric constant of the entire adhesive layer is high. Therefore, when the adhesive layer containing such a conductive filler is disposed in the vicinity of the printed circuit, there arises a problem that the transmission loss of the signal transmitted through the printed circuit is increased. In particular, since the electric signal transmitted to the printed circuit has been increased in frequency in recent years with the improvement of the signal transmission rate, such a problem has become remarkable.
  • Patent Document 3 the conductive filler is contained only in the portion of the adhesive layer of the shield film, which is disposed at the opening of the cover lay located immediately above the ground circuit.
  • Printed wiring boards have been proposed.
  • JP 2000-269632 A JP, 2010-177472, A JP, 2013-26322, A
  • the present invention has been made to solve the above problems, and an object of the present invention is to manufacture a shielded printed wiring board only between the ground circuit of the base film and the shield layer of the shield film. It is to provide a connection film for arranging a conductive filler, a method of manufacturing a shield printed wiring board using the connection film, and a shield printed wiring board using the connection film.
  • the connecting film of the present invention comprises a base film, a printed circuit including a ground circuit disposed on the base film, and a base film comprising a cover lay covering the printed circuit, an insulating adhesive layer, the insulating film Shield print comprising: a shield layer laminated on the conductive adhesive layer; and a shield film consisting of the insulating protective layer laminated on the shield layer, wherein the insulating adhesive layer is adhered to the coverlay
  • the connection film for electrically connecting the ground circuit and the shield layer wherein the connection film is made of a resin composition and a conductive filler, and the connection film is A flat portion and a convex portion formed by the conductive filler, wherein the diameter of the conductive filler is larger than the thickness of the flat portion It is characterized in.
  • connection film of the present invention is used when bonding a shield film to a base film to produce a shield printed wiring board.
  • the connection film of the present invention is disposed above the ground circuit of the base film.
  • the shield film is disposed such that the insulating adhesive layer of the shield film adheres to the cover lay of the base film and the connecting film, and a base film-shield film laminate is produced.
  • the base film-shield film laminate is pressed so that the conductive filler of the connection film contacts the ground circuit of the base film and the shield layer of the shield film.
  • the conductive filler can be easily disposed only between the ground circuit of the base film and the shield layer of the shield film.
  • connection film can be disposed at an arbitrary position above the ground circuit. Therefore, the freedom of design of the shield printed wiring board and the freedom of design of a product using the shield printed wiring board are not easily lost.
  • the diameter of the conductive filler is larger than the thickness of the flat portion. Therefore, the conductive filler is not buried in the resin composition.
  • the conductive filler does not easily come in contact with the ground circuit of the base film and the shield layer of the shield film when the shield printed wiring board is manufactured. Therefore, the ground circuit and the shield layer are easily electrically disconnected.
  • the conductive filler is not buried in the resin composition. Therefore, in the shield printed wiring board using the connection film of the present invention, the ground circuit and the shield layer are hardly cut electrically.
  • connection film of the present invention it is desirable that the height of the convex portion is larger than the thickness of the insulating adhesive layer of the shield film in the printed wiring board on which the connection film is to be disposed. . If the height of the convex part of the connection film is larger than the thickness of the insulating adhesive layer of the printed wiring board on which the connection film is to be disposed, the base film, the connection film and the shield film are sequentially disposed. When pressed, the conductive filler easily penetrates the insulating adhesive layer. Therefore, the conductive filler and the shield layer can be sufficiently electrically connected.
  • the thickness of the flat portion is preferably 1 to 100 ⁇ m. If the thickness of the flat portion is less than 1 ⁇ m, the strength of the connecting film is weakened and it is easily broken. When the thickness of the flat portion exceeds 100 ⁇ m, the connection film is too thick, and therefore, when the shield printed wiring board is manufactured, it is difficult to cause the base film and the shield film to adhere to each other.
  • the diameter of the conductive filler is desirably 2 to 200 ⁇ m.
  • the diameter of the conductive filler is less than 2 ⁇ m, the contact between the conductive filler and the ground circuit and / or the contact between the conductive filler and the shield layer tends to be separated. Therefore, the electrical contact between the ground circuit and the shield layer is likely to be broken.
  • the diameter of the conductive filler exceeds 200 ⁇ m, the conductive filler is too large, and when the shield printed wiring board is manufactured, it becomes difficult to bring the base film and the shield film into close contact with each other.
  • the conductive filler is at least one selected from the group consisting of copper powder, silver powder, nickel powder, silver coated copper powder, gold coated copper powder, silver coated nickel powder and gold coated nickel powder. It is desirable to consist of seeds. Since these conductive fillers have good conductivity, they are suitable for electrically connecting the ground circuit and the shield layer.
  • the resin composition is desirably made of at least one selected from the group consisting of a thermosetting resin and a thermoplastic resin.
  • a thermosetting resin and a thermoplastic resin can be used as a resin composition.
  • a method of manufacturing a shielded printed wiring board according to the present invention comprises a base film, a printed circuit including a ground circuit disposed on the base film, and a base film comprising a cover lay covering the printed circuit, and an insulating adhesive It is a method of manufacturing a printed wiring board provided with a shield film consisting of a layer, a shield layer laminated on the above-mentioned insulating adhesive layer, and an insulation protection layer laminated on the above-mentioned shield layer,
  • the connection film disposing step of preparing the connection film of the present invention above the ground circuit of the substrate film, and the shield film are prepared, and the insulating adhesive layer of the shield film is the substrate
  • a shield film is disposed so as to adhere to the film cover lay and the connection film, and a substrate fill
  • a shielding film is manufactured using the connection film of the present invention. Therefore, the conductive filler can be easily disposed only between the ground circuit of the base film and the shield layer of the shield film. As a result, in the manufactured shield printed wiring board, it is possible to prevent the deterioration of the transmission characteristics.
  • connection film disposing step the connection film is disposed so as to expose the ground circuit of the base film and bring the convex portion of the connection film into contact with the ground circuit. You may By arranging the connection film in this manner, the conductive filler and the ground circuit can be reliably brought into contact with each other.
  • the conductive filler of the connection film penetrates the insulating adhesive layer of the shield film and contacts the shield layer of the shield film.
  • the base film-shield film laminate may be pressed.
  • the shielded printed wiring board of the present invention comprises: a base film, a printed circuit including a ground circuit disposed on the base film, a base film comprising a cover lay covering the printed circuit, an insulating adhesive layer, A shield comprising: a shield layer laminated on an insulating adhesive layer; and a shield film consisting of an insulating protective layer laminated on the shield layer, wherein the insulating adhesive layer is adhered to the coverlay
  • the connection film of the present invention is further disposed between the ground circuit and the shield layer, and the conductive filler of the connection film is the ground circuit and the above. It is characterized in that the ground circuit and the shield layer are electrically connected by being in contact with the shield layer.
  • connection film of the present invention is used in the shielded printed wiring board of the present invention. Therefore, at the time of manufacture of a shield printed wiring board, a grand circuit and a shield layer can be electrically connected easily.
  • connection film is preferably disposed only between the ground circuit and the shield layer.
  • the connection film is disposed only between the ground circuit and the shield layer, the transmission characteristics can be prevented from being degraded.
  • the conductive filler can be easily disposed only between the ground circuit of the base film and the shield layer of the shield film. Therefore, in the shield printed wiring board manufactured, it can prevent that a transmission characteristic falls.
  • the connection film of the present invention can be disposed at any position above the ground circuit, so shield printing can be performed. The degree of freedom in the design of the wiring board and the degree of freedom in the design of a product using the shielded printed wiring board are not easily lost.
  • FIG. 1 is sectional drawing which shows typically an example of the film for connection which concerns on 1st embodiment of this invention.
  • FIG. 2 is a figure which shows typically the film arrangement process for connection of the process of manufacturing a shield printed wiring board using the film for connection of this invention.
  • FIGS. 3 (a) and 3 (b) are diagrams schematically showing a base film-shield film laminate manufacturing step in the step of manufacturing a shield printed wiring board using the connection film of the present invention.
  • Fig.4 (a) and (b) are figures which show typically the press process of the process of manufacturing a shield printed wiring board using the film for a connection of this invention.
  • FIG. 1 is sectional drawing which shows typically an example of the film for connection which concerns on 1st embodiment of this invention.
  • FIG. 2 is a figure which shows typically the film arrangement process for connection of the process of manufacturing a shield printed wiring board using the film for connection of this invention.
  • FIGS. 3 (a) and 3 (b) are diagrams schematically showing a base film-
  • FIG. 5 is a figure which shows typically the film arrangement process for connection of the process of manufacturing a shield printed wiring board using the film for connection of this invention.
  • 6 (a) and 6 (b) are diagrams schematically showing a base film-shield film laminate manufacturing step in the step of manufacturing a shield printed wiring board using the connection film of the present invention.
  • FIGS. 7 (a) and 7 (b) are diagrams schematically showing a pressing step of the step of producing a shielded printed wiring board using the connection film of the present invention.
  • FIG. 8 is a cross-sectional view schematically showing one example of the connection film according to the second embodiment of the present invention.
  • FIG. 9 is a figure which shows typically the film arrangement process for connection of the process of manufacturing a shield printed wiring board using the film for connection of this invention.
  • FIGS. 10 (a) and 10 (b) are diagrams schematically showing a base film-shield film laminate manufacturing step in the step of manufacturing a shield printed wiring board using the connection film of the present invention.
  • Fig.11 (a) and (b) are figures which show typically the press process of the process of manufacturing a shield printed wiring board using the film for a connection of this invention.
  • FIG. 12 is a cross-sectional view schematically showing one example of the connection film according to the third embodiment of the present invention.
  • FIG. 13 is a figure which shows typically the film arrangement process for a connection of the process of manufacturing a shield printed wiring board using the film for a connection of this invention.
  • FIGS. 14 (a) and 14 (b) are diagrams schematically showing a base film-shield film laminate manufacturing step of the step of manufacturing a shield printed wiring board using the connection film of the present invention.
  • FIGS. 15 (a) to 15 (c) are diagrams schematically showing a pressing step of the step of producing a shielded printed wiring board using the connection film of the present invention.
  • FIG. 16 is a cross-sectional view schematically showing an example of a conventional shield printed wiring board.
  • connection film of the present invention will be specifically described.
  • the present invention is not limited to the following embodiments, and can be appropriately modified and applied without departing from the scope of the present invention.
  • the connecting film of the present invention comprises a base film, a printed circuit including a ground circuit disposed on the base film, and a base film comprising a cover lay covering the printed circuit, an insulating adhesive layer, the insulating film Shield print comprising: a shield layer laminated on the conductive adhesive layer; and a shield film consisting of the insulating protective layer laminated on the shield layer, wherein the insulating adhesive layer is adhered to the coverlay
  • the connection film for electrically connecting the ground circuit and the shield layer wherein the connection film is made of a resin composition and a conductive filler, and the connection film is A flat portion and a convex portion formed by the conductive filler, wherein the diameter of the conductive filler is larger than the thickness of the flat portion It is characterized in.
  • FIG. 1 is sectional drawing which shows typically an example of the film for connection which concerns on 1st embodiment of this invention.
  • a connection film 10 which is an example of the connection film of the present invention comprises a resin composition 20 and a conductive filler 30. Further, the connection film 10 has the flat portion 11 and the convex portion 12 formed of the conductive filler 30, and the diameter D 1 of the conductive filler 30 is larger than the thickness T 1 of the flat portion 11. . Further, the convex portions 12 are formed on both sides of the adhesive film 10. Furthermore, in the connection film 10, the conductive filler 30 forms the convex portion 12 in the exposed state.
  • connection film 10 is used when the shield film is adhered to the base film to manufacture a shield printed wiring board.
  • a method of manufacturing a shielded printed wiring board using such a connection film 10 includes (1) a connection film disposing step, (2) a base film-shield film laminate forming step, and (3) a pressing step. .
  • the manufacturing method of the shield printed wiring board using the film 10 for connection is demonstrated using drawing.
  • FIG. 2: is a figure which shows typically the film arrangement process for connection of the process of manufacturing a shield printed wiring board using the film for connection of this invention.
  • FIGS. 3 (a) and 3 (b) are diagrams schematically showing a base film-shield film laminate manufacturing step in the step of manufacturing a shield printed wiring board using the connection film of the present invention.
  • Fig.4 (a) and (b) are figures which show typically the press process of the process of manufacturing a shield printed wiring board using the film for a connection of this invention.
  • connection Film Arrangement Process As shown in FIG. 2, first, from the base film 51, the printed circuit 52 including the ground circuit 52a disposed on the base film 51, and the cover lay 53 covering the printed circuit 52. The base film 50 is prepared. Then, the connection film 10 is disposed above the ground circuit 52 a of the base film 50.
  • the base film-shield film laminate 70 is made such that the conductive filler 30 of the connection film 10 contacts the ground circuit 52a and the shield layer 62. Press. During this pressing, the conductive filler 30 penetrates the cover lay 53 of the base film 50 and the insulating adhesive layer 61 of the shield film 60.
  • the shield printed wiring board 1 as shown in FIG. 4 (b) can be manufactured. Further, in the shield printed wiring board 1, the ground circuit 52 a and the shield layer 62 are electrically connected via the conductive filler 30 of the connection film 10.
  • shield printed wiring board 1 by manufacturing shield printed wiring board 1 in this manner, conductive filler 30 can be easily disposed only between ground circuit 52 a of base film 50 and shield layer 62 of shield film 60. . By arranging the conductive filler 30 only between the ground circuit 52a of the base film 50 and the shield layer 62 of the shield film 60, it is possible to prevent the transmission characteristics from being degraded in the shield printed wiring board 1. .
  • the shield printed wiring board 1 manufactured in this way is also a shield printed wiring board of this invention. That is, the shield printed wiring board 1 has a base film 51, a printed circuit 52 including a ground circuit 52a disposed on the base film 51, and a base film 50 including a cover lay 53 covering the printed circuit 52, and insulating properties.
  • a shield film 60 comprising an adhesive layer 61, a shield layer 62 laminated to the insulating adhesive layer 61, and an insulating protective layer 63 laminated to the shield layer 62; It is a shield printed wiring board adhered to the coverlay 53, and the connection film 10 is further disposed between the ground circuit 52a and the shield layer 62.
  • the conductive filler 30 of the connection film 10 By contacting the ground circuit 52a and the shield layer 62, the ground circuit 52a and the shield layer 62 Characterized in that it is electrically connected.
  • connection film 10 is disposed only between the ground circuit 52 a and the shield layer 62. In the shield printed wiring board 1, the connection film 10 is disposed only between the ground circuit 52a and the shield layer 62, so that the transmission characteristics can be prevented from being deteriorated.
  • connection film 10 can be disposed at any position above the ground circuit 52a. Therefore, the degree of freedom in the design of the shield printed wiring board 1 and the degree of freedom in the design of a product using the shield printed wiring board 1 are unlikely to be lost.
  • connection film 10 it is desirable that the height H 1 (see FIG. 3A) of the convex portion 12 on the shield film 60 side be larger than the thickness T 2 of the insulating adhesive layer 61 of the shield film 60. . If the height H 1 of the convex portion 12 of the connection film 10 on the shield film 60 side is larger than the thickness T 2 (see FIG. 3A) of the insulating adhesive layer 61 of the shield film 60, the base film When the connection film 10 and the shield film 60 are sequentially arranged and pressed, the conductive filler 30 easily penetrates the insulating adhesive layer 61. Therefore, the conductive filler 30 and the shield layer 62 can be sufficiently electrically connected.
  • the connecting film 10, the height H 1 of the convex portion 12 of the shielding film 60 side is preferably smaller than the shielding film 60 overall thickness T 3 (see Figure 3 (a)).
  • the conductive filler 30 easily penetrates to the insulating protection layer 63 of the shield film 60 when the height H 1 of the convex portion 12 on the shield film 60 side is equal to or more than the thickness T 3 of the entire shield film 60. As a result, the conductive filler 30 comes in contact with other electronic components, and a short circuit is likely to occur.
  • the height H 2 (see FIG. 2) of the convex portion 12 on the base film 50 side is the thickness T 4 of the coverlay 53 above the ground circuit 52a of the base film 50 (see FIG. 2). Larger than is desirable. If the height H 2 of the convex portion 12 of the connecting film 10 of the substrate film 50 side is greater than the thickness T 4 of the coverlay 53 that is above the ground circuit 52a of the base film 50, base film 50, a connection When the film 10 and the shield film 60 are sequentially arranged and pressed, the conductive filler 30 easily penetrates the cover lay 53 of the base film 50. Therefore, the conductive filler 30 and the ground circuit 52a can be sufficiently electrically contacted.
  • the thickness T 1 of the flat portion 11 is preferably 1 to 100 ⁇ m.
  • the thickness T 1 of the flat portion 11 is less than 1 [mu] m, the strength of the connection film 10 is weakened, easily broken.
  • the thickness T 1 of the flat portion 11 is more than 100 [mu] m, since the connecting film 10 is too thick, when manufacturing the shielded printed circuit board 1, a base film 50, it becomes difficult to adhere the shielding film 60.
  • the diameter D 1 of the conductive filler 30 is larger than the thickness T 1 of the flat portion 11. Therefore, the conductive filler 30 is not buried in the resin composition 20.
  • the conductive filler 30 does not easily come in contact with the ground circuit 52 a of the base film 50 and the shield layer 62 of the shield film 60 when the shield printed wiring board 1 is manufactured. Become. Therefore, the ground circuit 52a and the shield layer 62 are easily electrically disconnected.
  • the conductive filler 30 is not buried in the resin composition 20. Therefore, in the shield printed wiring board 1 using the connection film 10, the ground circuit 52a and the shield layer 62 are not easily cut electrically.
  • the diameter of the conductive filler 30 is desirably 2 to 200 ⁇ m.
  • the diameter of the conductive filler 30 is less than 2 ⁇ m, the contact between the conductive filler 30 and the ground circuit 52 a and / or the contact between the conductive filler 30 and the shield layer 62 is easily separated. Therefore, the electrical contact between the ground circuit 52a and the shield layer 62 is easily broken.
  • the diameter of the conductive filler 30 exceeds 200 ⁇ m, the conductive filler 30 is too large, and when the shield printed wiring board 1 is manufactured, it becomes difficult to cause the base film 50 and the shield film 60 to adhere to each other.
  • the material of the conductive filler 30 is not particularly limited, but it is selected from the group consisting of copper powder, silver powder, nickel powder, silver coated copper powder, gold coated copper powder, silver coated nickel powder and gold coated nickel powder. It is desirable to consist of at least one selected. Since these conductive fillers have good conductivity, they are suitable for electrically connecting the ground circuit 52 a and the shield layer 62.
  • the resin composition 20 in the connection film 10 is not particularly limited, it is desirable that the resin composition 20 be made of at least one selected from the group consisting of a thermosetting resin and a thermoplastic resin.
  • the resin composition 20 any of a thermosetting resin and a thermoplastic resin can be used as the resin composition 20.
  • thermosetting resin a styrene resin composition, a vinyl acetate resin composition, a polyester resin composition, a polyethylene resin composition, a polypropylene resin composition, an imide resin composition, an amide resin composition, etc.
  • thermoplastic resin a thermoplastic resin composition such as an acrylic resin composition, or a phenol resin composition, an epoxy resin composition, a urethane resin composition, a melamine resin composition, or an alkyd resin composition Etc. can be used.
  • the content of the conductive filler 30 in the resin composition 20 is desirably 20 wt% to 90 wt%. If the content of the conductive filler is less than 20 wt%, the connection stability between the ground circuit 52a and the shield layer 62 is impaired. Moreover, when content of a conductive filler exceeds 90 wt%, it is unpreferable in the point of raw material cost.
  • connection film 10 As the connection film 10, as other materials, a curing accelerator, a tackifier, an antioxidant, a pigment, a dye, a plasticizer, an ultraviolet absorber, an antifoaming agent, a leveling agent, a filler, a flame retardant, and a viscosity Modifiers and the like may be included.
  • a curing accelerator As the connection film 10, as other materials, a curing accelerator, a tackifier, an antioxidant, a pigment, a dye, a plasticizer, an ultraviolet absorber, an antifoaming agent, a leveling agent, a filler, a flame retardant, and a viscosity Modifiers and the like may be included.
  • the material of the base film 51 of the base film 50 is not particularly limited, and may be polyimide or the like.
  • the material of the printed circuit 52 of the base film 50 is not particularly limited, and may be a copper foil, a cured product of a conductive paste, or the like.
  • the material of the coverlay 53 of the base film 50 is not particularly limited, and may be polyimide or the like.
  • the material (adhesive composition) of the insulating adhesive layer 61 of the shield film 60 can be the same as the material of the resin composition 20.
  • the material of the shield layer 62 of the shield film 60 is not particularly limited, and may be copper, nickel, silver, tin, gold, palladium, aluminum, chromium, titanium, zinc and their alloys.
  • the material of the insulating protection layer 63 of the shield film 60 is not particularly limited, and may be a polyolefin resin, a polyester resin, a polyimide resin, a polyphenylene sulfide resin, or the like.
  • the adhesive composition constituting the insulating adhesive layer 63 preferably has a dielectric constant of 2.0 to 4.0 at 1 GHz, and more preferably 2.5 to 3.3. And 2.7 to 3.0 are more preferable.
  • the adhesive composition constituting the insulating adhesive layer 63 preferably has a dielectric loss tangent of 0.0015 to 0.0040 at 1 GHz, and more preferably 0.0015 to 0.0026. When the dielectric constant and dielectric loss tangent at 1 GHz of the insulating adhesive layer 63 are within the above ranges, it is possible to suppress the transmission loss of a high frequency signal (for example, 10 GHz) transmitted through the printed circuit.
  • FIG. 5 is a figure which shows typically the film arrangement process for connection of the process of manufacturing a shield printed wiring board using the film for connection of this invention.
  • 6 (a) and 6 (b) are diagrams schematically showing a base film-shield film laminate manufacturing step in the step of manufacturing a shield printed wiring board using the connection film of the present invention.
  • FIGS. 7 (a) and 7 (b) are diagrams schematically showing a pressing step of the step of producing a shielded printed wiring board using the connection film of the present invention.
  • connection Film Arrangement Step As shown in FIG. 5, first, the base film 51, the printed circuit 52 including the ground circuit 52a disposed on the base film 51, and the cover lay 53 covering the printed circuit 52 The base film 50 is prepared. Then, the cover lay 53 above the ground circuit 52a is removed to expose the ground circuit 52a. Thereafter, the connection film 10 is disposed on the ground circuit 52 a of the base film 50. By arranging the connection film 10 in this manner, the conductive filler 30 and the ground circuit 52a can be reliably brought into contact with each other.
  • the base film-shield film laminate 71 is placed so that the conductive filler 30 of the connection film 10 contacts the ground circuit 52a and the shield layer 62. Press. At the time of this pressing, the conductive filler 30 penetrates the insulating adhesive layer 61 of the shield film 60.
  • the shield printed wiring board 2 as shown in FIG. 7B can be manufactured.
  • Resin Composition Sheet Preparation Step First, the resin composition is formed into a sheet to prepare a resin composition sheet.
  • the diameter of the through holes is such that the conductive filler can not pass through.
  • the diameter of the through holes is preferably 50 to 90% of the diameter of the conductive filler.
  • the conductive filler is inserted into the through hole, but when the opening diameter of the through hole is less than 50% of the diameter of the conductive filler, it is difficult to insert the conductive filler. Become. If the diameter of the through holes is greater than 90% of the diameter of the conductive filler, the conductive filler is likely to come off.
  • the method of forming the through hole is not particularly limited, the through hole may be formed by a laser, or the through hole may be formed by pressing the embossing roll.
  • the adhesive film according to the first embodiment can be manufactured by the above steps.
  • FIG. 8 is a cross-sectional view schematically showing one example of the connection film according to the second embodiment of the present invention.
  • the connection film 110 which is an example of the connection film of the present invention, comprises a resin composition 120 and a conductive filler 130.
  • the connection film 110 has a flat portion 111 and a convex portion 112 formed of the conductive filler 130, and the diameter D 101 of the conductive filler 130 is larger than the thickness T 101 of the flat portion 111.
  • the convex part 112 is formed in the both surfaces of the film 110 for adhesion
  • the conductive filler 130 is covered with the resin composition 120 to form the convex portion 112.
  • connection film 110 is used when the shield film is bonded to the base film to manufacture a shield printed wiring board.
  • the manufacturing method of the shield printed wiring board using the film 110 for connection is demonstrated using drawing.
  • FIG. 9: is a figure which shows typically the film arrangement process for connection of the process of manufacturing a shield printed wiring board using the film for connection of this invention.
  • FIGS. 10 (a) and 10 (b) are diagrams schematically showing a base film-shield film laminate manufacturing step in the step of manufacturing a shield printed wiring board using the connection film of the present invention.
  • Fig.11 (a) and (b) are figures which show typically the press process of the process of manufacturing a shield printed wiring board using the film for a connection of this invention.
  • connection Film Arrangement Step As shown in FIG. 9, first, the base film 51, the printed circuit 52 including the ground circuit 52a disposed on the base film 51, and the cover lay 53 covering the printed circuit 52 The base film 50 is prepared. Then, the connection film 110 is disposed above the ground circuit 52 a of the base film 50.
  • a resin composition 120 in which the conductive filler 130 of the connection film 110 covers the conductive filler 130, a coverlay 53 of the base film 50, and a shield film The base film-shield film laminate 170 is pressed through the 60 insulating adhesive layers 61 and in contact with the ground circuit 52 a and the shield layer 62.
  • a shielded printed wiring board 101 as shown in FIG. 11B can be manufactured. Further, in the shield printed wiring board 101, the ground circuit 52a and the shield layer 62 are electrically connected via the conductive filler 130 of the connection film 110.
  • the conductive filler 30 can be easily disposed only between the ground circuit 52 a of the base film 50 and the shield layer 62 of the shield film 60. .
  • the conductive filler 130 By arranging the conductive filler 130 only between the ground circuit 52a of the base film 50 and the shield layer 62 of the shield film 60, it is possible to prevent the transmission characteristic from being degraded in the shield printed wiring board 101. .
  • the desired thickness of the flat portion 111 is the same as the desired thickness of the flat portion 11 of the connecting film 10.
  • the desired size and material of the conductive filler 130 are the same as the desired size and material of the conductive filler 30 described above.
  • the desirable material of the resin composition 120 is the same as the desirable material of the resin composition 20 described above.
  • the content of the conductive filler 130 in the resin composition 120 is desirably 20 wt% to 90 wt%. If the content of the conductive filler is less than 20 wt%, the connection stability between the ground circuit 52a and the shield layer 62 is impaired. Moreover, when content of a conductive filler exceeds 90 wt%, it is unpreferable in the point of raw material cost.
  • connection film 110 as other materials, a curing accelerator, a tackifier, an antioxidant, a pigment, a dye, a plasticizer, an ultraviolet absorber, an antifoamer, a leveling agent, a filler, a flame retardant, and a viscosity Adjustment, etc. may be included.
  • Resin Composition Sheet Preparation Step the resin composition is formed into a sheet to prepare a resin composition sheet.
  • the diameter of the through holes is such that the conductive filler can not pass through.
  • the diameter of the through holes is preferably 50 to 90% of the diameter of the conductive filler.
  • the conductive filler is inserted into the through hole, but when the opening diameter of the through hole is less than 50% of the diameter of the conductive filler, it is difficult to insert the conductive filler. Become. If the diameter of the through holes is greater than 90% of the diameter of the conductive filler, the conductive filler is likely to come off.
  • the method of forming the through hole is not particularly limited, the through hole may be formed by a laser, or the through hole may be formed by pressing the embossing roll.
  • the material of the resin film is not particularly limited, it may be the same as the material of the resin composition 20.
  • the thickness of the resin coating is not particularly limited, but preferably 0.1 to 10 ⁇ m. It can suppress that a conductive filler is oxidized by the water
  • the adhesive film according to the second embodiment of the present invention can be manufactured by the above steps.
  • the adhesive film according to the second embodiment of the present invention is used, as in the connection film according to the first embodiment of the present invention, in bonding a shield film to a base film to produce a shield printed wiring board It will be
  • Such a shielded printed wiring board can be manufactured by using the connection film according to the second embodiment of the present invention instead of the connection film according to the first embodiment of the present invention.
  • the film for connection when manufacturing a shield printed wiring board using the film for connection which concerns on 2nd embodiment of this invention, the film for connection will be arrange
  • the connection film may be disposed in a state where the ground circuit of the base film is covered with the coverlay, and as shown in FIG. 5, the ground circuit of the base film is covered.
  • the connecting film may be disposed in the state of being exposed from the ray.
  • FIG. 12 is a cross-sectional view schematically showing one example of the connection film according to the third embodiment of the present invention.
  • the connection film 210 which is an example of the connection film of the present invention, comprises a resin composition 220 and a conductive filler 230.
  • the connection film 210 has a flat portion 211 and a convex portion 212 formed of the conductive filler 230, and the diameter D 201 of the conductive filler 230 is larger than the thickness T 201 of the flat portion 211.
  • the convex portion 212 is formed only on one side of the adhesive film 210.
  • connection film 210 is used in bonding a shield film to a base film to produce a shield printed wiring board.
  • the manufacturing method of the shield printed wiring board using the film 210 for connection is demonstrated using drawing.
  • FIG. 13: is a figure which shows typically the film arrangement process for a connection of the process of manufacturing a shield printed wiring board using the film for a connection of this invention.
  • FIGS. 14 (a) and 14 (b) are diagrams schematically showing a base film-shield film laminate manufacturing step of the step of manufacturing a shield printed wiring board using the connection film of the present invention.
  • FIGS. 15 (a) to 15 (c) are diagrams schematically showing a pressing step of the step of producing a shielded printed wiring board using the connection film of the present invention.
  • connection Film Arrangement Step As shown in FIG. 13, first, from the base film 51, the printed circuit 52 including the ground circuit 52a disposed on the base film 51, and the cover lay 53 covering the printed circuit 52. The base film 50 is prepared. Then, the connection film 210 is disposed above the ground circuit 52 a of the base film 50. At this time, the convex portion 212 of the connection film 210 is directed to the side opposite to the base film 50.
  • connection film 210 penetrates the insulating adhesive layer 61 of the shield film 60 and is in contact with the shield layer 62.
  • the base film-shield film laminate 270 is pressed.
  • the conductive filler 230 of the film 210 for connection penetrates the resin composition 220 of the film 210 for connection, and continues a press until it penetrates the coverlay 53 of the base film 50 further.
  • a shield printed wiring board 201 as shown in FIG. 15 (c) can be manufactured. Further, in the shield printed wiring board 201, the ground circuit 52a and the shield layer 62 are electrically connected via the conductive filler 230 of the connection film 210.
  • the conductive filler 230 can be easily disposed only between the ground circuit 52 a of the base film 50 and the shield layer 62 of the shield film 60. .
  • the conductive filler 230 By arranging the conductive filler 230 only between the ground circuit 52a of the base film 50 and the shield layer 62 of the shield film 60, it is possible to prevent the transmission characteristic from being degraded in the shield printed wiring board 201. .
  • the desired thickness of the flat portion 211 is the same as the desired thickness of the flat portion 11 of the connecting film 10.
  • the desired size and material of the conductive filler 230 are the same as the desired size and material of the conductive filler 30 described above.
  • the desirable material of the resin composition 220 is the same as the desirable material of the resin composition 20 described above.
  • the content of the conductive filler 230 in the resin composition 220 is desirably 20 wt% to 90 wt%. If the content of the conductive filler is less than 20 wt%, the connection stability between the ground circuit 52a and the shield layer 62 is impaired. Moreover, when content of a conductive filler exceeds 90 wt%, it is unpreferable in the point of raw material cost.
  • connection film 210 as other materials, a curing accelerator, a tackifier, an antioxidant, a pigment, a dye, a plasticizer, an ultraviolet absorber, an antifoamer, a leveling agent, a filler, a flame retardant, and a viscosity Adjustment, etc. may be included.
  • the adhesive film according to the third embodiment of the present invention can be manufactured by the above steps.
  • the adhesive film according to the third embodiment of the present invention is used, as in the connection film according to the first embodiment of the present invention, for producing a shield printed wiring board by bonding a shield film to a base film. It will be
  • Such a shield printed wiring board can be manufactured by using the connection film according to the third embodiment of the present invention instead of the connection film according to the first embodiment of the present invention.
  • the film for connection when manufacturing a shield printed wiring board using the film for connection which concerns on 3rd embodiment of this invention, the film for connection will be arrange
  • the connection film may be disposed in a state where the ground circuit of the base film is covered with the coverlay, and as shown in FIG. 5, the ground circuit of the base film is covered.
  • the connecting film may be disposed in the state of being exposed from the ray.
  • a pair of electromagnetic wave shielding films and connecting films according to Examples 1 to 4 and an electromagnetic wave shielding film according to Comparative Examples 1 to 3 were prepared by the following method.
  • Example 1 Preparation of electromagnetic wave shield film> First, as a release film, a polyethylene terephthalate film subjected to release treatment on one side was prepared. Next, an epoxy resin was applied to the release-treated surface of the release film, and heating was performed at 100 ° C. for 2 minutes using an electric oven to produce an insulating protective layer having a thickness of 10 ⁇ m. Thereafter, a 2 ⁇ m copper layer was formed on the insulating protective layer by electroless plating. The copper layer becomes a shield layer. Next, an adhesive composition comprising a propylene-ethylene copolymer resin is applied to the surface of the copper layer opposite to the insulating protective layer, and the adhesive composition is heated at 100 ° C. for 2 minutes using an electric oven.
  • the relative dielectric constant and dielectric loss tangent at 1 GHz of the adhesive composition constituting the insulating adhesive layer were 2.23 and 0.0047, respectively.
  • connection film An epoxy resin was used as a resin composition of the film for connection. Further, spherical tin-coated copper powder (average particle diameter: 40 ⁇ m) was blended as the conductive filler so as to be 62 wt% with respect to the resin composition, to obtain the conductive resin composition. Next, the obtained conductive resin composition is coated on the surface of a polyethylene terephthalate film which has been subjected to peeling treatment on one side, and heated at 100 ° C. for 2 minutes using an electric oven to connect to the surface of the polyethylene terephthalate film Film was formed. In addition, when the thickness of the flat part of the film for connection was measured by the optical microscope for the cross section of the film for connection, thickness was 10 micrometers.
  • Example 2 Preparation of electromagnetic wave shield film> An electromagnetic wave shielding film was produced in the same manner as in Example 1 except that a cresol novolac epoxy resin was used as the adhesive composition. In the electromagnetic wave shielding film according to Example 2, the relative dielectric constant and dielectric loss tangent at 1 GHz of the adhesive composition constituting the insulating adhesive layer were 4.20 and 0.015, respectively.
  • connection film> In the same manner as in Example 1, a connection film was produced.
  • Example 3 ⁇ Preparation of electromagnetic wave shield film> In the same manner as in Example 1, an electromagnetic wave shield was produced.
  • connection film An epoxy resin was used as a resin composition of the film for connection. Further, spherical silver-coated nickel powder (average particle diameter: 23 ⁇ m) was blended as a conductive filler so as to be 35 wt% with respect to the resin composition, to obtain a conductive resin composition. Next, the obtained conductive resin composition is coated on the surface of a polyethylene terephthalate film which has been subjected to peeling treatment on one side, and heated at 100 ° C. for 2 minutes using an electric oven to connect to the surface of the polyethylene terephthalate film Film was formed. In addition, when the thickness of the flat part of the film for connection was measured by the optical microscope for the cross section of the film for connection, thickness was 10 micrometers.
  • Example 4 ⁇ Preparation of electromagnetic wave shield film> In the same manner as in Example 2, an electromagnetic wave shield was produced.
  • connection film> In the same manner as in Example 3, a connection film was produced.
  • the adhesive composition was cured to form a conductive adhesive layer having a thickness of 15 ⁇ m, and an electromagnetic shielding film was produced.
  • the proportion of dendrite silver-coated copper powder in the conductive adhesive layer was 15 wt% relative to the resole novolac epoxy resin.
  • the dielectric constant and dielectric loss tangent in 1 GHz of the adhesive composition which comprises a conductive adhesive layer were 4.20 and 0.015, respectively.
  • the conductive adhesive layer showed anisotropic conductivity.
  • ⁇ Shield characteristic evaluation> The adhesive layer of the electromagnetic wave shielding film of each example and the connecting film are superposed, heated and pressurized for 1 minute at 170 ° C. and 3.0 MPa using a press, and then heated for 3 minutes at the same temperature and pressure.
  • the polyethylene terephthalate film was pressed from the insulating protective layer of the electromagnetic wave shielding film to obtain a laminate of the electromagnetic wave shielding film and the connecting film.
  • the electric field shielding property of the obtained laminate was measured by the KEC method.
  • the electric field shielding property of the electromagnetic wave shielding film of each comparative example was also measured by the KEC method. The results are shown in Table 1.
  • a copper plating layer with a thickness of 12 ⁇ m is deposited on the surface of a polyimide film with a thickness of 25 ⁇ m, a length of 105 mm, and a width of 3 cm. Two parallel ground wires were formed to obtain an evaluation circuit. The width of the signal wiring was 50 ⁇ m, and the space between the wirings was 100 ⁇ m. Next, the evaluation circuit was covered with a polyimide coverlay of 37 ⁇ m in thickness to form a printed wiring board for evaluation. At this time, the evaluation circuit was exposed from both ends of the polyimide cover lay.
  • connection film and the electromagnetic wave shield film (length 100 mm) according to each example are laminated on a printed wiring board, heated and pressurized at 170 ° C. and 3.0 MPa for 1 minute using a press, and then the same Heat and pressure were applied for 3 minutes under temperature and pressure to obtain a shielded printed wiring board according to each example.
  • the electromagnetic wave shielding film (length 100 mm) which concerns on each comparative example on a printed wiring board and heating / pressurizing on 170 degreeC and 3.0 MPa conditions for 1 minute using a press, it is the same temperature and pressure. Heat and pressure were applied for 3 minutes to obtain shield printed wiring boards according to Comparative Examples.
  • the exposed evaluation circuit of the shield printed wiring board is connected to a network analyzer (KEYSIGHT, N5232A) via a probe (CASCADE Microtech, Z20-XD-GSSG), and it is in the range of 10 MHz to 20 GHz.
  • a signal was sent to the signal wiring, and the transmission loss of the shielded printed wiring board according to each example and each comparative example was measured. The results are shown in Table 1.
  • the transmission loss evaluation in Table 1 described the numerical value of the loss in 10 GHz.
  • the transmission loss of high frequency signals is significantly suppressed as compared with the conventional shielded printed wiring board (comparative examples 1 to 3). And the shield property evaluation was also good.
  • a resin composition having a small dielectric constant and a dielectric loss tangent was used as an adhesive composition constituting the insulating adhesive layer of the electromagnetic wave shielding film, the transmission loss of high frequency signals could be further suppressed (Examples 1 and Example 3).

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

Le film de connexion de la présente invention comprend : un film de substrat qui comprend un film de base, un circuit imprimé qui est disposé sur le film de base et qui comprend un circuit de masse, et une couche de couverture qui recouvre le circuit imprimé ; et un film de blindage qui comprend une couche adhésive isolante, une couche de blindage qui est appliquée sur la couche adhésive isolante, et une couche de protection isolante qui est appliquée sur la couche de blindage. La couche adhésive isolante relie électriquement le circuit de masse et la couche de blindage dans une carte de circuit imprimé blindée dans laquelle la couche adhésive isolante est collée à la couche de couverture. Le film de connexion est caractérisé en ce qu'il comprend une composition de résine et une charge conductrice, en ce qu'il possède une partie plate et une saillie qui est formée par la charge conductrice, et en ce que le diamètre de la charge conductrice est supérieur à l'épaisseur de la partie plate.
PCT/JP2018/029803 2017-08-09 2018-08-08 Film de connexion, procédé de production pour carte de circuit imprimé blindée, et carte de circuit imprimé blindée WO2019031555A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201880051684.4A CN110959316B (zh) 2017-08-09 2018-08-08 连接用膜、屏蔽印制线路板的制造方法及屏蔽印制线路板
KR1020207006593A KR102422104B1 (ko) 2017-08-09 2018-08-08 접속용 필름, 차폐 프린트 배선판의 제조 방법, 및 차폐 프린트 배선판
JP2019535704A JP6946437B2 (ja) 2017-08-09 2018-08-08 接続用フィルム、シールドプリント配線板の製造方法、及び、シールドプリント配線板

Applications Claiming Priority (2)

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JP2017-154532 2017-08-09
JP2017154532 2017-08-09

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WO2019031555A1 true WO2019031555A1 (fr) 2019-02-14

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JP (1) JP6946437B2 (fr)
KR (1) KR102422104B1 (fr)
CN (1) CN110959316B (fr)
TW (1) TWI725334B (fr)
WO (1) WO2019031555A1 (fr)

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JP2009239229A (ja) * 2008-03-28 2009-10-15 Toshiba Corp フレキシブルプリント配線板および電子機器
JP2011066329A (ja) * 2009-09-18 2011-03-31 Tatsuta Electric Wire & Cable Co Ltd シールドフィルム、そのシールドフィルムを有するシールド配線板、シールドフィルムにおけるグランド接続方法
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TWI725334B (zh) 2021-04-21
KR20200035450A (ko) 2020-04-03
KR102422104B1 (ko) 2022-07-15
JPWO2019031555A1 (ja) 2020-07-09
CN110959316A (zh) 2020-04-03
JP6946437B2 (ja) 2021-10-06
TW201921628A (zh) 2019-06-01
CN110959316B (zh) 2022-07-01

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