JP6946437B2 - 接続用フィルム、シールドプリント配線板の製造方法、及び、シールドプリント配線板 - Google Patents

接続用フィルム、シールドプリント配線板の製造方法、及び、シールドプリント配線板 Download PDF

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Publication number
JP6946437B2
JP6946437B2 JP2019535704A JP2019535704A JP6946437B2 JP 6946437 B2 JP6946437 B2 JP 6946437B2 JP 2019535704 A JP2019535704 A JP 2019535704A JP 2019535704 A JP2019535704 A JP 2019535704A JP 6946437 B2 JP6946437 B2 JP 6946437B2
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Japan
Prior art keywords
film
shield
wiring board
printed wiring
conductive filler
Prior art date
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JP2019535704A
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English (en)
Japanese (ja)
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JPWO2019031555A1 (ja
Inventor
裕介 春名
裕介 春名
志朗 山内
志朗 山内
晃司 高見
晃司 高見
浩輔 角
浩輔 角
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tatsuta Electric Wire and Cable Co Ltd
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Tatsuta Electric Wire and Cable Co Ltd
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Publication of JPWO2019031555A1 publication Critical patent/JPWO2019031555A1/ja
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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/281Applying non-metallic protective coatings by means of a preformed insulating foil
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2019535704A 2017-08-09 2018-08-08 接続用フィルム、シールドプリント配線板の製造方法、及び、シールドプリント配線板 Active JP6946437B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017154532 2017-08-09
JP2017154532 2017-08-09
PCT/JP2018/029803 WO2019031555A1 (fr) 2017-08-09 2018-08-08 Film de connexion, procédé de production pour carte de circuit imprimé blindée, et carte de circuit imprimé blindée

Publications (2)

Publication Number Publication Date
JPWO2019031555A1 JPWO2019031555A1 (ja) 2020-07-09
JP6946437B2 true JP6946437B2 (ja) 2021-10-06

Family

ID=65271099

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019535704A Active JP6946437B2 (ja) 2017-08-09 2018-08-08 接続用フィルム、シールドプリント配線板の製造方法、及び、シールドプリント配線板

Country Status (5)

Country Link
JP (1) JP6946437B2 (fr)
KR (1) KR102422104B1 (fr)
CN (1) CN110959316B (fr)
TW (1) TWI725334B (fr)
WO (1) WO2019031555A1 (fr)

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09217047A (ja) * 1996-02-08 1997-08-19 Hitachi Chem Co Ltd 粘着剤付導通テープ
JP2000269632A (ja) * 1999-03-17 2000-09-29 Tatsuta Electric Wire & Cable Co Ltd シールドフレキシブルプリント配線板の製造方法、シールドフレキシブルプリント配線板用補強シールドフィルム及びシールドフレキシブルプリント配線板
JP4673573B2 (ja) * 2004-04-21 2011-04-20 小松精練株式会社 電磁波シールド材の製造方法
JP4468464B2 (ja) * 2008-03-28 2010-05-26 株式会社東芝 フレキシブルプリント配線板および電子機器
JP2010177472A (ja) 2009-01-29 2010-08-12 Sumitomo Electric Printed Circuit Inc シールド型フレキシブルプリント配線板、その製造方法、および電子機器
JP2011066329A (ja) * 2009-09-18 2011-03-31 Tatsuta Electric Wire & Cable Co Ltd シールドフィルム、そのシールドフィルムを有するシールド配線板、シールドフィルムにおけるグランド接続方法
CN102387656B (zh) * 2010-08-30 2013-10-09 富葵精密组件(深圳)有限公司 具有接地屏蔽结构的电路板及其制作方法
JP5308465B2 (ja) * 2011-01-28 2013-10-09 タツタ電線株式会社 シールドプリント配線板
JP2013026322A (ja) * 2011-07-19 2013-02-04 Shin Etsu Polymer Co Ltd プリント配線板
CN102573285B (zh) * 2011-12-26 2015-09-09 华为终端有限公司 可挠性印制电路板及其制备方法
JP5866266B2 (ja) * 2012-08-29 2016-02-17 信越ポリマー株式会社 電磁波シールドフィルム、電磁波シールドフィルムの製造方法、およびフレキシブルプリント配線板の製造方法
JP6258290B2 (ja) * 2013-02-26 2018-01-10 タツタ電線株式会社 フレキシブルプリント配線板用補強部材、フレキシブルプリント配線板、及び、シールドプリント配線板
JP6585034B2 (ja) * 2013-05-01 2019-10-02 スリーエム イノベイティブ プロパティズ カンパニー 電気ケーブル用縁部絶縁構造
CN103763893B (zh) * 2014-01-14 2016-04-13 广州方邦电子股份有限公司 电磁波屏蔽膜以及包含屏蔽膜的线路板的制作方法
CN104332217B (zh) * 2014-10-08 2018-04-10 广州方邦电子股份有限公司 自由接地膜及其制作方法、包含自由接地膜的屏蔽线路板及接地方法
CN106937522A (zh) * 2017-04-05 2017-07-07 合肥美凯电子有限公司 一种新型电磁屏蔽膜

Also Published As

Publication number Publication date
TWI725334B (zh) 2021-04-21
WO2019031555A1 (fr) 2019-02-14
KR20200035450A (ko) 2020-04-03
KR102422104B1 (ko) 2022-07-15
JPWO2019031555A1 (ja) 2020-07-09
CN110959316A (zh) 2020-04-03
TW201921628A (zh) 2019-06-01
CN110959316B (zh) 2022-07-01

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