WO2022131183A1 - Film de blindage contre les ondes électromagnétiques et carte de circuit imprimé blindée - Google Patents

Film de blindage contre les ondes électromagnétiques et carte de circuit imprimé blindée Download PDF

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Publication number
WO2022131183A1
WO2022131183A1 PCT/JP2021/045730 JP2021045730W WO2022131183A1 WO 2022131183 A1 WO2022131183 A1 WO 2022131183A1 JP 2021045730 W JP2021045730 W JP 2021045730W WO 2022131183 A1 WO2022131183 A1 WO 2022131183A1
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WO
WIPO (PCT)
Prior art keywords
electromagnetic wave
metal layer
wave shielding
shielding film
wiring board
Prior art date
Application number
PCT/JP2021/045730
Other languages
English (en)
Japanese (ja)
Inventor
憲治 上農
Original Assignee
タツタ電線株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by タツタ電線株式会社 filed Critical タツタ電線株式会社
Priority to JP2022569964A priority Critical patent/JPWO2022131183A1/ja
Priority to CN202180078073.0A priority patent/CN116472171A/zh
Priority to KR1020237023302A priority patent/KR20230118923A/ko
Publication of WO2022131183A1 publication Critical patent/WO2022131183A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Definitions

  • the present invention relates to an electromagnetic wave shield film and a shield printed wiring board.
  • shield printed wiring Flexible printed wiring boards with shields (hereinafter referred to as "shield printed wiring") to which an electromagnetic wave shielding film is attached to shield electromagnetic waves generated from the inside and electromagnetic waves invading from the outside on smartphones, tablet terminals, etc., which are mobile devices. Also referred to as “board”) is used.
  • the shield layer used for the electromagnetic wave shield film a thin metal layer formed by thin film deposition, sputtering, plating or the like, a conductive paste containing a highly filled conductive filler, or the like is formed. If 5G and the like become widespread in earnest in the future, high-frequency and high-speed transmission will progress in order to communicate large volumes of data, and noise countermeasures for electronic devices will become even more necessary.
  • Patent Document 1 describes that the surface of a polymer film has a thickness of 1 to 8 ⁇ m, and Ni, Fe, Co, Ti, Zn, Cr, Sn, Cu and these metals are used.
  • One or more shield layers selected from the group consisting of at least one alloy are formed by any of a sputtering method, a vapor deposition method, and a plating method, and the surface of the polymer film and the shield layer are formed. It is composed of an alloy having a thickness of 1 ⁇ m or less and containing Ni, Co, Zn, Fe, Cu, Ti, Cr, oxides and nitrides of these metals, and at least one of these metals between the layers.
  • an electromagnetic wave shielding material electromagtic wave shielding film in which one layer or two or more layers are formed as a base layer composed of one kind selected from the group by either a plating method or a vapor deposition method.
  • Patent Document 2 describes an electromagnetic wave shielding film applied to a molded product molded from any of ABS resin, PC and ABS / PC polymer alloy, which is a first layer of Cu and a Sn—Cr film.
  • An electromagnetic wave shielding film (electromagnetic wave shielding film) characterized by being composed of a second layer is disclosed.
  • the present invention has been made to solve the above problems, and an object of the present invention is to provide an electromagnetic wave shielding film having high adhesion strength of a shield layer and excellent bending resistance.
  • the isotropic conductive adhesive layer, the insulating layer, and the metal layer are laminated in this order, and the total thickness of the insulating layer and the metal layer is 0.5 ⁇ m. As described above, it is characterized in that it is less than 20 ⁇ m.
  • both the isotropic conductive adhesive layer and the metal layer have the effect of shielding electromagnetic waves.
  • an insulating layer is formed between the isotropic conductive adhesive layer and the metal layer. Therefore, the metal layer is difficult to peel off. Further, even if the electromagnetic wave shielding film of the present invention is repeatedly bent, cracks are unlikely to occur in the metal layer.
  • the total thickness of the insulating layer and the metal layer is 0.5 ⁇ m or more and less than 20 ⁇ m.
  • the metal layer is less likely to peel off, and even if the electromagnetic wave shielding film is repeatedly bent, cracks are less likely to occur in the metal layer.
  • the thickness of the metal layer is preferably 0.1 to 8 ⁇ m. If the thickness of the metal layer is less than 0.1 ⁇ m, the strength of the metal layer is weakened and the metal layer is easily damaged. If the thickness of the metal layer exceeds 8 ⁇ m, the flexibility of the metal layer is lowered, so that cracks are likely to occur in the metal layer when repeatedly bent.
  • the thickness of the insulating layer is preferably 0.5 to 10 ⁇ m.
  • the thickness of the insulating layer is less than 0.5 ⁇ m, the amount of the insulating layer is small, so that the metal layer is easily peeled off.
  • the thickness of the insulating layer exceeds 10 ⁇ m, the insulating layer is thick, so that stress is likely to be applied to the metal layer when the electromagnetic wave shielding film is bent. Therefore, cracks are likely to occur in the metal layer when repeatedly bent.
  • the metal layer preferably contains at least one selected from the group consisting of copper, silver and aluminum. These metals are inexpensive, and when the metal layer is made of these metals, they exhibit excellent electromagnetic wave shielding properties.
  • the electromagnetic wave shielding film of the present invention it is preferable that a through hole is formed in the metal layer.
  • the electromagnetic wave shielding film will be placed on the printed wiring board.
  • the electromagnetic wave shielding film is thermocompression bonded.
  • a volatile component may be generated between the insulating layer and the metal layer. If no through hole is formed in the metal layer, this volatile component may expand due to heat, and the metal layer and the insulating layer may be separated from each other.
  • the volatile component can pass through the through hole, so that it is possible to prevent the metal layer and the insulating layer from peeling off.
  • the opening area per through hole is preferably 10 to 80,000 ⁇ m 2 .
  • the bending resistance is sufficient and it is possible to prevent volatile components from accumulating between the metal layer and the insulating layer.
  • the aperture ratio of the through hole is preferably 0.05 to 30%.
  • the bending resistance is sufficient and it is possible to prevent volatile components from accumulating between the metal layer and the insulating layer.
  • the shielded printed wiring board of the present invention is isotropically conductively bonded to a base film, a printed circuit board including a ground circuit arranged on the base film, and a printed wiring board composed of a coverlay covering the printed circuit.
  • a shield-printed wiring board comprising an electromagnetic wave shielding film in which an agent layer, an insulating layer, and a metal layer are laminated in order, and the total thickness of the insulating layer and the metal layer is 0.5 ⁇ m or more and less than 20 ⁇ m.
  • the electromagnetic shielding film is arranged on the printed wiring board so that the isotropic conductive adhesive layer comes into contact with the coverlay.
  • an isotropic conductive adhesive layer, an insulating layer, and a metal layer are laminated in this order, and the total thickness of the insulating layer and the metal layer is 0.5 ⁇ m or more and 20 ⁇ m.
  • an electromagnetic wave shielding film that is less than. That is, the shield printed wiring board of the present invention includes the electromagnetic wave shielding film of the present invention. Therefore, in the shield-printed wiring board of the present invention, the metal layer is less likely to peel off, and even if the shield-printed wiring board is repeatedly bent, cracks are less likely to occur in the metal layer.
  • the coverlay is formed with an opening that exposes the ground circuit, and the isotropic conductive adhesive layer and the ground circuit are formed in the opening. It is preferable that the isotropic conductive adhesive layer is filled so as to be in contact with each other. In such a shield-printed wiring board, the isotropic conductive adhesive layer and the ground circuit are sufficiently in contact with each other and electrically connected. In the shield printed wiring board of the present invention, the isotropic conductive adhesive layer has a function of shielding electromagnetic waves, so that the electromagnetic wave shielding effect is enhanced.
  • the metal layer is electrically connected to the external ground. Since the metal layer has a function of shielding electromagnetic waves in the shield printed wiring board of the present invention, the electromagnetic wave shielding effect is enhanced when the metal layer is electrically connected to the external ground.
  • the electromagnetic wave shielding film of the present invention an insulating layer is formed between the isotropic conductive adhesive layer and the metal layer. Therefore, the metal layer is difficult to peel off. Further, even if the electromagnetic wave shielding film of the present invention is repeatedly bent, cracks are unlikely to occur in the metal layer. Further, in the electromagnetic wave shielding film of the present invention, the total thickness of the insulating layer and the metal layer is 0.5 ⁇ m or more and less than 20 ⁇ m. When the total thickness of the insulating layer and the metal layer is 0.5 ⁇ m or more and less than 20 ⁇ m, the metal layer is less likely to peel off, and even if the electromagnetic wave shielding film is repeatedly bent, cracks are less likely to occur in the metal layer.
  • FIG. 1 is a cross-sectional view schematically showing an example of the electromagnetic wave shielding film of the present invention.
  • FIG. 2A is a process diagram schematically showing an example of a metal layer forming process in the method for manufacturing an electromagnetic wave shielding film of the present invention.
  • FIG. 2B is a process diagram schematically showing an example of an insulating layer forming process in the method for manufacturing an electromagnetic wave shielding film of the present invention.
  • FIG. 2C is a process diagram schematically showing an example of an isotropic conductive adhesive layer forming step in the method for manufacturing an electromagnetic wave shielding film of the present invention.
  • FIG. 3 is a cross-sectional view schematically showing an example of the shield printed wiring board of the present invention.
  • FIG. 4A is a cross-sectional view schematically showing another example of the shield printed wiring board of the present invention.
  • FIG. 4B is a cross-sectional view schematically showing another example of the shield printed wiring board of the present invention.
  • FIG. 4C is a cross-sectional view schematically showing another example of the shield printed wiring board of the present invention.
  • FIG. 4D is a cross-sectional view schematically showing another example of the shielded printed wiring board of the present invention.
  • the electromagnetic wave shielding film of the present invention will be specifically described.
  • the present invention is not limited to the following embodiments, and can be appropriately modified and applied without changing the gist of the present invention.
  • FIG. 1 is a cross-sectional view schematically showing an example of the electromagnetic wave shielding film of the present invention.
  • the isotropic conductive adhesive layer 20, the insulating layer 30, and the metal layer 40 are laminated in this order. Further, in the electromagnetic wave shielding film 10, the total thickness of the insulating layer 30 and the metal layer 40 is 0.5 ⁇ m or more and less than 20 ⁇ m.
  • the electromagnetic wave shielding film 10 will be arranged on the printed wiring board.
  • both the isotropic conductive adhesive layer 20 and the metal layer 40 have the effect of shielding electromagnetic waves. Therefore, in the shield printed wiring board on which the electromagnetic wave shield film 10 is arranged, isotropic conductivity is used. Electromagnetic waves can be shielded by the sex adhesive layer 20 and the metal layer 40.
  • an insulating layer 30 is formed between the isotropic conductive adhesive layer 20 and the metal layer 40. Therefore, the metal layer 40 is difficult to peel off. Further, even if the electromagnetic wave shielding film 10 is repeatedly bent, cracks are unlikely to occur in the metal layer 40.
  • the total thickness of the insulating layer 30 and the metal layer 40 is 0.5 ⁇ m or more and less than 20 ⁇ m. This thickness is preferably 1 to 12 ⁇ m. If the total thickness of the insulating layer 30 and the metal layer 40 is 0.5 ⁇ m or more and less than 20 ⁇ m, the metal layer 40 is difficult to peel off, and even if the electromagnetic wave shielding film 10 is repeatedly bent, cracks occur in the metal layer 40. It becomes difficult.
  • the material constituting the metal layer 40 is not particularly limited as long as it can shield electromagnetic waves, but preferably contains at least one selected from the group consisting of copper, silver and aluminum. These metals are inexpensive, and when the metal layer 40 is made of these metals, they exhibit excellent electromagnetic wave shielding properties.
  • the thickness of the metal layer 40 is preferably 0.1 to 8 ⁇ m, more preferably 0.1 to 4 ⁇ m. If the thickness of the metal layer is less than 0.1 ⁇ m, the strength of the metal layer is weakened and the metal layer is easily damaged. If the thickness of the metal layer exceeds 8 ⁇ m, the flexibility of the metal layer is lowered, so that cracks are likely to occur in the metal layer when repeatedly bent.
  • the metal layer 40 may be a vapor-deposited metal layer, a plated metal layer, or may be rolled or made of an electrolytic metal foil.
  • the metal layer 40 is formed with through holes.
  • the electromagnetic wave shielding film 10 will be arranged on the printed wiring board. At this time, the electromagnetic wave shielding film 10 is thermocompression bonded. At this time, a volatile component may be generated between the insulating layer 30 and the metal layer 40. When the through hole is not formed in the metal layer 40, this volatile component may expand due to heat, and the metal layer 40 and the insulating layer 30 may be separated from each other. However, when the through hole is formed in the metal layer 40, the volatile component can pass through the through hole, so that it is possible to prevent the metal layer 40 and the insulating layer 30 from peeling off.
  • the shape of the through hole is not particularly limited, but may be a polygonal shape such as a triangle or a quadrangle, a circular shape, or an elliptical shape.
  • the opening area per through hole is preferably 10 to 80000 ⁇ m 2 , more preferably 10 to 8000 ⁇ m 2 .
  • the bending resistance is sufficient and it is possible to prevent volatile components from accumulating between the metal layer 40 and the insulating layer 30. can.
  • the opening ratio of the through holes is preferably 0.05 to 30%, more preferably 0.1 to 10%.
  • the aperture ratio of the through hole formed in the metal layer 40 is within the above range, the bending resistance is sufficient and it is possible to prevent volatile components from accumulating between the metal layer 40 and the insulating layer 30. can.
  • the through holes may be arranged at equal intervals. When the through holes are arranged at equal intervals, it is preferable that the through holes are continuously arranged in a constant pattern.
  • the arrangement pattern of the through holes is such that when the metal layer 40 is viewed in a plan view, the center of the through holes is located at the apex of the equilateral triangle in a plane in which equilateral triangles are continuously arranged vertically and horizontally. May be good. Further, when the metal layer 40 is viewed in a plane, the arrangement pattern may be such that the center of the through hole is located at the apex of the square in the plane in which the squares are continuously arranged vertically and horizontally. Further, the arrangement pattern may be such that the center of the through hole is located at the apex of the regular hexagon when the metal layer 40 is viewed in a plan view.
  • the material of the insulating layer 30 is not particularly limited as long as the metal layer 40 can be sufficiently adhered, but may be a thermosetting resin composition or a thermoplastic resin composition.
  • the electromagnetic wave shielding film 10 is thermocompression bonded when it is placed on the printed wiring board. Whether to use the thermosetting resin composition or the thermoplastic resin composition as the insulating layer 30 is preferably determined by the conditions at the time of thermocompression bonding. From the viewpoint of heat resistance, the insulating layer 30 is preferably made of a thermosetting resin composition.
  • thermoplastic resin contained in the thermoplastic resin composition examples include urethane resin, polystyrene resin, vinyl acetate resin, polyester resin, polyolefin resin (for example, polyethylene resin, polypropylene resin composition, etc.), and acrylic resin. Examples include resin.
  • the insulating layer 30 may be made of only one of these resins, or may be made of two or more of these resins.
  • thermosetting resin contained in the thermosetting resin composition examples include polyimide resins such as phenol-based resins, epoxy-based resins, urethane-based resins, melamine-based resins, and alkyd-based resins.
  • the insulating layer 30 may be made of only one of these resins, or may be made of two or more of these resins.
  • the thickness of the insulating layer 30 is preferably 0.5 to 10 ⁇ m, more preferably 1 to 5 ⁇ m.
  • the thickness of the insulating layer is less than 0.5 ⁇ m, the amount of the insulating layer is small, so that the metal layer is easily peeled off.
  • the thickness of the insulating layer exceeds 10 ⁇ m, the insulating layer is thick, so that stress is likely to be applied to the metal layer when the electromagnetic wave shielding film is bent. Therefore, cracks are likely to occur in the metal layer when repeatedly bent.
  • the isotropic conductive adhesive layer 20 is composed of conductive particles and a resin composition.
  • the conductive particles include silver particles, copper particles, nickel particles, aluminum particles, silver-coated copper particles obtained by plating copper with silver, and the like. Since these conductive particles are excellent in conductivity, it is possible to suitably impart conductivity to the isotropic conductive adhesive layer 20. These conductive particles may be contained alone in the isotropic conductive adhesive layer 20, or may be contained in a plurality of types.
  • the size of the conductive particles is not particularly limited, but the average particle size (d 50 ) is preferably 0.5 to 20 ⁇ m.
  • the average particle size (d 50 ) is 0.5 ⁇ m or more, the dispersibility of the conductive particles is good, aggregation can be suppressed, and oxidation is difficult.
  • the average particle size (d 50 ) is 20 ⁇ m or less, the connectivity with the ground circuit is good.
  • the weight ratio of the conductive particles contained in the isotropic conductive adhesive layer 20 is preferably 40 to 80 wt%, more preferably 50 to 70 wt%. If the weight ratio of the conductive particles is less than 40 wt%, it becomes difficult to obtain isotropic conductivity. When the weight ratio of the conductive particles exceeds 80 wt%, the isotropic conductive adhesive layer becomes brittle and the electromagnetic wave shielding film is easily damaged.
  • the material of the resin composition is not particularly limited, but is limited to a styrene resin composition, a vinyl acetate resin composition, a polyester resin composition, a polyethylene resin composition, a polypropylene resin composition, an imide resin composition, and the like.
  • Thermoplastic resin compositions such as amide-based resin compositions and acrylic resin compositions, phenol-based resin compositions, epoxy-based resin compositions, urethane-based resin compositions, melamine-based resin compositions, alkyd-based resin compositions, etc.
  • the heat-curable resin composition of the above can be used. Among these, an epoxy-based resin composition is preferable.
  • the material of the adhesive resin composition may be one of these alone or a combination of two or more.
  • the isotropic conductive adhesive layer 20 further includes a flame retardant, a flame retardant aid, a curing accelerator, a tackifier, an antioxidant, a pigment, a dye, a plasticizer, an ultraviolet absorber, an antifoaming agent, and the like. It may contain a leveling agent, a filler, a viscosity modifier and the like.
  • the thickness of the isotropic conductive adhesive layer 20 is preferably 3 to 20 ⁇ m, more preferably 5 to 10 ⁇ m. When the thickness of the isotropic conductive adhesive layer 20 is 3 ⁇ m or more, the filling property into the opening provided in the coverlay of the printed wiring board becomes better. When the thickness of the isotropic conductive adhesive layer 20 is 20 ⁇ m or less, it is possible to meet the demand for thinning the electromagnetic wave shielding film.
  • a protective layer may be further formed on the metal layer 40.
  • the presence of the protective layer can prevent the metal layer 40 from being damaged by an external impact or the like.
  • the protective layer may not be formed.
  • the material of the protective layer is not particularly limited as long as it has insulating properties and can protect the metal layer 40, but is composed of a thermoplastic resin composition, a thermosetting resin composition, an active energy ray curable composition, and the like. Is preferable.
  • thermoplastic resin composition of the protective layer is not particularly limited, but is limited to a styrene resin composition, a vinyl acetate resin composition, a polyester resin composition, a polyethylene resin composition, a polypropylene resin composition, and a polyamide resin. Examples thereof include compositions and acrylic resin compositions.
  • thermosetting resin composition of the protective layer is not particularly limited, but is limited to a phenol-based resin composition, an epoxy-based resin composition, a urethane-based resin composition, a melamine-based resin composition, an alkyd-based resin composition, and a polyimide-based resin. Examples include compositions.
  • the active energy ray-curable composition of the protective layer is not particularly limited, and examples thereof include a polymerizable compound having at least two (meth) acryloyloxy groups in the molecule.
  • the protective layer may be composed of one kind of single material or two or more kinds of materials.
  • the protective layer may include a curing accelerator, a tackifier, an antioxidant, a pigment, a dye, a plasticizer, an ultraviolet absorber, an antifoaming agent, a leveling agent, a filler, a flame retardant, and a viscosity modifier, if necessary.
  • Anti-blocking agent and the like may be contained.
  • the thickness of the protective layer is not particularly limited and can be appropriately set as needed, but is preferably 1 to 15 ⁇ m, more preferably 3 to 10 ⁇ m.
  • the electromagnetic wave shielding film of the present invention When the electromagnetic wave shielding film of the present invention is manufactured, a metal layer forming step, an insulating layer forming step, and an isotropic conductive adhesive layer forming step are performed.
  • FIG. 2A is a process diagram schematically showing an example of a metal layer forming process in the method for manufacturing an electromagnetic wave shielding film of the present invention.
  • a release film 50 is prepared, and a metal layer 40 is formed on the release film 50.
  • the type of the release film 50 is not particularly limited, and conventionally used non-silicone release films, fine adhesive films and the like can be used.
  • the method for forming the metal layer 40 is not particularly limited, and may be rolled or an electrolytic metal foil may be arranged, may be formed by vapor deposition, or may be formed by plating.
  • FIG. 2B is a process diagram schematically showing an example of an insulating layer forming process in the method for manufacturing an electromagnetic wave shielding film of the present invention.
  • the insulating layer 30 is formed on the metal layer 40.
  • the method for forming the insulating layer 30 is not particularly limited, and may be applied by, for example, a bar coater.
  • FIG. 2C is a process diagram schematically showing an example of an isotropic conductive adhesive layer forming step in the method for manufacturing an electromagnetic wave shielding film of the present invention.
  • the isotropic conductive adhesive layer 20 is formed on the insulating layer 30.
  • the method for forming the isotropic conductive adhesive layer 20 is not particularly limited, and may be applied by, for example, a bar coater.
  • the electromagnetic wave shielding film 10 shown in FIG. 1 is obtained.
  • the release film 50 can be peeled off at the time of use.
  • the shield printed wiring board 1 is also an example of the shield printed wiring board of the present invention.
  • FIG. 3 is a cross-sectional view schematically showing an example of the shield printed wiring board of the present invention.
  • the shield printed wiring board 1 shown in FIG. 3 is a printed wiring board 60 including a base film 61, a printed circuit 62 including a ground circuit 62a arranged on the base film 61, and a coverlay 63 covering the printed circuit 62.
  • an electromagnetic wave shielding film 10 In the shield printed wiring board 1, the electromagnetic wave shielding film 10 is arranged on the printed wiring board 60 so that the isotropic conductive adhesive layer 20 comes into contact with the coverlay 63.
  • the shield printed wiring board 1 includes an electromagnetic wave shielding film 10. Therefore, in the shield-printed wiring board 1, the metal layer 40 is less likely to be peeled off, and even if the shield-printed wiring board 1 is repeatedly bent, the metal layer 40 is less likely to be cracked.
  • the coverlay 63 is formed with an opening 63a that exposes the ground circuit 62a.
  • the opening 63a is filled with the isotropic conductive adhesive layer 20 so that the isotropic conductive adhesive layer 20 and the ground circuit 62a are in contact with each other.
  • the isotropic conductive adhesive layer 20 and the ground circuit 62a are sufficiently in contact with each other and electrically connected.
  • the isotropic conductive adhesive layer 20 has a function of shielding electromagnetic waves, so that the electromagnetic wave shielding effect is enhanced.
  • the coverlay may not have an opening for exposing the ground circuit.
  • the ground circuit and the isotropic conductive adhesive layer may be electrically connected by a conductive bump or a conductive pin.
  • the metal layer 40 is electrically connected to the external ground GND. Since the metal layer 40 has a function of shielding electromagnetic waves in the shield printed wiring board 1, the electromagnetic wave shielding effect is enhanced when the metal layer 40 is electrically connected to the external ground GND.
  • the method of electrically connecting the external ground GND and the metal layer 40 is not particularly limited, but the external ground GND and the metal layer 40 are electrically connected by using, for example, a conductive adhesive, a conductive foam, a conductive gasket, or the like. You can connect.
  • FIGS. 4A to 4D are sectional views schematically showing another example of the shielded printed wiring board of the present invention.
  • the shield printed wiring board 1A shown in FIG. 4A is a printed wiring board 60 including a base film 61, a printed circuit 62 including a ground circuit 62a arranged on the base film 61, and a coverlay 63 covering the printed circuit 62. And an electromagnetic wave shielding film 11.
  • the electromagnetic wave shielding film 11 In the electromagnetic wave shielding film 11, the isotropic conductive adhesive layer 20, the insulating layer 30, the metal layer 40, and the protective layer 70 are laminated in this order.
  • the electromagnetic wave shielding film 11 is arranged on the printed wiring board 60 so that the isotropic conductive adhesive layer 20 comes into contact with the coverlay 63.
  • the shield printed wiring board 1A is a ground member having a flat plate-shaped conductive external connecting member 81 and a conductive projection 82 protruding from one side of the conductive external connecting member 81 on the protective layer 70 of the electromagnetic wave shielding film 11. It is equipped with 80A.
  • the conductive projection 82 penetrates the protective layer 70 and is in contact with the metal layer 40, and the conductive external connecting member 81 is electrically connected to the external ground GND. That is, in the shield printed wiring board 1A, the metal layer 40 is connected to the external ground GND via the ground member 80A.
  • the conductive external connecting member 81 and the conductive projection 82 of the gland member 80A may be made of any material as long as they have conductivity, and are made of, for example, copper, silver, aluminum, or the like. May be good.
  • the conductive external connecting member 81 and the conductive projection 82 may be connected by soldering or welding. Further, the conductive protrusion 82 is formed by etching, and the conductive external connecting member 81 and the conductive protrusion 82 may be integrated.
  • the shield printed wiring board 1B shown in FIG. 4B is a printed wiring board 60 including a base film 61, a printed circuit 62 including a ground circuit 62a arranged on the base film 61, and a coverlay 63 covering the printed circuit 62. And an electromagnetic wave shielding film 11.
  • the electromagnetic wave shielding film 11 In the electromagnetic wave shielding film 11, the isotropic conductive adhesive layer 20, the insulating layer 30, the metal layer 40, and the protective layer 70 are laminated in this order.
  • the electromagnetic wave shielding film 11 is arranged on the printed wiring board 60 so that the isotropic conductive adhesive layer 20 comes into contact with the coverlay 63.
  • the shield printed wiring board 1B has a ground having a flat plate-shaped conductive external connecting member 81 and conductive particles 83 arranged on one side of the conductive external connecting member 81 on the protective layer 70 of the electromagnetic wave shielding film 11.
  • the member 80B is provided.
  • the conductive particles 83 penetrate the protective layer 70 and are in contact with the metal layer 40, and the conductive external connecting member 81 is electrically connected to the external ground GND. That is, in the shield printed wiring board 1B, the metal layer 40 is connected to the external ground GND via the ground member 80B.
  • the conductive external connecting member 81 of the gland member 80B may be made of any material as long as it has conductivity, and may be made of, for example, copper, silver, aluminum, or the like. Further, the conductive particles 83 of the gland member 80B may be made of any material as long as they have conductivity, and may be made of, for example, copper, silver, aluminum or the like.
  • the conductive particles 83 may be adhered to the conductive external connecting member 81 with a conductive adhesive.
  • the shield printed wiring board 1C shown in FIG. 4C is a printed wiring board 60 including a base film 61, a printed circuit 62 including a ground circuit 62a arranged on the base film 61, and a coverlay 63 covering the printed circuit 62. And an electromagnetic wave shielding film 11.
  • the electromagnetic wave shielding film 11 In the electromagnetic wave shielding film 11, the isotropic conductive adhesive layer 20, the insulating layer 30, the metal layer 40, and the protective layer 70 are laminated in this order.
  • the electromagnetic wave shielding film 11 is arranged on the printed wiring board 60 so that the isotropic conductive adhesive layer 20 comes into contact with the coverlay 63.
  • the shield printed wiring board 1C includes a ground member 80C made of a conductive external connecting member 84 on the protective layer 70 of the electromagnetic wave shielding film 11.
  • the conductive external connecting member 84 has a shape formed by bending a flat plate a plurality of times, and has a protruding convex portion 84a.
  • the convex portion 84a penetrates the protective layer 70 and is in contact with the metal layer 40, and the conductive external connecting member 84 is electrically connected to the external ground GND. That is, in the shield printed wiring board 1C, the metal layer 40 is connected to the external ground GND via the ground member 80C.
  • the conductive external connecting member 84 of the gland member 80C may be made of any material as long as it has conductivity, and may be made of, for example, copper, nickel, silver, aluminum, or the like.
  • the shield printed wiring board 1D shown in FIG. 4D is a printed wiring board 60 including a base film 61, a printed circuit 62 including a ground circuit 62a arranged on the base film 61, and a coverlay 63 covering the printed circuit 62. And an electromagnetic wave shielding film 12.
  • the electromagnetic wave shielding film 12 In the electromagnetic wave shielding film 12, the isotropic conductive adhesive layer 20, the insulating layer 30, the metal layer 40, and the protective layer 70 are laminated in this order.
  • the electromagnetic wave shielding film 12 is arranged on the printed wiring board 60 so that the isotropic conductive adhesive layer 20 comes into contact with the coverlay 63.
  • the protective layer 71 of the electromagnetic wave shielding film 12 is formed with an opening 71a that exposes the metal layer 40.
  • the metal layer 40 is electrically connected to the external ground GND through the opening 71a.
  • the opening 71a of the protective layer 71 may be filled with a conductive adhesive, and the metal layer 40 may be connected to the external ground GND via the conductive adhesive.
  • the material of the base film 61 and the coverlay 63 is not particularly limited, but is preferably made of engineering plastic.
  • engineering plastics include resins such as polyethylene terephthalate, polypropylene, cross-linked polyethylene, polyester, polybenzimidazole, polyimide, polyimideamide, polyetherimide, and polyphenylene sulfide.
  • a polyphenylene sulfide film is desirable when flame retardancy is required, and a polyimide film is desirable when heat resistance is required.
  • the thickness of the base film 61 is preferably 10 to 40 ⁇ m.
  • the thickness of the coverlay 63 is preferably 20 to 50 ⁇ m.
  • the print circuit 62 and the ground circuit 62a are not particularly limited, but can be formed by etching a conductive material or the like.
  • Examples of the conductive material include copper, nickel, silver, gold and the like.
  • thermocompression bonding As a method of manufacturing the shield printed wiring board 1, a method of preparing a printed wiring board 60 and an electromagnetic wave shielding film 10 and arranging the electromagnetic wave shielding film 10 on the printed wiring board 60 can be mentioned. More specifically, a method of thermocompression bonding the electromagnetic wave shielding film 10 to the printed wiring board 60 so that the isotropic conductive adhesive layer 20 is in contact with the coverlay 63 can be mentioned.
  • the conditions for thermocompression bonding are not particularly limited, and examples thereof include conditions of 150 to 200 ° C., 2 to 5 MPa, and 1 to 60 min.
  • the isotropic conductive adhesive layer 20 fills the opening 63a.
  • the ground circuit 62a and the isotropic conductive adhesive layer 20 are electrically connected. This improves the electromagnetic wave shielding effect.
  • Example 1 Metal layer forming process
  • Silver (Ag) was vapor-deposited on the surface of the release film on which the non-silicone release agent was formed to form a metal layer having a thickness of 0.1 ⁇ m.
  • An isotropic conductive adhesive containing 60 wt% of conductive particles made of silver-coated copper powder and 40 wt% of epoxy resin was prepared.
  • the isotropic conductive adhesive layer was applied onto the insulating layer to form an isotropic conductive adhesive layer having a thickness of 15 ⁇ m.
  • Example 2 to 13 and (Comparative Examples 1 to 6)
  • the electromagnetic wave shielding films according to Examples 2 to 13 and Comparative Examples 1 to 3 were produced in the same manner as in Example 1 except that the material and thickness of the metal layer and the thickness of the insulating layer were changed as shown in Table 1. Further, the electromagnetic wave shielding films according to Comparative Examples 4 to 6 were produced in the same manner as in Example 1 except that the material and thickness of the metal layer were changed as shown in Table 1 and the insulating layer was not provided.
  • MIT test The bending resistance of the electromagnetic wave shielding film of each example and each comparative example from which the release film was peeled off was measured by the following method.
  • the evaluation criteria for the MIT test are as follows. The results are shown in Table 1. ⁇ : It was confirmed that the metal layer was broken when the number of bendings was 1000 or more. ⁇ : The metal layer was confirmed to be broken when the number of bendings was 300 or more and less than 999. X: The metal layer was confirmed to be broken when the number of bendings was less than 300.
  • Adhesion strength test The adhesion strength of the electromagnetic wave shielding film of each example and each comparative example from which the release film was peeled off was measured by the following method. Each electromagnetic wave shielding film was placed on the polyimide film so that the isotropic conductive adhesive layer was in contact with the polyimide film having a thickness of 25 ⁇ m, and thermocompression bonding was performed under the conditions of temperature: 170 ° C., time: 30 minutes, and pressure: 3 MPa.
  • the metal layer side of the electromagnetic wave shielding film is fixed with double-sided tape, the polyimide film is peeled off at a tensile speed of 50 mm / min at room temperature and a peeling angle of 180 °, the peel strength at the time of peeling is measured, and the average of the maximum and minimum values is measured. The value was taken as the adhesion strength.
  • the evaluation criteria for the adhesion strength test are as follows. The results are shown in Table 1. ⁇ : The metal layer was peeled off by a pulling force of 4.0 N / cm or more. ⁇ : The metal layer was peeled off by a tensile force of 3.0 N / cm or more and less than 4.0 N / cm. X: The metal layer was peeled off by a pulling force of less than 3.0 N / cm.
  • Examples 1 to 13 include an insulating layer between the isotropic conductive adhesive layer and the metal layer, and the total thickness of the insulating layer and the metal layer is 0.5 ⁇ m or more and less than 20 ⁇ m.
  • the electromagnetic wave shielding film according to the above was good in both the MIT test and the adhesion strength test.
  • Electromagnetic shield film 20 Isotropic conductive adhesive layer 30 Insulation layer 40 Metal layer 50 Release film 60 Printed wiring board 61 Base film 62 Printed circuit 62a Ground Circuit 63 Coverlay 63a Opening 70, 71 Protective layer 71a Opening 80A, 80B, 80C Ground member 81, 84 Conductive external connection member 82 Conductive protrusion 83 Conductive particle 84a Convex GND external ground

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)

Abstract

L'invention concerne un film de blindage contre les ondes électromagnétiques qui a une couche de blindage ayant une force d'adhérence élevée, et qui a une excellente résistance à la flexion. Le film de blindage contre les ondes électromagnétiques selon la présente invention comporte une couche adhésive électriquement conductrice isotrope, une couche isolante, et une couche métallique stratifiée dans cet ordre, et est caractérisé en ce que l'épaisseur totale de la couche isolante et de la couche métallique est supérieure ou égale à 0,5 µm et inférieure à 20 µm.
PCT/JP2021/045730 2020-12-14 2021-12-13 Film de blindage contre les ondes électromagnétiques et carte de circuit imprimé blindée WO2022131183A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2022569964A JPWO2022131183A1 (fr) 2020-12-14 2021-12-13
CN202180078073.0A CN116472171A (zh) 2020-12-14 2021-12-13 电磁波屏蔽薄膜和屏蔽印刷电路板
KR1020237023302A KR20230118923A (ko) 2020-12-14 2021-12-13 전자파 차폐 필름 및 차폐 프린트 배선판

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JP2020206824 2020-12-14
JP2020-206824 2020-12-14

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WO2022131183A1 true WO2022131183A1 (fr) 2022-06-23

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JP (1) JPWO2022131183A1 (fr)
KR (1) KR20230118923A (fr)
CN (1) CN116472171A (fr)
TW (1) TW202222563A (fr)
WO (1) WO2022131183A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013183632A1 (fr) * 2012-06-07 2013-12-12 タツタ電線株式会社 Film de blindage et carte de câblage imprimés blindée
JP2018061011A (ja) * 2016-01-21 2018-04-12 東洋インキＳｃホールディングス株式会社 電磁波シールドシートおよびプリント配線板
JP2018190973A (ja) * 2017-04-28 2018-11-29 日東電工株式会社 フレキシブル配線回路基板、その製造方法、および、撮像装置
WO2020116409A1 (fr) * 2018-12-03 2020-06-11 タツタ電線株式会社 Élément de mise à la terre et carte de circuit imprimé blindée
WO2020241835A1 (fr) * 2019-05-29 2020-12-03 タツタ電線株式会社 Film de blindage contre les ondes électromagnétiques et carte de circuit imprimé de blindage

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3826756B2 (ja) 2001-10-04 2006-09-27 住友金属鉱山株式会社 電磁波シールド膜
JP2004128158A (ja) 2002-10-01 2004-04-22 Fcm Kk 電磁波シールド材

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013183632A1 (fr) * 2012-06-07 2013-12-12 タツタ電線株式会社 Film de blindage et carte de câblage imprimés blindée
JP2018061011A (ja) * 2016-01-21 2018-04-12 東洋インキＳｃホールディングス株式会社 電磁波シールドシートおよびプリント配線板
JP2018190973A (ja) * 2017-04-28 2018-11-29 日東電工株式会社 フレキシブル配線回路基板、その製造方法、および、撮像装置
WO2020116409A1 (fr) * 2018-12-03 2020-06-11 タツタ電線株式会社 Élément de mise à la terre et carte de circuit imprimé blindée
WO2020241835A1 (fr) * 2019-05-29 2020-12-03 タツタ電線株式会社 Film de blindage contre les ondes électromagnétiques et carte de circuit imprimé de blindage

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TW202222563A (zh) 2022-06-16
JPWO2022131183A1 (fr) 2022-06-23
KR20230118923A (ko) 2023-08-14
CN116472171A (zh) 2023-07-21

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