KR102422104B1 - 접속용 필름, 차폐 프린트 배선판의 제조 방법, 및 차폐 프린트 배선판 - Google Patents

접속용 필름, 차폐 프린트 배선판의 제조 방법, 및 차폐 프린트 배선판 Download PDF

Info

Publication number
KR102422104B1
KR102422104B1 KR1020207006593A KR20207006593A KR102422104B1 KR 102422104 B1 KR102422104 B1 KR 102422104B1 KR 1020207006593 A KR1020207006593 A KR 1020207006593A KR 20207006593 A KR20207006593 A KR 20207006593A KR 102422104 B1 KR102422104 B1 KR 102422104B1
Authority
KR
South Korea
Prior art keywords
film
shielding
connection
wiring board
printed wiring
Prior art date
Application number
KR1020207006593A
Other languages
English (en)
Korean (ko)
Other versions
KR20200035450A (ko
Inventor
유스케 하루나
시로 야마우치
고지 다카미
고스케 가도
Original Assignee
타츠타 전선 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 타츠타 전선 주식회사 filed Critical 타츠타 전선 주식회사
Publication of KR20200035450A publication Critical patent/KR20200035450A/ko
Application granted granted Critical
Publication of KR102422104B1 publication Critical patent/KR102422104B1/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
KR1020207006593A 2017-08-09 2018-08-08 접속용 필름, 차폐 프린트 배선판의 제조 방법, 및 차폐 프린트 배선판 KR102422104B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017154532 2017-08-09
JPJP-P-2017-154532 2017-08-09
PCT/JP2018/029803 WO2019031555A1 (fr) 2017-08-09 2018-08-08 Film de connexion, procédé de production pour carte de circuit imprimé blindée, et carte de circuit imprimé blindée

Publications (2)

Publication Number Publication Date
KR20200035450A KR20200035450A (ko) 2020-04-03
KR102422104B1 true KR102422104B1 (ko) 2022-07-15

Family

ID=65271099

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020207006593A KR102422104B1 (ko) 2017-08-09 2018-08-08 접속용 필름, 차폐 프린트 배선판의 제조 방법, 및 차폐 프린트 배선판

Country Status (5)

Country Link
JP (1) JP6946437B2 (fr)
KR (1) KR102422104B1 (fr)
CN (1) CN110959316B (fr)
TW (1) TWI725334B (fr)
WO (1) WO2019031555A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005311039A (ja) 2004-04-21 2005-11-04 Komatsu Seiren Co Ltd 電磁波シールド材及びその製造方法
JP2011066329A (ja) 2009-09-18 2011-03-31 Tatsuta Electric Wire & Cable Co Ltd シールドフィルム、そのシールドフィルムを有するシールド配線板、シールドフィルムにおけるグランド接続方法
JP2012156457A (ja) * 2011-01-28 2012-08-16 Tatsuta Electric Wire & Cable Co Ltd シールドプリント配線板
JP2013026322A (ja) * 2011-07-19 2013-02-04 Shin Etsu Polymer Co Ltd プリント配線板

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09217047A (ja) * 1996-02-08 1997-08-19 Hitachi Chem Co Ltd 粘着剤付導通テープ
JP2000269632A (ja) 1999-03-17 2000-09-29 Tatsuta Electric Wire & Cable Co Ltd シールドフレキシブルプリント配線板の製造方法、シールドフレキシブルプリント配線板用補強シールドフィルム及びシールドフレキシブルプリント配線板
JP4468464B2 (ja) * 2008-03-28 2010-05-26 株式会社東芝 フレキシブルプリント配線板および電子機器
JP2010177472A (ja) 2009-01-29 2010-08-12 Sumitomo Electric Printed Circuit Inc シールド型フレキシブルプリント配線板、その製造方法、および電子機器
CN102387656B (zh) * 2010-08-30 2013-10-09 富葵精密组件(深圳)有限公司 具有接地屏蔽结构的电路板及其制作方法
CN102573285B (zh) * 2011-12-26 2015-09-09 华为终端有限公司 可挠性印制电路板及其制备方法
JP5866266B2 (ja) * 2012-08-29 2016-02-17 信越ポリマー株式会社 電磁波シールドフィルム、電磁波シールドフィルムの製造方法、およびフレキシブルプリント配線板の製造方法
US9736924B2 (en) * 2013-02-26 2017-08-15 Tatsuta Electric Wire & Cable Co., Ltd. Reinforcing member for flexible printed wiring board, flexible printed wiring board, and shield printed wiring board
KR20160005053A (ko) * 2013-05-01 2016-01-13 쓰리엠 이노베이티브 프로퍼티즈 컴파니 전기 케이블용 에지 절연 구조체
CN103763893B (zh) * 2014-01-14 2016-04-13 广州方邦电子股份有限公司 电磁波屏蔽膜以及包含屏蔽膜的线路板的制作方法
CN104332217B (zh) * 2014-10-08 2018-04-10 广州方邦电子股份有限公司 自由接地膜及其制作方法、包含自由接地膜的屏蔽线路板及接地方法
CN106937522A (zh) * 2017-04-05 2017-07-07 合肥美凯电子有限公司 一种新型电磁屏蔽膜

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005311039A (ja) 2004-04-21 2005-11-04 Komatsu Seiren Co Ltd 電磁波シールド材及びその製造方法
JP2011066329A (ja) 2009-09-18 2011-03-31 Tatsuta Electric Wire & Cable Co Ltd シールドフィルム、そのシールドフィルムを有するシールド配線板、シールドフィルムにおけるグランド接続方法
JP2012156457A (ja) * 2011-01-28 2012-08-16 Tatsuta Electric Wire & Cable Co Ltd シールドプリント配線板
JP2013026322A (ja) * 2011-07-19 2013-02-04 Shin Etsu Polymer Co Ltd プリント配線板

Also Published As

Publication number Publication date
CN110959316A (zh) 2020-04-03
JP6946437B2 (ja) 2021-10-06
JPWO2019031555A1 (ja) 2020-07-09
TW201921628A (zh) 2019-06-01
CN110959316B (zh) 2022-07-01
TWI725334B (zh) 2021-04-21
KR20200035450A (ko) 2020-04-03
WO2019031555A1 (fr) 2019-02-14

Similar Documents

Publication Publication Date Title
KR102467723B1 (ko) 그라운드 부재, 차폐 프린트 배선판 및 차폐 프린트 배선판의 제조 방법
WO2018147426A1 (fr) Film de blindage, carte de circuit imprimé blindée et procédé de fabrication d'une carte de circuit imprimé blindée
JP7244535B2 (ja) 電磁波シールドフィルム、シールドプリント配線板の製造方法、及び、シールドプリント配線板
KR102558230B1 (ko) 전사 필름이 부착된 전자파 차폐 필름, 전사 필름이 부착된 전자파 차폐 필름의 제조 방법 및 차폐 프린트 배선판의 제조 방법
CN108702863B (zh) 电磁波屏蔽膜
US11653439B2 (en) Ground member and shielded printed wiring board
KR102530878B1 (ko) 전자파 차폐 필름, 차폐 프린트 배선판의 제조 방법, 및 차폐 프린트 배선판
KR102422104B1 (ko) 접속용 필름, 차폐 프린트 배선판의 제조 방법, 및 차폐 프린트 배선판
KR102423541B1 (ko) 전자파 차폐 필름 및 차폐 프린트 배선판
JP2023120233A (ja) 電磁波シールドフィルム及びシールドプリント配線板
KR102640159B1 (ko) 차폐 프린트 배선판 및 차폐 프린트 배선판의 제조 방법
KR101518067B1 (ko) 다층 프린트 배선판 및 그 제조 방법
TWI550650B (zh) 導電性片以及電子零件
JP2020064927A (ja) 電磁波シールドフィルム及びその製造方法、並びに電磁波シールドフィルム付きプリント配線板
WO2023054656A1 (fr) Film de blindage contre les ondes électromagnétiques et carte de circuit imprimé blindée

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant