WO2019029044A1 - 一种柔性显示面板及其基板pi层结构、制备方法 - Google Patents

一种柔性显示面板及其基板pi层结构、制备方法 Download PDF

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WO2019029044A1
WO2019029044A1 PCT/CN2017/112053 CN2017112053W WO2019029044A1 WO 2019029044 A1 WO2019029044 A1 WO 2019029044A1 CN 2017112053 W CN2017112053 W CN 2017112053W WO 2019029044 A1 WO2019029044 A1 WO 2019029044A1
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layer
substrate
display panel
thin film
attached
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French (fr)
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崔磊
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Wuhan China Star Optoelectronics Technology Co Ltd
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Wuhan China Star Optoelectronics Technology Co Ltd
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Priority to US15/747,328 priority Critical patent/US10749124B2/en
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851—Division of substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the present invention relates to the field of display panel manufacturing, and in particular, to a flexible display panel and a substrate PI layer structure thereof and a preparation method thereof.
  • AMOLED Active-matrix organic light emitting diode, active matrix organic light-emitting diode or active matrix organic light-emitting diode
  • AMOLED display screen began to enter the consumer market
  • AMOLED due to its novel design and flexibility, it is popular among the public.
  • Flexible AMOLED display will become the mainstream of future smart terminal screens.
  • the key technology of the Flexible screen is the design of various Film materials when bending.
  • the substrate PI layer (Polyimide, polyimide flexible substrate PI layer) of the existing flexible display panel is greatly affected by the peeling operation, the flexible display panel has the following technical defects:
  • the tension of the PI layer of the substrate will increase the micro-crack extension caused by the cutting, thereby causing the risk of the flexible internal wiring and the film packaging.
  • the technical problem to be solved by the present invention is to provide a flexible display panel and a substrate PI layer structure and a preparation method thereof, and improve the strength of the edge of the PI layer of the substrate after the flexible display panel is cut, and control the probability that the micro-crack extends inward toward the PI layer of the substrate. Improve the yield.
  • an embodiment of the present invention provides a base of a flexible display panel.
  • the board PI layer structure, the flexible display panel comprises: a large board mainly composed of a carrier glass and a substrate PI layer attached on the carrier glass, and a display effective area component attached on the PI layer of the substrate, wherein: the display is effective along the display
  • the outer periphery of the display active area component and the substrate PI layer of the peripheral portion of the zone assembly and the substrate PI layer are provided with a glue layer for reinforcing the edge of the substrate PI layer after the large plate is cut into the display panel.
  • the glue layer is a UV glue layer; the UV glue layer is disposed at a position along three adjacent side regions of the periphery of the display effective area component along the outer periphery of the display active area component and the substrate PI layer.
  • the UV glue layer is disposed on the substrate PI layer that is in contact with three adjacent side regions of the periphery of the active area component.
  • the active area component includes: a TFT layer attached on the substrate PI layer, an OLED material layer attached on the TFT layer, a thin film encapsulation layer, a touch screen layer attached on the thin film encapsulation layer, and a touch screen layer And an outer cover layer of the OLED material layer and a side region of the TFT layer.
  • the thin film encapsulation layer is attached to the substrate PI layer.
  • the UV adhesive layer is disposed at three adjacent side regions of the outer periphery of the thin film encapsulation layer along the outer periphery of the thin film encapsulation layer and the substrate PI layer, and three adjacent sides of the outer periphery of the thin film encapsulation layer. The area is connected to the substrate PI layer.
  • the present invention also provides a method for preparing a flexible display panel, comprising the steps of: cutting a flexible display panel comprising: a carrier glass and a substrate PI mainly attached to the carrier glass a large plate composed of layers, and a display effective area component attached to the PI layer of the substrate; the periphery of the display effective area component and the substrate PI layer are coated along the periphery of the display active area assembly and the substrate PI layer
  • the glue is used to reinforce the edge of the PI layer of the substrate after the large board is cut into the display panel.
  • the display active area component includes a thin film encapsulation layer, and the thin film encapsulation layer is attached to the substrate PI layer.
  • the UV adhesive layer is applied at three adjacent side regions of the outer periphery of the thin film encapsulation layer along the outer periphery of the thin film encapsulation layer and the substrate PI layer, and three adjacent sides of the outer periphery of the thin film encapsulation layer The edge region is connected to the substrate PI layer.
  • an embodiment of the present invention further provides a flexible display panel.
  • the flexible display panel includes: a large board mainly composed of a carrier glass and a substrate PI layer attached to the carrier glass, and a display effective area component attached to the substrate PI layer, wherein: Providing a glue layer on the outer periphery of the display effective area component and the substrate PI layer along the outer periphery of the display active area component and the substrate PI layer contact area for cutting the large board into a display panel Afterwards, the edge of the substrate PI layer is reinforced;
  • the display active area component includes: a TFT layer attached on the substrate PI layer, an OLED material layer attached on the TFT layer, and a thin film package a layer, a touch screen layer attached to the film encapsulation layer, an optical adhesive layer attached to the touch screen layer, and a cover layer attached to the optical adhesive layer; wherein: the thin film encapsulation layer package Covering the outer periphery of the OLED material layer and the side regions of the
  • the glue layer is a UV glue layer
  • the UV adhesive layer is disposed at a position along three adjacent side regions of the outer periphery of the display effective area assembly along the outer circumference of the display active area assembly and the substrate PI layer contact area.
  • the UV glue layer is disposed on the substrate PI layer that is in contact with three adjacent side regions of the outer periphery of the display active area component.
  • the thin film encapsulation layer is attached to the substrate PI layer.
  • the UV adhesive layer is disposed at a position along three adjacent side regions of the outer periphery of the thin film encapsulation layer of the outer periphery of the thin film encapsulation layer and the substrate PI layer, and the film Three adjacent side regions of the outer periphery of the encapsulation layer are joined to the substrate PI layer.
  • an adhesive layer is disposed on the outer periphery of the display effective area component and the substrate PI layer along the periphery of the display active area component and the substrate PI layer, and the adhesive layer can be used to cut the large board into the display panel and the substrate PI
  • the edge of the layer is reinforced to further increase the strength of the edge of the PI layer of the substrate after the flexible display panel is cut.
  • the process is streamlined, controlling the probability of micro-cracks extending inward toward the PI layer of the substrate, and improving the yield rate, further reducing costs.
  • FIG. 1 is a schematic view showing a laminated structure of a flexible display panel according to an embodiment of the present invention.
  • FIG. 2 is a schematic view showing the effect of laser cutting a flexible display panel according to an embodiment of the present invention.
  • FIG 3 is a schematic cross-sectional view of a flexible display panel according to an embodiment of the present invention.
  • FIG. 4 is a schematic view showing the effect of a UV glue coating position of a flexible display panel according to an embodiment of the present invention.
  • FIG. 1 to FIG. 4 it is a first embodiment of the flexible display panel of the present invention.
  • the flexible display panel in this embodiment includes: a large board 1 mainly composed of a carrier glass 11 and a substrate PI layer 12 attached to the carrier glass 11, and a display effective area component attached to the substrate PI layer 12, Wherein: a periphery of the display effective area component along the periphery of the display active area component and the substrate PI layer 12 and the substrate PI layer 12 are provided with a glue layer 3 for cutting the large board 1 into a display panel The edges of the PI layer 12 are reinforced.
  • the large plate 1 has a rectangular shape and includes a carrier glass 11 and a substrate PI layer 12 attached to the carrier glass 11. In a specific operation, it is necessary to perform a laser cutting operation on the large plate 1 including the display effective area component. After the large plate 1 is cut into a plurality of single panels, the carrier glass 11 needs to be peeled off from the substrate PI layer 12.
  • the laminated structure before the laser cutting operation of the large plate 1 in this embodiment, that is, before the carrier glass 11 is not peeled off from the substrate PI layer 12, is as follows:
  • a large plate 1 mainly composed of a carrier glass 11 and a substrate PI layer 12 attached to the carrier glass 11, and a display effective area assembly attached to the substrate PI layer 12, the display effective area assembly comprising: being attached to the substrate The TFT layer 21 on the PI layer, the OLED material layer 22 attached to the TFT layer 21, the thin film encapsulation layer 23, the touch screen layer 24 attached to the thin film encapsulation layer 23, and the optical adhesive layer attached to the touch screen layer 24. 25 and a cover layer 26 attached to the optical adhesive layer 25.
  • the thin film encapsulation layer 23 is attached to one side of the OLED material layer 22 Covering one side of the OLED material layer 22 and its periphery and extending over the substrate PI layer 12, the structural thin film encapsulation layer 23 encapsulates the side region 21a of the TFT layer 21 therein.
  • the TFT layer 21 is attached to one side of the entire substrate PI layer 12, the OLED material layer 22 is pasted on the TFT layer 21, and the thin film encapsulation layer 23 is attached to the OLED material layer 22, and the thin film encapsulation layer 23 does not coat the OLED material layer 22 and/or the TFT layer 21.
  • the adhesive layer 3 is provided on the outer periphery of the display effective area component and the substrate PI layer 12 along the area where the outer periphery of the active area component is in contact with the substrate PI layer 12, and the glue in this embodiment
  • the layer is a UV adhesive layer, that is, the UV adhesive layer is disposed on the periphery of the display effective area assembly along the outer periphery of the display active area component (the illustrated thin film encapsulation layer 23) and the substrate PI layer 12 (the illustrated thin film encapsulation layer 23)
  • the adjacent side edge regions are positioned on the substrate PI layer 12 that is in contact with the adjacent side regions of the outer periphery of the active region assembly (shown as the thin film encapsulation layer 23).
  • the function of the UV adhesive layer is that the carrier glass 11 is still attached to the substrate PI layer 12 before the carrier glass 11 and the substrate PI layer 12 of the large board 1 are laser-cut into a single-piece independent panel.
  • a POL polarizer to the substrate PI layer 12, and then package the IC driver and the FPC board onto the cut panel by a packaging process, and then peel the carrier glass 11 from the substrate PI layer 12 by laser scanning.
  • the width of the microcracks is usually about 20 to 40 um, and the tension is also caused during the peeling of the carrier glass 11 from the substrate PI layer 12.
  • the UV adhesive layer disposed on the thin film encapsulation layer 23 at the position of the adjacent side edge region and the corresponding substrate PI layer 12 can reinforce the edge of the substrate PI layer 12, further improving the PI layer of the substrate after the flexible display panel is cut.
  • the strength of the edge reduces the probability of the crack extending inward and improves the yield.
  • the UV adhesive layer is disposed at a position along three adjacent side regions of the periphery of the display effective area assembly of the area where the outer periphery of the thin film encapsulation layer of the active area assembly and the substrate PI layer 12 is connected, and the periphery of the display effective area assembly The three adjacent side regions are joined to the substrate PI layer 12.
  • sufficient packaging space is reserved to package the IC driver and the FPC board onto the cut panel to improve assembly efficiency.
  • the UV glue layer can be disposed along the OLED material layer 22 and the film seal The position of the side of the layer 23 adjacent to the substrate PI layer 12 / TFT layer 21 in the region of the OLED material layer 22 and the three adjacent side regions of the outer periphery of the thin film encapsulation layer 23, and the OLED material layer 22 and film The substrate PI layer 12/TFT layer 21 on which the three adjacent side regions of the outer periphery of the encapsulation layer 23 are in contact with each other.
  • the present invention also provides a method for preparing a flexible display panel, comprising the steps of: cutting a flexible display panel comprising: a carrier glass 11 and a substrate PI layer 12 attached to the carrier glass 11
  • the large board 1 and the display active area component attached to the substrate PI layer 12; the outer circumference of the display active area assembly and the substrate PI layer 12 coated along the area where the outer circumference of the active area assembly is bonded to the substrate PI layer 12
  • the UV glue 3 is used to reinforce the edge of the substrate PI layer 12 after the large board is cut into a display panel.
  • the active area component is shown to include a TFT layer 21 overlying the substrate PI layer, an OLED material layer 22 overlying the TFT layer 21, a thin film encapsulation layer 23, and a thin film encapsulation layer 23.
  • the touch screen layer 24, the optical adhesive layer 25 attached to the touch screen layer 24, and the cover layer 26 attached to the optical adhesive layer 25, and the thin film encapsulation layer 23 attached to the OLED material layer 22 side is coated on the OLED
  • One side of the material layer 22 and its periphery are extended and attached to the substrate PI layer 12, and the structural thin film encapsulation layer 23 covers the side region 21a of the TFT layer 21 therein.
  • the TFT layer 21 is attached to one side of the entire substrate PI layer 12, the OLED material layer 22 is pasted on the TFT layer 21, and the thin film encapsulation layer 23 is attached to the OLED material layer 22, and the thin film encapsulation layer 23 does not coat the OLED material layer 22 and/or the TFT layer 21.
  • the UV glue 3 is coated on the outer periphery of the display active area component and the substrate PI layer 12 along the area where the outer periphery of the active area component is bonded to the substrate PI layer 12.
  • the effect of applying the UV glue is that the carrier glass 11 is still attached to the substrate PI layer 12 before the carrier glass 11 of the large board 1 and the substrate PI layer 12 are laser-cut into a single-piece independent panel.
  • a POL polarizer to the substrate PI layer 12, and then package the IC driver and the FPC board onto the cut panel by a packaging process, and then peel the carrier glass 11 from the substrate PI layer 12 by laser scanning.
  • the width of the microcracks is usually about 20 to 40 um, and the tension is also caused during the peeling of the carrier glass 11 from the substrate PI layer 12.
  • the effect is easy to extend the microcrack extension caused by laser cutting, thereby causing a flexible display panel Damage to internal wiring and risk of TFE packaging. Therefore, applying UV glue on the film encapsulation layer 23 at the position of the adjacent side regions and the corresponding substrate PI layer 12 can reinforce the edge of the substrate PI layer 12, further improving the substrate PI layer 12 after the flexible display panel is cut. The strength of the edge reduces the probability of the crack extending inward and improves the yield.
  • the UV glue 3 is applied at a position along three adjacent side regions of the region where the outer periphery of the thin film encapsulation layer of the active region assembly is bonded to the substrate PI layer 12.
  • sufficient packaging space is reserved to package the IC driver and the FPC board onto the cut panel to improve assembly efficiency.
  • the UV glue 3 may be applied to the outer periphery of the OLED material layer 22 and the thin film encapsulation layer 23 in the region where the outer periphery of the OLED material layer 22 and the thin film encapsulation layer 23 is in contact with the substrate PI layer 12/TFT layer 21.
  • the position of the three adjacent side regions is on the substrate PI layer 12/TFT layer 21 which is in contact with the three adjacent side regions of the outer periphery of the OLED material layer 22 and the thin film encapsulation layer 23.
  • an adhesive layer is disposed on the outer periphery of the display effective area component and the substrate PI layer along the periphery of the display active area component and the substrate PI layer, and the adhesive layer can be used to cut the large board into the display panel and the substrate PI
  • the edge of the layer is reinforced to further increase the strength of the edge of the PI layer of the substrate after the flexible display panel is cut.
  • the process is streamlined, controlling the probability of micro-cracks extending inward toward the PI layer of the substrate, and improving the yield rate, further reducing costs.

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Abstract

一种柔性显示面板的基板PI层结构、柔性显示面板及其制备方法，柔性显示面板包括：主要由载体玻璃（11）和贴覆在载体玻璃（11）上的基板PI层（12）所组成的大板（1），以及贴覆在基板PI层（12）上的显示有效区组件，其中：沿显示有效区组件的外周与基板PI层（12）相接区域的显示有效区组件的外周和基板PI层（12）上设有胶层（3），用以在切割大板（1）成显示面板后，对基板PI层（12）的边缘进行补强。能够提高柔性显示面板切割后基板PI层（12）边缘的强度，控制微裂痕向基板PI层（12）向内延伸的概率，提升良品率。

Description

一种柔性显示面板及其基板PI层结构、制备方法
本申请要求于2017年8月10日提交中国专利局、申请号为201710682298.2、发明名称为“一种柔性显示面板及其基板PI层结构、制备方法”的中国专利申请的优先权，上述专利的全部内容通过引用结合在本申请中。
技术领域
本发明涉及显示面板制造领域，尤其涉及一种柔性显示面板及其基板PI层结构、制备方法。
背景技术
随着显示技术的进步，AMOLED(Active-matrix organic light emitting diode，有源矩阵有机发光二极体或主动矩阵有机发光二极体)显示屏幕技术不断的创新发展，AMOLED显示屏幕开始大量进入消费市场，而作为AMOLED新技术的Flexible显示屏，由于其新颖的设计以及可弯折性，受到大众的亲赖，Flexible AMOLED显示屏将成为未来智能终端屏幕的主流。
但是，Flexible屏幕的技术关键是弯折时各种Film材料的设计，对Film材的特性，包括柔韧性、寿命等的要求非常高，直接影响产品的量产可行性。由于现有的柔性显示面板的基板PI层(Polyimide，聚酰亚胺Flexible基板PI层)受剥离作业的影响较大，使得柔性显示面板存在如下技术缺陷：
柔性显示面板的载体玻璃与基板PI层进行剥离的过程中，由于基板PI层张力会将切割时引起的微裂痕延伸增大，从而造成Flexible内部线路的以及薄膜封装的风险。
发明内容
本发明所要解决的技术问题在于，提供一种柔性显示面板及其基板PI层结构、制备方法，提高柔性显示面板切割后基板PI层边缘的强度，控制微裂痕向基板PI层向内延伸的概率，提升良品率。
为了解决上述技术问题，本发明的实施例提供了一种柔性显示面板的基 板PI层结构，柔性显示面板包括：主要由载体玻璃和贴覆在载体玻璃上的基板PI层所组成的大板，以及贴覆在基板PI层上的显示有效区组件，其中：沿显示有效区组件的外周与基板PI层相接区域的显示有效区组件的外周和基板PI层上设有胶层，用以在切割大板成显示面板后，对基板PI层的边缘进行补强。
其中，胶层为UV胶层；UV胶层设置在沿显示有效区组件的外周与基板PI层相接区域的显示有效区组件外周的三个相邻侧边区域的位置上。
其中，UV胶层设置在与显示有效区组件外周的三个相邻侧边区域相接的基板PI层上。
其中，显示有效区组件包括：贴覆在基板PI层上的TFT层、贴覆在TFT层上的OLED材料层、薄膜封装层、贴覆在薄膜封装层上的触摸屏层、贴覆在触摸屏层上的光学胶层以及贴覆在光学胶层上的盖板层；其中：薄膜封装层包覆在OLED材料层的外周和TFT层的侧边区域。
其中，薄膜封装层与基板PI层贴覆连接。
其中，UV胶层设置在沿薄膜封装层的外周与基板PI层相接区域的薄膜封装层外周的三个相邻侧边区域的位置上，以及与薄膜封装层外周的三个相邻侧边区域相接的基板PI层上。
为解决上述技术问题，本发明还提供了一种柔性显示面板的制备方法，包括以下步骤：对柔性显示面板进行切割，柔性显示面板包括：主要由载体玻璃和贴覆在载体玻璃上的基板PI层所组成的大板，以及贴覆在基板PI层上的显示有效区组件；沿显示有效区组件的外周与基板PI层相接区域的显示有效区组件的外周和基板PI层上涂覆UV胶，用以在切割大板成显示面板后，对基板PI层的边缘进行补强。
其中，显示有效区组件包括薄膜封装层，薄膜封装层与基板PI层贴覆连接。
其中，UV胶层涂覆在沿薄膜封装层的外周与基板PI层相接区域的薄膜封装层外周的三个相邻侧边区域的位置上，以及与薄膜封装层外周的三个相邻侧边区域相接的基板PI层上。
为解决上述技术问题，本发明的实施例还提供了一种柔性显示面板，其 中，所述柔性显示面板包括：主要由载体玻璃和贴覆在所述载体玻璃上的基板PI层所组成的大板，以及贴覆在所述基板PI层上的显示有效区组件，其中：沿所述显示有效区组件的外周与所述基板PI层相接区域的所述显示有效区组件的外周和所述基板PI层上设有胶层，用以在切割所述大板成显示面板后，对所述基板PI层的边缘进行补强；所述显示有效区组件包括：贴覆在所述基板PI层上的TFT层、贴覆在所述TFT层上的OLED材料层、薄膜封装层、贴覆在所述薄膜封装层上的触摸屏层、贴覆在所述触摸屏层上的光学胶层以及贴覆在所述光学胶层上的盖板层；其中：所述薄膜封装层包覆在所述OLED材料层的外周和所述TFT层的侧边区域。
其中，所述胶层为UV胶层；
所述UV胶层设置在沿所述显示有效区组件的外周与所述基板PI层相接区域的所述显示有效区组件外周的三个相邻侧边区域的位置上。
其中，所述UV胶层设置在与所述显示有效区组件外周的三个相邻侧边区域相接的所述基板PI层上。
其中，所述薄膜封装层与所述基板PI层贴覆连接。
其中，所述UV胶层设置在沿所述薄膜封装层的外周与所述基板PI层相接区域的所述薄膜封装层外周的三个相邻侧边区域的位置上，以及与所述薄膜封装层外周的三个相邻侧边区域相接的所述基板PI层上。
实施本发明所提供的柔性显示面板及其基板PI层结构、制备方法，具有如下有益效果：
第一、沿显示有效区组件的外周与基板PI层相接区域的显示有效区组件的外周和基板PI层上设有胶层，该胶层能够在切割大板成显示面板后，对基板PI层的边缘进行补强，进一步提高柔性显示面板切割后基板PI层边缘的强度。
第二、工艺精简，控制微裂痕向基板PI层向内延伸的概率，提升良品率的基础上，进一步降低成本。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面 描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本发明实施例柔性显示面板的叠层结构示意图。
图2是本发明实施例对柔性显示面板进行镭射切割的效果示意图。
图3是本发明实施例柔性显示面板的断面结构示意图。
图4是本发明实施例柔性显示面板的UV胶涂覆位置的效果示意图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
参见图1-图4所示，为本发明柔性显示面板的实施例一。
本实施例中的柔性显示面板包括：主要由载体玻璃11和贴覆在载体玻璃11上的基板PI层12所组成的大板1，以及贴覆在基板PI层12上的显示有效区组件，其中：沿显示有效区组件的外周与基板PI层12相接区域的显示有效区组件的外周和基板PI层12上设有胶层3，用以在切割大板1成显示面板后，对基板PI层12的边缘进行补强。
大板1呈矩状，其包括载体玻璃11和贴覆在载体玻璃11上的基板PI层12。具体作业中，需要对包含有显示有效区组件的大板1进行镭射切割作业，大板1被切割成多个单体面板后，需要将载体玻璃11从基板PI层12上剥离。
本实施例中在对大板1进行镭射切割作业前的，也就是载体玻璃11未从基板PI层12上剥离前的层叠结构如下：
主要由载体玻璃11和贴覆在载体玻璃11上的基板PI层12所组成的大板1，以及贴覆在基板PI层12上的显示有效区组件，显示有效区组件包括：贴覆在基板PI层上的TFT层21、贴覆在TFT层21上的OLED材料层22、薄膜封装层23、贴覆在薄膜封装层23上的触摸屏层24、贴覆在触摸屏层24上的光学胶层25以及贴覆在光学胶层25上的盖板层26。
其中一种实施方式中，贴覆在OLED材料层22一侧的薄膜封装层23包 覆在OLED材料层22的一侧及其四周并延伸贴覆在基板PI层12上，此种结构薄膜封装层23将TFT层21的侧边区域21a包覆在其中。
另一种实施方式中，TFT层21贴覆在整个基板PI层12的一侧，OLED材料层22贴覆在TFT层21上、薄膜封装层23贴覆在OLED材料层22上，薄膜封装层23并不对OLED材料层22和/或TFT层21进行包覆。
进一步的，在如上两种结构中，沿显示有效区组件的外周与基板PI层12相接区域的显示有效区组件的外周和基板PI层12上设有胶层3，本实施例中的胶层为UV胶层，也就是说UV胶层设置在沿显示有效区组件的外周(图示薄膜封装层23)与基板PI层12相接区域的显示有效区组件外周(图示薄膜封装层23)的相邻侧边区域的位置上以及与显示有效区组件外周(图示薄膜封装层23)的相邻侧边区域相接的基板PI层12上。
设置UV胶层的作用是：现有工艺对大板1的载体玻璃11和基板PI层12进行镭射切割成单片的独立的面板之前，载体玻璃11仍贴覆在基板PI层12上。首先，需要在基板PI层12贴上POL偏光片，紧接着通过封装工艺将IC驱动和FPC板封装到切割好的面板上，然后通过激光扫描，将载体玻璃11从基板PI层12上剥离掉形成显示面板产品。由于在镭射切割过程中会在基板PI层12的切割边缘造成有微裂纹，该微裂痕的宽度通常在20～40um左右，进而使在载体玻璃11从基板PI层12进行剥离的过程中，张力作用很容易将镭射切割引起的微裂纹延伸增大，进而造成柔性显示面板内部线路的损伤及TFE封装的风险。因此，设置在相邻侧边区域位置的薄膜封装层23上以及对应的基板PI层12上的UV胶层能够对基板PI层12的边缘进行补强，进一步提高柔性显示面板切割后基板PI层边缘的强度，降低为裂痕向内延伸的机率，提升良品率。
优选的，UV胶层设置在沿显示有效区组件薄膜封装层的外周与基板PI层12相接区域的显示有效区组件外周的三个相邻侧边区域的位置，以及与显示有效区组件外周的三个相邻侧边区域相接的基板PI层12上。如此，在保证切割后基板PI层边缘的强度的基础上，预留有足够的封装空间将IC驱动和FPC板封装到切割好的面板上，提升装配效率。
其它实施方式中，可以将UV胶层设置在沿OLED材料层22和薄膜封 装层23的侧边周与基板PI层12/TFT层21相接区域的OLED材料层22和薄膜封装层23外周的三个相邻侧边区域的位置上，以及与OLED材料层22和薄膜封装层23外周的三个相邻侧边区域相接的基板PI层12/TFT层21上。
本发明还提供了一种柔性显示面板的制备方法，包括以下步骤：对柔性显示面板进行切割，柔性显示面板包括：主要由载体玻璃11和贴覆在载体玻璃11上的基板PI层12所组成的大板1，以及贴覆在基板PI层12上的显示有效区组件；沿显示有效区组件的外周与基板PI层12相接区域的显示有效区组件的外周和基板PI层12上涂覆UV胶3，用以在切割大板成显示面板后，对基板PI层12的边缘进行补强。
其中一种实施方式中，显示有效区组件包括贴覆在基板PI层上的TFT层21、贴覆在TFT层21上的OLED材料层22、薄膜封装层23、贴覆在薄膜封装层23上的触摸屏层24、贴覆在触摸屏层24上的光学胶层25以及贴覆在光学胶层25上的盖板层26，贴覆在OLED材料层22一侧的薄膜封装层23包覆在OLED材料层22的一侧及其四周并延伸贴覆在基板PI层12上，此种结构薄膜封装层23将TFT层21的侧边区域21a包覆在其中。
另一种实施方式中，TFT层21贴覆在整个基板PI层12的一侧，OLED材料层22贴覆在TFT层21上、薄膜封装层23贴覆在OLED材料层22上，薄膜封装层23并不对OLED材料层22和/或TFT层21进行包覆。
具体实施时，沿显示有效区组件的外周与基板PI层12相接区域的显示有效区组件的外周和基板PI层12上涂覆UV胶3。
涂覆UV胶的作用是：现有工艺对大板1的载体玻璃11和基板PI层12进行镭射切割成单片的独立的面板之前，载体玻璃11仍贴覆在基板PI层12上。首先，需要在基板PI层12贴上POL偏光片，紧接着通过封装工艺将IC驱动和FPC板封装到切割好的面板上，然后通过激光扫描，将载体玻璃11从基板PI层12上剥离掉形成显示面板产品。由于在镭射切割过程中会在基板PI层12的切割边缘造成有微裂纹，该微裂痕的宽度通常在20～40um左右，进而使在载体玻璃11从基板PI层12进行剥离的过程中，张力作用很容易将镭射切割引起的微裂纹延伸增大，进而造成柔性显示面板 内部线路的损伤及TFE封装的风险。因此，在相邻侧边区域位置的薄膜封装层23上以及对应的基板PI层12上涂覆UV胶能够对基板PI层12的边缘进行补强，进一步提高柔性显示面板切割后基板PI层12边缘的强度，降低为裂痕向内延伸的机率，提升良品率。
优选的，UV胶3涂覆在沿显示有效区组件薄膜封装层的外周与基板PI层12相接区域的三个相邻侧边区域的位置上。如此，在保证切割后基板PI层边缘的强度的基础上，预留有足够的封装空间将IC驱动和FPC板封装到切割好的面板上，提升装配效率。
其它实施方式中，可以将UV胶3涂覆在沿OLED材料层22和薄膜封装层23的侧边外周与基板PI层12/TFT层21相接区域的OLED材料层22和薄膜封装层23外周的三个相邻侧边区域的位置上，以及与OLED材料层22和薄膜封装层23外周的三个相邻侧边区域相接的基板PI层12/TFT层21上。
实施本发明所提供的柔性显示面板及其基板PI层结构、制备方法，具有如下有益效果：
第一、沿显示有效区组件的外周与基板PI层相接区域的显示有效区组件的外周和基板PI层上设有胶层，该胶层能够在切割大板成显示面板后，对基板PI层的边缘进行补强，进一步提高柔性显示面板切割后基板PI层边缘的强度。
第二、工艺精简，控制微裂痕向基板PI层向内延伸的概率，提升良品率的基础上，进一步降低成本。

Claims (14)

  1. 一种柔性显示面板的基板PI层结构，其中，所述柔性显示面板包括：主要由载体玻璃和贴覆在所述载体玻璃上的基板PI层所组成的大板，以及贴覆在所述基板PI层上的显示有效区组件，其中：
    沿所述显示有效区组件的外周与所述基板PI层相接区域的所述显示有效区组件的外周和所述基板PI层上设有胶层，用以在切割所述大板成显示面板后，对所述基板PI层的边缘进行补强。
  2. 如权利要求1所述的柔性显示面板的基板PI层结构，其中，所述胶层为UV胶层；
    所述UV胶层设置在沿所述显示有效区组件的外周与所述基板PI层相接区域的所述显示有效区组件外周的三个相邻侧边区域的位置上。
  3. 如权利要求2所述的柔性显示面板的基板PI层结构，其中，所述UV胶层设置在与所述显示有效区组件外周的三个相邻侧边区域相接的所述基板PI层上。
  4. 如权利要求3所述的柔性显示面板的基板PI层结构，其中，所述显示有效区组件包括：贴覆在所述基板PI层上的TFT层、贴覆在所述TFT层上的OLED材料层、薄膜封装层、贴覆在所述薄膜封装层上的触摸屏层、贴覆在所述触摸屏层上的光学胶层以及贴覆在所述光学胶层上的盖板层；
    其中：所述薄膜封装层包覆在所述OLED材料层的外周和所述TFT层的侧边区域。
  5. 如权利要求4所述的柔性显示面板的基板PI层结构，其中，所述薄膜封装层与所述基板PI层贴覆连接。
  6. 如权利要求4所述的柔性显示面板的基板PI层结构，其中，所述UV胶层设置在沿所述薄膜封装层的外周与所述基板PI层相接区域的所述薄膜封装层外周的三个相邻侧边区域的位置上，以及与所述薄膜封装层外周的三个相邻侧边区域相接的所述基板PI层上。
  7. 一种柔性显示面板的制备方法，其中，包括以下步骤：
    对柔性显示面板进行切割，所述柔性显示面板包括：主要由载体玻璃和 贴覆在所述载体玻璃上的基板PI层所组成的大板，以及贴覆在所述基板PI层上的显示有效区组件；
    沿所述显示有效区组件的外周与所述基板PI层相接区域的所述显示有效区组件的外周和所述基板PI层上涂覆UV胶，用以在切割所述大板成显示面板后，对所述基板PI层的边缘进行补强。
  8. 如权利要求7所述的柔性显示面板的制备方法，其中，所述显示有效区组件包括薄膜封装层，所述薄膜封装层与所述基板PI层贴覆连接。
  9. 如权利要求8所述的柔性显示面板的制备方法，其中，所述UV胶层涂覆在沿所述薄膜封装层的外周与所述基板PI层相接区域的所述薄膜封装层外周的三个相邻侧边区域的位置上，以及与所述薄膜封装层外周的三个相邻侧边区域相接的所述基板PI层上。
  10. 一种柔性显示面板，其中，所述柔性显示面板包括：主要由载体玻璃和贴覆在所述载体玻璃上的基板PI层所组成的大板，以及贴覆在所述基板PI层上的显示有效区组件，其中：
    沿所述显示有效区组件的外周与所述基板PI层相接区域的所述显示有效区组件的外周和所述基板PI层上设有胶层，用以在切割所述大板成显示面板后，对所述基板PI层的边缘进行补强；
    所述显示有效区组件包括：贴覆在所述基板PI层上的TFT层、贴覆在所述TFT层上的OLED材料层、薄膜封装层、贴覆在所述薄膜封装层上的触摸屏层、贴覆在所述触摸屏层上的光学胶层以及贴覆在所述光学胶层上的盖板层；其中：所述薄膜封装层包覆在所述OLED材料层的外周和所述TFT层的侧边区域。
  11. 如权利要求10所述的柔性显示面板，其中，所述胶层为UV胶层；
    所述UV胶层设置在沿所述显示有效区组件的外周与所述基板PI层相接区域的所述显示有效区组件外周的三个相邻侧边区域的位置上。
  12. 如权利要求11所述的柔性显示面板，其中，所述UV胶层设置在与所述显示有效区组件外周的三个相邻侧边区域相接的所述基板PI层上。
  13. 如权利要求12所述的柔性显示面板，其中，所述薄膜封装层与所述基板PI层贴覆连接。
  14. 如权利要求12所述的柔性显示面板，其中，所述UV胶层设置在沿所述薄膜封装层的外周与所述基板PI层相接区域的所述薄膜封装层外周的三个相邻侧边区域的位置上，以及与所述薄膜封装层外周的三个相邻侧边区域相接的所述基板PI层上。
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