WO2019021365A1 - Dispositif de montage de composant - Google Patents

Dispositif de montage de composant Download PDF

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Publication number
WO2019021365A1
WO2019021365A1 PCT/JP2017/026815 JP2017026815W WO2019021365A1 WO 2019021365 A1 WO2019021365 A1 WO 2019021365A1 JP 2017026815 W JP2017026815 W JP 2017026815W WO 2019021365 A1 WO2019021365 A1 WO 2019021365A1
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WIPO (PCT)
Prior art keywords
measurement object
component
height
unit
imaging unit
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PCT/JP2017/026815
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English (en)
Japanese (ja)
Inventor
国宗 駒池
宏二 山積
一義 家泉
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ヤマハ発動機株式会社
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Application filed by ヤマハ発動機株式会社 filed Critical ヤマハ発動機株式会社
Priority to JP2019532245A priority Critical patent/JP6889778B2/ja
Priority to PCT/JP2017/026815 priority patent/WO2019021365A1/fr
Publication of WO2019021365A1 publication Critical patent/WO2019021365A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

Definitions

  • the present invention relates to a component mounting apparatus, and more particularly to a component mounting apparatus for acquiring the height of a measurement object.
  • Japanese Patent Application Laid-Open No. 2012-142347 discloses an electronic component mounting apparatus (component mounting apparatus) that acquires the height of an electronic component disposed in a feeder as the height of a measurement object.
  • the electronic component mounting apparatus is configured to obtain the height of the object to be measured by a laser displacement meter.
  • the present invention has been made to solve the problems as described above, and one object of the present invention is to provide a component mounting apparatus capable of accurately measuring the height of a small measurement object. To provide.
  • a component mounting apparatus includes a head for holding a component supplied from a component supply unit and mounting the component on a substrate, a first imaging unit for imaging a position recognition mark attached to the substrate, and A measurement target based on a second imaging unit provided separately from the imaging unit, a first captured image of the measurement target by the first imaging unit, and a second captured image of the measurement target by the second imaging unit And a control unit for acquiring the height of the object.
  • the control unit performs the first captured image of the measurement object by the first imaging unit and the second captured image of the measurement object by the second imaging unit.
  • the first imaging unit and the second imaging unit can image a wide range to some extent, the mounting positions of the first imaging unit and the second imaging unit are slightly deviated from the normal position. Even in this case, it is possible to image the measurement object. Therefore, as described above, a small measurement object is obtained by acquiring the height of the measurement object based on the first and second captured images of the measurement object by the first and second imaging units. Even the height can be measured accurately.
  • the height measurement of the measurement object can be performed using the first imaging unit that images the position recognition mark, the height measurement of the measurement object is performed at least for the first imaging unit. It is possible to suppress an increase in the number of parts.
  • the first imaging unit is configured to image the measurement object from substantially vertically above
  • the second imaging unit has a telecentric optical system and is oblique. It is comprised so that a measurement target may be imaged from upper direction.
  • the control unit is configured to obtain the height of the measurement object according to the following equation (1).
  • H S / sin ⁇ -T / tan ⁇ (1) here, H: height S of the measurement object: real space distance T corresponding to the distance from the center line to the measurement object position in the second image: corresponding to the distance from the center line to the measurement object position in the first image
  • Real space distance ⁇ the angle of the optical axis of the second imaging unit with respect to the vertical direction.
  • the control unit is configured to acquire the height of the measurement object according to the following equation (2).
  • the height of the measurement object can be acquired with only one conversion coefficient.
  • the process for acquiring the height can be performed more easily.
  • the second imaging unit is an imaging unit that images at least one of a component disposed in the component supply unit and a component mounting position of the substrate.
  • the height measurement of the object to be measured is performed using the part arranged in the part supply unit and the second imaging unit for imaging at least one of the component mounting positions of the substrate. Since the measurement can be performed, it is possible to further suppress the increase in the number of parts in order to measure the height of the measurement object.
  • the position is preferably a position where the position recognition mark is formed on the substrate or a position where the wiring pattern is formed on the substrate.
  • the position recognition mark and the wiring pattern are both characteristic and easy to recognize in the substrate. Therefore, if configured as described above, the height of the substrate is easily obtained based on the first captured image and the second captured image of the formation position of the position recognition mark on the substrate or the formation position of the wiring pattern on the substrate. can do. In this case, if the target mounting height position of the head at the time of mounting the component on the substrate is corrected based on the acquired height of the substrate, the mounting of the component on the substrate by the head can be performed with high accuracy.
  • the object to be measured is a component disposed in the component supply unit.
  • the height of the component disposed in the component supply unit can be easily obtained based on the first and second captured images of the component disposed in the component supply unit.
  • the target holding height position of the head at the time of holding the component from the component supply unit is corrected based on the acquired height of the component, the component can be held accurately from the component supply unit by the head. be able to.
  • the object to be measured is a component disposed in the component supply unit
  • the control unit is configured to perform a setup change
  • a holding error of the component by the head is
  • the first imaging unit and the second imaging unit perform control of imaging the component as the measurement object, and the first captured image of the component as the measurement object and the first (2) While acquiring a captured image, it is configured to obtain the height of a part as a measurement object based on the acquired first and second captured images.
  • the height of the part as the measuring object currently acquired is considered to be an inappropriate value because the holding error of the part by the head occurred, the height of the part as the measuring object is acquired It can be done again. That is, the height of the part as the object to be measured can be reacquired at an appropriate timing.
  • the measurement object is a component arranged in the component supply unit
  • the second imaging unit is a component from diagonally above
  • the control unit is configured to pick up an image of the component disposed in the supply unit, and the control unit causes the component disposed in the component supply unit to be displayed based on the captured image of the component disposed in the component supply unit by the second imaging unit.
  • the controller is configured to acquire a target holding horizontal position correction value for correcting a target holding horizontal position, which is a position in the horizontal direction targeted by the head when moving down for holding.
  • the first imaging unit and the second imaging unit When the target holding horizontal position correction value is equal to or greater than a predetermined threshold value, the first imaging unit and the second imaging unit perform control of imaging a component as a measurement object, and the measurement object Of parts as It acquires the captured image and the second captured image, based on the first image and the second captured image acquired, and is configured to obtain the height of the component as a measuring object.
  • the target holding horizontal position correction value when acquiring the target holding horizontal position correction value based on the captured image of the part captured from diagonally above, assuming that the height of the part is a predetermined height, the target holding horizontal position correction value You need to get In this case, if the height of the part is different from the predetermined height, it is difficult to obtain the target holding horizontal position correction value accurately.
  • the target holding horizontal position correction value when the acquired target holding horizontal position correction value is greater than or equal to the predetermined threshold value, the target holding horizontal position can be obtained by acquiring the height of the part as the measurement object. Since the position correction value is excessively large, the height of the part as the object to be measured can be re-acquired when it is considered that the target holding horizontal position correction value is not an accurate value. As a result, it is possible to accurately acquire the target holding horizontal position correction value based on the height of the reacquired part.
  • the control unit detects the same feature point of the measurement object in the first captured image and the second captured image, and the same feature of the detected measurement object
  • the height of the point is configured to be acquired as the height of the measurement object. According to this structure, the height of the measurement object can be acquired only by acquiring the height of the same feature point of the measurement object detected from each of the first captured image and the second captured image. Therefore, the height of the object to be measured can be obtained by simple processing.
  • FIG. 2 is a view showing an imaging state of a measurement object by an imaging unit. It is a figure which shows the captured image of the measurement object by the component mounting apparatus of 1st Embodiment, Comprising: (A) is a figure which shows the 1st captured image by a 1st imaging part, (B) is a 2nd imaging It is a figure which shows the 2nd captured image by a part.
  • (A) is a figure which shows the 1st captured image by a 1st imaging part
  • (B) is a 2nd imaging
  • the component mounting apparatus 100 is an apparatus which mounts components E (electronic components), such as IC, a transistor, a capacitor, and a resistance, on board
  • substrates P such as a printed circuit board, as shown in FIG.
  • the component mounting apparatus 100 includes a base 1, a transport unit 2, a head unit 3, a support unit 4, a rail unit 5, a component imaging unit 6, a first imaging unit 7, and a second imaging unit 8. , And the control unit 9.
  • the base 1 is a base on which the components are arranged in the component mounting apparatus 100.
  • a transport unit 2 On the base 1, a transport unit 2, a rail unit 5 and a component imaging unit 6 are provided. Further, in the base 1, a control unit 9 is provided. Further, in the base 1, arrangement portions 1 a capable of arranging the component supply portion 11 are provided on both sides in the Y direction (Y1 direction side and Y2 direction side).
  • the component supply unit 11 is a tape feeder that supplies components E to be mounted on the substrate P. Specifically, the component supply unit 11 holds a reel (not shown) around which a component supply tape (not shown) holding a plurality of components E is wound. Further, the component supply unit 11 is configured to supply the component E by rotating the held reel to send out the component supply tape according to the component holding operation for taking out the component E by the head unit 3. It is done. In the placement unit 1a, a plurality of component supply units 11 are arranged along the transport direction (X direction) of the substrate P.
  • the transport unit 2 is a device for transporting the substrate P in the transport direction (X direction). Specifically, the transport unit 2 carries in the substrate P before mounting from the outside of the component mounting apparatus 100, transports the substrate P in the transport direction, and carries out the mounted substrate P outside the component mounting apparatus 100. Is configured as. The transport unit 2 is configured to transport the carried-in substrate P to the mounting stop position M and to fix the substrate P at the mounting stop position M.
  • the conveyance part 2 has a pair of conveyor part 2a.
  • Each of the pair of conveyors 2a has a conveyor belt (not shown).
  • the transport unit 2 is configured to transport, in the transport direction (X direction), the substrates P placed on the transport belts of the pair of conveyors 2 a by the transport belts of the pair of conveyors 2 a.
  • the head unit 3 is a head unit for component mounting, and is configured to mount the component E on the substrate P fixed at the mounting stop position M.
  • the head unit 3 includes a plurality of heads (mounting heads) 3a arranged in a circle.
  • the head unit 3 is a rotary type head unit in which a plurality of heads 3a are arranged in a circle. In the case of a rotary type head unit 103, the head 3a is rotationally moved to a position closest to the second imaging unit 8, and the second imaging unit 8 images a component E to be held (sucked) by the head 3a. Can.
  • the plurality of heads 3a arranged in a circular shape are configured to be rotatable around the center of the circle formed by the plurality of heads 3a.
  • the plurality of heads 3a have substantially the same configuration.
  • the head 3 a is configured to hold (suck) the component E supplied from the component supply unit 11 and mount the component E on the substrate P.
  • the head 3a is connected to a vacuum generator (not shown), and holds the component E in a nozzle (not shown) attached to the tip by negative pressure supplied from the vacuum generator. It is configured to (adsorb).
  • the head 3a is configured to mount the component E held by the nozzle on the substrate P by releasing the negative pressure supplied from the vacuum generating device.
  • the head 3a is configured to be movable in the vertical direction (Z direction) by a drive mechanism (not shown).
  • the head 3a is configured to be movable between a lowered position for holding (sucking) the component E or mounting the component E on the substrate P and a raised position for movement in the horizontal plane. It is done.
  • the support 4 supports the head unit 3 so as to be movable in the transport direction (X direction).
  • the support 4 includes a ball screw shaft 41 extending in the transport direction, and an X-axis motor 42 that rotates the ball screw shaft 41.
  • the head unit 3 is provided with a ball nut (not shown) engaged with the ball screw shaft 41 of the support portion 4.
  • the head unit 3 is configured to be movable in the transport direction along the support portion 4 together with the ball nut engaged with the ball screw shaft 41 by rotating the ball screw shaft 41 by the X-axis motor 42.
  • the pair of rail portions 5 is configured to support the support portion 4 movably in the Y direction orthogonal to the X direction in the horizontal plane.
  • the rail portion 5 includes a pair of guide rails 51 for movably supporting both end portions in the X direction of the support portion 4 in the Y direction, a ball screw shaft 52 extending in the Y direction, and a ball screw shaft 52. And a Y-axis motor 53 to be rotated.
  • the support portion 4 is provided with a ball nut (not shown) engaged with the ball screw shaft 52 of the rail portion 5.
  • the support portion 4 is configured to be movable in the Y direction along the pair of rail portions 5 together with the ball nut engaged with the ball screw shaft 52 by the rotation of the ball screw shaft 52 by the Y-axis motor 53 There is.
  • the head 3 a of the head unit 3 is configured to be movable in the horizontal direction (X direction and Y direction) on the base 1.
  • the head 3 a of the head unit 3 can move above the component supply unit 11 to hold (suck) the component E supplied from the component supply unit 11.
  • the head unit 3 can move to the upper side of the substrate P fixed at the mounting stop position M, and mount the held (sucked) component E on the substrate P.
  • the component imaging unit 6 is a camera for component recognition that captures an image of the component E held (sucked) by the head 3 a prior to the mounting of the component E on the substrate P by the head 3 a.
  • the component imaging unit 6 is fixed on the upper surface of the base 1 and configured to image the component E held (sucked) by the head 3 a from below the component E (in the Z2 direction).
  • the control unit 9 is configured to acquire (recognize) the suction state (rotational posture and suction position with respect to the head 3a) of the component E based on the captured image of the component E by the component imaging unit 6.
  • the first imaging unit 7 is a camera for substrate recognition that images a position recognition mark (fiducial mark) F attached to the upper surface of the substrate P prior to the mounting of the component E on the substrate P by the head 3a.
  • the first imaging unit 7 is a camera for substrate recognition that has an application different from the application for photographing the measurement object 12 described later.
  • the position recognition mark F is a mark for recognizing the position of the substrate P.
  • the first imaging unit 7 is attached such that the optical axis 7a is oriented substantially along the vertical direction (Z direction), and imaging is performed from approximately vertically above (approximately directly above) It is configured to image an object.
  • the first imaging unit 7 is provided in the head unit 3 and is configured to be movable in the horizontal direction together with the head unit 3.
  • the control unit 9 is configured to acquire (recognize) the correct position and posture of the substrate P fixed at the mounting stop position M based on the captured image of the position recognition mark F by the first imaging unit 7 .
  • the second imaging unit 8 is a camera for component position recognition which picks up an image of the component E arranged in the component supply unit 11 prior to holding of the component E from the component supply unit 11 by the head 3a.
  • the second imaging unit 8 is provided in the head unit 3 and is configured to be movable in the horizontal direction together with the head unit 3.
  • the 2nd imaging part 8 is a camera for component position recognition which has a use different from the use which image
  • the second imaging unit 8 is attached such that the optical axis 8a is inclined with respect to the vertical direction, and is configured to image an object to be imaged from diagonally above It is done.
  • the second imaging unit 8 also has a telecentric optical system in which the chief ray is parallel to the optical axis 8a. Based on the captured image of the component E disposed in the component supply unit 11 by the second imaging unit 8, the control unit 9 causes the head 3a to move downward to hold the component E disposed in the component supply unit 11. It is configured to correct a target holding horizontal position (XY coordinate position) which is a position in the target horizontal direction.
  • the control unit 9 moves the second imaging unit 8 to a position where the component E to be taken out by the head 3a can be imaged immediately before holding (suction) the component E by the head 3a every time holding (suction) the component E
  • the second imaging unit 8 captures an image of the storage portion (pocket) of the component supply tape that stores the component E and the component E, and acquires a target holding horizontal position correction value for correcting the target holding horizontal position. It is configured.
  • the control unit 9 corrects the target holding horizontal position of the head 3a (that is, the target holding horizontal position of the nozzle) based on the acquired target holding horizontal position correction value, and controls to lower the nozzle of the head 3a. Is configured to do. If the correction is not in time, correction may be made in the case where the component E is taken out next from the component supply unit 11 (tape feeder) that supplies the same component E without correction in the imaged component E.
  • the control unit 9 is a control circuit that controls an operation of the component mounting apparatus 100, including a central processing unit (CPU), a read only memory (ROM), and a random access memory (RAM).
  • the control unit 9 mounts the component E on the substrate P by the head 3 a of the head unit 3 by controlling the transport unit 2, the component supply unit 11, the X-axis motor 42, the Y-axis motor 53 and the like according to the production program. Is configured as.
  • the control unit 9 measures the height of the measurement object 12
  • the first imaging unit 7 and the second imaging unit 8 thus, control for imaging the measurement object 12 is performed.
  • the height of the measurement object 12 means the height position of the measurement object 12 in the coordinate system set in the component mounting apparatus 100.
  • the measurement object 12 is the component E disposed in the component supply unit 11.
  • a first captured image 13 (see FIG. 3A) of the measurement object 12 by the first imaging unit 7 is an image obtained by copying the entire part E and the periphery of the part E from substantially vertically above the part E .
  • the first captured image 13 includes the upper surface of the part E indicating the height of the part E.
  • the second captured image 14 (see FIG. 3B) of the measurement object 12 by the second imaging unit 8 is an image obtained by copying the entire part E and the periphery of the part E from diagonally above the part E.
  • the second captured image 14 includes the upper surface of the part E indicating the height of the part E and the side surface of the part E.
  • control part 9 is a 1st captured image 13 of the measurement object 12 by the 1st imaging part 7, and the measurement object by the 2nd imaging part 8
  • the height of the measurement object 12 is acquired by stereo matching based on the second captured image 14 of the object 12.
  • the control unit 9 targets the head 3a when moving down to hold the component E disposed in the component supply unit 11.
  • the target holding height position (Z coordinate position), which is the position in the vertical direction, is configured to be corrected.
  • the control unit 9 determines whether the measurement object 12 (part E) in the first captured image 13 and the second captured image 14 is the same.
  • the feature point 12 a is detected, and the height of the same feature point 12 a of the detected measurement object 12 is acquired as the height of the measurement object 12.
  • the control unit 9 detects the same feature point 12 a of the measurement object 12 (part E) in the first captured image 13 and the second captured image 14 based on the lightness (pixel value) in the image. It is configured to For example, the control unit 9 detects the side E1 of the top surface of the measurement object 12 (part E) on the far side as viewed from the imaging direction by the second imaging unit 8 as the same feature point 12a.
  • the control unit 9 detects the side E1 of the top surface of the measurement object 12 (part E) on the far side as viewed from the imaging direction by the second imaging unit 8 as the same feature point 12a.
  • the control unit 9 detects the side E1 of the top surface of the measurement object 12 (part E) on the far side as viewed from the imaging direction by the second imaging unit 8 as the same feature point 12a.
  • the control unit 9 detects the side E1 of the top surface of the measurement object 12 (part E) on the far side as viewed from the imaging direction by the second imaging unit 8 as the same feature point 12a.
  • the control unit 9 is configured to detect, as the same feature point 12a, a predetermined point E4 in the side E1 that indicates a boundary between the electrode portion E2 of the component E and the mold portion E3. Thereby, it is possible to easily detect a characteristic portion having a large difference in lightness as the same feature point 12a.
  • the control unit 9 sets the height of the measurement object 12 (part E) according to the following equation (3) to the same feature points 12 a of the measurement object 12. Is configured to get the height of the.
  • H S / sin ⁇ -T / tan ⁇ (3) here, H: height S of the measurement object of the physical unit: real space distance T corresponding to the distance from the center line to the measurement object position in the second image: distance from the center line to the measurement object position in the first image
  • the distance ⁇ of the real space corresponding to : an angle of the optical axis of the second imaging unit with respect to the vertical direction.
  • the distance S is incident on the second imaging unit 8 through the center line of the real space (the line perpendicular to the page through the point B in FIG. 4) corresponding to the center line 14a passing the imaging center of the second captured image 14 It can be said that the distance from the light beam (light beam 15c to be described later) to the light beam (light beam 15d to be described later) incident on the second imaging unit 8 through the measurement target position in real space.
  • the distance S is a value acquired by the control unit 9 as a distance in physical units based on the distance in pixel units from the center line 14 a of the second captured image 14 to the feature point 12 a.
  • the distance T is incident on the first imaging unit 7 through the center line of the real space (the line perpendicular to the page through the point B in FIG. 4) corresponding to the center line 13a passing the imaging center of the first captured image 13 It can be said that the distance from the light beam (light beam 15a to be described later) to the light beam (light beam 15b to be described later) incident on the first imaging unit 7 through the measurement target position in real space.
  • the distance T is a value acquired by the control unit 9 as a physical unit distance based on the distance in pixel units from the center line 13a passing the imaging center of the first captured image 13 to the feature point 12a.
  • the angle ⁇ is a mounting angle of the second imaging unit 8 and is a known value (for example, 30 degrees).
  • a line 15a (a first imaging unit 7 center) indicating a light ray incident on the first imaging unit 7 through a center line of the real space corresponding to the center line 13a, and a first characteristic point 12a Indicates a ray incident on the second imaging unit 8 through a line 15 b (a feature point 12 a viewed from the first imaging unit 7) indicating a ray incident on the imaging unit 7 and a center line of the real space corresponding to the center line 14 a
  • a line 15c (second imaging unit 8 center) and a line 15d (feature point 12a viewed from the second imaging unit 8) indicating a light beam passing through the feature point 12a and incident on the second imaging unit 8 are defined.
  • the height H of the feature point 12a relative to the reference height is the length a of the line segment AB represented by S / sin ⁇ and the line segment BC represented by T / Tan ⁇ based on the geometrical relationship. It can be expressed by the difference with the length b of (i.e., equation (3)).
  • the control unit 9 determines the measurement object 12 (part E by the following equation (4) Is configured to obtain the height of the same feature point 12a of the measurement object 12 as the height of.
  • H S ⁇ cos ⁇ / sin ( ⁇ + ⁇ ) ⁇ T ⁇ ⁇ cos ⁇ / tan ( ⁇ + ⁇ ) + sin ⁇ (4)
  • the angle ⁇ is an angle of the optical axis 7a of the first imaging unit 7 with respect to the vertical direction, and is a known value.
  • a line 16a (first imaging unit 7 center) indicating a light beam entering the first imaging unit 7 through the center line 13a and a light beam entering the first imaging unit 7 through the feature point 12a
  • a line 16b (feature point 12a seen from the first imaging unit 7), a line 16c (second imaging unit 8 center) showing a light ray incident on the second imaging unit 8 through the center line 14a, and the feature point 12a
  • a line 16d (a feature point 12a viewed from the second imaging unit 8) indicating a light beam incident on the second imaging unit 8, two auxiliary lines 16e and 16f extending along the vertical direction, and a horizontal passing through the feature point 12a
  • an auxiliary line 16g inclined by an angle ⁇ with respect to the direction.
  • the length c of the line segment DE is represented by T / cos ( ⁇ + ⁇ ) ⁇ T.
  • the length d of the line segment EF is represented by T ⁇ tan ⁇ .
  • the length e of the line segment FG is represented by b / tan ( ⁇ + ⁇ ) -c.
  • the height H of the feature point 12a with respect to the reference height can be expressed by e ⁇ cos ⁇ (that is, equation (4)).
  • the height H can be obtained by the equation (3).
  • the angle ⁇ is 1 degree or less, it is possible to obtain the height H by the equation (3).
  • control unit 9 first obtains the distance S and the distance T as the distance in pixel units (s and t, respectively), and at the same time, obtains the distance s and the distance t obtained as the distances in pixel units Or it is comprised so that it may substitute to Formula (4).
  • the control unit 9 is configured to acquire the height h of the same feature point 12 a of the measurement object 12 in units of pixels.
  • control unit 9 converts the height h (pixel) of the same feature point 12 a of the measurement object 12 in pixel units into the height H ( ⁇ m) of the physical unit of the length by the following equation (5)
  • the second imaging unit 8 is a telecentric optical system
  • the angle of view of the first imaging unit 7 is a predetermined When the angle of view or less (about 4 degrees or less), if the height is in the range of about 1 mm, it is possible to handle the conversion coefficient as one conversion coefficient as shown in equation (5).
  • a certain height H1 (for example, 1 mm) and a reference height H0 can be represented by the following equations (6) and (7), respectively.
  • H1 (Scale-a) ⁇ s1 / sin ⁇ - (Scale-b) ⁇ t1 / tan ⁇ (6)
  • H0 (Scale-a) ⁇ s0 / sin ⁇ (Scale ⁇ b) ⁇ t0 / tan ⁇ (7)
  • the height H of the physical unit can be expressed by the following approximate expression (8).
  • the first captured image 13 which is an image obtained by capturing the measurement object 12 from substantially vertically above, the number of pixels constituting the distance T does not change significantly even if the height of the part E changes a little, so t1 easily. It is possible to obtain an approximation condition of tt0.
  • Scale-c can be expressed by the following Expression (9).
  • the control unit 9 performs the first imaging unit 7 and the second imaging unit 7 when a setup change is performed, and when a holding (suction) error of the component E by the head 3 a occurs.
  • 8 performs control of imaging the measurement object 12 (part E), acquires the first captured image 13 and the second captured image 14 of the measurement object 12, and obtains the acquired first captured image 13 and second imaging
  • the height of the measurement object 12 is configured to be acquired based on the image 14. That is, the control unit 9 is configured to re-acquire the height of the measurement object 12 when the setup change is performed and when a holding error of the component E by the head 3 a occurs.
  • the case where the setup change is performed is, for example, the case where the component supply unit 11 is replaced, the case where the reel held by the component supply unit 11 is replaced, or the like.
  • a holding error of the component E by the head 3a occurs, for example, the head 3a is lowered to hold the component disposed in the component supply unit 11, but holding the component E by the head 3a If you can not Further, the case where a holding error of the part E by the head 3a occurs may be a case where a holding error occurs once, or a case where a holding error occurs a plurality of times (for example, three times) continuously.
  • control unit 9 assumes that the height of the component E disposed in the component supply unit 11 is the height of the component E measured by the height measurement, and thus the target holding horizontal A target holding horizontal position correction value for correcting the position is configured to be acquired.
  • the control unit 9, the target holding horizontal position correction value, when the predetermined threshold value Th 1 or more predetermined, the measuring object by the first image pickup unit 7 and the second imaging unit 8 12 (part E) Control to pick up an image to obtain the first and second captured images 13 and 14 of the measurement object 12, and based on the obtained first and second captured images 13 and 14, the measurement object
  • the height of the object 12 is configured to be acquired. That is, the control unit 9, the target holding horizontal position correction value, when the predetermined threshold value Th 1 or more, and is configured to re-acquire the height of the measurement object 12.
  • the control unit 9, the target holding horizontal position correction value, if it is below a predetermined threshold Th 1 is configured so as not to perform the acquired again control the height of the measurement object 12 .
  • the predetermined threshold value Th 1 is a value for the target holding horizontal position correction value obtained to determine whether not excessive.
  • the control unit 9, a case where a predetermined threshold value Th 1 or more, the difference between the height of the measurement object 12, which is obtained this time, the height of the measurement object 12 obtained in the previous time, the predetermined If it is less than the threshold value Th 2 of is configured to perform control to notify the abnormality of the horizontal position of the disposed in the component supply section 11 part E.
  • the predetermined threshold value Th 2 the height of the measurement object 12, which is obtained this time is, the height of the measurement object 12 obtained in the previous time, in order to determine whether the changes significantly Is the value of
  • step S1 it is determined whether or not the height measurement of the measurement object 12 (the part E disposed in the part supply unit 11) is to be performed. That is, in step S1, it is determined whether or not the setup change has been performed, and whether a holding (suction) error of the component E by the head 3a has occurred. If it is determined that the height measurement of the measurement object 12 is not to be performed, the height measurement process is ended.
  • step S1 When it is determined in step S1 that the height measurement of the measurement object 12 is to be performed, the process proceeds to step S2.
  • step S2 control is performed to move the first imaging unit 7 to the imaging position of the measurement object 12 (part E). Then, the measurement object 12 is imaged by the first imaging unit 7.
  • step S3 the first captured image 13 by the first imaging unit 7 is acquired.
  • step S4 control is performed to move the second imaging unit 8 to the imaging position of the measurement object 12 (part E). Then, the measurement object 12 is imaged by the second imaging unit 8. Either of the imaging of the measurement object 12 by the first imaging unit 7 and the imaging of the measurement object 12 by the second imaging unit 8 may be performed first.
  • step S5 the second captured image 14 by the second imaging unit 8 is acquired.
  • step S6 the same feature points 12a of the measurement object 12 (part E) in the first captured image 13 and the second captured image 14 are detected based on the lightness in the image.
  • step S7 the height of the measurement object 12 is acquired based on the first captured image 13 and the second captured image 14. Specifically, the height of the same feature point 12 a of the detected measurement object 12 is acquired as the height of the measurement object 12 according to the above-described expression (3) or expression (4).
  • step S8 the target holding height position (Z coordinate position) is corrected based on the height of the measurement object 12. Thereafter, the height measurement process is ended.
  • FIG. 7 an example of the height measurement process by the component mounting apparatus 100 according to the first embodiment will be described based on a flowchart. Specifically, with reference to FIG. 7, height measurement processing of the part E in the case where the target holding horizontal position correction value is equal to or more than a predetermined threshold value Th 1 will be described.
  • the target holding horizontal position correction value is acquired for each holding operation of the component E by the head 3a. Therefore, the process of the flowchart shown in FIG. 7 is performed for each holding operation of the part E by the head 3a. Further, each process of the flowchart is performed by the control unit 9.
  • step S11 the target holding horizontal position correction value, whether the predetermined threshold value Th 1 or more is determined.
  • Target holding horizontal position correction value when it is determined to be less than the predetermined threshold value Th 1, the height measurement process is terminated.
  • step S11 when the target holding horizontal position correction value is determined to be a predetermined threshold value Th 1 or more, the process proceeds to step S12. Then, in the processes of steps S12 to S17, the same processes as the processes of steps S2 to S7 shown in FIG. 6 are performed.
  • step S18 the difference between the height of the measurement object 12 (part E disposed in the component supply unit 11) acquired this time and the height of the measurement object 12 acquired last time is a predetermined threshold value It is determined whether it is Th 2 or more.
  • step S18 if the difference between the height is determined to be a predetermined threshold value Th 2 or more, the height of the measurement object 12 from the time of previous measurement is considered to have changed significantly, the step Go to S19.
  • step S19 the height of the measurement object 12 is updated to the height of the measurement object 12 (part E) acquired this time.
  • the height of the part E disposed in the part supply unit 11 is the height of the updated measurement object 12 (part E)
  • An accurate target hold horizontal position correction value is obtained.
  • step S20 the target holding height position (Z coordinate position) is corrected based on the height of the updated measurement object 12 (part E). Thereafter, the height measurement process is ended.
  • step S18 if the difference between the height is determined to be below a predetermined threshold Th 2 is also the height of the measurement object 12 from the time of previous measurement has not changed significantly Regardless, it is considered that the target holding horizontal position correction value is an excessive value. That is, it is considered that the position in the horizontal direction of the component E disposed in the component supply unit 11 is actually largely displaced from the normal position. For this reason, the process proceeds to step S21, and in step S21, control is performed to notify of an abnormality in the position of the component E arranged in the component supply unit 11 in the horizontal direction. Thereafter, the height measurement process is ended.
  • the control unit 9 controls the first captured image 13 of the measurement object 12 (part E) by the first imaging unit 7 and the measurement object 12 by the second imaging unit 8 (
  • the height of the measurement object 12 (part E) is acquired based on the second captured image 14 of the part E).
  • the first imaging unit 7 and the second imaging unit 8 are both capable of imaging a wide range to some extent, the attachment positions of the first imaging unit 7 and the second imaging unit 8 are slightly deviated from the regular position. Even in the case, it is possible to image the measurement object 12 (part E).
  • the measurement object 12 (part E By acquiring the height of), the height can be accurately measured even with a small measurement object 12 (part E).
  • the height measurement of the measurement object 12 (part E) can be performed using the first imaging unit 7 that images the position recognition mark F, the height measurement of the measurement object 12 (part E) It is possible to suppress an increase in the number of parts in order to
  • the first imaging unit 7 is configured to image the measurement object 12 (part E) from substantially vertically above.
  • the second imaging unit 8 is configured to have a telecentric optical system and to image the measurement object 12 (part E) from diagonally above.
  • a first captured image 13 which is an image obtained by capturing the measurement target 12 (part E) from substantially vertically above
  • a second captured image 14 which is an image obtained by capturing the measurement target 12 (part E) from diagonally above
  • the height of the measurement object 12 (part E) can be easily obtained.
  • control unit 9 is configured to acquire the height of the measurement object 12 (part E) according to the above-mentioned equation (3).
  • the control unit 9 is configured to acquire the height of the measurement object 12 (part E) according to the above-mentioned equation (3).
  • control unit 9 is configured to obtain the height of the measurement object 12 (part E) by the above equation (5). Thereby, even when acquiring the height of the measurement object 12 (part E) using two imaging systems, acquiring the height of the measurement object 12 (part E) with only one conversion coefficient Since it can do, the process for acquiring the height of the measurement object 12 (part E) can be performed more easily.
  • the second imaging unit 8 is an imaging unit that images the component E disposed in the component supply unit 11.
  • the measurement object 12 In order to measure the height of the part E, the increase in the number of parts can be further suppressed.
  • the measurement object 12 is the component E disposed in the component supply unit 11.
  • the height of the component E disposed in the component supply unit 11 can be easily obtained based on the first captured image 13 and the second captured image 14 of the component E disposed in the component supply unit 11.
  • the component by the head 3 a is corrected by correcting the target holding height position (Z coordinate position) of the head 3 a at the time of holding the component E from the component supply unit 11 based on the acquired height of the component E.
  • the component E can be held from the supply unit 11 with high accuracy.
  • the first imaging unit 7 and the second imaging unit 7 perform the setup change of the control unit 9 and the holding error of the component E by the head 3a.
  • the imaging unit 8 controls the imaging of the component E as the measurement object 12, and acquires the first imaging image 13 and the second imaging image 14 of the component E as the measurement object 12, and the acquired first imaging Based on the image 13 and the second captured image 14, the height of the component E as the measurement object 12 is acquired.
  • the height of the component E as the measurement object 12 is acquired again. it can.
  • the part as the measurement object 12 when it is considered that the height of the part E as the currently obtained measurement object 12 is not an appropriate value because a holding error of the part E by the head 3a occurs, the part as the measurement object 12 You can get the height of E again. That is, the height of the part E as the measurement object 12 can be reacquired at an appropriate timing.
  • the control unit 9 corrects the target holding horizontal position based on the captured image of the part E disposed in the component supply unit 11 by the second imaging unit 8.
  • the target holding horizontal position correction value is acquired.
  • the measurement object by the first imaging unit 7 and the second imaging unit 8 Control for imaging the component E as 12 is performed, and the first captured image 13 and the second captured image 14 of the component E as the measurement object 12 are acquired, and the acquired first captured image 13 and the second captured image It is configured to acquire the height of the part E as the measurement object 12 on the basis of.
  • the target holding horizontal position correction value when acquiring the target holding horizontal position correction value based on the captured image of the part E captured from diagonally above, assuming that the height of the part E is a predetermined height, the target holding horizontal position It is necessary to obtain the correction value. In this case, if the height of the part E is different from the assumed predetermined height, it is difficult to accurately obtain the target holding horizontal position correction value. Therefore, as described above, the target holding horizontal position correction value acquired, if the predetermined threshold value Th 1 or more, if configured to obtain the height of the component E as the measurement object 12 Since the target holding horizontal position correction value is excessively large, the height of the part E as the measurement object 12 can be reacquired when it is considered that the target holding horizontal position correction value is not an accurate value. As a result, the target holding horizontal position correction value can be accurately acquired based on the height of the part E reacquired.
  • the control unit 9 detects the same feature points 12 a of the measurement object 12 (part E) in the first captured image 13 and the second captured image 14 as described above.
  • the height of the same feature point 12a of the detected measurement object 12 (part E) is obtained as the height of the measurement object 12 (part E).
  • the component mounting apparatus 200 according to the second embodiment of the present invention differs from the component mounting apparatus 100 according to the first embodiment in that a control unit 109 is provided as shown in FIG.
  • the measurement object 12 is a substrate P. Specifically, as shown in FIG. 8, the measurement object 12 is the formation position of the position recognition mark F on the substrate P and the formation position of the wiring pattern W on the substrate P.
  • the control unit 109 is configured to acquire the height of the measurement object 12 (substrate P), as in the first embodiment. That is, as shown in FIGS. 9A and 9B, the control unit 109 controls the first captured image 113 of the measurement object 12 by the first imaging unit 7 and the measurement object 12 by the second imaging unit 8.
  • the height of the measurement object 12 is acquired by stereo matching based on the second captured image 114.
  • the first captured image 113 is an image obtained by copying the entire position recognition mark F (the wiring pattern W of interest) and the periphery thereof from substantially vertically above the substrate P.
  • the first captured image 113 includes the upper surface of the substrate P indicating the height of the substrate P.
  • the distance T is the distance of the real space corresponding to the distance from the center line 113a passing the imaging center of the first pickup image 113 in the first pickup image 113 to the feature point 12a.
  • the second captured image 114 is an image in which the entire position recognition mark F (the wiring pattern W of interest) and the periphery thereof are photographed from diagonally above the substrate P.
  • the second captured image 114 includes the upper surface of the substrate P indicating the height of the substrate P.
  • the distance S is a distance in real space corresponding to the distance from the center line 114a passing through the imaging center of the second pickup image 114 in the second pickup image 114 to the feature point 12a.
  • the control unit 109 determines the position recognition mark F (target wiring pattern) as the same feature point 12a.
  • the corner F1 (W1) of W) is detected. Thereby, it is possible to easily detect a portion having a large difference in lightness as the same feature point 12a.
  • the control unit 109 is configured to acquire the height of the same feature point 12 a of the detected measurement object 12 as the height of the measurement object 12.
  • the control unit 109 acquires the heights of the plurality of positions on the measurement object 12 (substrate P), and based on the heights of the plurality of positions on the acquired measurement object 12 , It is comprised so that the curvature state of the whole measurement object 12 may be acquired. As shown in FIG. 8, for example, the control unit 109 determines the heights of the formation positions of the plurality (two) of position recognition marks F on the substrate P and the formation positions of the plurality (three) of wiring patterns W on the substrate P. Get the Then, the control unit 109 acquires the warping state of the entire substrate P based on the heights of the plurality (five) of positions in the acquired substrate P.
  • control unit 109 moves the head to mount the component E at the component mounting position of the substrate P based on the acquired warping state (height) of the substrate P as the measurement object 12. It is configured to correct a target mounting height position (Z coordinate position), which is a position in the vertical direction to be a target 3a.
  • step S31 from among the formation positions of the plurality (two) of position recognition marks F on the substrate P and the formation positions of the plurality (three) of wiring patterns W on the substrate P The measurement object 12 to be measured is determined.
  • step S32 control is performed to move the first imaging unit 7 to the imaging position of the determined measurement object 12 (the formation position of the position recognition mark F or the formation position of the wiring pattern W). Then, the measurement object 12 is imaged by the first imaging unit 7.
  • step S33 the first captured image 113 by the first imaging unit 7 is acquired.
  • step S34 control is performed to move the second imaging unit 8 to the imaging position of the determined measurement object 12 (the formation position of the position recognition mark F or the formation position of the wiring pattern W). Then, the measurement object 12 is imaged by the second imaging unit 8.
  • step S35 the second captured image 114 by the second imaging unit 8 is acquired.
  • step S36 based on the lightness in the image, the same features of the measurement object 12 (the position where the position recognition mark F is formed or the position where the wiring pattern W is formed) in the first captured image 113 and the second captured image 114. Point 12a is detected.
  • step S37 the height of the measurement object 12 is acquired based on the first captured image 113 and the second captured image 114. Specifically, the height of the same feature point 12 a of the detected measurement object 12 is acquired as the height of the measurement object 12 according to the above-described expression (3) or expression (4).
  • step S38 it is determined whether there is an unmeasured measurement object 12. If it is determined that there is an unmeasured measurement object 12, the process proceeds to step S31. Then, the processing of steps S32 to S37 is performed on the unmeasured measurement object 12, and the height is acquired.
  • step S38 when it is determined that there are no unmeasured measurement objects 12, the positions where all (two (two)) position recognition marks F are formed on the measurement objects 12 (the substrate P), and the substrate Since the formation positions of the plurality (three) of wiring patterns W in P are measured, the process proceeds to step S39.
  • step S39 the entire warped state of the substrate P is acquired based on the measurement results of the heights of all the measurement objects 12. Thereafter, the height measurement process is ended. After that, when mounting the component E on the substrate P, the target mounting height position (Z coordinate position) is corrected based on the acquired warping state (height) of the substrate P as the measurement object 12 Ru.
  • the remaining structure of the second embodiment is similar to that of the aforementioned first embodiment.
  • the control unit 109 controls the first captured image 113 of the measurement object 12 (substrate P) by the first imaging unit 7 and the measurement object 12 by the second imaging unit 8 (
  • the height of the measurement object 12 (substrate P) is obtained based on the second captured image 114 of the substrate P).
  • the height can be accurately measured even with a small measurement object 12 (e.g., the wiring pattern W for a minimal component in the substrate P).
  • the position is the position where the position recognition mark F is formed on the substrate P, or the position where the wiring pattern W is formed on the substrate P.
  • the position recognition mark F and the wiring pattern W are both characteristic and easy to recognize in the substrate P. Therefore, by configuring as described above, the substrate based on the first captured image 113 and the second captured image 114 of the formation position of the position recognition mark F on the substrate P or the formation position of the wiring pattern W on the substrate P The height of P can be easily obtained. In this case, if the target mounting height position of the head 3a at the time of mounting the component E on the substrate P is corrected based on the acquired height of the substrate P, mounting of the component E on the substrate P by the head 3a is performed. It can be done precisely.
  • the component supply unit is a tape feeder
  • the present invention is not limited to this.
  • the component supply unit may be a tray feeder that holds components on a tray.
  • the head unit is a rotary type head unit in which a plurality of heads are arranged in a circular shape, but the present invention is not limited to this.
  • the head unit may be a head unit including a plurality of heads arranged along a predetermined direction.
  • the head unit 103 includes a plurality of heads 103a arranged along a predetermined direction.
  • the head unit 103 is provided with a first imaging unit 7 and a second imaging unit 8.
  • the second imaging unit 8 is configured to be movable along the arrangement direction of the heads 103 a (nozzles) with respect to the head unit 103 so that the holding (suction) of the component E by each head 103 a can be imaged.
  • the first imaging unit captures an image of the measurement object from approximately vertically above, and the second imaging unit captures an image of the measurement object from diagonally above.
  • the present invention is not limited to this.
  • the first imaging unit may image the measurement object from any direction as long as the first imaging unit and the second imaging unit image the measurement object from different directions.
  • the unit may image the measurement object from any direction.
  • the height of a measurement object may be obtained by an equation other than the equation (3) or the equation (4).
  • the second imaging unit is an imaging unit for imaging a component arranged in the component supply unit.
  • the present invention is not limited to this.
  • the second imaging unit may be an imaging unit other than the imaging unit that images a component disposed in the component supply unit.
  • the second imaging unit may be an imaging unit that images a component mounting position of the substrate.
  • a target mounting horizontal position (XY coordinates) which is a position in the horizontal direction that the head targets when lowering to mount the component at the component mounting position. The position) may be corrected by the control unit.
  • the measurement object is a component disposed in the component supply unit
  • the measurement object is the position where the position recognition mark is formed on the substrate and the substrate
  • the present invention is not limited to this.
  • the object to be measured may be other than the components disposed in the component supply unit, the formation position of the position recognition mark on the substrate, and the formation position of the wiring pattern on the substrate.
  • the height of the substrate is measured, only one of the formation position of the position recognition mark on the substrate and the formation position of the wiring pattern on the substrate may be the object to be measured.
  • the control unit when the control unit performs the setup change, the holding error of the component by the head occurs, and the target holding horizontal position correction value is equal to or more than the predetermined threshold value.
  • the control unit performs at least one of the following cases: when a setup change is performed, when a holding error of a part by the head occurs, and when the target holding horizontal position correction value is equal to or more than a predetermined threshold value. In one case, it may be configured to obtain the height of the part as the measurement object.
  • the control unit when the control unit performs a setup change, a measurement error occurs in the case where a component holding error occurs by the head, and the target holding horizontal position correction value is equal to or more than a predetermined threshold value, the measurement target It may be configured to obtain the height of the part as an object.
  • the control unit may be configured to acquire the height of the part as the measurement object for each holding operation of the part by the head.
  • the control unit may be configured to obtain the height of the component as the measurement object when the substrate is transported.
  • the control unit detects a predetermined point indicating a boundary between the electrode portion of the component and the mold portion on a predetermined side as the same feature of the component as the measurement object.
  • the present invention is not limited to this.
  • the control unit may detect a portion other than a predetermined point indicating a boundary portion between the electrode portion of the component and the mold portion on the predetermined side as the same feature point of the component as the measurement object.
  • the control unit determines the position recognition mark (the wiring pattern of the object) as the same feature point of the formation position of the position recognition mark on the substrate as the measurement object (the formation position of the wiring pattern on the substrate).
  • the control unit determines the position other than the corner of the position recognition mark (the wiring pattern of the object) as the same feature point of the formation position of the position recognition mark on the substrate as the measurement object The part may be detected.
  • the processing operation of the control unit has been described using a flow-driven flow chart in which processing is sequentially performed along the processing flow, but the present invention is limited to this. I can not.
  • the processing operation of the control unit may be performed by event-driven (event-driven) processing that executes processing on an event-by-event basis. In this case, the operation may be completely event driven, or the combination of event driving and flow driving may be performed.

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  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

Un dispositif de montage de composant (100) comprend : une tête (3a) qui maintient un composant (E) fourni par une unité d'alimentation en composant (11) et monte ledit composant sur un substrat (P) ; une première unité de capture d'image (7) qui capture une marque d'identification de position (F) appliquée au substrat ; une seconde unité de capture d'image (8) qui est fournie indépendamment de la première unité de capture d'image ; et une unité de commande (9) qui acquiert la hauteur d'un objet de mesure (12) sur la base d'une première image (13) de l'objet de mesure capturée par la première unité de capture d'image et une seconde image (14) de l'objet de mesure capturée par la seconde unité de capture d'image.
PCT/JP2017/026815 2017-07-25 2017-07-25 Dispositif de montage de composant WO2019021365A1 (fr)

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WO2021060065A1 (fr) * 2019-09-27 2021-04-01 パナソニックＩｐマネジメント株式会社 Système de montage, unité de tête et procédé d'imagerie
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