WO2019021365A1 - Component-mounting device - Google Patents

Abstract

A component-mounting device (100) comprises: a head (3a) that holds a component (E) supplied from a component supply unit (11) and mounts said component on a substrate (P); a first image pick-up unit (7) that picks up a position identification mark (F) applied to the substrate; a second image pick-up unit (8) that is provided independently of the first image pick-up unit; and a control unit (9) that acquires the height of a measurement object (12) on the basis of a first image (13) of the measurement object picked up by the first image pick-up unit and a second image (14) of the measurement object picked up by the second image pick-up unit.

Description

Component mounting device

The present invention relates to a component mounting apparatus, and more particularly to a component mounting apparatus for acquiring the height of a measurement object.

BACKGROUND Conventionally, there is known a component mounting apparatus for acquiring the height of an object to be measured. Such a component mounting apparatus is disclosed in Japanese Patent Application Laid-Open No. 2012-142347.

Japanese Patent Application Laid-Open No. 2012-142347 discloses an electronic component mounting apparatus (component mounting apparatus) that acquires the height of an electronic component disposed in a feeder as the height of a measurement object. The electronic component mounting apparatus is configured to obtain the height of the object to be measured by a laser displacement meter.

JP, 2012-142347, A

Here, in the configuration using a laser displacement meter as in the electronic component mounting apparatus described in the above-mentioned JP 2012-142347 A, when the mounting accuracy of the laser displacement meter is poor or the mounting position of the laser displacement meter is elapsed with time In the case of a sudden change, the mounting position of the laser displacement gauge may deviate from the normal position. In this case, the irradiation position of the laser beam irradiated from the laser displacement meter deviates from the normal position.

When measuring the height of a small measurement object such as a microminiature electronic component, if the irradiation position of the laser light deviates from the normal position, it is difficult to accurately apply the laser light to the small measurement object. For this reason, the laser displacement meter may not be able to accurately measure the height of a small measurement object. In this respect, there is room for improvement in the electronic component mounting apparatus described in the above-mentioned JP-A-2012-142347.

The present invention has been made to solve the problems as described above, and one object of the present invention is to provide a component mounting apparatus capable of accurately measuring the height of a small measurement object. To provide.

A component mounting apparatus according to one aspect of the present invention includes a head for holding a component supplied from a component supply unit and mounting the component on a substrate, a first imaging unit for imaging a position recognition mark attached to the substrate, and A measurement target based on a second imaging unit provided separately from the imaging unit, a first captured image of the measurement target by the first imaging unit, and a second captured image of the measurement target by the second imaging unit And a control unit for acquiring the height of the object.

In the component mounting device according to one aspect of the present invention, as described above, the control unit performs the first captured image of the measurement object by the first imaging unit and the second captured image of the measurement object by the second imaging unit. To obtain the height of the measurement object. Here, since both the first imaging unit and the second imaging unit can image a wide range to some extent, the mounting positions of the first imaging unit and the second imaging unit are slightly deviated from the normal position. Even in this case, it is possible to image the measurement object. Therefore, as described above, a small measurement object is obtained by acquiring the height of the measurement object based on the first and second captured images of the measurement object by the first and second imaging units. Even the height can be measured accurately. In addition, since the height measurement of the measurement object can be performed using the first imaging unit that images the position recognition mark, the height measurement of the measurement object is performed at least for the first imaging unit. It is possible to suppress an increase in the number of parts.

In the component mounting apparatus according to the above aspect, preferably, the first imaging unit is configured to image the measurement object from substantially vertically above, and the second imaging unit has a telecentric optical system and is oblique. It is comprised so that a measurement target may be imaged from upper direction. According to this configuration, based on the first captured image, which is an image obtained by capturing the measurement object from approximately vertically above, and the second captured image, which is an image obtained by capturing the measurement object from diagonally above, The height of the object to be measured can be obtained.

In this case, preferably, the control unit is configured to obtain the height of the measurement object according to the following equation (1).
H = S / sin θ-T / tan θ (1)
here,
H: height S of the measurement object: real space distance T corresponding to the distance from the center line to the measurement object position in the second image: corresponding to the distance from the center line to the measurement object position in the first image Real space distance θ: the angle of the optical axis of the second imaging unit with respect to the vertical direction.

With this configuration, there is no need to perform an excessively complicated process in order to acquire the height of the measurement object, and the height of the measurement object is simple and reliable by the simple equation (1) described above. It can be acquired.

In the configuration for acquiring the height of the measurement object according to the above equation (1), preferably, the control unit is configured to acquire the height of the measurement object according to the following equation (2).
H = (Scale-c) x h = (Scale-c) x s / sin θ-t / tan θ (2)
here,
Scale-c: Conversion coefficient h for converting a distance in pixel units to a distance in physical units h: height of measurement object in pixel units s: distance in pixel units from the center line to the measurement target position in the second captured image t: The distance in pixel units from the center line to the measurement target position in the first captured image.

With this configuration, even when acquiring the height of the measurement object using two imaging systems, the height of the measurement object can be acquired with only one conversion coefficient. The process for acquiring the height can be performed more easily.

Preferably, in the component mounting apparatus according to the above aspect, the second imaging unit is an imaging unit that images at least one of a component disposed in the component supply unit and a component mounting position of the substrate. According to this structure, the height measurement of the object to be measured is performed using the part arranged in the part supply unit and the second imaging unit for imaging at least one of the component mounting positions of the substrate. Since the measurement can be performed, it is possible to further suppress the increase in the number of parts in order to measure the height of the measurement object.

In the component mounting apparatus according to the above aspect, the position is preferably a position where the position recognition mark is formed on the substrate or a position where the wiring pattern is formed on the substrate. Here, the position recognition mark and the wiring pattern are both characteristic and easy to recognize in the substrate. Therefore, if configured as described above, the height of the substrate is easily obtained based on the first captured image and the second captured image of the formation position of the position recognition mark on the substrate or the formation position of the wiring pattern on the substrate. can do. In this case, if the target mounting height position of the head at the time of mounting the component on the substrate is corrected based on the acquired height of the substrate, the mounting of the component on the substrate by the head can be performed with high accuracy.

In the component mounting apparatus according to the above aspect, preferably, the object to be measured is a component disposed in the component supply unit. According to this structure, the height of the component disposed in the component supply unit can be easily obtained based on the first and second captured images of the component disposed in the component supply unit. In this case, if the target holding height position of the head at the time of holding the component from the component supply unit is corrected based on the acquired height of the component, the component can be held accurately from the component supply unit by the head. be able to.

In the component mounting apparatus according to the above aspect, preferably, the object to be measured is a component disposed in the component supply unit, and the control unit is configured to perform a setup change, and a holding error of the component by the head is When at least one of the cases occurs, the first imaging unit and the second imaging unit perform control of imaging the component as the measurement object, and the first captured image of the component as the measurement object and the first (2) While acquiring a captured image, it is configured to obtain the height of a part as a measurement object based on the acquired first and second captured images. According to this configuration, when the height of the part disposed in the part supply unit is considered to have changed due to the implementation of the setup change, the height of the part as the object to be measured is reacquired. it can. In addition, when the height of the part as the measuring object currently acquired is considered to be an inappropriate value because the holding error of the part by the head occurred, the height of the part as the measuring object is acquired It can be done again. That is, the height of the part as the object to be measured can be reacquired at an appropriate timing.

In the configuration in which the second imaging unit picks up an image of a component arranged in the component supply unit, preferably, the measurement object is a component arranged in the component supply unit, and the second imaging unit is a component from diagonally above The control unit is configured to pick up an image of the component disposed in the supply unit, and the control unit causes the component disposed in the component supply unit to be displayed based on the captured image of the component disposed in the component supply unit by the second imaging unit. The controller is configured to acquire a target holding horizontal position correction value for correcting a target holding horizontal position, which is a position in the horizontal direction targeted by the head when moving down for holding. When the target holding horizontal position correction value is equal to or greater than a predetermined threshold value, the first imaging unit and the second imaging unit perform control of imaging a component as a measurement object, and the measurement object Of parts as It acquires the captured image and the second captured image, based on the first image and the second captured image acquired, and is configured to obtain the height of the component as a measuring object. Here, when acquiring the target holding horizontal position correction value based on the captured image of the part captured from diagonally above, assuming that the height of the part is a predetermined height, the target holding horizontal position correction value You need to get In this case, if the height of the part is different from the predetermined height, it is difficult to obtain the target holding horizontal position correction value accurately. Therefore, as described above, when the acquired target holding horizontal position correction value is greater than or equal to the predetermined threshold value, the target holding horizontal position can be obtained by acquiring the height of the part as the measurement object. Since the position correction value is excessively large, the height of the part as the object to be measured can be re-acquired when it is considered that the target holding horizontal position correction value is not an accurate value. As a result, it is possible to accurately acquire the target holding horizontal position correction value based on the height of the reacquired part.

In the component mounting device according to the above aspect, preferably, the control unit detects the same feature point of the measurement object in the first captured image and the second captured image, and the same feature of the detected measurement object The height of the point is configured to be acquired as the height of the measurement object. According to this structure, the height of the measurement object can be acquired only by acquiring the height of the same feature point of the measurement object detected from each of the first captured image and the second captured image. Therefore, the height of the object to be measured can be obtained by simple processing.

According to the present invention, as described above, it is possible to provide a component mounting apparatus capable of measuring the height of a small measurement object with high accuracy.

It is a figure which shows the whole structure of the component mounting apparatus of 1st and 2nd embodiment. It is a figure which shows the imaging state of the measurement object by the component mounting apparatus of 1st Embodiment, Comprising: (A) is a figure which shows the imaging state of the measurement object by a 1st imaging part, (B) is a FIG. 2 is a view showing an imaging state of a measurement object by an imaging unit. It is a figure which shows the captured image of the measurement object by the component mounting apparatus of 1st Embodiment, Comprising: (A) is a figure which shows the 1st captured image by a 1st imaging part, (B) is a 2nd imaging It is a figure which shows the 2nd captured image by a part. It is a figure for demonstrating the acquisition method of the height of a measurement object by the component mounting apparatus of 1st Embodiment. It is a figure for demonstrating the acquisition method of the height of a measurement object in, when the attachment angle of a 1st imaging part shifts | deviates. It is a flowchart for demonstrating an example of the height measurement process by the component mounting apparatus of 1st Embodiment. It is a flowchart for demonstrating an example of the height measurement process by the component mounting apparatus of 1st Embodiment. It is a top view for explaining a substrate. It is a figure which shows the captured image of the measurement object by the component mounting apparatus of 2nd Embodiment, Comprising: (A) is a figure which shows the 1st captured image by a 1st imaging part, (B) is a 2nd imaging It is a figure which shows the 2nd captured image by a part. It is a flowchart for demonstrating an example of the height measurement process by the component mounting apparatus of 2nd Embodiment. It is a figure which shows the head unit of the component mounting apparatus by the modification of 1st and 2nd embodiment.

Hereinafter, an embodiment of the present invention will be described based on the drawings.

First Embodiment
(Configuration of component mounting device)
First, with reference to FIG. 1 and FIG. 2, the whole structure of the component mounting apparatus 100 by 1st Embodiment of this invention is demonstrated.

The component mounting apparatus 100 is an apparatus which mounts components E (electronic components), such as IC, a transistor, a capacitor, and a resistance, on board | substrates P, such as a printed circuit board, as shown in FIG.

The component mounting apparatus 100 includes a base 1, a transport unit 2, a head unit 3, a support unit 4, a rail unit 5, a component imaging unit 6, a first imaging unit 7, and a second imaging unit 8. , And the control unit 9.

The base 1 is a base on which the components are arranged in the component mounting apparatus 100. On the base 1, a transport unit 2, a rail unit 5 and a component imaging unit 6 are provided. Further, in the base 1, a control unit 9 is provided. Further, in the base 1, arrangement portions 1 a capable of arranging the component supply portion 11 are provided on both sides in the Y direction (Y1 direction side and Y2 direction side).

The component supply unit 11 is a tape feeder that supplies components E to be mounted on the substrate P. Specifically, the component supply unit 11 holds a reel (not shown) around which a component supply tape (not shown) holding a plurality of components E is wound. Further, the component supply unit 11 is configured to supply the component E by rotating the held reel to send out the component supply tape according to the component holding operation for taking out the component E by the head unit 3. It is done. In the placement unit 1a, a plurality of component supply units 11 are arranged along the transport direction (X direction) of the substrate P.

The transport unit 2 is a device for transporting the substrate P in the transport direction (X direction). Specifically, the transport unit 2 carries in the substrate P before mounting from the outside of the component mounting apparatus 100, transports the substrate P in the transport direction, and carries out the mounted substrate P outside the component mounting apparatus 100. Is configured as. The transport unit 2 is configured to transport the carried-in substrate P to the mounting stop position M and to fix the substrate P at the mounting stop position M.

Moreover, the conveyance part 2 has a pair of conveyor part 2a. Each of the pair of conveyors 2a has a conveyor belt (not shown). The transport unit 2 is configured to transport, in the transport direction (X direction), the substrates P placed on the transport belts of the pair of conveyors 2 a by the transport belts of the pair of conveyors 2 a.

The head unit 3 is a head unit for component mounting, and is configured to mount the component E on the substrate P fixed at the mounting stop position M. The head unit 3 includes a plurality of heads (mounting heads) 3a arranged in a circle. The head unit 3 is a rotary type head unit in which a plurality of heads 3a are arranged in a circle. In the case of a rotary type head unit 103, the head 3a is rotationally moved to a position closest to the second imaging unit 8, and the second imaging unit 8 images a component E to be held (sucked) by the head 3a. Can. Further, the plurality of heads 3a arranged in a circular shape are configured to be rotatable around the center of the circle formed by the plurality of heads 3a. The plurality of heads 3a have substantially the same configuration.

The head 3 a is configured to hold (suck) the component E supplied from the component supply unit 11 and mount the component E on the substrate P. Specifically, the head 3a is connected to a vacuum generator (not shown), and holds the component E in a nozzle (not shown) attached to the tip by negative pressure supplied from the vacuum generator. It is configured to (adsorb). The head 3a is configured to mount the component E held by the nozzle on the substrate P by releasing the negative pressure supplied from the vacuum generating device. The head 3a is configured to be movable in the vertical direction (Z direction) by a drive mechanism (not shown). Thus, the head 3a is configured to be movable between a lowered position for holding (sucking) the component E or mounting the component E on the substrate P and a raised position for movement in the horizontal plane. It is done.

The support 4 supports the head unit 3 so as to be movable in the transport direction (X direction). Specifically, the support 4 includes a ball screw shaft 41 extending in the transport direction, and an X-axis motor 42 that rotates the ball screw shaft 41. The head unit 3 is provided with a ball nut (not shown) engaged with the ball screw shaft 41 of the support portion 4. The head unit 3 is configured to be movable in the transport direction along the support portion 4 together with the ball nut engaged with the ball screw shaft 41 by rotating the ball screw shaft 41 by the X-axis motor 42.

The pair of rail portions 5 is configured to support the support portion 4 movably in the Y direction orthogonal to the X direction in the horizontal plane. Specifically, the rail portion 5 includes a pair of guide rails 51 for movably supporting both end portions in the X direction of the support portion 4 in the Y direction, a ball screw shaft 52 extending in the Y direction, and a ball screw shaft 52. And a Y-axis motor 53 to be rotated. The support portion 4 is provided with a ball nut (not shown) engaged with the ball screw shaft 52 of the rail portion 5. The support portion 4 is configured to be movable in the Y direction along the pair of rail portions 5 together with the ball nut engaged with the ball screw shaft 52 by the rotation of the ball screw shaft 52 by the Y-axis motor 53 There is.

With such a configuration, the head 3 a of the head unit 3 is configured to be movable in the horizontal direction (X direction and Y direction) on the base 1. Thus, the head 3 a of the head unit 3 can move above the component supply unit 11 to hold (suck) the component E supplied from the component supply unit 11. Further, the head unit 3 can move to the upper side of the substrate P fixed at the mounting stop position M, and mount the held (sucked) component E on the substrate P.

The component imaging unit 6 is a camera for component recognition that captures an image of the component E held (sucked) by the head 3 a prior to the mounting of the component E on the substrate P by the head 3 a. The component imaging unit 6 is fixed on the upper surface of the base 1 and configured to image the component E held (sucked) by the head 3 a from below the component E (in the Z2 direction). The control unit 9 is configured to acquire (recognize) the suction state (rotational posture and suction position with respect to the head 3a) of the component E based on the captured image of the component E by the component imaging unit 6.

The first imaging unit 7 is a camera for substrate recognition that images a position recognition mark (fiducial mark) F attached to the upper surface of the substrate P prior to the mounting of the component E on the substrate P by the head 3a. The first imaging unit 7 is a camera for substrate recognition that has an application different from the application for photographing the measurement object 12 described later. The position recognition mark F is a mark for recognizing the position of the substrate P. As shown in FIG. 2A, the first imaging unit 7 is attached such that the optical axis 7a is oriented substantially along the vertical direction (Z direction), and imaging is performed from approximately vertically above (approximately directly above) It is configured to image an object. The first imaging unit 7 is provided in the head unit 3 and is configured to be movable in the horizontal direction together with the head unit 3. The control unit 9 is configured to acquire (recognize) the correct position and posture of the substrate P fixed at the mounting stop position M based on the captured image of the position recognition mark F by the first imaging unit 7 .

The second imaging unit 8 is a camera for component position recognition which picks up an image of the component E arranged in the component supply unit 11 prior to holding of the component E from the component supply unit 11 by the head 3a. The second imaging unit 8 is provided in the head unit 3 and is configured to be movable in the horizontal direction together with the head unit 3. In addition, the 2nd imaging part 8 is a camera for component position recognition which has a use different from the use which image | photographs the measurement target object 12 mentioned later. As shown in FIG. 2 (B), the second imaging unit 8 is attached such that the optical axis 8a is inclined with respect to the vertical direction, and is configured to image an object to be imaged from diagonally above It is done. The second imaging unit 8 also has a telecentric optical system in which the chief ray is parallel to the optical axis 8a. Based on the captured image of the component E disposed in the component supply unit 11 by the second imaging unit 8, the control unit 9 causes the head 3a to move downward to hold the component E disposed in the component supply unit 11. It is configured to correct a target holding horizontal position (XY coordinate position) which is a position in the target horizontal direction. The control unit 9 moves the second imaging unit 8 to a position where the component E to be taken out by the head 3a can be imaged immediately before holding (suction) the component E by the head 3a every time holding (suction) the component E The second imaging unit 8 captures an image of the storage portion (pocket) of the component supply tape that stores the component E and the component E, and acquires a target holding horizontal position correction value for correcting the target holding horizontal position. It is configured. In addition, the control unit 9 corrects the target holding horizontal position of the head 3a (that is, the target holding horizontal position of the nozzle) based on the acquired target holding horizontal position correction value, and controls to lower the nozzle of the head 3a. Is configured to do. If the correction is not in time, correction may be made in the case where the component E is taken out next from the component supply unit 11 (tape feeder) that supplies the same component E without correction in the imaged component E.

The control unit 9 is a control circuit that controls an operation of the component mounting apparatus 100, including a central processing unit (CPU), a read only memory (ROM), and a random access memory (RAM). The control unit 9 mounts the component E on the substrate P by the head 3 a of the head unit 3 by controlling the transport unit 2, the component supply unit 11, the X-axis motor 42, the Y-axis motor 53 and the like according to the production program. Is configured as.

(Configuration for measuring the height of the object to be measured)
Here, in the first embodiment, as shown in FIGS. 2A and 2B, in the case where the control unit 9 measures the height of the measurement object 12, the first imaging unit 7 and the second imaging unit 8 Thus, control for imaging the measurement object 12 is performed. The height of the measurement object 12 means the height position of the measurement object 12 in the coordinate system set in the component mounting apparatus 100.

In the first embodiment, the measurement object 12 is the component E disposed in the component supply unit 11.

A first captured image 13 (see FIG. 3A) of the measurement object 12 by the first imaging unit 7 is an image obtained by copying the entire part E and the periphery of the part E from substantially vertically above the part E . The first captured image 13 includes the upper surface of the part E indicating the height of the part E. Further, the second captured image 14 (see FIG. 3B) of the measurement object 12 by the second imaging unit 8 is an image obtained by copying the entire part E and the periphery of the part E from diagonally above the part E. The second captured image 14 includes the upper surface of the part E indicating the height of the part E and the side surface of the part E.

And as shown to FIG. 3 (A) (B) and FIG. 4, the control part 9 is a 1st captured image 13 of the measurement object 12 by the 1st imaging part 7, and the measurement object by the 2nd imaging part 8 The height of the measurement object 12 is acquired by stereo matching based on the second captured image 14 of the object 12.

Then, based on the acquired height of the component E as the measurement object 12, the control unit 9 targets the head 3a when moving down to hold the component E disposed in the component supply unit 11. The target holding height position (Z coordinate position), which is the position in the vertical direction, is configured to be corrected.

Further, in the first embodiment, as shown in FIGS. 3A and 3B, the control unit 9 determines whether the measurement object 12 (part E) in the first captured image 13 and the second captured image 14 is the same. The feature point 12 a is detected, and the height of the same feature point 12 a of the detected measurement object 12 is acquired as the height of the measurement object 12.

Specifically, the control unit 9 detects the same feature point 12 a of the measurement object 12 (part E) in the first captured image 13 and the second captured image 14 based on the lightness (pixel value) in the image. It is configured to For example, the control unit 9 detects the side E1 of the top surface of the measurement object 12 (part E) on the far side as viewed from the imaging direction by the second imaging unit 8 as the same feature point 12a. Here, not only the upper surface but also the side surface of the measurement object 12 (part E) is reflected in the second captured image 14, and therefore, they are close to each other on the side closer to the imaging direction by the second imaging unit 8. There are multiple sides at the same position. Therefore, if the side of the top surface of the measurement object 12 (part E) on the side closer to the image pickup direction by the second imaging unit 8 is the feature point 12a, the feature point 12a is easily erroneously detected. Therefore, as described above, by detecting the side E1 of the upper surface of the measurement object 12 (part E) on the far side as viewed from the imaging direction by the second imaging unit 8, erroneous detection is suppressed and the second imaging is performed. It is possible to detect the feature point 12a in the image 14 with high accuracy. Further, in this case, the control unit 9 is configured to detect, as the same feature point 12a, a predetermined point E4 in the side E1 that indicates a boundary between the electrode portion E2 of the component E and the mold portion E3. Thereby, it is possible to easily detect a characteristic portion having a large difference in lightness as the same feature point 12a.

Further, in the first embodiment, as shown in FIG. 4, the control unit 9 sets the height of the measurement object 12 (part E) according to the following equation (3) to the same feature points 12 a of the measurement object 12. Is configured to get the height of the.
H = S / sin θ-T / tan θ (3)
here,
H: height S of the measurement object of the physical unit: real space distance T corresponding to the distance from the center line to the measurement object position in the second image: distance from the center line to the measurement object position in the first image The distance θ of the real space corresponding to :: an angle of the optical axis of the second imaging unit with respect to the vertical direction.

The distance S is incident on the second imaging unit 8 through the center line of the real space (the line perpendicular to the page through the point B in FIG. 4) corresponding to the center line 14a passing the imaging center of the second captured image 14 It can be said that the distance from the light beam (light beam 15c to be described later) to the light beam (light beam 15d to be described later) incident on the second imaging unit 8 through the measurement target position in real space. The distance S is a value acquired by the control unit 9 as a distance in physical units based on the distance in pixel units from the center line 14 a of the second captured image 14 to the feature point 12 a. In addition, the distance T is incident on the first imaging unit 7 through the center line of the real space (the line perpendicular to the page through the point B in FIG. 4) corresponding to the center line 13a passing the imaging center of the first captured image 13 It can be said that the distance from the light beam (light beam 15a to be described later) to the light beam (light beam 15b to be described later) incident on the first imaging unit 7 through the measurement target position in real space. The distance T is a value acquired by the control unit 9 as a physical unit distance based on the distance in pixel units from the center line 13a passing the imaging center of the first captured image 13 to the feature point 12a. In addition, the angle θ is a mounting angle of the second imaging unit 8 and is a known value (for example, 30 degrees).

As shown in FIG. 4, a line 15a (a first imaging unit 7 center) indicating a light ray incident on the first imaging unit 7 through a center line of the real space corresponding to the center line 13a, and a first characteristic point 12a Indicates a ray incident on the second imaging unit 8 through a line 15 b (a feature point 12 a viewed from the first imaging unit 7) indicating a ray incident on the imaging unit 7 and a center line of the real space corresponding to the center line 14 a A line 15c (second imaging unit 8 center) and a line 15d (feature point 12a viewed from the second imaging unit 8) indicating a light beam passing through the feature point 12a and incident on the second imaging unit 8 are defined. In this case, the height H of the feature point 12a relative to the reference height is the length a of the line segment AB represented by S / sinθ and the line segment BC represented by T / Tanθ based on the geometrical relationship. It can be expressed by the difference with the length b of (i.e., equation (3)).

In addition, when the first imaging unit 7 has the attachment angle α due to an attachment error or the like, as shown in FIG. 5, the control unit 9 determines the measurement object 12 (part E by the following equation (4) Is configured to obtain the height of the same feature point 12a of the measurement object 12 as the height of.
H = S × cos α / sin (θ + α) −T × {cos α / tan (θ + α) + sin θ} (4)

Note that the angle α is an angle of the optical axis 7a of the first imaging unit 7 with respect to the vertical direction, and is a known value.

As shown in FIG. 5, a line 16a (first imaging unit 7 center) indicating a light beam entering the first imaging unit 7 through the center line 13a and a light beam entering the first imaging unit 7 through the feature point 12a A line 16b (feature point 12a seen from the first imaging unit 7), a line 16c (second imaging unit 8 center) showing a light ray incident on the second imaging unit 8 through the center line 14a, and the feature point 12a And a line 16d (a feature point 12a viewed from the second imaging unit 8) indicating a light beam incident on the second imaging unit 8, two auxiliary lines 16e and 16f extending along the vertical direction, and a horizontal passing through the feature point 12a Define an auxiliary line 16g inclined by an angle α with respect to the direction. In this case, the length c of the line segment DE is represented by T / cos (θ + α) −T. Further, the length d of the line segment EF is represented by T × tan α. Further, the length e of the line segment FG is represented by b / tan (θ + α) -c. The height H of the feature point 12a with respect to the reference height can be expressed by e × cos α (that is, equation (4)).

If the angle α is sufficiently small, the height H can be obtained by the equation (3). For example, when the angle α is 1 degree or less, it is possible to obtain the height H by the equation (3).

Furthermore, the control unit 9 first obtains the distance S and the distance T as the distance in pixel units (s and t, respectively), and at the same time, obtains the distance s and the distance t obtained as the distances in pixel units Or it is comprised so that it may substitute to Formula (4). Thus, the control unit 9 is configured to acquire the height h of the same feature point 12 a of the measurement object 12 in units of pixels.

Further, the control unit 9 converts the height h (pixel) of the same feature point 12 a of the measurement object 12 in pixel units into the height H (μm) of the physical unit of the length by the following equation (5) It is configured to Essentially, in two different imaging systems, although the conversion coefficients (Scale-a and Scale-b described later) are different from each other, the second imaging unit 8 is a telecentric optical system, and the angle of view of the first imaging unit 7 is a predetermined When the angle of view or less (about 4 degrees or less), if the height is in the range of about 1 mm, it is possible to handle the conversion coefficient as one conversion coefficient as shown in equation (5).
H = (Scale-c) x h = (Scale-c) x s / sin θ-t / tan θ (5)
here,
Scale-c: Conversion factor (μm / pixel) to convert distance in pixels to distance in physical units
h: height of the measurement object in pixel units s: distance in pixel units from the center line to the measurement target position in the second captured image t: distance in pixel units from the center line to the measurement target position in the first captured image is there.
That is, S = (Scale-c) × s, and T = (Scale-c) × t.

Specifically, a certain height H1 (for example, 1 mm) and a reference height H0 can be represented by the following equations (6) and (7), respectively.
H1 = (Scale-a) × s1 / sin θ- (Scale-b) × t1 / tan θ (6)
H0 = (Scale-a) × s0 / sin θ− (Scale−b) × t0 / tan θ (7)
here,
s1: distance s (pixel) at a certain height H1
t1: distance t (pixel) at a certain height H1
s0: distance s (pixel) at reference height H0
t0: distance t (pixel) at reference height H0
It is.

Further, assuming that t1 and t0 are substantially equal (t1 ≒ t0), the height H of the physical unit can be expressed by the following approximate expression (8). In the first captured image 13 which is an image obtained by capturing the measurement object 12 from substantially vertically above, the number of pixels constituting the distance T does not change significantly even if the height of the part E changes a little, so t1 easily. It is possible to obtain an approximation condition of tt0.
H = (H1-H0) = Scale-a x (s1-s0) / sinθ (8)

Further, when Expression (8) is transformed, Scale-c can be expressed by the following Expression (9).
Scale-c = Scale-a = H × sin θ / (s 1 −s 0) (9)

Therefore, if s1 and s0 are obtained under the condition that H is known (ie, H0 and H1 are known) (for example, the condition of H = 1 mm), it is possible to obtain Scale-c. Thereby, it is possible to easily convert the height h in pixel units to the height H in physical units.

In the first embodiment, the control unit 9 performs the first imaging unit 7 and the second imaging unit 7 when a setup change is performed, and when a holding (suction) error of the component E by the head 3 a occurs. 8 performs control of imaging the measurement object 12 (part E), acquires the first captured image 13 and the second captured image 14 of the measurement object 12, and obtains the acquired first captured image 13 and second imaging The height of the measurement object 12 is configured to be acquired based on the image 14. That is, the control unit 9 is configured to re-acquire the height of the measurement object 12 when the setup change is performed and when a holding error of the component E by the head 3 a occurs.

The case where the setup change is performed is, for example, the case where the component supply unit 11 is replaced, the case where the reel held by the component supply unit 11 is replaced, or the like. Further, when a holding error of the component E by the head 3a occurs, for example, the head 3a is lowered to hold the component disposed in the component supply unit 11, but holding the component E by the head 3a If you can not Further, the case where a holding error of the part E by the head 3a occurs may be a case where a holding error occurs once, or a case where a holding error occurs a plurality of times (for example, three times) continuously.

Further, in the first embodiment, the control unit 9 assumes that the height of the component E disposed in the component supply unit 11 is the height of the component E measured by the height measurement, and thus the target holding horizontal A target holding horizontal position correction value for correcting the position is configured to be acquired.

Then, the control unit 9, the target holding horizontal position correction value, when the predetermined threshold value Th ₁ or more predetermined, the measuring object by the first image pickup unit 7 and the second imaging unit 8 12 (part E) Control to pick up an image to obtain the first and second captured images 13 and 14 of the measurement object 12, and based on the obtained first and second captured images 13 and 14, the measurement object The height of the object 12 is configured to be acquired. That is, the control unit 9, the target holding horizontal position correction value, when the predetermined threshold value Th ₁ or more, and is configured to re-acquire the height of the measurement object 12. On the other hand, the control unit 9, the target holding horizontal position correction value, if it is below a predetermined threshold Th ₁ is configured so as not to perform the acquired again control the height of the measurement object 12 . The predetermined threshold value Th ₁ is a value for the target holding horizontal position correction value obtained to determine whether not excessive.

The control unit 9, the target holding horizontal position correction value, even if the predetermined threshold value Th ₁ or more, and the height of the currently acquired measurement object 12, the measurement object was last acquired 12 the difference between the height of the case is predetermined a predetermined threshold value Th ₂ or more, the height of the measurement object 12, the height of the acquired current measurement object 12 (part E) It is configured to update. On the other hand, the control unit 9, a case where a predetermined threshold value Th ₁ or more, the difference between the height of the measurement object 12, which is obtained this time, the height of the measurement object 12 obtained in the previous time, the predetermined If it is less than the threshold value Th ₂ of is configured to perform control to notify the abnormality of the horizontal position of the disposed in the component supply section 11 part E. The predetermined threshold value Th _2, the height of the measurement object 12, which is obtained this time is, the height of the measurement object 12 obtained in the previous time, in order to determine whether the changes significantly Is the value of

Next, with reference to FIG. 6, an example of the height measurement process by the component mounting apparatus 100 of the first embodiment will be described based on a flowchart. Specifically, the process of measuring the height of the component E will be described with reference to FIG. 6 when the setup change is performed or a holding (suction) error of the component E by the head 3a occurs. Each process of the flowchart is performed by the control unit 9.

As shown in FIG. 6, first, in step S1, it is determined whether or not the height measurement of the measurement object 12 (the part E disposed in the part supply unit 11) is to be performed. That is, in step S1, it is determined whether or not the setup change has been performed, and whether a holding (suction) error of the component E by the head 3a has occurred. If it is determined that the height measurement of the measurement object 12 is not to be performed, the height measurement process is ended.

When it is determined in step S1 that the height measurement of the measurement object 12 is to be performed, the process proceeds to step S2.

Then, in step S2, control is performed to move the first imaging unit 7 to the imaging position of the measurement object 12 (part E). Then, the measurement object 12 is imaged by the first imaging unit 7.

Then, in step S3, the first captured image 13 by the first imaging unit 7 is acquired.

Then, in step S4, control is performed to move the second imaging unit 8 to the imaging position of the measurement object 12 (part E). Then, the measurement object 12 is imaged by the second imaging unit 8. Either of the imaging of the measurement object 12 by the first imaging unit 7 and the imaging of the measurement object 12 by the second imaging unit 8 may be performed first.

Then, in step S5, the second captured image 14 by the second imaging unit 8 is acquired.

Then, in step S6, the same feature points 12a of the measurement object 12 (part E) in the first captured image 13 and the second captured image 14 are detected based on the lightness in the image.

Then, in step S7, the height of the measurement object 12 is acquired based on the first captured image 13 and the second captured image 14. Specifically, the height of the same feature point 12 a of the detected measurement object 12 is acquired as the height of the measurement object 12 according to the above-described expression (3) or expression (4).

Then, in step S8, the target holding height position (Z coordinate position) is corrected based on the height of the measurement object 12. Thereafter, the height measurement process is ended.

Next, referring to FIG. 7, an example of the height measurement process by the component mounting apparatus 100 according to the first embodiment will be described based on a flowchart. Specifically, with reference to FIG. 7, height measurement processing of the part E in the case where the target holding horizontal position correction value is equal to or more than a predetermined threshold value Th ₁ will be described. The target holding horizontal position correction value is acquired for each holding operation of the component E by the head 3a. Therefore, the process of the flowchart shown in FIG. 7 is performed for each holding operation of the part E by the head 3a. Further, each process of the flowchart is performed by the control unit 9.

As shown in FIG. 7, first, in step S11, the target holding horizontal position correction value, whether the predetermined threshold value Th ₁ or more is determined. Target holding horizontal position correction value, when it is determined to be less than the predetermined threshold value Th _1, the height measurement process is terminated.

Further, in step S11, when the target holding horizontal position correction value is determined to be a predetermined threshold value Th ₁ or more, the process proceeds to step S12. Then, in the processes of steps S12 to S17, the same processes as the processes of steps S2 to S7 shown in FIG. 6 are performed.

Then, in step S18, the difference between the height of the measurement object 12 (part E disposed in the component supply unit 11) acquired this time and the height of the measurement object 12 acquired last time is a predetermined threshold value It is determined whether it is Th ₂ or more.

Since in step S18, if the difference between the height is determined to be a predetermined threshold value Th ₂ or more, the height of the measurement object 12 from the time of previous measurement is considered to have changed significantly, the step Go to S19.

Then, in step S19, the height of the measurement object 12 is updated to the height of the measurement object 12 (part E) acquired this time. As a result, in the holding operation of the part E by the next head 3a, it is assumed that the height of the part E disposed in the part supply unit 11 is the height of the updated measurement object 12 (part E), An accurate target hold horizontal position correction value is obtained.

Then, in step S20, the target holding height position (Z coordinate position) is corrected based on the height of the updated measurement object 12 (part E). Thereafter, the height measurement process is ended.

Further, in step S18, if the difference between the height is determined to be below a predetermined threshold Th ₂ is also the height of the measurement object 12 from the time of previous measurement has not changed significantly Regardless, it is considered that the target holding horizontal position correction value is an excessive value. That is, it is considered that the position in the horizontal direction of the component E disposed in the component supply unit 11 is actually largely displaced from the normal position. For this reason, the process proceeds to step S21, and in step S21, control is performed to notify of an abnormality in the position of the component E arranged in the component supply unit 11 in the horizontal direction. Thereafter, the height measurement process is ended.

(Effect of the first embodiment)
In the first embodiment, the following effects can be obtained.

In the first embodiment, as described above, the control unit 9 controls the first captured image 13 of the measurement object 12 (part E) by the first imaging unit 7 and the measurement object 12 by the second imaging unit 8 ( The height of the measurement object 12 (part E) is acquired based on the second captured image 14 of the part E). Here, since the first imaging unit 7 and the second imaging unit 8 are both capable of imaging a wide range to some extent, the attachment positions of the first imaging unit 7 and the second imaging unit 8 are slightly deviated from the regular position. Even in the case, it is possible to image the measurement object 12 (part E). Therefore, as described above, based on the first captured image 13 and the second captured image 14 of the measurement object 12 (part E) by the first imaging unit 7 and the second imaging unit 8, the measurement object 12 (part E By acquiring the height of), the height can be accurately measured even with a small measurement object 12 (part E). In addition, since the height measurement of the measurement object 12 (part E) can be performed using the first imaging unit 7 that images the position recognition mark F, the height measurement of the measurement object 12 (part E) It is possible to suppress an increase in the number of parts in order to

Further, in the first embodiment, as described above, the first imaging unit 7 is configured to image the measurement object 12 (part E) from substantially vertically above. Then, the second imaging unit 8 is configured to have a telecentric optical system and to image the measurement object 12 (part E) from diagonally above. Thereby, a first captured image 13 which is an image obtained by capturing the measurement target 12 (part E) from substantially vertically above, and a second captured image 14 which is an image obtained by capturing the measurement target 12 (part E) from diagonally above And the height of the measurement object 12 (part E) can be easily obtained.

Further, in the first embodiment, as described above, the control unit 9 is configured to acquire the height of the measurement object 12 (part E) according to the above-mentioned equation (3). As a result, there is no need to perform excessively complicated processing in order to obtain the height of the measurement object 12 (part E), and according to the simple equation (3) described above, the measurement object 12 (part E) The height can be acquired easily and reliably.

Further, in the first embodiment, as described above, the control unit 9 is configured to obtain the height of the measurement object 12 (part E) by the above equation (5). Thereby, even when acquiring the height of the measurement object 12 (part E) using two imaging systems, acquiring the height of the measurement object 12 (part E) with only one conversion coefficient Since it can do, the process for acquiring the height of the measurement object 12 (part E) can be performed more easily.

In the first embodiment, as described above, the second imaging unit 8 is an imaging unit that images the component E disposed in the component supply unit 11. As a result, since the height measurement of the measurement object 12 (component E) can be performed using the second imaging unit 8 that images the component E disposed in the component supply unit 11, the measurement object 12 ( In order to measure the height of the part E), the increase in the number of parts can be further suppressed.

In the first embodiment, as described above, the measurement object 12 is the component E disposed in the component supply unit 11. Thus, the height of the component E disposed in the component supply unit 11 can be easily obtained based on the first captured image 13 and the second captured image 14 of the component E disposed in the component supply unit 11. . In this case, the component by the head 3 a is corrected by correcting the target holding height position (Z coordinate position) of the head 3 a at the time of holding the component E from the component supply unit 11 based on the acquired height of the component E. The component E can be held from the supply unit 11 with high accuracy.

In the first embodiment, as described above, the first imaging unit 7 and the second imaging unit 7 perform the setup change of the control unit 9 and the holding error of the component E by the head 3a. The imaging unit 8 controls the imaging of the component E as the measurement object 12, and acquires the first imaging image 13 and the second imaging image 14 of the component E as the measurement object 12, and the acquired first imaging Based on the image 13 and the second captured image 14, the height of the component E as the measurement object 12 is acquired. Thereby, when it is considered that the height of the component E disposed in the component supply unit 11 has changed due to the implementation of the setup change, the height of the component E as the measurement object 12 is acquired again. it can. In addition, when it is considered that the height of the part E as the currently obtained measurement object 12 is not an appropriate value because a holding error of the part E by the head 3a occurs, the part as the measurement object 12 You can get the height of E again. That is, the height of the part E as the measurement object 12 can be reacquired at an appropriate timing.

In the first embodiment, as described above, the control unit 9 corrects the target holding horizontal position based on the captured image of the part E disposed in the component supply unit 11 by the second imaging unit 8. The target holding horizontal position correction value is acquired. Then, when the target holding horizontal position correction value obtained by the control unit 9 is equal to or greater than a predetermined threshold value Th ₁ determined in advance, the measurement object by the first imaging unit 7 and the second imaging unit 8 Control for imaging the component E as 12 is performed, and the first captured image 13 and the second captured image 14 of the component E as the measurement object 12 are acquired, and the acquired first captured image 13 and the second captured image It is configured to acquire the height of the part E as the measurement object 12 on the basis of. Here, when acquiring the target holding horizontal position correction value based on the captured image of the part E captured from diagonally above, assuming that the height of the part E is a predetermined height, the target holding horizontal position It is necessary to obtain the correction value. In this case, if the height of the part E is different from the assumed predetermined height, it is difficult to accurately obtain the target holding horizontal position correction value. Therefore, as described above, the target holding horizontal position correction value acquired, if the predetermined threshold value Th ₁ or more, if configured to obtain the height of the component E as the measurement object 12 Since the target holding horizontal position correction value is excessively large, the height of the part E as the measurement object 12 can be reacquired when it is considered that the target holding horizontal position correction value is not an accurate value. As a result, the target holding horizontal position correction value can be accurately acquired based on the height of the part E reacquired.

In the first embodiment, as described above, the control unit 9 detects the same feature points 12 a of the measurement object 12 (part E) in the first captured image 13 and the second captured image 14 as described above. The height of the same feature point 12a of the detected measurement object 12 (part E) is obtained as the height of the measurement object 12 (part E). Thereby, only by acquiring the height of the same feature point 12a of the measurement object 12 (part E) detected from each of the first captured image 13 and the second captured image 14, the measurement object 12 (part E) The height of the measurement object 12 (part E) can be obtained by simple processing.

Second Embodiment
Next, a second embodiment will be described with reference to FIG. 1 and FIGS. 8 to 10. In the second embodiment, an example in which the object to be measured is a substrate will be described, unlike the first embodiment in which the object to be measured is a component disposed in a component supply unit. About the same composition as the 1st embodiment of the above, the same numerals are attached and illustrated in the figure, and the explanation is omitted.

(Configuration of component mounting device)
The component mounting apparatus 200 according to the second embodiment of the present invention differs from the component mounting apparatus 100 according to the first embodiment in that a control unit 109 is provided as shown in FIG.

In the second embodiment, the measurement object 12 is a substrate P. Specifically, as shown in FIG. 8, the measurement object 12 is the formation position of the position recognition mark F on the substrate P and the formation position of the wiring pattern W on the substrate P.

The control unit 109 is configured to acquire the height of the measurement object 12 (substrate P), as in the first embodiment. That is, as shown in FIGS. 9A and 9B, the control unit 109 controls the first captured image 113 of the measurement object 12 by the first imaging unit 7 and the measurement object 12 by the second imaging unit 8. The height of the measurement object 12 is acquired by stereo matching based on the second captured image 114. The first captured image 113 is an image obtained by copying the entire position recognition mark F (the wiring pattern W of interest) and the periphery thereof from substantially vertically above the substrate P. The first captured image 113 includes the upper surface of the substrate P indicating the height of the substrate P. In FIG. 9A, the distance T is the distance of the real space corresponding to the distance from the center line 113a passing the imaging center of the first pickup image 113 in the first pickup image 113 to the feature point 12a. Further, the second captured image 114 is an image in which the entire position recognition mark F (the wiring pattern W of interest) and the periphery thereof are photographed from diagonally above the substrate P. The second captured image 114 includes the upper surface of the substrate P indicating the height of the substrate P. In FIG. 9B, the distance S is a distance in real space corresponding to the distance from the center line 114a passing through the imaging center of the second pickup image 114 in the second pickup image 114 to the feature point 12a.

When the formation position of the position recognition mark F on the substrate P (the formation position of the wiring pattern W on the substrate P) is imaged, for example, the control unit 109 determines the position recognition mark F (target wiring pattern) as the same feature point 12a. The corner F1 (W1) of W) is detected. Thereby, it is possible to easily detect a portion having a large difference in lightness as the same feature point 12a. Further, as in the first embodiment, the control unit 109 is configured to acquire the height of the same feature point 12 a of the detected measurement object 12 as the height of the measurement object 12.

Furthermore, in the second embodiment, the control unit 109 acquires the heights of the plurality of positions on the measurement object 12 (substrate P), and based on the heights of the plurality of positions on the acquired measurement object 12 , It is comprised so that the curvature state of the whole measurement object 12 may be acquired. As shown in FIG. 8, for example, the control unit 109 determines the heights of the formation positions of the plurality (two) of position recognition marks F on the substrate P and the formation positions of the plurality (three) of wiring patterns W on the substrate P. Get the Then, the control unit 109 acquires the warping state of the entire substrate P based on the heights of the plurality (five) of positions in the acquired substrate P.

In addition, the control unit 109 moves the head to mount the component E at the component mounting position of the substrate P based on the acquired warping state (height) of the substrate P as the measurement object 12. It is configured to correct a target mounting height position (Z coordinate position), which is a position in the vertical direction to be a target 3a.

Next, with reference to FIG. 10, an example of height measurement processing by the component mounting apparatus 200 of the second embodiment will be described based on a flowchart. Specifically, with reference to FIG. 10, height measurement processing of the substrate P after the loading of the substrate P and before mounting will be described. Each process in the flowchart is performed by the control unit 109.

As shown in FIG. 10, first, in step S31, from among the formation positions of the plurality (two) of position recognition marks F on the substrate P and the formation positions of the plurality (three) of wiring patterns W on the substrate P The measurement object 12 to be measured is determined.

Then, in step S32, control is performed to move the first imaging unit 7 to the imaging position of the determined measurement object 12 (the formation position of the position recognition mark F or the formation position of the wiring pattern W). Then, the measurement object 12 is imaged by the first imaging unit 7.

Then, in step S33, the first captured image 113 by the first imaging unit 7 is acquired.

Then, in step S34, control is performed to move the second imaging unit 8 to the imaging position of the determined measurement object 12 (the formation position of the position recognition mark F or the formation position of the wiring pattern W). Then, the measurement object 12 is imaged by the second imaging unit 8.

Then, in step S35, the second captured image 114 by the second imaging unit 8 is acquired.

Then, in step S36, based on the lightness in the image, the same features of the measurement object 12 (the position where the position recognition mark F is formed or the position where the wiring pattern W is formed) in the first captured image 113 and the second captured image 114. Point 12a is detected.

Then, in step S37, the height of the measurement object 12 is acquired based on the first captured image 113 and the second captured image 114. Specifically, the height of the same feature point 12 a of the detected measurement object 12 is acquired as the height of the measurement object 12 according to the above-described expression (3) or expression (4).

Then, in step S38, it is determined whether there is an unmeasured measurement object 12. If it is determined that there is an unmeasured measurement object 12, the process proceeds to step S31. Then, the processing of steps S32 to S37 is performed on the unmeasured measurement object 12, and the height is acquired.

Further, in step S38, when it is determined that there are no unmeasured measurement objects 12, the positions where all (two (two)) position recognition marks F are formed on the measurement objects 12 (the substrate P), and the substrate Since the formation positions of the plurality (three) of wiring patterns W in P are measured, the process proceeds to step S39.

Then, in step S39, the entire warped state of the substrate P is acquired based on the measurement results of the heights of all the measurement objects 12. Thereafter, the height measurement process is ended. After that, when mounting the component E on the substrate P, the target mounting height position (Z coordinate position) is corrected based on the acquired warping state (height) of the substrate P as the measurement object 12 Ru.

The remaining structure of the second embodiment is similar to that of the aforementioned first embodiment.

(Effect of the second embodiment)
In the second embodiment, the following effects can be obtained.

In the second embodiment, as described above, the control unit 109 controls the first captured image 113 of the measurement object 12 (substrate P) by the first imaging unit 7 and the measurement object 12 by the second imaging unit 8 ( The height of the measurement object 12 (substrate P) is obtained based on the second captured image 114 of the substrate P). Thus, as in the first embodiment, the height can be accurately measured even with a small measurement object 12 (e.g., the wiring pattern W for a minimal component in the substrate P).

In the second embodiment, as described above, the position is the position where the position recognition mark F is formed on the substrate P, or the position where the wiring pattern W is formed on the substrate P. Here, the position recognition mark F and the wiring pattern W are both characteristic and easy to recognize in the substrate P. Therefore, by configuring as described above, the substrate based on the first captured image 113 and the second captured image 114 of the formation position of the position recognition mark F on the substrate P or the formation position of the wiring pattern W on the substrate P The height of P can be easily obtained. In this case, if the target mounting height position of the head 3a at the time of mounting the component E on the substrate P is corrected based on the acquired height of the substrate P, mounting of the component E on the substrate P by the head 3a is performed. It can be done precisely.

The remaining effects of the second embodiment are similar to those of the aforementioned first embodiment.

[Modification]
It should be understood that the embodiments disclosed herein are illustrative and non-restrictive in every respect. The scope of the present invention is indicated not by the above description of the embodiment but by the scope of the claims, and further includes all modifications (variations) within the meaning and scope equivalent to the scope of the claims.

For example, in the first and second embodiments, an example in which the component supply unit is a tape feeder is shown, but the present invention is not limited to this. For example, the component supply unit may be a tray feeder that holds components on a tray.

In the first and second embodiments, the head unit is a rotary type head unit in which a plurality of heads are arranged in a circular shape, but the present invention is not limited to this. For example, the head unit may be a head unit including a plurality of heads arranged along a predetermined direction. In the modification shown in FIG. 11, the head unit 103 includes a plurality of heads 103a arranged along a predetermined direction. Further, the head unit 103 is provided with a first imaging unit 7 and a second imaging unit 8. The second imaging unit 8 is configured to be movable along the arrangement direction of the heads 103 a (nozzles) with respect to the head unit 103 so that the holding (suction) of the component E by each head 103 a can be imaged.

In the first and second embodiments, the first imaging unit captures an image of the measurement object from approximately vertically above, and the second imaging unit captures an image of the measurement object from diagonally above. The present invention is not limited to this. In the present invention, the first imaging unit may image the measurement object from any direction as long as the first imaging unit and the second imaging unit image the measurement object from different directions. The unit may image the measurement object from any direction.

Moreover, in the said, 1st and 2nd embodiment, although the example from which the height of a measurement object is acquired by Formula (3) or Formula (4) was shown, this invention is not limited to this. In the present invention, the height of the measurement object may be obtained by an equation other than the equation (3) or the equation (4).

In the first and second embodiments, the second imaging unit is an imaging unit for imaging a component arranged in the component supply unit. However, the present invention is not limited to this. In the present invention, as long as the second imaging unit is provided separately from the first imaging unit, the second imaging unit may be an imaging unit other than the imaging unit that images a component disposed in the component supply unit. For example, the second imaging unit may be an imaging unit that images a component mounting position of the substrate. In this case, based on the captured image of the component mounting position by the second imaging unit, a target mounting horizontal position (XY coordinates) which is a position in the horizontal direction that the head targets when lowering to mount the component at the component mounting position. The position) may be corrected by the control unit.

Further, in the first embodiment, an example in which the measurement object is a component disposed in the component supply unit is shown, and in the second embodiment, the measurement object is the position where the position recognition mark is formed on the substrate and the substrate Although the example which is a formation position of the wiring pattern in is shown, the present invention is not limited to this. In the present invention, the object to be measured may be other than the components disposed in the component supply unit, the formation position of the position recognition mark on the substrate, and the formation position of the wiring pattern on the substrate. When the height of the substrate is measured, only one of the formation position of the position recognition mark on the substrate and the formation position of the wiring pattern on the substrate may be the object to be measured.

In the first embodiment, when the control unit performs the setup change, the holding error of the component by the head occurs, and the target holding horizontal position correction value is equal to or more than the predetermined threshold value. Although the example which is configured to acquire the height of the part as the measurement target is shown, the present invention is not limited to this. In the present invention, the control unit performs at least one of the following cases: when a setup change is performed, when a holding error of a part by the head occurs, and when the target holding horizontal position correction value is equal to or more than a predetermined threshold value In one case, it may be configured to obtain the height of the part as the measurement object. In addition, when the control unit performs a setup change, a measurement error occurs in the case where a component holding error occurs by the head, and the target holding horizontal position correction value is equal to or more than a predetermined threshold value, the measurement target It may be configured to obtain the height of the part as an object. For example, the control unit may be configured to acquire the height of the part as the measurement object for each holding operation of the part by the head. Also, for example, the control unit may be configured to obtain the height of the component as the measurement object when the substrate is transported.

In the first embodiment, the control unit detects a predetermined point indicating a boundary between the electrode portion of the component and the mold portion on a predetermined side as the same feature of the component as the measurement object. Although shown, the present invention is not limited to this. In the present invention, the control unit may detect a portion other than a predetermined point indicating a boundary portion between the electrode portion of the component and the mold portion on the predetermined side as the same feature point of the component as the measurement object.

In the second embodiment, the control unit determines the position recognition mark (the wiring pattern of the object) as the same feature point of the formation position of the position recognition mark on the substrate as the measurement object (the formation position of the wiring pattern on the substrate). Although the example which detects the corner of is shown, the present invention is not limited to this. In the present invention, the control unit determines the position other than the corner of the position recognition mark (the wiring pattern of the object) as the same feature point of the formation position of the position recognition mark on the substrate as the measurement object The part may be detected.

In the first and second embodiments, for convenience of explanation, the processing operation of the control unit has been described using a flow-driven flow chart in which processing is sequentially performed along the processing flow, but the present invention is limited to this. I can not. In the present invention, the processing operation of the control unit may be performed by event-driven (event-driven) processing that executes processing on an event-by-event basis. In this case, the operation may be completely event driven, or the combination of event driving and flow driving may be performed.

3a, 103a head 11 component supply unit 7 first imaging unit 8 second imaging unit 9, 109 control unit 12 object to be measured 12a feature point 13, 113, first captured image 14, 114 second captured image 100, 200 component mounted System E parts F Position recognition mark P board W Wiring pattern

Claims (10)

1. A head for holding a component supplied from the component supply unit and mounting it on a substrate;
   A first imaging unit for imaging the position recognition mark attached to the substrate;
   A second imaging unit provided separately from the first imaging unit;
   A control unit that acquires the height of the measurement object based on a first captured image of the measurement object by the first imaging unit and a second captured image of the measurement object by the second imaging unit; A component mounting apparatus comprising:
2. The first imaging unit is configured to image the measurement object from approximately vertically above,
   The component mounting apparatus according to claim 1, wherein the second imaging unit has a telecentric optical system, and is configured to image the measurement object from obliquely above.
3. The component mounting apparatus according to claim 2, wherein the control unit is configured to acquire the height of the measurement object according to the following expression (1).
   H = S / sin θ-T / tan θ (1)
   here,
   H: height S of the measurement object of the physical unit: real space distance T corresponding to the distance from the center line to the measurement object position in the second image: distance from the center line to the measurement object position in the first image The real space distance θ corresponding to 対 応: the angle of the optical axis of the second imaging unit with respect to the vertical direction.
4. The component mounting apparatus according to claim 3, wherein the control unit is configured to acquire the height of the measurement object according to the following equation (2).
   H = (Scale-c) x h = (Scale-c) x s / sin θ-t / tan θ (2)
   here,
   Scale-c: Conversion coefficient h for converting a distance in pixel units to a distance in physical units h: height of measurement object in pixel units s: distance in pixel units from the center line to the measurement target position in the second captured image t: The distance in pixel units from the center line to the measurement target position in the first captured image.
5. 5. The image pickup unit according to claim 1, wherein the second image pickup unit is an image pickup unit that picks up an image of at least one of the component disposed in the component supply unit and a component mounting position of the substrate. The component mounting apparatus described in the section.
6. The component mounting apparatus according to any one of claims 1 to 5, wherein the measurement object is a formation position of the position recognition mark on the substrate or a formation position of a wiring pattern on the substrate.
7. The component mounting apparatus according to any one of claims 1 to 6, wherein the object to be measured is the component disposed in the component supply unit.
8. The object to be measured is the component disposed in the component supply unit,
   The control unit is configured to use the first imaging unit and the second imaging unit when at least one of the case where the setup change is performed and the case where the holding error of the component by the head occurs. Control is performed to capture the part as the measurement object, and the first and second captured images of the part as the measurement object are acquired, and the acquired first captured image and the acquired image are acquired. The component mounting apparatus according to any one of claims 1 to 7, wherein the component mounting apparatus is configured to acquire the height of the component as the measurement object based on a second captured image.
9. The object to be measured is the component disposed in the component supply unit,
   The second imaging unit is configured to image the component disposed in the component supply unit from diagonally above,
   The control unit is configured to move the head to hold the component disposed in the component supply unit based on a captured image of the component disposed in the component supply unit by the second imaging unit. Configured to obtain a target holding horizontal position correction value for correcting a target holding horizontal position which is a position in a target horizontal direction;
   The control unit is configured to use the first imaging unit and the second imaging unit as the measurement object when the acquired target holding horizontal position correction value is equal to or greater than a predetermined threshold value determined in advance. Control is performed to capture the part, and the first and second captured images of the part as the measurement object are acquired, and the acquired first and second captured images are used. The component mounting apparatus according to claim 5, wherein the component mounting apparatus is configured to acquire the height of the component as the measurement object.
10. The control unit detects the same feature point of the measurement object in the first captured image and the second captured image, and measures the height of the detected same feature point of the measurement object. The component mounting apparatus according to any one of claims 1 to 9, configured to be acquired as the height of an object.

Images