JPH0685497A - Controlling method and device for scale of component mounting apparatus - Google Patents

Abstract

PURPOSE:To enable a corresponding relation between a system of coordinates of a drive system and another system of coordinates on an image processing picture plane to be accurately obtained even if a head unit is limited in a moving direction by a method wherein a specific processing is carried out. CONSTITUTION:A component position detecting means 41 detects the center position and turning angle of a chip component 39 based on the image of the chip component 39 picked up by a camera 31 after the chip component 39 is sucked by a suction nozzle 20, and at controlling scale data, the position of a work is detected, and its coordinates of position on an image processing picture plane is obtained. A distance measuring means 42 measures a prescribed distance when a work is rotated. At controlling scale data, an instruction computation means 44 moves works to a first point and a second point by the movement of a head unit 5 and rotates the works at prescribed spots. A measuring means 55 measures the coordinates of the first and the second point on a system of coordinates of a drive system, and a calculation means 56 calculates scale data based on the measured values obtained by the measuring means 55, the component position detecting means 41, and the distance measuring means 42.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention includes a head unit having a suction nozzle for mounting a small chip component such as an electronic component such as an IC at a predetermined position, and an image for correcting the mounting position. The present invention relates to a method and apparatus for adjusting the scale of the image processing means in a component mounting apparatus including processing means.

[0002]

2. Description of the Related Art Conventionally, a component mounting head unit having a suction nozzle sucks a chip component from a component supply unit such as a tape feeder and transfers it onto a positioned printed circuit board to a predetermined position on the printed circuit board. A component mounting apparatus adapted to be mounted on a device is generally known. In this device, the head unit and the printed circuit board are relatively movable in the X-axis direction and the Y-axis direction, and the suction nozzle is movable and rotatable in the Z-axis direction. And a drive mechanism for rotation is provided.

In this component mounting apparatus, since the position of the chip component (center position and rotation angle) varies when the chip component is sucked by the suction nozzle, the position of the chip component is detected, and based on that, the position of the chip component is detected. It is required to correct the mounting position. For that purpose, an image pickup means such as a CCD camera for picking up an image of the chip component sucked by the suction nozzle and an image processing means for detecting the position of the chip part image picked up by the image pickup means are provided, and based on the position detection. There is also known one in which the correction amount of the mounting position is obtained. The image processing means operates the imaged image of the chip component on the image processing screen to determine the center position and the rotation angle of the image and the displacement amount from the nozzle position.

[0004]

When the image pickup means and the image processing means are provided in the component mounting apparatus to detect the position and calculate the deviation amount, the coordinate system of the component mounting drive system and the image processing are carried out. Correspondence with the coordinate system on the screen, that is, how long the unit length (length of one pixel in the x direction and y direction) in the coordinate system on the image processing screen is in the drive system (X Axial direction, Y-axis direction length), and the corresponding relationship between the angles of both coordinate systems are checked in advance to determine the position etc. obtained from the image processing screen and the drive amount of the drive system. It is necessary to be able to convert to.

As a method for easily obtaining this correspondence, a small piece whose vertical and horizontal lengths are measured in advance is adsorbed by a suction nozzle to be imaged, and the length of the small piece on the image processing screen and the actual length are measured. A method of obtaining the correspondence with the length can be considered. However, according to such a method, there is an error in measuring the actual length and an error in reading the image processing screen, and further, there is a slight difference between the drive amount of the drive system checked by the encoder and the actual length. Since there is an error, the accuracy of the above correspondence is poor.

Therefore, as a method of more accurately obtaining the above-mentioned correspondence, by moving the head unit in the X-axis direction and the Y-axis direction, the imaged portion provided in the head unit is moved over three points which are not on a straight line. For each of the points, it is conceivable to examine the coordinates in the coordinate system of the drive system and the coordinates in the coordinate system of the image processing screen, and determine the correspondence based on these. According to this method, after actually moving the drive system and the like, the above 3
Since the coordinates of the points are obtained, the correspondence between the drive amount of the drive system and the length of the image processing screen according to the coordinate system can be obtained with high accuracy.

However, such a three-point teaching method may be difficult to adopt depending on the structure of the mounting device.

For example, as a structure in which the head unit and the printed circuit board can be relatively moved in the X-axis direction and the Y-axis direction, the head unit can be moved only in one of the X and Y axes. It is also possible to move the station holding the printed circuit board in the other direction,
This is advantageous when a large number of nozzles are provided in the head unit in order to improve the processing efficiency. However, if the head unit is movable in only one direction in this way, it is possible to obtain three points that are not on a straight line. It cannot be moved.

In view of such circumstances, the present invention is applied to a component mounting apparatus having a structure in which the moving direction of the head unit is limited, and the coordinate system of the drive system and the image processing screen are also applied. An object of the present invention is to provide a scale adjusting method for a component mounting apparatus and the apparatus capable of accurately obtaining the correspondence with the above coordinate system.

[0010]

To achieve the above object, a head unit for adsorbing a chip component by a suction nozzle and mounting it at a predetermined position is provided, and an image of the chip component adsorbed by the suction nozzle is picked up. A scale of the image processing means in the component mounting apparatus, which is equipped with an image processing means for picking up the image by means to detect the position of the chip component from the image, and correcting the component mounting position based on the position detection by the image processing means. And a predetermined position of an imaged portion provided on the head unit by moving the head unit in a fixed direction to a first point in an area corresponding to the image processing screen of the image processing means and a first point. To two points, and the first point and the second point are coordinated by the coordinate system of the drive system of the component mounting apparatus and the image processing, respectively. With measuring the coordinate by the coordinate system of the screen, by rotating the object to be imaged portion at a constant position,
The distance between the predetermined two points of the imaged portion on the image processing screen is measured in a plurality of different directions, and the first point and the second point are measured.
The correspondence between the coordinate system of the image processing screen and the coordinate system of the drive system is determined from the coordinates of each point and the distances between the two points in the plurality of directions.

Further, a head unit for sucking the chip component by the suction nozzle and mounting the chip component at a predetermined position is provided, and the chip component sucked by the suction nozzle is imaged by the image pickup means, and the position of the chip component is detected from the image. In a component mounting apparatus that includes an image processing unit that detects the position of the head unit and corrects the component mounting position based on the position detection by the image processing unit, a head unit driving unit that can linearly move the head unit in a fixed direction. Is provided
In addition, the head unit is provided with a rotation driving means that allows the imaged portion to rotate, and the first and second points on the locus along which the predetermined position of the imaged portion moves in response to the driving of the head unit driving means. A means for measuring the coordinates by the coordinate system of the drive system, a means for measuring the first point and the second point by coordinates on the image processing screen of the image processing means, and a plurality of different plural parts by rotating the imaged portion. Means for measuring a predetermined distance between two points of the imaged portion on the image processing screen in the direction, and the correspondence relationship between the coordinate system of the image processing screen and the coordinate system of the drive system based on these measured values. And a calculation means for obtaining

[0012]

According to the above construction, since the distances between the predetermined two points of the imaged portion on the image processing screen are obtained in a plurality of directions, the scale ratios in both the x and y directions on the processing screen can be obtained accurately. The coefficient values in the x-direction, the y-direction, and the rotation direction, which indicate the above-mentioned correspondence, can be accurately obtained from this and the coordinates of each point.

[0013]

Embodiments of the present invention will be described with reference to the drawings.
1 and 2 show the overall structure of a component mounting apparatus including an article recognition apparatus according to an embodiment of the present invention. In these drawings, a conveyer 2 for conveying a printed circuit board extending in the X-axis direction (conveying direction) is arranged on a base 1, and the printed circuit board 3 is conveyed on the conveyor 2, and a work station 6A, which will be described later, is provided. It is designed to be stopped at a fixed position of 6B.

On both sides of the portion where the conveyor 2 is arranged,
The component supply unit 4 is arranged. The component supply unit 4 includes a large number of rows of supply tapes 4a. Each supply tape 4a accommodates and holds small chip-shaped chip components such as ICs, transistors, and capacitors at equal intervals and is wound around a reel. ing. A ratchet type feed mechanism is incorporated at the feeding end of the supply tape 4a, and head units 5A and 5B described later are provided.
Thus, as the chip component is picked up from the feeding end, the supply tape 4a is intermittently fed out, and the above-mentioned pickup work can be repeated.

Head units 5A and 5B for mounting components are provided above the base 1, and the head units 5A and 5B and the printed circuit board 3 on the work stations 6A and 6B are relatively arranged on the X-axis. Direction and the Y-axis direction (direction orthogonal to the X-axis on the horizontal plane), and in particular, in this embodiment, the work stations 6A and 6B holding the printed circuit board 3 are movable in the Y-axis direction. The head units 5A and 5B are movable in the X-axis direction.

The structure will be described in detail. In the figure, the head units 5A and 5B and the work are arranged so that the mounting work can be performed on two printed circuit boards 3 at the same time to improve the processing efficiency. Station 6A,
Two 6Bs are installed, and a work station 6
A and 6B are arranged at two positions shifted in the X direction.
Each of the work stations 6A, 6B has a substrate holding device for holding the printed circuit board 3, and can hold the printed circuit board 3 sent from the conveyor 2 to the work stations 6A, 6B via the transfer device. It is like this.

At the locations where the work stations 6A and 6B are arranged, two guide rails 8 extending in parallel to each other in the Y-axis direction are arranged on the base 7 in parallel with each other at a predetermined interval. As a Y-axis feed mechanism, a ball screw shaft 9 which is rotationally driven by a Y-axis servomotor 10 is arranged near one guide rail 8. Then, the work stations 6A, 6
Both side portions of B are movably supported by the guide rail 7, and nut portions 11 provided on the work stations 6A and 6B are screwed onto the ball screw shaft 9. With this structure, the work stations 6A and 6B move in the Y-axis direction as the ball screw shaft 9 rotates while holding the printed circuit board 3 during the component mounting work.

An X-axis frame for holding the head units 5A, 5B movably in the X-axis direction is provided above the base 1. Two X-axis frames 13A, 13A are provided in the figure.
13B are parallel to each other at predetermined intervals, and X
It extends in the axial direction. This X-axis frame 13A, 13B
Is formed with X-axis guides 14 on both upper and lower sides thereof, and as a feed mechanism in the X-axis direction, a ball screw shaft 15 positioned between the upper and lower X-axis guides and the ball screw shaft 15 are rotated. An X-axis servomotor 16 for driving is provided. The head units 5A and 5B are movably supported by the X-axis guide 14, and a nut portion (not shown) provided on the head units 5A and 5B is screwed onto the ball screw shaft 15 to form a ball screw. The rotation of the shaft 15 causes the head units 5A and 5B to move in the X-axis direction.

The amount of movement in the Y-axis direction and the X-axis direction is
The measurement is performed by a measuring unit (see FIG. 6) including an encoder and the like provided for the servomotors 10 and 16.

The head units 5A and 5B are provided with suction nozzles 20 for sucking chip components. In the illustrated example, each head unit 5A and 5B is provided with 16 suction nozzles 20. As shown in detail in FIGS. 3 and 4, each of the suction nozzles 20 is movable along the Z-axis guide 21 in the Z-axis direction (vertical direction) and at the same time around the R-axis (nozzle central axis). The Z-axis servo motor 22 and the R-axis servo motor 23 for the suction nozzle 20 are rotatable and can be rotated.
It is equipped with A and 5B. Then, the suction nozzle 20 is moved up and down via the Z-axis ball screw shaft 24 by driving the Z-axis servo motor 22, and the R-axis servo motor 2
R axis ball screw shaft 25, R axis rack 26 by driving 3
The suction nozzle 20 is rotated via the R-axis pinion 27. Furthermore, the head unit 5
A and 5B are printed on the printed circuit board 3 by detecting a mark (not shown) previously attached to the printed circuit board 3.
A board position detecting CCD camera 28 for detecting the position of is attached.

On the base 1, head units 5A, 5A
A CCD camera 31 as an image pickup means for detecting the component position is provided at a position corresponding to an appropriate position within the X-axis direction movement range of B, for example, a position between the work stations 6A and 6B and the component supply unit 4. And a lamp house 32 for illumination at the time of imaging.

FIG. 5 schematically shows an image processing system. In this figure, a CCD camera 31 for detecting the position of a component is shown.
Is connected to an image processing unit (image processing means) 33. The substrate position detecting CCD camera 28 provided in each of the head units 5A and 5B is also connected to the image processing unit 33.

The lamp house 32 is connected to a flash unit 35 via a fiber cable 34, and the flash unit 35 is connected to the image processing unit 33. The image processing unit 33 is connected to the controller 36.

FIG. 6 schematically shows the head unit 5 (5A, 5B) equipped with the suction nozzle 20 and the like, the CCD camera 31, the lamp (illumination) 37 and the illumination power source 38, and also the image processing unit 33 and the controller. 36
2 shows a functional configuration of the. Reference numeral 39 is a chip component sucked by the suction nozzle 20.

In this figure, the image processing unit 33 includes a component position detecting means 41 and a distance measuring means 42. The component position detecting means 41 detects the image of the chip component 39 picked up by the CCD camera 31 after the component is picked up by the suction nozzle 20 during the mounting work in which a series of work for sucking and mounting the chip component 39 is automatically performed. The center position and the rotation angle of the chip part 39 are detected, and further has a function of detecting the work position and obtaining the coordinates on the image processing screen when adjusting the scale data described later. Further, the distance measuring means 42 measures the distance between CE and the distance between DF in FIG.

The controller 36 connected to the image processing unit 33 comprises a microcomputer or the like,
Storage means 43 such as ROM and RAM, command / calculation means 44, interface 45, various drive units such as head unit drive unit 46, suction nozzle rotation unit 47, suction nozzle vertical drive unit 48, and work station drive unit 49. Includes and. Then, the movement amount detection means 50 for detecting the movement amount of the head unit or the like and other various sensors 5
1, a suction vacuum supply / discharge switching valve 52, various servomotors 10, 16, 22, 23, etc. are electrically connected to the interface 45 and the drive units 46 to 49. Further, the keyboard 53 and the CRT 54 are connected to the controller 36.

The storage means 43 stores a sequence of a series of component mounting operations and various data, and also rewrites the scale data described later.

Further, the command / calculation means 44 is adapted to execute a sequence such as the component mounting work. Further, the command / calculation means 44 moves the work to the first point and the second point by the movement of the head unit and further rotates the work at a predetermined position at the time of adjusting the scale data, which will be described later. Dot and second
A means 55 for measuring the coordinates of the point in the coordinate system of the component mounting device drive system, and a means 56 for calculating scale data from the measured values of the measuring means 55 and the component position detecting means 41 and the distance measuring means 42. Contains.

A specific example of a component mounting process and a scale adjusting method using such an apparatus will be described with reference to a flowchart.

The flowcharts of FIGS. 7 and 8 show the entire component mounting process. In FIG. 7, first, in step S1, the keyboard mounting work start switch is turned on.
It will be waited until. When this switch is turned on, whether or not data (hereinafter, referred to as scale data) indicating the correspondence between the coordinate system of the image processing screen in the image processing means and the coordinate system of the drive system of the component mounting device does not exist. Whether the optical system (camera, illumination, etc.) has been changed (step S3), and the cumulative error of the image processing checked from the time of the previous adjustment in step S16 and step S19 described later. A determination is made as to whether or not the number E frequently occurs above a predetermined number Ea (step S4). If at least one of these determinations is YES, the scale data adjustment routine (step S5) described below is executed, and then the process proceeds to step S6. When step S5 is executed, the cumulative error number is reset to zero.

When all of the steps S2 to S4 are NO, the scale data already exists and it is not necessary to change it. Therefore, the process directly proceeds to the step S6.

Steps S6 and subsequent steps are a series of processes for automatically mounting components. First, as an initial process, the number and type of chip components to be mounted are indicated according to the printed circuit board 3 to be loaded. The board data is selected (step S6), the address counter described later is cleared for initialization (step S7), and the printed board 3 is carried in and positioned on the work stations 6A and 6B (step S8).

Next, the operation of the head units 5A and 5B and the operation of the suction nozzle 20 move the suction nozzle 20 to the component supply section 4, and the chip components are suctioned by the negative pressure supplied to each suction nozzle 20. (Step 9, S1
0). Then, based on the determination as to whether or not there is any remaining nozzle or component that can be sucked (step S11), if this is YES, the processes of steps S9 and S10 are repeated. When the suction of the required number of chip components is completed, the head unit is moved above the CCD camera 31 (step S12).

Turning to FIG. 8, in step S13, while the irradiation (flash) of the illumination is sequentially performed on each suction nozzle 20 passing above the camera 31, the chip components sucked by each suction nozzle 20 are removed. The image is captured by the camera 31, and the image is captured. Subsequently, the component position is detected from the image, and the amount of deviation from the position of the suction nozzle 20 to the component position is calculated based on the detected position (step S).
14). As a method of detecting the position of the component, for example, the lead edges at both ends of the four sides of the component are obtained by operating the image, and the center position and the rotation angle of the component are calculated from these. Then, the amount of deviation from the nozzle position is calculated, and this amount of deviation is converted into the drive amount of the drive system for the head unit and the work station based on the correspondence relationship obtained in the scale data adjustment routine described later. Required.

In step S15, it is determined whether or not the component recognition processing in steps S13 and S14 has been completed for the adsorbed component, and if not, step S15.
13 and S14 are repeated.

When the recognition process is completed, the n
It is determined whether or not a recognition error has occurred with respect to the second nozzle (step S16). If there is no error, the suction nozzle 2
0 is moved to the mounting position corrected by the displacement amount (step S17), and the chip component is mounted by lowering the suction nozzle, cutting the negative pressure supply, etc. at the mounting position (step S18). If the occurrence of an error is determined in step S16, the error counter is counted up as an error process (step S19), and the number of errors is stored in the storage means. . Then, based on the determination as to whether or not the mounting (or error processing) of all the sucked components has been completed (step S20), if not completed, step S16
The process from S20 to S20 is repeated.

When the mounting is completed, it is judged whether or not there is a component that has not been mounted due to an error (step S2).
1) If there is a component that has not been mounted due to an error, the component is discarded (step S22), and the process returns to step S9, so that the process from component suction is performed again for the error.

If there is no component not mounted due to the above error, the address counter indicating the mounting address is counted up (step S23), and mounting of all components for one printed circuit board is completed. Whether or not it is determined (step S24), and if not completed, the process returns to step S9, and the process from adsorption is newly performed.

When it is determined in step S24 that the printing is completed, the printed circuit board is unloaded (step S25), and
It is determined whether or not the mounting of all the printed circuit boards has been completed (step S26). If the determination is NO, the process returns to step S6 and the subsequent processes are repeated. When all the boards have been mounted, the process ends.

FIG. 9 shows an example of the processing of the scale data adjustment routine performed in step S5. In this routine, first, the suction nozzle sucks the work (small piece such as a chip component that is a portion to be imaged) (step S31). Then, as shown in FIG. 10A, the first unit on the X axis of the drive system is driven by driving the head unit within the range where the image is captured by the camera 31.
The work is moved from the point A to the second point B, the position of the work is detected (the center position is detected) at the two points, and the drive system coordinates A (R _1x , R _1y ), B (R _2x , R) are detected. _2y ) and the coordinates A (V _1x , V _1y ) and B (V _2x , V _2y ) on the image processing screen are obtained (step S 32).

Next, as shown in FIG. 10B, one point on the axis of the drive system (for example, the above-mentioned first point A or second point B).
With the R-axis servo motor, the workpiece is 0 °, 90 °,
The center positions C, D, E, and F of the workpiece are respectively detected by rotating them by 180 ° and 270 °, and the coordinates C (V _3x , V _3y ) and D on the image processing screen are detected.
(V _4x , V _4y ), E (V _5x , V _5y ), F (V _6x , V _6y ).
Is required (step S33). Here, subsequently, the ratio of the conversion coefficient is calculated as follows (step S3).
4).

[0042]

[Equation 1]

Here, Vax is the distance between the points CE on the image processing screen, Vby is the distance between the points DF on the same screen, and these are obtained from the above coordinates as follows.

[0044]

[Equation 2]

Next, the conversion coefficient in the X-axis direction and the conversion coefficient in the Y-axis direction are obtained as follows (step S35).

[0046]

[Equation 3]

However, L, Vay, Vdx, Vdy in this equation
Is as follows.

[0048]

[Equation 4]

Further, coordinate axes (Rx, Ry) X of the drive system
Coordinate axes (Vx, Vx,
The slope θ of Vy) is calculated as follows (step S
36).

[0050]

[Equation 5]

According to the above method, the scale data adjustment routine causes the conversion factors Sx, S in the x and y directions.
y and the inclination θ are obtained as scale data. In this case, each point C obtained by the process of step S33,
D, E, and F are the same position (center position) of the work moved by the rotation of the work, and E and F are C and D, respectively.
Is the position moved by 180 ° rotation of the work,
Since the distance between CEs and the distance between DFs are naturally the same as the actual size, the ratio of the size of the processed screen to the actual size in the x direction and the y direction can be accurately obtained. Then, from this ratio and the coordinates of the first point A, the second point B, etc., a relational expression sufficient to obtain the three unknowns Sx, Sy, θ as scale data is obtained.

Therefore, even under the constraint that the head unit can move only in the X-axis direction, the scale data Sx,
Sy and θ are required with high accuracy. This scale data is stored in the storage means 43.

In a series of component mounting processing, the amount of deviation is calculated based on the detection of the component position by image pickup and image processing after the component suction is performed (step S1).
4), the chip component is mounted at the mounting position corrected by that amount, but the scale data S
x, Sy, θ are used to convert the distance on the processing screen into the actual distance in the drive system. As the conversion formula,
The distances between two points in the X and Y directions are R _LX and R on the drive system coordinates.
_{Letting LY be} V _LX and V _LY on the processing screen, the following is obtained.

[0054]

[Equation 6]

When the correction is performed by converting in this way, the accuracy of the correction can be increased because the scale data is obtained with high accuracy.

FIG. 11 shows another example of the scale data adjustment routine. Also in this example, the processing up to the position detection of the first point A and the second point B in steps S41 and S42 is the same as in FIG.
This is the same as steps S31 and S32. Next, FIG.
As also shown in, the work is rotated at 0 ° and 90 ° by driving the R-axis servo motor at one point on the axis of the drive system. The length of the direction is detected. In this example, the lengths at the above angles are V _ax and V _by , respectively,
Hereinafter, the ratio calculation in step S44, step S4
The calculation of the scale data in S5 and S46 is performed in the same manner as steps S34, S35 and S36 in FIG.

Even in the case of this example, the lengths V _ax and V _by measured in the process of step S43 are exactly the same in the actual size, and therefore x in relation to the ratio of the size on the processing screen to the actual size. The ratio between the direction and the y direction is accurately obtained. Then, other than that, the scale data can be accurately obtained in the same manner as in the example of FIG.

The present invention is particularly useful when applied to a component mounting apparatus in which the head unit is movable only in one of the X axis and the Y axis as in the above embodiment. However, the structure of the component mounting device is not limited to this,
It can also be applied to a structure in which the head unit is movable in both X-axis and Y-axis directions.

[0059]

As described above, according to the present invention, the scale of the image processing means provided in the component mounting apparatus is adjusted for the component mounting position correction based on the component position detection. By moving the workpiece to the first point and the second point within the range corresponding to the processing screen, measuring the coordinates by the drive system and the coordinates on the processing screen for each point, and rotating the workpiece. Predetermined 2 of the work on the processing screen for different directions
The distance between points or the length is measured, and the correspondence between the coordinates on the processing screen and the coordinates of the drive system is calculated based on these measured values. The necessary conversion from the coordinates on the processing screen to the coordinates of the drive system can be performed accurately. In particular, in the process of obtaining the above correspondence, the position detection accompanying the movement of the head unit may be performed for the above-mentioned first and second points on the straight line, so that the movement direction of the head unit is limited to one direction. Even when applied to the mounting device having the structure described above, the above correspondence can be accurately obtained.

[Brief description of drawings]

FIG. 1 is a plan view of a component mounting device including an article recognition device according to an embodiment of the present invention.

FIG. 2 is a front view of a head unit arrangement portion of the component mounting apparatus.

FIG. 3 is an enlarged front view of a head unit.

FIG. 4 is a view of the head unit as seen from a line IV-IV in FIG.

FIG. 5 is a perspective view schematically showing a head unit, an image processing device, and the like.

FIG. 6 is a block diagram showing a mechanical configuration of an image processing and control system.

FIG. 7 is a flowchart showing a specific example of a series of component mounting processes.

8 is a flowchart following the flowchart of FIG.

FIG. 9 is a flowchart showing a routine for scale data adjustment.

10 (a) and 10 (b) are explanatory views of processing performed in the routine of FIG. 9, respectively.

FIG. 11 is a flowchart showing another example of a scale data adjustment routine.

12 is an explanatory diagram of a process performed in the routine of FIG.

[Explanation of symbols]

 5A, 5B Head unit 20 Suction nozzle 31 CCD camera (imaging means) 33 Image processing unit 36 Controller 41 Component position detecting means 42 Distance measuring means 44 Command / calculation means 55 Coordinate measuring means 56 Scale data calculating means

Claims (2)

[Claims] 1. A head unit is provided which sucks a chip component by a suction nozzle and mounts the chip component at a predetermined position, and the chip component sucked by the suction nozzle is imaged by an image pickup means to detect the position of the chip component from the image. A method for adjusting the scale of the image processing means in a component mounting apparatus, wherein the component mounting position is corrected on the basis of the position detection by the image processing means. By moving in the direction, the predetermined position of the imaged portion provided on the head unit is moved to the first point and the second point in the area corresponding to the image processing screen of the image processing means, and the first point and With respect to the second point, the coordinates in the coordinate system of the drive system of the component mounting device and the coordinates in the coordinate system of the image processing screen are measured. In addition, by rotating the imaged portion at a certain position, the distance between two predetermined points of the imaged portion on the image processing screen is measured in a plurality of different directions, and the respective coordinates of the first point and the second point are measured. And a scale adjustment method for a component mounting apparatus, wherein the correspondence between the coordinate system of the image processing screen and the coordinate system of the drive system is obtained from the distances between two points in the plurality of directions. 2. A head unit for sucking a chip component by a suction nozzle and mounting the chip component at a predetermined position is provided, and the chip component sucked by the suction nozzle is imaged by an image pickup means, and the position of the chip component is determined from the image. In a component mounting apparatus that includes an image processing unit that detects the position of the head unit and corrects the component mounting position based on the position detection by the image processing unit, a head unit driving unit that can linearly move the head unit in a fixed direction. And the head unit is provided with rotation driving means for allowing the imaged portion to rotate, and the first point and the first point on the locus along which the predetermined position of the imaged portion moves in response to the drive of the head unit driving means. Means for measuring two points by coordinates based on the coordinate system of the drive system, and the first and second points on the image processing screen of the image processing means. A means for measuring by coordinates, a means for rotating the imaged portion to measure a predetermined distance between two points of the imaged portion on the image processing screen in a plurality of different directions, and based on these measured values A scale adjusting apparatus for a component mounting apparatus, comprising: a computing means for determining a correspondence between a coordinate system of the image processing screen and a coordinate system of the drive system.