WO2018214653A1 - 触摸显示面板和液晶显示设备 - Google Patents

触摸显示面板和液晶显示设备 Download PDF

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Publication number
WO2018214653A1
WO2018214653A1 PCT/CN2018/082231 CN2018082231W WO2018214653A1 WO 2018214653 A1 WO2018214653 A1 WO 2018214653A1 CN 2018082231 W CN2018082231 W CN 2018082231W WO 2018214653 A1 WO2018214653 A1 WO 2018214653A1
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WIPO (PCT)
Prior art keywords
binding
circuit board
display panel
touch display
connection layer
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PCT/CN2018/082231
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English (en)
French (fr)
Inventor
党康鹏
左丞
侯帅
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京东方科技集团股份有限公司
重庆京东方光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 重庆京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US16/096,560 priority Critical patent/US11163386B2/en
Publication of WO2018214653A1 publication Critical patent/WO2018214653A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/13338—Input devices, e.g. touch panels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Definitions

  • This document relates to a touch display panel and a liquid crystal display device.
  • the flip chip and the flexible circuit board are usually selected to be simultaneously pressed by the same cutter head on the circuit board (ie, simultaneously binding), Bonding the first bonding pin of the flip chip to the first bonding region of the circuit board through the first conductive bonding layer, and bonding the second bonding pin of the flexible circuit board through the second conductive bonding layer On the second binding area of the board.
  • a touch display panel comprising: a substrate; a flip chip, one end of the flip chip bonded to the substrate, and having one or more first binding pins at the other end; and a flexible circuit board One end of the flexible circuit board is bound to the substrate, and the other end has one or more second binding pins, and a width L2 of each of the one or more second binding pins Greater than the width L1 of each of the one or more first binding pins.
  • a thickness of each of the one or more second binding pins is the same as a thickness of each of the one or more first binding pins.
  • the manufacturing process of the flexible circuit board is different from the manufacturing process of the flip chip.
  • the flexible circuit board is formed by vapor deposition of copper onto a polyimide substrate using an evaporation technique.
  • the flip chip is made by bonding copper to a polyimide substrate with an adhesive.
  • L2-L1 is 0.03 to 0.07 mm.
  • L1 is 0.7 to 0.9 mm
  • L2 is 0.75 to 0.95 mm.
  • the present disclosure further provides a liquid crystal display device, comprising: the touch display panel according to any one of the above embodiments; a circuit board having a first binding area and a second binding area; and a first conductive connection layer connecting the One or more first binding pins are on the first binding area; and a second conductive connection layer is connected to the one or more second binding pins on the second binding area.
  • the one or more first binding pins and the one or more second binding pins are simultaneously bound on the substrate, and the binding time is 5-9s.
  • the bonding force of the first conductive connection layer after bonding and the adhesion of the second conductive connection layer are not less than 1000N.
  • the first conductive connection layer and the second conductive connection layer are made of a conductive paste.
  • FIG. 1 is a schematic structural view of a circuit board in the present disclosure
  • FIG. 2 is a schematic structural view of a flip chip of the present disclosure
  • FIG. 3 is a schematic structural view of a flexible circuit board in the present disclosure
  • FIG. 4 is a schematic structural diagram of a liquid crystal display device according to an embodiment of the present disclosure.
  • FIG. 5 is a schematic structural view of the circuit board, the flip chip, and the flexible circuit board of FIG. 4 after being bonded.
  • the fabrication process, thickness and width of the flip chip and the flexible circuit board are required to be the same (the conventional flexible circuit board manufacturing process and the flip chip manufacturing process are not Similarly, when the binding is performed according to the current process specifications, the thermal conductivity of the flip chip is high, and the conductive adhesive of the first conductive connecting layer can be fully dissolved after the binding, and the adhesion of the first conductive connecting layer can be The design requirements are met; however, the thermal conductivity of the flexible circuit board is poor under the process conditions, and the conductive adhesive of the second conductive connecting layer is insufficient to be sufficiently dissolved during bonding, so that the adhesion of the second conductive connecting layer cannot be Meet the design requirements; if the bonding process is adjusted according to the design requirements of the flexible circuit board according to the tearing force ⁇ 1000N, the flip chip will be damaged due to excessive heat absorption, which means that the flip chip and the flexible circuit are required.
  • the manufacturing process, thickness and width of the board correspond to the same reason
  • the fabrication process of the flip chip can not be changed, so that the flexible circuit board can be made only by the same manufacturing process as the flip chip, and the fabrication process of the flip chip is high. This makes the production cost of the flexible circuit board greatly increased, which is contrary to the design idea of enterprise product optimization.
  • the touch display panel includes: a substrate 1; a flip chip 2 (shown in FIG. 2), one end of the flip chip 2 is bonded on the substrate 1 and has the other end a first binding pin 21; and a flexible circuit board 3 (shown in FIG. 3), one end of the flexible circuit board 3 is bound to the substrate 1 and has a second binding pin 31 at the other end, and The width L2 of the second binding pin 31 is greater than the width L1 of the first binding pin 21.
  • the thermal conductivity of the second binding pin 31 is weaker than the first binding pin 21, and the second The width of the binding pin 31 is increased to be larger than the width of the first binding pin 21, so that when the binding is simultaneously performed on the circuit board 5, the same binding time increases the heat storage amount of the second binding pin 31.
  • the binding state of the first binding pin 21 is unchanged, and the excess heat on the second binding pin 31 is further dissolved on the second conductive connection layer 42 after the binding ends, so as to be the same as the first conductive connection layer 41.
  • the bonding effect, the tearing force of the first conductive connecting layer 41 and the second conductive connecting layer 42 after bonding all meet the design requirements of not less than 1000N.
  • the thickness of the second binding pin 31 is the same as the thickness of the first binding pin 21, and there is no gap between the two, so as to avoid only one difference when there is a gap.
  • the flexible circuit board 3 is formed by vapor-depositing copper onto a polyimide substrate by an evaporation technique, and the manufactured flexible circuit board 3 has good compactness and high price;
  • the film 2 is made by sticking copper to a polyimide substrate by using an adhesive, and the resulting crystalline film has poor compactness and low price, and cannot be thinned, otherwise process defects may occur.
  • L2-L1 is 0.03 to 0.07 mm, for example, L1 is 0.7 to 0.9 mm, L2 is 0.75 to 0.95 mm, and the first binding pin 21 and the second binding pin 31 using the above data are simultaneously performed.
  • the adhesion between the first conductive connection layer 41 and the second conductive connection layer 42 is not less than 1000N, which satisfies the design requirements and better ensures the quality of the product.
  • the liquid crystal display device includes: the touch display panel according to any of the above embodiments; the circuit board 5 having the first binding area 51 and the second binding area 52 (FIG. 1) a first conductive connection layer 41 connecting the first binding pin 21 on the first bonding region 51; and a second conductive connection layer 42 connecting the second binding pin 31 On the second binding region 52 (as shown in FIG. 5), the bonding force of the first conductive connection layer 41 and the second conductive connection layer 42 after bonding is satisfied to meet the design requirement of not less than 1000N, and the selection is realized.
  • the flip chip 2 and the flexible circuit board 3 can satisfy the purpose of simultaneous bonding, and the purchase cost of the flexible circuit board 3 can be effectively reduced.
  • the first binding pin 21 and the second binding pin 31 have the same thickness (as shown in FIG. 5), and the first binding pin 21 and the second binding pin 31 are simultaneously tied.
  • the purpose of the present application is to achieve the purpose of the present application, and the binding time is preferably 5 to 9 s, such as 5s, 6s, 7s, 8s or 9s, etc., and the purpose of the present application is not deviated from the disclosure.
  • the design ideas are not described here, and are all within the scope of protection of this application.
  • the bonding force of the first conductive connection layer 41 and the adhesion of the second conductive connection layer 42 after bonding are not less than 1000N, which satisfies the design requirements.
  • the experimental data is shown in the following table:
  • the material of the first conductive connection layer 41 and the second conductive connection layer 42 is a conductive adhesive or equivalent material, and the first conductive connection layer 41 is connected to the first binding pin 21 and the first binding region. 51.
  • the second conductive connection layer 42 is connected to the second binding pin 31 and the second binding region 52.
  • the touch display panel provided by the present disclosure has a thermal conductivity weaker than the first binding pin when the manufacturing process of the flexible circuit board is different from the manufacturing process of the flip chip.
  • the width of the binding pin is increased to be larger than the width of the first binding pin, so that when the binding is simultaneously performed on the circuit board, the same binding time increases the heat storage of the second binding pin, and the first binding
  • the binding state of the fixed pin is unchanged, and the excess heat on the second binding pin is further dissolved on the second conductive connection layer after the binding is completed, achieving the same bonding effect as the first conductive connection layer, after binding
  • the tearing force of the first conductive connecting layer and the second conductive connecting layer both meet the design requirements of not less than 1000N.
  • connection may be a fixed connection, a detachable connection, or an integral connection. They can be directly connected or indirectly connected through an intermediate medium.
  • connecting may be a fixed connection, a detachable connection, or an integral connection. They can be directly connected or indirectly connected through an intermediate medium.
  • specific meanings of the above terms herein may be understood on a case-by-case basis.

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  • Computer Networks & Wireless Communication (AREA)
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  • Structure Of Printed Boards (AREA)
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Abstract

本文公开了一种触摸显示面板和液晶显示设备。触摸显示面板包括：基板(1)；覆晶薄膜(2)，覆晶薄膜(2)的一端绑定在基板上、另一端具有第一绑定引脚(21)；和柔性电路板(3)，柔性电路板(3)的一端绑定在基板(1)上、另一端具有第二绑定引脚(31)，且第二绑定引脚(31)的宽度L2大于第一绑定引脚(21)的宽度L1。

Description

触摸显示面板和液晶显示设备
相关申请的交叉引用
本申请要求于2017年5月22日提交的中国专利申请第201710363948.7号的优先权，该申请的公开通过引用被全部合并于此。
技术领域
本文涉及一种触摸显示面板和一种液晶显示设备。
背景技术
在制作触摸显示面板的过程中，为了减少绑定时间、提高生产效率，通常选择将覆晶薄膜与柔性电路板在线路板上通过同一刀头同时进行本压(即：同时绑定)，以通过第一导电连结层将覆晶薄膜的第一绑定引脚粘结在线路板的第一绑定区域上、通过第二导电连结层将柔性电路板的第二绑定引脚粘附在线路板的第二绑定区域上。
发明内容
本文提供了一种触摸显示面板，包括：基板；覆晶薄膜，所述覆晶薄膜的一端绑定在所述基板上、另一端具有一个或多个第一绑定引脚；和柔性电路板，所述柔性电路板的一端绑定在所述基板上、另一端具有一个或多个第二绑定引脚，且所述一个或多个第二绑定引脚中的每个的宽度L2大于所述一个或多个第一绑定引脚中的每个的宽度L1。
可选地，所述一个或多个第二绑定引脚中的每个的厚度与所述一个或多个第一绑定引脚中的每个的厚度相同。
可选地，所述柔性电路板的制作工艺不同于所述覆晶薄膜的制作工艺。
可选地，所述柔性电路板是利用蒸镀技术将铜蒸镀到聚酰亚胺基材上制成的。
可选地，所述覆晶薄膜是利用粘结剂将铜粘贴到聚酰亚胺基材上制成的。
可选地，L2-L1为0.03～0.07mm。
可选地，L1为0.7～0.9mm，L2为0.75～0.95mm。
本公开还提供了一种液晶显示设备，包括：上述任一实施例所述的触摸显示面板；具有第一绑定区域和第二绑定区域的线路板；第一导电连接层，连接所述一个或多个第一绑定引脚于所述第一绑定区域上；和第二导电连接层，连接所述一个或多个第二绑定引脚于所述第二绑定区域上。
可选地，所述一个或多个第一绑定引脚和所述一个或多个第二绑定引脚同时绑定在所述基板上，且绑定时间为5～9s。
可选地，进行绑定后的所述第一导电连接层的粘结力和所述第二导电连接层的粘结力不小于1000N。
可选地，所述第一导电连接层和所述第二导电连接层的材质为导电胶。
本文的其它特征和优点将在随后的说明书中阐述，并且，部分地从说明书中变得显而易见，或者通过实施本文而了解。本文的目的和其他优点可通过在说明书、权利要求书以及附图中所特别指出的结构来实现和获得。
附图说明
附图用来提供对本文技术方案的进一步理解，并且构成说明书的一部分，与本申请的实施例一起用于解释本文的技术方案，并不构成对本文技术方案的限制。
图1为本公开中的线路板的结构示意图；
图2为本公开中的覆晶薄膜的结构示意图；
图3为本公开中的柔性电路板的结构示意图；
图4为根据本公开的实施例的液晶显示设备的结构示意图；
图5为图4中线路板、覆晶薄膜和柔性电路板进行绑定后的结构示意图。
具体实施方式
为使本文的目的、技术方案和优点更加清楚明白，下文中将结合附图对本文的实施例进行详细说明。需要说明的是，在不冲突的情况下，本申请中的实施例及实施例中的特征可以相互任意组合。
在下面的描述中阐述了很多具体细节以便于充分理解本文，但是，本文还可以采用其他不同于在此描述的方式来实施，因此，本文的保护范围并不受下面公开的具体实施例的限制。
为了实现覆晶薄膜与柔性电路板的同时绑定，就要求覆晶薄膜和柔性电路板的制作工艺、厚度以及宽度均对应相同(常规的柔性电路板的制作工艺与覆晶薄膜的制作工艺不相同，根据目前量产的工艺规格进行绑定时，覆晶薄膜的导热性高，绑定时第一导电连接层的导电胶吸热后能够充分溶解，第一导电连接层的粘结力可以满足设计要求；但是在此工艺条件下柔性电路板的导热性差，在绑定时第二导电连接层的导电胶吸热量不足而不能够充分溶解，导致第二导电连接层的粘结力不能满足设计要求；如果对应于柔性电路板按照撕除力≥1000N的设计要求来调整绑定工艺，则覆晶薄膜就会因吸热量过大而损伤，这也就是要求覆晶薄膜和柔性电路板的制作工艺、厚度以及宽度均对应相同的原因)，这样绑定时覆晶薄膜和柔性电路板的导热性就相同，能够牢固地粘附在线路板上。
其中，覆晶薄膜的制作工艺是不能改变的，这样就只能将柔性电路板的制作工艺选用与覆晶薄膜相同的制作工艺进行制作柔性电路板，由于覆晶薄膜的制作工艺成本较高，这就使得柔性电路板的制作成本大幅度增加，是与企业产品优化的设计思想相违背的。
下面结合附图描述本文一些实施例的触摸显示面板和液晶显示设备。
如图4所示，本文提供的触摸显示面板，包括：基板1；覆晶薄膜2(如图2所示)，所述覆晶薄膜2的一端绑定在所述基板1上、另一端具有第一绑定引脚21；和柔性电路板3(如图3所示)，所述柔性电路板3的一端绑定在所述基板1上、另一端具有第二绑定引脚31，且所述第二绑定引脚31的宽度L2大于所述第一绑定引脚21的宽度L1。
本公开提供的触摸显示面板，在选用柔性电路板3的制作工艺不同于覆晶薄膜2的制作工艺时，第二绑定引脚31的导热性弱于第一绑定引脚21，第二绑定引脚31的宽度增加而大于第一绑定引脚21的宽度，这样在线路板5上同时进行绑定时，同样的绑定时间则第二绑定引脚31的储热量增加，而第一绑定引脚21的绑定状态不变，在绑定结束后第二绑定引脚31上多余的热量对第二导电连接层42进一步溶解，达到与第一导电连接层41同样的粘结效果，绑定后第一导电连接层41和第二导电连接层42的撕除力均满足不小于1000N的设计要求。
进一步地，为了实现一次同时绑定，所述第二绑定引脚31的厚度与所述第一绑定引脚21的厚度相同，二者不出现断差，避免存在断差时仅一个与刀头充分接触、另一个不能与刀头充分接触而不能够被刀头压实的状况发生，确保绑定后第一导电连接层41和第二导电连接层42的粘结力不小于1000N，即确保撕除力≥1000N。
较好地，所述柔性电路板3是利用蒸镀技术将铜蒸镀到聚酰亚胺基材上制成的，制成的柔性电路板3的致密性好、价格高；所述覆晶薄膜2是利用粘结剂将铜粘贴到聚酰亚胺基材上制成的，制成的覆晶薄膜的致密性差、价格低，而且不能减薄，否则会出现工艺不良。
具体地，L2-L1为0.03～0.07mm，如：L1为0.7～0.9mm，L2为0.75～0.95mm，采用上述数据的第一绑定引脚21和第二绑定引脚31在同时进行绑定后，第一导电连接层41和第二导电连接层42的粘结力均不小于1000N，满足设计要求，更好地确保了产品的品质。
本公开提供的液晶显示设备，如图4所示，包括：上述任一实施例所述的触摸显示面板；具有第一绑定区域51和第二绑定区域52的线路板5(如图1所示)；第一导电连接层41，连接所述第一绑定引脚21于所述第一绑定区域51上；和第二导电连接层42，连接所述第二绑定引脚31于所述第二绑定区域52上(如图5所示)，绑定后第一导电连接层41和第二导电连接层42的粘结力均满足不小于1000N的设计要求，实现了选用不同于覆晶薄膜2的制作工艺制成的柔性电路板3，覆晶薄膜2和柔性电路板3能够满足同时绑定的目的，可有效降低柔性电路板3的购置成本。
其中，第一绑定引脚21和第二绑定引脚31的厚度相同(如图5所示)，且所述第一绑定引脚21和所述第二绑定引脚31同时绑定在所述基板1上、以简化工艺步骤，其绑定时间优选为5～9s，如5s、6s、7s、8s或9s等，均可实现本申请的目的，其宗旨未脱离本公开的设计思想，在此不再赘述，均应属于本申请的保护范围内。进行绑定后的所述第一导电连接层41的粘结力和所述第二导电连接层42的粘结力均不小于1000N，满足设计要求。实验数据见下表：
Figure PCTCN2018082231-appb-000001
较好地，所述第一导电连接层41和所述第二导电连接层42的材质为导电胶或等同材质，第一导电连接层41连通第一绑定引脚21和第一绑定区域51，第二导电连接层42连通第二绑定引脚31和第二绑定区域52。
综上所述，本公开提供的触摸显示面板，在柔性电路板的制作工艺不同于覆晶薄膜的制作工艺时，第二绑定引脚的导热性弱于第一绑定引脚，第二绑定引脚的宽度增加而大于第一绑定引脚的宽度，这样在线路板上同时进行绑定时，同样的绑定时间则第二绑定引脚的储热量增加，而第一绑定引脚的绑定状态不变，在绑定结束后第二绑定引脚上多余的热量对第二导电连接层进一步溶解，达到与第一导电连接层同样的粘结效果，绑定后第一导电连接层和第二导电连接层的撕除力均满足不小于1000N的设计要求。
在本文的描述中，术语“安装”、“相连”、“连接”、“固定”等均应做广义理解，例如，“连接”可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是直接相连，也可以通过中间媒介间接相连。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本文中的具体含义。
在本说明书的描述中，术语“一个实施例”、“一些实施例”、“具体实施例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或特点包含于本文的至少一个实 施例或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施例或实例。而且，描述的具体特征、结构、材料或特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
虽然本文所揭露的实施方式如上，但所述的内容仅为便于理解本文而采用的实施方式，并非用以限定本文。任何本文所属领域内的技术人员，在不脱离本文所揭露的精神和范围的前提下，可以在实施的形式及细节上进行任何的修改与变化，但本文的专利保护范围，仍须以所附的权利要求书所界定的范围为准。

Claims (11)

  1. 一种触摸显示面板，包括：
    基板；
    覆晶薄膜，所述覆晶薄膜的一端绑定在所述基板上、另一端具有一个或多个第一绑定引脚；和
    柔性电路板，所述柔性电路板的一端绑定在所述基板上、另一端具有一个或多个第二绑定引脚，且所述一个或多个第二绑定引脚中的每个的宽度L2大于所述一个或多个第一绑定引脚中的每个的宽度L1。
  2. 根据权利要求1所述的触摸显示面板，其中，所述一个或多个第二绑定引脚中的每个的厚度与所述一个或多个第一绑定引脚中的每个的厚度相同。
  3. 根据权利要求1或2所述的触摸显示面板，其中，所述柔性电路板的制作工艺不同于所述覆晶薄膜的制作工艺。
  4. 根据权利要求3所述的触摸显示面板，其中，所述柔性电路板是利用蒸镀技术将铜蒸镀到聚酰亚胺基材上制成的。
  5. 根据权利要求3所述的触摸显示面板，其中，所述覆晶薄膜是利用粘结剂将铜粘贴到聚酰亚胺基材上制成的。
  6. 根据权利要求1或2所述的触摸显示面板，其中，L2-L1为0.03～0.07mm。
  7. 根据权利要求1或2所述的触摸显示面板，其中，L1为0.7～0.9mm，L2为 0.75～0.95mm。
  8. 一种液晶显示设备，包括：
    如权利要求1至7中任一项所述的触摸显示面板；
    具有第一绑定区域和第二绑定区域的线路板；
    第一导电连接层，连接所述一个或多个第一绑定引脚于所述第一绑定区域上；和
    第二导电连接层，连接所述一个或多个第二绑定引脚于所述第二绑定区域上。
  9. 根据权利要求8所述的液晶显示设备，其中，所述一个或多个第一绑定引脚和所述一个或多个第二绑定引脚同时绑定在所述基板上，且绑定时间为5～9s。
  10. 根据权利要求8所述的液晶显示设备，其中，进行绑定后的所述第一导电连接层的粘结力和所述第二导电连接层的粘结力不小于1000N。
  11. 根据权利要求7至10中任一项所述的液晶显示设备，其中，所述第一导电连接层和所述第二导电连接层的材质为导电胶。
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